JPH05160306A - Heat radiation structure - Google Patents
Heat radiation structureInfo
- Publication number
- JPH05160306A JPH05160306A JP3321771A JP32177191A JPH05160306A JP H05160306 A JPH05160306 A JP H05160306A JP 3321771 A JP3321771 A JP 3321771A JP 32177191 A JP32177191 A JP 32177191A JP H05160306 A JPH05160306 A JP H05160306A
- Authority
- JP
- Japan
- Prior art keywords
- heat
- generating component
- cold plate
- substrate
- solder
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
- H01L2224/161—Disposition
- H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/151—Die mounting substrate
- H01L2924/153—Connection portion
- H01L2924/1531—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface
- H01L2924/15312—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface being a pin array, e.g. PGA
Landscapes
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
Description
【０００１】[0001]
【産業上の利用分野】本発明は、放熱構造に係り、特に
基板上に実装された発熱部品を空冷にて冷却する放熱構
造に関するものである。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a heat radiation structure, and more particularly to a heat radiation structure for cooling a heat generating component mounted on a substrate by air cooling.
【０００２】[0002]
【従来の技術】従来は図２に示すように大きく分けて２
つのタイプがあった。まず、図２（ａ）に示すように、
基板２０上に実装された発熱部品２１に対して、その発
熱部品２１を包囲するようにフランジ２４を介して基板
２０に取り付けられるコールドプレート２２と、基板２
０との空間２３をＨｅやＮ2 で充填させ冷却する封止タ
イプがあった。尚、同図（ａ）において、２５はコール
ドプレートと２３とフランジ２４との密着性を向上させ
るためのシール材であって、２６は発熱部品２１に電源
等を供給するための基板２０の裏面から突出するＩ／Ｏ
ピンである。2. Description of the Related Art Conventionally, as shown in FIG.
There were two types. First, as shown in FIG.
A heat generating component 21 mounted on the substrate 20; a cold plate 22 attached to the substrate 20 via a flange 24 so as to surround the heat generating component 21;
There is a sealed type in which the space 23 with 0 is filled with He or N 2 and cooled. In FIG. 1A, reference numeral 25 is a sealing material for improving the adhesion between the cold plate 23 and the flange 24, and 26 is the back surface of the substrate 20 for supplying power to the heat-generating component 21. I / O protruding from
It's a pin.
【０００３】その他、同図（ｂ）は基板２０上に実装さ
れた発熱部品２１の放熱面に放熱フィンを立植させ、こ
の放熱フィンによって冷却を空冷タイプがあった。尚、
２６は発熱部品２１に電源等を供給するための基板２０
の裏面から突出するＩ／Ｏピンである。In addition, in FIG. 1B, there is an air-cooling type in which a heat radiation fin is set up on the heat radiation surface of the heat generating component 21 mounted on the substrate 20, and cooling is performed by this heat radiation fin. still,
26 is a substrate 20 for supplying power to the heat-generating component 21.
I / O pins protruding from the back surface of the.
【０００４】[0004]
【発明が解決しようとする課題】しかしながら図２
（ａ）に示す封止タイプでは、熱抵抗が大きく冷却効率
が悪く、また、図２（ｂ）に示す空冷タイプでは、過多
半田によりショートする問題があった。However, as shown in FIG.
The sealed type shown in (a) has a large thermal resistance and poor cooling efficiency, and the air-cooled type shown in FIG. 2 (b) has a problem of short circuit due to excessive solder.
【０００５】従って、本発明では過多半田を退避させつ
つ、冷却効率を向上させるようにすることを目的とする
ものである。Therefore, it is an object of the present invention to improve the cooling efficiency while retracting excess solder.
【０００６】[0006]
【課題を解決するための手段】上記目的は、基板１上に
実装された発熱部品２を冷却する放熱構造において、前
記発熱部品２を包囲するよう前記基板１に取り付けら
れ、当該発熱部品２の実装位置に対応して孔部３ｂを有
するコールドプレート３と、該発熱部品２の放熱面に塗
布され、該コールドプレート３の孔部３ｂとを接続する
半田４と、を具備することを特徴とする放熱構造、によ
って達成される。SUMMARY OF THE INVENTION In the heat dissipation structure for cooling the heat-generating component 2 mounted on the substrate 1, the above-described object is to mount the heat-generating component 2 on the substrate 1 so as to surround the heat-generating component 2. A cold plate 3 having a hole 3b corresponding to a mounting position, and a solder 4 applied to the heat dissipation surface of the heat-generating component 2 and connecting the hole 3b of the cold plate 3 are provided. Is achieved by the heat dissipation structure.
【０００７】[0007]
【作用】即ち、本発明によれば、コールドプレートと発
熱部品とを半田によって接続することで発熱部品の熱を
効率良く伝達することができるため、冷却効率が向上す
る。That is, according to the present invention, the cold plate and the heat-generating component are connected by solder, so that the heat of the heat-generating component can be efficiently transferred, so that the cooling efficiency is improved.
【０００８】また、コールドプレートに孔部を設けるこ
とでコールドプレートと発熱部品とを接続する半田の逃
げ部を形成することとなり、過多半田を逃がすことがで
きる。Further, by providing the hole portion in the cold plate, a solder escape portion for connecting the cold plate and the heat-generating component is formed, and excess solder can be escaped.
【０００９】[0009]
【実施例】以下、本発明の望ましい実施例を図面に基づ
いて詳細に説明する。図１は本発明の実施例を示す図で
ある。DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENT A preferred embodiment of the present invention will now be described in detail with reference to the drawings. FIG. 1 is a diagram showing an embodiment of the present invention.
【００１０】図１に示すように、基板１上には発熱部品
２がバンプ７を介して実装されており、またその発熱部
品２の放熱面には半田４が塗布されている。発熱部品２
を実装してなる基板１には、その発熱部品２を包囲する
ようにコールドプレート３がシール材６を介して取り付
けられている。As shown in FIG. 1, a heat generating component 2 is mounted on a substrate 1 via bumps 7, and a heat radiating surface of the heat generating component 2 is coated with solder 4. Heat generating parts 2
A cold plate 3 is attached to a substrate 1 on which is mounted so as to surround the heat generating component 2 via a sealing material 6.
【００１１】このコールドプレート３は発熱部品２と反
対の面に突起３ａが多段に形成されていると共に、半田
４がその放熱面に塗布された発熱部品２の実装位置に対
応して孔部３ｂが穿孔されている。更に、コールドプレ
ート３の発熱部品２側裏面には半田付け可能なメタライ
ズが施されている。The cold plate 3 has a multiplicity of protrusions 3a formed on the surface opposite to the heat-generating component 2, and a hole 3b corresponding to the mounting position of the heat-generating component 2 coated with solder 4 on its heat-radiating surface. Is perforated. Further, the back surface of the cold plate 3 on the side of the heat-generating component 2 is provided with a solderable metallization.
【００１２】尚、基板１の裏面（発熱部品２が実装され
ている面とは反対の面）から突出するものは、基板１お
よび発熱部品２に電源等を供給するためのＩ／Ｏピンで
あり、必要に応じてコールドプレート３と基板１との空
間５にＨｅやＮ2 で充填させ冷却する封止してもよい。What is projected from the back surface of the substrate 1 (the surface opposite to the surface on which the heat-generating component 2 is mounted) is an I / O pin for supplying power to the substrate 1 and the heat-generating component 2. If necessary, the space 5 between the cold plate 3 and the substrate 1 may be filled with He or N 2 and sealed by cooling.
【００１３】上記のように構成された基板１，発熱部
品，コールドプレート３をリフローすると、発熱部品２
の放熱面に塗布された半田４が溶融し、溶融した半田が
発熱部品２とコールドプレート３との間を直接接続する
こととなり、熱抵抗が低下し、冷却効率が向上する。When the substrate 1, the heat generating component and the cold plate 3 configured as described above are reflowed, the heat generating component 2
The solder 4 applied to the heat radiating surface is melted, and the melted solder directly connects the heat generating component 2 and the cold plate 3 to reduce the thermal resistance and improve the cooling efficiency.
【００１４】そして、溶融した半田４はコールドプレー
ト３の孔部３ｂに過多な部分のみが収納されて逃げるこ
とにより、過多半田によるショートが発生しない。其ば
かりか、コールドプレート３と発熱部品２との間はある
程度の間隔を有しているので、基板１上に実装する発熱
部品２の実装高さにバラツキがあったとしても、この溶
融する半田４によってそのバラツキを吸収して必ずコー
ルドプレート３と発熱部品２とを接触させることができ
る。The melted solder 4 is accommodated in the hole 3b of the cold plate 3 only in an excessive amount and escapes, so that a short circuit due to excessive solder does not occur. Moreover, since there is a certain distance between the cold plate 3 and the heat-generating component 2, even if the mounting height of the heat-generating component 2 mounted on the substrate 1 varies, this melting solder The variation can be absorbed by 4 and the cold plate 3 and the heat generating component 2 can be brought into contact with each other without fail.
【００１５】更に、コールドプレート３の孔部３ｂによ
って半田４がある程度許容されることにより発熱部品２
の放熱面に塗布する半田４の量を細かく設定する必要が
なくなる。Further, the hole 3b of the cold plate 3 allows the solder 4 to some extent, so that the heat generating component 2
It is not necessary to finely set the amount of the solder 4 applied to the heat radiation surface.
【００１６】[0016]
【発明の効果】以上述べたように本発明によれば以下の
効果を有する。 過多半田によるショートがなくなる。As described above, the present invention has the following effects. Short circuit due to excessive solder is eliminated.
【００１７】部品の高さがそれぞれ違っても半田高さ
を均一にして半田付けできる。 半田の量を細かく決める必要がない。Even if the heights of the components are different from each other, the solder height can be made uniform and soldering can be performed. There is no need to finely determine the amount of solder.
【図１】本発明の実施例を示す図である。FIG. 1 is a diagram showing an embodiment of the present invention.
【図２】従来例を示す図であり、同図（ａ）は封止タイ
プ，同図（ｂ）は空冷タイプである。2A and 2B are views showing a conventional example, in which FIG. 2A is a sealing type and FIG. 2B is an air cooling type.
１ 基板， ２ 発熱部品， ３ コールドプレート， ３ｂ 孔部， ４ 半田， ６ シール材， 1 board, 2 heat generating parts, 3 cold plate, 3b hole, 4 solder, 6 sealing material,
Claims (1)
（２）を冷却する放熱構造において、 前記発熱部品（２）を包囲するよう前記基板（１）に取
り付けられ、当該発熱部品（２）の実装位置に対応して
孔部（３ｂ）を有するコールドプレート（３）と、 該発熱部品（２）の放熱面に塗布され、該コールドプレ
ート（３）の孔部（３ｂ）とを接続する半田（４）と、 を具備することを特徴とする放熱構造。1. A heat dissipation structure for cooling a heat-generating component (2) mounted on a board (1), the heat-generating component (2) being attached to the board (1) so as to surround the heat-generating component (2). ) A cold plate (3) having a hole (3b) corresponding to the mounting position and a hole (3b) of the cold plate (3) connected to the heat radiating surface of the heat generating component (2) are connected. A heat dissipation structure comprising: a solder (4) for
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3321771A JPH05160306A (en) | 1991-12-05 | 1991-12-05 | Heat radiation structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3321771A JPH05160306A (en) | 1991-12-05 | 1991-12-05 | Heat radiation structure |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH05160306A true JPH05160306A (en) | 1993-06-25 |
Family
ID=18136251
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP3321771A Pending JPH05160306A (en) | 1991-12-05 | 1991-12-05 | Heat radiation structure |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH05160306A (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2001144233A (en) * | 1999-11-12 | 2001-05-25 | Fujitsu Ltd | Semiconductor unit, cooler and their manufacturing method |
| US6281575B1 (en) | 1998-07-08 | 2001-08-28 | Hitachi, Ltd | Multi-chip module |
| CN100376127C (en) * | 2004-05-14 | 2008-03-19 | 欧姆龙株式会社 | Heating element radiating structure |
| JP2010153934A (en) * | 2010-04-07 | 2010-07-08 | Fujitsu Ltd | Semiconductor unit and cooling device, and method for manufacturing the same |
-
1991
- 1991-12-05 JP JP3321771A patent/JPH05160306A/en active Pending
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6281575B1 (en) | 1998-07-08 | 2001-08-28 | Hitachi, Ltd | Multi-chip module |
| JP2001144233A (en) * | 1999-11-12 | 2001-05-25 | Fujitsu Ltd | Semiconductor unit, cooler and their manufacturing method |
| CN100376127C (en) * | 2004-05-14 | 2008-03-19 | 欧姆龙株式会社 | Heating element radiating structure |
| JP2010153934A (en) * | 2010-04-07 | 2010-07-08 | Fujitsu Ltd | Semiconductor unit and cooling device, and method for manufacturing the same |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A02 | Decision of refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A02 Effective date: 20000404 |