JPH049649Y2 - - Google Patents
Info
- Publication number
- JPH049649Y2 JPH049649Y2 JP1983099683U JP9968383U JPH049649Y2 JP H049649 Y2 JPH049649 Y2 JP H049649Y2 JP 1983099683 U JP1983099683 U JP 1983099683U JP 9968383 U JP9968383 U JP 9968383U JP H049649 Y2 JPH049649 Y2 JP H049649Y2
- Authority
- JP
- Japan
- Prior art keywords
- card
- integrated circuit
- circuit board
- synthetic resin
- printed circuit
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 229920003002 synthetic resin Polymers 0.000 claims description 19
- 239000000057 synthetic resin Substances 0.000 claims description 19
- 229920001187 thermosetting polymer Polymers 0.000 claims description 4
- 239000003822 epoxy resin Substances 0.000 claims description 2
- 238000010030 laminating Methods 0.000 claims description 2
- 229920000647 polyepoxide Polymers 0.000 claims description 2
- 229920005989 resin Polymers 0.000 description 8
- 239000011347 resin Substances 0.000 description 8
- 239000004020 conductor Substances 0.000 description 7
- 238000010586 diagram Methods 0.000 description 6
- 238000004519 manufacturing process Methods 0.000 description 5
- 238000000034 method Methods 0.000 description 5
- 230000007547 defect Effects 0.000 description 2
- 239000004800 polyvinyl chloride Substances 0.000 description 2
- 229920000915 polyvinyl chloride Polymers 0.000 description 2
- 229910000831 Steel Inorganic materials 0.000 description 1
- 239000004809 Teflon Substances 0.000 description 1
- 229920006362 Teflon® Polymers 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000007650 screen-printing Methods 0.000 description 1
- 239000010959 steel Substances 0.000 description 1
- 229920001169 thermoplastic Polymers 0.000 description 1
- 239000004416 thermosoftening plastic Substances 0.000 description 1
- 229920006352 transparent thermoplastic Polymers 0.000 description 1
Landscapes
- Credit Cards Or The Like (AREA)
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
Description
【考案の詳細な説明】
この考案はIC，LSI等の集積回路を内蔵し、デ
ータの蓄積、演算処理等を行ない得るカードに関
するものである。[Detailed description of the invention] This invention relates to a card that has a built-in integrated circuit such as an IC or LSI, and is capable of storing data, performing arithmetic processing, etc.
近年、特開昭51−18433号公報、特開昭52−
83132号公報にみられるようにIC等の集積回路を
内蔵するカードが提案され、現在広く用いられて
いる磁気カードに比べてメモリー容量が格段に大
きいために磁気カードでは不可能であつた使用型
態をとることができるものとして注目を集めてい
る。 In recent years, Japanese Unexamined Patent Publication No. 18433/1983,
As seen in Publication No. 83132, cards with built-in integrated circuits such as ICs were proposed, and because they had a much larger memory capacity than the currently widely used magnetic cards, they could be used in ways that were not possible with magnetic cards. It is attracting attention as a device that can be used in a variety of situations.
而るに、集積回路をカード内に内蔵するにおい
ては、カード製造時における過酷な加熱、加圧及
び衝撃等に精緻な電子部品である集積回路が故障
することなく耐えねばならないだけでなく、商品
としてのカード外見、品位をも満足するものがで
きなければならない課題が存在する。 However, when an integrated circuit is built into a card, not only must the integrated circuit, which is a delicate electronic component, withstand severe heat, pressure, and impact during card manufacturing without failure, but also the product There is a need to create a card that satisfies the appearance and quality of the card.
カード製造時において集積回路が上記の如くの
加熱、加圧及び衝撃等の影響を受けるのを避ける
ために、カード本体と集積回路部分を別個に製造
し、カード本体に設けられた取りつけ用の凹部に
完成時点で集積回路を取りつけ、両者を合体させ
て仕上げる形式のカードが知られている。 In order to avoid the integrated circuit from being affected by the heat, pressure, impact, etc. mentioned above during card manufacturing, the card body and the integrated circuit part are manufactured separately, and a recess for mounting is provided in the card body. A card is known in which an integrated circuit is attached to the card upon completion, and the two are combined to complete the process.
この場合、カード製造時点ではその内部に集積
回路が存在しないので、従来と同様に極めて容易
にカードを製造することができ、しかも品質的に
も十分に満足し得るものを得ることができる反
面、集積回路部分とカード本体との合体力が必ず
しも十分であることは言いきれず、このため集積
回路部分が使用中に欠落する惧れがある。 In this case, since there is no integrated circuit inside the card at the time of manufacture, it is possible to manufacture the card extremely easily in the same way as in the past. It cannot be said that the combined strength of the integrated circuit portion and the card body is necessarily sufficient, and as a result, there is a risk that the integrated circuit portion may come off during use.
他方、カード本体に集積回路を封入した状態で
製造されるものにおいては、上記した集積回路が
欠落する不備は解消され得るが、集積回路が取り
つけられているプリント基板表面の凹凸が影響し
て完成後のカード表面に凹凸が発生する不備があ
る。 On the other hand, in the case of cards manufactured with integrated circuits encapsulated in the card body, the above-mentioned defect of missing integrated circuits can be resolved, but the unevenness of the surface of the printed circuit board on which the integrated circuits are attached may affect the completion of the card. There is a defect that unevenness occurs on the surface of the card afterward.
即ち、第１図に示されるように、集積回路２は
プリント基板１に集積回路２の表面とプリント基
板１の表面が同一平面内にあるように取りつけら
れ、またこのプリント基板１の表面には外部接続
端子４及び導線３が35μm程度の高さをもつて配
設されており、このような集積回路２が取りつけ
られたプリント基板１をセンターコアシートに取
りつけ、さらにオーバーシート６，７をこのセン
ターコアシート５に加熱加圧することによりラミ
ネートしてカードを製造した場合、第２図に示さ
れるように、プリント基板上の突出した導線部が
影響してその部分に対応するオーバーシートの表
面（即ちカード表面）の凹凸８が発生する。 That is, as shown in FIG. 1, the integrated circuit 2 is mounted on the printed circuit board 1 so that the surface of the integrated circuit 2 and the surface of the printed circuit board 1 are in the same plane, and the surface of the printed circuit board 1 is External connection terminals 4 and conductive wires 3 are arranged at a height of about 35 μm, and the printed circuit board 1 on which such an integrated circuit 2 is attached is attached to the center core sheet, and the oversheets 6 and 7 are attached to the center core sheet. When a card is manufactured by laminating the center core sheet 5 by heating and pressurizing it, as shown in FIG. In other words, unevenness 8 occurs on the surface of the card.
カード表面の凹凸は、それがどの程度の大きさ
のものであつてもカードの外見と品位を大きく低
下させ、場合によつては機能面でも障害をきたす
可能性も有り、極めて憂慮すべき現象であること
は異論をはさまない事実である。 Irregularities on the surface of a card, no matter how large they are, can greatly reduce the appearance and quality of the card, and in some cases may even impair its functionality, making it an extremely worrying phenomenon. It is a fact that cannot be disputed.
従つて、この考案の目的は内蔵される集積回路
の不慮の欠落がないことはもちろんのことカード
表面に凹凸が生じることのない高品質の集積回路
内蔵カードを提供することにある。 Therefore, the object of this invention is to provide a high-quality card with a built-in integrated circuit, which is free from accidental loss of the built-in integrated circuit and also free from unevenness on the surface of the card.
以下にこの考案を図面の実施例に基づき詳細に
説明する。 This invention will be explained in detail below based on the embodiments shown in the drawings.
第３図及び第４図は本考案にかかるカードに内
蔵される集積回路が取りつけられたプリント基板
の断面を示す説明図であり、第５図は第３図に示
されたプリント基板を内蔵したカードの断面を示
す説明図である。 3 and 4 are explanatory diagrams showing a cross section of a printed circuit board on which an integrated circuit built into a card according to the present invention is attached, and FIG. It is an explanatory view showing a cross section of a card.
第３図に示されるように、プリント基板１に穴
９が形成され、この穴９にIC，LSI等の集積回路
２が嵌め込まれる。この状態でプリント基板１表
面と集積回路２表面とは同一平面内に位置してい
る。またプリント基板１表面には外部接続端子４
と導線３が形成されており、この外部接続端子４
と導線３は前述したようにプリント基板１表面か
ら35μm程度突出しており、この段差を無くし、
プリント基板１表面を平担化するために外部接続
端子４及び導線３が形成されていない部分にこの
部分を被覆するよう合成樹脂層１０が外部接続端
子４及び導線３の高さと同一の高さに設けられ
る。 As shown in FIG. 3, a hole 9 is formed in the printed circuit board 1, and an integrated circuit 2 such as an IC or LSI is fitted into the hole 9. In this state, the surface of the printed circuit board 1 and the surface of the integrated circuit 2 are located in the same plane. Also, external connection terminals 4 are on the surface of the printed circuit board 1.
and a conductor 3 are formed, and this external connection terminal 4
As mentioned above, the conductor wire 3 protrudes from the surface of the printed circuit board 1 by about 35 μm, and this step is eliminated.
In order to flatten the surface of the printed circuit board 1, the synthetic resin layer 10 is placed at the same height as the external connection terminals 4 and the conductor wires 3 so as to cover the areas where the external connection terminals 4 and the conductor wires 3 are not formed. established in
このようなプリント基板１を、第５図に示され
るようにプリント基板１と同一厚みを有するセン
ターコアシート５（ポリ塩化ビニル等の熱可塑性
合成樹脂よりなる）に設けられている穴１３に嵌
め込み、さらに透明な熱可塑性合成樹脂（例えば
ポリ塩化ビニル）よりなるオーバーシート６，７
をセンターコアシート５に重ね合わせて公知の方
法で加熱加圧することによりセンターコアシート
５にオーバーシート６，７が熱融着又は熱接着し
て本考案にかかるカードを形成することができ
る。 As shown in FIG. 5, such a printed circuit board 1 is fitted into a hole 13 provided in a center core sheet 5 (made of thermoplastic synthetic resin such as polyvinyl chloride) having the same thickness as the printed circuit board 1. , and an oversheet 6,7 made of a transparent thermoplastic synthetic resin (for example, polyvinyl chloride).
The oversheets 6 and 7 are superimposed on the center core sheet 5 and heated and pressed by a known method, whereby the oversheets 6 and 7 are thermally fused or bonded to the center core sheet 5 to form a card according to the present invention.
なお、１２は透孔であり、プリント基板１に設
けられている外部接続端子４を外部機器と接続す
るために設けられている。 Note that 12 is a through hole, which is provided for connecting the external connection terminal 4 provided on the printed circuit board 1 to an external device.
ここで、集積回路２をプリント基板１に取りつ
ける手段及びプリント基板１をカードのセンター
コアシート５に取りつける手段として各々プリン
ト基板１及びセンターコアシート５に穴を穿ち、
この穴に嵌め込む形態について説明したが、これ
に限定されることなく、プリント基板１及びセン
ターコアシート５に凹部を形成し、この凹部に
各々集積回路２及びプリント基板１を取りつける
形態であつても良く、要は取りつけ後の表面状態
が平面性を維持していれば良い。 Here, as a means for attaching the integrated circuit 2 to the printed circuit board 1 and a means for attaching the printed circuit board 1 to the center core sheet 5 of the card, holes are bored in the printed circuit board 1 and the center core sheet 5, respectively.
Although the embodiment has been described in which the printed circuit board 1 and the center core sheet 5 are fitted into the holes, the present invention is not limited to this. In short, it is sufficient that the surface condition after installation maintains flatness.
また、段差を解消するための合成樹脂層１０と
して熱硬化性の合成樹脂をその素材に用いること
が好ましく、例えばエポキシ樹脂（エマーソン・
アンド・カミング・ジヤパン（株）の
STYCAST2762等）を用いることができる。熱
硬化性合成樹脂を用いることによりセンターコア
シートとオーバーシートとを熱融着又は熱接着す
るときの加熱加圧条件（例えば100℃、30Kg／cm2）
の下でもこの樹脂が軟化することなく十分の平面
性を保ち得、所期の目的を良好に達成することが
できる。 Further, it is preferable to use a thermosetting synthetic resin as the material for the synthetic resin layer 10 to eliminate the step difference, for example, epoxy resin (Emerson,
And Coming Japan Co., Ltd.
STYCAST2762 etc.) can be used. Heat and pressure conditions when thermally fusing or thermally adhering the center core sheet and oversheet using thermosetting synthetic resin (for example, 100°C, 30Kg/cm 2 )
Even under such conditions, this resin can maintain sufficient flatness without softening, and the intended purpose can be satisfactorily achieved.
かかる合成樹脂層１０を設ける方法としては、
プリント基板１を水平面上に置き、導線３等が形
成されている表面に液状の合成樹脂を滴下した
後、ガラス板又は鏡面状若しくは鏡面にできるだ
け近い平滑面（例えば鉄板、テフロン板等）をそ
の上に載置して荷重をかけるか、或いは滴下した
樹脂をスキージで引けば、それらが導線３等の表
面（頂面）と同一表面となるように凹部を埋める
合成樹脂層１０を形成することができる。 As a method for providing such a synthetic resin layer 10,
Place the printed circuit board 1 on a horizontal surface, drop liquid synthetic resin onto the surface on which the conductive wires 3, etc. are formed, and then place a glass plate or a mirror-like or as close to a mirror-like smooth surface as possible (for example, a steel plate, a Teflon plate, etc.) on the surface. By placing the resin on top and applying a load, or by pulling the dropped resin with a squeegee, a synthetic resin layer 10 is formed that fills the recess so that the resin is flush with the surface (top surface) of the conductor 3, etc. I can do it.
第４図に他の実施例を示す。第４図において、
合成樹脂層１０は外部接続端子４部分を除いて導
線３をも披覆するように設けられる点が第３図に
示した実施例と異なつている。このとき合成樹脂
層１０の表面が平担面であることはもちろんであ
る。 FIG. 4 shows another embodiment. In Figure 4,
This embodiment differs from the embodiment shown in FIG. 3 in that the synthetic resin layer 10 is provided so as to cover the conductive wire 3 except for the external connection terminal 4 portion. At this time, it goes without saying that the surface of the synthetic resin layer 10 is a flat surface.
このように合成樹脂層１０を形成するにおいて
は、外部接続端子４表面が合成樹脂により被覆さ
れないように注意する必要がある。このために、
合成樹脂層１０形成にあつては、予め外部接続端
子４表面部分のみ剥離性を有する樹脂（又はイン
キ）をスクリーン印刷法等で形成するか、或いは
剥離性を有する接着剤で外部接続端子４と同一形
状の薄板を貼りつける等の工程を施して滴下した
樹脂が外部接続端子４表面に付着しないように
し、かつこれらの肉厚と同一の樹脂薄膜が導線３
表面を覆つて形成されるように第３図に示した実
施例のものを製造する方法と同様の方法で滴下さ
れた樹脂を全面に行き渡らせ、樹脂を硬化させた
後外部接続端子４表面を覆つている印刷層又は薄
板を剥離して取り除けば、外部接続端子４表面の
みを露出させることができる。 When forming the synthetic resin layer 10 in this manner, care must be taken to ensure that the surface of the external connection terminal 4 is not covered with the synthetic resin. For this,
When forming the synthetic resin layer 10, a removable resin (or ink) is formed on the surface of the external connection terminal 4 using a screen printing method, or a releasable adhesive is used to connect the external connection terminal 4 with the external connection terminal 4. A process such as pasting a thin plate of the same shape is applied to prevent the dropped resin from adhering to the surface of the external connection terminal 4, and a thin resin film with the same thickness as these is applied to the conductor 3.
The dropped resin is spread over the entire surface in the same manner as the method of manufacturing the embodiment shown in FIG. By peeling off and removing the covering printed layer or thin plate, only the surface of the external connection terminal 4 can be exposed.
このような構成のプリント基板は第３図に示さ
れたものと同様、センターコアに取りつけられ、
さらにオーバーシートが積層されて本考案にかか
るカードを得ることができる。 A printed circuit board with such a configuration is attached to the center core, similar to the one shown in FIG.
Further, an oversheet can be laminated to obtain a card according to the present invention.
以上に述べたように、本考案にかかる集積回路
内蔵カードはプリント基板表面の凹凸形状が解消
され、従つてこの凹凸形状に起因して発生してい
たカード表面の凹凸を無くすることができ、品質
的に極めて優れているものである。 As described above, in the card with a built-in integrated circuit according to the present invention, the unevenness on the surface of the printed circuit board is eliminated, and therefore, the unevenness on the card surface caused by the unevenness can be eliminated. It is extremely excellent in quality.
第１図は集積回路が取りつけられたプリント基
板を示すものであり、同図イはその平面図、同図
ロはＩ−Ｉ線における断面を示す説明図、第２図
は従来のカードの断面の状態を示す説明図、第３
図は本考案の一実施例の断面を示す説明図、第４
図は本考案の他の実施例の断面を示す説明図、第
５図は本考案にかかるカードの断面を示す説明図
である。
１……プリント基板、２……集積回路、３……
導線、４……外部接続端子、５……センターコア
シート、６，７……オーバーシート、１０……合
成樹脂層。
Fig. 1 shows a printed circuit board on which an integrated circuit is mounted, A is a plan view thereof, B is an explanatory diagram showing a cross section taken along line I-I, and Fig. 2 is a cross section of a conventional card. Explanatory diagram showing the state of
The figure is an explanatory diagram showing a cross section of one embodiment of the present invention.
The figure is an explanatory diagram showing a cross section of another embodiment of the present invention, and FIG. 5 is an explanatory diagram showing a cross section of a card according to the present invention. 1...Printed circuit board, 2...Integrated circuit, 3...
Conductor wire, 4...external connection terminal, 5...center core sheet, 6, 7...oversheet, 10...synthetic resin layer.
Claims (1)
プリント基板の表面を合成樹脂にて被覆するこ
とにより該表面を平坦面となし、このプリント
基板をその表面がセンターコアシートの表面と
同一平面内に位置するようにセンターコアシー
トに設けられている凹部若しくは穴に配設し、
さらにプリント基板が配設されたセンターコア
シートの両面にオーバーシートを積層してなる
集積回路内蔵カード。 (2) 前記合成樹脂が熱硬化性合成樹脂である実用
新案登録請求の範囲第１項記載の集積回路内蔵
カード。 (3) 前記熱硬化性合成樹脂がエポキシ樹脂である
実用新案登録請求の範囲第２項記載の集積回路
内蔵カード。[Claims for Utility Model Registration] (1) The surface of a printed circuit board in which an integrated circuit is incorporated and conductive wires are arranged is coated with synthetic resin to make the surface flat; disposed in a recess or hole provided in the center core sheet so that the surface is located in the same plane as the surface of the center core sheet,
A card with a built-in integrated circuit made by laminating oversheets on both sides of a center core sheet with a printed circuit board. (2) The card with a built-in integrated circuit according to claim 1, wherein the synthetic resin is a thermosetting synthetic resin. (3) The card with a built-in integrated circuit according to claim 2, wherein the thermosetting synthetic resin is an epoxy resin.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9968383U JPS6082359U (en) | 1983-06-27 | 1983-06-27 | Card with built-in integrated circuit |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9968383U JPS6082359U (en) | 1983-06-27 | 1983-06-27 | Card with built-in integrated circuit |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6082359U JPS6082359U (en) | 1985-06-07 |
| JPH049649Y2 true JPH049649Y2 (en) | 1992-03-10 |
Family
ID=30236134
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP9968383U Granted JPS6082359U (en) | 1983-06-27 | 1983-06-27 | Card with built-in integrated circuit |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6082359U (en) |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5556639A (en) * | 1978-10-19 | 1980-04-25 | Cii | Strip for carrying device for processing electric signal and method of manufacturing same |
| JPS5748175A (en) * | 1980-07-09 | 1982-03-19 | Philips Nv | Portable identifying structure |
| JPS5752977A (en) * | 1980-08-07 | 1982-03-29 | Gao Ges Automation Org | Identifying card and method of producing same |
| JPS5812082A (en) * | 1981-04-14 | 1983-01-24 | ガ−ア−オ−・ゲゼルシヤフト・フユ−ル・アウトマチオン・ウント・オルガニザチオン・エム・ベ−・ハ− | Data carrier for identification card or the like |
| JPS5827287A (en) * | 1981-07-30 | 1983-02-17 | シ−メンス・アクチエンゲゼルシヤフト | Portable card for processing information |
| JPS5941092A (en) * | 1982-08-31 | 1984-03-07 | Sony Corp | Data card |
-
1983
- 1983-06-27 JP JP9968383U patent/JPS6082359U/en active Granted
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5556639A (en) * | 1978-10-19 | 1980-04-25 | Cii | Strip for carrying device for processing electric signal and method of manufacturing same |
| JPS5748175A (en) * | 1980-07-09 | 1982-03-19 | Philips Nv | Portable identifying structure |
| JPS5752977A (en) * | 1980-08-07 | 1982-03-29 | Gao Ges Automation Org | Identifying card and method of producing same |
| JPS5812082A (en) * | 1981-04-14 | 1983-01-24 | ガ−ア−オ−・ゲゼルシヤフト・フユ−ル・アウトマチオン・ウント・オルガニザチオン・エム・ベ−・ハ− | Data carrier for identification card or the like |
| JPS5827287A (en) * | 1981-07-30 | 1983-02-17 | シ−メンス・アクチエンゲゼルシヤフト | Portable card for processing information |
| JPS5941092A (en) * | 1982-08-31 | 1984-03-07 | Sony Corp | Data card |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6082359U (en) | 1985-06-07 |
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