JPH0471340B2 - - Google Patents
Info
- Publication number
- JPH0471340B2 JPH0471340B2 JP59222181A JP22218184A JPH0471340B2 JP H0471340 B2 JPH0471340 B2 JP H0471340B2 JP 59222181 A JP59222181 A JP 59222181A JP 22218184 A JP22218184 A JP 22218184A JP H0471340 B2 JPH0471340 B2 JP H0471340B2
- Authority
- JP
- Japan
- Prior art keywords
- lead
- pitch
- leads
- lead frame
- resin
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 239000004065 semiconductor Substances 0.000 claims description 52
- 239000011347 resin Substances 0.000 claims description 44
- 229920005989 resin Polymers 0.000 claims description 44
- 238000004519 manufacturing process Methods 0.000 claims description 24
- 239000008188 pellet Substances 0.000 claims description 15
- 238000000034 method Methods 0.000 claims description 11
- 238000007789 sealing Methods 0.000 claims 1
- 239000011295 pitch Substances 0.000 description 65
- 238000000465 moulding Methods 0.000 description 13
- 230000007547 defect Effects 0.000 description 7
- 238000005516 engineering process Methods 0.000 description 6
- 230000008602 contraction Effects 0.000 description 5
- 230000000694 effects Effects 0.000 description 5
- 230000001186 cumulative effect Effects 0.000 description 4
- 239000000725 suspension Substances 0.000 description 3
- 101100008049 Caenorhabditis elegans cut-5 gene Proteins 0.000 description 2
- 239000006023 eutectic alloy Substances 0.000 description 2
- 239000000758 substrate Substances 0.000 description 2
- 238000001816 cooling Methods 0.000 description 1
- 238000006073 displacement reaction Methods 0.000 description 1
- 238000002474 experimental method Methods 0.000 description 1
- 239000004744 fabric Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/495—Lead-frames or other flat leads
- H01L23/49541—Geometry of the lead-frame
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Lead Frames For Integrated Circuits (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP22218184A JPS61101062A (ja) | 1984-10-24 | 1984-10-24 | 半導体装置の製造方法 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP22218184A JPS61101062A (ja) | 1984-10-24 | 1984-10-24 | 半導体装置の製造方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS61101062A JPS61101062A (ja) | 1986-05-19 |
JPH0471340B2 true JPH0471340B2 (de) | 1992-11-13 |
Family
ID=16778426
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP22218184A Granted JPS61101062A (ja) | 1984-10-24 | 1984-10-24 | 半導体装置の製造方法 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS61101062A (de) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS625652U (de) * | 1985-06-26 | 1987-01-14 |
Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5756532U (de) * | 1980-09-22 | 1982-04-02 |
-
1984
- 1984-10-24 JP JP22218184A patent/JPS61101062A/ja active Granted
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5756532U (de) * | 1980-09-22 | 1982-04-02 |
Also Published As
Publication number | Publication date |
---|---|
JPS61101062A (ja) | 1986-05-19 |
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