JPH05226812A - Printed wiring board and its manufacture - Google Patents
Printed wiring board and its manufactureInfo
- Publication number
- JPH05226812A JPH05226812A JP6903992A JP6903992A JPH05226812A JP H05226812 A JPH05226812 A JP H05226812A JP 6903992 A JP6903992 A JP 6903992A JP 6903992 A JP6903992 A JP 6903992A JP H05226812 A JPH05226812 A JP H05226812A
- Authority
- JP
- Japan
- Prior art keywords
- wiring board
- printed wiring
- circuit
- conductor
- manufacturing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0286—Programmable, customizable or modifiable circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/107—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by filling grooves in the support with conductive material
Landscapes
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
- Manufacturing Of Printed Wiring (AREA)
Abstract
Description
【０００１】[0001]
【産業上の利用分野】本発明は印刷配線板及びその製造
方法に関し、特に、所定の回路に付加される追加配線を
有する印刷配線板及びその製造方法に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a printed wiring board and a method for manufacturing the same, and more particularly to a printed wiring board having additional wiring added to a predetermined circuit and a method for manufacturing the same.
【０００２】[0002]
【従来の技術】図９には従来の印刷配線板１０の外観構
成、図１０にはその内部構造が各々示されている。印刷
配線板１０は、基板１２の上に所定パターンの回路導体
１４が形成されており、回路導体１４の途中には複数の
スルーホール１６が形成されている。そして、必要に応
じて回路導体１４間を接続部材１８によって電気的に接
続するようになっている。2. Description of the Related Art FIG. 9 shows an external structure of a conventional printed wiring board 10, and FIG. 10 shows its internal structure. In the printed wiring board 10, a circuit conductor 14 having a predetermined pattern is formed on a substrate 12, and a plurality of through holes 16 are formed in the circuit conductor 14. Then, the circuit conductors 14 are electrically connected by the connecting members 18 as needed.
【０００３】回路導体１４は、銅張積層板の不要な部分
を薬品で溶解除去することによって形成される。また、
接続部材１８は回路導体１４の上に電気溶接等によって
接続，形成される。The circuit conductor 14 is formed by dissolving and removing an unnecessary portion of the copper clad laminate with a chemical. Also,
The connection member 18 is connected and formed on the circuit conductor 14 by electric welding or the like.
【０００４】[0004]
【発明が解決しようとする課題】しかしながら、上記の
ような構造の従来の印刷配線板１０によると、接続部材
１８と基板１２の間に隙間があるため、当該接続部材１
８自体が水平に保たれず、また、剥がれ易いという問題
点があった。However, according to the conventional printed wiring board 10 having the above-mentioned structure, since there is a gap between the connecting member 18 and the substrate 12, the connecting member 1 is not provided.
There is a problem that 8 itself cannot be kept horizontal and is easily peeled off.
【０００５】[0005]
【発明の目的】本発明の目的は、回路導体に対して接続
部材を確実に接続，固定できる印刷配線板及びその製造
方法を提供することにある。SUMMARY OF THE INVENTION It is an object of the present invention to provide a printed wiring board and a method for manufacturing the same, in which a connecting member can be reliably connected and fixed to a circuit conductor.
【０００６】[0006]
【課題を解決するための手段】本発明に係る印刷配線板
は、上記目的を達成するために、回路基板と、基板の表
面と同一レベルの平滑表面を有するように当該基板に埋
め込まれた所定パターンの回路導体部と、回路導体部の
必要箇所を電気的に接続するように、回路導体部の必要
な複数カ所に密着するように平滑表面上に形成された中
間接続部とを備えている。In order to achieve the above object, a printed wiring board according to the present invention has a circuit board and a predetermined embedded in the board so as to have a smooth surface at the same level as the surface of the board. The circuit conductor portion of the pattern and the intermediate connection portion formed on the smooth surface so as to be in close contact with a plurality of necessary portions of the circuit conductor portion so as to electrically connect the necessary portions of the circuit conductor portion are provided. .
【０００７】また、本発明に係る印刷配線板の製造方法
は、平滑金属板の表面にドライフィルムをラミネートす
る工程と、ドライフィルム上に所定の回路パターンをプ
リントする工程と、回路パターン部分を除去する工程
と、パターン部分に回路導体となる導体メッキを形成す
る工程と、ドライフィルムを除去する工程と、導体メッ
キ上及び間に絶縁層を、導体メッキと同一レベルの水平
表面を有するように形成して中間構造体を製造する工程
と、中間構造体の金属板を剥離する工程と、回路導体の
複数の必要箇所を接続するように水平表面に導電性の中
間接続部を密着形成する工程とを含んでいる。Further, the method for manufacturing a printed wiring board according to the present invention comprises the steps of laminating a dry film on the surface of a smooth metal plate, printing a predetermined circuit pattern on the dry film, and removing the circuit pattern portion. Step, forming conductive plating to become a circuit conductor on the pattern part, removing the dry film, and forming an insulating layer on and between the conductive plating so that it has a horizontal surface at the same level as the conductive plating. A step of manufacturing the intermediate structure, a step of peeling the metal plate of the intermediate structure, and a step of closely forming a conductive intermediate connecting portion on the horizontal surface so as to connect a plurality of necessary portions of the circuit conductor. Is included.
【０００８】[0008]
【作用】本発明は上記のように構成されているため、中
間接続部と回路導体とが１つの平滑平面上で密着接続さ
れる。Since the present invention is configured as described above, the intermediate connecting portion and the circuit conductor are closely connected on one smooth plane.
【０００９】[0009]
【実施例】以下、本発明の実施例を添付図面を参照しつ
つ説明する。図１には実施例に係る印刷配線板２０の外
観構成、図２には当該配線板２０の内部構造が各々示さ
れている。印刷配線板１０は２層構造をなし、基本的に
は、基板２２と、基板２２の表面に埋め込まれた所定パ
ターンの回路導体２４と、回路導体２４間を電気的に接
続する接続部材２８とから構成されている。回路導体２
４の途中には複数のスルーホール２６が形成されてい
る。接続部材２８としては、リボン等の導体線材や導体
ペーストを使用する。Embodiments of the present invention will be described below with reference to the accompanying drawings. FIG. 1 shows an external configuration of a printed wiring board 20 according to the embodiment, and FIG. 2 shows an internal structure of the wiring board 20. The printed wiring board 10 has a two-layer structure and basically includes a substrate 22, a circuit conductor 24 having a predetermined pattern embedded in the surface of the substrate 22, and a connecting member 28 for electrically connecting the circuit conductors 24. It consists of Circuit conductor 2
A plurality of through holes 26 are formed in the middle of 4. As the connecting member 28, a conductor wire material such as a ribbon or a conductor paste is used.
【００１０】次に、上記のような構成の印刷配線板２０
の製造工程について、図３〜図８を参照しつつ説明す
る。まず、平滑性の高い金属板３０の表面にドライフィ
ルム３２をラミネートし、所定の回路パターンを露光，
現像した後、当該パターン部分を除去する（図３，図
４）。Next, the printed wiring board 20 having the above structure.
The manufacturing process will be described with reference to FIGS. First, a dry film 32 is laminated on the surface of the metal plate 30 having high smoothness, and a predetermined circuit pattern is exposed,
After the development, the pattern portion is removed (FIGS. 3 and 4).
【００１１】次に、パターン部分に回路導体２４となる
銅メッキ３４を形成し（図５）、その後、ドライフィル
ム３２を除去し片側の配線板４０を製造する（図６）。
同様にして、もう一方の配線板４２を製造し、プリプラ
グ３６を挟んで両者４０，４２を向い合せて積層する
（図７）。Next, a copper plating 34 to be the circuit conductor 24 is formed on the pattern portion (FIG. 5), and then the dry film 32 is removed to manufacture the wiring board 40 on one side (FIG. 6).
Similarly, the other wiring board 42 is manufactured, and both 40 and 42 are faced to each other with the pre-plug 36 interposed therebetween (FIG. 7).
【００１２】次に、金属板３０を剥離して図８に示すよ
うな印刷配線板を形成する。そして、必要に応じて対象
回路２４上に接続部材２８を載置し、これらを電気溶接
等によって完全に密着接続し、実施例に係る印刷配線板
２０（図１）の製造が完了する。Next, the metal plate 30 is peeled off to form a printed wiring board as shown in FIG. Then, if necessary, the connection member 28 is placed on the target circuit 24, and these are completely and tightly connected by electric welding or the like, and the manufacturing of the printed wiring board 20 (FIG. 1) according to the embodiment is completed.
【００１３】[0013]
【発明の効果】以上説明したように本発明に係る印刷配
線板は、基板の表面と同一レベルの平滑表面を有するよ
うに回路導体を埋め込み、当該平滑平面上の当該回路導
体部の必要箇所に中間接続部を形成しているため、中間
接続部と回路導体とが密着接続され、回路導体に対して
接続部材を確実に接続されるという効果がある。As described above, in the printed wiring board according to the present invention, the circuit conductor is embedded so as to have a smooth surface at the same level as the surface of the substrate, and the circuit conductor is provided in a necessary portion on the smooth plane. Since the intermediate connecting portion is formed, there is an effect that the intermediate connecting portion and the circuit conductor are closely connected and the connecting member is reliably connected to the circuit conductor.
【図１】本発明の実施例に係る印刷配線板の構成を示す
斜視図である。FIG. 1 is a perspective view showing a configuration of a printed wiring board according to an embodiment of the present invention.
【図２】図１のＡ−Ａ方向の断面図である。FIG. 2 is a sectional view taken along line AA of FIG.
【図３】実施例に係る印刷配線板の製造工程を示す工程
図である。FIG. 3 is a process drawing showing a process of manufacturing a printed wiring board according to an example.
【図４】実施例に係る印刷配線板の製造工程を示す工程
図である。FIG. 4 is a process drawing showing a process of manufacturing a printed wiring board according to an example.
【図５】実施例に係る印刷配線板の製造工程を示す工程
図である。FIG. 5 is a process drawing showing a process of manufacturing a printed wiring board according to an example.
【図６】実施例に係る印刷配線板の製造工程を示す工程
図である。FIG. 6 is a process drawing showing a process of manufacturing a printed wiring board according to an example.
【図７】実施例に係る印刷配線板の製造工程を示す工程
図である。FIG. 7 is a process drawing showing a process of manufacturing a printed wiring board according to an example.
【図８】実施例に係る印刷配線板の製造工程を示す工程
図である。FIG. 8 is a process drawing showing a process of manufacturing a printed wiring board according to an example.
【図９】従来の印刷配線板の構成を示す斜視図である。FIG. 9 is a perspective view showing a configuration of a conventional printed wiring board.
【図１０】図９のＢ−Ｂ方向の断面図である。10 is a cross-sectional view taken along the line BB of FIG.
２０ 印刷配線板 ２２ 基板 ２４ 回路導体 ２６ スルーホール ２８ 中間接続部材 ３０ 金属板 ３２ ドライフィルム ３４ 銅メッキ ３６ プリプレグ ４０ 中間構造体 20 Printed Wiring Board 22 Substrate 24 Circuit Conductor 26 Through Hole 28 Intermediate Connection Member 30 Metal Plate 32 Dry Film 34 Copper Plating 36 Prepreg 40 Intermediate Structure
Claims (4)
当該基板に埋め込まれた所定パターンの回路導体部と、 前記回路導体部の必要箇所を電気的に接続するように、
前記回路導体部の前記必要な複数カ所に密着するように
前記平滑表面上に形成された中間接続部とを備えたこと
を特徴とする印刷配線板。1. A circuit board, a circuit conductor portion having a predetermined pattern embedded in the board so as to have a smooth surface at the same level as the surface of the board, and a necessary portion of the circuit conductor portion are electrically connected. like,
A printed wiring board, comprising: an intermediate connecting portion formed on the smooth surface so as to be in close contact with the necessary plural portions of the circuit conductor portion.
両面に形成されていることを特徴とする請求項１記載の
印刷配線板。2. The printed wiring board according to claim 1, wherein the conductor circuit portion is formed on both front and back surfaces of the circuit board.
ミネートする工程と、前記ドライフィルム上に所定の回
路パターンをプリントする工程と、 前記回路パターン部分を除去する工程と、 前記パターン部分に回路導体となる導体メッキを形成す
る工程と、 前記ドライフィルムを除去する工程と、 前記導体メッキ上及び間に絶縁層を、前記導体メッキと
同一レベルの水平表面を有するように形成して中間構造
体を製造する工程と、 前記中間構造体の前記金属板を剥離する工程と、 前記回路導体の複数の必要箇所を接続するように前記水
平表面に導電性の中間接続部を密着形成する工程とを含
むことを特徴とする印刷配線板の製造方法。3. A step of laminating a dry film on the surface of a smooth metal plate, a step of printing a predetermined circuit pattern on the dry film, a step of removing the circuit pattern portion, and a circuit conductor on the pattern portion. And a step of removing the dry film, and forming an insulating layer on and between the conductor plating so as to have a horizontal surface at the same level as the conductor plating to form an intermediate structure. A step of manufacturing, a step of peeling off the metal plate of the intermediate structure, and a step of closely forming a conductive intermediate connecting portion on the horizontal surface so as to connect a plurality of necessary portions of the circuit conductor. A method of manufacturing a printed wiring board, comprising:
同様の方法によって製造し、 前記２つの中間構造体を前記絶縁層を挟んで、前記導体
メッキ部分を向かい合わせて積層して２層の印刷配線板
を製造することを特徴とする請求項３記載の印刷配線板
の製造方法。4. The method for manufacturing a printed wiring board according to claim 4, wherein, in addition to the intermediate structure, another intermediate structure is manufactured by a similar method, and the two intermediate structures sandwich the insulating layer. 4. The method for manufacturing a printed wiring board according to claim 3, wherein the conductor plated portions are laminated facing each other to produce a two-layer printed wiring board.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6903992A JPH05226812A (en) | 1992-02-18 | 1992-02-18 | Printed wiring board and its manufacture |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6903992A JPH05226812A (en) | 1992-02-18 | 1992-02-18 | Printed wiring board and its manufacture |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH05226812A true JPH05226812A (en) | 1993-09-03 |
Family
ID=13391048
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP6903992A Pending JPH05226812A (en) | 1992-02-18 | 1992-02-18 | Printed wiring board and its manufacture |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH05226812A (en) |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS547170A (en) * | 1977-06-17 | 1979-01-19 | Dainippon Printing Co Ltd | Method of making print wiring board |
| JPS61267396A (en) * | 1985-05-22 | 1986-11-26 | 株式会社日立製作所 | Printed circuit board, multilayer printed circuit equipped therewith and manufacture thereof |
| JPH02113589A (en) * | 1988-10-22 | 1990-04-25 | Matsushita Electric Works Ltd | Manufacture of printed-wiring board |
| JPH03284894A (en) * | 1990-03-30 | 1991-12-16 | Kyocera Corp | Thick film circuit substrate and manufacture thereof |
-
1992
- 1992-02-18 JP JP6903992A patent/JPH05226812A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS547170A (en) * | 1977-06-17 | 1979-01-19 | Dainippon Printing Co Ltd | Method of making print wiring board |
| JPS61267396A (en) * | 1985-05-22 | 1986-11-26 | 株式会社日立製作所 | Printed circuit board, multilayer printed circuit equipped therewith and manufacture thereof |
| JPH02113589A (en) * | 1988-10-22 | 1990-04-25 | Matsushita Electric Works Ltd | Manufacture of printed-wiring board |
| JPH03284894A (en) * | 1990-03-30 | 1991-12-16 | Kyocera Corp | Thick film circuit substrate and manufacture thereof |
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