JPH0491884A - Laser beam machine - Google Patents

Laser beam machine

Info

Publication number
JPH0491884A
JPH0491884A JP2207616A JP20761690A JPH0491884A JP H0491884 A JPH0491884 A JP H0491884A JP 2207616 A JP2207616 A JP 2207616A JP 20761690 A JP20761690 A JP 20761690A JP H0491884 A JPH0491884 A JP H0491884A
Authority
JP
Japan
Prior art keywords
holding member
groove
workpiece material
slit
work table
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2207616A
Other languages
Japanese (ja)
Inventor
Naohisa Matsushita
直久 松下
Shusaku Nishiyama
秀作 西山
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujitsu Ltd
Original Assignee
Fujitsu Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujitsu Ltd filed Critical Fujitsu Ltd
Priority to JP2207616A priority Critical patent/JPH0491884A/en
Publication of JPH0491884A publication Critical patent/JPH0491884A/en
Pending legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/08—Devices involving relative movement between laser beam and workpiece
    • B23K26/083—Devices involving movement of the workpiece in at least one axial direction
    • B23K26/0838—Devices involving movement of the workpiece in at least one axial direction by using an endless conveyor belt
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/70—Auxiliary operations or equipment
    • B23K26/702—Auxiliary equipment
    • B23K26/704—Beam dispersers, e.g. beam wells

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • Laser Beam Processing (AREA)

Abstract

PURPOSE:To maintain specified processing conditions by forming a groove- shaped space having a slit-like aperture in work holding members by means of plural revolving rollers. CONSTITUTION:An X-table 18 is driven in an X direction. A work table 10 having a U-shaped section driven in a Y direction is provided thereon. The work holding members 11 which are fixed at both ends and have flexibility are provided at both ends of the work table 10. Four pieces of the revolving rollers 12-1 to 12-4 are supported via supporting members 25, 25' on the X table 18. The groove-shaped space 15 having the slit-shaped aperture 14 in the work holding members 11 is formed of 4 pieces of the revolving rollers 12-1 to 12-4. Contribution is made to the improvement of the quality in laser cutting of sheets in this way.

Description

【発明の詳細な説明】 〔概　要〕 金属や樹脂等の薄板を切断するためのレーザ加工装置に
関し、 レーザ切断により生じた溶融物が被加工材料の裏面に付
着し切断品質を低下させるのを防止することを目的とし
、 Ｘ方向に駆動されるＸテーブルと、該Ｘテーブル上に設
けられ、Ｘ方向に駆動される断面Ｕ字形のワークテーブ
ルと、該ワークテーブルの両端に、両端が固定された可
撓性を有する被加工材料保持部材と、前記Ｘテーブルに
支持部材を介して支持された４本のローラとよりなり、
該４本のローラで前記液加］ユ材料保持部材にスリット
状の開口部を有する溝状の空間を形成してなるように構
成する。[Detailed Description of the Invention] [Summary] Regarding a laser processing device for cutting thin plates of metal, resin, etc., it is possible to prevent molten material generated by laser cutting from adhering to the back side of the workpiece material and reducing cutting quality. In order to prevent this, an and a workpiece material holding member having flexibility, and four rollers supported by the X table via support members,
The four rollers form a groove-like space having a slit-like opening in the material holding member.

〔産業上の利用分野〕[Industrial application field]

本発明は金属や樹脂等の薄板を切断するためのレーザ加
工装置に関する。The present invention relates to a laser processing device for cutting thin plates of metal, resin, etc.

〔従来の技術〕[Conventional technology]

レーザ加工装置はＮＣ装置と組み合わされて、板金や樹
脂板の切断に広く用いられている。これらの加工では、
加工装置のワークテーブルに被加工材料である板材を載
せて加工を行なうのが通常である。そして、このワーク
テーブルには切断品質の低下を防ぐた袷に、■板材を反
らさずに水平に保持できること、■切断時に吹きつける
酸素等のアシストガスが板材下面に安定して排出できる
こと、■切断時に発生する溶融物の排出を妨げないこと
、■切断時に板材と融着しないこと、等の機能が要求さ
れる。Laser processing equipment is widely used in combination with NC equipment to cut sheet metal and resin plates. In these processes,
Normally, processing is carried out by placing a plate material, which is the material to be processed, on a work table of a processing device. In order to prevent deterioration in cutting quality, this work table has two features: (1) to be able to hold the board horizontally without warping, and (2) to be able to stably discharge assist gas such as oxygen to the bottom surface of the board that is blown during cutting. The following functions are required: (1) not to obstruct the discharge of molten material generated during cutting; and (2) not to fuse with the plate material during cutting.

このたｔ従来のレーザ加工装置では、第４図（ａ）に示
すよう多数の針１が台２に植設された剣山とか、第４図
（ｂ）に示すような格子３を有する治具４上に板材５を
載せて加工する方法がとられている。On the other hand, in the conventional laser processing apparatus, a jig having a lattice 3 as shown in FIG. 4(b), a sword mount in which a large number of needles 1 are planted on a stand 2 as shown in FIG. 4(a), A method is used in which a plate material 5 is placed on top of the material 4.

〔発明が解決しようとする課題〕[Problem to be solved by the invention]

上記従来の剣山や格子治具では、アシストガスや溶融物
の排出を防げないとか、切断時に板材と融着しないとい
った要求から針１や格子３の間隔を狭くすることは困難
であった。It has been difficult to narrow the spacing between the needles 1 and the lattice 3 with the above-mentioned conventional sword mounts and lattice jigs because they do not prevent the discharge of assist gas and molten material, and do not fuse with the plate material during cutting.

従って、０．数ｍｌ１１程度以下の薄板の切断加工の場
合には、アンストガスの吹きつけ力によって板材が変形
してしまい、レーザの焦点位置がずれるなど安定した加
工が行なえないという問題が生じていた。また針１や格
子３と接触している部分を加工する場合には、切断によ
り形成された溝部から板材下面側に抜けるアシストガス
の流れが乱れ溶融物が板材下面に付着し易くなったり、
溶融物が跳ね返り板材裏面に付着してしまうという問題
もあった。Therefore, 0. In the case of cutting a thin plate of several milliliters or less, the plate material is deformed by the blowing force of the unstrung gas, causing problems such as shifting of the focal position of the laser and the inability to perform stable processing. Furthermore, when processing the parts that are in contact with the needles 1 and the grid 3, the flow of assist gas that escapes from the grooves formed by cutting to the lower surface of the plate may be disrupted, making it easier for molten material to adhere to the lower surface of the plate.
There was also the problem that the molten material would bounce back and adhere to the back side of the plate material.

本発明は上記従来の問題点に鑑み、レーザ切断により生
じた溶融物が被加工材料の裏面に付着して切断品質を低
下させるのを防止可能としたレーザ加工装置を提供する
ことを目的とする。In view of the above-mentioned conventional problems, an object of the present invention is to provide a laser processing device that can prevent melted material generated by laser cutting from adhering to the back surface of a workpiece material and reducing cutting quality. .

〔課題を解決するための手段〕[Means to solve the problem]

第１図は本発明の原理説明図である。 FIG. 1 is a diagram explaining the principle of the present invention.

本発明のレーザ加工装置は、同図に示すようにＵ字状を
なすワークテーブル１０の両端に金属又は樹脂等の可撓
性を有する薄板で形成された被加工材料保持部材１１の
両端が固定され、さらに該被加工材料保持部材１１は、
ワークテーブル１０とは別の固定系に支持された回転ロ
ーラ１２−１〜１２−２によりレーザ照射部１３の真下
にスリット状開口部１４を有する溝状の空間１５が形成
されるように屈曲支持されている。またワークテーブル
１１はモータ１６により回転される送りねじ１７により
図示なきレール上を駆動され移動できるようになってい
る。As shown in the figure, in the laser processing apparatus of the present invention, both ends of a workpiece holding member 11 formed of a flexible thin plate such as metal or resin are fixed to both ends of a U-shaped work table 10. Further, the workpiece material holding member 11 is
Rotating rollers 12-1 to 12-2 supported by a fixed system separate from the work table 10 are bent and supported so that a groove-shaped space 15 having a slit-shaped opening 14 is formed directly below the laser irradiation section 13. has been done. Further, the work table 11 is driven and moved on a rail (not shown) by a feed screw 17 rotated by a motor 16.

〔作　用〕[For production]

ローラ１２−１〜１２−１がワークテーブル１０とは別
の固定系に支持されているため、ワークテーブル１０が
第１図（ａ）の状態か第１図（ｂ）の状態に移動しても
、被加工材料保持部材１１にはレーザ照射部１３の位置
に常に一定の溝状の空間１５を保つことが可能となり、
安定した加工状態を維持することができる。Since the rollers 12-1 to 12-1 are supported by a fixed system separate from the work table 10, the work table 10 can move to the state shown in FIG. 1(a) or the state shown in FIG. 1(b). Also, it is possible to always maintain a constant groove-shaped space 15 at the position of the laser irradiation part 13 in the workpiece material holding member 11,
Stable processing conditions can be maintained.

〔実施例〕〔Example〕

第２図は本発明の実施例を示す図である。 FIG. 2 is a diagram showing an embodiment of the present invention.

本実施例はＸ−Ｙテーブル駆動型レーザ加工装置である
。同図において、１８はモータＩ９で回転される送りね
じ２０でレール２１上をｘ−ｘ’方向に駆動されるＸテ
ーブノベ１０は該Ｘテーブル１８に固定されたモータ１
６により回転される送りねじ１７によりレール２２上を
Ｙ−Ｙ’方向に駆動されるワークテーブルベ２３はレー
ザ発振器、２４はレーザ集光用レンズやアシストガス噴
出機能を有する加工ヘッドである。そして前記ワークテ
ーブル１０はＵ字状をなし、その両端に金属又は樹脂等
の可撓性を有する薄板、例えばステンレス薄板又は樹脂
フィルムからなる被加工材料保持部材１１０両端が固定
されている。さらに該被加工材料保持部材１１はその中
間をワークテーブル１０とは別の固定系であるＸテーブ
ル１８に固定されたブラヶッ）２５．２５’　に支持さ
れた４本の回転ローラ１２−１〜１２−４により屈曲支
持され、レーザ照射部１３の真下にスリット状開口部１
４を有する凹状の空間１５を形成している。This embodiment is an X-Y table driven laser processing apparatus. In the figure, reference numeral 18 indicates a feed screw 20 rotated by a motor I9, and an
A work table 23 driven in the Y-Y' direction on a rail 22 by a feed screw 17 rotated by 6 is a laser oscillator, and 24 is a processing head having a laser focusing lens and an assist gas jetting function. The work table 10 has a U-shape, and both ends of a workpiece holding member 110 made of a flexible thin plate of metal or resin, such as a stainless steel plate or a resin film, are fixed at both ends. Further, the workpiece material holding member 11 has four rotary rollers 12-1 to 12 supported in the middle thereof by a bracket 25.25' fixed to an X table 18 which is a fixed system separate from the work table 10. -4 is bent and supported, and a slit-shaped opening 1 is provided directly below the laser irradiation part 13.
A concave space 15 having a diameter of 4 is formed.

このように構成された本実施例は、被加工材料保持部材
１１の上に被加工材料を載ｔ＃′、レーザ加工ヘッド２
４により加−１−するとき、被加工材料をＹ又はＹ′方
向に移動すべくワ　りｉ−プルＩＩＹ又はＹ′方向に移
動しても、被加］−材料は移動４″るが、被加工材料保
持部材１１に「η転ローラ１２−１〜１２−２に、よっ
て形成されている溝状の空間１５及びスリット状開口部
１４は、該回転ローラ１２−１〜・１２１がＸテーブル
１８に固定されたブラケット２５．２５’　に支持さｔ
ｌでいるたｌ）その位置は動かない。また被加工材料を
Ｘ又はＸ′力方向移動づべくＸテーブル１８をＸ又はＸ
′力方向移動しても、その移動方向は被加工材料保持部
材１１のスリット状開Ｌ］部１４の長手方向であるので
、該スリット状開口部１４は被加工ｖＪ籾をどの方向に
移動しても常にＩ／−ザ加Ｌヘッド２４の直）゛にある
ことになる。従って加工時のアシストガスや溶融物は何
ものにも妨げられずに溝状の空間１５に排出され、溶融
物が被加工材料の裏面に付着することはない。In this embodiment configured in this way, the workpiece material is placed on the workpiece material holding member 11, and the laser processing head 2
4, even if the workpiece material is moved in the Y or Y' direction, even if the material is moved in the Y or Y' direction, The groove-shaped space 15 and slit-shaped opening 14 formed by the η rolling rollers 12-1 to 12-2 in the workpiece material holding member 11 are such that the rotating rollers 12-1 to 121 are connected to the X table. supported by a bracket 25.25' fixed to 18
If it is at l) its position will not move. In addition, in order to move the workpiece material in the X or X' force direction, the X table 18 is
Even if it moves in the force direction, the direction of movement is in the longitudinal direction of the slit-like opening L] portion 14 of the workpiece material holding member 11, so the slit-like opening 14 does not move the workpiece vJ paddy in which direction. However, the I/-L head 24 is always located directly in front of it. Therefore, the assist gas and melted material during processing are discharged into the groove-shaped space 15 without being hindered by anything, and the melted material does not adhere to the back surface of the material to be processed.

第３図は本発明の他の実施例の要部を示す図である。FIG. 3 is a diagram showing essential parts of another embodiment of the present invention.

本実施例の構成は基本的には前実施例と同様であり、異
なるところは、被加工材料保持部材１１が４本の回転ロ
ーラ１２−１〜１２−一、によって形成された溝状の空
間１５の中に集塵用ノズル２６を設けたことである。The configuration of this embodiment is basically the same as that of the previous embodiment, and the difference is that the workpiece material holding member 11 has a groove-shaped space formed by four rotating rollers 12-1 to 12-1. 15 is provided with a dust collecting nozzle 26.

本実施例によれば、前実施例と同様な作用効果を有する
上、集塵用ノズル２６にまり常に一定の位置で溶融物を
集塵することができる。According to this embodiment, in addition to having the same functions and effects as those of the previous embodiment, the molten material can be collected in the dust collection nozzle 26 and always at a fixed position.

［発明の効果］ 以上説明した様に、本発明によれば、レーザ加工ヘッド
の直下に形成された被加工材料保持部材のスリット状開
口部を移動させずに被加工材料を移動させることが可能
となり、加工条件を一定に保つことが可能となる。また
常にレーザ照射付蓋において、被加工材料と被加工材料
保持部材との摺触がないため、両者が溶着することがな
く、また溶融物の跳ね返りによる被加工材料への付着を
防止することができ、薄板のレーザ切断加工にお（Ｊる
品質の向１：、に寄与するところ大である。[Effects of the Invention] As explained above, according to the present invention, it is possible to move the workpiece material without moving the slit-shaped opening of the workpiece material holding member formed directly below the laser processing head. This makes it possible to keep the machining conditions constant. In addition, in the lid with laser irradiation, there is no sliding contact between the workpiece material and the workpiece material holding member, so there is no welding of the two, and it is possible to prevent the melt from rebounding and adhering to the workpiece material. This greatly contributes to the quality improvement of thin plate laser cutting.

【図面の簡単な説明】[Brief explanation of the drawing]

第１図は本発明の原理説明図、 第２図は本発明の実施例を示す図、 第３図は本発明の他の実施例の要部を示す図、第４図は
従来のレーザ加工、装置の加］−］治具を示ず図である
。 図において、 １０はワークテーブノベ １１は被加工材料保持部材、 １２〜１〜１２〜．は回転ローラ、 １３はレーザ照射部、 １４はスリット状開口部、 １５は溝状の空間、 １．６．１９はモータ、 １７＝２０は送りねじ、 １８はｘ−ｙ−ブノベ ２１．２２はレール、 ２３はレーザ発振器、 ２４は加工ヘッド、 ２５４２５’　はブラケット、 ２６は集塵ノズル、 を示す。Fig. 1 is a diagram explaining the principle of the present invention, Fig. 2 is a diagram showing an embodiment of the invention, Fig. 3 is a diagram showing main parts of another embodiment of the invention, and Fig. 4 is a diagram showing conventional laser processing. , addition of the apparatus]-] is a diagram without showing the jig. In the figure, 10 is a work table top 11 is a workpiece material holding member, 12-1-12-. is a rotating roller, 13 is a laser irradiation part, 14 is a slit-shaped opening, 15 is a groove-shaped space, 1.6.19 is a motor, 17=20 is a feed screw, 18 is an x-y-bnobe 21.22 is 23 is a laser oscillator, 24 is a processing head, 25425' is a bracket, and 26 is a dust collection nozzle.

Claims (1)

【特許請求の範囲】 １、Ｘ方向に駆動されるＸテーブル（１８）と、該Ｘテ
ーブル（１８）上に設けられ、Ｙ方向に駆動される断面
Ｕ字形のワークテーブル（１０）と、該ワークテーブル
（１０）の両端に、両端が固定された可撓性を有する被
加工材料保持部材（１１）と、前記Ｘテーブル（１８）
に支持部材を介して支持された４本の回転ローラ（１２
−＿１〜１２−＿４）とよりなり、該４本の回転ローラ
（１２−＿１〜１２−＿４）で前記被加工材料保持部材
（１１）にスリット状の開口部（１４）を有する溝状の
空間（１５）を形成してなることを特徴とするレーザ加
工装置。 ２、上記被加工材料保持部材（１１）で形成された溝状
の空間（１５）内に集塵用ノズル（２６）を配設したこ
とを特徴とする請求項１記載のレーザ加工装置。[Claims] 1. An X table (18) driven in the X direction, a work table (10) with a U-shaped cross section provided on the X table (18) and driven in the Y direction, and A flexible workpiece material holding member (11) having both ends fixed to both ends of the work table (10), and the X table (18)
Four rotating rollers (12
-_1 to 12-_4), and the four rotating rollers (12-_1 to 12-_4) form a groove-like groove having a slit-like opening (14) in the workpiece material holding member (11). A laser processing device characterized by forming a space (15). 2. The laser processing apparatus according to claim 1, further comprising a dust collection nozzle (26) disposed within the groove-shaped space (15) formed by the workpiece material holding member (11).
JP2207616A 1990-08-07 1990-08-07 Laser beam machine Pending JPH0491884A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2207616A JPH0491884A (en) 1990-08-07 1990-08-07 Laser beam machine

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2207616A JPH0491884A (en) 1990-08-07 1990-08-07 Laser beam machine

Publications (1)

Publication Number Publication Date
JPH0491884A true JPH0491884A (en) 1992-03-25

Family

ID=16542745

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2207616A Pending JPH0491884A (en) 1990-08-07 1990-08-07 Laser beam machine

Country Status (1)

Country Link
JP (1) JPH0491884A (en)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2007028576A2 (en) 2005-09-06 2007-03-15 Trumpf Werkzeugmaschinen Gmbh + Co. Kg Beam catching device for a processing machine
WO2007028404A1 (en) * 2005-09-06 2007-03-15 Trumpf Werkzeugmaschinen Gmbh + Co. Kg Device for supporting sheet-like materials for at least one separating process
WO2007028403A1 (en) 2005-09-06 2007-03-15 Trumpf Werkzeugmaschinen Gmbh + Co. Kg Jet trapping device for a cutting machine
JP2009531190A (en) * 2006-03-29 2009-09-03 株式会社ディスコ Platform for supporting a workpiece to be cut from a sheet-like material and method for supporting the same
JP2018516760A (en) * 2015-06-12 2018-06-28 シューラー・オートメーション・ゲーエムベーハー・ウント・シーオー・カーゲーＳｃｈｕｌｅｒ Ａｕｔｏｍａｔｉｏｎ Ｇｍｂｈ ＆ Ｃｏ．Ｋｇ Equipment for cutting metal plates from metal strips

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS55106799A (en) * 1979-02-07 1980-08-15 Sugino Mach Device for cutting fluid with high pressure
JPH01140996A (en) * 1987-11-26 1989-06-02 Yamazaki Mazak Corp Work loader in linear cutting machine tool

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS55106799A (en) * 1979-02-07 1980-08-15 Sugino Mach Device for cutting fluid with high pressure
JPH01140996A (en) * 1987-11-26 1989-06-02 Yamazaki Mazak Corp Work loader in linear cutting machine tool

Cited By (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2007028576A2 (en) 2005-09-06 2007-03-15 Trumpf Werkzeugmaschinen Gmbh + Co. Kg Beam catching device for a processing machine
WO2007028404A1 (en) * 2005-09-06 2007-03-15 Trumpf Werkzeugmaschinen Gmbh + Co. Kg Device for supporting sheet-like materials for at least one separating process
WO2007028402A1 (en) * 2005-09-06 2007-03-15 Trumpf Werkzeugmaschinen Gmbh + Co. Kg Jet trapping device for a cutting machine
WO2007028403A1 (en) 2005-09-06 2007-03-15 Trumpf Werkzeugmaschinen Gmbh + Co. Kg Jet trapping device for a cutting machine
WO2007028576A3 (en) * 2005-09-06 2007-08-16 Trumpf Werkzeugmaschinen Gmbh Beam catching device for a processing machine
JP2010502442A (en) * 2005-09-06 2010-01-28 トルンプ・ヴェルクツォイクマシーネン・ゲーエム・ベーハー・ウント・コンパニ・カーゲー Beam capture device for processing machine
US7847215B2 (en) 2005-09-06 2010-12-07 Trumpf Werkzeugmaschinen Gmbh + Co. Kg Jet trapping in a cutting beam processing machine
US8028977B2 (en) 2005-09-06 2011-10-04 Trumpf Werkzeugmaschinen Gmbh + Co. Kg Device for supporting plate-like materials for at least one separating process
US8044321B2 (en) 2005-09-06 2011-10-25 Trumpf Werkzeugmaschinen Gmbh +Co. Kg Beam-catching device for a processing machine
JP2009531190A (en) * 2006-03-29 2009-09-03 株式会社ディスコ Platform for supporting a workpiece to be cut from a sheet-like material and method for supporting the same
JP2018516760A (en) * 2015-06-12 2018-06-28 シューラー・オートメーション・ゲーエムベーハー・ウント・シーオー・カーゲーＳｃｈｕｌｅｒ Ａｕｔｏｍａｔｉｏｎ Ｇｍｂｈ ＆ Ｃｏ．Ｋｇ Equipment for cutting metal plates from metal strips

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