JPH0453168B2 - - Google Patents

Info

Publication number: JPH0453168B2
Authority: JP; Japan
Prior art keywords: surface plate; flexible sheet; printed wiring; substrate; base material
Prior art date: 1985-12-28
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.): Expired - Lifetime

Application number

JP60297415A

Other languages

English (en)

Japanese (ja)

Other versions

JPS62156931A (ja

Inventor

Katsumi Kosaka

Mamoru Kawasaki

Kunio Setsuda

Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)

Ibiden Co Ltd

Original Assignee

Ibiden Co Ltd

Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)

1985-12-28

Filing date

1985-12-28

Publication date

1992-08-25

1985-12-28 Application filed by Ibiden Co Ltd filed Critical Ibiden Co Ltd

1985-12-28 Priority to JP60297415A priority Critical patent/JPS62156931A/ja

1987-07-11 Publication of JPS62156931A publication Critical patent/JPS62156931A/ja

1992-08-25 Publication of JPH0453168B2 publication Critical patent/JPH0453168B2/ja

Status Granted legal-status Critical Current

Links

239000000758 substrate Substances 0.000 claims description 41
239000000463 material Substances 0.000 claims description 31
238000004519 manufacturing process Methods 0.000 claims description 29
230000001070 adhesive effect Effects 0.000 claims description 23
239000000853 adhesive Substances 0.000 claims description 21
238000003825 pressing Methods 0.000 claims description 14
238000007789 sealing Methods 0.000 claims description 11
239000004020 conductor Substances 0.000 claims description 8
239000013013 elastic material Substances 0.000 claims description 5
238000007599 discharging Methods 0.000 claims description 4
229920002379 silicone rubber Polymers 0.000 claims description 3
239000004945 silicone rubber Substances 0.000 claims description 3
238000010030 laminating Methods 0.000 claims description 2
238000000034 method Methods 0.000 description 20
239000007789 gas Substances 0.000 description 13
229920005989 resin Polymers 0.000 description 9
239000011347 resin Substances 0.000 description 9
239000010410 layer Substances 0.000 description 8
238000007796 conventional method Methods 0.000 description 5
230000007547 defect Effects 0.000 description 3
230000000694 effects Effects 0.000 description 3
229920001971 elastomer Polymers 0.000 description 3
238000010438 heat treatment Methods 0.000 description 3
JYEUMXHLPRZUAT-UHFFFAOYSA-N 1,2,3-triazine Chemical compound C1=CN=NN=C1 JYEUMXHLPRZUAT-UHFFFAOYSA-N 0.000 description 2
IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 2
238000001723 curing Methods 0.000 description 2
239000011521 glass Substances 0.000 description 2
239000003365 glass fiber Substances 0.000 description 2
238000007731 hot pressing Methods 0.000 description 2
229910001220 stainless steel Inorganic materials 0.000 description 2
239000010935 stainless steel Substances 0.000 description 2
239000004593 Epoxy Substances 0.000 description 1
238000011074 autoclave method Methods 0.000 description 1
239000004927 clay Substances 0.000 description 1
238000010276 construction Methods 0.000 description 1
230000032798 delamination Effects 0.000 description 1
238000005530 etching Methods 0.000 description 1
238000013007 heat curing Methods 0.000 description 1
229920006015 heat resistant resin Polymers 0.000 description 1
239000011261 inert gas Substances 0.000 description 1
238000003475 lamination Methods 0.000 description 1
239000000203 mixture Substances 0.000 description 1
229910052757 nitrogen Inorganic materials 0.000 description 1
238000004806 packaging method and process Methods 0.000 description 1
229920001296 polysiloxane Polymers 0.000 description 1
239000002356 single layer Substances 0.000 description 1
238000005303 weighing Methods 0.000 description 1

Classifications

- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
- B29C43/02—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles
- B29C43/18—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles incorporating preformed parts or layers, e.g. compression moulding around inserts or for coating articles
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
- B29C43/32—Component parts, details or accessories; Auxiliary operations
- B29C43/36—Moulds for making articles of definite length, i.e. discrete articles
- B29C43/3642—Bags, bleeder sheets or cauls for isostatic pressing
- B29C2043/3647—Membranes, diaphragms
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/06—Lamination
- H05K2203/068—Features of the lamination press or of the lamination process, e.g. using special separator sheets
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/08—Treatments involving gases
- H05K2203/082—Suction, e.g. for holding solder balls or components

Landscapes

Engineering & Computer Science (AREA)
Manufacturing & Machinery (AREA)
Microelectronics & Electronic Packaging (AREA)
Mechanical Engineering (AREA)
Laminated Bodies (AREA)
Casting Or Compression Moulding Of Plastics Or The Like (AREA)
Production Of Multi-Layered Print Wiring Board (AREA)

JP60297415A 1985-12-28 1985-12-28 多層プリント配線板の製造方法及びこれに使用する装置 Granted JPS62156931A (ja)

Priority Applications (1)

Application Number	Priority Date	Filing Date	Title
JP60297415A JPS62156931A (ja)	1985-12-28	1985-12-28	多層プリント配線板の製造方法及びこれに使用する装置

Applications Claiming Priority (1)

Application Number	Priority Date	Filing Date	Title
JP60297415A JPS62156931A (ja)	1985-12-28	1985-12-28	多層プリント配線板の製造方法及びこれに使用する装置

Publications (2)

Publication Number	Publication Date
JPS62156931A JPS62156931A (ja)	1987-07-11
JPH0453168B2 true JPH0453168B2 (ko)	1992-08-25

Family

ID=17846208

Family Applications (1)

Application Number	Title	Priority Date	Filing Date
JP60297415A Granted JPS62156931A (ja)	1985-12-28	1985-12-28	多層プリント配線板の製造方法及びこれに使用する装置

Country Status (1)

Country	Link
JP (1)	JPS62156931A (ko)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
CN102642368A (zh) *	2012-04-05	2012-08-22	福兴达科技实业（深圳）有限公司	粘贴治具及其应用方法

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
FR2642224B1 (fr) *	1989-01-25	1991-04-19	Siemens Bendix Automotive Elec	Procede et dispositif de fixation d'un substrat de circuit electronique sur un support
JP2899130B2 (ja) *	1991-05-09	1999-06-02	日立テクノエンジニアリング株式会社	高真空ホットプレス
US5578159A (en) *	1993-06-29	1996-11-26	Hitachi Techno Engineering Co., Ltd.	Hot press for producing multilayer circuit board
JPH07195391A (ja) *	1993-12-28	1995-08-01	Hitachi Techno Eng Co Ltd	ホットプレス
JP6050103B2 (ja) *	2012-11-29	2016-12-21	ミカド機器販売株式会社	真空加熱加圧封止成形装置及び真空加熱加圧封止成形方法

Citations (1)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
JPS52148561A (en) *	1976-06-07	1977-12-09	Kanebo Ltd	Method of manufacture of resin laminated sheet

1985
- 1985-12-28 JP JP60297415A patent/JPS62156931A/ja active Granted

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
JPS52148561A (en) *	1976-06-07	1977-12-09	Kanebo Ltd	Method of manufacture of resin laminated sheet

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
CN102642368A (zh) *	2012-04-05	2012-08-22	福兴达科技实业（深圳）有限公司	粘贴治具及其应用方法

Also Published As

Publication number	Publication date
JPS62156931A (ja)	1987-07-11

Legal Events

Date	Code	Title	Description
2004-07-27	R250	Receipt of annual fees	Free format text: JAPANESE INTERMEDIATE CODE: R250
2005-07-26	R250	Receipt of annual fees	Free format text: JAPANESE INTERMEDIATE CODE: R250
2005-12-28	EXPY	Cancellation because of completion of term

Publication	Publication Date	Title
JPH10315257A (ja)	1998-12-02	真空積層装置および真空積層方法
JP4935957B1 (ja)	2012-05-23	封止用樹脂シートの製造方法
JPH0453168B2 (ko)	1992-08-25
JPS63251207A (ja)	1988-10-18	プリント配線板の成形方法及びその装置
JP3893930B2 (ja)	2007-03-14	シート材保持具、シート材保持方法、及び多層基板の製造方法
JP2000182014A (ja)	2000-06-30	Ｉｃカード製造装置
JP3277195B2 (ja)	2002-04-22	多層プリント配線板およびその製造方法
JP3308304B2 (ja)	2002-07-29	成型材料の成型方法とその成型装置
JPH06378B2 (ja)	1994-01-05	多層プリント配線板の製造方法
JPS61277428A (ja)	1986-12-08	積層板の成形方法
JP2002164665A (ja)	2002-06-07	配線板成形用の真空成形装置
JP3243607B2 (ja)	2002-01-07	真空積層装置および真空積層方法
JPS6337922A (ja)	1988-02-18	熱圧着方法
JPH034017B2 (ko)	1991-01-22
TWI749632B (zh)	2021-12-11	具有壓合治具盒之疊板壓合系統及方法
JPH0235477B2 (ko)	1990-08-10
JP2002326302A (ja)	2002-11-12	耐熱クッション
KR102534660B1 (ko)	2023-05-25	합지장치를 이용한 기판 합지방법
WO2024150534A1 (ja)	2024-07-18	回路基板の製造装置及び回路基板の製造方法
JPH1093236A (ja)	1998-04-10	多層回路基板の成形方法
WO2024150537A1 (ja)	2024-07-18	回路基板の製造装置及び回路基板の製造方法
JPS63112122A (ja)	1988-05-17	多層印刷配線板の製造方法および製造装置
JPH08255979A (ja)	1996-10-01	電子部品搭載用多層基板の製造方法
TW529316B (en)	2003-04-21	Method for making composite plate
JPH01238934A (ja)	1989-09-25	セラミックグリーンシートの積層方法及び装置

JPH0453168B2 - - Google Patents

Info

Links

Classifications

Landscapes

Priority Applications (1)

Applications Claiming Priority (1)

Publications (2)

Family

ID=17846208

Family Applications (1)

Country Status (1)

Cited By (1)

Families Citing this family (5)

Citations (1)

Patent Citations (1)

Cited By (1)

Also Published As

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