JPH0251906A - Chip type piezoelectric resonator and its manufacture - Google Patents
Chip type piezoelectric resonator and its manufactureInfo
- Publication number
- JPH0251906A JPH0251906A JP20210388A JP20210388A JPH0251906A JP H0251906 A JPH0251906 A JP H0251906A JP 20210388 A JP20210388 A JP 20210388A JP 20210388 A JP20210388 A JP 20210388A JP H0251906 A JPH0251906 A JP H0251906A
- Authority
- JP
- Japan
- Prior art keywords
- resonator
- piezoelectric
- external electrode
- electrode
- external
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000004519 manufacturing process Methods 0.000 title claims description 8
- 239000000758 substrate Substances 0.000 claims description 33
- 238000000034 method Methods 0.000 claims description 24
- 238000004544 sputter deposition Methods 0.000 claims description 11
- 239000010409 thin film Substances 0.000 claims description 10
- 238000001771 vacuum deposition Methods 0.000 claims description 2
- 238000005476 soldering Methods 0.000 abstract description 14
- 239000004020 conductor Substances 0.000 abstract 1
- 239000000853 adhesive Substances 0.000 description 10
- 230000001070 adhesive effect Effects 0.000 description 10
- 229910000679 solder Inorganic materials 0.000 description 5
- 239000000919 ceramic Substances 0.000 description 4
- 238000005520 cutting process Methods 0.000 description 4
- 239000000463 material Substances 0.000 description 3
- 238000005498 polishing Methods 0.000 description 3
- 230000015572 biosynthetic process Effects 0.000 description 2
- 230000000052 comparative effect Effects 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000005530 etching Methods 0.000 description 2
- 239000010408 film Substances 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 238000007747 plating Methods 0.000 description 2
- 239000003795 chemical substances by application Substances 0.000 description 1
- 238000013016 damping Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000005684 electric field Effects 0.000 description 1
- 230000005520 electrodynamics Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 238000007639 printing Methods 0.000 description 1
- 229910052718 tin Inorganic materials 0.000 description 1
- 238000009489 vacuum treatment Methods 0.000 description 1
- 238000007740 vapor deposition Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/341—Surface mounted components
- H05K3/3431—Leadless components
Landscapes
- Piezo-Electric Or Mechanical Vibrators, Or Delay Or Filter Circuits (AREA)
Abstract
Description
【発明の詳細な説明】
〔産業上の利用分野〕
本発明は、振動電極部を設けられた圧電振動エレメント
を外装基板間に挾持させ、両側面に外部電極を形成さ゛
れたチップ型の圧電共振子及びその製造方法に関する。[Detailed Description of the Invention] [Field of Industrial Application] The present invention provides a chip-type piezoelectric resonator in which a piezoelectric vibrating element provided with a vibrating electrode portion is sandwiched between exterior substrates, and external electrodes are formed on both sides. and its manufacturing method.
第１０図及び第１１図に示す従来のチップ型圧電共振子
Ｇは、次のような方法により製造されている。まず、圧
電セラミックス等の圧電基板３１の表面に振動電極部３
２などを形成して圧電振動エレメント３３を製作した後
、この圧電振動エレメント３３の両面にセラミックス等
の外装基板３４を接着して角ブロック状の共振子素体３
５を製造する。次に、第１２図に示すように、複数個の
共振子素体３５を互いに外面（Ｍも面積の大きな面）を
密着させるようにして平行に並べてホルダー（図示せず
）等により保持させ、この状態でスパッタリング等の薄
膜形成技術により共振子素体３５の両側面に外部型ｆｉ
３７ｅ形成し、同時に外部を極３７を圧電振動エレメン
ト３３の振動電極部３２に導通させていた。The conventional chip-type piezoelectric resonator G shown in FIGS. 10 and 11 is manufactured by the following method. First, a vibrating electrode portion 3 is placed on the surface of a piezoelectric substrate 31 made of piezoelectric ceramics or the like.
2 and the like to produce the piezoelectric vibrating element 33, an exterior substrate 34 made of ceramics or the like is adhered to both sides of the piezoelectric vibrating element 33 to form a rectangular block-shaped resonator element 3.
5 is manufactured. Next, as shown in FIG. 12, a plurality of resonator elements 35 are arranged in parallel with each other with their outer surfaces (M is also a large surface) in close contact with each other and held by a holder (not shown) or the like. In this state, an external mold fi is formed on both sides of the resonator element body 35 using a thin film forming technique such as sputtering.
37e, and at the same time, the external pole 37 was electrically connected to the vibrating electrode portion 32 of the piezoelectric vibrating element 33.
しかして、従来のチップ型圧電共振子Ｇにあっては、共
振子素体３５が角ブロック状をしており、外部電極３７
形成時には共振子素体３５の外面全体が密着して隠れて
いるので、共振子素体３５の外面には外部電極３７は形
成されず、第１０図及び第１１図に示すように前記外面
と垂直な両側面にのみ外部型１３７が形成されていた。However, in the conventional chip-type piezoelectric resonator G, the resonator element body 35 has a square block shape, and the external electrode 37
At the time of formation, the entire outer surface of the resonator element 35 is in close contact and hidden, so no external electrode 37 is formed on the outer surface of the resonator element 35, and as shown in FIGS. External molds 137 were formed only on both vertical sides.
上記チップ型圧電共振子Ｇは、実装時には、配線基板１
３のランド部１４の上に載置され、例えばフロー半田な
どによって外部電極３７を各々のランド部１４に半田付
けされるものである。When the chip type piezoelectric resonator G is mounted, the chip type piezoelectric resonator G is mounted on the wiring board 1
The external electrode 37 is placed on each land portion 14 of No. 3, and the external electrode 37 is soldered to each land portion 14 by, for example, flow soldering.
しかしながら、従来のチップ型圧電共振子Ｇにあっては
、上述のように角ブロック状をした共振子素体３５の両
側面にのみ外部型［ｉ３７が設けられでいるので、配線
基板１３への実装状態においては、第１３図に示すよう
に、外部電極３７はランド部１４の上に垂直に配置され
ているだけであり、外部電極３７とランド部１４とは互
いの隅部に保持された半田１５によって半田接合されて
いるに過ぎなかった。言い換えれば、チップ型圧電共振
子Ｇの下面とランド部１４との間は半田付けされていな
かづな、このため、配線基板１３に実装された圧電共振
子Ｇの半田付けの機械的及び電気的な信頼性が低かった
。However, in the conventional chip-type piezoelectric resonator G, the external molds [i37] are provided only on both sides of the rectangular block-shaped resonator element body 35 as described above. In the mounted state, as shown in FIG. 13, the external electrode 37 is simply arranged vertically on the land part 14, and the external electrode 37 and the land part 14 are held at the corners of each other. They were merely soldered together using solder 15. In other words, there is no soldering between the lower surface of the chip-type piezoelectric resonator G and the land portion 14, and therefore the mechanical and electrical soldering of the piezoelectric resonator G mounted on the wiring board 13 is reliability was low.
しかして、本発明は半田付は信頼性の高いチップ型圧電
共振子とその製造方法を提供することを目的とする。SUMMARY OF THE INVENTION Therefore, an object of the present invention is to provide a chip-type piezoelectric resonator whose soldering is highly reliable and a method of manufacturing the same.
このため１本発明のチップ型圧電共振子は、圧電基板の
表面に振動電極部を設けられた圧電振動エレメントを一
対の外装基板間に挟持させて共振子素体を形成し、この
共振子素体の少なくとも一方の外面と両側面との間の角
部にそれぞれ面取りを施し、前記共振子素体の両側面及
び前記面取り部に外部２極を形成すると共に各々の外部
ｔ８ｉを前記圧電振動エレメントの各振動電極に導通さ
せたことを特徴としている。Therefore, in the chip-type piezoelectric resonator of the present invention, a piezoelectric vibrating element having a vibrating electrode section provided on the surface of a piezoelectric substrate is sandwiched between a pair of exterior substrates to form a resonator element. Corners between at least one outer surface and both side surfaces of the body are chamfered, and two external poles are formed on both side surfaces of the resonator element body and the chamfered portions, and each external t8i is connected to the piezoelectric vibrating element. It is characterized in that each of the vibrating electrodes is electrically connected.
また、本発明のチップ型圧電共振子の製造方法は、圧電
基板の表面に振動を極部を設けられた圧電振動エレメン
トを一対の外装基板間に挾持させて共振子素体を形成し
、この共振子素体の少なくとも一方の外面と両側面との
間の角部にそれぞれ面取りを施した後、複数個の共振子
素体をその外面を互いに密着させるようにして平行に並
べ、スパッタリングや真空蒸着等の薄膜形成技術により
前記共振子素体の両側面及び面取り部に外部電極を形成
することを特徴としている。In addition, the method for manufacturing a chip-type piezoelectric resonator of the present invention includes forming a resonator element by sandwiching a piezoelectric vibrating element having a pole portion on the surface of a piezoelectric substrate between a pair of exterior substrates. After chamfering the corners between at least one outer surface and both side surfaces of the resonator element, a plurality of resonator elements are arranged in parallel with their outer surfaces in close contact with each other, and then subjected to sputtering or vacuum treatment. The present invention is characterized in that external electrodes are formed on both side surfaces and chamfered portions of the resonator element by a thin film forming technique such as vapor deposition.
本発明のチップ型圧電共振子は、共振子素体の両側面と
少なくとも一方の外面との間の角部に面取り部を設け、
この両側面と面取り部とに外部Ｔ１１［ｉを形成しであ
るので、面取り部を設けられた側の外面を下にして配線
基板のランド部の上に載置し、この状態で外部電極をラ
ンド部に半田付けすることにより、両側面に形成された
外部電極ばかりでなく、圧電共振子下面の面取り部に施
された外部電極もランド部に半田付けされ、確実に外部
電極を半田付けすることができ、半田付けの機械的及び
電気的な信頼性が向上する。しかも、外部電極は面取り
部に設けられているので、この面取り部の外部電極とラ
ンド部との間に略くさび状の空間が生じ、・ここに半田
を保持することができて一層半田付けの信頼性を向上さ
せることができる。また、面取り部を設けてここへ外部
電極を設けたので、共振子素体の両側面と面取り部との
間の角度が鈍角となっているために両側面と面取り部と
の間の境界部における外部電極の断線も発生しにくい。The chip-type piezoelectric resonator of the present invention has a chamfered portion at a corner between both side surfaces of the resonator element and at least one outer surface,
Since external T11[i is formed on both sides and the chamfered portion, place the external electrode on the land portion of the wiring board with the outer surface of the side provided with the chamfered portion facing down, and in this state, attach the external electrode. By soldering to the land part, not only the external electrodes formed on both sides, but also the external electrodes formed on the chamfered part of the bottom surface of the piezoelectric resonator are soldered to the land part, ensuring that the external electrodes are soldered securely. This improves the mechanical and electrical reliability of soldering. Moreover, since the external electrode is provided on the chamfered part, a wedge-shaped space is created between the external electrode of this chamfered part and the land part, and the solder can be held here, making the soldering process even easier. Reliability can be improved. In addition, since the chamfered portion is provided and the external electrode is provided here, the angle between both side surfaces of the resonator element and the chamfered portion is an obtuse angle, so that the boundary between both side surfaces and the chamfered portion is Disconnection of the external electrode is also less likely to occur.
本発明のチップ型圧電共振子の製造方法にあっては、面
取り部を設けた後の共振子素体を互いに外面を密着させ
て平行に並べ、スパッタリング等の薄膜形成技術によっ
て外部電極を形成しているので、マスク等を用いなくて
も外部電極の不要な部分（共振子素体の外面）に成膜さ
れず、簡単な方法で必要箇所にのみ外部電極を形成でき
る。即ち、共振子素体の外面をスバ・７タリング等の際
にマスクで覆ったり、スパッタリング等の後に外面の電
極膜をエツチング除去したりする必要がない。In the method for manufacturing a chip-type piezoelectric resonator of the present invention, the resonator elements having chamfered portions are arranged in parallel with each other with their outer surfaces in close contact with each other, and external electrodes are formed by a thin film forming technique such as sputtering. Therefore, without using a mask or the like, the external electrodes are not formed on unnecessary parts (the outer surface of the resonator element body), and the external electrodes can be formed only in the necessary parts by a simple method. That is, there is no need to cover the outer surface of the resonator element with a mask during sputtering or the like, or to remove the electrode film on the outer surface by etching after sputtering or the like.
以下、本発明の実施例を添付図に基づいて詳述する。 Embodiments of the present invention will be described in detail below with reference to the accompanying drawings.
第１図及び第２図に示すものは、本発明の一実施例であ
って、エネルギー閉じ込め型の厚み縦振動を利用した圧
電共振子Ａである。この圧電共振子Ａは、圧電振動エレ
メント３の両面を一対の外装基板４で挟んだ構造をして
おり、図示例では圧電振動エレメント３は１層となって
いるが２層以上の構造になっていても差し支えない。圧
電振動エレメント３は、圧電セラミックス等の圧電材料
により形成された圧電基板１の表裏両面に互いに対向さ
せて金属薄膜の振動電極８を設けて振動電極部２を形成
したものであり、この振動電極８間に電気的な交流信号
を印加することにより娠動電ｆｌｌｉｓ間でエネルギー
閉じ込め型の厚み縦振動を生成するようにしたものであ
る。また、各々の振動電極８からは互いに逆方向へ向け
て外部型ｆ！７と接続するための導電層９が延出されて
いる。外装基板４は、上記圧電基板１と同材質の（特に
、熱膨張率等の等しい）例えばセラミックス基板等が用
いられており、圧電基板１と同じ面積の板が用いられて
いる。・この外装基板４の内面を接着剤１０により圧電
振動エレメント３の両面に接着して一体構造の共振子素
体５が形成されているが、接着剤１０は外装基板４及び
圧電振動エレメント３の全面に塗布されている訳ではな
く、第２図に示しであるように振動を極８を含む振動電
極８よりも若干広い面積の部分では接着剤１０は塗布さ
れていない。しかも、接着剤１０は薄膜である振動電極
８よりも大きな厚みで塗布されており、振動電極８が外
装基板４の内面に接触して振動がダンピングされること
のないようにしである。この結果、振動電極８は圧電基
板１と外装基板４との間に形成された振動空間１１内に
密封されている。What is shown in FIGS. 1 and 2 is an embodiment of the present invention, which is a piezoelectric resonator A that utilizes energy-trapped thickness longitudinal vibration. This piezoelectric resonator A has a structure in which both sides of a piezoelectric vibrating element 3 are sandwiched between a pair of exterior substrates 4. In the illustrated example, the piezoelectric vibrating element 3 has one layer, but it has a structure of two or more layers. It's okay to stay. The piezoelectric vibrating element 3 has a vibrating electrode part 2 formed by providing vibrating electrodes 8 made of thin metal films on both sides of a piezoelectric substrate 1 made of a piezoelectric material such as piezoelectric ceramics, facing each other. By applying an electrical alternating current signal between the two electrodes, an energy-trapped longitudinal thickness vibration is generated between the electrodynamic flis. Further, external mold f! from each vibrating electrode 8 is directed in opposite directions to each other. A conductive layer 9 for connection with 7 is extended. The exterior substrate 4 is made of the same material as the piezoelectric substrate 1 (in particular, has the same coefficient of thermal expansion), such as a ceramic substrate, and has the same area as the piezoelectric substrate 1. - The inner surface of this exterior substrate 4 is bonded to both sides of the piezoelectric vibrating element 3 with an adhesive 10 to form an integrally structured resonator element 5. The adhesive 10 is not applied to the entire surface, and as shown in FIG. 2, the adhesive 10 is not applied to a portion having a slightly wider area than the vibrating electrode 8 including the vibration pole 8. Furthermore, the adhesive 10 is applied to a thickness greater than that of the vibrating electrode 8, which is a thin film, to prevent the vibrating electrode 8 from coming into contact with the inner surface of the exterior substrate 4 and damping vibrations. As a result, the vibrating electrode 8 is sealed within the vibrating space 11 formed between the piezoelectric substrate 1 and the exterior substrate 4.
また、各々の導電層９の外縁側の部分でも接着剤１０が
塗布されておらず、外部電極７が形成される前の状態で
は導電層９の外縁側の部分が外装基板４と圧電振動エレ
メント３との間の隙間１２に露出している。また、外装
基板４の両側面と外面との間の両側の角部には面取りが
施されており、共振子素体５の上下の面取り部６から両
側面にかけて外部ｉ！７が形成されている。しかも、外
部電極７は、外装基板４と圧電振動エレメント３との間
の隙間１２に侵入しており、この隙間１２で露出してい
た導電層９に導通状態で付着しており、この結果それぞ
れの外部電極７が各々の振動電極８に導通していて各振
動電極８の外部電極７となっている。Further, the adhesive 10 is not applied to the outer edge side of each conductive layer 9, and in the state before the external electrode 7 is formed, the outer edge side of the conductive layer 9 is connected to the exterior substrate 4 and the piezoelectric vibrating element. It is exposed in the gap 12 between 3 and 3. Further, the corners on both sides between the both side surfaces and the outer surface of the exterior substrate 4 are chamfered, and the external i! 7 is formed. Moreover, the external electrode 7 has entered the gap 12 between the exterior substrate 4 and the piezoelectric vibrating element 3, and is attached in a conductive state to the conductive layer 9 that was exposed in this gap 12. As a result, each The external electrode 7 is electrically connected to each vibrating electrode 8 and serves as the external electrode 7 of each vibrating electrode 8.
しかして、この圧電共振子Ａを配線基板１３の上に実装
する場合には、第３図に示すように、圧電共振子Ａを配
線基板１３のランド部１４の上に載置し、フロー半田な
どの方法で外部電極７をランド部１４に半田付けするも
のである。このとき、圧電共振子Ａの面取り部６にも外
部電極７を設けであるので、半田１５の付着面積が大き
くなり、外部電極７をランド部１４に確実に半田付けす
ることができる。また、仮に面取り部の無い角ブロック
状の共振子素体の下面の縁にも外部電極（回り込み電極
）を設けた圧電共振子と比較しても、本発明の圧電共振
子Ａでは、面取り部６とランド部１４との間に略くさび
状の空間１６が生じるので、この空間１６に半田１５が
浸入し易く、−層半田付けの信頼性が向上する。When mounting this piezoelectric resonator A on the wiring board 13, as shown in FIG. The external electrode 7 is soldered to the land portion 14 by the following method. At this time, since the external electrode 7 is also provided on the chamfered portion 6 of the piezoelectric resonator A, the adhesion area of the solder 15 becomes large, and the external electrode 7 can be reliably soldered to the land portion 14. Moreover, even if compared with a piezoelectric resonator in which an external electrode (wrapping electrode) is also provided on the lower edge of a rectangular block-shaped resonator element without a chamfered part, the piezoelectric resonator A of the present invention has a chamfered part. Since a substantially wedge-shaped space 16 is created between the land portion 14 and the solder 15, the solder 15 easily penetrates into this space 16, improving the reliability of -layer soldering.
つぎに、上記の圧電共振子Ａの製造方法を第４図（ａ＞
（ｂ）〜第８図に従って説明する。Next, the manufacturing method of the piezoelectric resonator A described above is shown in FIG.
This will be explained according to FIGS. 8(b) to 8.
第４図（ｂ）に示すものは、複数枚の圧電基板１を切り
出すためのマザーボード１８であり、このマザーボード
１８の表面及び裏面にはスパッタリングや真空蒸着等の
薄膜形成技術により金属薄膜の振動電極８と導電層９と
が形成されている（マザーボード１８の裏面には第４図
（ｂ）と対称なパターンで振動電極８と導電層９が形成
されている。）、第４図（ａ）（ｃ）に示すものは、複
数枚の外装基板４ｆ！：切り出すためのマザーボード１
７．１９であり、まずマザーボード１７．１９の内面に
印刷等の方法によって振動電極８の厚みよりも厚く接着
剤１０を塗布した後、第５図に示すように振動＠極８を
形成されたマザーボード１８の両面にマザーボード１７
．１９を重ね、接着剤１０を硬化させて３枚のマザーボ
ード１７．１８．１９を一体に積層する。なお、第４図
（ａ）（ｃ）に見える接着１ｕ１１１０の孔２０は、振
動空間１１を形成するためのものであり、この孔２０に
振動電極８が納まるようにマザーボード１７，１８．１
９を積層する。この後、この３層のマザーボード１７，
１８．１９は、グイシングツ−等によって第５図のＣ−
Ｃ線より切断され、第６図に示すようなストリップ状の
共振子素体５が得られる。ついで、この共振子素体５は
、上下両面の肩部を全長にわたって面取り加工され、第
７図に示すように４箇所の面取り部６を形成される。こ
の面取り加工は、研削盤等によって角部を研削したり、
ダイシングソーなどでカットしたりする方法によって行
うことができる０面取り部６を設けられた共振子素体５
は、さらに第７図のＤ−Ｄ線で切断され、単体の共振子
素体５に切り離される。切り離された複数個の共振子素
体５は、第８図に示すように、外装基板４の外面同志を
密着させるようにして平行に並べられ、ホルダー（図示
せず）内に保持される。共振子素体５の両端面（第８図
の前後の面）及び端の共振子素体５の一方の外面はホル
ダーにより覆われるので、ホルダー内にセットされた各
々の共振子素体５は、両側面と各面取り部６のみが露出
している。しかして、共振子素体５をホルダーごとスパ
ッタリング装置に入れ、Ｎｉターゲット等からスパッタ
させることにより共振子素体５の露出している両側面及
び面取り部６にのみＮｉ等の外部電極７を形成すること
ができる。したがって、マスクを用いることなく、ｆｒ
Ｎ車な方法によりホルダーに納めた複数個の共振子素体
５の必要箇所（特に、面取り部６）にだけ外部電極７を
形成することができるのである。What is shown in FIG. 4(b) is a motherboard 18 for cutting out a plurality of piezoelectric substrates 1, and vibrating metal thin film electrodes are formed on the front and back surfaces of the motherboard 18 using thin film forming techniques such as sputtering and vacuum deposition. 8 and a conductive layer 9 are formed (on the back side of the motherboard 18, a vibrating electrode 8 and a conductive layer 9 are formed in a pattern symmetrical to that of FIG. 4(b)), FIG. 4(a). What is shown in (c) is a plurality of exterior boards 4f! : Motherboard 1 for cutting out
7.19, first, the adhesive 10 was applied to the inner surface of the motherboard 17.19 to a thickness thicker than the vibrating electrode 8 by a method such as printing, and then the vibrating electrode 8 was formed as shown in FIG. Motherboard 17 on both sides of motherboard 18
．． 19, the adhesive 10 is cured, and the three motherboards 17, 18, and 19 are laminated together. Note that the holes 20 of the adhesive 1u1110 visible in FIGS. 4(a) and 4(c) are for forming the vibration space 11, and the motherboards 17, 18.
Layer 9. After this, this three-layer motherboard 17,
18.19 is C- in Figure 5 by Guissingz et al.
By cutting along line C, a strip-shaped resonator element 5 as shown in FIG. 6 is obtained. Next, this resonator element body 5 is chamfered over the entire length of the upper and lower shoulder portions to form four chamfered portions 6 as shown in FIG. This chamfering process involves grinding the corner using a grinder, etc.
A resonator element body 5 provided with a zero-chamfered portion 6 that can be cut with a dicing saw or the like.
is further cut along the line DD in FIG. 7, and is separated into a single resonator element 5. As shown in FIG. 8, the plurality of separated resonator elements 5 are arranged in parallel so that the outer surfaces of the exterior substrate 4 are in close contact with each other, and held in a holder (not shown). Since both end surfaces of the resonator element 5 (front and rear surfaces in FIG. 8) and one outer surface of the end resonator element 5 are covered by the holder, each resonator element 5 set in the holder , only both side surfaces and each chamfered portion 6 are exposed. Then, the resonator element 5 is placed in a sputtering device together with the holder, and external electrodes 7 made of Ni or the like are formed only on both exposed side surfaces and the chamfered portion 6 of the resonator element 5 by sputtering from a Ni target or the like. can do. Therefore, without using a mask, fr
External electrodes 7 can be formed only at necessary locations (particularly at chamfered portions 6) of a plurality of resonator elements 5 housed in a holder using the N-type method.
上記外部電極形成方法を、仮に面取り部の無い角ブロッ
ク状の共振子素体の上下面の両側縁にも外部電極（回り
込み電極）を設けた圧電共振子と比較すると、次のよう
な利点がある。この比較例において外部電極を形成する
場合には、次のような方法により行うことができるが、
いずれもコスト面で問題がある。■共振子素体の上下面
の中央部のみをマスクで覆って薄膜を形成する方法では
、マスクが必要となり、外部電極形成コストが高くつく
、■また、共振子素体の上下面の両側縁にのみ外部電極
の一部（回り込み電極）を予め形成しておき、この後第
１２図のようにして複数個の共振子素体の両側面に一部
に外部電極を形成する方法では、工程が増加してやはり
外部電極形成コストが高くつく、■共振子素体の全面に
電極を形成し、後から不要部分の電極をエツチング等に
より除去する方法でも、材料コストと工程面でのコスト
が高くつく、これに対し、上記本発明の方法によれば、
簡単な方法により必要部分にのみ外部電極７を一度に形
成することができるのである。また、上記の比較例では
、外部電極が９０度の角度の角部に形成されるために半
田付は時などに角部で外部電極の断線を生じる恐れがあ
るが、本発明では共振子素体５の両側面と面取り部６と
の間の角度が鈍角となるので、外部型ｌｌ１１７の断線
を生じにくいという利点もある。If the above external electrode formation method is compared with a piezoelectric resonator in which external electrodes (wrapping electrodes) are also provided on both sides of the upper and lower surfaces of a rectangular block-shaped resonator element without chamfered parts, the following advantages are obtained. be. In this comparative example, the external electrodes can be formed by the following method.
Both have problems in terms of cost. ■The method of forming a thin film by covering only the central part of the top and bottom surfaces of the resonator element with a mask requires a mask, which increases the cost of forming external electrodes; In the method in which a part of the external electrode (wrapping electrode) is formed in advance only on the outer electrode, and then the external electrode is formed on a part of both sides of a plurality of resonator elements as shown in FIG. However, the method of forming electrodes on the entire surface of the resonator element and later removing unnecessary portions of the electrodes by etching, etc., also increases material and process costs. In contrast, according to the method of the present invention,
The external electrode 7 can be formed only in the necessary portions at once using a simple method. In addition, in the above comparative example, since the external electrode is formed at a corner at a 90 degree angle, soldering may sometimes cause the external electrode to break at the corner, but in the present invention, the resonator element Since the angle between both side surfaces of the body 5 and the chamfered portion 6 is an obtuse angle, there is also an advantage that disconnection of the external mold 117 is less likely to occur.
なお、スパッタリング前の共振子素体５においては、導
電層９の一部が外装基板４と圧電基板１の間において接
着剤１０から外に出ているので、外部電極７を形成する
際に、スパッタ粒子が外装基板４と圧電基板１の間の隙
間］２（接着剤１０の無い部分）に侵入して沈着し、こ
れによって外部電極７と導電層９とが接合されて導通状
態となる。Note that in the resonator element 5 before sputtering, a part of the conductive layer 9 is exposed from the adhesive 10 between the exterior substrate 4 and the piezoelectric substrate 1, so when forming the external electrode 7, The sputtered particles enter and deposit in the gap 2 between the exterior substrate 4 and the piezoelectric substrate 1 (the part where the adhesive 10 is not present), and thereby the external electrode 7 and the conductive layer 9 are bonded to each other and become electrically conductive.
こうして、共振子素体５の両側面及び面取り部６にスパ
ッタリングにより薄膜の外部＠、極７を形成した後、電
界メツキにより薄膜の外部電極７の上にＮｉとＳｎのメ
ツキ層を施して外部型ｆ１７の強度を向上させる。こう
して、第１図及び第２図に示すようなチップ型の圧電共
振子Ａが製造されるのである。In this way, after forming the thin film external electrodes 7 on both sides and the chamfered portion 6 of the resonator element 5 by sputtering, a plating layer of Ni and Sn is applied on the thin film external electrodes 7 by electric field plating. Improve the strength of type f17. In this way, a chip-type piezoelectric resonator A as shown in FIGS. 1 and 2 is manufactured.
なお、上記実襖例では、第７図のストリップ状の共振子
素体５をＤ−Ｄ線で切断した後に外部電極７を形成した
が、第７図の共振子素体５に外部電極７を形成した後に
Ｄ−Ｄ線で切断することも可能である。In the above example, the external electrode 7 was formed after cutting the strip-shaped resonator element 5 shown in FIG. 7 along the D-D line. It is also possible to cut along the D-D line after forming.
また、第９図に示すものは本発明の他例の圧電共振子Ｂ
である。これは、第６図のような複数個の共振子素体５
を研磨粉と共にドラム状のノ（レル（図示せず）内に入
れ、バレルを回転させることによって中の共振子素体５
の角部を研磨して面取りを行い、この後共振子素体５の
両側面及び面取り部６に外部電極７を形成したものであ
る。このバレル研磨による方法では、共振子素体５の両
側面と面取り部６との間の境界も摩耗して丸くなるので
、外部電極７も丸みを帯び、半田付は時などに外部型Ｆ
ｆ！７の断線を生じる恐れが一層少なくなる。なお、面
取り部６は、第９図の図示例よりももっと丸くなってい
てもよく、面取り部６の全体が円弧状に丸くなっていて
もよい、また、研削型による研削の後にバレル研磨を行
って面取り部６を形成することも可能である。Moreover, what is shown in FIG. 9 is a piezoelectric resonator B according to another example of the present invention.
It is. This is achieved by using a plurality of resonator elements 5 as shown in FIG.
is placed in a drum-shaped barrel (not shown) together with the polishing powder, and by rotating the barrel, the resonator element 5 inside is removed.
The corners of the resonator element body 5 are polished and chamfered, and then external electrodes 7 are formed on both sides of the resonator element body 5 and the chamfered portions 6. In this method of barrel polishing, the boundaries between both side surfaces of the resonator element 5 and the chamfered portion 6 are also worn and rounded, so the external electrode 7 also becomes rounded, and the soldering is sometimes done using the external mold F.
f! This further reduces the risk of wire breakage. Note that the chamfered portion 6 may be more rounded than the illustrated example of FIG. 9, or the entire chamfered portion 6 may be rounded in an arc shape, or barrel polishing may be performed after grinding with a grinding die. It is also possible to form the chamfered portion 6 by doing so.
本発明は上記実施例に限られるものでなく、適宜設計変
更可能である。特に、面取り部は共振子素体の上下両面
側に設ける必要はなく、少なくとも一方に設けられてい
れば、配線基板に実装する際に面取り部の設けられてい
る側を下にして配線基板の上に実装することが可能であ
る。もつとも、上下両側に設けであると、方向性がなく
なるので、実装作業°が容易になり、とりわけ機械実装
などに適している。また、面取り部は圧電基板にまで及
んでいても差し支えない。The present invention is not limited to the above embodiments, and the design can be changed as appropriate. In particular, it is not necessary to provide the chamfer on both the upper and lower sides of the resonator element; if it is provided on at least one side, the chamfer is placed on the wiring board with the side with the chamfer facing down when it is mounted on the wiring board. It is possible to implement above. However, if they are provided on both the upper and lower sides, there is no directionality, which makes the mounting work easier and is especially suitable for mechanical mounting. Further, the chamfered portion may extend to the piezoelectric substrate.
本発明によれば、圧電共振子を配線基板に実装して半田
付けする場合、圧電共振子の下面の面取り部に施された
外部電極も配線基板のランド部に半田付けすることがで
きるので、半田付けの機械的及び電気的な信顆性が向上
する。また、面取り部に外部電極を形成しているので、
半田付は時などにおける共振子素体の両側面と面取り部
との間のコーナ部での外部電極の断線を生じにくいもの
である。According to the present invention, when the piezoelectric resonator is mounted on a wiring board and soldered, the external electrode provided on the chamfered part of the lower surface of the piezoelectric resonator can also be soldered to the land part of the wiring board. The mechanical and electrical reliability of soldering is improved. In addition, since the external electrode is formed on the chamfered part,
Soldering is less likely to cause disconnection of the external electrodes at the corners between both sides of the resonator element and the chamfered parts.
また、本発明によれば、共振子素体に面取り部を形成し
た後、外部電極の不要な共振子素体の外面を密着させて
共振子素体の両側面及び面取り部に外部電極を形成する
ことができ、マスク等を用いることなく簡単な方法で＝
１要箇所に外部電極を形成することができ、量産性に優
れると共に外部電極を形成するためのコストを低度にす
ることができるものである。Further, according to the present invention, after forming the chamfered portion on the resonator element, the outer surface of the resonator element that does not require an external electrode is brought into close contact with the outer surface of the resonator element, and external electrodes are formed on both sides of the resonator element and the chamfered portion. can be done in a simple way without using masks etc. =
The external electrode can be formed at one important location, which is excellent in mass productivity and can reduce the cost for forming the external electrode.
第１図は本発明の一実施例を示す斜視図、第２図は同上
の断面図、第３図は同上の圧電共振子を配線基板の上に
実装した状態の正面図、第４図＜ａ＞（ｂ）（ｃ） 、
第５図、第６図、第７図及び第８図は同上の圧電共振子
の製造工程を示す説明図、第９図は本発明の他例を示す
正面図、第１０図は従来例の斜視図、第１１図は同上の
断面図、第１２図は同上の外部電極形成工程を示す斜視
図、第１３図は同上の圧電共振子を配線基板の上に実装
した状態の正面図である。
１・・・圧電基板 ２・・・振動電極部３・
・圧電振動ニレメンｌ〜
５・・・共振子素体
７・・・外部電極
４・・外装基板
６・・・面取り部
８・・・振動電極
特許出願人 株式会社 村田製作所
代理人 弁理士 中 野 雅 房FIG. 1 is a perspective view showing an embodiment of the present invention, FIG. 2 is a sectional view of the same, FIG. 3 is a front view of the piezoelectric resonator mounted on a wiring board, and FIG. a>(b)(c),
5, 6, 7, and 8 are explanatory diagrams showing the manufacturing process of the piezoelectric resonator mentioned above, FIG. 9 is a front view showing another example of the present invention, and FIG. 10 is a conventional example. FIG. 11 is a sectional view of the same as above, FIG. 12 is a perspective view showing the step of forming external electrodes of the above, and FIG. 13 is a front view of the piezoelectric resonator of the above mounted on a wiring board. . 1... Piezoelectric substrate 2... Vibrating electrode part 3.
・Piezoelectric vibrating element 1 ~ 5... Resonator element 7... External electrode 4... Exterior substrate 6... Chamfered portion 8... Vibrating electrode Patent applicant Murata Manufacturing Co., Ltd. Agent Patent attorney Nakano Miyabifusa
Claims (2)
動エレメントを一対の外装基板間に挾持させて共振子素
体を形成し、この共振子素体の少なくとも一方の外面と
両側面との間の角部にそれぞれ面取りを施し、前記共振
子素体の両側面及び前記面取り部に外部電極を形成する
と共に各々の外部電極を前記圧電振動エレメントの各振
動電極に導通させたことを特徴とするチップ型圧電共振
子。(1) A piezoelectric vibrating element having a vibrating electrode section provided on the surface of a piezoelectric substrate is sandwiched between a pair of exterior substrates to form a resonator element, and at least one outer surface and both side surfaces of the resonator element The corner portions between the piezoelectric vibrating elements are chamfered, external electrodes are formed on both sides of the resonator element and the chamfered portions, and each external electrode is electrically connected to each vibrating electrode of the piezoelectric vibrating element. Chip-type piezoelectric resonator.
動エレメントを一対の外装基板間に挾持させて共振子素
体を形成し、この共振子素体の少なくとも一方の外面と
両側面との間の角部にそれぞれ面取りを施した後、複数
個の共振子素体をその外面を互いに密着させるようにし
て平行に並べ、スパッタリングや真空蒸着等の薄膜形成
技術により前記共振子素体の両側面及び面取り部に外部
電極を形成することを特徴とするチップ型圧電共振子の
製造方法。(2) A piezoelectric vibrating element having a vibrating electrode section provided on the surface of a piezoelectric substrate is sandwiched between a pair of exterior substrates to form a resonator element, and at least one outer surface and both side surfaces of the resonator element After chamfering the corners between the two, a plurality of resonator elements are arranged in parallel with their outer surfaces in close contact with each other, and the resonator elements are formed using a thin film forming technique such as sputtering or vacuum deposition. A method for manufacturing a chip-type piezoelectric resonator, characterized in that external electrodes are formed on both side surfaces and a chamfered portion.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP20210388A JPH0251906A (en) | 1988-08-13 | 1988-08-13 | Chip type piezoelectric resonator and its manufacture |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP20210388A JPH0251906A (en) | 1988-08-13 | 1988-08-13 | Chip type piezoelectric resonator and its manufacture |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0251906A true JPH0251906A (en) | 1990-02-21 |
Family
ID=16452014
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP20210388A Pending JPH0251906A (en) | 1988-08-13 | 1988-08-13 | Chip type piezoelectric resonator and its manufacture |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0251906A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH056902U (en) * | 1991-07-03 | 1993-01-29 | 株式会社村田製作所 | Stripline resonator |
| CN102370527A (en) * | 2011-08-26 | 2012-03-14 | 王喜增 | Adjustable continuous injector |
-
1988
- 1988-08-13 JP JP20210388A patent/JPH0251906A/en active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH056902U (en) * | 1991-07-03 | 1993-01-29 | 株式会社村田製作所 | Stripline resonator |
| CN102370527A (en) * | 2011-08-26 | 2012-03-14 | 王喜增 | Adjustable continuous injector |
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