JPH0457469B2 - - Google Patents
Info
- Publication number
- JPH0457469B2 JPH0457469B2 JP60081958A JP8195885A JPH0457469B2 JP H0457469 B2 JPH0457469 B2 JP H0457469B2 JP 60081958 A JP60081958 A JP 60081958A JP 8195885 A JP8195885 A JP 8195885A JP H0457469 B2 JPH0457469 B2 JP H0457469B2
- Authority
- JP
- Japan
- Prior art keywords
- carrier
- workpiece
- suction
- suction head
- turntable
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 230000007246 mechanism Effects 0.000 claims description 35
- 239000000969 carrier Substances 0.000 claims description 12
- 238000005498 polishing Methods 0.000 claims description 10
- 238000006243 chemical reaction Methods 0.000 description 4
- 238000011109 contamination Methods 0.000 description 3
- 238000001514 detection method Methods 0.000 description 3
- 238000000034 method Methods 0.000 description 3
- 230000008569 process Effects 0.000 description 3
- 238000006073 displacement reaction Methods 0.000 description 2
- 238000003754 machining Methods 0.000 description 2
- 238000013459 approach Methods 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 230000008602 contraction Effects 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000001788 irregular Effects 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 238000007517 polishing process Methods 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 230000032258 transport Effects 0.000 description 1
- 235000012431 wafers Nutrition 0.000 description 1
Landscapes
- Constituent Portions Of Griding Lathes, Driving, Sensing And Control (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
Description
【発明の詳細な説明】
「産業上の利用分野」
本発明は、半導体ウエハなどのワークの研磨加
工を自動的に行うための平面自動研磨装置に関す
るものである。DETAILED DESCRIPTION OF THE INVENTION "Field of Industrial Application" The present invention relates to an automatic surface polishing apparatus for automatically polishing workpieces such as semiconductor wafers.
「従来の技術」
従来、ラツピング装置やポリツシング装置のよ
うに、回転する内歯歯車と太陽歯車との間にキヤ
リヤを噛合させ、このキヤリヤに保持させたワー
クを上下の定盤によつて研磨加工するようにした
ものは知られているが、この種従来の平面研磨装
置においては、キヤリヤ及びワークの装置及び取
出しを人手に頼つていたため、非能率的且つ非量
産的であり、しかも、作業者自身が汚染源となつ
たり、加工面に接触してその品質低下を来し易い
等の問題があつた。"Conventional Technology" Conventionally, in lapping machines and polishing machines, a carrier is meshed between a rotating internal gear and a sun gear, and the workpiece held by this carrier is polished by upper and lower surface plates. However, in this type of conventional surface polishing equipment, the equipment and removal of the carrier and workpieces relied on manual labor, which was inefficient and not suitable for mass production. There were problems such as the worker himself becoming a source of contamination or coming into contact with the processed surface and easily causing quality deterioration.
「発明が解決しようとする問題点」
本発明の課題は、キヤリヤ及びワークの装填か
ら取出しまでを自動化可能に構成することによつ
て加工能率の向上を図ると同時に、作業者による
ワークの汚染を防止することにある。"Problems to be Solved by the Invention" An object of the present invention is to improve processing efficiency by automating the process from loading to unloading of carriers and workpieces, and at the same time to prevent contamination of workpieces by workers. The purpose is to prevent it.
「問題点を解決するための手段」
上記課題を解決するため、本発明における平面
自動研磨装置は、複数のワーク保持穴を備え且つ
外周にギヤを備えたキヤリヤと、円周方向に一定
間隔で配列された複数のキヤリヤに同時に噛合
し、これらのキヤリヤを駆動する内歯歯車及び太
陽歯車と、上記キヤリヤに保持されたワークを研
磨する上下の定盤と、ロボツトアームの先端に吸
着ヘツドを回転制御可能に取付け、該吸着ヘツド
に、キヤリヤと該キヤリヤに保持されたワークと
を同時に吸着可能な複数の吸盤を設けたワークの
搬入・搬出機構と、該搬入・搬出機構と対応する
位置に配設され、正逆方向に180゜ずつ回転可能に
軸支された台板上に、複数のキヤリヤ載置台をそ
れぞれ一定角度ずつ間欠回転可能に配設してなる
ターンテーブルと、ロボツトアームの先端に設け
た吸着ヘツドにワークを吸着するための吸盤を備
え、上記ターンテーブルにおける載置台上のキヤ
リヤに対してワークの供給及び取出しを行うワー
クの交換機構とを備えたものとして構成してい
る。"Means for Solving the Problems" In order to solve the above problems, the automatic surface polishing apparatus of the present invention includes a carrier having a plurality of work holding holes and gears on the outer periphery, and An internal gear and a sun gear that mesh with and drive a plurality of arranged carriers at the same time, upper and lower surface plates that polish the workpiece held by the carriers, and a rotating suction head at the tip of the robot arm. A workpiece loading/unloading mechanism is provided with a plurality of suction cups that are controllably mounted and capable of simultaneously sucking a carrier and a workpiece held by the carrier on the suction head, and the workpiece loading/unloading mechanism is arranged at a position corresponding to the loading/unloading mechanism. A turntable consists of a plurality of carrier mounting tables each of which is rotatable intermittently at a fixed angle on a base plate that is rotatably rotated by 180 degrees in the forward and reverse directions, and a turntable at the tip of the robot arm. The suction head provided therein is equipped with a suction cup for suctioning the workpiece, and a workpiece exchange mechanism is provided for supplying and taking out the workpiece to and from the carrier on the mounting table of the turntable.
「実施例」
以下、本発明の実施例を図面に基づいて詳細に
説明するに、第１図及び第２図において、１は機
体、２は該機体１の中央に配設された下定盤、３
は不定盤２回りにおいて上下動自在の内歯歯車、
４は下定盤２の中央に位置する太陽歯車、５はシ
リンダ６によつて上下動自在の上定盤であつて、
こられにより構成される加工部７は、公知の平面
研磨装置の場合と同様に、内歯歯車３と太陽歯車
４とに複数のキヤリヤ８を噛合させ、これらのキ
ヤリヤ８に保持させたワーク９を上下の定盤２，
５によつて研磨加工するように構成されている。"Embodiment" Hereinafter, an embodiment of the present invention will be described in detail based on the drawings. In FIGS. 1 and 2, 1 is a fuselage, 2 is a lower surface plate disposed in the center of the fuselage 1, 3
is an internal gear that can freely move up and down around two irregular plates,
4 is a sun gear located at the center of the lower surface plate 2; 5 is an upper surface plate that can be moved vertically by a cylinder 6;
The processing section 7 configured by these has a plurality of carriers 8 meshed with the internal gear 3 and the sun gear 4, and a workpiece 9 held by these carriers 8, as in the case of a known surface polishing device. Upper and lower surface plate 2,
5 is configured to perform polishing processing.
上記キヤリヤ８は、第５図に詳細に示すよう
に、ワーク９を嵌合させるための複数のワーク保
持穴１０を円周方向に一定間隔で設けると共に、
その外周にキヤ１１を形成したもので、該キヤリ
ヤ８の中央部には、中心に位置するセンタ孔１２
と、該センタ孔１２の回りに位置して上記ワーク
保持穴１０とそれぞれ対応する複数の位置決め用
小孔１３とを穿設し、これらのセンタ孔１２と位
置決め用小孔１３とは、互いに大きさを異にする
などして区別している。 As shown in detail in FIG. 5, the carrier 8 is provided with a plurality of workpiece holding holes 10 at regular intervals in the circumferential direction, into which the workpieces 9 are fitted.
A carrier 11 is formed on the outer periphery of the carrier 8, and a center hole 12 located at the center is provided in the center of the carrier 8.
A plurality of small positioning holes 13 are formed around the center hole 12 and correspond to the workpiece holding hole 10, respectively, and the center hole 12 and the small positioning holes 13 are arranged so that the size of each hole is small. They are distinguished by different sizes.
上記加工部７の近傍には、キヤリヤ８及びワー
ク９を該加工部７に対して搬入及び搬出するため
の搬入・搬出機構１６が設けられている。この搬
入・搬出機構１６は、支柱２０に沿つて上下動自
在且つ回転自在の基体１８と、該基体１８から軸
方向に進退自在に突出するロツド１９とからなる
ロボツトアーム１７を備え、該ロボツトアーム１
７の先端に円板状の吸着ヘツド２１を回転制御可
能に軸支したもので、該吸着ヘツド２１の下面に
は、上記キヤリヤ８及び該キヤリヤ８に保持され
たワーク９を同時に吸着可能な複数の吸盤２２を
取付けると共に、上記加工部７上に位置するキヤ
リヤ８のセンタ孔１２及び小孔１３を検出するセ
ンサ２３，２４を取付け、上記各吸盤２２を図示
しない真空線に接続している。上記センサ２３，
２４は、これらによつてキヤリヤ８のセンタ孔１
２及びいずれかの小孔１３が検出される位置に吸
着ヘツド２１を変位させることにより、該吸着ヘ
ツド２１を、各吸盤２２とキヤリヤ８及びワーク
９とが正しく対応する吸着可能位置に位置決めす
るためのものである。 A loading/unloading mechanism 16 is provided near the processing section 7 for carrying the carrier 8 and the workpiece 9 into and out of the processing section 7 . This loading/unloading mechanism 16 includes a robot arm 17 consisting of a base body 18 that is vertically movable and rotatable along a column 20, and a rod 19 that projects from the base body 18 so as to be able to move forward and backward in the axial direction. 1
A disc-shaped suction head 21 is rotatably supported on the tip of the suction head 7, and a plurality of suction heads 21 are provided on the lower surface of the suction head 21 to simultaneously suction the carrier 8 and the workpieces 9 held by the carrier 8. A suction cup 22 is attached thereto, and sensors 23 and 24 for detecting the center hole 12 and small hole 13 of the carrier 8 located above the processing section 7 are attached, and each of the suction cups 22 is connected to a vacuum line (not shown). The sensor 23,
24 is the center hole 1 of the carrier 8.
By displacing the suction head 21 to a position where 2 and any of the small holes 13 are detected, the suction head 21 is positioned at a position where each suction cup 22 correctly corresponds to the carrier 8 and the workpiece 9 where it can be suctioned. belongs to.
また、上記吸着ヘツド２１から側方へ突出する
金具２６には、下定盤２を一定距離で検出するセ
ンサ２７を取付け、加工部７からキヤリヤ８及び
ワーク９を搬出するに当つて吸着ヘツド２１をキ
ヤリヤ８上に下降させる際に、このセンサ２７に
よる下定盤２の検出によつて吸着ヘツド２１をそ
の位置で一旦停止させるように構成している。 In addition, a sensor 27 for detecting the lower surface plate 2 at a certain distance is attached to a metal fitting 26 that protrudes laterally from the suction head 21. When the suction head 21 is lowered onto the carrier 8, the sensor 27 detects the lower surface plate 2 and the suction head 21 is temporarily stopped at that position.
上記機体１の側方には、上記搬入・搬出機構１
６との対応位置に、キヤリヤ８を載置するための
二つのキヤリヤ載置台３３ａ，３３ｂを備えたタ
ーンテーブル３０と、キヤリヤ載置台３３ａ，３
３ｂ上のキヤリヤに対するワークの供給及び取出
しを行うワーク交換機構２９とを配置している。 On the side of the aircraft 1, the loading/unloading mechanism 1 is installed.
A turntable 30 is provided with two carrier mounting tables 33a and 33b for mounting the carrier 8 at positions corresponding to the carrier mounting tables 33a and 3.
A workpiece exchange mechanism 29 for supplying and taking out the workpieces to and from the carrier on the carrier 3b is arranged.
上記ターンテーブル３０は、第３図及び第４図
に詳細に示すように、支柱３５によつて回転自在
に支持された台板３６上に、その回転中心に対し
て対称に位置するように上記キヤリヤ載置台３３
ａ，３３ｂを取付けたもので、該台板３６は、そ
の下面の軸筒部３７の下端に従動歯車３８を備
え、この従動歯車３８と噛合する駆動歯車３９を
介してエアモータ４０により180゜ずつ正逆回転せ
しめられるようになつており、その回転時の位置
決めを行うため、支柱３５の側面には、互いに反
対側に位置する二つのストツパ４１ａ，４２ｂを
調節自在に取付け、これに対して、従動歯車３８
の下面には当片４２を垂設し、台板３６が正逆に
180゜回転した位置で該当片４２が二つのストツパ
４１ａ，４１ｂに当接するように構成している。
また、上記キヤリヤ載置台３３ａ，３３ｂは、減
速機構を備えたモータ４３とエンコーダ４４とに
よつて一定角度ずつ間欠回転可能に構成し、その
上面には、キヤリヤ８を一定の向きに保持したま
ま載置できるようにするため、キヤリヤのセンタ
孔１２に嵌入するセンタピン４５と、位置決め用
小孔１３のいずれかに嵌入する補助ピン４６とを
突設している。 As shown in detail in FIGS. 3 and 4, the turntable 30 is mounted on a base plate 36 that is rotatably supported by a support 35, and is positioned symmetrically with respect to its center of rotation. Carrier mounting stand 33
a and 33b are attached, and the base plate 36 is provided with a driven gear 38 at the lower end of a shaft cylinder portion 37 on its lower surface, and is driven by an air motor 40 through a drive gear 39 that meshes with the driven gear 38 to rotate the base plate 36 by 180 degrees. It is designed to be able to rotate in forward and reverse directions, and in order to determine the position during rotation, two stoppers 41a and 42b located on opposite sides of the column 35 are adjustably attached to the side surfaces of the column 35. Driven gear 38
A piece 42 is installed vertically on the bottom surface of the base plate 36 so that the base plate 36 can be
The corresponding piece 42 is configured to abut against two stoppers 41a and 41b at a position rotated by 180 degrees.
Further, the carrier mounting tables 33a and 33b are configured to be able to rotate intermittently at a constant angle by a motor 43 equipped with a speed reduction mechanism and an encoder 44, and the carriers 8 are mounted on their upper surfaces while being held in a constant direction. In order to enable the carrier to be placed, a center pin 45 that fits into the center hole 12 of the carrier and an auxiliary pin 46 that fits into one of the small positioning holes 13 are provided in a protruding manner.
なお、上記キヤリヤ載置台３３ａ，３３ｂの上
面は、多数の細溝を同心状に設けるなどして粗面
とし、該載置台へのワークの吸着を防止するよう
に構成するのが望ましい。 It is preferable that the upper surfaces of the carrier mounting tables 33a and 33b are made rough by providing a large number of concentric grooves to prevent workpieces from being attracted to the mounting tables.
上記ワーク変換機構２９は、ワーク供給機構３
１及びワーク取出機構３２からなつており、これ
らの各機構３１，３２は、支柱５０に沿つて上下
動自在且つ回動自在の基体５１と、該基体５１か
ら軸方向に進退自在に突出するロツド５２とから
なるロボツトアーム４９を備え、該ロボツトアー
ム４９の先端に設けた吸着ヘツド５３にワーク９
を吸着するために吸盤５４を取付け、この吸盤５
４を図示しない真空源に接続したもので、ワーク
供給機構３１によりコンベヤ５５上の未加工ワー
クを吸着してキヤリヤ８に供給し、キヤリヤ８に
保持されている加工済ワークをワーク取出機構３
２により別のコンベヤ５６上に取出すようにして
いる。 The workpiece conversion mechanism 29 includes the workpiece supply mechanism 3
Each of these mechanisms 31 and 32 includes a base body 51 that is vertically movable and rotatable along a support column 50, and a rod that protrudes from the base body 51 so as to be freely forward and backward in the axial direction. The workpiece 9 is attached to a suction head 53 provided at the tip of the robot arm 49.
Attach a suction cup 54 to absorb the
4 is connected to a vacuum source (not shown), the work supply mechanism 31 sucks unprocessed workpieces on the conveyor 55 and supplies them to the carrier 8, and the processed workpieces held on the carrier 8 are transferred to the workpiece take-out mechanism 3.
2, it is taken out onto another conveyor 56.
なお、上記吸盤２２，５４は、キヤリヤ及びワ
ーク緩衝的に当接するようにばねで進退自在に支
持させておくのが望ましい。 It is preferable that the suction cups 22 and 54 be supported by springs so as to be movable forward and backward so as to come into contact with the carrier and workpiece in a cushioning manner.
次に、上記構成を有する平面自動研磨装置の作
用について説明する。 Next, the operation of the automatic surface polishing apparatus having the above configuration will be explained.
下定盤２上には、複数のワーク９を保持した状
態のキヤリヤ８が第１図に示すように一定間隔で
セツトされ、上定盤５の下降により公知の両面研
磨装置と同様にしてワークの加工が行われる。 On the lower surface plate 2, carriers 8 holding a plurality of workpieces 9 are set at regular intervals as shown in FIG. Processing is performed.
加工が終了すると、各歯車３，４及び定盤２，
５が一旦停止して上定盤５が上昇し、いずれかの
キヤリヤが搬出位置Ａに来るように各キヤリヤ８
の位置調整が行われる。この位置調整は、キヤリ
ヤ８が搬出位置Ａに来たときに感応する光センサ
等の検出素子を機体１または上定盤５に取付けて
おき、それが感応するまで下定盤２及び両歯車
３，４を回転させてキヤリヤを移動させることに
より行うことができる。このとき、下定盤２とワ
ーク９との相対変位をなくして全てのワークの加
工条件を等しくするため、キヤリヤ８と下定盤２
とが相対変位することなく移動するように、下定
盤２と両歯車３，４との回転比の設定を変更する
のが望ましい。 When the machining is completed, each gear 3, 4 and surface plate 2,
5 stops once, the upper surface plate 5 rises, and each carrier 8 is moved so that one of the carriers comes to the unloading position A.
The position is adjusted. This position adjustment is carried out by attaching a detection element such as a light sensor to the body 1 or the upper surface plate 5, which is sensitive when the carrier 8 comes to the carry-out position A, and moving the lower surface plate 2 and both gears 3, This can be done by rotating 4 and moving the carrier. At this time, in order to eliminate relative displacement between the lower surface plate 2 and the workpiece 9 and to equalize the machining conditions for all the workpieces, the carrier 8 and the lower surface plate 2
It is desirable to change the setting of the rotation ratio between the lower surface plate 2 and both gears 3 and 4 so that the lower surface plate 2 and both gears 3 and 4 move without relative displacement.
キヤリヤ８の位置調整が終ると、搬入・搬出機
構１６におけるロボツトアーム１７が伸長し、吸
着ヘツド２１が搬出位置Ａに位置するキヤリヤ８
上に移動する。そして、この位置で該ロボツトア
ーム１７が吸着のために下降するが、吸着ヘツド
２１が下定盤２に一定距離まで近づいた所でセン
サ２７の作動によりロボツトアーム１７は一旦停
止し、吸着ヘツド２１の正確な位置決めが行われ
る。即ち、まず、ロボツトアーム１７の伸縮を伴
なう揺動により吸着ヘツド２１が上記キヤリヤ８
上を変位せしめられ、センサ２３がキヤリヤ８の
公転時におけるセンタ孔１２の軌跡に沿つて一定
範囲を往復することによりセンタ孔１２が検出さ
れる。そして、センタ孔１２の検出と同時に吸着
ヘツド２１がその位置に停止する。次いで、該吸
着ヘツド２１がその位置で回転し、センサ２４に
よる位置検出用小孔１３の検出が行われ、いずれ
かの小孔１３を検出した位置で吸着ヘツド２１は
停止する。これによつて該吸着ヘツド２１は各吸
盤２２によつてワーク９及びキヤリヤ８を同時に
吸着可能な位置に位置決めされることになる。 When the position adjustment of the carrier 8 is completed, the robot arm 17 in the loading/unloading mechanism 16 is extended, and the carrier 8 with the suction head 21 located at the loading/unloading position A is moved.
Move up. At this position, the robot arm 17 descends for suction, but when the suction head 21 approaches the lower surface plate 2 to a certain distance, the robot arm 17 is temporarily stopped by the operation of the sensor 27, and the suction head 21 is moved down. Accurate positioning is performed. That is, first, the suction head 21 is moved to the carrier 8 by the swinging movement accompanied by the expansion and contraction of the robot arm 17.
The center hole 12 is detected by the sensor 23 reciprocating within a certain range along the locus of the center hole 12 when the carrier 8 revolves. Simultaneously with the detection of the center hole 12, the suction head 21 stops at that position. Next, the suction head 21 rotates at that position, the small holes 13 for position detection are detected by the sensor 24, and the suction head 21 stops at the position where any of the small holes 13 is detected. As a result, the suction head 21 is positioned at a position where the suction cups 22 can simultaneously suction the workpiece 9 and the carrier 8.
吸着ヘツド２１の位置決めが終ると、ロボツト
アーム１７により該吸着ヘツド２１が下降し、吸
盤２２によりキヤリヤ８及びワーク９を吸着して
持上げ、それをターンテーブル３０上の一方のキ
ヤリヤ載置台３３ａ上に載置する。その載置に当
つては、キヤリヤ載置台３３ａ上に突設したセン
タピン４５と補助ピン４６とが、キヤリヤ８のセ
ンタ孔１２といずれかの位置決め用小孔１３とに
嵌入し、該キヤリヤ８が不必要に変位することの
無いようにその位置決めが行われる。 When the positioning of the suction head 21 is completed, the suction head 21 is lowered by the robot arm 17, and the suction cup 22 suctions and lifts the carrier 8 and workpiece 9, and places them on one carrier mounting table 33a on the turntable 30. Place it. When placing the carrier 8, a center pin 45 and an auxiliary pin 46 protruding from the carrier mounting table 33a are fitted into the center hole 12 of the carrier 8 and one of the small positioning holes 13, so that the carrier 8 is Its positioning is done so that it will not be displaced unnecessarily.
このとき、他方のキヤリヤ載置台３３ｂ上に
は、ワーク供給機構３１によつてワーク保持穴１
０内に未加工ワーク９を供給されたキヤリヤ８が
載置され、このキヤリヤ載置台３３ｂは、上記キ
ヤリヤ載置台３３ａと同じ向きに保持された状態
で待機している。 At this time, the workpiece holding hole 1 is placed on the other carrier mounting table 33b by the workpiece supply mechanism 31.
The carrier 8 to which the unprocessed workpiece 9 has been supplied is placed in the carrier 8, and the carrier mount 33b is on standby while being held in the same direction as the carrier mount 33a.
続いて、上記ターンテーブル３０が180゜回転
し、二つのキヤリヤ載置台３３ａ，３３ｂの位置
が入れ代わると、キヤリヤ載置台３３ｂ上のキヤ
リヤ及び未加工ワークが搬入・搬出機構１６の吸
着ヘツド２１により持上げられ、加工部７の上記
加工済のキヤリヤ及びワークを取出した場所へ搬
入される。 Subsequently, when the turntable 30 rotates 180 degrees and the positions of the two carrier mounting tables 33a and 33b are switched, the carrier and unprocessed workpiece on the carrier mounting table 33b are lifted by the suction head 21 of the loading/unloading mechanism 16. The processed carrier and workpiece are transported to the processing section 7 where the processed carrier and workpiece are taken out.
上記搬入が行われると、下定盤２及び両歯車
３，４の駆動により次に搬出すべきキヤリヤ８が
その搬出位置Ａに送られ、上述した場合と同様に
してそれがターンテーブル３０のキヤリヤ載置台
３３ｂ上に搬出装置される。 When the above carrying-in is carried out, the lower surface plate 2 and both gears 3 and 4 are driven to send the carrier 8 to be carried out next to its carrying-out position A, and it is placed on the carrier of the turntable 30 in the same manner as in the above case. The unloading device is placed on the placing stand 33b.
上記搬入及び搬出が行われている間、ターンテ
ーブル３０における他方のキヤリヤ載置台３３ａ
においては、それが一定角度ずつ間欠回転しなが
らワーク取出機構３２によつてキヤリヤ８から加
工済ワーク９がコンベヤ５６上に取出されると共
に、その取出されたあとにワーク供給機構３１に
よつて未加工ワーク９がコンベヤ５５から供給さ
れる。 While the above loading and unloading is being carried out, the other carrier mounting table 33a on the turntable 30
, the processed workpiece 9 is taken out from the carrier 8 onto the conveyor 56 by the workpiece take-out mechanism 32 while rotating intermittently at a constant angle, and after being taken out, the workpiece supply mechanism 31 removes the unfinished workpiece 9 from the carrier 8. A workpiece 9 is supplied from a conveyor 55.
次に、上記ターンテーブル３０が180゜逆回転
し、再び二つのキヤリヤ載置台３３ａ，３３ｂの
位置が入れ代わると、載置台３３ａ上にキヤリヤ
及び未加工ワークが搬入・搬出機構１６により加
工部７へ搬入され、他方の載置台３３ｂ上のキヤ
リヤに対して加工済ワークの取出しと未加工ワー
クの供給とが行われる。 Next, the turntable 30 is rotated 180 degrees in the opposite direction, and the positions of the two carrier mounting tables 33a and 33b are switched again. The processed workpiece is carried in and the processed workpiece is taken out and the unprocessed workpiece is supplied to the carrier on the other mounting table 33b.
かくして上記動作が繰り返されることにより、
加工部７に対する加工済ワークの搬出と未加工ワ
ークの搬入とが行われ、上定盤５の下降により再
びその研磨加工が行われる。 Thus, by repeating the above operations,
The processed work is carried out and the unprocessed work is carried into the processing section 7, and the polishing process is performed again by lowering the upper surface plate 5.
上記一連の動作は、コンピユータを用いた制御
装置（図示せず）により、所定のプログラムに沿
つて自動的に行われるものである。 The series of operations described above are automatically performed according to a predetermined program by a control device (not shown) using a computer.
なお、上記実施例では、ワーク変換機構２９と
してワーク供給機構３１とワーク取出機構３２と
を別々に設けたが、第６図に示すように、それら
を一つにまとめることもできる。即ち、このワー
ク変換機構２９は、ロボツトアーム６１の先端に
互いに直角をなす二つの軸６２，６３を左右に
90゜回動可能に取付け、両軸６２，６３の先端に
ワーク供給用の吸着ヘツド６４とワーク取出用の
吸着ヘツド６５とを設けたものである。 In the above embodiment, the workpiece supply mechanism 31 and the workpiece takeout mechanism 32 are provided separately as the workpiece conversion mechanism 29, but they can also be combined into one as shown in FIG. That is, this workpiece conversion mechanism 29 has two shafts 62 and 63 at right angles to each other at the tip of the robot arm 61.
It is mounted so as to be rotatable through 90 degrees, and a suction head 64 for supplying a workpiece and a suction head 65 for taking out a workpiece are provided at the tips of both shafts 62 and 63.
「発明の効果」
上記構成を有する本発明によれば、二つのキヤ
リヤ載置台を備えた180゜ずつ正逆回転可能なター
ンテーブルと、キヤリヤ及びそれに保持されたワ
ークを同時に吸着可能な吸着ヘツドを備えた搬
入・搬出機構と、ターンテーブル上のキヤリヤに
対する加工済ワークの取出し及び未加工ワークの
供給を行うワーク交換機構とを設けたので、上記
ターテーブルを180゜ずつ回転させて、搬入・搬出
機構により加工部に対する加工済のキヤリヤ及び
ワークにターンテーブル上への搬出と未加工のキ
ヤリヤ及びワークのターンテーブルからの搬入と
を行いながら、ワークの供給、取出機構によりタ
ーンテーブル上のキヤリヤに対する加工済ワーク
の取出しと未加工ワークの供給とを行うことによ
り、ワークの装填から取出しまでを自動的に行う
ことができ、加工能率の向上とワークの汚染防止
とを図ることができる。``Effects of the Invention'' According to the present invention having the above configuration, a turntable equipped with two carrier mounting tables and capable of rotating in forward and reverse directions by 180 degrees, and a suction head capable of simultaneously suctioning a carrier and a workpiece held thereon are provided. A loading/unloading mechanism is provided, and a work changing mechanism is provided for taking out processed workpieces and supplying unfinished workpieces to the carrier on the turntable. The mechanism transports the processed carriers and workpieces to the processing section onto the turntable, and the unprocessed carriers and workpieces are carried in from the turntable, while the workpiece supply and removal mechanism processes the carriers on the turntable. By taking out the finished workpiece and supplying the unprocessed workpiece, the process from loading to taking out the workpiece can be performed automatically, improving processing efficiency and preventing contamination of the workpiece.
第１図は本発明の一実施例を示す一部省略平面
図、第２図はその部分縦断側面図、第３図は同要
部側面図、第４図はその平面図、第５図はキヤリ
ヤの正面図、第６図は本発明の他の実施例の部分
平面図である。
２……下定盤、３……内歯歯車、４……太陽歯
車、５……上定盤、８……キヤリヤ、９……ワー
ク、１０……ワーク保持穴、１６……搬入・搬出
機構、１７，４９……ロボツトアーム、２１，５
３……吸着ヘツド、２２，５４……吸盤、２９…
…ワーク変換機構、３０……ターンテーブル、３
１……ワーク供給機構、３２……ワーク取出機
構、３３ａ，３３ｂ……キヤリヤ載置台、３６…
…台板。
Fig. 1 is a partially omitted plan view showing an embodiment of the present invention, Fig. 2 is a partial vertical sectional side view thereof, Fig. 3 is a side view of the same main part, Fig. 4 is a plan view thereof, and Fig. 5 is A front view of the carrier, FIG. 6, is a partial plan view of another embodiment of the invention. 2... Lower surface plate, 3... Internal gear, 4... Sun gear, 5... Upper surface plate, 8... Carrier, 9... Work, 10... Work holding hole, 16... Carrying in/out mechanism , 17, 49... Robot arm, 21, 5
3... Suction head, 22, 54... Suction cup, 29...
...Workpiece conversion mechanism, 30...Turntable, 3
1... Work supply mechanism, 32... Work take-out mechanism, 33a, 33b... Carrier mounting table, 36...
...base plate.
Claims (1)
備えたキヤリヤと、 円周方向に一定間隔で配列された複数のキヤリ
ヤに同時に噛合し、これらのキヤリヤを駆動する
内歯歯車及び太陽歯車と、 上記キヤリヤに保持されたワークを研磨する上
下の定盤と、 ロボツトアームの先端に吸着ヘツドを回転制御
可能に取付け、該吸着ヘツドに、キヤリヤと該キ
ヤリヤに保持されたワークとを同時に吸着可能な
複数の吸盤を設けたキヤリヤ・ワークの搬入・搬
出機構と、 該搬入・搬出機構と対応する位置に配設され、
正逆方向に180゜ずつ回転可能に軸支された台板上
に、二つのキヤリヤ載置台をそれぞれ一定角度ず
つ間欠回転可能に配設してなるターンテーブル
と、 ロボツトアームの先端に設けた吸着ヘツドにワ
ークを吸着するための吸盤を備え、上記ターンテ
ーブルにおける載置台上のキヤリヤに対してワー
クの供給及び取出しを行うワークの交換機構と、 を備えたことを特徴とする平面自動研磨装置。[Claims] 1. A carrier having a plurality of work holding holes and gears on its outer periphery; and internal teeth that simultaneously mesh with and drive the plurality of carriers arranged at regular intervals in the circumferential direction. A gear and a sun gear, upper and lower surface plates for polishing the workpiece held by the carrier, a suction head rotatably attached to the tip of the robot arm, and the carrier and the workpiece held by the carrier are attached to the suction head. a carrier/work loading/unloading mechanism provided with a plurality of suction cups capable of simultaneously suctioning a carrier/workpiece, and a carrier/work loading/unloading mechanism disposed at a position corresponding to the loading/unloading mechanism;
A turntable consists of a base plate that is rotatably rotated by 180 degrees in forward and reverse directions, and two carrier mounting tables are arranged so as to be able to rotate intermittently at a fixed angle each, and a suction device installed at the tip of the robot arm. An automatic surface polishing apparatus comprising: a suction cup for adsorbing a workpiece to a head; and a workpiece exchange mechanism for supplying and taking out the workpiece to and from a carrier on the mounting base of the turntable.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP60081958A JPS61241060A (en) | 1985-04-17 | 1985-04-17 | Automatic plane grinding device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP60081958A JPS61241060A (en) | 1985-04-17 | 1985-04-17 | Automatic plane grinding device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS61241060A JPS61241060A (en) | 1986-10-27 |
| JPH0457469B2 true JPH0457469B2 (en) | 1992-09-11 |
Family
ID=13761006
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP60081958A Granted JPS61241060A (en) | 1985-04-17 | 1985-04-17 | Automatic plane grinding device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS61241060A (en) |
Families Citing this family (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0755448B2 (en) * | 1990-03-14 | 1995-06-14 | 九州電子金属株式会社 | Double-sided precision lapping machine |
| US5174067A (en) * | 1990-10-19 | 1992-12-29 | Shin-Etsu Handotai Co., Ltd. | Automatic wafer lapping apparatus |
| US5329732A (en) * | 1992-06-15 | 1994-07-19 | Speedfam Corporation | Wafer polishing method and apparatus |
| US5498199A (en) * | 1992-06-15 | 1996-03-12 | Speedfam Corporation | Wafer polishing method and apparatus |
| JPH11207611A (en) * | 1998-01-21 | 1999-08-03 | Shin Etsu Handotai Co Ltd | Automatic work carrier device for double-side grinding device |
| JP4620898B2 (en) * | 2001-04-23 | 2011-01-26 | 不二越機械工業株式会社 | Polishing equipment system |
| JP5265281B2 (en) * | 2008-09-12 | 2013-08-14 | 不二越機械工業株式会社 | Double-side polishing equipment |
| JP5524676B2 (en) * | 2010-03-31 | 2014-06-18 | コマツＮｔｃ株式会社 | Work carry-in / out device and method in machining system |
| JP5512354B2 (en) * | 2010-03-31 | 2014-06-04 | コマツＮｔｃ株式会社 | Method and apparatus for machining rod-shaped workpiece |
| JP6183301B2 (en) * | 2014-06-16 | 2017-08-23 | 信越半導体株式会社 | Automatic handling device |
-
1985
- 1985-04-17 JP JP60081958A patent/JPS61241060A/en active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS61241060A (en) | 1986-10-27 |
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