JPH0485912A - Manufacture of electromagnetic machinery and apparatus - Google Patents
Manufacture of electromagnetic machinery and apparatusInfo
- Publication number
- JPH0485912A JPH0485912A JP2201612A JP20161290A JPH0485912A JP H0485912 A JPH0485912 A JP H0485912A JP 2201612 A JP2201612 A JP 2201612A JP 20161290 A JP20161290 A JP 20161290A JP H0485912 A JPH0485912 A JP H0485912A
- Authority
- JP
- Japan
- Prior art keywords
- compound
- opening
- case body
- electromagnetic device
- electromagnetic
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000004519 manufacturing process Methods 0.000 title claims description 13
- 150000001875 compounds Chemical class 0.000 claims abstract description 43
- 238000007789 sealing Methods 0.000 claims abstract description 4
- STBLNCCBQMHSRC-BATDWUPUSA-N (2s)-n-[(3s,4s)-5-acetyl-7-cyano-4-methyl-1-[(2-methylnaphthalen-1-yl)methyl]-2-oxo-3,4-dihydro-1,5-benzodiazepin-3-yl]-2-(methylamino)propanamide Chemical compound O=C1[C@@H](NC(=O)[C@H](C)NC)[C@H](C)N(C(C)=O)C2=CC(C#N)=CC=C2N1CC1=C(C)C=CC2=CC=CC=C12 STBLNCCBQMHSRC-BATDWUPUSA-N 0.000 abstract description 17
- 229940125878 compound 36 Drugs 0.000 abstract description 17
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 abstract description 8
- 230000017525 heat dissipation Effects 0.000 abstract description 5
- 239000000565 sealant Substances 0.000 abstract 1
- 238000000034 method Methods 0.000 description 5
- 239000002184 metal Substances 0.000 description 3
- 229910052751 metal Inorganic materials 0.000 description 3
- 239000003566 sealing material Substances 0.000 description 3
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical group [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- 238000003780 insertion Methods 0.000 description 2
- 230000037431 insertion Effects 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 241001247986 Calotropis procera Species 0.000 description 1
- 239000003990 capacitor Substances 0.000 description 1
- 238000007599 discharging Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
Landscapes
- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
- Casings For Electric Apparatus (AREA)
Abstract
Description
【発明の詳細な説明】
〔発明の目的〕
（産業上の利用分野）
本発明は電磁機器の製造方法に係り、例えば、放電灯安
定器などのケース体に電磁機器本体をコンパウンドに埋
設して収納固定する製造方法に関する。[Detailed Description of the Invention] [Object of the Invention] (Industrial Application Field) The present invention relates to a method of manufacturing electromagnetic equipment, for example, a method of manufacturing an electromagnetic equipment by embedding the main body of the electromagnetic equipment in a compound in a case body such as a discharge lamp ballast. This invention relates to a manufacturing method for storing and fixing.
（従来の技術）
従来のこの種の電磁機器は、第４図に示すように、金属
板材の絞り加工により舟形に成形されたケース体１を上
面開口部２が上側となるように保持し、この状態でケー
ス体１内に電磁機器本体３を収納し、次いでコンパウン
ド４をケース体１の開口部２から充填し、このコンパウ
ンド４にて前記電磁機器本体３を埋設し、この状態でケ
ース体１の開口部２を蓋体５にて閉塞し、この蓋体５を
シール材６にて密閉し、コンパウンド４を硬化させる製
造方法が採られていた。(Prior Art) As shown in FIG. 4, a conventional electromagnetic device of this type holds a case body 1 formed into a boat shape by drawing a metal plate so that the top opening 2 faces upward. In this state, the electromagnetic device body 3 is housed in the case body 1, and then compound 4 is filled from the opening 2 of the case body 1, the electromagnetic device body 3 is buried in this compound 4, and the case body A manufacturing method has been employed in which the opening 2 of the compound 4 is closed with a lid 5, the lid 5 is sealed with a sealing material 6, and the compound 4 is cured.
また、第５図に示すように、長手方向の一端面を開口し
た筒形状のケース体７を一端面の開口部が上側となるよ
うに保持し、このケース体７の一端面の開口部８から電
磁機器本体３を収納し、次いでコンパウンド４をケース
体７に充填し、このコンパウンド４にて前記電磁機器本
体３を埋設し、この状態でケース体７の開口部８を端板
１０にて閉塞し、コンパウンド４を硬化させる製造方法
が採られていた。Further, as shown in FIG. 5, a cylindrical case body 7 with an open end face in the longitudinal direction is held so that the opening of the one end face faces upward, and the opening 8 of the one end face of the case body 7 is held so that the opening of the one end face faces upward. Then, the case body 7 is filled with compound 4, the electromagnetic device body 3 is buried in the compound 4, and in this state, the opening 8 of the case body 7 is filled with the end plate 10. A manufacturing method was adopted in which the compound 4 was closed and hardened.
（発明が解決しようとする課題）
上記第４図に示す製造方法では、ケース体１の開口部２
が最も広い面に開口されているため、電磁機器本体３を
収納し易く、リード線１１と電磁機器本体３の端子１２
との接続配線が容易で、さらにコンパウンド４の充填の
位置決めが容易となるとともにコンパウンド４の底側へ
の回り込みが良好であるなどの利点を有する反面、コン
パウンド４の硬化時の収縮により蓋体５とコンパウンド
４との間に空隙１３が生じ、電磁機器本体３への通電時
に、電磁機器本体３が引起こす磁気吸引力が蓋体５に作
用するか、または、磁気振動がケース体１を伝達して蓋
体５に到達した場合、蓋体５は中間部が空隙１３に対向
され、機械的に固定されておらず、蓋体５の固有振動数
で共振を引起こし、騒音が発生する問題があった。(Problem to be Solved by the Invention) In the manufacturing method shown in FIG.
Since the opening is on the widest side, it is easy to store the electromagnetic device main body 3, and the lead wire 11 and the terminal 12 of the electromagnetic device main body 3 can be easily stored.
Although it has advantages such as easy connection wiring, easy positioning for filling the compound 4, and good wraparound of the compound 4 to the bottom side, on the other hand, shrinkage of the lid body 5 when the compound 4 hardens occurs. A gap 13 is created between the electromagnetic device main body 3 and the compound 4, and when the electromagnetic device main body 3 is energized, the magnetic attraction force caused by the electromagnetic device main body 3 acts on the lid body 5, or magnetic vibration is transmitted through the case body 1. When the lid 5 is reached, the middle part of the lid 5 faces the gap 13 and is not mechanically fixed, causing resonance at the natural frequency of the lid 5 and generating noise. was there.
また、第５図に示す製造方法では、端板１０はコンパウ
ンド４との間に空隙１３が形成されているが、端板ｌＯ
と電磁機器本体３との間が長く、電磁機器本体３の磁気
吸引力が到達し難く、磁気吸引力が端板１０に伝達した
場合でも、端板１０の面積が狭く、端板１０の共振振幅
が小さく、騒音となり難い利点を有する反面、ケース体
７の開口部８の開口面積が狭く、電磁機器本体３はケー
ス体７の挿入方向に対して長くなるため、電磁機器本体
３の挿入が困難で、さらに、端板１０を貫通し２てケー
ス体７の外部に導出するリート線１１は予め電磁機器本
体３の端子１２に半田付けし、電磁機器本体３をケース
体７に挿入しながらリート線１１を引出さなくてはなら
ず、さらに、開口部８が狭いため、コンパウンド４の充
填位置の位置決めに精度を要求され、また、ケース体７
は挿入方向の長さが長いため、コンパウンド４の回り込
みに時間が損り、コンパウンド４の充填に時間が掛かる
問題があつた。Further, in the manufacturing method shown in FIG. 5, a gap 13 is formed between the end plate 10 and the compound 4, but the end plate lO
and the electromagnetic device body 3 is long, making it difficult for the magnetic attraction force of the electromagnetic device body 3 to reach, and even if the magnetic attraction force is transmitted to the end plate 10, the area of the end plate 10 is small and the resonance of the end plate 10 Although it has the advantage that the amplitude is small and does not easily cause noise, the opening area of the opening 8 of the case body 7 is narrow, and the electromagnetic device main body 3 is longer in the direction of insertion of the case body 7, making it difficult to insert the electromagnetic device main body 3. Furthermore, it is difficult to solder the Riet wire 11 that passes through the end plate 10 and leads out of the case body 7 to the terminal 12 of the electromagnetic device body 3 in advance, while inserting the electromagnetic device body 3 into the case body 7. In addition, since the opening 8 is narrow, precision is required for positioning the filling position of the compound 4, and the case body 7
Since the length in the insertion direction is long, there is a problem in that time is wasted for the compound 4 to wrap around, and it takes time to fill the compound 4.
本発明は上記問題点に鑑みなされたもので、ケース体の
開口部を閉塞する蓋体とコンパウンドとの間の空隙を少
くして騒音が小さく、放熱性が良好で、リード線の配線
、コンパウンドの充填が容易な電磁機器の製造方法を提
供するものである。The present invention was made in view of the above problems, and it reduces the gap between the lid body that closes the opening of the case body and the compound, thereby reducing noise, good heat dissipation, and reducing the wiring of lead wires and the compound. The present invention provides a method for manufacturing electromagnetic equipment that allows easy filling.
（課題を解決するための手段）
本発明の電磁機器の製造方法は、ケース体の面積の最も
広い面を開口した開口面から電磁機器本体を収納する工
程と、このケース体の開口部からコンパウンドを充填し
てこのコンパウンドにてこのケース体内に収納されてい
る前記電磁機器本体を埋設する工程と、前記コンパウン
ドが流動性を有する間に前記ケース体のｒＭｃ７部を蓋
体にて密閉して開口部が垂直面となる方向にケース体を
保持して前記コンパウンドを硬化させる工程とからなる
ものである。(Means for Solving the Problems) The method for manufacturing an electromagnetic device of the present invention includes the steps of storing the electromagnetic device from the opening surface of the case body with the widest area, and discharging the compound from the opening of the case body. burying the electromagnetic device main body housed in the case body with this compound, and sealing the rMc7 part of the case body with a lid body and opening it while the compound has fluidity. This process consists of a step of curing the compound while holding the case body in a direction in which the parts thereof are perpendicular to each other.
（作用）
本発明の電磁機器の製造方法は、ケース体の面積の最も
広い面に開口されている開口面から電磁機器本体を収納
するため、電磁機器本体の収納が容易で、リード線の配
線も容易となり、このケース体の開口部から充填するコ
ンパウンドの充填位置の位置決めが容易となり、さらに
、コンパウンドの回り込みも良好てこのケース体内に収
納されている電磁機器本体をコンパウンドに確実に埋設
テキ、さらにコンパウンドが流動性を有する開にケース
体の開口部を蓋体にて密閉して開口部が垂直面となる方
向にケース体を保持することにより、コンパウンドの硬
化によって蓋体とコンパウンドとの間に生じる空隙も上
部のみで狭く、電磁機器本体の固有振動数による共振振
動も低く、騒音の低減となり、放熱も良好となる。(Function) The electromagnetic device manufacturing method of the present invention stores the electromagnetic device from the opening that is the widest surface of the case body, making it easy to store the electromagnetic device and wiring the lead wires. This makes it easy to position the filling position of the compound to be filled from the opening of the case body.Furthermore, the compound wraps around easily, making it possible to securely bury the electromagnetic equipment body housed inside the case body in the compound. Furthermore, by sealing the opening of the case body with the lid body while the compound has fluidity and holding the case body in a direction where the opening is in a vertical plane, the hardening of the compound creates a gap between the lid body and the compound. The air gap created in the upper part is narrower, and the resonance vibration due to the natural frequency of the electromagnetic equipment body is also lower, reducing noise and improving heat dissipation.
（実施例）
本発明の一実施例を図面第１図乃至第３図について説明
する。(Embodiment) An embodiment of the present invention will be described with reference to FIGS. 1 to 3 of the drawings.
２０は金属板材を絞り加工によって成形したケース体で
、このケース体２０は面積の最も広い面が開口されてい
る。そして、このケース体２０の開口部２１の両端側に
は取付は孔２２を有する取付は片部２３が一体に形成さ
れている。また、このケース体２０の両端面にはそれぞ
れゴムフッシュ３８を介してリード線２４が導出されて
いる。さらに、このケース体２０の一端面にはアース端
子２５が設けられている。Reference numeral 20 denotes a case body formed by drawing a metal plate material, and the case body 20 has an opening at its widest surface. Mounting pieces 23 having mounting holes 22 are integrally formed on both ends of the opening 21 of the case body 20. Further, lead wires 24 are led out from both end surfaces of the case body 20 via rubber bushes 38, respectively. Furthermore, a ground terminal 25 is provided on one end surface of the case body 20.
また、２６は電磁機器本体で、鉄心２７とこの鉄心２７
に装着した二次コイル２８、二次コイル２９とにて構成
され、この−次コイル２８と二次コイル２９を巻回した
コイルボビン３０．３１には前記リード線２４を接続す
る端子３２がそれぞれ設けられている。そして、この電
磁機器本体２６の端子３２にはコンデンサ３３が接続さ
れている。In addition, 26 is the electromagnetic equipment main body, which includes an iron core 27 and this iron core 27.
It is composed of a secondary coil 28 and a secondary coil 29 attached to the coil bobbin 30 and 31 around which the secondary coil 28 and the secondary coil 29 are wound, respectively, each terminal 32 for connecting the lead wire 24 is provided. It is being A capacitor 33 is connected to the terminal 32 of the electromagnetic device body 26.
さらに、３４は蓋体で、前記ケース体２０の開口部２１
を閉塞し、シール材３５でケース体２０の開口部２１を
密閉される。Furthermore, 34 is a lid, and the opening 21 of the case body 20
and the opening 21 of the case body 20 is sealed with the sealing material 35.
また、３６は前記ケース体２０内に開口部２１から充填
される絶縁コンパウンドで、前記電磁機器本体２６を埋
設する。Further, 36 is an insulating compound that is filled into the case body 20 from the opening 21 and embeds the electromagnetic device body 26 therein.
まず、第１の工程は、ケース体２０の面積の最も広い面
に開口された開口部２１から電磁機器本体２６を収納す
る。そして、電磁機器本体２６の端子３２にリード線２
４を接続する。First, in the first step, the electromagnetic device main body 26 is housed through the opening 21 opened on the widest surface of the case body 20 . Then, the lead wire 2 is connected to the terminal 32 of the electromagnetic device main body 26.
Connect 4.
次の工程は、ケース体２０の開口部２１からコンパウン
ド３６を充填してこのコンパウンド３Ｇにてこのケース
体２０内に収納されている前記電磁機器本体２６をコン
パウンド３６に埋設する。In the next step, a compound 36 is filled through the opening 21 of the case body 20, and the electromagnetic device main body 26 housed in the case body 20 is buried in the compound 36 using the compound 3G.
続く工程は、前記コンパウンド３６が流動性を有する間
に前記ケース体２０の開口部２１を蓋体３４にて閉塞し
、シール材３５で密閉する。そして、開口部２１が垂直
面となる方向にケース体２０を起した状態に保持して前
記コンパウンド３６を硬化させる。In the subsequent step, the opening 21 of the case body 20 is closed with the lid 34 and sealed with a sealing material 35 while the compound 36 has fluidity. Then, the compound 36 is cured by holding the case body 20 in an upright position in a direction in which the opening 21 is a vertical plane.
次にこの実施例の作用を説明する。Next, the operation of this embodiment will be explained.
ケース体２０の面積の最も広い面に開口されている開口
部２１から電磁機器本体２６を収納するため、電磁機器
本体２６の収納が容易で、リード線２４と端子３２との
配線接続も広い開口部２１で行え、予めリード線２４を
電磁機器本体２６に接続した状態で電磁機器本体２６を
ケース体２０に収納する方法に比べてリード線２４の配
線が容易にできる。また、このケース体２０の開口部２
１から充填するコンパウンド３６の充填位置の位置決め
も開口部２１が広いため容易となる。さらに、ケース体
２０の広い開口部２１からコンパウンド３６を充填する
ため、コンパウンド３６の回り込みも良好で、このケー
ス体２０内に収納されている電磁機器本体２６をコンパ
ウンド３６に確実に埋設できる。さらに、コンパウンド
３６が流動性を有する間にケース体２０の開口部２１を
蓋体３４にて密閉して開口部２１が垂直面となる方向に
ケース体２０を保持することにより、コンパウンド３６
の硬化によって蓋体３４とコンパウンド３６との間に生
じる空隙もケース体２０の上部のみで狭く、蓋体３４の
大部分はコンパウンド３６に密着される。そして、蓋体
３４の大部分はコンパウンド３６に密着されるため、電
磁機器本体２６への通電時に電磁機器本体２６の磁気吸
引力によって蓋体３４が振動することなく、電磁機器本
体２６の固有振動数による共振振動も低く、騒音の低減
となり、放熱も良好となる。Since the electromagnetic device main body 26 is stored through the opening 21 which is opened on the widest surface of the case body 20, the electromagnetic device main body 26 can be easily stored, and the wiring connection between the lead wire 24 and the terminal 32 can be made through the wide opening. The lead wire 24 can be wired more easily than the method in which the electromagnetic device main body 26 is housed in the case body 20 with the lead wire 24 connected to the electromagnetic device main body 26 in advance. Moreover, the opening 2 of this case body 20
Since the opening 21 is wide, positioning of the filling position of the compound 36 to be filled from the beginning becomes easy. Further, since the compound 36 is filled from the wide opening 21 of the case body 20, the compound 36 can wrap around well, and the electromagnetic device main body 26 housed in the case body 20 can be reliably buried in the compound 36. Further, while the compound 36 has fluidity, the opening 21 of the case body 20 is sealed with the lid 34 and the case body 20 is held in a direction in which the opening 21 is a vertical plane.
The gap created between the lid body 34 and the compound 36 by the hardening is narrow only in the upper part of the case body 20, and most of the lid body 34 is in close contact with the compound 36. Since most of the lid body 34 is in close contact with the compound 36, the lid body 34 does not vibrate due to the magnetic attraction force of the electromagnetic device body 26 when the electromagnetic device body 26 is energized, and the natural vibration of the electromagnetic device body 26 is suppressed. Resonant vibration due to the number of parts is also low, reducing noise and improving heat dissipation.
なお、ケース体２０は金属板材により絞り加工により成
形することにより、角隅部３７は曲面となり、機械的強
度が高められるとともに、ケース体２０に電磁機器本体
２６による振動が伝達されても振動の振幅が小さく抑え
られる。さらに、ケース体２０の角隅部３７は曲面とな
るため、コンパウンド３６の回り込みも良好となる。Note that by forming the case body 20 from a metal plate material by drawing, the corner portions 37 have curved surfaces, which increases mechanical strength and prevents vibrations even when vibrations from the electromagnetic device main body 26 are transmitted to the case body 20. The amplitude can be kept small. Further, since the corner portions 37 of the case body 20 have curved surfaces, the compound 36 can wrap around easily.
本発明によれば、ケース体の面積の最も広い面に開口さ
れている開口面から電磁機器本体を収納するため、電磁
機器本体の収納が容易となり、リート線の配線が容易に
でき、このケース体の開口部から充填するコンパウンド
の充填位置の位置決めが容易となり、さらに、コンパウ
ンドの回り込みも良好でこのケース体内に収納されてい
る電磁機器本体をコンパウンドに確実に埋設でき、コン
パウンドの硬化によって蓋体とコンパウンドとの間に生
じる空隙も上部のみで狭く、電磁機器本体の固有振動数
による共振振動も低く、騒音の低減となり、放熱も良好
となる。According to the present invention, since the electromagnetic device body is stored from the opening surface that is opened on the widest surface of the case body, the electromagnetic device body can be easily stored, and the wire can be easily wired. It is easy to position the filling position of the compound to be filled from the opening of the case, and the compound wraps around well, so the electromagnetic equipment body housed inside this case body can be reliably buried in the compound, and as the compound hardens, the lid body The gap created between the electromagnetic device and the compound is narrow only in the upper part, and the resonant vibration due to the natural frequency of the electromagnetic device body is also low, reducing noise and improving heat dissipation.
第１図は本発明の一実施例を示す電磁機器の一部を切り
欠いた側面図、第２図は同上一部を切り欠いた正面図、
第３図は同上電磁機器本体の組込み工程を示す正面図、
第４図および第５図はそれぞれ異なる従来の製造工程に
よる電磁機器の一部を切り欠いた側面図である。
２０・
・ケース体、
２１・
・開口部、
２６・
電磁
機器本体、
３４・
蓋体、
３６・
コ
ンパウ
ン
ド。
平成２年７月
日
発
明
者
梅
原
孝
司FIG. 1 is a partially cutaway side view of an electromagnetic device showing an embodiment of the present invention, and FIG. 2 is a partially cutaway front view of the same.
Figure 3 is a front view showing the process of assembling the electromagnetic device as above;
4 and 5 are partially cutaway side views of electromagnetic equipment manufactured by different conventional manufacturing processes, respectively. 20. Case body, 21. Opening, 26. Electromagnetic device body, 34. Lid body, 36. Compound. July 1990 Inventor Takashi Umehara
Claims (1)
ら電磁機器本体を収納する工程と、このケース体の開口
部からコンパウンドを充填してこのコンパウンドにてこ
のケース体内に収納されている前記電磁機器本体を埋設
する工程と、前記コンパウンドが流動性を有する間に前
記ケース体の開口部を蓋体にて密閉して開口部が垂直面
となる方向にケース体を保持して前記コンパウンドを硬
化させる工程とからなることを特徴とする電磁機器の製
造方法。(1) The step of housing the electromagnetic device from the opening surface that opens the widest area of the case body, filling the compound from the opening of the case body, and storing the electromagnetic device inside the case body with this compound. a step of burying the electromagnetic device main body; and, while the compound has fluidity, sealing the opening of the case body with a lid body and holding the case body in a direction where the opening becomes a vertical plane, and burying the compound; A method of manufacturing an electromagnetic device, comprising the step of curing the .
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2201612A JPH0485912A (en) | 1990-07-30 | 1990-07-30 | Manufacture of electromagnetic machinery and apparatus |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2201612A JPH0485912A (en) | 1990-07-30 | 1990-07-30 | Manufacture of electromagnetic machinery and apparatus |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0485912A true JPH0485912A (en) | 1992-03-18 |
Family
ID=16443949
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2201612A Pending JPH0485912A (en) | 1990-07-30 | 1990-07-30 | Manufacture of electromagnetic machinery and apparatus |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0485912A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2007150377A (en) * | 2005-11-24 | 2007-06-14 | Nec Corp | Distributor, combiner and power amplifier using them |
| JP2008523763A (en) * | 2004-12-14 | 2008-07-03 | コーニンクレッカ フィリップス エレクトロニクス エヌ ヴィ | Low loss, asymmetric combiner for adaptive phase difference system and adaptive radio frequency amplifier with asymmetric combiner |
| JP2011198970A (en) * | 2010-03-19 | 2011-10-06 | Denso Corp | Reactor and method of manufacturing the same |
-
1990
- 1990-07-30 JP JP2201612A patent/JPH0485912A/en active Pending
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2008523763A (en) * | 2004-12-14 | 2008-07-03 | コーニンクレッカ フィリップス エレクトロニクス エヌ ヴィ | Low loss, asymmetric combiner for adaptive phase difference system and adaptive radio frequency amplifier with asymmetric combiner |
| JP2007150377A (en) * | 2005-11-24 | 2007-06-14 | Nec Corp | Distributor, combiner and power amplifier using them |
| JP2011198970A (en) * | 2010-03-19 | 2011-10-06 | Denso Corp | Reactor and method of manufacturing the same |
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