TWI836544B - Piezoelectric vibration device and manufacturing method of piezoelectric vibration device - Google Patents
Piezoelectric vibration device and manufacturing method of piezoelectric vibration device Download PDFInfo
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- 239000000155 melt Substances 0.000 claims 2
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 120
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- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H3/00—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators
- H03H3/007—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators for the manufacture of electromechanical resonators or networks
- H03H3/02—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators for the manufacture of electromechanical resonators or networks for the manufacture of piezoelectric or electrostrictive resonators or networks
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- H—ELECTRICITY
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- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
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Abstract
Description
本發明係關於一種壓電振動器件及壓電振動器件的製造方法。 The present invention relates to a piezoelectric vibration device and a method for manufacturing the piezoelectric vibration device.
壓電振動器件例如包含採用石英諧振片的石英諧振器。前述石英諧振器係具有屬於壓電元件的石英諧振片、保持前述石英諧振片的保持構件、及將前述保持構件密閉的蓋構件。前述石英諧振器係將前述石英諧振片保持於由陶瓷等絕緣體構成的箱狀的前述保持構件內。前述石英諧振器係於前述石英諧振片的電極與前述保持構件內的電極接合的狀態下，藉由蓋構件密閉。 Piezoelectric oscillator devices include, for example, quartz resonators using quartz resonator plates. The quartz resonator has a quartz resonator plate that is a piezoelectric element, a holding member that holds the quartz resonator plate, and a cover member that seals the holding member. The quartz resonator holds the quartz resonator plate in a box-shaped holding member made of an insulating body such as ceramic. The quartz resonator is sealed by the cover member in a state where the electrode of the quartz resonator plate is joined to the electrode in the holding member.
上述壓電振動器件的製造方法係包含壓電元件安裝步驟、蓋體配置步驟、蓋體暫接步驟及蓋體接合步驟。前述壓電元件安裝步驟係將前述壓電元件接合於塗布有導電性的接合材的前述保持構件內的電極墊。前述蓋體配置步驟係將具有接合構件的蓋體配置於已接合前述壓電元件的前述保持構件的開口部。前述蓋體暫接步驟係使配置於前述保持構件的前述蓋體的接合構件的一部分熔融以暫接於前述保持構件。前述蓋體接合步驟係於氮氣環境中或真空環境中將前述保持構件與前述蓋體接合。例如專利文獻1揭示的蓋體暫接步驟係將金
屬棒壓觸於前述蓋體的一部分並通電，藉由電阻熱使前述蓋體的接合構件的一部分熔融而暫接於前述保持構件。
The above-mentioned manufacturing method of a piezoelectric vibration device includes a step of mounting a piezoelectric element, a step of arranging a cover, a step of temporarily connecting the cover, and a step of joining the cover. The piezoelectric element mounting step is to bond the piezoelectric element to the electrode pad in the holding member coated with a conductive bonding material. The cover arranging step is to arrange the cover having the joining member in the opening of the holding member to which the piezoelectric element is joined. In the step of temporarily connecting the cover, a part of the joint member of the cover disposed on the holding member is melted and temporarily connected to the holding member. The aforementioned cover body joining step is to join the aforementioned holding member and the aforementioned cover body in a nitrogen environment or a vacuum environment. For example, the step of temporarily connecting the cover disclosed in
[先前技術文獻] [Prior Art Literature]
[專利文獻] [Patent Document]
專利文獻1：日本特開2018-88563號公報 Patent document 1: Japanese Patent Publication No. 2018-88563
專利文獻1記載的壓電振動器件的製造方法中，蓋體暫接步驟係在藉由前述金屬棒將前述蓋體按壓於前述保持構件的狀態下，將前述蓋體暫時固定於前述保持構件。藉此，前述蓋體係在密接於前述保持構件的狀態下暫接於前述保持構件。因此，蓋體接合步驟中，自前述保持構件內的接合材等產生的氣體難以從前述蓋體與前述保持構件的間隙排出。
In the manufacturing method of the piezoelectric vibration device described in
本發明的目的在於提供一種壓電振動器件及壓電振動器件的製造方法，可排出自保持構件內的接合材等產生的氣體。 The purpose of the present invention is to provide a piezoelectric vibration device and a method for manufacturing a piezoelectric vibration device that can discharge gas generated from bonding materials and the like in a self-retaining component.
本案發明人等檢討了可排出從保持構件的接合材等所產生的氣體的壓電振動器件及壓電振動器件的製造方法。精心檢討的結果，本案發明人等思及如下構成。 The inventors of this case have examined a piezoelectric vibration device and a method for manufacturing a piezoelectric vibration device that can discharge gas generated from a bonding material of a retaining member. As a result of careful examination, the inventors of this case have come up with the following structure.
本發明一實施型態的壓電振動器件的製造方法中，該壓電振動器件係至少具有壓電元件；保持構件，係與前述壓電元件接合；及蓋構件，係覆蓋 已與前述保持構件接合的前述壓電元件；並且，蓋構件係藉由封閉材接合於已接合前述壓電元件的保持構件。 In a manufacturing method of a piezoelectric vibration device of an embodiment of the present invention, the piezoelectric vibration device has at least a piezoelectric element; a retaining member that is joined to the piezoelectric element; and a cover member that covers the piezoelectric element joined to the retaining member; and the cover member is joined to the retaining member joined to the piezoelectric element by a sealing material.
前述壓電振動器件的製造方法係包含：具封閉材的構件準備步驟，係準備設有封閉材的前述蓋構件或前述保持構件，該封閉材係俯視觀看時構成矩形的框狀，且設置成以前述蓋構件覆蓋已與前述保持構件接合的前述壓電元件時位於前述蓋構件及前述保持構件之中的一者中與另一者接觸的部位的至少一部分，且該封閉材的至少一個角部具有比該角部以外的部分更厚的增厚部；蓋構件搭載步驟，係使前述蓋構件及前述保持構件之中的一者所具有的前述增厚部接觸另一者，將前述蓋構件搭載於已與前述壓電元件接合的前述保持構件；暫時固定步驟，係至少加熱已搭載於前述保持構件的蓋構件，至少使前述增厚部的一部分熔融而將前述蓋構件與前述保持構件暫時固定；及封閉步驟，係將已暫時固定的前述蓋構件與前述保持構件分別加熱，使包含前述增厚部的前述封閉材熔融而將前述蓋構件與前述保持構件封閉。 The manufacturing method of the piezoelectric vibration device includes the step of preparing a member with a sealing material, and preparing the cover member or the holding member provided with the sealing material. The sealing material forms a rectangular frame shape when viewed from above, and is arranged to When the piezoelectric element joined to the holding member is covered with the cover member, at least a part of the portion of one of the cover member and the holding member that contacts the other, and at least one corner of the sealing member The portion has a thickened portion that is thicker than the portion other than the corner portion; the cover member mounting step is to bring the thickened portion of one of the cover member and the holding member into contact with the other, and move the cover member The member is mounted on the holding member joined to the piezoelectric element; and the temporary fixing step is to heat at least the cover member mounted on the holding member to melt at least a part of the thickened portion to separate the cover member and the holding member. Temporarily fixing; and a sealing step of heating the temporarily fixed cover member and the holding member respectively to melt the sealing material including the thickened portion to seal the cover member and the holding member.
上述構成係於前述蓋構件搭載步驟中，前述蓋構件係隔著具有前述增厚部的封閉材而搭載於前述保持構件。前述蓋構件係藉由前述增厚部而支持於與前述保持構件分離達前述增厚部的厚度部分的位置。藉此，暫時固定步驟中，在將前述增厚部的一部分熔融而暫時固定的前述蓋構件與前述保持構件之間產生間隙。因此，封閉步驟中，在製程環境氣體中加熱蓋構件及保持構件之際，製程環境氣體會快速地從前述蓋構件與前述保持構件之間的間隙流入前述保持構件內。藉此，可使前述保持構件內的接合材等產生的氣體排出。 The above-mentioned structure is that in the aforementioned cover member mounting step, the aforementioned cover member is mounted on the aforementioned retaining member via the sealing material having the aforementioned thickened portion. The aforementioned cover member is supported by the aforementioned thickened portion at a position separated from the aforementioned retaining member by the thickness portion of the aforementioned thickened portion. Thereby, in the temporary fixing step, a gap is generated between the aforementioned cover member and the aforementioned retaining member, which are temporarily fixed by melting a part of the aforementioned thickened portion. Therefore, in the closing step, when the cover member and the retaining member are heated in the process environment gas, the process environment gas will quickly flow into the aforementioned retaining member from the gap between the aforementioned cover member and the aforementioned retaining member. Thereby, the gas generated by the bonding material and the like in the aforementioned retaining member can be discharged.
依據另一觀點，本發明的壓電振動器件的製造方法較佳為包含如下構成。前述暫時固定步驟中，使發熱體接觸前述蓋構件的一部分而將前述蓋構 件加熱。 From another viewpoint, the manufacturing method of the piezoelectric vibration device of the present invention preferably includes the following configuration. In the temporary fixing step, the heating element is brought into contact with a part of the cover member to fix the cover member. parts heating.
上述構成中，由於前述封閉材接觸於藉由前述發熱體直接加熱的前述蓋構件，故熱係有效率地從前述發熱體經由前述蓋構件進行傳導。因此，暫時固定步驟中，即使前述封閉材具有增厚部，亦不會使封閉材的熔融速度降低，而可將前述蓋構件暫時固定於前述保持構件。藉此，可使前述保持構件內的接合材等產生的氣體排出。 In the above structure, since the sealing material is in contact with the cover member directly heated by the heating element, heat is efficiently conducted from the heating element through the cover member. Therefore, in the temporary fixing step, even if the sealing material has a thickened portion, the cover member can be temporarily fixed to the holding member without reducing the melting speed of the sealing material. Thereby, the gas generated by the joining material etc. in the said holding member can be discharged.
依據另一觀點，本發明的壓電振動器件的製造方法較佳為包含如下構成。前述暫時固定步驟中，在藉由搭載手段保持前述蓋構件的狀態下，加熱前述蓋構件。 From another viewpoint, the manufacturing method of the piezoelectric vibration device of the present invention preferably includes the following configuration. In the temporary fixing step, the cover member is heated while the cover member is held by the mounting means.
上述構成中，前述蓋構件係於前述蓋構件搭載步驟中，藉由將前述蓋構件搭載於前述保持構件的搭載手段而保持相對於前述保持構件的位置。因此，可提升藉由暫時固定步驟而暫時固定於前述保持構件的前述蓋構件的位置精度，並且可縮短從前述蓋構件搭載步驟轉移至前述暫時固定步驟所需的時間。藉此，可使前述保持構件內的接合材等產生的氣體排出。 In the above structure, in the cover member mounting step, the position of the cover member relative to the holding member is maintained by means of mounting the cover member on the holding member. Therefore, the positional accuracy of the cover member temporarily fixed to the holding member in the temporary fixing step can be improved, and the time required to transfer from the cover member mounting step to the temporary fixing step can be shortened. Thereby, the gas generated by the joining material etc. in the said holding member can be discharged.
依據另一觀點，本發明的壓電振動器件的製造方法較佳為包含如下構成。前述暫時固定步驟中，藉由前述發熱體按壓前述蓋構件。 According to another viewpoint, the manufacturing method of the piezoelectric vibration device of the present invention preferably includes the following structure. In the aforementioned temporary fixing step, the aforementioned cover member is pressed by the aforementioned heating element.
上述構成係於前述暫時固定步驟中，前述蓋構件係藉由前述發熱體加熱且同時向前述保持構件按壓。因此，位於前述蓋構件與前述保持構件之間的前述增厚部的熔融速度增大。藉此，可使前述保持構件內的接合材等產生的氣體排出。 The above structure is that in the above temporary fixing step, the above cover member is heated by the above heating element and pressed against the above retaining member at the same time. Therefore, the melting speed of the above thickened portion between the above cover member and the above retaining member increases. Thereby, the gas generated by the bonding material in the above retaining member can be discharged.
依據另一觀點，本發明的壓電振動器件的製造方法較佳為包含如下構成。前述暫時固定步驟中，按壓於前述蓋構件之中之俯視觀看時與前述封閉 材的至少一部分重疊的部位。 According to another viewpoint, the manufacturing method of the piezoelectric vibration device of the present invention preferably includes the following structure. In the aforementioned temporary fixing step, the portion of the aforementioned cover member that overlaps with at least a portion of the aforementioned sealing material when viewed from above is pressed.
上述構成中，由於前述封閉材係位於最接近藉由前述發熱體直接加熱前述蓋構件之處，故熱係有效率地從前述發熱體經由前述蓋構件進行傳導。因此，暫時固定步驟中，即使前述封閉材具有前述增厚部，亦不會使前述增厚部的熔融速度降低，而可將前述蓋構件暫時固定於前述保持構件。藉此，可使前述保持構件內的接合材等產生的氣體排出。 In the above structure, since the sealing material is located closest to the cover member that is directly heated by the heating element, heat is efficiently conducted from the heating element through the cover member. Therefore, in the temporary fixing step, even if the sealing material has the thickened portion, the cover member can be temporarily fixed to the holding member without reducing the melting speed of the thickened portion. Thereby, the gas generated by the joining material etc. in the said holding member can be discharged.
依據另一觀點，本發明的壓電振動器件的製造方法較佳為包含如下構成。前述暫時固定步驟中，使前述發熱體接觸於俯視觀看時比前述蓋構件的中心偏靠任意外緣側的位置而加熱前述蓋構件。 From another viewpoint, the manufacturing method of the piezoelectric vibration device of the present invention preferably includes the following configuration. In the temporary fixing step, the heating element is brought into contact with a position on an arbitrary outer edge side relative to the center of the cover member in plan view to heat the cover member.
上述構成係於前述暫時固定步驟中，前述發熱體按壓於前述蓋構件之俯視觀看時的前述蓋構件的中心與任意外緣之間。亦即，藉由前述保持構件支持外緣的前述蓋構件係藉由前述發熱體按壓於比蓋構件的中心更接近藉由前述保持構件支持的部分的位置。前述發熱體按壓於前述蓋構件的比中心偏靠任意外緣側的位置時產生的前述蓋構件的彈性變形量會小於前述發熱體按壓於前述蓋構件的中心時產生的前述蓋構件的彈性變形量。因此，即使暫時固定後前述蓋構件回復到彈性變形前的狀態，亦可抑制對接合部分造成的影響，故可將前述蓋構件適當地暫時固定於前述保持構件。 In the above configuration, in the temporary fixing step, the heating element is pressed between the center of the cover member and any outer edge of the cover member when viewed from above. That is, the cover member whose outer edge is supported by the holding member is pressed by the heating element at a position closer to the portion supported by the holding member than the center of the cover member. The amount of elastic deformation of the cover member that occurs when the heating element is pressed against the center of the cover member at any outer edge side is smaller than the elastic deformation of the cover member that occurs when the heating element is pressed against the center of the cover member. quantity. Therefore, even if the cover member returns to the state before elastic deformation after being temporarily fixed, the influence on the joint portion can be suppressed, so that the cover member can be appropriately temporarily fixed to the holding member.
依據另一觀點，本發明的壓電振動器件的製造方法較佳為包含如下構成。前述封閉材為金錫合金。 From another viewpoint, the manufacturing method of the piezoelectric vibration device of the present invention preferably includes the following configuration. The aforementioned sealing material is gold-tin alloy.
上述構成中，由於前述封閉材為金錫合金，故具有高熱傳導性。亦即，前述封閉部的增厚部可快速地加熱至熔融溫度。因此，暫時固定步驟中，不使前述增厚部的熔融速度降低即可將前述蓋構件暫時固定於前述保持構件。 藉此，可使前述保持構件內的接合材等產生的氣體排出。 In the above structure, since the aforementioned sealing material is a gold-tin alloy, it has high thermal conductivity. That is, the thickened portion of the aforementioned sealing portion can be quickly heated to the melting temperature. Therefore, in the temporary fixing step, the aforementioned cover member can be temporarily fixed to the aforementioned retaining member without reducing the melting speed of the aforementioned thickened portion. Thereby, the gas generated by the bonding material in the aforementioned retaining member can be discharged.
依據另一觀點，本發明的壓電振動器件較佳為包含如下構成。壓電振動器件係藉由上述各壓電振動器件的製造方法所製造者。 From another viewpoint, the piezoelectric vibration device of the present invention preferably includes the following structure. The piezoelectric vibration device is manufactured by each of the above-mentioned manufacturing methods of the piezoelectric vibration device.
上述構成中，前述壓電振動器件係於封閉步驟中藉由前述蓋部封閉前述保持構件之際，可使前述保持構件內的接合材等產生的氣體從間隙排出。藉此，前述壓電振動器件可抑制保持構件內的壓電元件的劣化。 In the above structure, the piezoelectric vibrator can discharge the gas generated by the bonding material etc. in the holding member from the gap when the piezoelectric vibrator seals the holding member with the cover in the sealing step. In this way, the piezoelectric vibrator can suppress the deterioration of the piezoelectric element in the holding member.
依據另一觀點，本發明的壓電振動器件較佳為包含如下構成。壓電振動器件係藉由上述各壓電振動器件的製造方法所製造者，並且，前述封閉材含有共晶合金(eutectic alloy)以及融點高於該共晶合金的非共晶合金，俯視觀看時，矩形的框狀的前述封閉材之中，至少一個角部的封閉材含有前述非共晶合金。 From another viewpoint, the piezoelectric vibration device of the present invention preferably includes the following structure. The piezoelectric vibration device is manufactured by the above-mentioned manufacturing method of each piezoelectric vibration device, and the aforementioned sealing material contains a eutectic alloy and a non-eutectic alloy with a melting point higher than that of the eutectic alloy. When viewed from above, In this case, among the rectangular frame-shaped sealing materials, at least one corner sealing material contains the non-eutectic alloy.
上述構成中，由於前述封閉材的角部含有融點高於共晶合金的非共晶合金，故相較於前述未含有前述非共晶合金的角部難以熔融。再者，相較於直線部，具有前述增厚部的前述封閉材的角部相對地體積較大，故比起邊部係難以熔融。因此，使銲錫熔融而將前述壓電振動器件安裝(迴銲(reflow)實裝)於外部基板時，前述封閉材難以熔融而流出間隙側。藉此，可防止前述壓電振動器件的對外部基板安裝時的氣密不良。 In the above structure, since the corner of the aforementioned sealing material contains a non-eutectic alloy having a higher melting point than the eutectic alloy, it is more difficult to melt than the aforementioned corner that does not contain the aforementioned non-eutectic alloy. Furthermore, compared with the straight line portion, the corner of the aforementioned sealing material having the aforementioned thickened portion is relatively larger in volume, so it is more difficult to melt than the edge. Therefore, when the solder is melted and the aforementioned piezoelectric oscillator device is mounted (reflow mounted) on the external substrate, the aforementioned sealing material is difficult to melt and flow out of the gap side. Thereby, poor airtightness when the aforementioned piezoelectric oscillator device is mounted on the external substrate can be prevented.
[共晶合金] [eutectic alloy]
本說明書中，共晶合金係指合金凝固之際從液相固化成具有兩種固相的狀態的合金。本實施型態中，共晶合金係金錫合金。共晶合金的融點係低於非共晶合金。 In this specification, eutectic alloy refers to an alloy that solidifies from a liquid phase into a state with two solid phases during solidification. In this embodiment, the eutectic alloy is a gold-tin alloy. The melting point of the eutectic alloy is lower than that of the non-eutectic alloy.
依據本發明的一實施型態，可使前述保持構件內的接合材等產生的氣體排出。 According to an embodiment of the present invention, gas generated by the joining material or the like in the holding member can be discharged.
1:壓電振動器件 1: Piezoelectric vibration device
2:保持構件 2: Keep components
3:底部 3: Bottom
4:電極墊 4: Electrode pad
5:外部端子 5:External terminal
6:側壁部 6: Side wall
6a:接合面 6a:Jointing surface
7:壓電元件 7: Piezoelectric element
8:電極 8: Electrode
9:接合材 9:Jointing material
10:蓋構件 10: Cover member
11:封閉材 11:Sealing material
11a:短邊方向直線部 11a: Straight line portion in the short side direction
11b:長邊方向直線部 11b: Longitudinal straight line part
11c:角部 11c: Corner
12:吸附嘴 12: Suction nozzle
13:烙鐵 13: Iron
14:保持構件加熱裝置 14: Holding member heating device
15:蓋構件加熱裝置 15: Cover member heating device
Ar:角部面積 Ar: Corner area
As:短邊方向直線部面積 As: Area of the straight line in the short side direction
Al:長邊方向直線部面積 Al: Area of the straight line in the long side direction
S:內部空間 S: internal space
S100,S100A,S100B:壓電元件封閉步驟 S100, S100A, S100B: Piezoelectric element sealing steps
S110:具封閉材的構件準備步驟 S110: Preparation steps for components with closing materials
S120:蓋構件搭載步驟 S120: Cover component installation steps
S130,S130A,S130B:暫時固定步驟 S130, S130A, S130B: Temporarily fixed steps
S140:封閉步驟 S140: Closure step
Tr:厚度 Tr:Thickness
Ts:厚度 Ts:Thickness
Tl:厚度 Tl:Thickness
Wr:寬度 Wr:width
Ws:寬度 Ws: width
Wl:寬度 Wl: Width
圖1係顯示本發明實施型態1的壓電振動器件的整體構成的示意分解立體圖。
FIG. 1 is a schematic exploded perspective view showing the overall structure of a piezoelectric vibration device according to
圖2係從圖1中的A箭號觀看時的剖視圖。 Figure 2 is a cross-sectional view when viewed from the arrow A in Figure 1.
圖3係本發明實施型態1的壓電振動器件的俯視圖。
FIG. 3 is a top view of the piezoelectric vibration device according to
圖4係本發明實施型態1的壓電振動器件的製造方法所包含的壓電元件封閉步驟的流程圖。
FIG4 is a flow chart of the piezoelectric element sealing step included in the manufacturing method of the piezoelectric vibration device of the
圖5A係本發明實施型態1的壓電振動器件的製造方法所包含的具封閉材的構件準備步驟中準備的蓋構件的俯視圖。
FIG. 5A is a top view of a cover component prepared in the component preparation step with a sealing material included in the manufacturing method of the piezoelectric vibration device of the
圖5B係本發明實施型態1的壓電振動器件的製造方法所包含的具封閉材的構件準備步驟中準備的蓋構件的長邊方向側視圖。
5B is a longitudinal side view of the cover member prepared in the member preparation step with a sealing material included in the manufacturing method of the piezoelectric vibration device according to
圖5C係本發明實施型態1的壓電振動器件的製造方法所包含的具封閉材的構件準備步驟中準備的蓋構件的短邊方向側視圖。
5C is a short-side side view of the cover member prepared in the member preparation step with a sealing material included in the manufacturing method of the piezoelectric vibration device according to
圖6係本發明實施型態1的壓電振動器件的製造方法所包含的蓋構件搭載步驟中，從圖3中的A箭號觀看保持構件時的剖視圖及要搭載於保持構件的蓋構件的側視圖。
FIG6 is a cross-sectional view of the cover member mounting step included in the manufacturing method of the piezoelectric vibration device of the
圖7係本發明實施型態1的壓電振動器件的製造方法所包含的暫時固定步驟中，藉由發熱體加熱的蓋構件的側視圖及從圖3中的A箭號觀看藉由保持構件加熱裝置加熱的保持構件時的剖視圖。
FIG. 7 is a side view of a cover member heated by a heating element in a temporary fixing step included in the manufacturing method of a piezoelectric vibration device of
圖8係顯示本發明實施型態1的壓電振動器件的製造方法所包含的封閉步驟中，藉由蓋構件加熱裝置加熱並按壓的蓋構件以及藉由保持構件加熱裝置加熱的保持構件的剖視圖。
FIG8 is a cross-sectional view showing a cover member heated and pressed by a cover member heating device and a retaining member heated by a retaining member heating device in a closing step included in the manufacturing method of a piezoelectric vibration device of
圖9係本發明實施型態2的壓電振動器件的製造方法所包含的暫時固定步驟中，從圖3中的A箭號觀看保持於吸附嘴的狀態下藉由發熱體加熱的蓋構件的側視圖以及藉由保持構件加熱裝置加熱的保持構件時的剖視圖。
Fig. 9 is a view of the cover member heated by the heating element while being held in the suction nozzle as viewed from arrow A in Fig. 3 during the temporary fixing step included in the manufacturing method of the piezoelectric vibration device according to
圖10係本發明實施型態3的壓電振動器件的製造方法所包含的暫時固定步驟中，從圖3中的A箭號觀看保持於吸附嘴的狀態下藉由發熱體加熱的蓋構件的側視圖以及藉由保持構件加熱裝置加熱的保持構件時的剖視圖。 FIG. 10 is a side view of the cover member heated by the heating element while being held in the adsorption nozzle and a cross-sectional view of the retaining member heated by the retaining member heating device, as viewed from the arrow A in FIG. 3 in the temporary fixing step included in the manufacturing method of the piezoelectric vibration device of the third embodiment of the present invention.
圖11係本發明另一實施型態的壓電振動器件的部分剖視圖。 11 is a partial cross-sectional view of a piezoelectric vibration device according to another embodiment of the present invention.
圖12係本發明的壓電振動器件的製造方法所包含的暫時固定步驟中，從圖3中的A箭號觀看保持於吸附嘴的狀態下藉由發熱體加熱的蓋構件的側視圖以及藉由保持構件加熱裝置加熱的長邊為1.2mm、短邊為1.0mm大小的保持構件時的剖視圖。 FIG. 12 is a side view of a cover member heated by a heating element while being held in an adsorption nozzle from the arrow A in FIG. 3 in the temporary fixing step included in the manufacturing method of the piezoelectric vibration device of the present invention, and a cross-sectional view of a holding member with a long side of 1.2 mm and a short side of 1.0 mm heated by a holding member heating device.
以下參照圖式說明各實施型態。各圖中，對相同部分標註相同的符號而不重複該相同部分的說明。在此，各圖中的構成構件的尺寸並未忠實地表示實際的構成構件的尺寸及各構成構件的尺寸比例等。 The following describes each implementation with reference to the drawings. In each figure, the same part is marked with the same symbol and the description of the same part is not repeated. Here, the size of the components in each figure does not faithfully represent the actual size of the components and the size ratio of each component.
在此，下文的本發明的實施型態的壓電振動器件1的說明中，將壓電振動器件1的長邊方向設為「X方向」，將短邊方向設為「Y方向」，將保持壓電元件7的保持構件2的開口部的開口方向且為與X方向及Y方向正交的方向設為「Z方向」。再者，本實施型態中，X方向及Y方向為水平面上的方向。Z方向為鉛直方向。亦即，Z方向為上下方向。然而壓電振動器件1的使用時的朝向不限於此方向的定義。
Here, in the following description of the
再者，下文的說明中，「固定」、「連接」、「接合」及「安裝」等(下文中亦稱為「固定等」)的表現不僅包含構件彼此間直接固定等的情形，亦包含藉由其他構件而固定等的情形。亦即，下文的說明中，固定等的表現包含構件彼此間直接及間接的固定等意思。 Furthermore, in the following description, the expressions "fixing", "connecting", "joining" and "installing" (hereinafter referred to as "fixing, etc.") include not only the situation where components are directly fixed to each other, but also the situation where components are fixed by other components. That is, in the following description, the expressions "fixing, etc." include the meaning of direct and indirect fixing between components.
[實施型態1] [Implementation Type 1]
<壓電振動器件1的構成>
<Structure of
使用圖1至圖3來說明本發明的壓電振動器件1。圖1係顯示壓電振動器件1的整體構成的示意分解立體圖。圖2係從圖1中的A箭號觀看時的剖視圖。圖3係壓電振動器件1的俯視圖。
The
如圖1與圖2所示，壓電振動器件1係具有壓電元件7的裝置，該壓電元件7係將施加於壓電體的力轉換成電壓，或將施加於壓電體的電壓轉換成力。壓電振動器件1係具有保持構件2、壓電元件7、及蓋構件10。
As shown in FIGS. 1 and 2 , the
保持構件2係用以保持壓電元件7之由絕緣體構成的容器。本實施型態中，保持構件2係陶瓷製的殼體。保持構件2係藉由燒結陶瓷粉末而構成。此外，保持構件2亦可積層複數個絕緣體而構成。保持構件2係具有底部3、電極墊4、側壁部6及外部端子5。
The holding
底部3係構成保持構件2的底面的部分。底部3係由矩形的板狀構件所構成。由導電性金屬構成的電極墊4係沿矩形的板狀構件的一短邊，形成於底部3的一面之上表面。電極墊4係與壓電元件7電性連接。電極墊4係對壓電元件7施加電壓的電路的一部分。由導電性金屬構成的外部端子5係氣相沈積於底部3的另一面之下表面。外部端子5係與未圖示的外部基板電性連接。外部端子5係用以從外部基板對壓電元件7發送信號，施加電壓的端子。電極墊4與外部端子5係藉由未圖示的配線圖案而電性連接。
The
側壁部6係構成保持構件2的側面的部分。側壁部6係位於底部3的外緣。側壁部6係包圍底部3的框狀的壁。側壁部6係從底部3的上表面向上方延伸。再者，側壁部6係從外側面朝向內側面具有預定厚度。側壁部6的上端部係具有要與蓋構件10接合的接合面6a。如此構成的保持構件2係藉由底部3的上表面與側壁部6的內側面構成用以收容壓電元件7的內部空間S。保持構件2係從底部3的上表面向上方開口。電極墊4係位於內部空間S內。
The
壓電元件7係將施加的力轉換成電壓，或將施加的電壓轉換成力的壓電體。本實施型態中，壓電元件7係以特定的方向切出水晶而獲得的矩形的石英諧振片。壓電元件7係於面積最大的一對主面雙方氣相沈積電極8。電極8的一部分係引出至石英諧振片的長邊方向的一端部。壓電元件7係位於保持構件2的內部空間S內。壓電元件7係藉由導電性的接合材9而使電極8接著於保持構件2的電極墊4。藉此，壓電元件7可從電極8經由電極墊4、未圖示的配線圖案及外部端子5而電性連接於外部基板。再者，壓電元件7係藉由保持構件2保持成為懸臂支持的狀態。藉此，壓電元件7係依據從外部基板所施加的電壓而以預定的頻率振盪。
The
蓋構件10係使保持構件2的內部空間S成為密封空間的構件。蓋構件10係例如由科伐(Kovar)合金等金屬材料所構成。再者，蓋構件10係例如施予電解鍍鎳或無電解鍍鎳等，蓋構件10係以一側的面之下表面與保持構件2相對向而位於保持構件2的上端部。沿Z方向俯視觀看時，蓋構件10係具有覆蓋保持構件2的內部空間S的開口部分的大小。再者，沿Z方向觀看時，蓋構件10係小於保持構件2。
The
如圖3所示，沿Z方向觀看時，於蓋構件10之與保持構件2的側壁部6的接合面6a重疊的部分設有框狀的封閉材11。亦即，蓋構件10覆蓋包含已接合於保持構件2的壓電元件7的內部空間S之際，沿Z方向觀看時，於接觸於保持構件2的接合面6a的部分，具有包圍保持構件2的開口部分的封閉材11。封閉材11係金錫合金。沿Z方向觀看時，封閉材11係具有沿X方向延伸的兩個長邊方向直線部11b、沿Y方向延伸的兩個短邊方向直線部11a、以及連接長邊方向直線部11b與短邊方向直線部11a的四個角部11c。
As shown in FIG3 , when viewed along the Z direction, a frame-shaped
沿Z方向觀看時，四個角部11c的延伸方向的單位長度的角部面積Ar(參照影線部分)係大於長邊方向直線部11b的延伸方向的單位長度的長邊方向直線部面積Al(參照影線部分)，且大於短邊方向直線部11a的延伸方向的單位長度的短邊方向直線部面積As(參照影線部分)。
When viewed in the Z direction, the corner area Ar per unit length in the extending direction of the four
封閉材11係包含共晶合金以及融點高於該共晶合金的非共晶合金。本實施型態中，角部11c係包含非共晶合金。在此，非共晶合金亦可包含於短邊方向直線部11a或長邊方向直線部11b的至少一者而不僅包含於角部11c。蓋構件10係藉由封閉材11而接合於保持構件2的接合面6a。保持構件2的內部空間S內呈真空。此外，保持構件2的內部空間S亦可封入氮氣等。
The sealing
如此，壓電振動器件1係使壓電元件7位於內部空間S內且藉由蓋構件10將填充有氮氣的保持構件2封閉。將蓋構件10接合於保持構件2的金錫合金係包含融點高於共晶合金的非共晶合金。再者，相較於短邊方向直線部11a及長邊方向直線部11b，由於角部11c的單位長度的體積較大，所以比直線部難以熔融。因此，使銲錫熔融而將壓電振動器件1安裝(迴銲實裝)於外部基板之際，即使封閉材11因用於加熱銲錫的熱而熔融，封閉材11亦難以流出間隙側。藉此，壓電振動器件1係於對外部基板安裝時，可抑制氣密不良。
In this way, in the
<壓電振動器件1的製造方法>
<Manufacturing method of
接著，使用圖4至圖8來說明本發明的壓電振動器件1的製造方法所包含的壓電元件封閉步驟S100。圖4係壓電振動器件1的製造方法所包含的壓電元件封閉步驟S100的流程圖。圖5A係壓電振動器件1的製造方法所包含的具封閉材的構件準備步驟S110中準備的蓋構件10的俯視圖。圖5B係壓電振動器件1的製造方法所包含的具封閉材的構件準備步驟S110中準備的蓋構件10的長邊方向側視圖。圖5C係於壓電振動器件1的製造方法所包含的具封閉材的構件準備步驟S110準備的蓋構件10的短邊方向側視圖。圖6係顯示壓電振動器件1的製造方法所包含的蓋構件搭載步驟S120中，從圖3中的A箭號觀看保持構件2時的剖視圖及要搭載於保持構件2的蓋構件10的側視圖。圖7係壓電振動器件1的製造方法所包含的暫時固定步驟S130中，藉由烙鐵13加熱的蓋構件10的側視圖及藉由保持構件加熱裝置14加熱的保持構件2的剖視圖。圖8係顯示壓電振動器件1的製造方法所包含的封閉步驟S140中，藉由蓋構件加熱裝置15加熱並按壓的蓋構件10以及藉由保持構件加熱裝置14加熱的保持構件2的剖視圖。
Next, the piezoelectric element sealing step S100 included in the method of manufacturing the
如圖4所示，壓電元件封閉步驟S100係藉由蓋構件10將位於保持
構件2的內部空間S內的壓電元件7封閉的步驟(參照圖2)。壓電元件封閉步驟S100係具有：具封閉材的構件準備步驟S110、蓋構件搭載步驟S120、暫時固定步驟S130、及封閉步驟S140。
As shown in FIG. 4 , the piezoelectric element sealing step S100 uses the
就壓電振動器件1的初始狀態而言，例如將壓電元件7組裝於保持構件2。壓電元件7係藉由接合材而接合於保持構件2的電極墊4。亦即，將壓電元件7以藉由施加電壓而可振盪的狀態組裝於保持構件2的內部空間S內。
In the initial state of the
如圖4、圖5A、圖5B及圖5C所示，具封閉材的構件準備步驟5110係準備蓋構件10的步驟，該蓋構件10即為設有預定狀態的封閉材11的具封閉材的構件。具封閉材的構件準備步驟S110中，就其準備的蓋構件10而言，在藉由蓋構件10覆蓋已接合於保持構件2的壓電元件7時，在蓋構件10與壓電元件7相向的面之下表面中與保持構件2接觸的部分塗布有封閉材11(參照圖3)。封閉材11係共晶狀態的金錫合金。
As shown in FIG. 4, FIG. 5A, FIG. 5B and FIG. 5C, the component preparation step 5110 with a sealing material is a step of preparing a
沿著垂直於前述下表面的方向俯視觀看時，設於蓋構件10的封閉材11係構成矩形的框狀。亦即，封閉材11係包含沿蓋構件10的短邊方向延伸的直線狀的兩邊的短邊方向直線部11a、沿蓋構件10的長邊方向延伸的直線狀的兩邊的長邊方向直線部11b、以及連接短邊方向直線部11a與長邊方向直線部11b各者的圓弧狀的四個角部11c。短邊方向直線部11a與長邊方向直線部11b係相互沿大致垂直的方向延伸。四個角部11c係具有預定曲率。角部11c係包含非共晶合金。
When viewed from above in a direction perpendicular to the lower surface, the sealing
四個角部11c的徑向的寬度Wr係大於兩個長邊方向直線部11b的蓋構件10的短邊方向的寬度Wl，且大於兩個短邊方向直線部11a的蓋構件10的長邊方向的寬度Ws。再者，四個角部11c分別具有增厚部，該等增厚部的厚度Tr係大於兩個長邊方向直線部11b的垂直於前述下表面的方向的厚度Tl，且大於兩個
短邊方向直線部11a的垂直於前述下表面的方向的厚度Ts。亦即，四個角部11c係相較於短邊方向直線部11a及長邊方向直線部11b更朝向垂直於蓋構件10的下表面的方向突出。因此，封閉材11中，四個角部11c的延伸方向的單位長度的體積係大於短邊方向直線部11a的單位長度的體積且大於長邊方向直線部11b的單位長度的體積。
The radial width Wr of the four
如圖4、圖6及圖7所示，蓋構件搭載步驟S120係將具封閉材的構件準備步驟S110中所準備的具封閉材的構件之蓋構件10搭載於保持構件2的步驟。蓋構件搭載步驟S120中，將保持構件2載置於保持構件加熱裝置14。並且，藉由保持構件加熱裝置14將保持構件2預熱而維持於預定溫度。蓋構件10係藉由作為搭載手段的吸附嘴12吸附。蓋構件10係以設有封閉材11的下表面朝向保持構件2而藉由吸附嘴12搭載於保持構件2。蓋構件10係以設於前述下表面的封閉材11之中的角部11c的增厚部接觸於保持構件2的接合面6a。另一方面，封閉材11之中的短邊方向直線部11a及長邊方向直線部11b不會接觸於接合面6a。
As shown in FIGS. 4 , 6 , and 7 , the cover member mounting step S120 is a step of mounting the
如圖4與圖7所示，暫時固定步驟S130係將於蓋構件搭載步驟S120中搭載於保持構件2的蓋構件10暫時固定於保持構件2的步驟。暫時固定步驟S130中，以作為發熱體的烙鐵13接觸蓋構件10的上表面。使烙鐵13位於蓋構件10的短邊方向的大致中央，且又位於長邊方向的大致中央。蓋構件10係藉由烙鐵13而加熱至預定溫度。接著，設於蓋構件10的封閉材11係藉由蓋構件10而加熱。而且，封閉材11係藉由以保持構件加熱裝置14維持於預定溫度的保持構件2加熱。
As shown in FIG. 4 and FIG. 7 , the temporary fixing step S130 is a step of temporarily fixing the
蓋構件10的角部11c的增厚部的一部分會熔融。烙鐵13係在達預定加熱溫度及預定加熱時間時就離開蓋構件10。如此，蓋構件搭載步驟S120係在藉由保持構件加熱裝置14加熱保持構件2的狀態下，藉由烙鐵13加熱蓋構件10。
因此，相較於僅藉由來自烙鐵13的熱所致的熔融，封閉材11將更快熔融。在此，角部11c的增厚部的熔融量可藉由烙鐵接觸蓋構件10的接觸位置、烙鐵接觸蓋構件10的接觸面積、以烙鐵對蓋構件10進行的加熱時間、以烙鐵對蓋構件10進行的加熱溫度來調整。
A part of the thickened portion of the
封閉材11係以藉由烙鐵13的加熱致使角部11c的增厚部的厚度Tr熔融的部分變薄的狀態，接合於保持構件2的接合面6a。藉由暫時固定步驟S130，封閉材11係因烙鐵13及經加熱的保持構件2而熔融之後凝固，而產生融點高於共晶合金的非共晶合金。另一方面，封閉材11的短邊方向直線部11a及長邊方向直線部11b未接觸於保持構件2的接合面6a。亦即，蓋構件10的封閉材11的短邊方向直線部11a及長邊方向直線部11b係與保持構件2的側壁部6的接合面6a之間產生間隙。
The sealing
如圖4、圖7及圖8所示，封閉步驟S140係藉由於暫時固定步驟S130中暫時固定於保持構件2的蓋構件10將保持構件2封閉的步驟。封閉步驟S140中，蓋構件10與保持構件2係於真空中分別加熱。保持構件2係藉由保持構件加熱裝置14加熱至預定溫度。蓋構件10係藉由蓋構件加熱裝置15加熱至預定溫度且朝保持構件2按壓。封閉材11係藉由來自保持構件加熱裝置14及蓋構件加熱裝置15的熱而熔融。
As shown in FIG. 4 , FIG. 7 and FIG. 8 , the closing step S140 is a step of closing the holding
封閉材11係隨著角部11c的增厚部的熔融的進展而使短邊方向直線部11a及長邊方向直線部11b接近接合面6a。此時，在保持構件2的內部空間S內，會從要將壓電元件7接合於電極墊4的接合材9等產生氣體。所產生的氣體係從短邊方向直線部11a及長邊方向直線部11b與接合面6a之間的間隙排出內部空間S的外部。
In the sealing
因角部11c的增厚部的熔融使得短邊方向直線部11a的厚度Ts、長邊方向直線部11b的厚度Tl及角部11c的厚度Tr成為大致相同時，短邊方向直線部11a、長邊方向直線部11b及角部11c係接觸於接合面6a。亦即，蓋構件10係隔著封閉材11而接觸於接合面6a。而封閉材11冷卻時就接合保持構件2與蓋構件10。藉此，藉由蓋構件10封閉保持構件2的開口部。此時，保持構件2的內部空間S成為真空。
When the thickness Ts of the short-side direction
如此構成的壓電振動器件1的製造方法係於蓋構件搭載步驟S120中，將蓋構件10隔著封閉材11搭載於保持構件2。蓋構件10係藉由角部11c的增厚部而支持於與側壁部6的接合面6a分離達角部11c的厚度Tr部分的位置。藉此，暫時固定步驟S130中，因角部11c的增厚部熔融而暫時固定的蓋構件10與保持構件2的側壁部6的接合面6a之間，於角部11c的增厚部以外的部分產生間隙。
In the manufacturing method of the
因此，封閉步驟S140中，在真空環境下對保持構件2及蓋構件10加熱時，位於保持構件2的內部空間S內的接合材9所產生的氣體會從保持構件2與蓋構件10之間的間隙排出內部空間S的外部。再者，由於藉由烙鐵13直接對設有封閉材11的蓋構件10加熱，故來自烙鐵13的熱經由金屬製的蓋構件10有效地傳導至封閉材11。藉此，可將位於保持構件2的內部空間S內的接合材9等所產生的氣體排出。
Therefore, in the sealing step S140, when the holding
以上述壓電振動器件1的製造方法製造的壓電振動器件1的保持構件2與蓋構件10係藉由角部11c的厚度Tr大於短邊方向直線部11a的厚度Ts且大於長邊方向直線部11b的厚度Tl的封閉材11所接合。因此，沿Z方向觀看時，封閉材11的四個角部11c的延伸方向的單位長度的角部面積Ar係大於長邊方向直線部11b的延伸方向的單位長度的長邊方向直線部面積Al且大於短邊方向直線部
11a的延伸方向的單位長度的短邊方向直線部面積As。再者，封閉材11係於暫時固定步驟S130中藉由熔融及凝固而產生前述非共晶合金。藉此，封閉材11的角部11c相較於短邊方向直線部11a及長邊方向直線部11b更難熔融。如此構成的壓電振動器件1的封閉材11，使銲錫熔融而安裝(迴銲實裝)於外部基板之際，即使封閉材11熔融，亦難以流出間隙。
The holding
[實施型態2] [Implementation type 2]
使用圖4與圖9來說明本發明實施型態2的壓電振動器件1的製造方法所包含的壓電元件封閉步驟S100A。圖9係壓電振動器件1的製造方法所包含的暫時固定步驟S130A中，從圖3中的A箭號觀看藉由烙鐵13加熱的蓋構件10的側視圖以及藉由保持構件加熱裝置14加熱的保持構件2時的剖視圖。在此，下文的實施型態中，對於與已說明的實施型態的相同點省略其具體的說明，而以相異點為中心進行說明。
FIG. 4 and FIG. 9 are used to illustrate the piezoelectric element closing step S100A included in the manufacturing method of the
如圖4所示，壓電元件封閉步驟S100A係包含：具封閉材的構件準備步驟S110、蓋構件搭載步驟S120、暫時固定步驟S130A、及封閉步驟S140。 As shown in FIG. 4 , the piezoelectric element sealing step S100A includes: a component preparation step S110 with a sealing material, a cover component mounting step S120, a temporary fixing step S130A, and a sealing step S140.
蓋構件搭載步驟S120中，蓋構件10係藉由作為搭載手段的搬送裝置的吸附嘴12吸附。吸附嘴12係吸附於蓋構件10的短邊方向的大致中央，且為比長邊方向的大致中央偏靠一側的位置。蓋構件10係以設有封閉材11的下表面朝向保持構件2而搭載於保持構件2。
In the cover member mounting step S120, the
如圖4與圖9所示，暫時固定步驟S130A係將於蓋構件搭載步驟S120中搭載於保持構件2的蓋構件10暫時固定於保持構件2的步驟。暫時固定步驟S130A中，蓋構件10係在藉由作為搭載手段的吸附嘴12吸附的狀態下，以作為發熱體的烙鐵13接觸於蓋構件10的上表面。烙鐵13係接觸於蓋構件10的短邊方
向的大致中央，且為比長邊方向的大致中央偏靠另一側的位置。亦即，暫時固定步驟S130A中，俯視觀看時，烙鐵13係接觸於蓋構件10之比長邊方向的中心偏靠另一側的外緣側的位置。因此，烙鐵13係與吸附嘴12分離一定距離而接觸於蓋構件10。
As shown in Fig. 4 and Fig. 9, the temporary fixing step S130A is a step of temporarily fixing the
再者，蓋構件10係在藉由吸附嘴12吸附的狀態下，藉由烙鐵13加熱至預定溫度。蓋構件10係藉由烙鐵13加熱，並且藉由以保持構件加熱裝置14維持於預定溫度的保持構件2加熱，使得蓋構件10的封閉材11的角部11c的增厚部的一部分熔融。此時，蓋構件10係在藉由吸附嘴12保持成為相對於保持構件2的位置的狀態下，接合於保持構件2的接合面6a。烙鐵13係在達預定加熱溫度及預定加熱時間就離開蓋構件10。
Furthermore, the
上述構成中，蓋構件10係在藉由吸附嘴12保持成為相對於保持構件2的位置的狀態下，暫時固定於保持構件2。亦即，蓋構件10的角部11c的增厚部熔融時，相對於保持構件2的位置不會偏移。因此，可提升隔著角部11c的增厚部暫時固定於保持構件2的蓋構件10對於保持構件2的位置精度，並且可縮短從蓋構件搭載步驟S120進行至暫時固定步驟S130所須的時間。藉此，不增加製程時間就可使位於保持構件2的內部空間S內的接合材9所產生的氣體排出。
In the above-described structure, the
[實施型態3] [Implementation Type 3]
使用圖4與圖10來說明本發明實施型態3的壓電振動器件1的製造方法所包含的壓電元件封閉步驟S100B。圖10係壓電振動器件1的製造方法所包含的暫時固定步驟S130B中，從圖3中的A箭號觀看藉由烙鐵13加熱的蓋構件10的側視圖以及藉由保持構件加熱裝置14加熱的保持構件2時的剖視圖。
The piezoelectric element sealing step S100B included in the manufacturing method of the
如圖4所示，壓電元件封閉步驟S100B係包含：具封閉材的構件準 備步驟S110、蓋構件搭載步驟S120、暫時固定步驟S130B、及封閉步驟S140。 As shown in FIG. 4 , the piezoelectric element sealing step S100B includes: a component preparation step S110 with a sealing material, a cover component mounting step S120, a temporary fixing step S130B, and a sealing step S140.
如圖4與圖10所示，暫時固定步驟S130B係將蓋構件10暫時固定於保持構件2的步驟。暫時固定步驟S130B中，蓋構件10係在藉由吸附嘴12的吸附而保持的狀態下，以烙鐵13接觸於蓋構件10的上表面。沿垂直於蓋構件10的上表面的方向觀看時(俯視時)，烙鐵13係位於與封閉材11的至少一部分重疊的部分。本實施型態中，沿垂直於蓋構件10的上表面的方向觀看時，烙鐵13係位於與封閉材11的角部11c的增厚部重疊的部分。亦即，烙鐵13係位於最接近封閉材11中具有厚度的角部11c的位置。
As shown in FIGS. 4 and 10 , the temporary fixing step S130B is a step of temporarily fixing the
再者，蓋構件10係藉由烙鐵13加熱至預定溫度且藉由預定的力朝向保持構件2按壓。封閉材11係藉由以烙鐵13加熱的蓋構件10加熱且按壓，並且藉由以保持構件加熱裝置14維持於預定溫度的保持構件2加熱。藉此，使角部11c的增厚部的一部分熔融。烙鐵13係在達預定加熱時間及按壓時間就離開蓋構件10。
Furthermore, the
本實施型態中，烙鐵13係接觸於俯視觀看時與蓋構件10的封閉材11的至少一部分重疊的部分，亦即，烙鐵13係接觸於俯視觀看時比蓋構件10的中心偏靠外緣側的位置。
In this embodiment, the
藉由保持構件2支持外緣的蓋構件10係藉由烙鐵13朝向保持構件2按壓於比蓋構件10的中心更接近藉由保持構件2保持的部分的位置。蓋構件10係藉由烙鐵13的按壓而朝向保持構件2彈性變形。烙鐵13按壓於蓋構件10的比中心偏靠任意外緣側的位置時產生的蓋構件10的彈性變形量會小於烙鐵13按壓於蓋構件10的中心時產生的彈性變形量。因此，藉由烙鐵13按壓於蓋構件10的比中心偏靠任意外緣側的位置，可抑制蓋構件10於暫時固定後回復到彈性變形前的
狀態之際對接合部分造成的影響。藉此，可將蓋構件10適當地暫時固定於保持構件2。
The
再者，暫時固定步驟S130B中，藉由烙鐵13加熱以吸附嘴12吸附中的蓋構件10的封閉材11時，從烙鐵13傳導至蓋構件10的熱不僅傳導至封閉材11，亦傳導至吸附嘴12。傳導至吸附嘴12的熱不會使封閉材11熔融而排出外部。因此，藉由抑制從烙鐵13傳導來的熱傳導至吸附嘴12，而可使封閉材11受到較多的熱的供給。因此，為了抑制傳導至吸附嘴12的熱，烙鐵13以對於儘可能遠離吸附嘴12的位置進行加熱為佳。
Furthermore, in the temporary fixing step S130B, when the closing
暫時固定步驟S130B中，沿垂直於蓋構件10的上表面的方向觀看時，蓋構件10係藉由烙鐵13加熱與封閉材11的角部11c重疊的部分，故烙鐵13的熱係效率更佳地傳導至封閉材11的增厚部分。因此，暫時固定步驟S130中，不使增厚部的角部11c的熔融速度降低就可將蓋構件10暫時固定於保持構件2。藉此，不增加製程時間就可使保持構件2的內部空間S內的接合材9等所產生的氣體排出。
In the temporary fixing step S130B, when viewed in a direction perpendicular to the upper surface of the
[其他實施型態] [Other implementation forms]
在此，上述實施型態中，暫時固定步驟S130、S130A、130B係蓋構件10在吸附嘴12吸附的狀態下藉由烙鐵13加熱。然而，暫時固定步驟中，蓋構件亦可在吸附嘴未吸附的狀態下藉由烙鐵加熱。
Here, in the above-mentioned embodiment, the temporary fixing steps S130, S130A, and 130B are performed by heating the
在吸附嘴未吸附蓋構件的狀態下藉由烙鐵加熱時，蓋構件搭載步驟中，藉由吸附嘴將蓋構件保持於蓋構件與保持構件的接合面之間會有些許間隙的位置。 When the cover member is heated by the soldering iron without the suction nozzle sucking it, the cover member is held by the suction nozzle in a position where there is a slight gap between the joint surface of the cover member and the holding member during the cover member loading step.
接著，暫時固定步驟中，使吸附嘴吸附的蓋構件離開吸附嘴後接 觸保持構件。例如，藉由朝向保持構件移動的烙鐵使吸附嘴吸附的蓋構件離開吸附嘴後，藉由烙鐵向保持構件按壓。再者，蓋構件係在藉由烙鐵向保持構件按壓的狀態下加熱。亦即，蓋構件係在未與吸附嘴接觸的狀態下藉由烙鐵加熱。因此，從烙鐵傳導至蓋構件的熱不經由吸附嘴散出外部而傳導至封閉材。 Next, in the temporary fixing step, the cover member adsorbed by the adsorption nozzle is made to leave the adsorption nozzle and contact the holding member. For example, after the cover member adsorbed by the adsorption nozzle leaves the adsorption nozzle by the solder moving toward the holding member, the solder is pressed against the holding member. Furthermore, the cover member is heated while being pressed against the holding member by the solder. That is, the cover member is heated by the solder without contacting the adsorption nozzle. Therefore, the heat transferred from the solder to the cover member is transferred to the sealing material without being dissipated to the outside through the adsorption nozzle.
如此構成的暫時固定步驟中，由於烙鐵的熱不從吸附嘴散出外部而傳導至封閉材，故提升封閉材的熔融速度且擴大封閉材的熔融範圍。藉此，可縮短暫時固定步驟的製程時間。再者，可提升藉由封閉材所致的蓋構件與保持構件的暫時固定強度。此外，由於熱不會從吸附嘴排出至外部，故連續進行複數個蓋構件的暫時固定時，可抑制烙鐵的溫度降低。藉此，即使藉由烙鐵連續進行複數個蓋構件的暫時固定，暫時固定的品質亦穩定。在吸附嘴未吸附蓋構件的狀態下藉由烙鐵加熱的暫時固定步驟係適合於吸附嘴為熱傳導率高的金屬製吸附嘴的情形。 In the temporary fixing step thus constructed, since the heat of the soldering iron is not dissipated to the outside from the suction nozzle but is conducted to the sealing material, the melting speed of the sealing material is increased and the melting range of the sealing material is expanded. In this way, the process time of the temporary fixing step can be shortened. Furthermore, the temporary fixing strength of the cover member and the retaining member by the sealing material can be improved. In addition, since the heat is not discharged to the outside from the suction nozzle, the temperature drop of the soldering iron can be suppressed when temporarily fixing multiple cover members in succession. In this way, even if multiple cover members are temporarily fixed in succession by the soldering iron, the quality of the temporary fixing is stable. The temporary fixing step of heating the nozzle with a soldering iron when the nozzle is not sucking the cover component is suitable for the case where the nozzle is made of metal with high thermal conductivity.
再者，上述實施型態係於具封閉材的構件準備步驟S110中準備設有封閉材11的蓋構件10。然而，亦可如圖11所示，於具封閉材的構件準備步驟S110中準備設有封閉材11的保持構件2。而於蓋構件搭載步驟S120中，於保持構件2搭載未設有封閉材11的蓋構件10。
Furthermore, in the above-mentioned embodiment, the
再者，上述實施型態中，保持構件2例如俯視觀看時為長方形。保持構件2係構成為例如長邊2.0mm、短邊1.6mm的大小。或者，保持構件2係構成為例如長邊1.6mm、短邊1.2mm的大小。或者，保持構件2係構成為例如長邊1.2mm、短邊1.0mm的大小。
Furthermore, in the above embodiment, the holding
吸附嘴12的直徑(吸附面積)及烙鐵13的接觸部位的大小(接觸面積)可根據保持構件2(蓋構件10)的大小來決定。例如，對長邊1.2mm、短邊1.0mm
的大小的保持構件2而言，吸附嘴12的直徑為蓋構件10的長邊的1/3左右(參照圖12)。例如，對長邊1.2mm、短邊1.0mm的大小的保持構件2而言，烙鐵13的前端的大小為蓋構件10的長邊方向的蓋構件10的長邊的1/2左右。
The diameter (adsorption area) of the
再者，上述實施型態中，暫時固定步驟S130、S130A、及S130B係藉由烙鐵13加熱蓋構件10，並且藉由保持構件加熱裝置14加熱保持構件2。然而，暫時固定步驟亦可為僅對於蓋構件以發熱體加熱的構成。
Furthermore, in the above embodiment, the
再者，上述實施型態中，暫時固定步驟S130、S130A、及S130B係藉由使烙鐵13直接接觸蓋構件10而加熱蓋構件10。然而，暫時固定步驟亦可為對蓋構件加熱時不使烙鐵等發熱體直接接觸。暫時固定步驟亦可為例如在加熱爐內對蓋構件10與保持構件2加熱的構成。再者，亦可藉由遠紅外線或雷射進行加熱。
Furthermore, in the above embodiment, the temporary fixing steps S130, S130A, and S130B are performed by causing the
再者，上述實施型態中，暫時固定步驟S130、S130A及S130B係藉由使烙鐵13直接接觸蓋構件10而加熱蓋構件10。然而，暫時固定步驟亦可為藉由烙鐵等發熱體按壓蓋構件而直接加熱蓋構件的構成。暫時固定步驟中，蓋構件係在藉由發熱體向保持構件按壓的狀態下，藉由發熱體加熱。因此，設於蓋構件與保持構件之間的增厚部的熔融速度增大。藉此，可使位於保持構件的內部空間內的接合材等產生的氣體排出。
Furthermore, in the above embodiment, the temporary fixing steps S130, S130A and S130B are performed by causing the
再者，上述實施型態中，暫時固定步驟S130A係在藉由吸附嘴12吸附蓋構件10的狀態下使烙鐵13直接接觸。然而，暫時固定步驟亦可為藉由吸附嘴等搭載手段保持蓋構件的同時按壓蓋構件的構成。蓋構件係在藉由搭載手段向保持構件按壓的狀態下，藉由發熱體加熱。藉此，可使位於保持構件的內部空間內的接合材等產生的氣體排出。
Furthermore, in the above embodiment, in the temporary fixing step S130A, the
再者，上述實施型態中，暫時固定步驟S130A係在藉由吸附嘴12吸附蓋構件10的狀態下使烙鐵13直接接觸。然而，暫時固定步驟亦可為藉由吸附嘴等搭載手段保持蓋構件的同時，藉由搭載手段與烙鐵等發熱體來按壓蓋構件的構成。蓋構件係在藉由搭載手段與發熱體分別按壓的狀態下，藉由發熱體加熱。此時，搭載手段與發熱體係配置成為以蓋構件的長邊方向的中線呈線對稱。因此，暫時固定步驟中，可使施加於封閉材的單位面積的荷重接近均等。藉此，可抑制四個角部的接合狀態的不均。
Furthermore, in the above-mentioned embodiment, the temporary fixing step S130A is to directly contact the
再者，上述實施型態中，暫時固定步驟S130A係在藉由吸附嘴12吸附蓋構件10的狀態下使烙鐵13直接接觸。然而，暫時固定步驟亦可在藉由吸附嘴等搭載手段保持蓋構件的狀態下，藉由發熱體直接或間接地加熱的吸附嘴來加熱蓋構件。藉此，可使位於保持構件的內部空間內的接合材等產生的氣體排出。
Furthermore, in the above embodiment, in the temporary fixing step S130A, the
再者，上述實施型態中，壓電振動器件1係於保持構件2的內部空間S內設置壓電元件7。然而，壓電振動器件亦可於保持構件的內部空間內設置壓電元件與電子零件。前述電子零件至少為包含振盪電路的積體電路元件。再者，前述電子零件亦可為內建溫度感測器的振盪器。
Furthermore, in the above-mentioned embodiment, the
再者，上述實施型態中，封閉材11為金錫合金。然而，封閉材若構成為可藉由蓋構件將保持構件封閉的材料即可。封閉材亦可為例如金屬硬銲材、熱可塑性樹脂、玻璃材等。
Furthermore, in the above-mentioned embodiment, the sealing
再者，上述實施型態中，壓電元件封閉步驟S100係將蓋構件10接合於單片狀態的保持構件2。然而，壓電元件封閉步驟亦可將蓋構件分別接合於多數個保持構件相連成矩陣狀的蓆狀構件。
Furthermore, in the above-mentioned embodiment, the piezoelectric element closing step S100 is to join the
複數個保持構件2係一體成型為相互連結的蓆狀構件。蓆狀構件的大小係不論保持構件2的大小如何皆構成為相同大小。亦即，依據保持構件2的大小，蓆狀構件所包含的保持構件2的數量有所不同。藉由如此構成，壓電振動器件的製造方法中，即使保持構件2的大小改變，亦不須配合保持構件2的大小對壓電振動器件的製造裝置進行調整等。
The plurality of holding
再者，上述實施型態中，壓電振動器件1的壓電元件7係位於保持構件2的內部空間S內。然而，壓電振動器件亦可具有底部、以及於該底部的相對的兩個平面上分別沿著垂直於前述平面的方向延伸的框狀的側壁部，亦即所謂的H型構造的壓電振動器件。前述H型構造的壓電振動器件中，壓電元件係位於前述底部的一側的平面上，且位於該一側的前述側壁部的內側。再者，前述H型構造的壓電振動器件中，電子零件係搭載於前述底部的另一側的平面上，且搭載於該另一側的前述側壁部的內側。前述H型構造的壓電振動器件中，蓋構件係藉由封閉材分別接合於前述一側的側壁部的前端部及前述另一側的側壁部的前端部。
Furthermore, in the above-mentioned embodiment, the
以上已說明了本發明的實施型態，惟上述實施型態僅為用以實施本發明的例示。因此，本發明不限於上述實施型態，在不脫離其要旨的範圍內，亦可將上述實施型態適當地變化實施。 The embodiments of the present invention have been described above, but the above embodiments are only examples for implementing the present invention. Therefore, the present invention is not limited to the above-described embodiments, and the above-described embodiments can be appropriately modified and implemented within the scope that does not deviate from the gist of the invention.
1:壓電振動器件 1: Piezoelectric vibration device
2:保持構件 2: Keep components
4:電極墊 4: Electrode pad
5:外部端子 5: External terminals
6:側壁部 6: Side wall part
7:壓電元件 7: Piezoelectric components
8:電極 8: Electrode
9:接合材 9:Jointing material
10:蓋構件 10: Cover member
11:封閉材 11: Sealing material
11b:長邊方向直線部 11b: Longitudinal straight line part
11c:角部 11c: Corner
12:吸附嘴 12:Suction mouth
13:烙鐵 13:Soldering iron
14:保持構件加熱裝置 14: Holding member heating device
S:內部空間 S: Internal space
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| US7060520B2 (en) * | 2002-03-25 | 2006-06-13 | Seiko Epson Corporation | Piezoelectric device and cover sealing method and apparatus therefor, cellular phone apparatus using piezoelectric device and electronic apparatus using piezoelectric device |
| TW201010272A (en) * | 2008-02-18 | 2010-03-01 | Seiko Instr Inc | Method for fabricating piezoeledctric vibrator, piezoeledctric vibrator, oscillator, electronic apparatus and radio-controlled clock |
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| JP5508192B2 (en) * | 2010-08-24 | 2014-05-28 | 日本電波工業株式会社 | Piezoelectric device manufacturing method and piezoelectric device |
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| CN100407469C (en) * | 2002-03-25 | 2008-07-30 | 精工爱普生株式会社 | Piezoelectric device and its cap sealing method cap sealing appts. portable telephone set utilizing piezoelectric device and electronic device utilizing piezoelectric device |
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