JPH05250618A - Production of metallic terminal board for rotary head - Google Patents
Production of metallic terminal board for rotary headInfo
- Publication number
- JPH05250618A JPH05250618A JP4886892A JP4886892A JPH05250618A JP H05250618 A JPH05250618 A JP H05250618A JP 4886892 A JP4886892 A JP 4886892A JP 4886892 A JP4886892 A JP 4886892A JP H05250618 A JPH05250618 A JP H05250618A
- Authority
- JP
- Japan
- Prior art keywords
- head chip
- terminal board
- terminal plate
- metal substrate
- punching
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Magnetic Heads (AREA)
Abstract
Description
【０００１】[0001]
【産業上の利用分野】本発明は、一般のＶＴＲ、８ミリ
ＶＴＲ、Ｒ−ＤＡＴ等に使用される回転ヘッド用金属端
子板の製造方法に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for manufacturing a metal terminal plate for a rotary head used in general VTR, 8 mm VTR, R-DAT and the like.
【０００２】[0002]
【従来の技術】図６に示すように、回転ヘッド用の金属
端子板１は、金属基板２上に絶縁性接着剤層３を介して
銅箔による所定の導電パターン即ち端子部４を形成し、
その端部即ち接続部以外の部分にレジスト膜５を形成す
ると共に、接続部に半田層６を形成して構成される。７
は取付け孔である。この回転ヘッド用金属端子板１の端
子部と反対の金属基板裏面の先端部８にヘッドチップ９
が取付けられ、そのコイル端末が端子部４に半田付けさ
れる。2. Description of the Related Art As shown in FIG. 6, a metal terminal plate 1 for a rotary head has a predetermined conductive pattern, that is, a terminal portion 4 made of copper foil on a metal substrate 2 with an insulating adhesive layer 3 interposed therebetween. ,
The resist film 5 is formed on the end portion, that is, the portion other than the connection portion, and the solder layer 6 is formed on the connection portion. 7
Is a mounting hole. A head chip 9 is attached to the tip portion 8 on the back surface of the metal substrate opposite to the terminal portion of the rotary head metal terminal plate 1.
Is attached, and the coil end is soldered to the terminal portion 4.
【０００３】この回転ヘッド用金属端子板１の製造方法
としては、例えば金属基板２の一面に絶縁性接着剤層３
を介して銅箔を加熱加圧して一体成形し、その銅箔をパ
ターニングして端子部４を形成し、更にレジスト膜５、
半田層６を形成した後、端子板形状に沿って打ち抜き加
工するという方法がとられている。As a method of manufacturing the rotary terminal metal terminal plate 1, for example, an insulating adhesive layer 3 is formed on one surface of a metal substrate 2.
The copper foil is heated and pressed through the above to integrally form the copper foil, and the copper foil is patterned to form the terminal portion 4, and the resist film 5,
After forming the solder layer 6, a method of punching along the shape of the terminal board is adopted.
【０００４】[0004]
【発明が解決しようとする課題】上述の金属端子板１
は、可撓性のある金属基板２と脆性のある絶縁性接着剤
層３を構成要素としているために、打ち抜き加工時に切
断面の金属基板端部が変形（所謂だれる）を起こす。し
かし、絶縁性接着剤層３はこの変形に沿ってついていき
にくく、さらに打ち抜き時の衝撃力、歪み等と相俟って
剥離しやすい。これが為に、従来は同図示のように、パ
ターン形成面側とは反対の面側（矢印Ａ方向）から打ち
抜き加工を行ってきた。SUMMARY OF THE INVENTION The above-mentioned metal terminal board 1
Since the flexible metal substrate 2 and the brittle insulating adhesive layer 3 are components, the metal substrate end portion of the cut surface is deformed (so-called drool) during the punching process. However, the insulating adhesive layer 3 is hard to follow along with this deformation, and is likely to be peeled off together with the impact force and the distortion at the time of punching. For this reason, conventionally, as shown in the same drawing, punching has been performed from the surface side (direction of arrow A) opposite to the pattern forming surface side.
【０００５】ところが、金属端子板１の先端部８にヘッ
ドチップ９を接着する際、先端部８のだれ（変形）によ
り、接着面積が小さくなり、接着強度が不安定となる弊
害があった。However, when the head chip 9 is adhered to the tip portion 8 of the metal terminal board 1, the sagging (deformation) of the tip portion 8 reduces the adhesion area, resulting in unstable adhesion strength.
【０００６】本発明は、上述の点に鑑み、ヘッドチップ
の接着強度を高め、且つ絶縁性接着剤層の剥離を防止し
た回転ヘッド用金属端子板の製造方法を提供するもので
ある。In view of the above points, the present invention provides a method of manufacturing a metal terminal plate for a rotary head, which enhances the adhesive strength of the head chip and prevents the insulating adhesive layer from peeling off.
【０００７】[0007]
【課題を解決するための手段】本発明は、金属基板２上
に絶縁性接着剤層３を介して導電パターン即ち端子部４
を形成し、このパターン形成した金属基板２を端子板形
状に打ち抜き加工する回転ヘッド用金属端子板の製造方
法において、打ち抜き加工として、金属基板２のヘッド
チップ９が取付けられる先端部８の端辺１１をパターン
形成側から打ち抜く第１の打ち抜き工程と、端辺１１以
外の部分１２を金属基板２側から打ち抜く第２の打ち抜
き工程を有することを特徴とする。According to the present invention, a conductive pattern, that is, a terminal portion 4 is formed on a metal substrate 2 with an insulating adhesive layer 3 interposed therebetween.
In the method for manufacturing a metal terminal plate for a rotary head, in which the metal substrate 2 having the pattern is formed is punched into a terminal plate shape, in the punching process, the edge of the tip portion 8 to which the head chip 9 of the metal substrate 2 is attached is punched. It is characterized by having a first punching step of punching 11 from the pattern forming side and a second punching step of punching a portion 12 other than the edge 11 from the metal substrate 2 side.
【０００８】この第１の打ち抜き工程と第２の打ち抜き
工程はどちらを先に行ってもよい。Either the first punching step or the second punching step may be performed first.
【０００９】以下、図面を参照して本発明を詳述する。
先ず図１に示すように金属基板２上に絶縁性接着剤層２
を介して銅箔を一体に接着し、この銅箔をパターニング
して所定パターンの端子部４を形成する。The present invention will be described in detail below with reference to the drawings.
First, as shown in FIG. 1, the insulating adhesive layer 2 is formed on the metal substrate 2.
A copper foil is integrally bonded via the, and the copper foil is patterned to form the terminal portion 4 having a predetermined pattern.
【００１０】金属基板２としては、厚さ０．５〜２．０
ｍｍ程度の真鍮、アルミニウム等の非磁性材料を使用す
ることができる。好ましくは、加工性、剛性、価格等の
点から真鍮を使用する。The metal substrate 2 has a thickness of 0.5 to 2.0.
A non-magnetic material such as brass or aluminum having a size of about mm can be used. Preferably, brass is used in terms of workability, rigidity, price and the like.
【００１１】また、銅箔としては、電解銅箔や圧延銅箔
で１／２〜２０Ｚ（２オンス）のものを使用することが
できる。As the copper foil, electrolytic copper foil or rolled copper foil of 1/2 to 20 Z (2 ounce) can be used.
【００１２】このような金属基板２と銅箔を一体成形す
るのに使用する接着剤であって金属基板２と銅箔の間で
絶縁層となる絶縁性接着剤層３としては、ポリエステル
系、エポキシ系、ウレタン系、シリコーン系、ポリイミ
ド系、メラミン系、ウレア系、フェノール系等の種々の
熱硬化性樹脂接着剤を使用することができ、それらの加
熱加圧方法も常法に従うことができる。The insulating adhesive layer 3 which is an adhesive used to integrally mold the metal substrate 2 and the copper foil and serves as an insulating layer between the metal substrate 2 and the copper foil is a polyester-based adhesive. Various thermosetting resin adhesives such as epoxy type, urethane type, silicone type, polyimide type, melamine type, urea type and phenol type can be used, and the heating and pressing method thereof can also follow the conventional method. ..
【００１３】銅箔をパターニングして端子部４を形成
し、さらに種々の表面処理をする方法についても特に制
限はない。例えば銅箔上にドライフィルムレジストをラ
ミネートした後、露光するか、あるいは銅箔上にレジス
トを印刷した後、エッチングして銅箔を所定パターンの
端子部４を形成し、さらに、その端子部４の端部即ち接
続部以外の部分にレジスト膜５を印刷で形成し、次いで
ロール半田することにより端子部４の接続部に半田層６
を形成する。なお、このような表面パターンの形成にお
いては、同一金属基板２上に、回転ヘッド用金属端子板
の多数個分のパターン形成を同時に行ってもよい。The method of patterning the copper foil to form the terminal portion 4 and further performing various surface treatments is not particularly limited. For example, after laminating a dry film resist on a copper foil, exposing or printing a resist on the copper foil and then etching the copper foil to form a terminal portion 4 having a predetermined pattern, and further, the terminal portion 4 The resist film 5 is formed by printing on the end portion other than the end portion, that is, the connection portion, and then the solder layer 6 is formed on the connection portion of the terminal portion 4 by roll soldering.
To form. In forming such a surface pattern, patterns for a large number of rotary terminal metal terminal plates may be simultaneously formed on the same metal substrate 2.
【００１４】次に、図２及び図３に示すように所定パタ
ーンの端子部４を形成した金属基板２を打ち抜く。この
打ち抜き加工としては、一般的なプレス機で打ち抜くこ
とができる。Next, as shown in FIGS. 2 and 3, the metal substrate 2 on which the terminal portions 4 having a predetermined pattern are formed is punched out. As the punching process, a general press machine can be used for punching.
【００１５】すなわち、図２に示すように、ヘッドチッ
プが取付けられる先端部８の端辺１１のみを端子部４が
形成された側（矢印Ｂ方向）から第１の打ち抜き加工を
施す。１４は打ち抜かれた透孔である。That is, as shown in FIG. 2, only the end side 11 of the tip portion 8 to which the head chip is attached is subjected to the first punching process from the side where the terminal portion 4 is formed (the direction of arrow B). Reference numeral 14 is a punched through hole.
【００１６】次いで、図３に示すように、端辺１１以外
の部分（即ち他の周辺部）１２を端子板形状に沿って金
属基板２側（矢印Ａ方向）から第２の打ち抜き加工を施
す。１５はこのときの打ち抜かれた透孔である。Next, as shown in FIG. 3, a portion other than the edge 11 (that is, other peripheral portion) 12 is subjected to a second punching process along the shape of the terminal plate from the metal substrate 2 side (arrow A direction). .. Reference numeral 15 is a punched through hole at this time.
【００１７】金属基板２を打ち抜いた後には、次に、図
４に示すように、金属基板２の先端部８のテーパ加工を
行う。これにより、第１の打ち抜き加工で生じただれ部
分１６が全て除去される。またこのテーパ加工により、
回転ヘッド用金属端子板にヘッドチップを取付けた際、
その金属基板の先端部８が巻線や絶縁被膜を損傷するの
を防止できる。テーパ加工の方法としては、たとえばフ
ライス盤にて所定の角度に調整した切刃を回転させ、テ
ーパ付けすればよい。After punching out the metal substrate 2, as shown in FIG. 4, the tip portion 8 of the metal substrate 2 is tapered. As a result, all of the sore portion 16 generated in the first punching process is removed. By this taper processing,
When the head chip is attached to the metal terminal plate for the rotary head,
It is possible to prevent the tip portion 8 of the metal substrate from damaging the winding and the insulating coating. As a method of tapering, for example, a cutting blade adjusted to a predetermined angle with a milling machine may be rotated to taper it.
【００１８】テーパ加工をした後には、打ち抜きやテー
パ加工により生じたバリ１７等を除くためにバレル加工
を施す。バレル加工の方法としては、回転バレル機によ
り小粒子、水などを使用して２時間位加工する方法が好
ましい。After the taper processing, barrel processing is performed to remove burrs 17 and the like produced by punching and taper processing. As a method of barrel processing, a method of processing for about 2 hours using small particles, water, etc. by a rotary barrel machine is preferable.
【００１９】バレル加工後には、加工歪み等を除去する
ためにアニール加工を行う。アニール加工の条件として
は、１００〜３００℃で１〜３時間加熱することが好ま
しい。加熱温度が１００℃未満で加熱時間が１時間未満
であると加工歪みを除くことが難しく、加熱温度が３０
０℃を超し、加熱時間が３時間を超すと金属基板の接着
剤が劣化し易くなるので好ましくない。After barrel processing, annealing processing is performed to remove processing strain and the like. As a condition of annealing, heating at 100 to 300 ° C. for 1 to 3 hours is preferable. When the heating temperature is less than 100 ° C. and the heating time is less than 1 hour, it is difficult to remove processing strain, and the heating temperature is 30
If the temperature exceeds 0 ° C. and the heating time exceeds 3 hours, the adhesive of the metal substrate is likely to deteriorate, which is not preferable.
【００２０】アニール加工の後には、回転ヘッド用金属
端子板の使用時にヘッドチップが接着される面にヘッド
チップの取付け精度を高く維持し、またその接着強度を
高めるために、ラップ加工を行う。ラップ加工の方法と
しては、片面ラップにて所定の厚みとなるまで行うのが
好ましい。After the annealing process, a lapping process is performed in order to maintain a high mounting accuracy of the head chip on the surface to which the head chip is bonded when using the metal terminal plate for a rotary head and to increase the bonding strength. As a method of lapping, it is preferable to carry out lapping on one side until a predetermined thickness is obtained.
【００２１】ラップ加工した後は、表面に付着した油分
や有機物を除去するために、超音波洗浄機等でトリクレ
ンやアセトン、中性洗剤を使用して洗浄する。After the lapping process, in order to remove oil and organic substances adhering to the surface, washing is performed using trichlene, acetone or a neutral detergent in an ultrasonic washing machine or the like.
【００２２】このようにして図５に示すように、目的の
回転ヘッド用金属端子板１８を得る。この金属端子板１
８の先端部８にヘッドチップ９が接着固定される。ヘッ
ドチップ９としては、単結晶、多結晶のフエライト上に
スパッタリング等によって膜付けを行い機械加工、ガラ
ス融着などの方法によって作成する。金属基板２とヘッ
ドチップ９は瞬間接着剤（エポキシ系）にて固定するこ
とができる。必要に応じて紫外線硬化型接着剤等で保強
する。In this way, as shown in FIG. 5, the target rotary head metal terminal plate 18 is obtained. This metal terminal board 1
The head chip 9 is adhesively fixed to the tip portion 8 of 8. The head chip 9 is formed by a method such as mechanical processing or glass fusion by applying a film on a single crystal or polycrystalline ferrite by sputtering or the like. The metal substrate 2 and the head chip 9 can be fixed with an instant adhesive (epoxy type). If necessary, strengthen with UV-curable adhesive.
【００２３】[0023]
【作用】本発明においては、ヘッドチップ９が取付けら
れる端子板１８の先端部８では、その端辺１１が第１の
打ち抜き工程でパターン形成側から打ち抜かれるので、
ヘッドチップ取付側の面８ａにだれが生じない。従っ
て、ヘッドチップ９との接着面積が十分確保され、ヘッ
ドチップ９の接着強度が安定する。In the present invention, at the tip portion 8 of the terminal plate 18 to which the head chip 9 is attached, the end side 11 is punched from the pattern forming side in the first punching step,
No sagging occurs on the surface 8a on the head chip mounting side. Therefore, a sufficient bonding area with the head chip 9 is secured, and the bonding strength of the head chip 9 is stable.
【００２４】また、先端部８の端辺１１以外の部分１２
には第２の打ち抜き工程により金属基板２側から打ち抜
かれるので、絶縁性接着剤層３の剥離は生じない。A portion 12 other than the end side 11 of the tip portion 8
In the second punching process, since the metal substrate 2 is punched out, the insulating adhesive layer 3 is not peeled off.
【００２５】[0025]
【実施例】以下、本発明の実施例を具体的に説明する。EXAMPLES Examples of the present invention will be specifically described below.
【００２６】図１〜図４に示したようにして回転ヘッド
用金属端子板１８を製造した。この場合、金属基板２と
しては、厚さ１．０ｍｍの真鍮板を使用し、銅箔として
は、電解銅箔〔１０Ｚ（１オンス）、古河サーキットフ
ォイル（株）製〕を使用した。そして、これらを接着す
る絶縁性接着剤層３として、エピコート１００７〔商品
名、シエル化学（株）製〕８０部、ジシアンジアミド２
０部およびアクリルゴム１０部をエチルセロソルブ１０
０部に溶解したものを調整し、この絶縁性接着剤を銅箔
に乾燥後の厚みが３５μｍとなるように塗布し、１４０
℃で５分間乾燥した。次いでこれと真鍮板とを積層し、
１７０℃、３０ｋｇ／ｃｍ2 、３０分で熱圧着し、銅箔
と真鍮板とを一体化した。A metal terminal plate 18 for a rotary head was manufactured as shown in FIGS. In this case, a brass plate having a thickness of 1.0 mm was used as the metal substrate 2, and an electrolytic copper foil [10Z (1 ounce), manufactured by Furukawa Circuit Foil Co., Ltd.] was used as the copper foil. Then, as an insulating adhesive layer 3 for adhering these, 80 parts of Epicoat 1007 [trade name, manufactured by Shell Chemical Co., Ltd.], dicyandiamide 2
Ethyl cellosolve 10 with 0 part and acrylic rubber 10 parts
A solution dissolved in 0 part was prepared, and this insulating adhesive was applied to a copper foil so that the thickness after drying would be 35 μm.
Dried at 5 ° C for 5 minutes. Then stack this with a brass plate,
The copper foil and the brass plate were integrated by thermocompression bonding at 170 ° C. and 30 kg / cm 2 for 30 minutes.
【００２７】次に、銅箔上にドライフィルム（ＨＧ１．
５mil 、ダイナケム社製）をゴムロールにて、１０５
℃、２〜３ｋｇ／ｃｍ2 、２ｍ／分の条件でラミネート
した。そしてラミネートしたドライフィルムを露光し、
炭酸ソーダで現像し、塩化第二銅で銅箔を所定パターン
にエッチングして端子部４を形成した。Next, a dry film (HG1.
5 mil, manufactured by Dynachem Co., Ltd., with a rubber roll, 105
Lamination was carried out under conditions of 2 ° C., 2 to 3 kg / cm 2 , and 2 m / min. Then expose the laminated dry film,
The terminal portion 4 was formed by developing with sodium carbonate and etching the copper foil with cupric chloride in a predetermined pattern.
【００２８】次いで、端子部の端部即ち接続部以外の部
分に、レジスト（Ｓ−４０Ｇ、太陽インク工業製）を乾
燥後の厚さが１５〜２５μｍとなるようにスクリーン印
刷により塗布し、１４５℃、２０分間で硬化乾燥させ
た。そして、ロール半田により端子部４の接続部に厚さ
約１００μｍの半田層５を形成した。即ち、溶融した半
田浴中に金属ロールを回転させ、この金属ロールに半田
を付着させた後、パターン形成面に接触させた。Next, a resist (S-40G, manufactured by Taiyo Ink Kogyo Co., Ltd.) is applied by screen printing to a portion other than the end portion of the terminal portion, that is, the connection portion by screen printing so that the thickness after drying is 15 to 25 μm. It was cured and dried at 0 ° C. for 20 minutes. Then, a solder layer 5 having a thickness of about 100 μm was formed on the connection portion of the terminal portion 4 by roll soldering. That is, a metal roll was rotated in a molten solder bath, solder was attached to the metal roll, and then contacted with the pattern forming surface.
【００２９】次に、金属基板２に対して打ち抜きプレス
機によりパターン形成面側からヘッドチップ９が取付け
られる先端部８の端辺１１のみを打ち抜き、次いで、同
様の打ち抜きプレス機により、パターン形成側と反対側
の金属基板２側から上記端辺１１以外の部分１２を端子
板形状に沿って打ち抜いた。その後、先端部８をテーパ
角（図４の角度θ）４５度にテーパ付けし、回転バレル
機を用いてバレル加工した。Next, only the end side 11 of the tip 8 to which the head chip 9 is attached is punched from the pattern forming surface side of the metal substrate 2 by a punching press machine, and then the pattern forming side is made by the same punching press machine. A portion 12 other than the edge 11 was punched along the shape of the terminal plate from the side opposite to the metal substrate 2 side. Then, the tip portion 8 was tapered to a taper angle (angle θ in FIG. 4) of 45 degrees, and barrel processing was performed using a rotary barrel machine.
【００３０】続いて、２５０℃の恒温槽に１時間おいて
アニール処理し、パターン形成面と反対側の金属基板面
に片面ラップによりラップ加工を施した。その後、トリ
クレンを使用して超音波洗浄機で洗浄し、回転ヘッド用
金属端子板を得た。Subsequently, annealing was performed for 1 hour in a constant temperature bath at 250 ° C., and the metal substrate surface opposite to the pattern forming surface was lapped by single-sided lap. Then, it was cleaned with an ultrasonic cleaner using trichlene to obtain a metal terminal plate for a rotary head.
【００３１】この回転ヘッド用端子板１８によれば、ヘ
ッドチップ９を取付ける先端部８の面８ａがだれること
なく平坦となり、ヘッドチップ９の接着面積が十分に得
られる。これにより、ヘッドチップ９の接着強度が高く
なり、接着強度のバラツキを少なくできる。また、ヘッ
ドチップ９を金属基板２に対して平行に取付けることが
可能となる。従って、信頼性の高い回転ヘッド用金属端
子板１８が得られる。According to this rotary head terminal plate 18, the surface 8a of the tip portion 8 to which the head chip 9 is attached becomes flat without sagging, and a sufficient bonding area of the head chip 9 can be obtained. As a result, the adhesive strength of the head chip 9 is increased, and variations in the adhesive strength can be reduced. Further, the head chip 9 can be attached in parallel to the metal substrate 2. Therefore, a highly reliable rotary head metal terminal plate 18 can be obtained.
【００３２】[0032]
【発明の効果】本発明によれば、ヘッドチップの接着強
度を高め、且つ絶縁性接着剤層の剥離がない信頼性の高
い回転ヘッド用金属端子板を製造することができる。According to the present invention, it is possible to manufacture a highly reliable metal terminal plate for a rotary head in which the adhesive strength of the head chip is enhanced and the insulating adhesive layer is not peeled off.
【図１】本発明による回転ヘッド用金属端子板の製造方
法の実施例を示す工程図（その１）である。FIG. 1 is a process diagram (No. 1) showing an embodiment of a method of manufacturing a metal terminal plate for a rotary head according to the present invention.
【図２】本発明による回転ヘッド用金属端子板の製造方
法の実施例を示す工程図（その２）である。FIG. 2 is a process diagram (No. 2) showing an embodiment of the method for manufacturing a metal terminal plate for a rotary head according to the present invention.
【図３】本発明による回転ヘッド用金属端子板の製造方
法の実施例を示す工程図（その３）である。FIG. 3 is a process diagram (No. 3) showing the embodiment of the method for producing the metal terminal plate for the rotary head according to the present invention.
【図４】本発明による回転ヘッド用金属端子板の製造方
法の実施例を示す工程図（その４）である。FIG. 4 is a process diagram (4) showing the embodiment of the method for manufacturing the metal terminal plate for the rotary head according to the present invention.
【図５】本発明による回転ヘッド用金属端子板の製造方
法の実施例を示す工程図（その５）である。FIG. 5 is a process diagram (5) showing the embodiment of the method for manufacturing the metal terminal plate for the rotary head according to the present invention.
【図６】従来の回転ヘッド用金属端子板の製造方法の例
を示す説明図である。FIG. 6 is an explanatory view showing an example of a conventional method for manufacturing a metal terminal plate for a rotary head.
１，１８ 回転ヘッド用金属端子板 ２ 金属基板 ３ 絶縁性接着剤層 ４ 端子部 ５ レジスト膜 ６ 半田層 ７ 取付け孔 ８ 先端部 ９ ヘッドチップ １４，１５ 打ち抜かれた透孔 1,18 Rotating head metal terminal plate 2 Metal substrate 3 Insulating adhesive layer 4 Terminal part 5 Resist film 6 Solder layer 7 Mounting hole 8 Tip part 9 Head chip 14,15 Punched through hole
Claims (1)
電パターンを形成し、該パターン形成した金属基板を端
子板形状に打ち抜き加工する回転ヘッド用金属端子板の
製造方法において、 上記打ち抜き加工は、 金属端子板のヘッドチップが取付けられる先端部の端辺
を上記パターン形成側から打ち抜く第１の打ち抜き工程
と、 上記端辺以外の部分を上記金属基板側から打ち抜く第２
の打ち抜き工程を有することを特徴とする回転ヘッド用
金属端子板の製造方法。1. A method of manufacturing a metal terminal plate for a rotary head, comprising forming a conductive pattern on a metal substrate via an insulating adhesive layer and punching the patterned metal substrate into a terminal plate shape. The processing includes a first punching step of punching the end side of the tip of the metal terminal plate to which the head chip is attached from the pattern forming side, and a second punching step of punching the portion other than the edge side from the metal substrate side.
A method of manufacturing a metal terminal plate for a rotary head, comprising:
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4886892A JPH05250618A (en) | 1992-03-05 | 1992-03-05 | Production of metallic terminal board for rotary head |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4886892A JPH05250618A (en) | 1992-03-05 | 1992-03-05 | Production of metallic terminal board for rotary head |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH05250618A true JPH05250618A (en) | 1993-09-28 |
Family
ID=12815269
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP4886892A Pending JPH05250618A (en) | 1992-03-05 | 1992-03-05 | Production of metallic terminal board for rotary head |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH05250618A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2022534582A (en) * | 2019-06-28 | 2022-08-02 | 維沃移動通信有限公司 | Optical modules and mobile terminals |
-
1992
- 1992-03-05 JP JP4886892A patent/JPH05250618A/en active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2022534582A (en) * | 2019-06-28 | 2022-08-02 | 維沃移動通信有限公司 | Optical modules and mobile terminals |
| US11881046B2 (en) | 2019-06-28 | 2024-01-23 | Vivo Mobile Communication Co., Ltd. | Optical module and mobile terminal |
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