JPH05270933A - Ceramic joined body and its production - Google Patents
Ceramic joined body and its productionInfo
- Publication number
- JPH05270933A JPH05270933A JP6742692A JP6742692A JPH05270933A JP H05270933 A JPH05270933 A JP H05270933A JP 6742692 A JP6742692 A JP 6742692A JP 6742692 A JP6742692 A JP 6742692A JP H05270933 A JPH05270933 A JP H05270933A
- Authority
- JP
- Japan
- Prior art keywords
- ceramic
- joined
- members
- bonding material
- bonded
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Abstract
Description
【０００１】[0001]
【産業上の利用分野】本発明は、セラミックス部材を接
合して得られるセラミックス接合体に関し、更に詳細に
は、接合強度が強く、かつ、接合部の気密性の高いセラ
ミックス接合体及びその製造方法に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a ceramics joined body obtained by joining ceramics members, and more particularly, to a ceramics joined body having a strong joining strength and a high airtightness at the joined portion, and a method for producing the same. Regarding
【０００２】[0002]
【従来の技術】セラミックスは、その成分組成が酸化
物、非酸化物に拘らず、高度の耐熱・断熱性があり、絶
縁性、導電性、磁気的・誘電的性質などの電気的・電子
的機能を有し、また耐摩耗性等の機械的性質も優れ、各
種構造物の材料として既に使用され、研究開発されてい
る。セラミックスを機械部品材料や構造物材料として使
用する場合、種々の形状の機械部品や構造材料が要求さ
れ、また各部品や部材の組み合わせも求められることに
なり、一体成形により製造されるものは別として、セラ
ミックスを接合固定してセラミックス接合体を得る必要
が生じる。2. Description of the Related Art Ceramics, regardless of whether they are oxides or non-oxides, have a high degree of heat resistance and heat insulation, and have electrical and electronic properties such as insulation, conductivity, magnetic and dielectric properties. It has a function and is excellent in mechanical properties such as abrasion resistance, and has already been used as a material for various structures and has been researched and developed. When ceramics are used as mechanical part materials and structural materials, mechanical parts and structural materials of various shapes are required, and combinations of each part and member are also required. As a result, it becomes necessary to bond and fix ceramics to obtain a ceramics bonded body.
【０００３】従来、このようなセラミックス接合体を得
る方法として、各セラミックス部材を接合材により接合
する方法が提案されている。セラミックス部材の接合に
用いられる接合材としては、いわゆる耐熱ガラスの商品
名パイレックスガラスとして知られている酸化ホウ素
（Ｂ2 Ｏ3 ）成分を含むホウケイ酸ガラスが一般に用い
られており、その粉末やスラリーをセラミックス部材の
接合部に塗布し、大気や真空中で加熱して接合しセラミ
ックス接合体を得ていた。Conventionally, as a method of obtaining such a ceramics joined body, a method of joining each ceramics member with a joining material has been proposed. Borosilicate glass containing a boron oxide (B 2 O 3 ) component, which is known as a so-called heat-resistant glass under the trade name of Pyrex glass, is generally used as a bonding material used for bonding ceramic members, and its powder or slurry. Was applied to the bonded portion of the ceramic member and heated in the air or vacuum to be bonded to obtain a ceramic bonded body.
【０００４】[0004]
【発明が解決しようとする課題】しかし、前述したホウ
ケイ酸ガラスを用いて得られたセラミックス接合体にお
いては、接合部に気孔及びクラック等の接合欠陥が生じ
やすく、接合強度や気密性に劣る等の課題があった。ま
た、本発明者等は、このような従来技術の有する課題を
解決するものとして、特願平３−２９５８４５号におい
てＳｉＯ2 を主成分とする接合材にムライト等を添加し
た無機接合材を提案したが、この無機接合材により得ら
れるセラミックス接合体おいても気密性になお一層の改
良の余地があることを知見した。本発明は、かかる課題
及び改良の余地に鑑みてなされたもので、その目的とす
るところは、接合部に気孔が少なく接合部全体が均質
で、接合強度や気密性（安定かつ十分な気密性）に優れ
たセラミックス接合体及び製造方法を提供することにあ
る。However, in the ceramic bonded body obtained by using the above-mentioned borosilicate glass, bonding defects such as pores and cracks are likely to occur at the bonded portion, and the bonding strength and airtightness are poor. There was a problem. Further, the present inventors propose an inorganic bonding material in which mullite or the like is added to a bonding material containing SiO 2 as a main component in Japanese Patent Application No. 3-295845 as a solution to the problems of the prior art. However, it was found that there is room for further improvement in airtightness even in a ceramics joined body obtained by this inorganic joining material. The present invention has been made in view of such problems and room for improvement, and the purpose thereof is to have uniform pores in the joint, and the entire joint is uniform, and the joint strength and airtightness (stable and sufficient airtightness). To provide a ceramic joined body excellent in the above) and a manufacturing method.
【０００５】[0005]
【課題を解決するための手段】本発明者等は、前記課題
等を解決するため鋭意研究した結果、被接合部材たるセ
ラミックス部材の粒界相を形成する金属の化合物と特定
のセラミックス材料を含有する無機接合材を用いること
により、この課題等が解決されることを見出し本発明を
完成するに至った。Means for Solving the Problems As a result of intensive studies for solving the above problems, the present inventors have found that a compound of a metal forming a grain boundary phase of a ceramics member to be joined and a specific ceramics material are contained. It was found that this problem and the like can be solved by using an inorganic bonding material that achieves the present invention, and completed the present invention.
【０００６】従って、本発明のセラミックス接合体は、
被接合部材たるセラミックス部材の粒界相を形成する金
属元素の化合物のうちの少なくとも１種類とＳｉＯ2 、
Ａｌ2 Ｏ3 及びＳｉ3 Ｎ4 とを含有する無機接合材を用
いて作製して成ることを特徴とする。また、本発明のセ
ラミックス接合体の製造方法は、被接合部材たるセラミ
ックス部材の粒界相を形成する金属元素の化合物のうち
の少なくとも１種類とＳｉＯ2 、Ａｌ2 Ｏ3 及びＳｉ3
Ｎ4 とを含有する無機接合材をセラミックス部材間の接
合部に介在させ、次いで、窒素雰囲気下１５００〜１６
００℃で加熱して無機接合材を溶融させた後、固化する
ことを特徴とする。Therefore, the ceramic bonded body of the present invention is
At least one kind of compound of a metal element forming a grain boundary phase of a ceramic member, which is a member to be joined, and SiO 2 ,
It is characterized by being manufactured using an inorganic bonding material containing Al 2 O 3 and Si 3 N 4 . In addition, the method for manufacturing a ceramics joined body of the present invention includes at least one of compounds of a metal element forming a grain boundary phase of a ceramics member which is a joined member, SiO 2 , Al 2 O 3 and Si 3
An inorganic bonding material containing N 4 is interposed in the bonding portion between the ceramic members, and then 1500 to 16 in a nitrogen atmosphere.
It is characterized in that the inorganic bonding material is melted by heating at 00 ° C. and then solidified.
【０００７】以下、本発明のセラミックス接合体に用い
る無機接合材の構成成分につき説明する。この無機接合
材においては、セラミックス部材の粒界相を形成する金
属元素を用いる。前記粒界相を形成し得る金属元素は、
接合すべきセラミックス部材の種類によって選定するこ
とができるが、例えば、Ｓｉ3 Ｎ4 については、Ｍｇ、
Ｃｅ、Ｓｒ、Ｙ及びＺｒ等を例示することができる。ま
た、前記金属元素の化合物としては、酸化物及び炭酸塩
等を挙げることができ、従って、Ｓｉ3 Ｎ4 について
は、ＭｇＯ、ＣｅＯ2 、ＳｒＣＯ3 、Ｙ2 Ｏ3及びＺｒ
Ｏ2 等を例示できる。The constituent components of the inorganic bonding material used in the ceramic bonded body of the present invention will be described below. In this inorganic bonding material, a metal element that forms the grain boundary phase of the ceramic member is used. The metal element capable of forming the grain boundary phase is
It can be selected according to the type of ceramic members to be joined. For example, for Si 3 N 4 , Mg,
Ce, Sr, Y, Zr, etc. can be illustrated. Further, examples of the compound of the metal element include oxides and carbonates. Therefore, for Si 3 N 4 , MgO, CeO 2 , SrCO 3 , Y 2 O 3 and Zr are used.
Examples thereof include O 2 and the like.
【０００８】前記酸化物及び炭酸塩の配合量は、接合す
べきセラミックス部材の種類や物性及び得られる接合体
の使用条件等により適宜変更できるが、該セラミックス
部材の原料調製時に添加した金属元素化合物の重量比と
同等の割合で配合するのが好ましい。これは、粒界相の
金属組成比と同等の割合にすることにより、化学的な親
和性が向上することは基より、熱膨張係数が接近し、冷
却時のクラック、剥離が低減し、信頼性が向上するから
である。The amounts of the oxides and carbonates can be appropriately changed depending on the type and physical properties of the ceramic members to be joined and the usage conditions of the resulting joined body. The metal element compound added at the time of preparing the raw materials for the ceramic members. It is preferable to mix them at a ratio equivalent to the weight ratio of. This is because, by setting the ratio to be equal to the metal composition ratio of the grain boundary phase, the chemical affinity is improved, the thermal expansion coefficient is closer, cracks and peeling during cooling are reduced, and reliability is improved. This is because the property is improved.
【０００９】例えば、粒界相がＭｇ、Ｓｒ、Ｃｅから成
るＳｉ3 Ｎ4 製セラミックス部材については、ＭｇＯは
０〜５０重量％が好ましい。５０重量％を越えると濡れ
性が低下し、好ましくない。ＣｅＯ2 は０〜５６重量％
が好ましい。５６重量％を越えると濡れ性が低下し好ま
しくない。また、ＳｒＣＯ3 では０〜２８重量％が好ま
しい。２８重量％を越えると濡れ性が低下し好ましくな
い。なお、ＭｇＯ、ＣｅＯ2 、ＳｒＣＯ3 の重量比を、
該Ｓｉ3 Ｎ4 部材の原料調製時に添加した重量比と同等
の割合にするのが更に好ましい。For example, in a ceramic member made of Si 3 N 4 whose grain boundary phase is composed of Mg, Sr and Ce, MgO is preferably 0 to 50% by weight. If it exceeds 50% by weight, the wettability is deteriorated, which is not preferable. CeO 2 is 0 to 56% by weight
Is preferred. If it exceeds 56% by weight, the wettability is deteriorated, which is not preferable. Further, SrCO 3 is preferably 0 to 28% by weight. If it exceeds 28% by weight, the wettability is lowered, which is not preferable. The weight ratio of MgO, CeO 2 , and SrCO 3 is
It is more preferable that the ratio is the same as the weight ratio added at the time of preparing the raw material of the Si 3 N 4 member.
【００１０】一方、他の構成成分であるＳｉＯ2 、Ａｌ
2 Ｏ3 及びＳｉ3 Ｎ4 の配合量についても接合すべきセ
ラミックス部材の種類等により変更し得るが、Ｓｉ3 Ｎ
4 については、ＳｉＯ2 を１３〜３７重量％配合するの
が好ましい。１３重量％未満ではガラス状物質の形成が
困難となり、３７重量％を越えるとガラス軟化点が急激
に低下するため、耐熱性が低下し好ましくない。また、
Ａｌ2 Ｏ3 は６〜１９重量％配合するのが好ましい。６
重量％未満ではガラス状物質の形成が困難となり、１９
重量％を越えると濡れ性が低下し、好ましくない。ま
た、Ｓｉ3 Ｎ4 を６〜１９重量％配合するのが好まし
い。６重量％未満ではガラス軟化点が急激に低下するた
め耐熱性が低下し、１９重量％を越えると濡れ性が低下
し好ましくない。On the other hand, other constituents such as SiO 2 and Al
The compounding amounts of 2 O 3 and Si 3 N 4 may be changed depending on the type of ceramic member to be joined, but Si 3 N
Regarding 4, it is preferable to mix 13 to 37% by weight of SiO 2 . If it is less than 13% by weight, it becomes difficult to form a glassy substance, and if it exceeds 37% by weight, the glass softening point is drastically lowered, and the heat resistance is lowered, which is not preferable. Also,
Al 2 O 3 is preferably added in an amount of 6 to 19% by weight. 6
If it is less than 10% by weight, it becomes difficult to form a glassy substance,
If it exceeds 5% by weight, the wettability is deteriorated, which is not preferable. Further, it is preferable to add 6 to 19% by weight of Si 3 N 4 . If it is less than 6% by weight, the glass softening point is drastically lowered to lower the heat resistance, and if it exceeds 19% by weight, the wettability is lowered, which is not preferable.
【００１１】次に、前記無機接合材の製造方法の一例に
つき説明する。この無機接合材は、各構成成分を所定量
配合し、これに所定量の水を添加し、アルミナ玉石を用
いて振動ミルで所定時間粉砕混合することにより得るこ
とができる。なお、セラミックス部材に塗布することを
考慮して、水、適当な分散剤等を用いてペースト状に調
製しておくのがよい。Next, an example of a method for producing the inorganic bonding material will be described. This inorganic bonding material can be obtained by mixing each constituent component in a predetermined amount, adding a predetermined amount of water thereto, and pulverizing and mixing with an oscillating mill for a predetermined time using alumina cobblestone. In consideration of application to the ceramic member, it is preferable to prepare a paste using water, an appropriate dispersant, or the like.
【００１２】なお、この無機接合材を用いて接合できる
セラミックス部材としては、酸化物及び非酸化物等いず
れのセラミックスをも挙げることができ、セラミックス
接合体が使用される構造部材の種類、機械的強度等必要
な使用条件に応じて適宜選定すればよい。例えば、産業
機械及び熱交換機等に使用する場合は、高強度・高耐熱
性の窒化ケイ素や炭化ケイ素が用いられる。また、各々
同種又は異種のセラミックスで構成されていてもよい。As the ceramic member which can be bonded by using this inorganic bonding material, any ceramic such as oxide and non-oxide can be mentioned. It may be appropriately selected according to the required use conditions such as strength. For example, when it is used for industrial machines and heat exchangers, high strength and high heat resistance silicon nitride and silicon carbide are used. Further, they may be made of the same or different ceramics.
【００１３】また、接合すべきセラミックス部材の形
状、厚み及び大きさは、特に限定されるものではない。
例えば、単なる平面同士の接合でもよく、また平板状体
に多数の孔を形成した多孔板の各孔に管状体を挿入して
平板表面と孔部とに連続的接合層を形成する接合でもよ
い。この場合、管状体は、円形、楕円、矩形、多角形、
星形等のいずれでもよく、また、平板の孔をテーパー
状、段形状やネジ構造等に変形し、管状体の端部を孔の
形状に合わせて形成することも可能である。The shape, thickness and size of the ceramic members to be joined are not particularly limited.
For example, mere flat surfaces may be joined, or a tubular body may be inserted into each hole of a perforated plate in which a large number of holes are formed in a flat plate-like body to form a continuous joining layer on the flat plate surface and the hole portion. .. In this case, the tubular body may be circular, oval, rectangular, polygonal,
It may be star-shaped or the like, and it is also possible to form the end of the tubular body in conformity with the shape of the hole by deforming the hole of the flat plate into a tapered shape, a step shape, a screw structure or the like.
【００１４】次に、本発明のセラミックス接合体の製造
方法の一例につき説明する。２以上の被接合部材（セラ
ミックス部材）の接合面の少なくとも一方の表面に、前
記無機接合材から成るペーストを塗布し、各被接合部材
の接合面を合わせた後、大気中約１００〜１２０℃で約
１〜３時間乾燥させる。次いで、約４００〜５００℃で
約１〜３時間仮焼した後、窒素雰囲気中において加熱処
理して無機接合材を溶融させ、その後冷却固化させるこ
とにより、本発明の接合体を得ることができる。この場
合の乾燥及び仮焼の温度及び時間は、前記無機接合材の
各構成成分の配合量や被接合部材の性質等により適宜変
更できる。Next, an example of the method for manufacturing the ceramic bonded body of the present invention will be described. At least one of the joint surfaces of the two or more members to be joined (ceramic members) is coated with the paste made of the above-mentioned inorganic joining material, and the joining faces of the respective members to be joined are joined together, and then the atmosphere is heated to about 100 to 120 ° C. And dry for about 1 to 3 hours. Then, after calcination at about 400 to 500 ° C. for about 1 to 3 hours, heat treatment is performed in a nitrogen atmosphere to melt the inorganic bonding material, and then cooled and solidified to obtain the bonded body of the present invention. .. In this case, the temperature and time of drying and calcination can be appropriately changed depending on the blending amount of each constituent component of the inorganic bonding material, the properties of the members to be bonded, and the like.
【００１５】また、前述の方法において、加熱処理温度
及び時間は、前記無機接合材の各構成成分の配合量や接
合部の形状や厚さ等により適宜選定することができる
が、約１５００〜１６００℃で約１〜２時間静置するの
が好ましい。加熱処理温度が１５００℃未満の場合は、
接合部を形成する塗布した無機接合材全体が均一に溶融
されないため、均質な接合部を得ることができず、得ら
れるセラミックス接合体の気密性も劣るため好ましくな
い。また、１６００℃を越えると、無機接合材の構成成
分の一部が気化するため、接合面がポーラスになり易く
好ましくない。また、加熱処理後の降温速度が、被接合
部材であるセラミックス部材を焼成した後の降温速度と
同等であることが好ましい。これは、被接合部材の粒界
相と物理的状態の接近した接合部を形成することがで
き、被接合部材に対する濡れ性が向上し、良好な気密性
が得られるからである。また、無機接合材を塗布する厚
さは特に限定されるものではない。通常は、約０．１〜
５ｍｍの厚さにすればよい。但し、被接合部材の形状、
材質、接合部の構造、接合部に求められる強度等により
適宜変更できる。Further, in the above-mentioned method, the heat treatment temperature and time can be appropriately selected depending on the blending amount of each constituent component of the inorganic bonding material, the shape and thickness of the bonding portion, etc., but about 1500 to 1600. It is preferable to stand at about 1 to 2 hours. If the heat treatment temperature is less than 1500 ° C,
Since the entire applied inorganic bonding material forming the bonding part is not uniformly melted, a uniform bonding part cannot be obtained, and the resulting ceramic bonded body is inferior in airtightness, which is not preferable. On the other hand, if the temperature exceeds 1600 ° C., some of the constituent components of the inorganic bonding material are vaporized, and the bonding surface tends to become porous, which is not preferable. Further, it is preferable that the temperature lowering rate after the heat treatment is equal to the temperature lowering rate after the ceramic member, which is the member to be joined, is fired. This is because it is possible to form a bonded portion in a physical state close to the grain boundary phase of the member to be bonded, improve wettability with respect to the member to be bonded, and obtain good airtightness. Further, the thickness of applying the inorganic bonding material is not particularly limited. Usually about 0.1
The thickness may be 5 mm. However, the shape of the members to be joined,
It can be appropriately changed depending on the material, the structure of the joint, the strength required for the joint, and the like.
【００１６】[0016]
【実施例】以下、本発明を、図面を参照して実施例及び
比較例により詳細に説明するが、本発明はこれら実施例
に限定されるものではない。 （実施例１〜１３、比較例１〜４） （接合材の調製）表１に示す配合組成により得られる各
混合粉末に、水を添加して水分が６７重量％になるよう
に調整した。得られた混合液を、直径５ｍｍのアルミナ
玉石を用いて湿式振動ミルで３時間粉砕混合した。次い
で、得られた微粉砕混合物と水とを２：３（重量比）の
割合で混合した。このようにして得られたスラリー１０
０重量部に対して、メチルセルロース系バインダー３重
量部及び界面活性剤１重量部を添加して混合し、接合材
ペーストを調製した。EXAMPLES The present invention will be described in detail below with reference to the drawings and examples, but the present invention is not limited to these examples. (Examples 1 to 13 and Comparative Examples 1 to 4) (Preparation of bonding material) Water was added to each mixed powder obtained by the composition shown in Table 1 to adjust the water content to 67% by weight. The obtained mixed liquid was pulverized and mixed for 3 hours with a wet vibration mill using alumina cobblestone having a diameter of 5 mm. Then, the obtained finely pulverized mixture and water were mixed at a ratio of 2: 3 (weight ratio). Slurry 10 thus obtained
A bonding material paste was prepared by adding 3 parts by weight of a methylcellulose-based binder and 1 part by weight of a surfactant to 0 part by weight and mixing them.
【００１７】[0017]
【表１】 [Table 1]
【００１８】（接合体の作製）図１に、本発明のセラミ
ックス接合体の一例を示す。同図において、接合体１
は、円塔状の窒化ケイ素棒２と、円盤状の窒化ケイ素孔
空き板３と、接合材４とから成る。接合体１の作製は、
次の手順で行なった。即ち、まず窒化ケイ素板３の孔部
に窒化ケイ素棒２を挿入し、これら両者のなす円形状の
接合部５に、前述のようにして得られた接合材ペースト
を約５ｍｍ塗布した。次いで、電気炉内に移し約１１０
℃で約１時間乾燥し、更に温度を上昇させ、約５００℃
で約１時間仮焼した後、電気炉内を窒素雰囲気とし、温
度を更にそれぞれ表２に示した接合温度に上昇させて１
時間加熱処理し、その後、そのまま放置して冷却し接合
体１を得た。(Preparation of bonded body) FIG. 1 shows an example of the ceramic bonded body of the present invention. In the figure, the bonded body 1
Is composed of a columnar silicon nitride rod 2, a disk-shaped silicon nitride perforated plate 3, and a bonding material 4. The production of the joined body 1 is
The procedure was as follows. That is, first, the silicon nitride rod 2 was inserted into the hole portion of the silicon nitride plate 3, and the bonding material paste obtained as described above was applied to the circular bonding portion 5 formed by both of them for about 5 mm. Then, move it into the electric furnace for about 110
Dry at ℃ for about 1 hour, further raise the temperature to about 500 ℃
After calcination for about 1 hour in the electric furnace, the inside of the electric furnace was made into a nitrogen atmosphere, and the temperature was further raised to the joining temperature shown in Table 2 to 1
It was heat-treated for a time, and then left as it was and cooled to obtain a joined body 1.
【００１９】（性能評価）このようにして得られた各接
合体について以下に示す気密性及び接合強度試験を行な
い、その結果を表２に示した。 （気密性試験）図２に気密性試験装置を示す。接合体１
は、水槽６に設置された保持治具７により保持されてい
る。この保持治具７の底部８と接合体１との間は、Ｏリ
ング９より封止されている。そして、この状態で、７ｋ
ｇ／ｃｍ2 のエアーを通気路１０を介して接合部５に負
荷し、接合部５から漏出したエアーを水上置換により捕
集し、その容量を測定した。また、接合体１を大気中８
００℃で曝露し、１０時間後及び１００時間後に同様の
測定を行なった。(Evaluation of Performance) Each of the joints thus obtained was subjected to the following airtightness and joint strength tests, and the results are shown in Table 2. (Airtightness Test) FIG. 2 shows an airtightness test apparatus. Zygote 1
Are held by a holding jig 7 installed in the water tank 6. A space between the bottom portion 8 of the holding jig 7 and the bonded body 1 is sealed by an O-ring 9. And in this state, 7k
Air of g / cm 2 was applied to the joint portion 5 through the air passage 10, and the air leaking from the joint portion 5 was collected by displacement on water, and the capacity was measured. In addition, the bonded body 1 was placed in the atmosphere 8
The same measurement was performed after exposure at 00 ° C. for 10 hours and 100 hours.
【００２０】（接合強度試験）図３に接合強度試験装置
を示す。接合体１を保持治具１１により固定し、接合体
１の頂部にロードセル１２を介して荷重を負荷し、その
押抜荷重を測定した。なお、ロードセル１２の最大負荷
加重は５００ｋｇである。また、前記と同様に曝露し、
接合強度の測定を行なった。(Joint Strength Test) FIG. 3 shows a joint strength test apparatus. The bonded body 1 was fixed by the holding jig 11, a load was applied to the top of the bonded body 1 via the load cell 12, and the pushing load was measured. The maximum load weight of the load cell 12 is 500 kg. Also, expose as described above,
The bonding strength was measured.
【００２１】[0021]
【表２】 [Table 2]
【００２２】表２に示すように、本発明のセラミックス
接合体は、接合強度が大きいのみならず、気密性にも極
めて優れていることが分かる。As shown in Table 2, it is understood that the ceramic bonded body of the present invention has not only high bonding strength but also excellent airtightness.
【発明の効果】以上説明したように、本発明によれば、
接合部に気孔が少なく接合部全体が均質で、接合強度や
気密性に優れたセラミックス接合体及びその製造方法を
提供できる。As described above, according to the present invention,
It is possible to provide a ceramics joined body which has few pores in the joined portion, is uniform throughout the joined portion, and has excellent joining strength and airtightness, and a method for producing the same.
【図１】本発明のセラミックス接合体の一例を示す断面
図である。FIG. 1 is a cross-sectional view showing an example of a ceramics joined body of the present invention.
【図２】気密性試験装置を示す断面図である。FIG. 2 is a cross-sectional view showing an airtightness test device.
【図３】接合強度試験装置を示す断面図である。FIG. 3 is a cross-sectional view showing a bonding strength testing device.
【符号の説明】 １ 接合体 ２ 窒化ケイ素棒 ３ 窒化ケイ素板 ４ 接合材 ５ 接合部 ６ 水槽 ７ 保持治具 ８ 底部 ９ Ｏリング １０ 通気路 １１ 保持治具 １２ ロードセル[Explanation of Codes] 1 bonded body 2 silicon nitride rod 3 silicon nitride plate 4 bonding material 5 bonded portion 6 water tank 7 holding jig 8 bottom 9 O-ring 10 air passage 11 holding jig 12 load cell
Claims (2)
相を形成する金属元素の化合物のうちの少なくとも１種
類とＳｉＯ2 、Ａｌ2 Ｏ3 及びＳｉ3 Ｎ4 とを含有する
無機接合材を用いて作製して成ることを特徴とするセラ
ミックス接合体。1. An inorganic bonding material containing at least one kind of compound of a metal element forming a grain boundary phase of a ceramic member as a member to be bonded and SiO 2 , Al 2 O 3 and Si 3 N 4 is used. A ceramic bonded body characterized by being manufactured by
相を形成する金属元素の化合物のうちの少なくとも１種
類とＳｉＯ2 、Ａｌ2 Ｏ3 及びＳｉ3 Ｎ4 とを含有する
無機接合材をセラミックス部材間の接合部に介在させ、
次いで、窒素雰囲気下１５００〜１６００℃で加熱して
無機接合材を溶融させた後、固化することを特徴とする
セラミックス接合体の製造方法。2. A ceramic is an inorganic bonding material containing at least one kind of a compound of a metal element forming a grain boundary phase of a ceramic member which is a member to be bonded and SiO 2 , Al 2 O 3 and Si 3 N 4. Intervening in the joint between the members,
Next, a method for producing a ceramics joined body, which comprises heating at 1500 to 1600 ° C. in a nitrogen atmosphere to melt the inorganic joining material and then solidifying the inorganic joining material.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4067426A JP2815075B2 (en) | 1992-03-25 | 1992-03-25 | Ceramic bonded body and manufacturing method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4067426A JP2815075B2 (en) | 1992-03-25 | 1992-03-25 | Ceramic bonded body and manufacturing method thereof |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH05270933A true JPH05270933A (en) | 1993-10-19 |
| JP2815075B2 JP2815075B2 (en) | 1998-10-27 |
Family
ID=13344580
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP4067426A Expired - Lifetime JP2815075B2 (en) | 1992-03-25 | 1992-03-25 | Ceramic bonded body and manufacturing method thereof |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2815075B2 (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH09293685A (en) * | 1996-02-28 | 1997-11-11 | Asahi Glass Co Ltd | Vertical wafer boat |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5884186A (en) * | 1981-11-12 | 1983-05-20 | 株式会社神戸製鋼所 | Ceramics bonding method |
| JPS62128975A (en) * | 1985-11-29 | 1987-06-11 | 京セラ株式会社 | Adhesive composition for bonding ceramics and method therefor |
| JPS62148380A (en) * | 1985-12-20 | 1987-07-02 | 株式会社クボタ | Adhesive for joining silicon nitride base ceramic sintered bodies and adhesion method |
| JPS62187180A (en) * | 1986-02-10 | 1987-08-15 | 日本ハイブリツドテクノロジ−ズ株式会社 | Method of joining ceramic parts by high frequency induction heating and joined structure |
| JPH0216271A (en) * | 1988-07-02 | 1990-01-19 | Yuhshin Co Ltd | Device for door lock |
| JPH02192471A (en) * | 1989-01-20 | 1990-07-30 | Nippon Steel Corp | Adhesive and method for sintering and bonding silicon nitride |
-
1992
- 1992-03-25 JP JP4067426A patent/JP2815075B2/en not_active Expired - Lifetime
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5884186A (en) * | 1981-11-12 | 1983-05-20 | 株式会社神戸製鋼所 | Ceramics bonding method |
| JPS62128975A (en) * | 1985-11-29 | 1987-06-11 | 京セラ株式会社 | Adhesive composition for bonding ceramics and method therefor |
| JPS62148380A (en) * | 1985-12-20 | 1987-07-02 | 株式会社クボタ | Adhesive for joining silicon nitride base ceramic sintered bodies and adhesion method |
| JPS62187180A (en) * | 1986-02-10 | 1987-08-15 | 日本ハイブリツドテクノロジ−ズ株式会社 | Method of joining ceramic parts by high frequency induction heating and joined structure |
| JPH0216271A (en) * | 1988-07-02 | 1990-01-19 | Yuhshin Co Ltd | Device for door lock |
| JPH02192471A (en) * | 1989-01-20 | 1990-07-30 | Nippon Steel Corp | Adhesive and method for sintering and bonding silicon nitride |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH09293685A (en) * | 1996-02-28 | 1997-11-11 | Asahi Glass Co Ltd | Vertical wafer boat |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2815075B2 (en) | 1998-10-27 |
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