JPH0453168B2 - - Google Patents
Info
- Publication number
- JPH0453168B2 JPH0453168B2 JP60297415A JP29741585A JPH0453168B2 JP H0453168 B2 JPH0453168 B2 JP H0453168B2 JP 60297415 A JP60297415 A JP 60297415A JP 29741585 A JP29741585 A JP 29741585A JP H0453168 B2 JPH0453168 B2 JP H0453168B2
- Authority
- JP
- Japan
- Prior art keywords
- surface plate
- flexible sheet
- printed wiring
- substrate
- base material
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 239000000758 substrate Substances 0.000 claims description 41
- 239000000463 material Substances 0.000 claims description 31
- 238000004519 manufacturing process Methods 0.000 claims description 29
- 230000001070 adhesive effect Effects 0.000 claims description 23
- 239000000853 adhesive Substances 0.000 claims description 21
- 238000003825 pressing Methods 0.000 claims description 14
- 238000007789 sealing Methods 0.000 claims description 11
- 239000004020 conductor Substances 0.000 claims description 8
- 239000013013 elastic material Substances 0.000 claims description 5
- 238000007599 discharging Methods 0.000 claims description 4
- 229920002379 silicone rubber Polymers 0.000 claims description 3
- 239000004945 silicone rubber Substances 0.000 claims description 3
- 238000010030 laminating Methods 0.000 claims description 2
- 238000000034 method Methods 0.000 description 20
- 239000007789 gas Substances 0.000 description 13
- 229920005989 resin Polymers 0.000 description 9
- 239000011347 resin Substances 0.000 description 9
- 239000010410 layer Substances 0.000 description 8
- 238000007796 conventional method Methods 0.000 description 5
- 230000007547 defect Effects 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 229920001971 elastomer Polymers 0.000 description 3
- 238000010438 heat treatment Methods 0.000 description 3
- JYEUMXHLPRZUAT-UHFFFAOYSA-N 1,2,3-triazine Chemical compound C1=CN=NN=C1 JYEUMXHLPRZUAT-UHFFFAOYSA-N 0.000 description 2
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 2
- 238000001723 curing Methods 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- 239000003365 glass fiber Substances 0.000 description 2
- 238000007731 hot pressing Methods 0.000 description 2
- 229910001220 stainless steel Inorganic materials 0.000 description 2
- 239000010935 stainless steel Substances 0.000 description 2
- 239000004593 Epoxy Substances 0.000 description 1
- 238000011074 autoclave method Methods 0.000 description 1
- 239000004927 clay Substances 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 230000032798 delamination Effects 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 238000013007 heat curing Methods 0.000 description 1
- 229920006015 heat resistant resin Polymers 0.000 description 1
- 239000011261 inert gas Substances 0.000 description 1
- 238000003475 lamination Methods 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 229910052757 nitrogen Inorganic materials 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 229920001296 polysiloxane Polymers 0.000 description 1
- 239000002356 single layer Substances 0.000 description 1
- 238000005303 weighing Methods 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
- B29C43/02—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles
- B29C43/18—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles incorporating preformed parts or layers, e.g. compression moulding around inserts or for coating articles
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
- B29C43/32—Component parts, details or accessories; Auxiliary operations
- B29C43/36—Moulds for making articles of definite length, i.e. discrete articles
- B29C43/3642—Bags, bleeder sheets or cauls for isostatic pressing
- B29C2043/3647—Membranes, diaphragms
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/06—Lamination
- H05K2203/068—Features of the lamination press or of the lamination process, e.g. using special separator sheets
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/08—Treatments involving gases
- H05K2203/082—Suction, e.g. for holding solder balls or components
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Mechanical Engineering (AREA)
- Laminated Bodies (AREA)
- Casting Or Compression Moulding Of Plastics Or The Like (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP60297415A JPS62156931A (ja) | 1985-12-28 | 1985-12-28 | 多層プリント配線板の製造方法及びこれに使用する装置 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP60297415A JPS62156931A (ja) | 1985-12-28 | 1985-12-28 | 多層プリント配線板の製造方法及びこれに使用する装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS62156931A JPS62156931A (ja) | 1987-07-11 |
JPH0453168B2 true JPH0453168B2 (ko) | 1992-08-25 |
Family
ID=17846208
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP60297415A Granted JPS62156931A (ja) | 1985-12-28 | 1985-12-28 | 多層プリント配線板の製造方法及びこれに使用する装置 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS62156931A (ko) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102642368A (zh) * | 2012-04-05 | 2012-08-22 | 福兴达科技实业(深圳)有限公司 | 粘贴治具及其应用方法 |
Families Citing this family (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
FR2642224B1 (fr) * | 1989-01-25 | 1991-04-19 | Siemens Bendix Automotive Elec | Procede et dispositif de fixation d'un substrat de circuit electronique sur un support |
JP2899130B2 (ja) * | 1991-05-09 | 1999-06-02 | 日立テクノエンジニアリング株式会社 | 高真空ホットプレス |
US5578159A (en) * | 1993-06-29 | 1996-11-26 | Hitachi Techno Engineering Co., Ltd. | Hot press for producing multilayer circuit board |
JPH07195391A (ja) * | 1993-12-28 | 1995-08-01 | Hitachi Techno Eng Co Ltd | ホットプレス |
JP6050103B2 (ja) * | 2012-11-29 | 2016-12-21 | ミカド機器販売株式会社 | 真空加熱加圧封止成形装置及び真空加熱加圧封止成形方法 |
Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS52148561A (en) * | 1976-06-07 | 1977-12-09 | Kanebo Ltd | Method of manufacture of resin laminated sheet |
-
1985
- 1985-12-28 JP JP60297415A patent/JPS62156931A/ja active Granted
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS52148561A (en) * | 1976-06-07 | 1977-12-09 | Kanebo Ltd | Method of manufacture of resin laminated sheet |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102642368A (zh) * | 2012-04-05 | 2012-08-22 | 福兴达科技实业(深圳)有限公司 | 粘贴治具及其应用方法 |
Also Published As
Publication number | Publication date |
---|---|
JPS62156931A (ja) | 1987-07-11 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
EXPY | Cancellation because of completion of term |