JPH0457880A - Adhesive for copper-clad laminate - Google Patents
Adhesive for copper-clad laminateInfo
- Publication number
- JPH0457880A JPH0457880A JP17122990A JP17122990A JPH0457880A JP H0457880 A JPH0457880 A JP H0457880A JP 17122990 A JP17122990 A JP 17122990A JP 17122990 A JP17122990 A JP 17122990A JP H0457880 A JPH0457880 A JP H0457880A
- Authority
- JP
- Japan
- Prior art keywords
- adhesive
- resin
- copper
- rubber
- unsaturated double
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000853 adhesive Substances 0.000 title claims abstract description 37
- 230000001070 adhesive effect Effects 0.000 title claims abstract description 37
- 229920005989 resin Polymers 0.000 claims abstract description 23
- 239000011347 resin Substances 0.000 claims abstract description 23
- 150000001875 compounds Chemical class 0.000 claims abstract description 10
- 125000003700 epoxy group Chemical group 0.000 claims abstract description 10
- 239000005060 rubber Substances 0.000 claims abstract description 9
- 239000000203 mixture Substances 0.000 claims abstract description 8
- 229920005992 thermoplastic resin Polymers 0.000 claims abstract description 8
- 229920001971 elastomer Polymers 0.000 claims abstract description 7
- 229920000459 Nitrile rubber Polymers 0.000 claims abstract description 6
- 229920002037 poly(vinyl butyral) polymer Polymers 0.000 claims abstract description 6
- 229920001187 thermosetting polymer Polymers 0.000 claims description 7
- 239000013034 phenoxy resin Substances 0.000 claims description 4
- 229920006287 phenoxy resin Polymers 0.000 claims description 4
- 239000000758 substrate Substances 0.000 claims description 2
- 229920002725 thermoplastic elastomer Polymers 0.000 claims description 2
- 238000006116 polymerization reaction Methods 0.000 abstract description 3
- 239000002904 solvent Substances 0.000 abstract description 3
- 239000007822 coupling agent Substances 0.000 abstract description 2
- 239000000945 filler Substances 0.000 abstract description 2
- 125000000524 functional group Chemical group 0.000 abstract description 2
- 239000000463 material Substances 0.000 description 7
- 239000005011 phenolic resin Substances 0.000 description 7
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 5
- 239000003795 chemical substances by application Substances 0.000 description 5
- 239000011889 copper foil Substances 0.000 description 5
- 239000003822 epoxy resin Substances 0.000 description 5
- 229920000647 polyepoxide Polymers 0.000 description 5
- 229920000877 Melamine resin Polymers 0.000 description 3
- 229930182556 Polyacetal Natural products 0.000 description 3
- RAXXELZNTBOGNW-UHFFFAOYSA-N imidazole Natural products C1=CNC=N1 RAXXELZNTBOGNW-UHFFFAOYSA-N 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 3
- 229920006324 polyoxymethylene Polymers 0.000 description 3
- VTYYLEPIZMXCLO-UHFFFAOYSA-L Calcium carbonate Chemical compound [Ca+2].[O-]C([O-])=O VTYYLEPIZMXCLO-UHFFFAOYSA-L 0.000 description 2
- 239000004640 Melamine resin Substances 0.000 description 2
- KFSLWBXXFJQRDL-UHFFFAOYSA-N Peracetic acid Chemical compound CC(=O)OO KFSLWBXXFJQRDL-UHFFFAOYSA-N 0.000 description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- 239000002174 Styrene-butadiene Substances 0.000 description 2
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 2
- -1 acrylic ester Chemical class 0.000 description 2
- 150000001412 amines Chemical class 0.000 description 2
- MTAZNLWOLGHBHU-UHFFFAOYSA-N butadiene-styrene rubber Chemical compound C=CC=C.C=CC1=CC=CC=C1 MTAZNLWOLGHBHU-UHFFFAOYSA-N 0.000 description 2
- 230000000052 comparative effect Effects 0.000 description 2
- 239000003999 initiator Substances 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 229920001225 polyester resin Polymers 0.000 description 2
- 239000004645 polyester resin Substances 0.000 description 2
- 239000003505 polymerization initiator Substances 0.000 description 2
- 239000011115 styrene butadiene Substances 0.000 description 2
- 229920003048 styrene butadiene rubber Polymers 0.000 description 2
- SMZOUWXMTYCWNB-UHFFFAOYSA-N 2-(2-methoxy-5-methylphenyl)ethanamine Chemical compound COC1=CC=C(C)C=C1CCN SMZOUWXMTYCWNB-UHFFFAOYSA-N 0.000 description 1
- KXGFMDJXCMQABM-UHFFFAOYSA-N 2-methoxy-6-methylphenol Chemical compound [CH]OC1=CC=CC([CH])=C1O KXGFMDJXCMQABM-UHFFFAOYSA-N 0.000 description 1
- ZTQSAGDEMFDKMZ-UHFFFAOYSA-N Butyraldehyde Chemical compound CCCC=O ZTQSAGDEMFDKMZ-UHFFFAOYSA-N 0.000 description 1
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 1
- CERQOIWHTDAKMF-UHFFFAOYSA-N Methacrylic acid Chemical class CC(=C)C(O)=O CERQOIWHTDAKMF-UHFFFAOYSA-N 0.000 description 1
- 240000007594 Oryza sativa Species 0.000 description 1
- 235000007164 Oryza sativa Nutrition 0.000 description 1
- 239000005062 Polybutadiene Substances 0.000 description 1
- 239000006087 Silane Coupling Agent Substances 0.000 description 1
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 1
- 150000008065 acid anhydrides Chemical class 0.000 description 1
- 229920000800 acrylic rubber Polymers 0.000 description 1
- 125000001931 aliphatic group Chemical group 0.000 description 1
- WNROFYMDJYEPJX-UHFFFAOYSA-K aluminium hydroxide Chemical compound [OH-].[OH-].[OH-].[Al+3] WNROFYMDJYEPJX-UHFFFAOYSA-K 0.000 description 1
- 239000000010 aprotic solvent Substances 0.000 description 1
- 125000003118 aryl group Chemical group 0.000 description 1
- 229910000019 calcium carbonate Inorganic materials 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000009472 formulation Methods 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 description 1
- 150000002576 ketones Chemical class 0.000 description 1
- 150000002978 peroxides Chemical class 0.000 description 1
- 229920001568 phenolic resin Polymers 0.000 description 1
- 229920000058 polyacrylate Polymers 0.000 description 1
- 239000003586 protic polar solvent Substances 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
- 235000009566 rice Nutrition 0.000 description 1
- 239000000377 silicon dioxide Substances 0.000 description 1
- 229910001220 stainless steel Inorganic materials 0.000 description 1
- 239000010935 stainless steel Substances 0.000 description 1
- 239000010936 titanium Substances 0.000 description 1
- 229910052719 titanium Inorganic materials 0.000 description 1
- 229920006337 unsaturated polyester resin Polymers 0.000 description 1
Abstract
Description
【発明の詳細な説明】 〔産業上の利用分野〕 本発明は銅張積層板用接着剤に間する。[Detailed description of the invention] [Industrial application field] The present invention relates to an adhesive for copper-clad laminates.
従来、基材に熱硬化性樹脂を含浸させたプリプレグと接
着剤を塗布した銅箔を重ね合わせ、これを加熱、必要な
らば加圧する銅張積層板の製造方法において、接着剤と
して、ポリビニルブチラールのようなポリアセタール樹
脂やニトリルゴムのようなゴムにエポキシ樹脂、フェノ
ール樹脂やメラミン樹脂の単独又は混合物を混合したも
のが使用されている。Conventionally, in the manufacturing method of copper-clad laminates, the base material is a prepreg impregnated with a thermosetting resin and a copper foil coated with an adhesive, which are then heated and, if necessary, pressed. Polyacetal resins such as polyacetal resins and rubbers such as nitrile rubber are used, together with epoxy resins, phenol resins, and melamine resins, either singly or in combination.
ポリアセタール樹脂又はゴムにエポキシ樹脂、フェノー
ル樹脂やメラミン樹脂の単独又は混合物を混合したもの
を銅張積層板用の接着剤として用いた場合、接着強度は
良好なものの、エポキシ樹脂、フェノール樹脂、メラミ
ン樹脂が熱硬化性樹脂のため、室温でも反応が進み、保
存安定性が不十分という問題点があった。本発明は接着
強度の低下をきたすことなく、保存安定性の良好な銅張
積層板用の接着剤を提供することを目的とするものであ
る。When polyacetal resin or rubber is used alone or as a mixture of epoxy resin, phenol resin, or melamine resin as an adhesive for copper-clad laminates, the adhesive strength is good, but the epoxy resin, phenol resin, or melamine resin Since it is a thermosetting resin, the reaction proceeds even at room temperature, resulting in insufficient storage stability. An object of the present invention is to provide an adhesive for copper-clad laminates that has good storage stability without causing a decrease in adhesive strength.
（課題を解決するための手段〕
本発明者らは上記問題点を解決するために鋭意研究を行
った結果、接着剤成分として分子内にエポキシ基及びα
、β−不飽和二重結合を含有する化合物を配合した接着
剤により、上記目的が達成されることを見出し、この知
見に基づいて本発明を完成するに至った。(Means for Solving the Problems) The present inventors have conducted extensive research to solve the above problems, and have found that epoxy groups and α
The inventors have discovered that the above object can be achieved by an adhesive containing a compound containing a β-unsaturated double bond, and based on this knowledge, the present invention has been completed.
すなわち、本発明は（ａ）熱可塑性樹脂、ゴム又はこれ
らの混合物並びに（ｂ）分子内に２個以上のエポキシ基
及びα、β−不飽和二重結合を含有する化合物からなる
ことを特徴とする銅張積層板用接着剤を提供するもので
ある。That is, the present invention is characterized in that it consists of (a) a thermoplastic resin, a rubber, or a mixture thereof, and (b) a compound containing two or more epoxy groups and an α,β-unsaturated double bond in the molecule. The present invention provides an adhesive for copper-clad laminates.
本発明において用いられる（ａ）成分の熱可塑性樹脂と
してはポリビニルブチラール樹脂、フェノキシ樹脂、ポ
リエステル樹脂、スチレンブタジェン樹脂などがある。Thermoplastic resins as component (a) used in the present invention include polyvinyl butyral resins, phenoxy resins, polyester resins, and styrene-butadiene resins.
ポリビニルブチラール樹脂のブチラール化度、重合度は
特に制限されないが、ブチラール化度６０〜７０モル％
、重合度１，５００〜２，０００のものが好ましい。具
体的にはエスレックＢＸ−１、ＢＸ−２、ＢＸ−５５（
種水化学工業社製、商品名）、電化ブチラール４０００
−２．５０００−Ａ、６０００−Ｃ（電気化学工業社製
、商品名）などが挙げられる。フェノキシ樹脂の分子量
は制限されないが分子量が約７．０００〜２００゜ＯＯ
Ｏのものが好ましい。具体的にはＹＰ−５０（東部化成
社製、商品名）が挙げられる。ポリエステル樹脂も特に
制限するものではない。具体的にはＰ−３０Ｂ、Ｐ−４
０Ｂ、Ｐ−４０Ｈ（東洋紡社製、商品名）が挙げられる
。スチレンブタジェン樹脂も制限するものではなく、具
体的にはＭ１９１１、Ｍ１９１３ （旭化成工業社社、
商品名）が挙げられる。これらの熱可塑性樹脂は単独で
も２種以上の組み合わせでも使用可能である。The degree of butyralization and degree of polymerization of polyvinyl butyral resin are not particularly limited, but the degree of butyralization is 60 to 70 mol%.
, those having a degree of polymerization of 1,500 to 2,000 are preferred. Specifically, S-LEC BX-1, BX-2, BX-55 (
Manufactured by Tanemizu Kagaku Kogyo Co., Ltd. (trade name), Denka Butyral 4000
-2.5000-A, 6000-C (manufactured by Denki Kagaku Kogyo Co., Ltd., trade name), and the like. The molecular weight of the phenoxy resin is not limited, but the molecular weight is approximately 7.000 to 200°OO.
O is preferred. Specifically, YP-50 (manufactured by Tobu Kasei Co., Ltd., trade name) is mentioned. The polyester resin is not particularly limited either. Specifically, P-30B, P-4
Examples include 0B and P-40H (manufactured by Toyobo Co., Ltd., trade name). Styrene-butadiene resin is not limited, specifically M1911, M1913 (Asahi Kasei Industries, Ltd.,
product name). These thermoplastic resins can be used alone or in combination of two or more.
接着強度からポリビニルブチラール樹脂、フェノキシ樹
脂が好ましい。更に好ましくはポリビニルブチラール樹
脂である。Polyvinyl butyral resin and phenoxy resin are preferred from the viewpoint of adhesive strength. More preferred is polyvinyl butyral resin.
ゴムとしては、ニトリルゴム、ブタジェンゴム、アクリ
ルゴムなどがある。接着強度からニトリルゴムが好まし
い。Examples of rubber include nitrile rubber, butadiene rubber, and acrylic rubber. Nitrile rubber is preferred from the viewpoint of adhesive strength.
（ｂ）の分子内にエポキシ基とα、β−不飽和二重結合
を含有する化合物としては、フェノール樹脂をアクリル
エステル化した後、アクリル基の二重結合の一部を過酢
酸でエポキシ化したもの、エポキシ樹脂をアクリル酸又
はメタクリル酸誘導体でエステル化したものなどがあり
、原料樹脂、エポキシ基導入法、α、β−不飽和二重結
合導入法等について特に制限するものではない。For the compound containing an epoxy group and α,β-unsaturated double bonds in the molecule (b), after converting the phenol resin into acrylic ester, part of the double bonds of the acrylic group is epoxidized with peracetic acid. Examples include those obtained by esterifying an epoxy resin with an acrylic acid or methacrylic acid derivative, and there are no particular limitations on the raw material resin, the method for introducing an epoxy group, the method for introducing an α,β-unsaturated double bond, etc.
（ａ）成分の熱可塑性樹脂、ゴム又はこれらの混合物の
部数（Ａ）〔重量部、以下同じ〕と（ｂ）成分の分子内
にエポキシ基とα、β−不飽和二重結合を含有する化合
物の部数（Ｂ）の割合は次式に示されるような割合とす
ることが好ましい。(a) Number of parts of thermoplastic resin, rubber, or a mixture thereof (A) [parts by weight, same hereinafter] and component (b) containing an epoxy group and an α,β-unsaturated double bond in the molecule The ratio of the number of parts (B) of the compound is preferably as shown in the following formula.
更に好ましくは
Ａ／Ａ＋Ｂが０．０５以下であると接着剤の柔軟性が十
分でなく接着強度がでない、一方０．９以上であると柔
らかくなりすぎ、これまた接着強度がでない。More preferably, if A/A+B is 0.05 or less, the adhesive will not have sufficient flexibility and adhesive strength will be poor, while if it is 0.9 or more, it will become too soft and adhesive strength will also be poor.
分子内にエポキシ基とα、β不飽和二重結合を含有する
化合物のエポキシ基の官能基数（Ｘ）とα、β不飽和二
重結合の二重結合基数（Ｙ）の割合は次式に示されるよ
うな割合とすることが好ましい。The ratio of the number of functional groups (X) of the epoxy group to the number of double bond groups (Y) of the α, β unsaturated double bonds in a compound containing an epoxy group and α, β unsaturated double bonds in the molecule is expressed by the following formula: It is preferable to set the ratio as shown.
Ｘ／Ｘ＋ｙが０．０５以下であると接着強度が不十分で
あり、０．９５以上であると保存安定性が不十分である
。When X/X+y is 0.05 or less, the adhesive strength is insufficient, and when it is 0.95 or more, the storage stability is insufficient.
ら）成分には必要に応じ、硬化剤、硬化促進剤を配合し
たものを用いる。硬化剤としてはアミン系硬化剤、酸無
水物系硬化剤、フェノール樹脂などがあり、特に制限す
るものではない。また、硬化促進剤として、イミダゾー
ル系促進剤、アミン系促進剤があり、特に制限するもの
ではない。また、α、β−不飽和二重結合を含有する化
合物の重合開始剤を配合してもよい０重合開始剤として
はアゾ系開始剤、過酸化物系開始剤があり、特に制限す
るものではない。(3) A curing agent and a curing accelerator may be added to the component as necessary. Examples of the curing agent include amine curing agents, acid anhydride curing agents, and phenol resins, and are not particularly limited. Further, examples of the curing accelerator include imidazole accelerators and amine accelerators, and are not particularly limited. In addition, polymerization initiators of compounds containing α,β-unsaturated double bonds may be blended. Polymerization initiators include azo initiators and peroxide initiators, but there are no particular restrictions. do not have.
本発明の接着剤を使用する銅張積層板は基材として紙基
材、ガラス基材などを用いたものが用いられるが、銅張
積層板に用いられる基材であれば特に制限はない。The copper-clad laminate using the adhesive of the present invention may use a paper base material, a glass base material, or the like as a base material, but there are no particular limitations as long as the base material is used for copper-clad laminates.
また、上記基材に含浸させる熱硬化性樹脂としてはエポ
キシ樹脂、フェノール樹脂、不飽和ポリエステル樹脂、
アクリルエステル樹脂などがある。In addition, examples of the thermosetting resin to be impregnated into the base material include epoxy resin, phenol resin, unsaturated polyester resin,
Examples include acrylic ester resin.
また、上記熱硬化性樹脂の混合物の使用される。Also, mixtures of the above thermosetting resins may be used.
更に、これらに重合可能なα、β〜不飽和二重結合をも
つ七ツマ−を配合したものであってもよい。Furthermore, a heptamer having polymerizable α, β to unsaturated double bonds may be blended with these.
熱硬化性樹脂が系中に重合可能なα、β不飽和二重結合
を含む場合、接着強度が向上し好ましい。It is preferable that the thermosetting resin contains a polymerizable α,β unsaturated double bond in the system because adhesive strength is improved.
本発明の接着剤には、水酸化アルミニウム、炭酸カルシ
ウム、シリカなどの充填剤、またシランカップリング剤
、チタンカップリング剤などの処理剤を添加することも
可能である。It is also possible to add fillers such as aluminum hydroxide, calcium carbonate, and silica, and processing agents such as silane coupling agents and titanium coupling agents to the adhesive of the present invention.
本発明の銅張積層板用接着剤は、銅張積層板の連続製造
方式又はバッチ製造方式、いずれの方式への適用も可能
である。The adhesive for copper-clad laminates of the present invention can be applied to either a continuous manufacturing method or a batch manufacturing method for copper-clad laminates.
接着剤の溶剤としてアルコール、ケトン、芳香族、脂肪
族、その他種性のプロチック、アプロチックな溶剤を使
用を使用することができる。As the solvent for the adhesive, alcohol, ketone, aromatic, aliphatic, and other types of protic and aprotic solvents can be used.
以下、本発明を実施例に基づいて詳細に説明するが、本
発明はこれに限定されるものではない。Hereinafter, the present invention will be explained in detail based on Examples, but the present invention is not limited thereto.
実施例１〜２、比較例１〜２
第１表に示す接着剤配合で溶剤に均一に溶解さ、せて銅
張積層板用接着剤を得た。この接着剤をロールコータで
厚さ３５μｍの銅箔に塗布し乾燥させて接着剤厚み４０
μｍの接着剤付銅箔を得た。Examples 1-2, Comparative Examples 1-2 The adhesive formulations shown in Table 1 were uniformly dissolved in a solvent to obtain adhesives for copper-clad laminates. Apply this adhesive to a 35 μm thick copper foil using a roll coater and dry it until the adhesive thickness is 40 μm.
A μm adhesive-coated copper foil was obtained.
水溶性フェノール樹脂で下処理した紙基材に熱硬化性樹
脂を含浸、乾燥してプリプレグを得た。下処理樹脂付着
分１５重量％、全樹脂付着量５０重量％であった。A paper base material pretreated with a water-soluble phenolic resin was impregnated with a thermosetting resin and dried to obtain a prepreg. The pretreatment resin adhesion was 15% by weight, and the total resin adhesion was 50% by weight.
銅箔の接着剤側にプリプレグ８枚を重ねて積層体としス
テンレス鏡板に挟んで１６０ ’Ｃ１１００ｋｇ／ｃ１
１で６０分間加熱加圧成形して銅張積層板を得た。この
銅張積層板の接着強度を第１表に示す。8 sheets of prepreg are stacked on the adhesive side of the copper foil to form a laminate and sandwiched between stainless steel mirror plates at 160'C1100kg/c1
1 for 60 minutes to obtain a copper-clad laminate. Table 1 shows the adhesive strength of this copper-clad laminate.
また、接着剤の保存安定性を調べる目的で接着剤を２５
゛Ｃで保存したときの結果も第１表に示す。In addition, for the purpose of examining the storage stability of adhesives, 25%
Table 1 also shows the results when saving in C.
実施例と比較例の接着強さ、保存安定性を示した第１表
より本発明のものは接着強さの低下をきたすことなく１
．保存安定性が良好となっており、本発明の優れている
ことを確認した。From Table 1 showing the adhesive strength and storage stability of Examples and Comparative Examples, the adhesive strength of the present invention was 1.
．． The storage stability was good, confirming the superiority of the present invention.
第１表接１１治と接栃擦及因昨茹丼 （）−１１１＋
摺ゴヒンエル８ｊ牒
幡 東圃圀狙製
〔発明の効果〕
本発明により銅箔と基板の接着強度の低下をきたすこと
なく、保存安定性に優れている銅張積層板用接着剤が得
られ、その工業的価値は極めて大である。1st table contact 11 cures and contact tochi rubs in last boiled rice bowl ()-111+
[Effects of the Invention] The present invention provides an adhesive for copper-clad laminates that does not reduce the adhesive strength between the copper foil and the substrate and has excellent storage stability. Its industrial value is extremely large.
Claims (4)
に（ｂ）分子内に２個以上のエポキシ基及びα，β−不
飽和二重結合を含有する化合物からなることを特徴とす
る銅張積層板用接着剤。1. A copper-clad laminate comprising (a) a thermoplastic resin, rubber, or a mixture thereof; and (b) a compound containing two or more epoxy groups and an α,β-unsaturated double bond in the molecule. Adhesive for use.
ノキシ樹脂から選ばれた少なくとも１種の樹脂である請
求項１記載の銅張積層板用接着剤。2. The adhesive for copper-clad laminates according to claim 1, wherein the thermoplastic resin is at least one resin selected from polyvinyl butyral resin and phenoxy resin.
板用接着剤。3. The adhesive for copper-clad laminates according to claim 1, wherein the rubber is nitrile rubber.
性樹脂を基材に含浸硬化させた基板からなる銅張積層板
用の請求項１、２又は３記載の銅張積層板用接着剤。4. The adhesive for copper-clad laminates according to claim 1, 2 or 3, which is used for copper-clad laminates comprising a substrate obtained by impregnating and curing a thermosetting resin containing a compound containing a polymerizable double bond.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP17122990A JPH0457880A (en) | 1990-06-28 | 1990-06-28 | Adhesive for copper-clad laminate |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP17122990A JPH0457880A (en) | 1990-06-28 | 1990-06-28 | Adhesive for copper-clad laminate |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0457880A true JPH0457880A (en) | 1992-02-25 |
Family
ID=15919441
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP17122990A Pending JPH0457880A (en) | 1990-06-28 | 1990-06-28 | Adhesive for copper-clad laminate |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0457880A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE102004057651A1 (en) * | 2004-11-29 | 2006-06-01 | Tesa Ag | Heat-activable adhesive tape for producing and reprocessing flexible printed circuit board and bonding to polyimide, is based on composition containing acrylonitrile-butadiene copolymer, polyvinyl acetal, epoxide resin and hardener |
| DE102008007749A1 (en) | 2008-02-05 | 2009-08-06 | Tesa Se | Thermally activatable and curable adhesive film, in particular for the bonding of electronic components and flexible printed conductors |
-
1990
- 1990-06-28 JP JP17122990A patent/JPH0457880A/en active Pending
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE102004057651A1 (en) * | 2004-11-29 | 2006-06-01 | Tesa Ag | Heat-activable adhesive tape for producing and reprocessing flexible printed circuit board and bonding to polyimide, is based on composition containing acrylonitrile-butadiene copolymer, polyvinyl acetal, epoxide resin and hardener |
| JP2008522392A (en) * | 2004-11-29 | 2008-06-26 | テサ・アクチエンゲゼルシヤフト | Adhesive strip, thermally activated and based on nitrile rubber and polyvinyl butyral, for bonding electronic components and strip-shaped conductors together |
| DE102008007749A1 (en) | 2008-02-05 | 2009-08-06 | Tesa Se | Thermally activatable and curable adhesive film, in particular for the bonding of electronic components and flexible printed conductors |
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