JPH0525821U - Piezoelectric resonance component - Google Patents
Piezoelectric resonance componentInfo
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- JPH0525821U JPH0525821U JP8244091U JP8244091U JPH0525821U JP H0525821 U JPH0525821 U JP H0525821U JP 8244091 U JP8244091 U JP 8244091U JP 8244091 U JP8244091 U JP 8244091U JP H0525821 U JPH0525821 U JP H0525821U
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- piezoelectric
- resonance component
- piezoelectric element
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Abstract
(57)【要約】
【目的】 対衝撃性を向上させて圧電素子の薄型化（す
なわち、高周波化）を可能にするとともに、製造工程に
おける作業性を向上させ、量産を可能にする。
【構成】 圧電基板１の互いに異なる主面に振動電極２
ａ，２ｂを設けるとともに、振動電極２ａ，２ｂから圧
電基板１の異なる側の端部に引出し電極３ａ，３ｂを引
き出して形成した圧電素子４を、その両主面側から、圧
電素子４と対向する面に振動空間７ａ形成用の凹部７を
有する２枚の保護基板８ａ，８ｂで挾持して共振部品素
子９を形成し、かつ、共振部品素子９の両端側にカップ
端子６ａ，６ｂを取り付けて、引出し電極３ａ，３ｂと
カップ端子６ａ，６ｂを電気的に接続する。
(57) [Abstract] [Purpose] To improve impact resistance and enable thinning of piezoelectric elements (that is, higher frequencies), improve workability in the manufacturing process, and enable mass production. [Structure] Vibrating electrodes 2 are provided on different main surfaces of a piezoelectric substrate 1.
a and 2b are provided, and the piezoelectric element 4 formed by pulling out the extraction electrodes 3a and 3b from the vibrating electrodes 2a and 2b to the ends on different sides of the piezoelectric substrate 1 is opposed to the piezoelectric element 4 from both main surface sides thereof. The resonance component element 9 is sandwiched between two protective substrates 8a and 8b having a concave portion 7 for forming the vibration space 7a on its surface to form the resonance component element 9, and the cup terminals 6a and 6b are attached to both ends of the resonance component element 9. Then, the extraction electrodes 3a and 3b and the cup terminals 6a and 6b are electrically connected.
Description
【０００１】[0001]
この考案は、エネルギーとじ込め型の厚みすべり振動モードを利用した圧電共 振部品に関する。 The present invention relates to a piezoelectric resonance part using an energy confinement type thickness-shear vibration mode.
【０００２】[0002]
図６は、従来のエネルギーとじ込め型の厚みすべり振動モードを利用した端子 付きの圧電共振部品を示す斜視図であり、図７は、該圧電共振部品を構成する圧 電素子を示す斜視図である。この従来の圧電共振部品は、圧電基板３１の両主面 に振動電極３２ａ，３２ｂを形成するとともに、各振動電極３２ａ，３２ｂから 、互いに逆の端部側に、入出力用の引出し電極３３ａ，３３ｂを引き出すことに より形成した圧電素子３４の両端側に、保持部３５の平面形状が略Ｕ字状のカッ プ端子３６ａ，３６ｂをはんだ付けして、引出し電極３３ａ，３３ｂとカップ端 子３６ａ，３６ｂを電気的に接続し、さらに、これを外装樹脂４３で外装するこ とにより形成されている。 FIG. 6 is a perspective view showing a conventional piezoelectric resonance component with a terminal utilizing the energy confinement type thickness shear vibration mode, and FIG. 7 is a perspective view showing a piezoelectric element constituting the piezoelectric resonance component. is there. In this conventional piezoelectric resonance component, vibrating electrodes 32a and 32b are formed on both main surfaces of a piezoelectric substrate 31, and lead electrodes 33a for input and output are provided on the opposite end sides of the vibrating electrodes 32a and 32b. The lead terminals 33a, 33b and the cup terminal 36a are soldered to the both ends of the piezoelectric element 34 formed by pulling out the lead 33b, and the holding terminals 35 are soldered to the cup terminals 36a, 36b having a substantially U-shaped planar shape. , 36b are electrically connected to each other, and are further covered with a cover resin 43.
【０００３】 なお、上記従来の、エネルギーとじ込め型厚みすべり振動モードの圧電共振部 品においては、圧電素子３４（図７）の寸法は、通常、Ｌ＝５．０〜１０．０mm ，Ｗ＝０．７〜１．１mm，Ｔ＝１８０〜６２０μm程度となっている。In the above-mentioned conventional piezoelectric resonance part of the energy confinement type thickness shear vibration mode, the size of the piezoelectric element 34 (FIG. 7) is usually L = 5.0 to 10.0 mm, W = It is 0.7 to 1.1 mm and T = 180 to 620 μm.
【０００４】[0004]
しかし、上記従来の圧電共振部品においては、 高周波化を図るためには、圧電素子３４の厚みＴを小さくすることが必要に なるが、厚みＴを小さくすると、機械的強度が低下し、割れや欠けが生じやすく なるため、厚みＴを小さくして高周波化を図ることが困難である、 圧電素子３４の幅Ｗが、０．２〜０．７mm程度にまで小さくなると、圧電素 子３４の両端部をカップ端子３６ａ，３６ｂの保持部（カップ部）３５にはめ込 むことが困難になり、作業性が大幅に低下する、 圧電素子３４の長さＬが大きくなると、対衝撃性が低下し、また、Ｌが小さ くなると、はんだ付けなどの方法によりカップ端子３６ａ，３６ｂを圧電素子３ ４に取り付ける工程で、はんだが振動電極３２ａ，３２ｂ上にまで流れ込み共振 特性が劣化する、というような問題点がある。 However, in the above-described conventional piezoelectric resonance component, it is necessary to reduce the thickness T of the piezoelectric element 34 in order to achieve a high frequency. However, if the thickness T is reduced, the mechanical strength decreases and cracks or cracks occur. It is difficult to reduce the thickness T to achieve high frequency because chipping easily occurs. When the width W of the piezoelectric element 34 is reduced to about 0.2 to 0.7 mm, both ends of the piezoelectric element 34 are reduced. It becomes difficult to fit the portion into the holding portion (cup portion) 35 of the cup terminals 36a and 36b, and the workability is significantly reduced. If the length L of the piezoelectric element 34 is increased, the impact resistance is reduced. Also, when L becomes small, the solder flows into the vibrating electrodes 32a and 32b in the step of attaching the cup terminals 36a and 36b to the piezoelectric element 34 by a method such as soldering, and the resonance characteristic deteriorates. There is Una problems.
【０００５】 この考案は上記問題点を解決しようとするものであり、対衝撃性に優れ、高周 波化が可能であるとともに、製造工程における作業性に優れた、厚みすべり振動 モードを利用した圧電共振部品を提供することを目的とする。This invention is intended to solve the above-mentioned problems, and utilizes a thickness-shear vibration mode that is excellent in impact resistance, enables high frequencies, and has excellent workability in the manufacturing process. An object is to provide a piezoelectric resonance component.
【０００６】[0006]
上記目的を達成するために、この考案の圧電共振部品は、エネルギーとじ込め 型の厚みすべり振動モードを利用した圧電共振部品であって、圧電基板の互いに 異なる主面に振動電極を設けるとともに、前記振動電極から圧電基板の異なる側 の端部に引出し電極を引き出して形成した圧電素子を、その両主面側から、前記 圧電素子と対向する面に振動空間形成用の凹部を有する２枚の保護基板で挾持し て共振部品素子を形成し、かつ、前記共振部品素子の両端側にカップ端子を取り 付けて、前記引出し電極と前記カップ端子とを電気的に接続したことを特徴とす る。 In order to achieve the above-mentioned object, the piezoelectric resonance component of the present invention is a piezoelectric resonance component utilizing energy confinement type thickness-shear vibration mode, in which vibration electrodes are provided on different main surfaces of a piezoelectric substrate, and A piezoelectric element formed by pulling out extraction electrodes from the vibrating electrode to the ends on different sides of the piezoelectric substrate, and protecting the two sheets with a concave for vibrating space formation on the surface facing the piezoelectric element from both main surface sides. It is characterized in that a resonant component element is formed by sandwiching the substrate, and cup terminals are attached to both ends of the resonant component element to electrically connect the extraction electrode and the cup terminal.
【０００７】[0007]
圧電素子を、その両主面側から保護基板で挾持することにより、積層構造で一 体の共振部品素子が形成されており、保護基板が圧電素子を保護して、十分な耐 衝撃性を与える。したがって、圧電素子の厚みを小さくすることが可能になり、 高周波化に対応することができる。また、共振部品素子は、ある程度の大きさが あるので、カップ端子にはめ込む工程での作業性に優れ、また、圧電素子が保護 基板で挾持されているので、カップ端子のはんだ付け工程で、溶融はんだが振動 電極上にまで流れ込むことを効果的に防止することができる。 By sandwiching the piezoelectric element from both main surface sides with protective substrates, a single resonance component element is formed in a laminated structure, and the protective substrate protects the piezoelectric element and provides sufficient impact resistance. . Therefore, it becomes possible to reduce the thickness of the piezoelectric element, and it is possible to cope with higher frequencies. In addition, since the resonant component element has a certain size, it has excellent workability in the process of fitting it into the cup terminal, and because the piezoelectric element is sandwiched by the protective substrate, it does not melt during the soldering process of the cup terminal. It is possible to effectively prevent the solder from flowing into the vibrating electrode.
【０００８】[0008]
【実施例】 以下、この考案の実施例を図に基づいて説明する。図１はこの考案の一実施例 にかかるエネルギーとじ込め型の厚みすべり振動モードを利用した端子付きの圧 電共振部品を示す斜視図である。この実施例の圧電共振部品において、圧電素子 ４は、図２に示すように、短冊状の圧電基板１の両主面に振動電極２ａ，２ｂを 形成するとともに、各振動電極２ａ，２ｂから、互いに逆の端部側に、入出力用 の引出し電極３ａ，３ｂを引き出すことにより形成されている。そして、この圧 電素子４を、圧電素子４の主面と対向する面に振動空間７ａを形成するための凹 部７が形成された２枚の保護基板８ａ，８ｂで挾持することにより、共振部品素 子９が形成されている。なお、共振部品素子９の高さＨ（図５）は、例えば、０ ．８〜３．５mm程度である。Embodiment An embodiment of the present invention will be described below with reference to the drawings. FIG. 1 is a perspective view showing a piezoelectric resonance component with a terminal utilizing an energy confinement type thickness-shear vibration mode according to an embodiment of the present invention. In the piezoelectric resonance component of this embodiment, the piezoelectric element 4 has vibrating electrodes 2a and 2b formed on both principal surfaces of a strip-shaped piezoelectric substrate 1 as shown in FIG. The lead-out electrodes 3a and 3b for input and output are formed on the opposite ends to each other. Then, the piezoelectric element 4 is sandwiched between two protective substrates 8a and 8b in which a concave portion 7 for forming a vibration space 7a is formed on a surface facing the main surface of the piezoelectric element 4, and thereby resonance occurs. A component element 9 is formed. The height H (FIG. 5) of the resonance component element 9 is, for example, 0. It is about 8 to 3.5 mm.
【０００９】 さらに、共振部品素子９の両端側には、保持部５の平面形状が略Ｕ字状のカッ プ端子６ａ，６ｂがはんだ付けされており、引出し電極３ａ，３ｂとカップ端子 ６ａ，６ｂが電気的に接続されている。Further, on both ends of the resonant component element 9, there are soldered cap terminals 6a and 6b having a substantially U-shaped plan view of the holding portion 5, and the lead electrodes 3a and 3b and the cup terminals 6a and 6a. 6b is electrically connected.
【００１０】 次に、上記の圧電共振部品の製造方法の一例について説明する。この実施例の 圧電共振部品を製造するにあたっては、まず、図３に示すように、圧電基板（マ ザー基板）１１上の所定の位置に電極１２を形成し、これをマザー基板１１の主 面と対向する面に振動空間７ａを形成するための凹部７が形成された保護基板（ マザー基板）１８ａ（図３では省略），１８ｂにより上下両面側から挾持し、こ れをカットして図４に示すようなユニット１３を形成する。それから、このユニ ット１３を所定の位置でカットし、その両端側にスパッタなどの方法で、圧電素 子４の引出し電極と導通する電極膜１０を形成して、図５に示すような構造を有 する共振部品素子９（圧電基板１を保護基板８ａ，８ｂで挾持した一体型素子） を得る。そして、この共振部品素子９の両端側に、図１に示すように、カップ端 子６ａ，６ｂをはんだ付けして、電極膜１０を介してカップ端子６ａ，６ｂを引 出し電極３ａ，３ｂに接続した後、圧電素子４と保護基板８ａ，８ｂとの間に振 動空間７ａを形成するためのワックス（図示せず）を塗布し、樹脂ディップを行 って外装樹脂１３で外装する。それから、焼付けを行い、ワックスを外装樹脂１ ３に吸収させて除去することにより図１に示すような圧電共振部品が得られる。Next, an example of a method of manufacturing the above piezoelectric resonance component will be described. In manufacturing the piezoelectric resonance component of this embodiment, first, as shown in FIG. 3, an electrode 12 is formed at a predetermined position on a piezoelectric substrate (mother substrate) 11, and the electrode 12 is formed on the main surface of the mother substrate 11. The protective substrate (mother substrate) 18a (not shown in FIG. 3) and the recessed portion 7 for forming the vibrating space 7a on the surface facing the upper and lower sides are sandwiched between the upper and lower sides and cut to cut it. A unit 13 as shown in is formed. Then, the unit 13 is cut at a predetermined position, and the electrode film 10 which is electrically connected to the extraction electrode of the piezoelectric element 4 is formed on both ends of the unit 13 by a method such as sputtering to have a structure as shown in FIG. To obtain a resonance component element 9 (an integrated element in which the piezoelectric substrate 1 is held between the protective substrates 8a and 8b). Then, as shown in FIG. 1, the cup terminals 6a and 6b are soldered to both ends of the resonance component element 9, and the cup terminals 6a and 6b are connected to the extraction electrodes 3a and 3b through the electrode film 10. After the connection, a wax (not shown) for forming the vibration space 7a is applied between the piezoelectric element 4 and the protective substrates 8a, 8b, and a resin dip is performed to coat with the exterior resin 13. Then, baking is performed, and the wax is absorbed by the exterior resin 13 and removed, whereby a piezoelectric resonance component as shown in FIG. 1 is obtained.
【００１１】 この実施例の圧電共振部品は、上述のように、圧電素子４を、保護基板８ａ， ８ｂで挾持することによって一体の共振部品素子９を形成しており、保護基板８ ａ，８ｂが圧電素子４を保護して、十分な耐衝撃性、耐熱性を与えているため、 圧電素子４の厚みを、例えば、１８０μm程度にまで小さくして高周波化に対応 することが可能になる。さらに、共振部品素子９は、ある程度の大きさを有して いるので、その両端側をカップ端子６ａ，６ｂにはめ込む工程で特に作業性が低 下することがなく、また、圧電素子４が保護基板８ａ，８ｂで覆われているため 、ワックスをその隙間に効果的にゆきわたらせることができる。さらに、カップ 端子６ａ，６ｂのはんだ付け工程で、溶融はんだが振動電極２ａ，２ｂ（を含む 振動部）上にまで流れ込むことを効果的に防止することができる。In the piezoelectric resonance component of this embodiment, as described above, the piezoelectric element 4 is sandwiched between the protection substrates 8a and 8b to form an integral resonance component device 9, and the protection substrates 8a and 8b are formed. Protects the piezoelectric element 4 and imparts sufficient impact resistance and heat resistance. Therefore, it becomes possible to reduce the thickness of the piezoelectric element 4 to, for example, about 180 μm and cope with high frequencies. Further, since the resonance component element 9 has a certain size, the workability is not particularly lowered in the process of fitting both end sides into the cup terminals 6a and 6b, and the piezoelectric element 4 is protected. Since it is covered with the substrates 8a and 8b, the wax can be effectively spread into the gap. Further, in the soldering process of the cup terminals 6a and 6b, it is possible to effectively prevent the molten solder from flowing onto the vibrating electrodes 2a and 2b (including the vibrating portion).
【００１２】 さらに、ワックスがゆきわたり、振動電極２ａ，２ｂの周囲に十分な振動空間 ７ａが形成されるとともに、振動電極２ａ，２ｂ（を含む振動部）が、上下両面 側から保護基板８ａ，８ｂにより保護されているため、外装樹脂１３の焼付け工 程で、外装樹脂１３のフラッシュ（外装樹脂１３中の溶剤が気化膨張して、気泡 が破裂し、樹脂が圧電素子４の振動電極２ａ，２ｂなどに付着すること）の発生 を防止することができる。Further, as the wax spreads, a sufficient vibrating space 7a is formed around the vibrating electrodes 2a and 2b, and the vibrating electrodes 2a and 2b (including the vibrating portion) are protected from the upper and lower both sides by the protective substrate 8a, Since it is protected by 8b, during the baking process of the exterior resin 13, the flash of the exterior resin 13 (the solvent in the exterior resin 13 is vaporized and expanded, the bubbles are ruptured, and the resin is oscillated by the vibrating electrode 2a of the piezoelectric element 4). 2b) can be prevented from occurring.
【００１３】 上記実施例では、カップ端子６ａ，６ｂの長手方向に対して圧電素子４の主面 が略垂直になるような状態で共振部品素子９を保持した圧電共振部品について説 明したが、圧電素子４の主面がカップ端子６ａ，６ｂの長手方向に対して略平行 になるような状態（すなわち、９０度回転させた状態）で共振部品素子９を保持 するようにしてもよい。In the above embodiment, the piezoelectric resonance component holding the resonance component element 9 in a state where the main surface of the piezoelectric element 4 is substantially perpendicular to the longitudinal direction of the cup terminals 6a and 6b has been described. The resonant component element 9 may be held in a state in which the main surface of the piezoelectric element 4 is substantially parallel to the longitudinal direction of the cup terminals 6a and 6b (that is, in the state of being rotated by 90 degrees).
【００１４】 なお、上記実施例では、はんだ付けの方法により、カップ端子６ａ，６ｂを共 振部品素子９に取り付けた場合について説明したが、カップ端子６ａ，６ｂを共 振部品素子９に取り付ける方法としては、はんだ付けの方法に限らず、導電性接 着剤により接着する方法など他の方法を用いることも可能である。In the above embodiment, the case where the cup terminals 6a and 6b are attached to the resonance component element 9 by the soldering method has been described, but the method of attaching the cup terminals 6a and 6b to the resonance component element 9 is described. The method is not limited to the soldering method, and other methods such as a method of bonding with a conductive adhesive can be used.
【００１５】 また、振動電極２ａ，２ｂや引出し電極３ａ，３ｂの形状（パターン）、ある いは、保護基板８ａ，８ｂやその凹部７の形状などについては特に制約はなく、 この考案の作用を妨げない範囲において、種々のパターン、形状を任意に選択す ることが可能である。There are no particular restrictions on the shapes (patterns) of the vibrating electrodes 2a and 2b and the extraction electrodes 3a and 3b, or the shapes of the protective substrates 8a and 8b and the recesses 7 thereof. Various patterns and shapes can be arbitrarily selected as long as they do not interfere.
【００１６】 さらに、上記実施例においては、カップ端子６ａ，６ｂとして、共振部品素子 ９を保持する部分（保持部５）の平面形状がＵ字状のカップ端子を用いた場合に ついて説明したが、保持部その他の形状に特に制約はなく、共振部品素子９を確 実に保持することができるような種々の形状のカップ端子を用いることが可能で ある。Further, in the above-described embodiment, the cup terminals 6a and 6b are cup terminals having a U-shaped planar shape in the portion (holding portion 5) for holding the resonance component element 9. There are no particular restrictions on the shape of the holding portion or the like, and it is possible to use cup terminals of various shapes that can hold the resonant component element 9 reliably.
【００１７】[0017]
上述のように、この考案の圧電共振部品は、圧電素子をその両主面側から、対 向面に振動空間形成用の凹部を有する２枚の保護基板で挾持して共振部品素子を 形成するようにしているので、保護基板により圧電素子を保護して、耐衝撃性を 向上させることが可能になり、圧電素子の厚みを小さくして高周波化に対応する ことができる。 As described above, according to the piezoelectric resonance component of the present invention, the piezoelectric component is formed by sandwiching the piezoelectric element from both main surface sides with the two protective substrates having the concave portions for forming the vibration space on the opposite surfaces. Therefore, it becomes possible to protect the piezoelectric element by the protective substrate and improve the impact resistance, and it is possible to reduce the thickness of the piezoelectric element and cope with higher frequencies.
【００１８】 また、圧電素子の振動電極を含む振動部が、両側から保護基板により保護され ているため、カップ端子のはんだ付け工程ではんだが振動電極に流れ込むことや 、焼付け工程で外装樹脂がフラッシュして振動電極などに付着することを防止し て良好な共振特性を有する圧電共振部品を得ることができる。Further, since the vibrating portion including the vibrating electrode of the piezoelectric element is protected from the both sides by the protective substrates, the solder flows into the vibrating electrode during the soldering process of the cup terminal and the exterior resin flashes during the baking process. As a result, it is possible to prevent the piezoelectric resonance component from adhering to the vibrating electrode or the like and obtain a piezoelectric resonance component having good resonance characteristics.
【００１９】 また、共振部品素子はある程度の大きさを有するとともに、必要な機械的強度 を有しているため、カップ端子へのはめ込み工程などにおける作業性に優れてお り、大量生産にも適している。In addition, since the resonant component element has a certain size and has necessary mechanical strength, it has excellent workability in the process of fitting into the cup terminal and is suitable for mass production. ing.
【図１】この考案の一実施例にかかる圧電共振部品を示
す斜視図である。FIG. 1 is a perspective view showing a piezoelectric resonance component according to an embodiment of the present invention.
【図２】この考案の一実施例にかかる圧電共振部品を構
成する圧電素子を示す斜視図である。FIG. 2 is a perspective view showing a piezoelectric element constituting a piezoelectric resonance component according to an embodiment of the present invention.
【図３】この考案の一実施例にかかる圧電共振部品の製
造方法の一工程を示す斜視図である。FIG. 3 is a perspective view showing one step of a method of manufacturing a piezoelectric resonance component according to an embodiment of the present invention.
【図４】この考案の一実施例にかかる圧電共振部品の製
造方法の一工程を示す斜視図である。FIG. 4 is a perspective view showing one step of a method of manufacturing a piezoelectric resonance component according to an embodiment of the present invention.
【図５】この考案の一実施例にかかる圧電共振部品にお
いて用いられている共振部品素子を示す斜視図である。FIG. 5 is a perspective view showing a resonant component element used in a piezoelectric resonant component according to an embodiment of the present invention.
【図６】従来の圧電共振部品を示す斜視図である。FIG. 6 is a perspective view showing a conventional piezoelectric resonance component.
【図７】従来の圧電共振部品を構成する圧電素子を示す
斜視図である。FIG. 7 is a perspective view showing a piezoelectric element that constitutes a conventional piezoelectric resonance component.
１ 圧電基板 ２ａ，２ｂ 振動電極 ３ａ，３ｂ 引出し電極 ４ 圧電素子 ６ａ，６ｂ カップ端子 ７ 凹部 ７ａ 振動空間 ８ａ，８ｂ 保護基板 ９ 共振部品素子 DESCRIPTION OF SYMBOLS 1 Piezoelectric substrate 2a, 2b Vibration electrode 3a, 3b Extraction electrode 4 Piezoelectric element 6a, 6b Cup terminal 7 Recess 7a Vibration space 8a, 8b Protective substrate 9 Resonance component element
Claims (1)
モードを利用した圧電共振部品であって、圧電基板の互
いに異なる主面に振動電極を設けるとともに、前記振動
電極から圧電基板の異なる側の端部に引出し電極を引き
出して形成した圧電素子を、その両主面側から、前記圧
電素子と対向する面に振動空間形成用の凹部を有する２
枚の保護基板で挾持して共振部品素子を形成し、かつ、
前記共振部品素子の両端側にカップ端子を取り付けて、
前記引出し電極と前記カップ端子とを電気的に接続した
ことを特徴とする圧電共振部品。1. A piezoelectric resonance component utilizing an energy confinement type thickness-shear vibration mode, in which vibrating electrodes are provided on different principal surfaces of a piezoelectric substrate, and end portions on different sides of the vibrating electrode from the vibrating electrode are provided. A piezoelectric element formed by pulling out a lead electrode to a main surface of the piezoelectric element has a concave portion for forming a vibration space on a surface facing the piezoelectric element.
Holding the sheet of protective substrate to form a resonant component element, and
Attaching cup terminals to both ends of the resonant component element,
A piezoelectric resonance component, wherein the extraction electrode and the cup terminal are electrically connected.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8244091U JPH0525821U (en) | 1991-09-14 | 1991-09-14 | Piezoelectric resonance component |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8244091U JPH0525821U (en) | 1991-09-14 | 1991-09-14 | Piezoelectric resonance component |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0525821U true JPH0525821U (en) | 1993-04-02 |
Family
ID=13774605
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP8244091U Withdrawn JPH0525821U (en) | 1991-09-14 | 1991-09-14 | Piezoelectric resonance component |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0525821U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2015519010A (en) * | 2012-06-01 | 2015-07-06 | エム スクエアード レーザーズ リミテッドＭ Ｓｑｕａｒｅｄ Ｌａｓｅｒｓ Ｌｉｍｉｔｅｄ | Method and apparatus for locking and scanning output frequency from laser cavities |
-
1991
- 1991-09-14 JP JP8244091U patent/JPH0525821U/en not_active Withdrawn
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2015519010A (en) * | 2012-06-01 | 2015-07-06 | エム スクエアード レーザーズ リミテッドＭ Ｓｑｕａｒｅｄ Ｌａｓｅｒｓ Ｌｉｍｉｔｅｄ | Method and apparatus for locking and scanning output frequency from laser cavities |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A300 | Withdrawal of application because of no request for examination |
Free format text: JAPANESE INTERMEDIATE CODE: A300 Effective date: 19951130 |