JPH048784A - Heat-resistant tacky agent useful for taping and temporary fixation of electric part - Google Patents
Heat-resistant tacky agent useful for taping and temporary fixation of electric partInfo
- Publication number
- JPH048784A JPH048784A JP11148190A JP11148190A JPH048784A JP H048784 A JPH048784 A JP H048784A JP 11148190 A JP11148190 A JP 11148190A JP 11148190 A JP11148190 A JP 11148190A JP H048784 A JPH048784 A JP H048784A
- Authority
- JP
- Japan
- Prior art keywords
- adhesive
- heat
- carrier tape
- taping
- electronic components
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000853 adhesive Substances 0.000 claims abstract description 108
- 230000001070 adhesive effect Effects 0.000 claims abstract description 108
- 238000005476 soldering Methods 0.000 abstract description 12
- 239000003795 chemical substances by application Substances 0.000 abstract description 7
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 abstract description 4
- 229920001296 polysiloxane Polymers 0.000 abstract description 4
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 abstract 1
- 229910052710 silicon Inorganic materials 0.000 abstract 1
- 239000010703 silicon Substances 0.000 abstract 1
- 239000010410 layer Substances 0.000 description 15
- 238000000034 method Methods 0.000 description 10
- 229920006243 acrylic copolymer Polymers 0.000 description 9
- 229920005989 resin Polymers 0.000 description 9
- 239000011347 resin Substances 0.000 description 9
- 239000002390 adhesive tape Substances 0.000 description 6
- 238000012546 transfer Methods 0.000 description 6
- 238000010008 shearing Methods 0.000 description 5
- JOYRKODLDBILNP-UHFFFAOYSA-N Ethyl urethane Chemical compound CCOC(N)=O JOYRKODLDBILNP-UHFFFAOYSA-N 0.000 description 4
- 239000003522 acrylic cement Substances 0.000 description 4
- 239000003431 cross linking reagent Substances 0.000 description 4
- 229920001187 thermosetting polymer Polymers 0.000 description 4
- 238000000576 coating method Methods 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- 238000002156 mixing Methods 0.000 description 3
- 239000013464 silicone adhesive Substances 0.000 description 3
- 239000012790 adhesive layer Substances 0.000 description 2
- 235000013405 beer Nutrition 0.000 description 2
- 239000011248 coating agent Substances 0.000 description 2
- 239000000203 mixture Substances 0.000 description 2
- 239000011342 resin composition Substances 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- 241000283690 Bos taurus Species 0.000 description 1
- YCKRFDGAMUMZLT-UHFFFAOYSA-N Fluorine atom Chemical compound [F] YCKRFDGAMUMZLT-UHFFFAOYSA-N 0.000 description 1
- 239000004820 Pressure-sensitive adhesive Substances 0.000 description 1
- 230000008094 contradictory effect Effects 0.000 description 1
- 239000012050 conventional carrier Substances 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 230000003247 decreasing effect Effects 0.000 description 1
- 230000002950 deficient Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000011156 evaluation Methods 0.000 description 1
- 229910052731 fluorine Inorganic materials 0.000 description 1
- 239000011737 fluorine Substances 0.000 description 1
- 239000002952 polymeric resin Substances 0.000 description 1
- 229920003002 synthetic resin Polymers 0.000 description 1
- 238000012360 testing method Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/303—Surface mounted components, e.g. affixing before soldering, aligning means, spacing means
Landscapes
- Adhesives Or Adhesive Processes (AREA)
Abstract
Description
【発明の詳細な説明】
(産業上の利用分野)
本発明は、電子部品のテーピングおよび仮固定に使用す
る耐熱性粘着剤、特に粘着式キャリアテープを使った仮
固定用であってはんだ付けに耐える耐熱性粘着剤に関す
る。[Detailed Description of the Invention] (Industrial Application Field) The present invention relates to a heat-resistant adhesive used for taping and temporary fixing of electronic components, particularly for temporary fixing using adhesive carrier tape, and suitable for soldering. Concerning durable heat-resistant adhesives.
(従来の技術)
電子機器および電子応用装置等に用いる小型電子部品(
以下単に「電子部品Jという)をプリント基板へ載置す
る場合、自動装置によるテーピング方式が多く採用され
るようになってきた。テーピング、すなわち、適宜粘着
剤でもってキャリアテープに一時的に保持された一連の
電子部品を自動装置によって基板の所定位置に載せて仮
固定してゆくのである。(Prior technology) Small electronic components (
When mounting electronic components (hereinafter simply referred to as "electronic components J") on a printed circuit board, a taping method using automatic equipment is increasingly being adopted. A series of electronic components are then placed on predetermined positions on the board and temporarily fixed using automated equipment.
このような従来の粘着式キャリアーテープの粘着剤は、
テーピングされた後の電子部品に粘着剤を付着させない
ことが必要であった。この理由は、電子部品をプリント
基板に載置する場合に、VV硬化型接着剤、熱硬化型接
着剤等の接着剤で接着するからである。キャリアテープ
から離脱させた電子部品に粘着剤が残っていると、粘着
剤面と接着剤が接し、強固な接着ができず、はんだ付は
時の高温で接着剤の電子部品への接着力が低下し、はん
だ付は不良が生しることがある。したがって、電子部品
に粘着剤が付着しないように、従来のキャリアテープで
は粘着剤の基材付着面には剥離層を設けていなかった。The adhesive of such conventional adhesive carrier tape is
It was necessary to prevent the adhesive from adhering to the electronic components after they were taped. The reason for this is that when electronic components are mounted on a printed circuit board, they are bonded with an adhesive such as a VV curable adhesive or a thermosetting adhesive. If adhesive remains on electronic components that have been removed from the carrier tape, the adhesive surface will come into contact with the adhesive, making it impossible to form a strong bond, and the high temperatures during soldering may reduce the adhesive strength of the adhesive to the electronic components. This may lead to poor soldering. Therefore, in order to prevent the adhesive from adhering to electronic components, conventional carrier tapes do not have a release layer on the surface to which the adhesive is attached to the base material.
すなわち、従来の粘着式キャリアテープにおいでは、テ
ーピングされた後にテープから離脱させる際に粘着剤が
電子部品に付着しないことが必要であった。このためε
IAJ規格1?C−1011の電子部品のテーピング方
法(粘着式)において、粘着式テーピング(TJ321
20,1984.9制定)は穴明の支持体の裏面に全面
に粘着剤を塗布した部品粘着用テープを貼りつけたもの
で、穴の部分の表面ムこ電子部品をテーピングする。な
お、実用的には、支持体表面に電子部品をテーピングし
た後にカバーテープを貼りキャリアテープからの電子部
品の脱落を防止している。また、穴明の支持体から部品
粘着用テープを剥す時の剥離強さを、粘着用テープから
の電子部品の剥離強度として規定し、粘着用テープ幅6
.21に対し0.2〜0.7N (約20〜70gf)
、165〜180°で剥離速度が毎分300 mmと規
定されている。しかし、ビール剥離強度を示してはいる
が、引張り、剪断による剥離強度は規定されていない。That is, in conventional adhesive carrier tapes, it is necessary that the adhesive does not adhere to electronic components when the electronic components are removed from the tape after being taped. For this reason, ε
IAJ standard 1? In C-1011 electronic component taping method (adhesive type), adhesive taping (TJ321
20, enacted September 1984) is a device in which component adhesive tape coated with adhesive is applied to the back of a support with a hole, and electronic components are taped to the surface of the hole. Note that, practically, after taping the electronic components to the surface of the support, a cover tape is applied to prevent the electronic components from falling off the carrier tape. In addition, the peel strength when peeling the component adhesive tape from the perforated support is defined as the peel strength of the electronic component from the adhesive tape, and the adhesive tape width 6
.. 0.2-0.7N (approximately 20-70gf) for 21
, 165-180° and a peeling rate of 300 mm/min. However, although beer peel strength is indicated, peel strength due to tension and shearing is not specified.
これは電子部品に粘着剤を付着させたま−取り外すこと
がないためであろう。従来、電子部品を取り外し、プリ
ント基板に載置する場合には、UV硬化型接着剤、熱硬
化型接着剤等の接着剤で接着していたからである。This is probably because the adhesive does not need to be removed once it is attached to the electronic component. This is because conventionally, when an electronic component is removed and placed on a printed circuit board, it is bonded with an adhesive such as a UV curable adhesive or a thermosetting adhesive.
(発明が解決しようとする課題)
しかしながら、従来のようにテーピングと接着剤塗布と
を別々に行う方式には工程が増えることと、接着剤を硬
化させた後では仮接着した時に正しい位置に載置できな
かった電子部品を容易に再剥離できないというように接
着剤それ自体の特性不十分という欠点がみられる。(Problem to be solved by the invention) However, the conventional method of performing taping and adhesive application separately requires more steps, and after the adhesive has hardened, it is difficult to place the tape in the correct position when temporarily bonding. The disadvantage is that the adhesive itself has insufficient properties, such as the fact that electronic components that could not be placed cannot be easily re-peeled.
したがって、キャリアテープから離脱させる際粘着剤を
電子部品底部に転着させ2、この耐熱性粘着剤を電子部
品底部に付着させたままプリント基板に載置して仮止め
を行い、次いではんだ付けを行う方法が提案されている
。かかる粘着剤転着方式においては、UV硬化型接着剤
または熱硬化型接着剤を使用する必要はないが、電子部
品に耐熱性粘着剤を付着させたまま粘着式キアリャーテ
ープから剥離する必要がある。Therefore, when detaching from the carrier tape, the adhesive is transferred to the bottom of the electronic component 2, and with this heat-resistant adhesive attached to the bottom of the electronic component, it is placed on a printed circuit board for temporary fixing, and then soldered. A method is proposed. In such an adhesive transfer method, it is not necessary to use a UV-curable adhesive or a thermosetting adhesive, but it is necessary to peel the heat-resistant adhesive from the adhesive carrier tape while keeping the heat-resistant adhesive attached to the electronic component. be.
このため粘着式テープの耐熱性粘着剤の塗布面には粘着
剤の剥離を容易にするための剥離層を設ける必要がある
。この場合、剥離が軽すぎると、電子部品をテーピング
するときやテーピング後に電子部品が脱落してしまう。For this reason, it is necessary to provide a release layer on the surface of the adhesive tape coated with a heat-resistant adhesive to facilitate the peeling of the adhesive. In this case, if the peeling is too light, the electronic component will fall off when or after taping the electronic component.
一方、剥離するための力が余り大きすぎるとキャリアテ
ープから電子部品を取り外す場合に、現在市場で使用さ
れている表面実装機では容易に取り外すことが困難とな
ることになる。On the other hand, if the peeling force is too large, it will be difficult to easily remove the electronic component from the carrier tape using surface mounting machines currently in use on the market.
このように粘着剤転着方式にはいくつかの提案がすでに
なされているが、それらはいずれも実用的とはいえなか
った。As described above, several proposals have already been made for adhesive transfer methods, but none of them can be said to be practical.
例えば実開昭58−85397号公報には、両面接着体
を電子部品とテープとの間に介在させ、テープ側の粘着
層の接着力を電子部品側のそれより小さくすることによ
りテープからの離脱の際、両面接着体を電子部品底面に
付着させようとするアイデアが開示されているが、はん
だ付は時に上記両面接着体が残ることになりはんだ付は
不良は免れず、またそのような都合のよい接着力を備え
た両面接着体の具体的開示がなく、実現可能とは云えな
い。For example, in Japanese Utility Model Application Publication No. 58-85397, a double-sided adhesive is interposed between the electronic component and the tape, and the adhesive force of the adhesive layer on the tape side is made smaller than that on the electronic component side, so that the adhesive layer can be easily separated from the tape. The idea of attaching a double-sided adhesive to the bottom of an electronic component has been disclosed, but when soldering, the double-sided adhesive sometimes remains, and soldering is inevitably defective. There is no specific disclosure of a double-sided adhesive body with good adhesive strength, and it cannot be said that it is possible to realize it.
特開昭59−23597号公報にも同様のアイデアが開
示されているが、両面接着剤(体)についての具体的開
示はない。Although a similar idea is disclosed in JP-A-59-23597, there is no specific disclosure regarding the double-sided adhesive (body).
特開昭59−194498号公報にはキャリアテープと
してエンボス型のものを使用しているが、電子部品を離
脱させるときに電子部品に粘着剤が転着するとともにそ
の粘着剤を使って基板に固定するとのアイデアが示され
ている。しかし、この場合、両面接着体を使用するこれ
までの手段と比較して単に粘着剤を転着させるとなって
おり、それだけ構成は簡単になっているが、それを実現
する粘着剤についての開示がなく、かえって従来のもの
と比較して実現性は乏しい内容となっている。JP-A-59-194498 uses an embossed type of carrier tape, but when the electronic components are removed, the adhesive is transferred to the electronic components and the adhesive is used to fix them to the board. The idea is to do so. However, in this case, compared to previous methods that use double-sided adhesives, the adhesive is simply transferred and the configuration is simpler, but there is no disclosure of the adhesive that makes this possible. However, the content is rather less practical than the conventional one.
実開昭60−41344号公報には粘着剤の離脱を容易
にするためにテープ表面に剥離層を設けることが開示さ
れているが、この場合にも粘着剤の具体的開示はなく、
これも実現性は乏しい。Although Japanese Utility Model Application Publication No. 60-41344 discloses providing a release layer on the surface of the tape in order to facilitate release of the adhesive, there is no specific disclosure of the adhesive in this case either.
This also has little practicality.
かくして、本発明の第一の目的は、上述のような粘着式
キャリアテープにおける粘着剤移着を実現可能ならしめ
る耐熱性粘着剤を提供することである。Thus, the first object of the present invention is to provide a heat-resistant adhesive that makes it possible to transfer the adhesive in an adhesive carrier tape as described above.
本発明の第二の目的は、テーピングにより一旦キャリア
テープに付着させた電子部品をそのキャリアテープから
耐熱性粘着剤を付着させたま一剥がすことを可能とする
所定の引張りおよび剪断剥離力を備えた、電子部品のテ
ーピングおよび仮固定に使用するはんだ付けに耐える耐
熱性粘着剤を提供することである。A second object of the present invention is to provide a device with a predetermined tensile and shear peeling force that enables an electronic component once attached to a carrier tape by taping to be peeled off from the carrier tape with a heat-resistant adhesive attached thereto. An object of the present invention is to provide a heat-resistant adhesive that can withstand soldering and is used for taping and temporarily fixing electronic components.
(課題を解決するための手段)
これらの目的達成のためには、実用上の観点から云えば
、電子部品の安定したテーピングを行い、またキャリア
テープから取り外すには、電子部品との間の粘着力でな
くキャリアテープに対する耐熱性粘着剤の粘着力、つま
り剥離強さを引張り力および剪断力を基準に適正に規定
する必要があることが判明した。(Means for solving the problems) In order to achieve these objectives, from a practical point of view, it is necessary to stably tape electronic components, and to remove them from the carrier tape, it is necessary to It has been found that it is necessary to properly define the adhesive force of the heat-resistant adhesive to the carrier tape, that is, the peel strength, not on the basis of force, but on the basis of tensile force and shear force.
すなわち、電子部品の搬送体として、粘着式キャリアー
テープを使用する粘着剤転着方式においては、電子部品
を安定に保持し、かつ取り外しを容易ムこするという一
見相反する特性を有することが望まれ、電子部品一個毎
に規定の範囲の接着力および剥離力に入っていなければ
、実用上トラブルが発生する。また、電子部品には大小
さまざまな形状があり、また重さも異なっている。これ
らを粘着剤転着方式によるキャリアテープにテーピング
するには、耐熱性粘着剤の接着力安定化が求められると
同時にキャリアテープとの間の剥離力がある範囲にある
ことが必要である。In other words, in the adhesive transfer method that uses an adhesive carrier tape as a carrier for electronic components, it is desired that the tape has the seemingly contradictory properties of stably holding the electronic components and making it easy to remove them. If the adhesion and peeling forces are not within the specified range for each electronic component, problems will occur in practice. Additionally, electronic components come in a variety of shapes, sizes, and weights. In order to tape these onto a carrier tape using an adhesive transfer method, it is necessary that the adhesive force of the heat-resistant adhesive be stabilized, and at the same time, the peeling force between the heat-resistant adhesive and the carrier tape must be within a certain range.
ここに、はんだ付けに耐える耐熱性粘着剤が、電子部品
をテーピングしたときキャリアテープから電子部品を脱
落せず安定に保持し、一方、電子部品を取り外す際には
容易にキャリアテープから電子部品とともに剥離できる
ようにするには、アクリル系またはシリコン系接着剤を
使用してキャリアテープに対する引張りまたは剪断によ
る剥離力(引張り・剪断剥離力という)が、電子部品1
個当たり2〜30gf/a+m”であることを見出し、
本発明に到った。Here, the heat-resistant adhesive that can withstand soldering stably holds the electronic components without falling off the carrier tape when the electronic components are taped, and on the other hand, when the electronic components are removed, they are easily removed from the carrier tape together with the electronic components. To enable peeling, an acrylic or silicone adhesive is used to apply tension or shear peeling force (referred to as tensile/shear peeling force) to the carrier tape.
It was found that 2 to 30gf/a+m" per piece,
We have arrived at the present invention.
よって、本発明は、電子部品のテーピング後のキャリア
テープとの間の引張り・剪断剥離力が2〜30gf/m
+*”である、電子部品のテーピングおよび仮固定に使
用する耐熱性粘着剤である。Therefore, in the present invention, the tensile/shear peeling force between the electronic component and the carrier tape after taping is 2 to 30 gf/m.
+*'' is a heat-resistant adhesive used for taping and temporary fixing of electronic components.
別の面からは、本発明は、電子部品のテーピング後のキ
ャリアテープとの間の引張り・剪断剥離力が2〜30g
f/mm2である、電子部品の仮固定に使用する耐熱性
粘着剤を使って行うテーピング方法である。From another aspect, the present invention has a tensile/shear peeling force of 2 to 30 g between the electronic component and the carrier tape after taping.
This is a taping method using a heat-resistant adhesive used for temporary fixing of electronic components, which has a diameter of f/mm2.
なお、上記耐熱性粘着剤と電子部品との間の粘着力は、
通常、40gf/mm2と十分大きく、電子部品底面と
耐熱性粘着剤との間の剥離が問題となることはないが、
本発明にあっては、当然ながら、キャリアテープに対す
る前記耐熱性粘着剤の引張り・剪断剥離力は電子部品に
対するそれよりも常に小さい。In addition, the adhesive strength between the heat-resistant adhesive and electronic components is as follows:
Normally, it is large enough at 40gf/mm2, and peeling between the bottom of the electronic component and the heat-resistant adhesive does not become a problem.
In the present invention, naturally, the tensile/shear peeling force of the heat-resistant adhesive against the carrier tape is always smaller than that against the electronic component.
本発明の好適態様によれば、前記粘着剤はアクリル系ま
たはシリコン系接着剤であって、キャリアテープには同
じくシリコン系の剥離剤が塗布される。According to a preferred embodiment of the present invention, the adhesive is an acrylic or silicone adhesive, and the carrier tape is also coated with a silicone release agent.
(作用)
次に、添付図面を参照しながら本発明をさらに詳述する
。(Operation) Next, the present invention will be described in further detail with reference to the accompanying drawings.
第1図において、テープ支持体10には必要により剥離
層12が設けられる。この剥離層12は後述する粘着剤
との引張り・剪断剥離力が2〜30gf/mm2の間に
くるようにするためで、必要に応し設ければよい。この
ようにして用意した牛ヤリアテーブ14には、所定間隔
を置いて耐熱性粘着剤16が印刷あるいは吐出等の手段
で塗布され、次いでそのうえに電子部品I8が自動装置
(図示せず)によって載置される。いわゆるテーピング
である。In FIG. 1, a tape support 10 is provided with a release layer 12 if necessary. This release layer 12 is provided so that the tensile/shear release force with respect to the adhesive described later is between 2 and 30 gf/mm<2>, and may be provided as necessary. Heat-resistant adhesive 16 is applied at predetermined intervals to the cattle tape 14 prepared in this manner by means such as printing or dispensing, and then the electronic component I8 is placed thereon by an automatic device (not shown). Ru. This is so-called taping.
電子部品18が多数載置されたキャリアテープからは今
度は適宜電子部品搭載手段(図示せず)でもって電子部
品18が1個つづ、離脱されて、回路基板に自動装置に
よって搭載されてゆく。このときキャリアテープ14に
付着していた粘着剤I6は電子部品18の底面に移着し
、これがこのまま回路基板への仮止め用耐熱性粘着剤と
なる。The electronic components 18 are then removed one by one from the carrier tape on which a large number of electronic components 18 are mounted using an appropriate electronic component mounting means (not shown) and mounted on the circuit board by an automatic device. At this time, the adhesive I6 adhering to the carrier tape 14 is transferred to the bottom surface of the electronic component 18, and this becomes a heat-resistant adhesive for temporary attachment to the circuit board.
第1図において、図面向かって上下方向に引張り力とあ
るのは粘着剤の垂直方向への引張り力による剥離力を示
し、図面向かって左右方向に剪断力とあるのは粘着剤の
水平方向への剪断力による剥離力を示し、本発明にあっ
てはこれを総称して引張り・剪断剥離力と称し、そのい
ずれかが、好ましくはそれら両者が2〜30gf/mm
2の範囲にあることを必要とするのである。すでに述べ
たようにこれはキャリアテープとの間の剥離力であって
、通常電子部品18の底面との間の剥離力はこの範囲よ
りもかなり大きいため、電子部品底面と粘着剤とが離脱
することはない。In Figure 1, the tensile force in the vertical direction toward the drawing indicates the peeling force due to the tensile force in the vertical direction of the adhesive, and the shearing force in the horizontal direction toward the drawing indicates the peeling force in the horizontal direction of the adhesive. In the present invention, these are collectively referred to as tensile/shearing peeling force, and either one of them, preferably both of them, is 2 to 30 gf/mm.
It needs to be within the range of 2. As already mentioned, this is the peeling force between the carrier tape and the bottom of the electronic component 18, which is usually much larger than this range, so the adhesive separates from the bottom of the electronic component. Never.
このように、本発明によれば、はんだ付けを行っても何
ら問題の生じない耐熱性粘着剤を電子部品底部に付着さ
せたま一プリント基板に載置してはんガ付けを行うこと
から、UV硬化型接着剤、熱硬化型接着剤等の接着剤を
使用する必要がない。As described above, according to the present invention, a heat-resistant adhesive that does not cause any problems even when soldering is applied to the bottom of the electronic component is placed on a printed circuit board, and soldering is performed. There is no need to use adhesives such as UV curable adhesives or thermosetting adhesives.
また、キャリアテープから耐熱性粘着剤を部品底面に付
着させたま\剥離してプリント基板に載置するため、場
合によってキャリアテープの耐熱性粘着剤の塗工面には
支持体から容易に剥離できる層、つまり剥離層を設ける
必要がある。In addition, because the heat-resistant adhesive is attached to the bottom of the component from the carrier tape and then peeled off and placed on the printed circuit board, in some cases there is a layer on the heat-resistant adhesive coated surface of the carrier tape that can be easily peeled off from the support. In other words, it is necessary to provide a release layer.
この場合、剥離が軽過ぎると電子部品をテーピングする
時やテーピングした後に脱落する。また剥離が重過ぎる
と電子部品を取り外す場合に、現在市場で採用されてい
る表面実装機では容易に取り外すことが困難となる。In this case, if the peeling is too light, it will fall off when or after taping the electronic component. Furthermore, if the peeling is too heavy, it becomes difficult to easily remove the electronic component using surface mounting machines currently employed in the market.
これらの観点から、安定したテーピングを行い、カバー
テープを不要にして、かつ部品を取外し可能とするため
に、耐熱性粘着剤の引張・剪断力に抗する剥離強さを規
定するものである。From these viewpoints, in order to perform stable taping, eliminate the need for cover tape, and enable parts to be removed, the peel strength of the heat-resistant adhesive against tensile and shearing forces is specified.
本発明によれば粘着剤とキャリアテープとの間の引張り
・剪断剥離力が2〜30gf/mm”であり、望ましく
は4〜25gf/+m2、最も望ましくは6〜20gf
/llICである。この引張り・剪断剥離力が2 gf
/mm2未満では所期の目的が達成されず、一方30g
f/I2を超えると電子部品を取り外すとき粘着剤の電
子部品底面への移着が円滑に行われないことがある。According to the present invention, the tensile/shear peeling force between the adhesive and the carrier tape is 2 to 30 gf/mm'', preferably 4 to 25 gf/+m2, and most preferably 6 to 20 gf/mm.
/llIC. This tensile/shear peeling force is 2 gf
If it is less than /mm2, the intended purpose will not be achieved;
If f/I2 is exceeded, the adhesive may not be smoothly transferred to the bottom surface of the electronic component when the electronic component is removed.
耐熱性粘着剤の粘・接着力は品種によって異なる。また
、剥離層、剥離剤の品種、塗工量、表面型状、塗工方法
、基材の材質等によって剥離力が異なる。これらの組合
せによりキャリアテープとの間の引張り・剪断剥離力を
上述の範囲内に入れることができ、それにより電子部品
を安定に保持し、かつ取り外しを容易にすることができ
る。The viscosity and adhesive strength of heat-resistant adhesives vary depending on the type. Further, the peeling force varies depending on the type of release layer and release agent, coating amount, surface type, coating method, material of the base material, etc. With these combinations, the tensile/shear peeling force between the carrier tape and the carrier tape can be kept within the above-mentioned range, thereby stably holding the electronic component and making it easy to remove it.
電子部品には大小さまざまな型状があり、重量も異なっ
ている。これらをキャリアテープにテーピングするには
、耐熱性粘着剤の粘・接着力の安定化が求められると同
時に剥離層との引張り・剪断剥離力がある範囲に有るこ
とが必要である。なお、従来のEIAJ規格1?c−1
011、TJ32120の部品粘着用テープを貼りつけ
る製法では、ビール剥離強度はこの規格通りでよい。Electronic components come in a variety of shapes, sizes, and weights. In order to tape these onto a carrier tape, it is necessary that the heat-resistant pressure-sensitive adhesive has a stable viscosity/adhesive force, and at the same time, it is necessary that the tensile/shear peeling force with the release layer be within a certain range. In addition, the conventional EIAJ standard 1? c-1
011, TJ32120 component adhesive tape, the beer peel strength may meet this standard.
かかる引張り剪断剥離力は、具体的手段として例えば次
のような粘・接着性付与成分および耐熱性付与成分の各
成分を1種または2種以上適宜配合することによって容
易に調整することができる。Such tensile shear peeling force can be easily adjusted, for example, by suitably blending one or more of the following tack/adhesion imparting components and heat resistance imparting components.
もちろん、このようにして得たアクリル系またはシリコ
ン系接着剤の剥離力は、前述のように剥離層その他の塗
工条件を考えることによっても調整することができる。Of course, the peeling force of the acrylic or silicone adhesive thus obtained can also be adjusted by considering the release layer and other coating conditions as described above.
(1)シリコン・アクリル共重合体樹脂(例:0〜10
0%)(2)アクリル系共重合体樹脂(例:10〜80
%)(3)ウレタンまたはウレタンアクリル系共重合体
樹脂(例:0〜20%)
(4)シリコン系4#!脂(例:0−100%)ここに
、上記組成の粘・接着剤にあって、剥離力は、引張り剥
離力および剪断剥離力のいずれの場合も粘接着性付与成
分であるアクリル系共重合体樹脂を増加することにより
低下させることができ、またはウレタンもしくはウレタ
ンアクリル共重合体樹脂またはンリコンアクリル共重合
体樹脂の量を増加することによって増加することができ
るが、かかる成分が少ない場合でも後述の架橋剤独で使
用してもよい場合があることを意味する。(1) Silicone-acrylic copolymer resin (e.g. 0-10
0%) (2) Acrylic copolymer resin (e.g. 10-80
%) (3) Urethane or urethane acrylic copolymer resin (e.g. 0-20%) (4) Silicone 4#! (Example: 0-100%) Here, in the adhesive/adhesive with the above composition, the peeling force is determined by the acrylic adhesive which is the adhesive imparting component in both the tensile peeling force and the shear peeling force. It can be decreased by increasing the amount of polymer resin, or it can be increased by increasing the amount of urethane or urethane-acrylic copolymer resin or urethane-acrylic copolymer resin, if such components are low. However, this means that there are cases where the crosslinking agent described below may be used alone.
さらに必要に応し適宜架橋剤を配合してもよい。Furthermore, a crosslinking agent may be added as appropriate.
もちろん、すでに述べたようにキャリアテープに剥離層
を設ける場合、その種類によっても上記剥離力が変動す
る。代表的剥離剤としては、シリコン系または弗素系を
挙げることができる。Of course, as already mentioned, when a release layer is provided on the carrier tape, the above-mentioned release force varies depending on the type of release layer. Typical stripping agents include silicone-based or fluorine-based stripping agents.
このようにしてテーピングした後、電子部品18は必要
に応じ表面実装機で自動的に取り外されてプリント基板
の所定位置に載され、仮固定される。After taping in this manner, the electronic component 18 is automatically removed by a surface mounter as required, placed on a predetermined position on the printed circuit board, and temporarily fixed.
本発明にあって規定する粘着剤を使用する場合、仮固定
は効果的に行われ、特にそれ以上制限されることはない
が、より好ましくははんだ付温度において、動的粘弾性
の弾性率が10’〜109dyne/cm2であるよう
な粘着剤を使用する。かかる特性を有する粘着剤は本発
明の範囲内の前記粘着剤から必要により容易に選択する
ことができる。When using the adhesive specified in the present invention, temporary fixing is effectively performed, and there are no particular restrictions beyond that, but it is more preferable that the elastic modulus of dynamic viscoelasticity is maintained at the soldering temperature. An adhesive having a density of 10' to 109 dyne/cm2 is used. An adhesive having such characteristics can be easily selected from the above-mentioned adhesives within the scope of the present invention, if necessary.
次に、本発明を実施例によってさらに具体的に説明する
。Next, the present invention will be explained in more detail with reference to Examples.
災施孤:
本例では以下の組成範囲内で適宜配合比を変えることに
より各種の引張剥離力および剪断剥離力を備えた樹脂組
成物を調整して、その粘接着力を評価した。In this example, resin compositions with various tensile peeling forces and shearing peeling forces were prepared by appropriately changing the blending ratio within the following composition range, and their adhesive strength was evaluated.
(1)アクリル系共重合樹脂 40〜60%(例:東亜
合成化学工業■製HVC−5200)(2)ウレタン・
アクリル共重合体樹脂(例: ARCJapan社製H
AP−070) O〜10%(3)ンリコン・アクリ
ル共重合体樹脂 40〜60%(伊り日本純薬■製Ty
−B)
その他、架橋剤を0.1〜5.0%配合した。(1) Acrylic copolymer resin 40-60% (e.g. HVC-5200 manufactured by Toagosei Chemical Industry Co., Ltd.) (2) Urethane
Acrylic copolymer resin (e.g. H manufactured by ARC Japan)
AP-070) O ~ 10% (3) Nlicon acrylic copolymer resin 40 ~ 60% (Ty manufactured by Nippon Pure Chemical Industries, Ltd.)
-B) In addition, 0.1 to 5.0% of a crosslinking agent was blended.
引張り剥離力および剪断剥離力はウレタン・アクリル共
重合体樹脂および架橋剤の配合量を増加することにより
増大させることができた。The tensile peel force and shear peel force could be increased by increasing the blending amounts of the urethane-acrylic copolymer resin and crosslinking agent.
本例では剥離層を使用し、剥離層としては市販ンリコン
系を使用し、これを紙製のテープ本体に塗布してキャリ
アテープを構成した。In this example, a release layer was used, and the release layer was a commercially available NRICON system, and this was applied to a paper tape body to construct a carrier tape.
得られた各樹脂組成、物の剥離力として引張力および剪
断力を求め、さらに取扱い性および作業性について評価
した。それらの試験結果を第1表にまとめて示す。The tensile force and shear force were determined as the peeling force of each resin composition and object obtained, and the handleability and workability were further evaluated. The test results are summarized in Table 1.
(以下余白)
第 1 表
(第1表つづき)
(次頁につづく)
島律製作所製の引張り試験機および剪断力試験機で測定
。これらの剥離力はいずれも粘着剤との間のそれである
。(Margin below) Table 1 (Continued from Table 1) (Continued on next page) Measured using a tensile tester and a shear force tester manufactured by Shima Ritsu Seisakusho. All of these peeling forces are those with adhesives.
iニイ2久牲
テーピング後の取扱い性を次の要領で調べ4段階評価し
た。The ease of handling after 2-permanent taping was examined in the following manner and evaluated on a 4-grade scale.
市販のテーピングマシンでテーピングし、電子部品が脱
落せず正しい位置に保持されて、巻取りリールに正常に
巻取れか否かを確認した。Taping was performed using a commercially available taping machine, and it was confirmed whether the electronic components did not fall off and were held in the correct position, and whether they could be wound normally onto the take-up reel.
200個の電子部品をテーピングして 脱落しないものを◎、 2個以内の脱落をOl 5個以内の脱落を△、 6個以上の脱落を× と4段階に分けて判定した。Taping 200 electronic parts Something that won't fall off◎ If less than 2 pieces fall off, △ if less than 5 pieces fall off. 6 or more pieces fall off × The judgment was divided into four stages.
実装透型 実装時の外し作業を次の要領で調べた。Transparent mounting type The removal work during mounting was investigated as follows.
市販の表面実装機で自動的にプリント基板に載置し、規
定の速度で高精度に装着できるか否かを確認した。A commercially available surface mounter was used to automatically place the mount on a printed circuit board, and it was confirmed whether it could be mounted at a specified speed and with high precision.
200個の電子部品をプリント基板にH&置し、全て正
常に装着したものを◎
2個以内の不良装着が生じたものを0
5個以内 6
6個以内 ×
と4段階に分けて判定した。200 electronic components were placed on a printed circuit board, and the evaluation was divided into 4 grades: ◎ (◎) for those that were all correctly mounted, 0 (for less than 2 parts), 6 (less than 6 parts), and × (for those with less than 6 parts).
(発明の効果)
従来から粘着剤付きキャリアテープの構想が粘着剤転着
方式としてあり、実公昭56−11438号、特開昭5
9−23597号、特開昭59〜19449号等の各公
報に提示されてきたが、電子部品のテーピングおよび取
外しが確実に行われ、しがもハンダ付けを行っても何ら
問題を生しない耐熱性粘着剤が開発されず実用化には至
ってぃなかったのであり、本発明によってはしめてそれ
らが実用化できたもので、今後この分野の大幅な合理化
を可能ならしめるなどその実用上の意義は大きい。(Effects of the Invention) Conventionally, the concept of carrier tape with adhesive has been based on the adhesive transfer method.
As proposed in various publications such as No. 9-23597 and Japanese Unexamined Patent Publication Nos. 59-19449, heat-resistant devices that ensure the taping and removal of electronic components and do not cause any problems even when soldering are performed. However, the present invention has finally put them into practical use, and its practical significance is that it will enable significant rationalization of this field in the future. big.
第1図は、本発明にががる粘着剤の使用形態の略式説明
図である。
10; テープ支持体
12:剥離層
14:キャリアテープ
16: 耐熱性粘着剤
18: iii子部品FIG. 1 is a schematic explanatory diagram of the usage form of the adhesive according to the present invention. 10; tape support 12: release layer 14: carrier tape 16: heat-resistant adhesive 18: iii child component
Claims (1)
り・剪断剥離力が2〜30gf/mm^2である、電子
部品のテーピングおよび仮固定に使用する耐熱性粘着剤
。A heat-resistant adhesive used for taping and temporary fixing of electronic components, which has a tensile/shear peeling force of 2 to 30 gf/mm^2 with a carrier tape after taping the electronic components.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP11148190A JPH048784A (en) | 1990-04-26 | 1990-04-26 | Heat-resistant tacky agent useful for taping and temporary fixation of electric part |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP11148190A JPH048784A (en) | 1990-04-26 | 1990-04-26 | Heat-resistant tacky agent useful for taping and temporary fixation of electric part |
Publications (1)
Publication Number | Publication Date |
---|---|
JPH048784A true JPH048784A (en) | 1992-01-13 |
Family
ID=14562352
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP11148190A Pending JPH048784A (en) | 1990-04-26 | 1990-04-26 | Heat-resistant tacky agent useful for taping and temporary fixation of electric part |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH048784A (en) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2001242757A (en) * | 2000-02-29 | 2001-09-07 | Tsuchiya Tsco Co Ltd | Integrated object of bonded products and method for manufacturing the same |
US8721309B2 (en) | 2008-12-17 | 2014-05-13 | Daikin Industries, Ltd. | Airtight compressor |
KR20230143894A (en) * | 2022-04-06 | 2023-10-13 | 조인셋 주식회사 | Storage tray, Carrier tape Assembly for SMT, and Method for making the same |
-
1990
- 1990-04-26 JP JP11148190A patent/JPH048784A/en active Pending
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2001242757A (en) * | 2000-02-29 | 2001-09-07 | Tsuchiya Tsco Co Ltd | Integrated object of bonded products and method for manufacturing the same |
US8721309B2 (en) | 2008-12-17 | 2014-05-13 | Daikin Industries, Ltd. | Airtight compressor |
KR20230143894A (en) * | 2022-04-06 | 2023-10-13 | 조인셋 주식회사 | Storage tray, Carrier tape Assembly for SMT, and Method for making the same |
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