JPH0516730Y2 - - Google Patents
Info
- Publication number
- JPH0516730Y2 JPH0516730Y2 JP7756887U JP7756887U JPH0516730Y2 JP H0516730 Y2 JPH0516730 Y2 JP H0516730Y2 JP 7756887 U JP7756887 U JP 7756887U JP 7756887 U JP7756887 U JP 7756887U JP H0516730 Y2 JPH0516730 Y2 JP H0516730Y2
- Authority
- JP
- Japan
- Prior art keywords
- package
- glass
- zircon
- added
- lead terminals
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 229910052845 zircon Inorganic materials 0.000 claims description 14
- GFQYVLUOOAAOGM-UHFFFAOYSA-N zirconium(iv) silicate Chemical compound [Zr+4].[O-][Si]([O-])([O-])[O-] GFQYVLUOOAAOGM-UHFFFAOYSA-N 0.000 claims description 14
- 239000002184 metal Substances 0.000 claims description 13
- 239000000843 powder Substances 0.000 claims description 10
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 claims description 9
- 239000005388 borosilicate glass Substances 0.000 claims description 6
- 239000011521 glass Substances 0.000 description 22
- 239000000463 material Substances 0.000 description 9
- 238000010304 firing Methods 0.000 description 6
- 238000002844 melting Methods 0.000 description 5
- 230000008018 melting Effects 0.000 description 5
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 3
- 229910052799 carbon Inorganic materials 0.000 description 3
- 229910000833 kovar Inorganic materials 0.000 description 3
- 230000015572 biosynthetic process Effects 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000007789 sealing Methods 0.000 description 2
- 238000003466 welding Methods 0.000 description 2
- 239000000654 additive Substances 0.000 description 1
- 230000000996 additive effect Effects 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 230000005284 excitation Effects 0.000 description 1
- 238000002474 experimental method Methods 0.000 description 1
- 230000004927 fusion Effects 0.000 description 1
- 230000001771 impaired effect Effects 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 230000002265 prevention Effects 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
Landscapes
- Glass Compositions (AREA)
- Piezo-Electric Or Mechanical Vibrators, Or Delay Or Filter Circuits (AREA)
Description
【考案の詳細な説明】
（産業上の利用分野）
電子機器が急速に高密度化、小型化するにつ
れ、電子部品をプリント配線基板の表面のみで実
装する表面実装デバイスが要求されている。本考
案はこの要求に対応したフラツトパツケージ型圧
電振動子に関するものである。[Detailed Description of the Invention] (Industrial Application Field) As electronic equipment rapidly becomes more dense and smaller, there is a demand for surface mount devices in which electronic components are mounted only on the surface of a printed wiring board. The present invention relates to a flat package type piezoelectric vibrator that meets this requirement.
（従来技術とその問題点） 従来例を第４図の正面図とともに説明する。(Prior art and its problems) A conventional example will be explained with reference to the front view of FIG.
フラツトパツケージ型圧電振動子はガラスを材
料とし、全体として直方体で、２本のリード端子
３１，３２（一部図示せず）が貫通し、上面に金
属層４の設けられたパツケージ２と、パツケージ
２内に設置される圧電振動素子５（図示せず）
と、金属製の蓋板６とよりなる。このパツケージ
２は圧縮成形した粉末ガラスをカーボン治具を用
いて焼成し、ガラスをリード端子３１，３２に融
着させ成形していた。このようなフラツトパツケ
ージ型圧電振動子は気密性に優れ、圧電振動子
としての電気的諸特性を損なわない。パツケー
ジの製造が容易でアセンブリー時の作業性が向上
する。コストダウンが実現できる等の利点を有
している。 The flat package type piezoelectric vibrator is made of glass, has a rectangular parallelepiped shape as a whole, has two lead terminals 31 and 32 (partially not shown) passing through it, and has a package 2 with a metal layer 4 on the top surface. Piezoelectric vibrating element 5 (not shown) installed in package 2
and a metal lid plate 6. This package 2 was formed by firing compression-molded powdered glass using a carbon jig and fusing the glass to lead terminals 31 and 32. Such a flat package type piezoelectric vibrator has excellent airtightness and does not impair various electrical characteristics as a piezoelectric vibrator. The package is easy to manufacture and work efficiency during assembly is improved. It has advantages such as cost reduction.
しかしながら、ガラス材であるホウケイ酸ガラ
スを溶融させた際粘度が低すぎ、パツケージが変
形するというように所望のパツケージ形状が得ら
れないことがあり、この変形等により気密封止が
困難になることがあつた。また溶融時の粘度が低
いことにより、溶融したガラスが第４図に示すよ
うに、リード端子に沿つて流れ、冷却時には流出
部２３，２４となつて残ることがあつた。この流
出部２３，２４はリード端子３１，３２を所望の
形に屈曲（フオーミング）させる時に破損し、こ
の破損部分からクラツクが発生し、パツケージの
気密性を損なうことがあつた。 However, when the glass material borosilicate glass is melted, the viscosity is too low and the package may deform, making it difficult to obtain the desired shape of the package.This deformation makes it difficult to achieve an airtight seal. It was hot. Furthermore, due to the low viscosity during melting, the melted glass sometimes flows along the lead terminals and remains as outflow portions 23 and 24 during cooling, as shown in FIG. The outflow portions 23 and 24 were damaged when the lead terminals 31 and 32 were bent (formed) into a desired shape, and cracks were generated from the damaged portions, impairing the airtightness of the package.
（考案の目的）
本考案は上記欠点を解決するためになされたも
ので、ガラス溶融時の低粘度に起因するパツケー
ジの変形やリード端子に沿つた流出部の形成をな
くし、気密が確実で高信頼性の圧電振動子用フラ
ツトパツケージを提供することを目的とするもの
である。(Purpose of the invention) This invention was made to solve the above-mentioned drawbacks, and it eliminates the deformation of the package and the formation of outflow parts along the lead terminals caused by the low viscosity during glass melting, and ensures airtightness and high performance. The object of the present invention is to provide a reliable flat package for a piezoelectric vibrator.
（考案の構造）
本考案による電子部品用フラツトパツケージ
は、ジルコンあるいはアルミナ粉末を10〜20％添
加したホウケイ酸ガラスからなり、このホウケイ
酸ガラスと熱膨張係数がほぼ一致したりリード端
子が一体的に形成されたことを特徴とする。(Structure of the invention) The flat package for electronic components according to the invention is made of borosilicate glass to which 10 to 20% of zircon or alumina powder is added. It is characterized by being formed.
また、上記構成において、パツケージ上部の開
口部上面に金属層を設けるとともに、パツケージ
上部よりもリード端子の貫通するパツケージ下部
に前記ジルコンあるいはアルミナ粉末を多く添加
した構成としてもよい。 Further, in the above structure, a metal layer may be provided on the upper surface of the opening in the upper part of the package, and a larger amount of the zircon or alumina powder may be added to the lower part of the package through which the lead terminal passes than the upper part of the package.
（考案の実施例）
本考案による実施例を図面とともに説明する。
第１図は本考案による実施例を示す斜視図であ
り、第２図は圧電振動素子を設置し、気密封止し
た時の断面図を示す図である。(Embodiment of the invention) An embodiment of the invention will be described with reference to the drawings.
FIG. 1 is a perspective view showing an embodiment of the present invention, and FIG. 2 is a sectional view showing a piezoelectric vibrating element installed and hermetically sealed.
フラツトパツケージ型圧電振動子１は、全体と
して直方体で、２本のリード端子３１，３２が貫
通し、上面に金属層４の設けられたパツケージ２
と、パツケージ２内に設置される圧電振動素子５
と気密封止用の蓋板６とよりなる。 The flat package type piezoelectric vibrator 1 has a rectangular parallelepiped shape as a whole, and has a package 2 through which two lead terminals 31 and 32 pass and a metal layer 4 provided on the top surface.
and a piezoelectric vibrating element 5 installed in the package 2.
and a lid plate 6 for airtight sealing.
パツケージ２の材料は粉末状のジルコン
（ZrO2）を15重量％添加したホウケイ酸ガラスで
あり、パツケージ内部にはリード端子３１，３２
に密着する段部２１，２２が設けられている。リ
ード端子３１，３２の材料はコバールであり、パ
ツケージの材料であるガラスと熱膨張係数が略一
致している。リード端子３１，３２はパツケージ
２の側面を貫通し、前記段部２１，２２上で一部
露出（露出部３１１，３２１）している。金属層
４の材料はリード端子と同じく、ガラスと熱膨張
係数が略一致しているコバールである。 The material of the package 2 is borosilicate glass to which 15% by weight of powdered zircon (ZrO 2 ) is added, and the lead terminals 31 and 32 are inside the package.
Step portions 21 and 22 are provided that are in close contact with. The material of the lead terminals 31 and 32 is Kovar, and its coefficient of thermal expansion is approximately the same as that of glass, which is the material of the package. The lead terminals 31 and 32 pass through the side surface of the package 2 and are partially exposed (exposed parts 311 and 321) on the step parts 21 and 22. The material of the metal layer 4 is Kovar, which has a coefficient of thermal expansion that is substantially the same as that of glass, as is the case with the lead terminals.
第３図に示すようにこれらパツケージ２の元と
なる粉末ガラスを圧縮成形したガラス２５と２６
とでリード端子３１，３２を挟み、その上部に金
属層４を設置し、そして段部２１，２２を有する
パツケージ２を形作るカーボン治具８１，８２内
に設置され、900℃前後の高温度下で焼成され、
ガラス溶着により一体化される。尚、リード端子
３１，３２と金属層４は焼成前には酸化処理が施
されている。 As shown in FIG. 3, glasses 25 and 26 are compression-molded from powdered glass, which is the basis of these packages 2.
The lead terminals 31 and 32 are sandwiched between the metal layer 4 and the metal layer 4 is placed on top of the lead terminals 31 and 32.The metal layer 4 is then placed in carbon jigs 81 and 82 that form the package 2 having the stepped portions 21 and 22, and is heated under a high temperature of around 900°C. is fired in
Integrated by glass welding. Note that the lead terminals 31 and 32 and the metal layer 4 are oxidized before firing.
ジルコン粉末は任意の粒径でよく、ガラス内に
任意に混合しており、ガラス溶融時の粘度を高め
焼成成形時の型くずれ防止に寄与している。発明
者はガラス材に占めるジルコン粉末の割合、すな
わちジルコン粉末の添加量を変化させて実験を繰
り返した結果、ジルコンを10〜20重量％添加する
と溶融時に適切な粘度並びに焼成後の気密性の得
られることを見い出した。10重量％以下の添加で
あると溶融時の粘度が低く、型くずれを起こし所
望のパツケージ形状が得られなくなり、また前記
流出部が形成され、この流出部の破損により気密
性が損なわれることがあつた。20重量％以上の添
加であると溶融時の粘度は高く成形し易いが、添
加物が多すぎる為焼成後のパツケージは良好な気
密性が得られず、気密封止に適さないことがあつ
た。 Zircon powder may have any particle size and is mixed into the glass as desired, increasing the viscosity of the glass during melting and contributing to prevention of deformation during firing and molding. The inventor repeated experiments by changing the proportion of zircon powder in the glass material, that is, the amount of zircon powder added, and found that adding 10 to 20% by weight of zircon resulted in appropriate viscosity during melting and airtightness after firing. I found out that it can be done. If less than 10% by weight is added, the viscosity during melting will be low and the package will lose its shape, making it impossible to obtain the desired package shape.In addition, the above-mentioned outflow portion may be formed and the airtightness may be impaired due to breakage of this outflow portion. Ta. If 20% by weight or more is added, the viscosity when melted is high and it is easy to mold, but because there is too much additive, the package after firing may not have good airtightness and may not be suitable for airtight sealing. .
圧電振動素子５はATカツト水晶板であり、表
裏面に励振電極５１，５２が形成され、かつ長手
方向に引き出され、側面から反対面に回り込んで
いる。この圧電振動素子５を前記パツケージの段
部２１，２２上に露出しているリード端子露出部
３１１，３２１に架設し、この圧電振動素子５の
両端部と前記露出部３１１，３２１とを導電性接
着剤等７１，７２で電気的機械的接続をする。そ
して金属製の蓋板６と前記金属層４とを半田付法
あるいは超音波溶接法等適当な手段で気密封止す
ることにより、フラツトパツケージ型圧電振動子
の完成となる。 The piezoelectric vibrating element 5 is an AT-cut crystal plate, and excitation electrodes 51 and 52 are formed on the front and back surfaces, and are drawn out in the longitudinal direction and wrap around from the side to the opposite surface. This piezoelectric vibrating element 5 is installed on the lead terminal exposed parts 311, 321 exposed on the stepped parts 21, 22 of the package, and both ends of this piezoelectric vibrating element 5 and the exposed parts 311, 321 are connected to each other by conductive conductivity. Electrical and mechanical connections are made using adhesives 71 and 72. Then, the metal cover plate 6 and the metal layer 4 are hermetically sealed by a suitable method such as soldering or ultrasonic welding, thereby completing the flat package type piezoelectric vibrator.
本考案は上記実施例に限定されるものではな
く、多種の変形実施例を包含するものである。例
えば前記ジルコン粉末の替わりにアルミナ（Ａ
２O3）粉末を用いても同じ効果が得られる。また
第３図を用いて説明するが、リード端子の貫通し
たパツケージ下部に相当するガラス２５に添加す
るジルコンあるいはアルミナ等の量よりも、パツ
ケージ上部を構成するガラス２６に添加する当該
量を少なくする（例えばガラス２５に添加する当
該量を20重量％、ガラス２６に添加する当該量を
15重量％とする）ことにより、パツケージ上部の
ガラスを若干柔らかくしパツケージ開口部に施さ
れる金属層の焼成時に生じる歪を緩和することが
でき、良好な気密性を保つたままガラスと金属層
との融着を強固にすることができる。さらに、ジ
ルコンを添加したガラス層とアルミナを添加した
ガラス層を一体形成してもよいし、リード端子の
材料はコバールのみならず42アロイ等ホウケイ酸
ガラスと熱膨張係数が略一致した材料であればよ
い。 The present invention is not limited to the above embodiments, but includes various modified embodiments. For example, instead of the zircon powder, alumina (A
The same effect can be obtained by using 2 O 3 ) powder. Furthermore, as will be explained using FIG. 3, the amount of zircon or alumina added to the glass 26 forming the upper part of the package is smaller than the amount of zircon or alumina added to the glass 25 corresponding to the lower part of the package through which the lead terminals pass. (For example, the amount added to glass 25 is 20% by weight, and the amount added to glass 26 is 20% by weight.
15% by weight), it is possible to slightly soften the glass at the top of the package and alleviate the distortion that occurs during firing of the metal layer applied to the package opening. It is possible to strengthen the fusion bond with. Furthermore, the glass layer doped with zircon and the glass layer doped with alumina may be integrally formed, and the material of the lead terminal may be not only Kovar but also a material with a coefficient of thermal expansion that roughly matches that of borosilicate glass such as 42 alloy. Bye.
なお、上記実施例では圧電振動子を例に取り説
明したが、本考案によるパツケージは他の電子部
品のパツケージにも適用できる。 Although the above embodiment has been explained using a piezoelectric vibrator as an example, the package according to the present invention can also be applied to packages for other electronic components.
（考案の効果）
本考案によればリード端子と熱膨張係数が略一
致したガラス材にジルコンあるいはアルミナ粉末
を10〜20重量％添加し、リード端子とともに焼成
成形しているので、ガラス溶融時の低粘度に起因
するパツケージの変形やリード端子に沿つた流出
部の形成をなくし、またパツケージ自体も気密性
に優れているので、全体として多種の気密性を阻
害する起因を排除でき、信頼性の高い電子部品用
フラツトパツケージを得ることができる。(Effects of the invention) According to the invention, 10 to 20% by weight of zircon or alumina powder is added to a glass material whose coefficient of thermal expansion is approximately the same as that of the lead terminals, and is fired and formed together with the lead terminals. This eliminates the deformation of the package due to low viscosity and the formation of leakage along the lead terminals, and the package itself has excellent airtightness, so it eliminates various causes that impede airtightness and improves reliability. A high quality flat package for electronic components can be obtained.
第１図、第２図は本考案の実施例を示す図、第
３図はパツケージを形作るカーボン治具を示す
図、第４図は従来例を示す図である。
２……パツケージ、３１，３２……リード端
子、６……蓋板。
1 and 2 are views showing an embodiment of the present invention, FIG. 3 is a view showing a carbon jig for forming a package, and FIG. 4 is a view showing a conventional example. 2...Package cage, 31, 32...Lead terminal, 6...Lid plate.
Claims (1)
加したホウケイ酸ガラスからなり、このホウケ
イ酸ガラスと熱膨張係数がほぼ一致したリード
端子が一体的に形成された電子部品用フラツト
パツケージ。 (2) パツケージ上部の開口部上面に金属層を設け
るとともに、パツケージ上部よりもリード端子
の貫通するパツケージ下部に前記ジルコンある
いはアルミナ粉末を多く添加したことを特徴と
する実用新案登録請求の範囲第１項の電子部品
用フラツトパツケージ。[Claims for Utility Model Registration] (1) An electronic device made of borosilicate glass to which 10 to 20% of zircon or alumina powder is added, and a lead terminal whose thermal expansion coefficient is approximately the same as that of the borosilicate glass is integrally formed. Flat package cage for parts. (2) A metal layer is provided on the upper surface of the opening in the upper part of the package, and more of the zircon or alumina powder is added to the lower part of the package through which the lead terminal passes than in the upper part of the package. Flat package cage for electronic components.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7756887U JPH0516730Y2 (en) | 1987-05-22 | 1987-05-22 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7756887U JPH0516730Y2 (en) | 1987-05-22 | 1987-05-22 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS63185318U JPS63185318U (en) | 1988-11-29 |
| JPH0516730Y2 true JPH0516730Y2 (en) | 1993-05-06 |
Family
ID=30925694
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP7756887U Expired - Lifetime JPH0516730Y2 (en) | 1987-05-22 | 1987-05-22 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0516730Y2 (en) |
Families Citing this family (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0683008B2 (en) * | 1989-08-22 | 1994-10-19 | セイコー電子部品株式会社 | Surface mount piezoelectric vibrator container |
| JP2742615B2 (en) * | 1989-11-27 | 1998-04-22 | 京セラ株式会社 | Package for storing semiconductor elements |
| JP2742617B2 (en) * | 1989-11-30 | 1998-04-22 | 京セラ株式会社 | Package for storing semiconductor elements |
| JP2742613B2 (en) * | 1989-11-27 | 1998-04-22 | 京セラ株式会社 | Package for storing semiconductor elements |
| JP2742611B2 (en) * | 1989-11-27 | 1998-04-22 | 京セラ株式会社 | Package for storing semiconductor elements |
| JP2742616B2 (en) * | 1989-11-27 | 1998-04-22 | 京セラ株式会社 | Package for storing semiconductor elements |
| JP2742618B2 (en) * | 1989-11-30 | 1998-04-22 | 京セラ株式会社 | Package for storing semiconductor elements |
| JP2742612B2 (en) * | 1989-11-27 | 1998-04-22 | 京セラ株式会社 | Package for storing semiconductor elements |
| JP2742614B2 (en) * | 1989-11-27 | 1998-04-22 | 京セラ株式会社 | Package for storing semiconductor elements |
| JP2742610B2 (en) * | 1989-11-27 | 1998-04-22 | 京セラ株式会社 | Package for storing semiconductor elements |
-
1987
- 1987-05-22 JP JP7756887U patent/JPH0516730Y2/ja not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JPS63185318U (en) | 1988-11-29 |
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