JPH0239594A - Manufacture of flexible rigid wiring board - Google Patents
Manufacture of flexible rigid wiring boardInfo
- Publication number
- JPH0239594A JPH0239594A JP19090888A JP19090888A JPH0239594A JP H0239594 A JPH0239594 A JP H0239594A JP 19090888 A JP19090888 A JP 19090888A JP 19090888 A JP19090888 A JP 19090888A JP H0239594 A JPH0239594 A JP H0239594A
- Authority
- JP
- Japan
- Prior art keywords
- board
- rigid
- flexible
- hole
- dry film
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000004519 manufacturing process Methods 0.000 title claims description 10
- 229920002120 photoresistant polymer Polymers 0.000 claims abstract description 26
- 239000000853 adhesive Substances 0.000 claims abstract description 12
- 230000001070 adhesive effect Effects 0.000 claims abstract description 12
- 239000000758 substrate Substances 0.000 claims description 52
- 238000000034 method Methods 0.000 claims description 23
- 238000007747 plating Methods 0.000 abstract description 20
- 238000005530 etching Methods 0.000 abstract description 15
- 239000011888 foil Substances 0.000 abstract description 15
- 239000002904 solvent Substances 0.000 abstract description 4
- 238000005553 drilling Methods 0.000 abstract description 3
- 239000011347 resin Substances 0.000 description 16
- 229920005989 resin Polymers 0.000 description 16
- 238000010586 diagram Methods 0.000 description 6
- 238000003475 lamination Methods 0.000 description 5
- 239000000463 material Substances 0.000 description 5
- 238000005520 cutting process Methods 0.000 description 3
- 230000018109 developmental process Effects 0.000 description 3
- 230000001681 protective effect Effects 0.000 description 3
- 238000010030 laminating Methods 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 239000004642 Polyimide Substances 0.000 description 1
- 239000003513 alkali Substances 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000000149 penetrating effect Effects 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 230000007261 regionalization Effects 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4688—Composite multilayer circuits, i.e. comprising insulating layers having different properties
- H05K3/4691—Rigid-flexible multilayer circuits comprising rigid and flexible layers, e.g. having in the bending regions only flexible layers
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
- Combinations Of Printed Boards (AREA)
Abstract
Description
【発明の詳細な説明】
〈産業上の利用分野〉
本発明は、リジッド基板とフレキシブル基板とを接続し
た構造のリジッドフレキシブル配線板の製造方法に関す
る。DETAILED DESCRIPTION OF THE INVENTION <Industrial Application Field> The present invention relates to a method for manufacturing a rigid-flexible wiring board having a structure in which a rigid substrate and a flexible substrate are connected.
〈従来の技術〉
−ＪＩＩＱ的なフレキシブル配線板は、その可撓性によ
り任意の方向に配線を施すことができる利点があるが、
薄いことから、電子部品の取付は手段が複雑であり、ま
た、実装できる電子部品が制限され、例えはリジッド配
線板に用いるデイツプタイプ（挿入型）の電子部品を用
いることができない。<Prior art> -JIIQ flexible wiring boards have the advantage of being able to be wired in any direction due to their flexibility, but
Because of its thinness, mounting of electronic components is complicated and the types of electronic components that can be mounted are limited, for example, dip-type (insertion-type) electronic components used in rigid wiring boards cannot be used.
このため、電子部品取付の機能にすぐれたリジッド基板
と配線用のフレキシブル基板とを接続した構造のリジッ
ドフレキシブル配線板が採用されている。第４図はこの
リジッドフレキシブル配線板の構造を示しており、２枚
のリジッド基板３によりフレキシブル基板１の一部分を
挟み込んだ構造である。For this reason, a rigid-flexible wiring board is used, which has a structure in which a rigid board with an excellent function for mounting electronic components and a flexible board for wiring are connected. FIG. 4 shows the structure of this rigid-flexible wiring board, in which a portion of the flexible substrate 1 is sandwiched between two rigid substrates 3.
第５図はこのリジッドフレキシブル配線板を構成する材
料及びそれらの積層方法を示している。FIG. 5 shows the materials constituting this rigid-flexible wiring board and the method of laminating them.
片方の面全体に導電箔４が形成された２枚のりジット基
板３を導電箔４を外側にして接着シート５を介してフレ
キシブル基板１を挾むように重ね、全体を熱圧着する。Two adhesive substrates 3 having a conductive foil 4 formed on the entire surface of one side are stacked with the conductive foil 4 on the outside so as to sandwich a flexible substrate 1 via an adhesive sheet 5, and the whole is bonded by thermocompression.
この場合、フレキシブル基板１には、配線パターン２を
覆うフィルムカバーレイ８が予め積層されており、この
フィルムカバーレイ８はフレキシブル基板１の端子部１
０を外部に露出するための透孔９が形成されている。さ
らに、フレキシブル基板１がリジッド基板３から突き出
た部分１ａ（第４図）を後工程において切断により形成
するための透孔６，７が、リジッド基板３と接着シート
５に形成されている。In this case, a film coverlay 8 that covers the wiring pattern 2 is laminated on the flexible substrate 1 in advance, and this film coverlay 8 covers the terminal portion 1 of the flexible substrate 1.
A through hole 9 is formed to expose 0 to the outside. Further, through holes 6 and 7 are formed in the rigid substrate 3 and the adhesive sheet 5 for forming a portion 1a (FIG. 4) of the flexible substrate 1 protruding from the rigid substrate 3 by cutting in a subsequent process.
フレキシブル基板１とリジッド基板３との熱圧着が完了
した状態では、フレキシブル基板１の端子部１０が透孔
６，７．９を通じて外部に露呈しているため、このまま
では、後工程のスルーホールのめっき処理やリジッド基
板３の回路パターン形成におけるエツチング処理に際し
て、端子部１０にめっき液やエツチング液が付着し、端
子部１０が損傷を受ける。これを防止するため、めっき
処理およびエツチング処理の前に、第６図に示すように
、透孔６，７．９から露呈している端子部１０にめっき
液及びエツチング液に対して安定であり且つ剥離可能な
樹脂１１が塗布される。When the thermocompression bonding between the flexible substrate 1 and the rigid substrate 3 is completed, the terminal portion 10 of the flexible substrate 1 is exposed to the outside through the through holes 6 and 7. During the plating process or the etching process for forming a circuit pattern on the rigid substrate 3, plating solution or etching solution adheres to the terminal part 10, and the terminal part 10 is damaged. In order to prevent this, before plating and etching, as shown in FIG. 6, the terminal portion 10 exposed through the through holes 6, 7. A removable resin 11 is also applied.
その後、第７図に示すように、リジッド基板３、接着シ
ート５、フィルムカバーレイ８並びにフレキシブル基板
１を貫通するスルーホール孔１３及びスルーホールめっ
き層１４が形成され、さらに、リジッド基板３の導電箔
４をパターンエツチングして回路パターン４Ａが形成さ
れる。リジッド基板３の回路パターン４Ａとフレキシブ
ル基板１の回路パターン２とは、スルーホールめっき層
１４により電気的に接続される。スルーホールめっき及
びエツチングが完了すると、樹脂１１を剥離し、第７図
及び第８図に破′ｆ／Ａｂで示す切断線に沿って切断す
ると、第４図に示すリジッドフレキシブル配線板が完成
する。Thereafter, as shown in FIG. 7, through-hole holes 13 and through-hole plating layers 14 are formed to penetrate the rigid substrate 3, the adhesive sheet 5, the film coverlay 8, and the flexible substrate 1. A circuit pattern 4A is formed by pattern etching the foil 4. The circuit pattern 4A of the rigid board 3 and the circuit pattern 2 of the flexible board 1 are electrically connected by the through-hole plating layer 14. When through-hole plating and etching are completed, the resin 11 is peeled off and cut along the cutting line indicated by f/Ab in FIGS. 7 and 8 to complete the rigid-flexible wiring board shown in FIG. 4. .
〈発明が解決しようとする課題〉
しかしながら、上記製造方法においては、樹脂１１が透
孔６，７．９内でフィルムカバーレイ８及び端子部１０
の表面に均一に塗布された場合は問題はないが、この樹
脂１１の塗布は手作業で行われるため、熟練者が細心の
注意を払いかつ十分な時間をかけて行わないと、第６図
のような理想的な状態に樹脂１１を塗布することは困難
である。<Problems to be Solved by the Invention> However, in the above manufacturing method, the resin 11 does not adhere to the film coverlay 8 and the terminal portion 10 within the through holes 6, 7.9.
There is no problem if the resin 11 is applied uniformly to the surface of the image shown in Fig. It is difficult to apply the resin 11 in such an ideal state.
透孔６，７．９が小さくまた、リジッド基板３の厚さが
薄い場合には特に難しく、実際には、第９図に示すよう
に、塗布された樹脂１１にピンホールＩＩＡが生じたり
、リジッド基板３の導電箔４の上にはみ出し部分１１Ｂ
が生じたりするのが通常である。This is particularly difficult when the through holes 6, 7.9 are small and the rigid substrate 3 is thin, and in reality, as shown in FIG. 9, pinholes IIA may occur in the coated resin 11. Protruding portion 11B on the conductive foil 4 of the rigid board 3
It is normal for this to occur.
しかるに、樹脂１１にピンホールＩＩＡが生じた場合、
このままの状態で導電箔４のパターンエンチングを行な
うと、フレキシブル基板１の端子部１０の導体にエツチ
ング液が接触し、この部分にピンホールが生じる。また
、樹脂１１のはみ出し部１１Ｂはエツチングレジストと
して作用し、リジッド基板３上に所要の配線パターンが
形成されない。However, if a pinhole IIA occurs in the resin 11,
If pattern etching is performed on the conductive foil 4 in this state, the etching solution will come into contact with the conductor of the terminal portion 10 of the flexible substrate 1, and a pinhole will be created in this portion. Further, the protruding portion 11B of the resin 11 acts as an etching resist, and a desired wiring pattern is not formed on the rigid substrate 3.
また、上記方法では、樹脂１１の塗布を熟練者が手作業
で長時間をかけて行なうため、作業能率が悪＜、量産化
に適していないという問題もあった。Further, in the above method, since the coating of the resin 11 is carried out manually by a skilled person over a long period of time, there is a problem that the work efficiency is poor and that it is not suitable for mass production.
本発明は、上記問題点を解消するために、樹脂の塗布を
行なうことなく、高能率でかつ容易に実施することがで
きるリジッドフレキシブル配線板の製造方法を提供する
ことを目的とするものである。SUMMARY OF THE INVENTION In order to solve the above-mentioned problems, the present invention aims to provide a method for manufacturing a rigid-flexible wiring board that can be carried out easily and with high efficiency without applying resin. .
〈課題を解決するための手段〉
上記目的を達成するために、本発明においては、リジッ
ドフレキシブル配線板の製造方法を以下のように構成し
た。<Means for Solving the Problems> In order to achieve the above object, in the present invention, a method for manufacturing a rigid-flexible wiring board is configured as follows.
すなわち、樹脂を塗布するかわりに、リジッド基板とフ
レキシブル基板との熱圧着を行なう前に、フレキシブル
基板のリジッド基板の透孔から露呈する部分にドライフ
ィルムフォトレジストをラミネート及び露光現像の工程
により形成し、完成時にフレキシブル基板となる部分を
このドライフィルムフォトレジストにより覆っておく。That is, instead of applying a resin, a dry film photoresist is formed on the portion of the flexible substrate exposed through the through hole of the rigid substrate through a process of lamination, exposure and development, before thermocompression bonding between the rigid substrate and the flexible substrate. The portion that will become the flexible substrate upon completion is covered with this dry film photoresist.
熱圧着の次に、穴あけ及びスルーホールめっき処理とリ
ジッド基板の回路のパターンエツチング処理を行い、そ
の後、ドライフィルムフォトレジストを剥離する。After thermocompression bonding, drilling, through-hole plating, and pattern etching of the circuit on the rigid board are performed, and then the dry film photoresist is peeled off.
〈作用〉
本発明によるリジッドフレキシブル配線板の製造方法に
おいては、溶剤剥離型のドライフィルムフォトレジスト
をラミネート及び露光現像の工程により作成するため、
ピンホールのない均一な厚みの保護膜をフレキシブル基
板の端子部に高い位置精度で形成することができる。こ
の結果、後工程のスルーホールめっきやパターンエツチ
ングにおけるめっき液やエツチング液の端子部への付着
を防止する。また、処理後の保護膜の剥離は、溶剤によ
って簡単に行なうことができる。<Function> In the method for manufacturing a rigid-flexible wiring board according to the present invention, since a solvent-releasable dry film photoresist is created through the steps of lamination and exposure and development,
A protective film with a uniform thickness and no pinholes can be formed on the terminal portion of a flexible substrate with high positional accuracy. As a result, adhesion of plating solution or etching solution to the terminal portion during through-hole plating or pattern etching in subsequent steps is prevented. Furthermore, the protective film can be easily peeled off after treatment using a solvent.
〈実施例〉
第１図は本発明の方法により製造されるリジッドフレキ
シブル配線板を構成する材料及びそれらの積層方法を示
している。図において、１はフレキシブル基板、２は配
線パターン、３はリジッド基板、４は導電箔、５は接着
シート、６，７．９はｉ！孔、８はフィルムカバーレイ
、１０は端子部、１１はドライフィルムフォトレジスト
、１２は切り込みである。<Example> FIG. 1 shows materials constituting a rigid-flexible wiring board manufactured by the method of the present invention and a method of laminating them. In the figure, 1 is a flexible board, 2 is a wiring pattern, 3 is a rigid board, 4 is a conductive foil, 5 is an adhesive sheet, 6, 7.9 are i! 8 is a film coverlay, 10 is a terminal portion, 11 is a dry film photoresist, and 12 is a notch.
片方の面全体に導電箔４が形成された２枚のリジッド基
板３を導電箔４を外側にして接着シート５を介してフィ
ルム基板１を挟むように重ねる点、リジッド基板３と接
着シート５に透孔６，７がそれぞれ形成されている点、
さらに、フレキシブル基板１に予めフィルムカバーレイ
８が端子部１０を除いて被覆されている点は、従来の構
成（第５図）と同様である。従来と異なるのは、フレキ
シブル基板１に接着シート５を介してリジッド基板３を
重ね合わせたときに透光６，７から露呈するフィルムカ
バーレイ８と端子部１０の上にドライフィルムフォトレ
ジスト１１がラミネート及び露光現像の工程により形成
される点と、完成時にフレキシブル基板の外郭となる部
分に切り込み１２が形成されている点である。Two rigid substrates 3 having a conductive foil 4 formed on the entire surface of one side are stacked with the conductive foil 4 on the outside with the film substrate 1 interposed therebetween, and the rigid substrate 3 and the adhesive sheet 5 The point that through holes 6 and 7 are formed respectively,
Furthermore, it is similar to the conventional structure (FIG. 5) in that the flexible substrate 1 is previously covered with a film coverlay 8 except for the terminal portions 10. What is different from the conventional method is that when the rigid substrate 3 is superimposed on the flexible substrate 1 via the adhesive sheet 5, a dry film photoresist 11 is placed on the film coverlay 8 and the terminal portion 10 that are exposed through the light transmitters 6 and 7. The two points are that it is formed through the steps of lamination and exposure and development, and that the notch 12 is formed in the portion that will become the outer contour of the flexible substrate upon completion.
第２図（ａｌはリジッド基板３、接着シート５、フィル
ムカバーレイ８並びにフレキシブル基板１を上述のよう
に重ね合わせて熱圧着を行った後の断面構造を示してい
る。透孔６から露呈するフレキシブル基板１の裏面及び
表面の端子部１０並びにフィルムカバーレイ８の表面を
覆ってドライフィルムフォトレジスト１１が形成されて
いる。FIG. 2 (al shows the cross-sectional structure after the rigid substrate 3, adhesive sheet 5, film coverlay 8, and flexible substrate 1 are stacked and thermocompression bonded as described above. A dry film photoresist 11 is formed to cover the terminal portions 10 on the back and front surfaces of the flexible substrate 1 and the surface of the film coverlay 8.
その後、第２図（ｂ）に示すように、導電箔４、リジッ
ド基板３、接着シート５、フィルムカバーレイ８、配線
パターン２並びにフレキシブル基板１を貫通するスルー
ホール１３がドリリング加工により形成される。さらに
、第２図（Ｃ）に示すように、スルーホール１３の内面
にリジット基板３の導電箔４とフレキシブル基板１の配
線パターン２とを電気的に接続するめっき層１４が形成
された後に、導電７ｆ３４がパターンエツチングされ、
リジッド基板３の配線パターン４Ａが形成される。なお
、スルーホールめっきにおいては、アルカリ性めっき液
が使用されるので、ドライフィルムフォトレジスト１１
として、アルカリ剥離型を用いるとめつき処理工程でド
ライフィルムフォトレジスト１１が剥離してしまうので
、溶剤剥離型を用いる必要がある。Thereafter, as shown in FIG. 2(b), a through hole 13 penetrating the conductive foil 4, rigid substrate 3, adhesive sheet 5, film coverlay 8, wiring pattern 2, and flexible substrate 1 is formed by drilling. . Furthermore, as shown in FIG. 2(C), after the plating layer 14 that electrically connects the conductive foil 4 of the rigid board 3 and the wiring pattern 2 of the flexible board 1 is formed on the inner surface of the through hole 13, The conductive 7F34 is pattern etched,
A wiring pattern 4A of the rigid substrate 3 is formed. In addition, in through-hole plating, since an alkaline plating solution is used, dry film photoresist 11
However, if an alkali peeling type is used, the dry film photoresist 11 will peel off during the plating process, so it is necessary to use a solvent peeling type.
以上のスルーホールめっき及び回路パターンエツチング
の各処理が完了すると、溶剤によってドライフィルムフ
ォトレジスト１１が剥離される（第２図（Ｃ））。When the through-hole plating and circuit pattern etching processes described above are completed, the dry film photoresist 11 is peeled off using a solvent (FIG. 2(C)).
リジッド基板３の回路パターンの形成においては、通常
はアルカリ剥離型のドライフィルムフォトレジストを用
いて導電箔４が所要のパターンにエツチングされる。一
方、この回路パターン形成に溶剤剥離型ドライフィルム
フォトレジストを用いると、このレジストを剥離すると
きに保護用のドライフィルムフォトレジスト１１も同時
に剥離することが可能である。また、アルカリ剥離型フ
ォトレジストを回路パターン形成に用いたときには、こ
のレジストの剥離時にドライフィルムフォトレジスト１
１を剥離せず残すことができるので、その後の工程に応
じてレジストの種類を適宜選択すればよい。In forming the circuit pattern on the rigid substrate 3, the conductive foil 4 is usually etched into a desired pattern using an alkaline peelable dry film photoresist. On the other hand, if a solvent-removable dry film photoresist is used to form this circuit pattern, when this resist is removed, the protective dry film photoresist 11 can also be removed at the same time. In addition, when an alkaline peelable photoresist is used for circuit pattern formation, the dry film photoresist 1
1 can be left without being peeled off, so the type of resist can be appropriately selected depending on the subsequent process.
第３図はスルーホールめっき、回路パターンのエツチン
グ及びドライフィルムフォトレジスト１１の剥離の各処
理が完了した時点の状態を示しており、この後、必要に
応じてソルダーレジスト１５をリジッド基板３の表面に
印刷しく第２図（ｄ））、破ＮＩＡｂに沿って切断する
と、第２図（ｄｌに示すような断面構造のリジッドフレ
キシブル配線板が完成する。FIG. 3 shows the state at the time when through-hole plating, circuit pattern etching, and dry film photoresist 11 peeling are completed, and after this, solder resist 15 is applied to the surface of rigid substrate 3 as necessary. By cutting along the broken NIAb as shown in FIG. 2(d), a rigid-flexible wiring board having a cross-sectional structure as shown in FIG. 2(dl) is completed.
なお、熱圧着前にフレキシブル基板の外郭となる部分に
切り込み１２が形成されているが、これは本発明におい
ては熱圧着前にフレキシブル基板の外形加工が可能であ
るためである。その理由は、従来では、熱圧着前に切り
込みを入れると、そこから樹脂が流れ落ちてしまい、作
業性が著しく悪い。これに対して、本発明では、ドライ
フィルムフォトレジストはそのようなことがなく、した
がって、熱圧着後では加工が難しい形状でも一般的なフ
レキシブル基板の外形加工と同様に行なうことができる
。Note that the notch 12 is formed in the outer part of the flexible substrate before thermocompression bonding, but this is because in the present invention, it is possible to process the external shape of the flexible substrate before thermocompression bonding. The reason for this is that conventionally, when a cut is made before thermocompression bonding, the resin flows down from the cut, resulting in extremely poor workability. On the other hand, in the present invention, dry film photoresist does not have such a problem, and therefore, even shapes that are difficult to process after thermocompression bonding can be processed in the same way as the external shape of a general flexible substrate.
また、フレキシブル基板１の材料であるポリイミドは、
表面が平滑であるため、銅スルーホールめっきが付着し
にくいことがあるが、ドライフィルムフォトレジストを
フレキシブル基板の表裏両面に形成しておくと、このレ
ジスト上にはめっきが確実に付くので、そのような問題
は解消する。In addition, polyimide, which is the material of the flexible substrate 1, is
Because the surface is smooth, it may be difficult for copper through-hole plating to adhere, but if dry film photoresist is formed on both the front and back sides of the flexible substrate, the plating will definitely adhere to this resist. Problems like this will be resolved.
〈発明の効果〉
本発明によれば、フレキシブル基板をドライフィルムフ
ォトレジストで被覆したので、スルーホールめっき及び
回路パターンエツチングの処理においてフレキシブル基
板を損傷から保護するための樹脂の塗布を不要とし、こ
の樹脂の塗布に起因する樹脂のピンホールやはみ出しと
いった問題を解消することができる。また、樹脂の塗布
という熟練を要する煩雑な作業が不要であるので、工程
時間を短縮化し、さらに、量産化に適しているので、製
品のコストダウンが実現できる。<Effects of the Invention> According to the present invention, since the flexible substrate is coated with a dry film photoresist, there is no need to apply resin to protect the flexible substrate from damage during through-hole plating and circuit pattern etching processes. Problems such as resin pinholes and protrusion caused by resin application can be solved. Furthermore, since the complicated work of applying resin, which requires skill, is not required, the process time is shortened, and furthermore, since it is suitable for mass production, the cost of the product can be reduced.
第１図は本発明実施例の材料の構成と積層の方法を示す
図、
第２図は本発明実施例の断面構造を示す図、第３図は本
発明実施例の斜視構造を示す図、第４図はリジッドフレ
キシブル配線板の構造を示す図、
第５図は従来例の材料の構成と積層方法を示す図、
第６図、第７図、第９図は従来例の断面構造を示す図、
第８図は従来例の斜視構造を示す図である。
１・・・フレキシブル基板
２．４Ａ・・・配線パターン
３・・・リジッド基板
４・・・導電箔
５・・・接着シート
６．７．９・・・透孔
８・・・フィルムカバーレイ
０・・・端子部
１・・・ドライフィルムフォトレジスト２・・・切り込
み
３・・・スルーホール
４・・・スルーホールめっき層
第１図Fig. 1 is a diagram showing the composition of materials and the lamination method of the embodiment of the present invention, Fig. 2 is a diagram showing the cross-sectional structure of the embodiment of the invention, and Fig. 3 is a diagram showing the perspective structure of the embodiment of the invention. Figure 4 is a diagram showing the structure of a rigid-flexible wiring board, Figure 5 is a diagram showing the material composition and lamination method of the conventional example, and Figures 6, 7, and 9 are the cross-sectional structures of the conventional example. FIG. 8 is a diagram showing a perspective structure of a conventional example. 1...Flexible board 2.4A...Wiring pattern 3...Rigid board 4...Conductive foil 5...Adhesive sheet 6.7.9...Through hole 8...Film cover lay 0 ...Terminal part 1...Dry film photoresist 2...Notch 3...Through hole 4...Through hole plating layer Fig. 1
Claims (1)
在して熱圧着され、スルーホールによってリジッド基板
とフレキシブル基板の回路が電気的に接続された構造の
リジッドフレキシブル配線板の製造方法において、熱圧
着前にフレキシブル基板のリジッド基板との接合部以外
の部分にドライフィルムフォトレジストを形成し、上記
フレキシブル基板とリジッド基板との熱圧着及びスルー
ホールの形成後、上記ドライフィルムフォトレジストを
除去することを特徴とするリジッドフレキシブル配線板
の製造方法。In a method for manufacturing a rigid-flexible wiring board, in which a rigid board and a flexible board are bonded together by thermocompression with an adhesive sheet interposed in between, and the circuits of the rigid board and the flexible board are electrically connected by through holes, the flexible board is A dry film photoresist is formed on a portion of the substrate other than the joint portion with the rigid substrate, and the dry film photoresist is removed after the flexible substrate and the rigid substrate are bonded by thermocompression and the through holes are formed. A method for manufacturing a rigid-flexible wiring board.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP19090888A JPH0239594A (en) | 1988-07-29 | 1988-07-29 | Manufacture of flexible rigid wiring board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP19090888A JPH0239594A (en) | 1988-07-29 | 1988-07-29 | Manufacture of flexible rigid wiring board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0239594A true JPH0239594A (en) | 1990-02-08 |
Family
ID=16265718
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP19090888A Pending JPH0239594A (en) | 1988-07-29 | 1988-07-29 | Manufacture of flexible rigid wiring board |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0239594A (en) |
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2007088249A (en) * | 2005-09-22 | 2007-04-05 | Daisho Denshi:Kk | Method of manufacturing flex-rigid printed wiring board |
| WO2009069683A1 (en) * | 2007-11-30 | 2009-06-04 | Sony Chemical & Information Device Corporation | Method for manufacturing multilayer printed wiring board |
| WO2009099065A1 (en) * | 2008-02-04 | 2009-08-13 | Sony Chemical & Information Device Corporation | Resist ink and method for manufacturing multilayer printed wiring board |
| WO2010140214A1 (en) * | 2009-06-02 | 2010-12-09 | ソニーケミカル＆インフォメーションデバイス株式会社 | Method for manufacturing multilayer printed wiring board |
| KR20140068946A (en) | 2011-08-30 | 2014-06-09 | 히타치가세이가부시끼가이샤 | Liquid ink |
| CN104812181A (en) * | 2015-05-15 | 2015-07-29 | 信丰迅捷兴电路科技有限公司 | Photoresist film infiltration-prevention process of rigid and flexible combined plate with flexible structure outer layer |
| JP2018197327A (en) * | 2017-05-25 | 2018-12-13 | 日油株式会社 | Resist resin for flexible device |
-
1988
- 1988-07-29 JP JP19090888A patent/JPH0239594A/en active Pending
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2007088249A (en) * | 2005-09-22 | 2007-04-05 | Daisho Denshi:Kk | Method of manufacturing flex-rigid printed wiring board |
| WO2009069683A1 (en) * | 2007-11-30 | 2009-06-04 | Sony Chemical & Information Device Corporation | Method for manufacturing multilayer printed wiring board |
| JPWO2009069683A1 (en) * | 2007-11-30 | 2011-04-14 | ソニーケミカル＆インフォメーションデバイス株式会社 | Manufacturing method of multilayer printed wiring board |
| WO2009099065A1 (en) * | 2008-02-04 | 2009-08-13 | Sony Chemical & Information Device Corporation | Resist ink and method for manufacturing multilayer printed wiring board |
| WO2010140214A1 (en) * | 2009-06-02 | 2010-12-09 | ソニーケミカル＆インフォメーションデバイス株式会社 | Method for manufacturing multilayer printed wiring board |
| KR20140068946A (en) | 2011-08-30 | 2014-06-09 | 히타치가세이가부시끼가이샤 | Liquid ink |
| CN104812181A (en) * | 2015-05-15 | 2015-07-29 | 信丰迅捷兴电路科技有限公司 | Photoresist film infiltration-prevention process of rigid and flexible combined plate with flexible structure outer layer |
| JP2018197327A (en) * | 2017-05-25 | 2018-12-13 | 日油株式会社 | Resist resin for flexible device |
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