JPH11145656A - Method for heat radiation for circuit board and circuit board - Google Patents
Method for heat radiation for circuit board and circuit boardInfo
- Publication number
- JPH11145656A JPH11145656A JP30420297A JP30420297A JPH11145656A JP H11145656 A JPH11145656 A JP H11145656A JP 30420297 A JP30420297 A JP 30420297A JP 30420297 A JP30420297 A JP 30420297A JP H11145656 A JPH11145656 A JP H11145656A
- Authority
- JP
- Japan
- Prior art keywords
- circuit board
- heat
- metal plate
- hole
- dissipating
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/05—Insulated conductive substrates, e.g. insulated metal substrate
Landscapes
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
Description
【０００１】[0001]
【発明の属する技術分野】本発明は、配線回路パターン
を形成した金属板を、絶縁性樹脂でモールドしてなる回
路基板における放熱方法及び回路基板に関するものであ
る。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a heat radiation method and a circuit board for a circuit board formed by molding a metal plate on which a wiring circuit pattern is formed with an insulating resin.
【０００２】[0002]
【従来の技術】従来、回路基板の放熱方法としては、図
５に示すものが一般的である。図５において、１は発熱
するＩＣ 、３は回路基板、９は放熱フィンである。回
路基板３に、発熱するＩＣ１が実装されている場合、発
熱するＩＣ１には放熱フィン９が取り付けられる。発熱
するＩＣ１の熱は、放熱フィン９に伝わり空気中に熱を
伝達されることによって冷却される。2. Description of the Related Art Conventionally, as a method of radiating heat from a circuit board, a method shown in FIG. 5 is generally used. In FIG. 5, reference numeral 1 denotes an IC that generates heat, 3 denotes a circuit board, and 9 denotes a radiation fin. When the heat-generating IC 1 is mounted on the circuit board 3, the heat-radiating fins 9 are attached to the heat-generating IC 1. The heat of the heat-generating IC 1 is transmitted to the heat radiation fins 9 and transferred to the air to be cooled.
【０００３】[0003]
【発明が解決しようとする課題】上記従来の回路基板の
放熱方法では、回路基板３の上に放熱フィン９が実装さ
れているので、大きな実装面積を必要とし、かつ放熱フ
ィン９のコストがかかっていた。絶縁性樹脂でモールド
してなる回路基板３で同様の方法をとると、従来の回路
基板では配線パターンは、表面に露出していたので、発
熱するＩＣのリード部分からの熱を回路基板で冷却する
ことができたが、絶縁性樹脂でモールドされた回路基板
では部品から発生する熱が、配線パターンを伝わり、基
板の表面から放熱しないため、リード部分の温度が上昇
するので半田接続の信頼性を確保するためには、発熱す
るＩＣ等の部品から直接熱を逃がす必要がある。このた
め、従来よりも更に大きな放熱フィンが必要となる。In the above-described conventional method for radiating heat from a circuit board, since the radiating fins 9 are mounted on the circuit board 3, a large mounting area is required and the cost of the radiating fins 9 increases. I was When the same method is applied to the circuit board 3 molded with an insulating resin, the wiring pattern is exposed on the surface of the conventional circuit board, so the heat from the heat-generating IC leads is cooled by the circuit board. However, in a circuit board molded with insulating resin, the heat generated from the components is transmitted through the wiring pattern and does not radiate heat from the surface of the board, so the temperature of the lead rises and the reliability of the solder connection increases. In order to ensure the above, it is necessary to directly release heat from components such as an IC that generates heat. For this reason, a radiation fin larger than before is required.
【０００４】[0004]
【課題を解決するための手段】前記課題を解決するため
に、本発明の回路基板の放熱方法は、配線パターンを形
成した金属板を、絶縁性樹脂でモールドしてなる回路基
板において、前記回路基板の下側に放熱用の金属板を配
置し、前記回路基板に穴を設けて、発熱する部品と放熱
用の金属板を接合できるようにして、発熱するＩＣの熱
を専ら放熱用の金属板に逃がすことができるようにした
こと及び外装キャビネットが金属で形成されているキャ
ビネットの場合、放熱用の金属板を外装キャビネットと
接合し熱をセットの外に逃がすことができるようにした
ことを特徴としたものである。In order to solve the above-mentioned problems, a method for radiating heat of a circuit board according to the present invention is directed to a circuit board formed by molding a metal plate on which a wiring pattern is formed with an insulating resin. A metal plate for heat dissipation is arranged on the lower side of the board, and a hole is provided in the circuit board so that a heat-generating component can be joined to the metal plate for heat dissipation, and the heat of the heat-generating IC is exclusively used for the metal for heat dissipation. In the case where the cabinet is made of metal, the metal plate for heat dissipation can be joined to the cabinet to allow heat to escape to the outside of the set. It is a characteristic.
【０００５】従来の回路基板に実装された発熱する部品
に取り付ける放熱フィンの形状が大きいために回路基板
の実装面積が大きくなっていたが、本発明によれば、放
熱フィンを下側に配置させたことによる放熱方法によ
り、回路基板に放熱フィンを実装しなくてもよいので、
回路基板のサイズを小さくすることができる。又、これ
によりコストダウンを図れるとともに、放熱部品も削減
することができるため、品質信頼性が向上する。[0005] Although the mounting area of the circuit board has been increased due to the large shape of the radiation fin attached to the heat-generating component mounted on the conventional circuit board, according to the present invention, the radiation fin is arranged on the lower side. Because of the heat dissipation method, it is not necessary to mount the heat dissipation fins on the circuit board.
The size of the circuit board can be reduced. In addition, the cost can be reduced, and the number of heat radiating components can be reduced, so that quality reliability is improved.
【０００６】[0006]
【発明の実施の形態】本発明の請求項１に記載の発明
は、配線回路パターンを形成した金属板を、絶縁性樹脂
でモールドしてなる回路基板において、回路基板に穴を
設けて、発熱する部品と放熱用の金属板を接合できるよ
うにして、発熱するＩＣの熱を専ら放熱用の金属板に逃
がすことができるようにしたことを特徴とする。本発明
の請求項２に記載の発明は、請求項１と同様に回路基板
に穴を設けて、発熱する部品と放熱用の金属板を接合す
る際に放熱用の金属板を切り起こして、切り起こし部分
を穴から貫通させたことを特徴とする。DESCRIPTION OF THE PREFERRED EMBODIMENTS The invention according to claim 1 of the present invention is directed to a circuit board formed by molding a metal plate on which a wiring circuit pattern is formed with an insulating resin. And the heat dissipating metal plate can be bonded to the heat dissipating metal plate so that the heat of the IC that generates heat can be exclusively released to the heat dissipating metal plate. According to a second aspect of the present invention, a hole is formed in a circuit board as in the first aspect, and a metal plate for heat radiation is cut and raised when a heat-generating component and a metal plate for heat radiation are joined. The cut and raised portion is penetrated from the hole.
【０００７】本発明の請求項３に記載の発明は、請求項
１及び請求項２と同様に回路基板に穴を設けて、発熱す
る部品と放熱用の金属板を接合する方式において、最初
から部品を実装する前に穴を設けると実装する時にデイ
ップ半田の場合基板の表側に半田が飛散する恐れがある
ので、部品を実装した後容易に切り取れるように切り込
み用の溝を設けたことを特徴とする。According to a third aspect of the present invention, there is provided a method of joining a heat-generating component and a heat-dissipating metal plate by providing a hole in a circuit board as in the first and second aspects. If a hole is provided before mounting the component, solder may be scattered on the front side of the board in the case of dip soldering when mounting.Therefore, it is necessary to provide a notch groove so that the component can be easily cut off after mounting. Features.
【０００８】本発明の請求項４に記載の発明は、外装が
金属で形成されているキャビネットの場合において、請
求項１及び請求項２と同様に、発熱する部品と放熱用の
金属板を接合して熱を逃がし、更に放熱用の金属板に伝
わった熱を外装と接合し熱をセットの外に逃がすことが
できるようにしたことを特徴とする。以下に、本発明の
実施の形態における回路基板接続方法およびそれを用い
た回路基板について、図面を用いて説明する。According to a fourth aspect of the present invention, in the case of a cabinet whose exterior is made of metal, a heat-generating component and a metal plate for heat radiation are joined in the same manner as in the first and second aspects. The heat is dissipated, and further, the heat transmitted to the metal plate for heat dissipation is joined to the exterior so that the heat can be dissipated outside the set. Hereinafter, a circuit board connection method according to an embodiment of the present invention and a circuit board using the same will be described with reference to the drawings.
【０００９】（実施の形態１）図１は、本発明の一実施
の形態における回路基板の断面図を示す。本発明の第１
実施例によれば、プリント配線された回路基板３又は、
配線回路パターンを形成した金属板を、絶縁性樹脂でモ
ールドして形成された回路基板３において、発熱するＩ
Ｃ１が放熱用金属板２を前面的に接触できるようにリー
ドを折り曲げて実装されている。発熱するＩＣ１の下側
には穴があり、放熱用金属板２において、穴よりも一回
り小さいサイズの突起を設けて発熱するＩＣ１と接合さ
せている。これにより、発熱するＩＣ１から発生する熱
を放熱用金属板２に伝えることが可能となる。(Embodiment 1) FIG. 1 is a sectional view of a circuit board according to an embodiment of the present invention. First of the present invention
According to the embodiment, the printed circuit board 3 or
In a circuit board 3 formed by molding a metal plate on which a wiring circuit pattern is formed with an insulating resin, heat is generated.
The lead is bent and mounted so that C1 can contact the heat-dissipating metal plate 2 from the front. There is a hole below the heat-generating IC 1, and a protrusion having a size one size smaller than the hole is provided on the heat-dissipating metal plate 2 to be joined to the heat-generating IC 1. As a result, heat generated from the heat-generating IC 1 can be transmitted to the metal plate 2 for heat radiation.
【００１０】放熱用金属板２は、回路基板３を支持する
シャーシフレーム６と一体となった構造を有しているの
で、放熱用金属板２に伝わった熱を更にシャーシフレー
ム６に逃がすことができるので熱容量を大きくすること
が可能となる。これらの熱容量を大きくできる効果によ
り従来の放熱フィンと同等の冷却効果を持たせることが
可能となる。従来は放熱フィンを基板の表側に実装して
いたため、放熱フィンの実装面積が回路基板に占める割
合が大きく基板サイズの小型化ができなかったが、本発
明の実装形態により、放熱フィンを基板に実装しなくて
も済むので、基板サイズの小型化が可能となる。Since the heat dissipating metal plate 2 has a structure integrated with the chassis frame 6 that supports the circuit board 3, the heat transmitted to the heat dissipating metal plate 2 can be further released to the chassis frame 6. Therefore, the heat capacity can be increased. Due to the effect of increasing the heat capacity, it is possible to provide a cooling effect equivalent to that of the conventional radiating fin. Conventionally, the radiating fins were mounted on the front side of the board, so the mounting area of the radiating fins occupied a large portion of the circuit board and the board size could not be reduced. Since it is not necessary to mount the device, the size of the substrate can be reduced.
【００１１】図１において、プリント配線された回路基
板３又は回路基板３及び放熱用金属板２にも放熱孔４を
設けることによって、対流の流れを改善し、温度上昇し
た放熱用金属板２と回路基板３との空間に熱がこもるの
を防ぎ全体的に効率良く冷却することが可能となる。In FIG. 1, a radiating hole 4 is also provided in the printed circuit board 3 or the circuit board 3 and the heat radiating metal plate 2 to improve the convection flow and to increase the temperature of the heat radiating metal plate 2. It is possible to prevent heat from being trapped in the space with the circuit board 3 and to efficiently cool the entire board.
【００１２】（実施の形態２）図２は、本発明の一実施
の形態における金属板を切り起こした場合の回路基板の
断面図を示す。本発明の第２実施例によれば、プリント
配線された回路基板３又は配線回路パターンを形成した
金属板を、絶縁性樹脂でモールドしてなる回路基板３に
発熱するＩＣ１は従来通り立った状態で実装されてい
る。発熱するＩＣ１の下側周辺には穴があり、放熱用金
属板２の一部分を切り起こして、穴を貫通させて回路基
板３の表側に出るようにして、発熱するＩＣ１と接合が
できるようにした。発熱するＩＣ１の発熱量が著しい場
合回路基板３の下側に放熱用金属板２を配置すると局部
的に温度上昇が発生し、回路基板３も温度が上昇し、そ
れに伴って部品温度も上昇する可能性があるので、ＩＣ
で発生した熱をできるだけすみやかに効率良く逃がすた
めには、回路基板３の上側にも放熱用金属板２を配置す
る必要がある。(Embodiment 2) FIG. 2 is a sectional view of a circuit board when a metal plate is cut and raised according to an embodiment of the present invention. According to the second embodiment of the present invention, the circuit board 3 on which the printed wiring is formed or the metal plate on which the wiring circuit pattern is formed is molded with an insulating resin. Has been implemented. There is a hole around the lower side of the heat-generating IC 1. A part of the heat-dissipating metal plate 2 is cut and raised so that the hole penetrates the hole and comes out to the front side of the circuit board 3 so that it can be joined to the heat-generating IC 1. did. When the heat generation amount of the IC 1 that generates heat is remarkable, the temperature rise occurs locally when the heat-dissipating metal plate 2 is disposed below the circuit board 3, the temperature of the circuit board 3 also rises, and the component temperature rises accordingly. Because there is a possibility, IC
In order to efficiently and efficiently release the heat generated in the circuit board 3, it is necessary to arrange the metal plate 2 for heat radiation also above the circuit board 3.
【００１３】本発明によれば、放熱用金属板２はシャー
シフレーム６も兼用しているため、熱容量が大きく、本
発明の第２実施例の形態となっても、従来の放熱フィン
のサイズよりも小さい形状で同じ冷却効果が得られるの
で、基板サイズの小型化が可能となる。又、図２におい
て、本発明の第１実施例と同様回路基板３及び放熱用金
属板２にも放熱孔４を設けることによって、対流の流れ
を改善し、温度上昇した放熱用金属板２と回路基板３と
の空間に熱がこもるのを防ぎ全体的に効率良く冷却する
ことが可能となる。According to the present invention, since the heat-dissipating metal plate 2 also serves as the chassis frame 6, the heat capacity is large, and even in the second embodiment of the present invention, the size of the heat-dissipating fin is smaller than that of the conventional heat dissipating fin. Since the same cooling effect can be obtained with a small shape, the size of the substrate can be reduced. In FIG. 2, as in the first embodiment of the present invention, the convection flow is improved by providing heat radiating holes 4 in the circuit board 3 and the heat radiating metal plate 2 as well. It is possible to prevent heat from being trapped in the space with the circuit board 3 and to efficiently cool the entire board.
【００１４】（実施の形態３）図３は、本発明の一実施
の形態における回路基板に溝を設けた回路基板の斜視図
を示す。本発明の第３実施例によれば、プリント配線さ
れた回路基板３又は配線回路パターンを形成した金属板
を、絶縁性樹脂でモールドしてなる回路基板３に部品を
実装する際に、あらかじめ回路基板３に穴を設けてある
と、デイップ半田槽を通す時に回路基板３の表側に半田
が飛散し、パターンのショートの原因となる可能性があ
る。従って、部品を実装した後で穴を形成できるように
切込み溝５を設けて一部分のみつながった状態にしてお
き、部品が実装された後で、力を加えて容易に割って削
除できるようにした。(Embodiment 3) FIG. 3 is a perspective view of a circuit board provided with a groove in a circuit board according to an embodiment of the present invention. According to the third embodiment of the present invention, when components are mounted on the circuit board 3 formed by molding a printed circuit board 3 or a metal plate on which a wiring circuit pattern is formed with an insulating resin, a circuit is prepared in advance. If a hole is provided in the substrate 3, solder may be scattered on the front side of the circuit board 3 when passing through the dip solder bath, which may cause a short circuit of the pattern. Therefore, the cut groove 5 is provided so that a hole can be formed after the component is mounted, and only a part thereof is connected, and after the component is mounted, the component can be easily broken by applying force and removed. .
【００１５】（実施の形態４）図４は、本発明の一実施
の形態における回路基板のＩＣの熱を外装に伝熱させた
状態を示した断面図を示す。本発明の第４実施例によれ
ば、プリント配線された回路基板３又は配線回路パター
ンを形成した金属板を、絶縁性樹脂でモールドしてなる
回路基板３に実装された発熱するＩＣ１と放熱用金属板
２を接合させて発熱するＩＣ１からの熱を放熱用金属板
２に伝えて放熱する方法において、放熱用金属板２は、
シャーシフレーム６と一体になっているので熱容量は従
来の放熱フィンよりも十分大きい。外装が金属でできて
いるようなセットでは、シャーシフレーム６と外装キャ
ビ７と接触させることにより、更に放熱効果が良くな
る。図４において、発熱するＩＣ１から熱を奪った放熱
用金属板２は、シャーシフレーム６全体に熱を伝えてい
く。(Embodiment 4) FIG. 4 is a sectional view showing a state in which heat of an IC of a circuit board is transferred to an exterior in an embodiment of the present invention. According to the fourth embodiment of the present invention, the heat-generating IC 1 mounted on the printed circuit board 3 or the circuit board 3 formed by molding a metal plate on which a wiring circuit pattern is formed with an insulating resin is provided. In the method of transferring the heat from the IC 1 that generates heat by joining the metal plates 2 to the metal plate 2 for heat dissipation and radiating the heat, the metal plate 2 for heat dissipation includes:
Since it is integrated with the chassis frame 6, the heat capacity is sufficiently larger than that of the conventional radiating fin. In a set in which the exterior is made of metal, the heat dissipation effect is further improved by bringing the chassis frame 6 into contact with the exterior cabinet 7. In FIG. 4, the heat-dissipating metal plate 2 that has taken heat from the IC 1 that generates heat transfers heat to the entire chassis frame 6.
【００１６】シャーシフレーム６と金属製の外装キャビ
７との間には、熱伝導性シート８を設置し、表面の状態
が良好でなくても熱伝導性シート８により効率良く熱を
伝えてそして外装キャビを通じてセット外部放熱するこ
とができるので、金属キャビのメリットを最大限に生か
すことが可能となる。尚、熱伝導性シート８は、電気的
には絶縁特性を有しているので電源回路のグランドが直
接外側の外装キャビネット７に導通することがないの
で、電気的にも安全を確保することができる。A heat conductive sheet 8 is provided between the chassis frame 6 and the metal exterior cabinet 7 to efficiently transfer heat to the heat conductive sheet 8 even if the surface condition is not good. Since the set outside heat can be radiated through the exterior cabinet, it is possible to maximize the advantages of the metal cabinet. Since the heat conductive sheet 8 has an electrically insulating property, the ground of the power supply circuit does not directly conduct to the outer cabinet 7 on the outside, so that electrical safety can be ensured. it can.
【００１７】[0017]
【発明の効果】以上のように本発明の回路基板の放熱方
法およびそれを用いた回路基板によれば、従来タイプの
放熱フィンを不要にし、コストダウンを図れるととも
に、回路基板に実装する部品が減少するため、実装密度
が向上し基板サイズを縮小することができる。As described above, according to the circuit board heat dissipation method of the present invention and the circuit board using the same, the conventional type of heat dissipation fin is not required, the cost can be reduced, and the components mounted on the circuit board can be reduced. Because of the reduction, the mounting density can be improved and the substrate size can be reduced.
【図１】本発明の一実施の形態における回路基板の断面
図FIG. 1 is a cross-sectional view of a circuit board according to an embodiment of the present invention.
【図２】本発明の一実施の形態における金属板を切り起
こした場合の回路基板の断面図FIG. 2 is a cross-sectional view of a circuit board when a metal plate is cut and raised according to an embodiment of the present invention.
【図３】本発明の一実施の形態における回路基板に溝を
設けた回路基板の斜視図FIG. 3 is a perspective view of a circuit board provided with a groove in the circuit board according to one embodiment of the present invention;
【図４】本発明の一実施の形態における回路基板のＩＣ
の熱を外装に伝熱させた状態を示した断面図FIG. 4 is a circuit board IC according to an embodiment of the present invention.
Sectional view showing the state where the heat of the heat was transferred to the exterior
【図５】従来の放熱フィンを設置した回路基板の斜視図FIG. 5 is a perspective view of a circuit board provided with a conventional heat radiation fin.
１ 発熱するＩＣ ２ 放熱用金属板 ３ 回路基板 ４ 放熱孔 ５ 切込み溝 ６ シャーシフレーム ７ 外装キャビ ８ 熱伝導性シート ９ 放熱フィン REFERENCE SIGNS LIST 1 heat-generating IC 2 heat-dissipating metal plate 3 circuit board 4 heat-dissipating hole 5 cut-out groove 6 chassis frame 7 exterior cabinet 8 heat-conductive sheet 9 heat-dissipating fin
Claims (4)
路パターンを形成した金属板を、絶縁性樹脂でモールド
して形成された回路基板において、前記回路基板に実装
された発熱する部品を放熱するために穴を有し、前記部
品を穴を通過させて、回路基板の下側に設けた放熱用の
金属板に取り付けたことと回路基板を支持する金属製の
シャーシフレームと放熱用の金属板が一体となったこと
を特徴とする回路基板の放熱方法。1. A circuit board formed by molding a printed circuit board or a metal plate on which a wiring circuit pattern is formed with an insulating resin to radiate heat generated components mounted on the circuit board. Has a hole, the components are passed through the hole, and attached to the metal plate for heat dissipation provided on the lower side of the circuit board, the metal chassis frame supporting the circuit board and the metal plate for heat dissipation A heat dissipation method for a circuit board, which is integrated.
る部品を、放熱用の金属板の一部分を切りおこした部分
に前記記載の回路基板に設けた穴を通過させることによ
って取り付けたことを特徴とする請求項１記載の回路基
板の放熱方法。2. The method according to claim 1, wherein the heat-generating component mounted on the circuit board is attached to a part of the heat-dissipating metal plate by cutting a part of the heat-dissipating metal plate through a hole provided in the circuit board. The method for radiating heat of a circuit board according to claim 1, wherein:
過させるための穴を形成するためにあらかじめ切り込ん
で溝を形成して割って落とし易くしたことを特徴とする
回路基板。3. A circuit board according to claim 1, wherein the circuit board is cut in advance to form a groove for forming a hole for allowing the component to pass therethrough, and the groove is easily split and dropped.
ケースが金属製である装置において、回路基板を支持す
るフレームと一体となった放熱用の金属板を金属製の外
装ケースに密着させて熱を逃がすことができるようにし
たことを特徴とする放熱方法。4. A device according to claim 1, wherein the outer case for housing the circuit board is made of metal, and a heat-dissipating metal plate integrated with a frame supporting the circuit board is brought into close contact with the outer case made of metal. A heat dissipation method characterized by allowing heat to escape.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP30420297A JPH11145656A (en) | 1997-11-06 | 1997-11-06 | Method for heat radiation for circuit board and circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP30420297A JPH11145656A (en) | 1997-11-06 | 1997-11-06 | Method for heat radiation for circuit board and circuit board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH11145656A true JPH11145656A (en) | 1999-05-28 |
Family
ID=17930254
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP30420297A Pending JPH11145656A (en) | 1997-11-06 | 1997-11-06 | Method for heat radiation for circuit board and circuit board |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH11145656A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2002217574A (en) * | 2001-01-12 | 2002-08-02 | Matsushita Electric Works Ltd | Power converter |
| JP2012190955A (en) * | 2011-03-10 | 2012-10-04 | Furukawa Electric Co Ltd:The | Injection molded substrate |
| JP2014143843A (en) * | 2013-01-24 | 2014-08-07 | Nissan Motor Co Ltd | Contactless power supply device |
-
1997
- 1997-11-06 JP JP30420297A patent/JPH11145656A/en active Pending
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2002217574A (en) * | 2001-01-12 | 2002-08-02 | Matsushita Electric Works Ltd | Power converter |
| JP2012190955A (en) * | 2011-03-10 | 2012-10-04 | Furukawa Electric Co Ltd:The | Injection molded substrate |
| JP2014143843A (en) * | 2013-01-24 | 2014-08-07 | Nissan Motor Co Ltd | Contactless power supply device |
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