JPH0457878A - Adhesive for copper-clad laminate - Google Patents
Adhesive for copper-clad laminateInfo
- Publication number
- JPH0457878A JPH0457878A JP17122790A JP17122790A JPH0457878A JP H0457878 A JPH0457878 A JP H0457878A JP 17122790 A JP17122790 A JP 17122790A JP 17122790 A JP17122790 A JP 17122790A JP H0457878 A JPH0457878 A JP H0457878A
- Authority
- JP
- Japan
- Prior art keywords
- resin
- adhesive
- copper
- epoxy
- rubber
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000853 adhesive Substances 0.000 title claims abstract description 38
- 230000001070 adhesive effect Effects 0.000 title claims abstract description 38
- 239000003822 epoxy resin Substances 0.000 claims abstract description 21
- 229920000647 polyepoxide Polymers 0.000 claims abstract description 21
- 125000003700 epoxy group Chemical group 0.000 claims abstract description 14
- 150000001875 compounds Chemical class 0.000 claims abstract description 10
- 239000000203 mixture Substances 0.000 claims abstract description 9
- 239000005060 rubber Substances 0.000 claims abstract description 9
- 229920005992 thermoplastic resin Polymers 0.000 claims abstract description 8
- 229920001971 elastomer Polymers 0.000 claims abstract description 7
- 229920002037 poly(vinyl butyral) polymer Polymers 0.000 claims abstract description 7
- 229920000459 Nitrile rubber Polymers 0.000 claims abstract description 6
- 229920005989 resin Polymers 0.000 claims description 24
- 239000011347 resin Substances 0.000 claims description 24
- 229920001187 thermosetting polymer Polymers 0.000 claims description 8
- 239000013034 phenoxy resin Substances 0.000 claims description 4
- 229920006287 phenoxy resin Polymers 0.000 claims description 4
- 239000000758 substrate Substances 0.000 claims description 2
- 229920002725 thermoplastic elastomer Polymers 0.000 claims description 2
- 238000006116 polymerization reaction Methods 0.000 abstract description 3
- 239000002904 solvent Substances 0.000 abstract description 3
- 239000007822 coupling agent Substances 0.000 abstract description 2
- 239000000945 filler Substances 0.000 abstract description 2
- 230000000593 degrading effect Effects 0.000 abstract 1
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 description 10
- 239000000463 material Substances 0.000 description 7
- 239000005011 phenolic resin Substances 0.000 description 7
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 5
- 239000003795 chemical substances by application Substances 0.000 description 5
- 239000011889 copper foil Substances 0.000 description 5
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 4
- -1 glycidyl ester Chemical class 0.000 description 4
- 229920000877 Melamine resin Polymers 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 3
- SMZOUWXMTYCWNB-UHFFFAOYSA-N 2-(2-methoxy-5-methylphenyl)ethanamine Chemical compound COC1=CC=C(C)C=C1CCN SMZOUWXMTYCWNB-UHFFFAOYSA-N 0.000 description 2
- VTYYLEPIZMXCLO-UHFFFAOYSA-L Calcium carbonate Chemical compound [Ca+2].[O-]C([O-])=O VTYYLEPIZMXCLO-UHFFFAOYSA-L 0.000 description 2
- 239000004640 Melamine resin Substances 0.000 description 2
- CERQOIWHTDAKMF-UHFFFAOYSA-N Methacrylic acid Chemical class CC(=C)C(O)=O CERQOIWHTDAKMF-UHFFFAOYSA-N 0.000 description 2
- KFSLWBXXFJQRDL-UHFFFAOYSA-N Peracetic acid Chemical compound CC(=O)OO KFSLWBXXFJQRDL-UHFFFAOYSA-N 0.000 description 2
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 2
- 229930182556 Polyacetal Natural products 0.000 description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- PPBRXRYQALVLMV-UHFFFAOYSA-N Styrene Chemical compound C=CC1=CC=CC=C1 PPBRXRYQALVLMV-UHFFFAOYSA-N 0.000 description 2
- 239000002174 Styrene-butadiene Substances 0.000 description 2
- MTAZNLWOLGHBHU-UHFFFAOYSA-N butadiene-styrene rubber Chemical compound C=CC=C.C=CC1=CC=CC=C1 MTAZNLWOLGHBHU-UHFFFAOYSA-N 0.000 description 2
- 230000000052 comparative effect Effects 0.000 description 2
- 239000003999 initiator Substances 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 239000004843 novolac epoxy resin Substances 0.000 description 2
- 229920001568 phenolic resin Polymers 0.000 description 2
- 229920001225 polyester resin Polymers 0.000 description 2
- 239000004645 polyester resin Substances 0.000 description 2
- 239000003505 polymerization initiator Substances 0.000 description 2
- 229920006324 polyoxymethylene Polymers 0.000 description 2
- 239000011115 styrene butadiene Substances 0.000 description 2
- 229920003048 styrene butadiene rubber Polymers 0.000 description 2
- KXGFMDJXCMQABM-UHFFFAOYSA-N 2-methoxy-6-methylphenol Chemical compound [CH]OC1=CC=CC([CH])=C1O KXGFMDJXCMQABM-UHFFFAOYSA-N 0.000 description 1
- 229930185605 Bisphenol Natural products 0.000 description 1
- ZTQSAGDEMFDKMZ-UHFFFAOYSA-N Butyraldehyde Chemical compound CCCC=O ZTQSAGDEMFDKMZ-UHFFFAOYSA-N 0.000 description 1
- 239000004593 Epoxy Substances 0.000 description 1
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 1
- 239000005062 Polybutadiene Substances 0.000 description 1
- 239000006087 Silane Coupling Agent Substances 0.000 description 1
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 1
- 150000008065 acid anhydrides Chemical class 0.000 description 1
- 229920000800 acrylic rubber Polymers 0.000 description 1
- 125000001931 aliphatic group Chemical group 0.000 description 1
- WNROFYMDJYEPJX-UHFFFAOYSA-K aluminium hydroxide Chemical compound [OH-].[OH-].[OH-].[Al+3] WNROFYMDJYEPJX-UHFFFAOYSA-K 0.000 description 1
- 150000001412 amines Chemical class 0.000 description 1
- 239000000010 aprotic solvent Substances 0.000 description 1
- 125000003118 aryl group Chemical group 0.000 description 1
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 description 1
- 229910000019 calcium carbonate Inorganic materials 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- GYZLOYUZLJXAJU-UHFFFAOYSA-N diglycidyl ether Chemical class C1OC1COCC1CO1 GYZLOYUZLJXAJU-UHFFFAOYSA-N 0.000 description 1
- 239000003085 diluting agent Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 150000002148 esters Chemical class 0.000 description 1
- 238000009472 formulation Methods 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 150000002576 ketones Chemical class 0.000 description 1
- 239000000178 monomer Substances 0.000 description 1
- 150000002978 peroxides Chemical class 0.000 description 1
- 150000002989 phenols Chemical class 0.000 description 1
- 125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 description 1
- 229920000058 polyacrylate Polymers 0.000 description 1
- 239000003586 protic polar solvent Substances 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
- 229920003987 resole Polymers 0.000 description 1
- 239000000377 silicon dioxide Substances 0.000 description 1
- 229910001220 stainless steel Inorganic materials 0.000 description 1
- 239000010935 stainless steel Substances 0.000 description 1
- 239000010936 titanium Substances 0.000 description 1
- 229910052719 titanium Inorganic materials 0.000 description 1
- 229920006337 unsaturated polyester resin Polymers 0.000 description 1
Abstract
Description
【発明の詳細な説明】 〔産業上の利用分野〕 本発明は銅張積層板用接着剤に関する。[Detailed description of the invention] [Industrial application field] The present invention relates to an adhesive for copper-clad laminates.
従来、基材に熱硬化性樹脂を含浸させたプリプレグと接
着剤を塗布した銅箔を重ね合わせ、これを加熱、必要な
らば加圧する銅張積層板の製造方法ニおいて、接着剤と
して、ポリビニルブチラールのようなポリアセタール樹
脂やニトリルゴムのようなゴムに、エポキシ樹脂、フェ
ノール樹脂やメラミン樹脂の単独又は混合物を混合した
ものが使用されている。Conventionally, in the manufacturing method of copper-clad laminates, the base material is a prepreg impregnated with a thermosetting resin and a copper foil coated with an adhesive, which are then heated and, if necessary, pressurized. Polyacetal resins such as polyvinyl butyral, rubbers such as nitrile rubber, and epoxy resins, phenol resins, and melamine resins, singly or in combination, are used.
ポリアセタール樹脂又はゴムに、エポキシ樹脂、フェノ
ール樹脂やメラミン樹脂の単独又は混合物を混合したも
のを銅張積層板用の接着剤として用いた場合、接着強度
は良好なものの、エポキシ樹脂、フェノール樹脂、メラ
ミン樹脂が熱硬化性樹脂のため、室温でも反応が進み、
保存安定性が不十分という問題点があった０本発明は接
着強度の低下をきたすことなく、保存安定性の良好な銅
張積層板用の接着剤を提供することを目的とするもので
ある。When polyacetal resin or rubber is used alone or as a mixture of epoxy resin, phenol resin, or melamine resin as an adhesive for copper-clad laminates, the adhesive strength is good, but the epoxy resin, phenol resin, or melamine resin Since the resin is a thermosetting resin, the reaction proceeds even at room temperature.
There has been a problem of insufficient storage stability.The object of the present invention is to provide an adhesive for copper-clad laminates that has good storage stability without causing a decrease in adhesive strength. .
本発明者らは上記問題点を解決するために鋭意研究を行
った結果、接着剤成分として分子内にエポキシ基及びα
、β−不飽和二重結合を含有する化合物を配合した接着
剤により、上記目的が達成される、：とを見出し、この
知見に基づいて本発明を完成するに至った。The present inventors conducted intensive research to solve the above problems and found that the adhesive component contains an epoxy group and α
The inventors have discovered that the above object can be achieved by an adhesive containing a compound containing a β-unsaturated double bond, and have completed the present invention based on this knowledge.
すなわち、本発明は（ａ）熱可塑性樹脂、ゴム又はこれ
らの混合物、わ）分子内に２個以上のエポキシ基を含有
するエポキシ樹脂並びに（ｃ）分子内にエポキシ基及び
α、β−不飽和二重結合を含有する化合物からなること
を特徴とする銅張積層板用接着剤を提供するものである
。That is, the present invention relates to (a) a thermoplastic resin, a rubber, or a mixture thereof; (b) an epoxy resin containing two or more epoxy groups in the molecule; and (c) an epoxy resin containing an epoxy group and α,β-unsaturation in the molecule. The present invention provides an adhesive for copper-clad laminates characterized by comprising a compound containing a double bond.
本発明において用いられる（ａ）成分の熱可塑性樹脂と
してはポリビニルブチラール樹脂、フェノキシ樹脂、ポ
リエステル樹脂、スチレンブタジェン樹脂などがある。Thermoplastic resins as component (a) used in the present invention include polyvinyl butyral resins, phenoxy resins, polyester resins, and styrene-butadiene resins.
ポリビニルブチラール樹脂のブチラール化度、重合度は
特に制限されないが、ブチラール化度６０〜７０モル％
、重合度１，５００〜２，０００のものが好ましい。具
体的にはエスレックＢＸ−１、ＢＸ−２、ＢＸ−５５（
種水化学工業社製、商品名）、電化ブチラール４０００
−２．５０００−Ａ、６０００−Ｃ（電気化学工業社製
、商品名）などが挙げられる。フェノキシ樹脂の分子量
は制限されないが分子量が約７，０００〜２００゜００
０のものが好ましい、具体的にはＹＰ−５０（東部化成
社製、商品名）が挙げられる。ポリエステル樹脂も特に
制限するものではない、具体的にはＰ−３０Ｂ、Ｐ−４
０Ｂ、Ｐ−４０Ｈ（東洋紡社製、商品名）が挙げられる
。スチレンブタジェン樹脂も制限するものではなく、具
体的にはＭ１９１１、Ｍ１９１３（旭化成工業社製、商
品名）が挙げられる。これらの熱可塑性樹脂は単独でも
２種以上の組み合わせでも使用可能である。The degree of butyralization and degree of polymerization of polyvinyl butyral resin are not particularly limited, but the degree of butyralization is 60 to 70 mol%.
, those having a degree of polymerization of 1,500 to 2,000 are preferred. Specifically, S-LEC BX-1, BX-2, BX-55 (
Manufactured by Tanemizu Kagaku Kogyo Co., Ltd. (trade name), Denka Butyral 4000
-2.5000-A, 6000-C (manufactured by Denki Kagaku Kogyo Co., Ltd., trade name), and the like. The molecular weight of the phenoxy resin is not limited, but the molecular weight is approximately 7,000 to 200°00.
0 is preferable, and a specific example is YP-50 (manufactured by Tobu Kasei Co., Ltd., trade name). Polyester resin is also not particularly limited, specifically P-30B, P-4
Examples include 0B and P-40H (manufactured by Toyobo Co., Ltd., trade name). The styrene-butadiene resin is not limited either, and specific examples thereof include M1911 and M1913 (manufactured by Asahi Kasei Kogyo Co., Ltd., trade name). These thermoplastic resins can be used alone or in combination of two or more.
接着強度からポリビニルブチラール樹脂、フェノキシ樹
脂が好ましい、更に好ましくはポリビニルブチラール樹
脂である。Polyvinyl butyral resin and phenoxy resin are preferred from the viewpoint of adhesive strength, and polyvinyl butyral resin is more preferred.
ゴムとしては、ニトリルゴム、ブタジェンゴム、アクリ
ルゴムなどがある。接着強度からニトリルゴムが好まし
い、具体的にはＮ１ｐｏｌ １０４１（日本ゼオン社
製、商品名）が挙げられる。Examples of rubber include nitrile rubber, butadiene rubber, and acrylic rubber. Nitrile rubber is preferred from the viewpoint of adhesive strength, and a specific example is N1pol 1041 (manufactured by Nippon Zeon Co., Ltd., trade name).
（ｂ）成分の分子内に２個以上のエポキシ基を含有する
エポキシ樹脂としてはフェノールノボラック型エポキシ
樹脂、タレゾールノボラック型エポキシ樹脂、レゾール
型エポキシ樹脂、ビスフェノール型エポキシ樹脂などの
フェノール類のグリシジルエーテルであるエポキシ樹脂
（フェノール型エポキシ樹脂）やグリシジルエステル型
エポキシ樹脂、ハロゲン化エポキシ樹脂、可撓性エポキ
シ樹脂などが挙げられ、分子内に２個以上のエポキシ基
を含有していればいずれのエポキシ樹脂であっても又は
それらの混合物であっても使用可能である。(b) Epoxy resins containing two or more epoxy groups in the molecule of the component include glycidyl ethers of phenols such as phenol novolac epoxy resins, talesol novolac epoxy resins, resol epoxy resins, and bisphenol epoxy resins. Examples include epoxy resins (phenol type epoxy resins), glycidyl ester type epoxy resins, halogenated epoxy resins, flexible epoxy resins, etc., and any epoxy resin containing two or more epoxy groups in the molecule. Either a resin or a mixture thereof can be used.
（ｃ）成分の分子内にエポキシ基とα、β−不飽和二重
結合を含有する化合物としては、フェノール樹脂をアク
リルエステル化した後、アクリル基の二重結合の一部を
過酢酸でエポキシ化したもの、エポキシ樹脂をアクリル
酸又はメタクリル酸誘導体でエステル化したものなどが
あり、原料樹脂、エポキシ基導入法、α、β−不飽和結
合導入法等について特に制限するものではない。(c) For compounds containing an epoxy group and α,β-unsaturated double bonds in the molecule of component, after acrylic esterifying a phenol resin, some of the double bonds of the acrylic group are epoxied with peracetic acid. Examples include those obtained by esterifying an epoxy resin with an acrylic acid or methacrylic acid derivative, etc., and there are no particular restrictions on the raw material resin, the method for introducing an epoxy group, the method for introducing an α, β-unsaturated bond, etc.
（ａ）成分の熱可塑性樹脂、ゴム、又はこれらの混合物
の部数（Ａ）〔重量部、以下同し〕とル）成分の分子内
に２個以上のエポキシ基を含有するエポキシ樹脂の部数
（Ｂ）と（ｃ）成分の分子内にエポキシ基とα、β−不
飽和二重結合を含有する化合物の部数（ｃ）の割合は、
次式に示されるような割合とすることが好ましい。(a) The number of parts of the thermoplastic resin, rubber, or a mixture thereof (A) [parts by weight, the same hereinafter] and the number of parts of the epoxy resin containing two or more epoxy groups in the molecule of the component (A) The ratio of parts (c) of compounds containing an epoxy group and α, β-unsaturated double bonds in the molecules of components B) and (c) is:
It is preferable to set the ratio as shown in the following formula.
更に好ましくは
Ａ
かつ
更に好ましくは
Ａ／Ａ＋Ｂ＋Ｃが０．０５以下であると接着剤の柔軟性
が十分でなく接着強度がでない、一方０．９以上である
と柔らかくなりすぎ、これまた接着強度がでない。Ｂ／
Ｂ＋Ｃが０．０５以下であると接着強度がでない、一方
０．９以上であると保存安定性が不十分である。More preferably A, and even more preferably A/A+B+C of 0.05 or less, the adhesive will not have sufficient flexibility and will not have adhesive strength, while if it is 0.9 or more, it will become too soft and the adhesive strength will also decrease. Not. B/
When B+C is 0.05 or less, the adhesive strength is poor, while when it is 0.9 or more, storage stability is insufficient.
エポキシ樹脂には必要に応じ、硬化剤、硬化促進剤を配
合したものを用いる。硬化剤としてはアミン系硬化剤、
酸無水物系硬化剤、フェノール樹脂などがあり、特に制
限するものではない、また、エポキシ樹脂の硬化促進剤
としては、イミダゾール系促進剤、アミン系促進剤があ
り、特に制限するものではない、α、β−不飽和二重結
合を含有する化合物には必要に応じ、重合開始剤を配合
したものを用いる０重合開始剤としてはアゾ系開始剤、
過酸化物系開始剤があり、特に制限するものではない。The epoxy resin used may contain a curing agent and a curing accelerator, if necessary. As a curing agent, an amine curing agent,
Examples of curing accelerators for epoxy resins include acid anhydride curing agents and phenolic resins, but are not particularly limited. For compounds containing α,β-unsaturated double bonds, a polymerization initiator should be added as necessary.As the polymerization initiator, an azo initiator,
Peroxide-based initiators may be used, but are not particularly limited.
本発明の接着剤を使用する銅張積層板は基材として紙基
材、ガラス基材などを用いたものが用いられるが、銅張
積層板に用いられる基材であれば特に制限はない。The copper-clad laminate using the adhesive of the present invention may use a paper base material, a glass base material, or the like as a base material, but there are no particular limitations as long as the base material is used for copper-clad laminates.
また、上記基材に含浸させる熱硬化性樹脂としてはエポ
キシ樹脂、フェノール樹脂、不飽和ポリエステル樹脂、
アクリルエステル樹脂などが用いられる。また、上記熱
硬化性樹脂の混合物も使用される。さらに、これらに重
合可能なα、β−不飽和二重結合をもつモノマーを配合
したものであってもよい、熱硬化性樹脂が系中に重合可
能なα。In addition, examples of the thermosetting resin to be impregnated into the base material include epoxy resin, phenol resin, unsaturated polyester resin,
Acrylic ester resin or the like is used. Mixtures of the above thermosetting resins may also be used. Further, a thermosetting resin may be blended with a monomer having a polymerizable α, β-unsaturated double bond, and α is a thermosetting resin that can be polymerized in the system.
β−不飽和二重結合を含む場合、接着強度が向上し好ま
しい。When it contains a β-unsaturated double bond, the adhesive strength is improved, which is preferable.
本発明の接着剤には、水酸化アルミニウム、炭酸カルシ
ウム、シリカなどの充填側、またシランカップリング剤
、チタンカップリング剤などの処理剤を添加することも
可能である。It is also possible to add fillers such as aluminum hydroxide, calcium carbonate, and silica, and processing agents such as silane coupling agents and titanium coupling agents to the adhesive of the present invention.
本発明の銅張積層板用接着剤は、銅張積層板の連続製造
方式又はバッチ製造方式、いずれの方式への適用も可能
である。The adhesive for copper-clad laminates of the present invention can be applied to either a continuous manufacturing method or a batch manufacturing method of copper-clad laminates.
接着剤の溶剤として、アルコール、ケトン、芳香族、脂
肪族、その他極性のプロチック、アプロチックな溶剤を
使用することができる。また、フェニルグリシジエテー
ルなどの一官能エポキシ化合物、スチレンやアクリル酸
、メタクリル酸及びそれらの誘導体のエステル化物など
のα、β−不飽和二重結合を分子中に１個含有する、い
わゆる反応性の希釈剤の使用も可能である。As the solvent for the adhesive, alcohol, ketone, aromatic, aliphatic, and other polar protic or aprotic solvents can be used. In addition, monofunctional epoxy compounds such as phenyl glycidiether, esters of styrene, acrylic acid, methacrylic acid, and their derivatives, which contain one α,β-unsaturated double bond in the molecule, are so-called reactive. The use of diluents is also possible.
以下、本発明を実施例に基づいて詳細に説明するが、本
発明はこれに限定されるものではない。Hereinafter, the present invention will be explained in detail based on Examples, but the present invention is not limited thereto.
実施例１〜３、比較例１〜３
第１表に示す接着剤配合で溶剤に均一に溶解させて銅張
積層板用接着剤を得た。この接着剤をロールコータで厚
さ３５μｍの銅箔に塗布し乾燥させて接着剤厚み４０μ
ｍの接着剤付銅箔を得た。Examples 1 to 3, Comparative Examples 1 to 3 Adhesives for copper-clad laminates were obtained by uniformly dissolving them in a solvent using the adhesive formulations shown in Table 1. Apply this adhesive to a 35μm thick copper foil using a roll coater and dry it to make the adhesive 40μm thick.
A copper foil with an adhesive of m was obtained.
水溶性フェノール樹脂で下処理した紙基材に熱硬化性樹
脂を含浸、乾燥してプリプレグを得た。下処理樹脂付着
分１５重量％、前樹脂付着量５０重量％であった。A paper base material pretreated with a water-soluble phenolic resin was impregnated with a thermosetting resin and dried to obtain a prepreg. The pretreatment resin adhesion amount was 15% by weight, and the pretreatment resin adhesion amount was 50% by weight.
銅箔の接着剤側にプリプレグ８枚を重ねて積層体としス
テンレス鏡板に挟んで１６０℃、１１００）ｃ／ｃｊで
６０分間加熱加圧成形して銅張積層板を得た。この銅張
積層板の接着強度を第１表に示す。Eight sheets of prepreg were stacked on the adhesive side of the copper foil to form a laminate, which was sandwiched between stainless steel end plates and heated and pressure-molded at 160° C. and 1100) c/cj for 60 minutes to obtain a copper-clad laminate. Table 1 shows the adhesive strength of this copper-clad laminate.
また、接着剤の保存安定性を調べる目的で接着剤を２５
℃で保存したときの結果も第１表に示す。In addition, for the purpose of examining the storage stability of adhesives, 25%
The results when stored at °C are also shown in Table 1.
実施例と比較例の接着強さ、保存安定性を示した第１表
より本発明のものは接着強さの低下をきたすことなく、
保存安定性が良好となっており、本発明の優れているこ
とをｉｔ認した。From Table 1 showing the adhesive strength and storage stability of Examples and Comparative Examples, the products of the present invention did not cause a decrease in adhesive strength.
The storage stability was good, confirming the superiority of the present invention.
（以下余白）
（発明の効果〕
本発明により銅箔と基板の接着強度の低下をきたすこと
なく、
保存安定性に優れている銅張積層
板用接着剤が得られ、
その工業的価値は極めて大
である。(The following is a blank space) (Effects of the invention) The present invention provides an adhesive for copper-clad laminates that does not reduce the adhesive strength between the copper foil and the substrate and has excellent storage stability, and its industrial value is extremely high. It's large.
悔東部化成製Manufactured by Tobu Kasei
Claims (4)
ｂ）分子内に２個以上のエポキシ基を含有するエポキシ
樹脂並びに（ｃ）分子内にエポキシ基及びα，β−不飽
和二重結合を含有する化合物からなることを特徴とする
銅張積層板用接着剤。1. (a) Thermoplastic resin, rubber or mixture thereof, (
A copper-clad laminate comprising b) an epoxy resin containing two or more epoxy groups in the molecule; and (c) a compound containing an epoxy group and an α,β-unsaturated double bond in the molecule. Adhesive for use.
ノキシ樹脂から選ばれた少なくとも１種の樹脂である請
求項１記載の銅張積層板用接着剤。2. The adhesive for copper-clad laminates according to claim 1, wherein the thermoplastic resin is at least one resin selected from polyvinyl butyral resin and phenoxy resin.
板用接着剤。3. The adhesive for copper-clad laminates according to claim 1, wherein the rubber is nitrile rubber.
性樹脂を基材に含浸硬化させた基板からなる銅張積層板
用の請求項１、２又は３記載の銅張積層板用接着剤。4. The adhesive for copper-clad laminates according to claim 1, 2 or 3, which is used for copper-clad laminates comprising a substrate obtained by impregnating and curing a thermosetting resin containing a compound containing a polymerizable double bond.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP17122790A JPH0457878A (en) | 1990-06-28 | 1990-06-28 | Adhesive for copper-clad laminate |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP17122790A JPH0457878A (en) | 1990-06-28 | 1990-06-28 | Adhesive for copper-clad laminate |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0457878A true JPH0457878A (en) | 1992-02-25 |
Family
ID=15919405
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP17122790A Pending JPH0457878A (en) | 1990-06-28 | 1990-06-28 | Adhesive for copper-clad laminate |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0457878A (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2003238925A (en) * | 2002-02-19 | 2003-08-27 | Hitachi Chem Co Ltd | Adhesive agent composition and adhesive film |
| DE102004057651A1 (en) * | 2004-11-29 | 2006-06-01 | Tesa Ag | Heat-activable adhesive tape for producing and reprocessing flexible printed circuit board and bonding to polyimide, is based on composition containing acrylonitrile-butadiene copolymer, polyvinyl acetal, epoxide resin and hardener |
| DE102008007749A1 (en) | 2008-02-05 | 2009-08-06 | Tesa Se | Thermally activatable and curable adhesive film, in particular for the bonding of electronic components and flexible printed conductors |
| CN103881590A (en) * | 2014-03-10 | 2014-06-25 | 苏州捷德瑞精密机械有限公司 | Metal adhesive and preparation method thereof |
-
1990
- 1990-06-28 JP JP17122790A patent/JPH0457878A/en active Pending
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2003238925A (en) * | 2002-02-19 | 2003-08-27 | Hitachi Chem Co Ltd | Adhesive agent composition and adhesive film |
| DE102004057651A1 (en) * | 2004-11-29 | 2006-06-01 | Tesa Ag | Heat-activable adhesive tape for producing and reprocessing flexible printed circuit board and bonding to polyimide, is based on composition containing acrylonitrile-butadiene copolymer, polyvinyl acetal, epoxide resin and hardener |
| DE102008007749A1 (en) | 2008-02-05 | 2009-08-06 | Tesa Se | Thermally activatable and curable adhesive film, in particular for the bonding of electronic components and flexible printed conductors |
| CN103881590A (en) * | 2014-03-10 | 2014-06-25 | 苏州捷德瑞精密机械有限公司 | Metal adhesive and preparation method thereof |
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