JPH0444323A - Draining and drying apparatus for substrate - Google Patents
Draining and drying apparatus for substrateInfo
- Publication number
- JPH0444323A JPH0444323A JP2152413A JP15241390A JPH0444323A JP H0444323 A JPH0444323 A JP H0444323A JP 2152413 A JP2152413 A JP 2152413A JP 15241390 A JP15241390 A JP 15241390A JP H0444323 A JPH0444323 A JP H0444323A
- Authority
- JP
- Japan
- Prior art keywords
- substrate
- water
- tank
- cleaning
- water surface
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000758 substrate Substances 0.000 title claims abstract description 83
- 238000001035 drying Methods 0.000 title claims abstract description 20
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims abstract description 82
- 238000004140 cleaning Methods 0.000 claims abstract description 48
- 238000000034 method Methods 0.000 abstract description 11
- 210000000078 claw Anatomy 0.000 description 4
- 238000007796 conventional method Methods 0.000 description 3
- 238000010586 diagram Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- 239000007787 solid Substances 0.000 description 2
- 230000002542 deteriorative effect Effects 0.000 description 1
- 239000003337 fertilizer Substances 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 239000004973 liquid crystal related substance Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 239000000725 suspension Substances 0.000 description 1
- 235000012431 wafers Nutrition 0.000 description 1
- 238000005406 washing Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Cleaning Or Drying Semiconductors (AREA)
- Drying Of Solid Materials (AREA)
Abstract
Description
【発明の詳細な説明】
〔産業上の利用分野〕
本発明は、液晶用ガラス基板、半導体ウェーハなどを対
象に、洗浄槽内に満たした洗浄水の中に基板を浸漬して
洗浄した後に、該基板の表面に付着している水滴を液切
りさせた上で洗浄槽内がら引き上げる基板の水切り乾燥
装置に関する。[Detailed Description of the Invention] [Industrial Application Field] The present invention targets liquid crystal glass substrates, semiconductor wafers, etc., and after cleaning the substrates by immersing them in cleaning water filled in a cleaning tank, The present invention relates to a substrate draining and drying device that drains water droplets adhering to the surface of the substrate and then lifts the substrate out of the cleaning tank.
頭記した各種基板の製造工程では、薬液処理の後に基板
を純水を満たした洗浄槽内に搬入し、ここで基板を純水
で洗浄した後に水切り、乾燥を行い、しかる後に基板を
洗浄槽から引き上げて次の処理工程に移送するようにし
ている。また、洗浄後に行う基板の水切り、乾燥方法と
して、基板の表面に付着している洗浄水の水滴を水の表
面張力を利用して基板から排除するうよにした方法が例
えば特開昭６３−３０１５２７号公報、あるいは特開平
１−２２５１２４号公報などで既に公知である。In the manufacturing process of the various substrates mentioned above, after chemical treatment, the substrate is transported into a cleaning tank filled with pure water, where the substrate is washed with pure water, drained and dried, and then the board is transferred to the cleaning tank. It is then lifted up and transported to the next processing step. Furthermore, as a method for draining and drying a substrate after cleaning, there is a method in which water droplets of cleaning water adhering to the surface of the substrate are removed from the substrate by using the surface tension of the water, for example, in Japanese Patent Application Laid-Open No. 63-1999. This is already known in Japanese Patent Application Laid-open No. 301527 or Japanese Patent Application Laid-Open No. 1-225124.
これらの提案になる水切り、乾燥方式は、洗浄水（純水
）で満たした洗浄槽の中にキ中リヤ、あるいは吊り下げ
機構で基板を保持したまま水中に浸漬して洗浄を行った
後、槽内の水を徐々に排水して基板を水面上に露出させ
て水切り乾燥させ、しかる後にキャリヤ、吊り下げ機構
を引き上げ操作して基板を槽外に搬出するようにしたも
のである。このような操作により、基板の表面に付着し
ていた水滴は、槽内を下降する水面との間に働く水の表
面張力により引き摺られて水切りされ、水面上に露出し
た部位から順に乾燥状態になる。These proposed draining and drying methods involve cleaning the substrate by immersing it in water while holding it in a cleaning tank filled with cleaning water (pure water) or by a hanging mechanism. The water in the tank is gradually drained to expose the substrate above the water surface, where it is drained and dried, and then the carrier and hanging mechanism are pulled up to carry the substrate out of the tank. Through this operation, the water droplets adhering to the surface of the substrate are dragged and drained by the surface tension of the water acting between it and the water surface descending in the tank, and the parts exposed above the water surface become dry. Become.
〔発明が解決しようとする１ＩＮ）
ところで、前記した従来方式では基板を完全に水切りで
きず、特にキャリヤ、吊り下げ機構との接触部分に水滴
が残り、これが原因で基板に乾燥むら、汚れが発生し昌
い難点がある。[1IN to be solved by the invention] By the way, in the conventional method described above, water cannot be completely drained from the substrate, and water droplets remain especially in the contact area with the carrier and the hanging mechanism, which causes uneven drying and stains on the substrate. There are some serious drawbacks.
すなわち、基板をキャリヤ、あるいは吊り下げ機構に保
持して水中に浸漬すると、基板とこれに接するキャリヤ
、吊り下げ機構との間の接触部分の微小な隙間に毛細管
現象が働いて水が滲み込むようになる。しかも、固体間
の隙間に浸透した水に吸引力として働く固−液間の界面
張力は、基板の自由表面に付着した水滴に働く表面張力
よりも大きく、このために洗浄槽内の水面降下に伴って
キャリヤ、ないし吊り下げ機構が水面上に露出した状態
になっても、基板との間の隙間に滲みこんだ水は水面側
から吸引力として作用する表面張力では排除されずにそ
のまま隙間内に残り、これが基板に乾燥むら、汚れを引
き起こす原因となって基板の品質を劣化させる。In other words, when a substrate is held on a carrier or a hanging mechanism and immersed in water, capillary action acts in the tiny gaps in the contact area between the substrate, the carrier that is in contact with it, and the hanging mechanism, causing water to seep into it. become. Moreover, the interfacial tension between the solid and liquid, which acts as an attractive force on the water that has penetrated into the gaps between the solids, is greater than the surface tension that acts on the water droplets adhering to the free surface of the substrate. As a result, even if the carrier or suspension mechanism is exposed above the water surface, water seeping into the gap between it and the substrate will not be removed by the surface tension that acts as suction from the water surface and will continue to flow into the gap. This causes uneven drying and stains on the board, deteriorating the quality of the board.
本発明は上記の点にかんがみなされたものであり、従来
方式を改良することにより、基板上から水滴を完全に水
切りして乾燥できるようにした基板の水切り乾燥装置を
提供することを目的とする。The present invention has been made in consideration of the above points, and an object of the present invention is to provide a substrate draining and drying device that can completely drain water droplets from the substrate and dry it by improving the conventional method. .
上記課題を解決するために、本発明の装置は、洗浄槽内
に満たした洗浄水を槽の底部側から徐々に抜く排水弁と
、洗浄槽内の底部に設置して槽内に搬入された基板を起
立姿勢に受容保持する固定ホルダと、洗浄槽の上方より
アクセスして前記固定ホルダに保持されている基板を把
持する基板引き上げ用の可動ホルダを備え、基板の洗浄
後に排水弁を通じて槽内の洗浄水を徐々に排水するとと
もに、固定ホルダが水面下に没している状態で水面上に
露出した基板部分を可動ホルダにより把持し、緩速で基
板を水面上に引き上げ操作するよう構成したものである
。In order to solve the above problems, the device of the present invention has a drain valve that gradually drains the cleaning water filled in the cleaning tank from the bottom side of the tank, and a drain valve that is installed at the bottom of the cleaning tank and carried into the tank. It is equipped with a fixed holder that receives and holds the substrate in an upright position, and a movable holder that is accessed from above the cleaning tank and lifts the substrate to grasp the substrate held in the fixed holder. In addition to gradually draining the cleaning water, the movable holder grips the board part exposed above the water surface while the fixed holder is submerged under the water surface, and slowly lifts the board above the water surface. It is something.
上記のように洗浄槽内に搬入した基板を保持する手段を
、槽内の底部で基板を起立姿勢に支える固定ホルダと、
基板を把持して槽内から引き上げる可動ホルダとに分け
、かつこれに洗浄槽内の水面を下降させる前半の水切り
工程と、水面上に露出して水切り、乾燥した部位を可動
ホルダが把持して基板を槽内から引き上げる後半の水切
り工程を組合わせて基板の水切り、乾燥をｊテうことに
より、水中に浸漬している基板部分に全く触れることな
く可動ホルダの操作で基板を槽内から引き上げることが
でき、これにより基板の完全な水切り乾燥状態が得られ
る。The means for holding the substrate carried into the cleaning tank as described above includes a fixed holder that supports the substrate in an upright position at the bottom of the tank;
The process is divided into a movable holder that grips the substrate and pulls it up from the tank, and a first half of the draining process that lowers the water level in the cleaning tank, and a movable holder that grips the parts exposed above the water surface that have been drained and dried. By combining the draining process in the second half of lifting the board from the tank, and draining and drying the board, the board can be pulled out of the tank by operating the movable holder without touching the board part that is immersed in water. This allows the substrate to be completely drained and dried.
以下本発明の実施例を図面に基づいて説明する。 Embodiments of the present invention will be described below based on the drawings.
まず、第１図に装置全体の構成を示す０図において、１
は底面が中央部に向けて下向きに傾斜した洗浄槽であり
、その底部から引出した排水管２にはニードル弁などの
排水弁３が接続され、さらに槽内の傾斜底壁上には、液
晶用ガラス基板を対象とした方形状の基板４を図示のよ
うに基板の対角線を上下、左右に向けた起立姿勢に並べ
て担持する固定ホルダ５が装備されている。また、６は
洗浄槽１の上方からアクセスして固定ホルダ５に担持さ
れている基板４を受は取り、槽外に引き上げる可動ホル
ダである。この可動ホルダ６の詳細構造は第２図、第３
図に示すごとくであり、口字形をなす二股状のフレーム
７と、フレーム７の先端記取付けた開閉爪８と、該爪８
を開閉操作するアクチュエータ９とを装備し、支持アー
ムｌＯを介してハンドリング用ロボット１１に連結され
ている。First, in Figure 1, which shows the overall configuration of the device, 1
is a washing tank whose bottom surface slopes downward toward the center, and a drain valve 3 such as a needle valve is connected to a drain pipe 2 drawn out from the bottom. A fixed holder 5 is provided to hold rectangular substrates 4 intended for use as glass substrates in an upright position with diagonal lines of the substrates oriented vertically and horizontally as shown. Further, reference numeral 6 denotes a movable holder that is accessed from above the cleaning tank 1, picks up the substrate 4 supported by the fixed holder 5, and pulls it out of the tank. The detailed structure of this movable holder 6 is shown in Figures 2 and 3.
As shown in the figure, there is a bifurcated frame 7 in the shape of an opening, an opening/closing claw 8 attached to the tip of the frame 7, and the claw 8.
It is equipped with an actuator 9 for opening and closing operations, and is connected to a handling robot 11 via a support arm IO.
なお、図示は基板の把持状態を示しており、フレーム７
の先端と開閉爪８（閉している）との間に複数枚の基板
４が一括して把持されている。ここで、方形状の基板４
はその対角線上に並ぶ左右の角部が爪８に係止して把持
されるでいる。Note that the illustration shows the state in which the board is held, and the frame 7
A plurality of substrates 4 are held together between the tip and the opening/closing claw 8 (closed). Here, a rectangular substrate 4
The left and right corner portions arranged diagonally are engaged with the claws 8 to be gripped.
次に、第４図により基板４の洗浄、水切り乾燥工程を説
明する。なお第４図において、１２は前段工程から受は
取った基板を洗浄槽１に搬入する搬入専用の可動ホルダ
であり、先記した基板引き上げ専用の可動ホルダ６とは
別個に設備されている。Next, the cleaning, draining and drying process of the substrate 4 will be explained with reference to FIG. In FIG. 4, reference numeral 12 denotes a movable holder exclusively used for carrying the substrates received from the previous step into the cleaning tank 1, and is installed separately from the movable holder 6 exclusively used for lifting the substrates described above.
まず、洗浄槽１には洗浄水としての純水１３が水位ｎ１
まで満たされている。ここで前段工程で処理された基板
４は搬入用の可動ホルダ１２の操作により第４図（ａ）
に表した移動経路Ａを経て洗浄槽４に搬入され、基板４
が槽内の底部に設けた固定ホルダ５に移載される。一方
、空になった可動ホルダ１２は洗浄槽から出て待機位置
に後退する。なお、この時点では基板引き上げ用の可動
ホルダ６が槽外の待機位置に後退している。続いて洗浄
槽内でオーバーフロー洗浄方式などにより基板４の洗浄
を行った後、次にら）図のように排水弁３を通じて槽内
の純水を少量ずつ排水して槽内の水面を緩速で降下させ
る。この水面下降操作により、固定ホルダ５に担持され
ている基板４は上端部位から徐々に水面上に露出するよ
うになり、この過程で基板４の表面に付着している水滴
は水面との間に働（表面張力により水切りされ、水面上
に露出した部分から順に乾燥状態になる。First, pure water 13 as cleaning water is placed in the cleaning tank 1 at a water level n1.
It's filled to the max. Here, the substrate 4 processed in the previous step is transported by operating the movable holder 12 as shown in FIG. 4(a).
The substrate 4 is carried into the cleaning tank 4 via the moving path A shown in FIG.
is transferred to a fixed holder 5 provided at the bottom of the tank. On the other hand, the empty movable holder 12 comes out of the cleaning tank and retreats to the standby position. Note that at this point, the movable holder 6 for lifting the substrate has retreated to a standby position outside the tank. Next, after cleaning the substrate 4 in the cleaning tank using an overflow cleaning method, etc., as shown in the figure, the pure water in the tank is drained little by little through the drain valve 3 to slowly lower the water surface in the tank. to lower it. By this water level lowering operation, the substrate 4 supported by the fixed holder 5 is gradually exposed above the water surface from the upper end portion, and in this process, water droplets adhering to the surface of the substrate 4 are removed between the water surface and the water surface. Water is removed by surface tension, and the parts exposed above the water surface become dry.
そして、水面の下降操作に伴う基板４の水切りが進行し
、（Ｃ）図のように水面が水位Ｈ３にまで下降（但し、
固定ホルダ５は水面下に没している）して基板４の少な
くとも上半分域以上が水面上に露出した状態になると、
次に可動ホルダ６を待機位置から移動経路Ｂを経て上方
から洗浄槽内に搬入し、ここで水面上に露出している基
板４の左右角部（既に水切りが済んで乾燥状態になって
いる）を把持する。続いて可動ホルダ６を緩速で上昇操
作し、水位Ｈ３の水面下に浸漬していた基板４の残り部
分を徐々に水面上に露出させ、この引き上げ過程で表面
張力による水切り、乾燥を行う、なお、可動ホルダ６の
引き上げ操作により、基板４は槽内の固定ホルダ５から
Ｈ脱した状態で水面上に露出する。そして、基板４が完
全に水面上に露出した後に、可動ホルダ６を洗浄槽１の
外に引き上げて基板４を後段工程に移送する。以下同様
な操作を繰り返し、基板の洗浄、水切り乾燥工程をバン
チ方式で進める。Then, as the water surface lowers, the substrate 4 drains, and the water surface descends to the water level H3 as shown in Figure (C) (however,
(The fixed holder 5 is submerged below the water surface) and at least the upper half of the substrate 4 is exposed above the water surface.
Next, move the movable holder 6 from the standby position through the moving path B into the cleaning tank from above, and here the left and right corners of the substrate 4 exposed above the water surface (which have already been drained and are in a dry state) ). Subsequently, the movable holder 6 is slowly raised to gradually expose the remaining portion of the substrate 4 that has been immersed below the water surface at the water level H3 above the water surface, and during this lifting process, water is drained and dried by surface tension. Note that by pulling up the movable holder 6, the substrate 4 is exposed above the water surface in a state in which it is removed from the fixed holder 5 in the tank. After the substrate 4 is completely exposed above the water surface, the movable holder 6 is pulled out of the cleaning tank 1 and the substrate 4 is transferred to the subsequent process. Thereafter, similar operations are repeated to proceed with the cleaning, draining and drying process of the substrate in a bunch manner.
上記のような水切り操作で基板４を水面上に引き上げる
ことにより、乾いている可動ホルダ６が基板４の乾燥状
態の部分を把持して引き上げ、さらに槽内の水面下で固
定ホルダ５に担持されていた基板４の下縁部分も固定ホ
ルダ５より離脱してから水面上に露出するようになり、
したがって基板４の表面、特に固定ホルダ５．可動ホル
ダ６と接触する部分に水滴が残るおそれは全くない。By lifting the substrate 4 above the water surface by the above-described draining operation, the dry movable holder 6 grasps the dry portion of the substrate 4 and pulls it up, and the substrate 4 is further carried by the fixed holder 5 under the water surface in the tank. The lower edge of the board 4, which had previously been exposed, is now exposed above the water surface after detaching from the fixed holder 5.
Therefore, the surface of the substrate 4, especially the fixed holder 5. There is no possibility that water droplets will remain on the part that comes into contact with the movable holder 6.
なお、図示実施例では、基板の搬入用と引き上げ用とに
分けて２基の可動ホルダ６．１２を備えているが、洗浄
槽内への基板搬入の際に水で濡れた可動ホルダを槽外で
乾燥させる手段を併設することにより、可動ホルダ６．
１２を１基で共用することも可能である。In the illustrated embodiment, two movable holders 6.12 are provided, one for carrying in the substrate and one for pulling it up, but when carrying the substrate into the cleaning tank, the movable holder 6. By providing a means for drying outside, the movable holder 6.
It is also possible to share 12 units with one unit.
以上述べたように本発明による基板の水切り乾燥装置に
よれば、従来方式におけるキャリヤ、吊り上げ機構など
のように、基板引き上げ手段が水中に没したままの状態
で基板を保持することがなく、可動ホルダは水面上に露
出した乾燥部分を把持して基板を引き上げる。As described above, according to the substrate draining and drying device according to the present invention, the substrate lifting means does not hold the substrate submerged in water, unlike the carrier and lifting mechanism in the conventional method, and is movable. The holder grasps the dry portion exposed above the water surface and pulls up the substrate.
したがって可動ホルダとの接触部分に水滴が残るといっ
た問題が解消され、基板を完全に水切り乾燥した状態で
洗浄槽から引き上げて次段工程へ移送でき、これにより
乾燥むら、汚れの発生を確実に防止して基板の品質の向
上化が図れる。This eliminates the problem of water droplets remaining on the contact area with the movable holder, and allows the board to be completely drained and dried before being lifted out of the cleaning tank and transferred to the next process, thereby reliably preventing uneven drying and dirt. As a result, the quality of the substrate can be improved.
第１図は本発明実施例の全体構成図、第２図第３図はそ
れぞれ第１図における可動ホルダの詳細構造を示す正面
図、側面図、第４図（ａ）〜（Ｃ）は第１図の装置によ
る基板の洗浄、水切り乾燥工程の説明図である０図にお
いて、
１；洗浄槽、２：排水管、３：排水弁、４：基第２肥Figure 1 is an overall configuration diagram of an embodiment of the present invention, Figures 2 and 3 are front and side views showing the detailed structure of the movable holder in Figure 1, respectively, and Figures 4 (a) to (C) are In Figure 0, which is an explanatory diagram of the substrate cleaning, draining and drying process using the apparatus in Figure 1, 1: cleaning tank, 2: drain pipe, 3: drain valve, 4: base second fertilizer.
Claims (1)
浄した後に、該基板の表面に付着している水滴を液切り
させた上で洗浄槽から引き上げる基板の液切り乾燥装置
であって、洗浄槽内に満たした洗浄水を槽の底部側から
徐々に抜く排水弁と、洗浄槽内の底部に設置して槽内に
搬入された基板を起立姿勢に受容保持する固定ホルダと
、洗浄槽の上方よりアクセスして前記固定ホルダに保持
されている基板を把持する基板引き上げ用の可動ホルダ
を備え、基板の洗浄後に排水弁を通じて槽内の洗浄水を
徐々に排水するとともに、固定ホルダが水面下に没して
いる状態で水面上に露出した基板部分を可動ホルダによ
り把持し、緩速で基板を水面上に引き上げ操作すること
を特徴とする基板の水切り乾燥装置。1) After cleaning the substrate by immersing it in the cleaning water filled in the cleaning tank, water droplets adhering to the surface of the substrate are drained, and then the substrate is removed from the cleaning tank using a drying device. There is a drain valve that gradually drains the cleaning water filled in the cleaning tank from the bottom side of the tank, and a fixed holder that is installed at the bottom of the cleaning tank to receive and hold the board carried into the tank in an upright position. , is provided with a movable holder for lifting the substrate that is accessed from above the cleaning tank and grasps the substrate held in the fixed holder, and after cleaning the substrate, the cleaning water in the tank is gradually drained through the drain valve, and the cleaning tank is fixed. A device for draining and drying a substrate, characterized in that a movable holder grips the substrate portion exposed above the water surface while the holder is submerged under the water surface, and slowly lifts the substrate above the water surface.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2152413A JPH0444323A (en) | 1990-06-11 | 1990-06-11 | Draining and drying apparatus for substrate |
| KR1019910009697A KR930011433B1 (en) | 1990-06-11 | 1991-06-11 | Draining and drying apparatus for substrate |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2152413A JPH0444323A (en) | 1990-06-11 | 1990-06-11 | Draining and drying apparatus for substrate |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0444323A true JPH0444323A (en) | 1992-02-14 |
Family
ID=15539974
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2152413A Pending JPH0444323A (en) | 1990-06-11 | 1990-06-11 | Draining and drying apparatus for substrate |
Country Status (2)
| Country | Link |
|---|---|
| JP (1) | JPH0444323A (en) |
| KR (1) | KR930011433B1 (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO1995002473A1 (en) * | 1993-07-16 | 1995-01-26 | Cfmt, Inc. | Static megasonic cleaning system for cleaning objects |
| WO1997048129A1 (en) * | 1996-06-14 | 1997-12-18 | Seiko Epson Corporation | Pull-up drying method and drying apparatus |
| JP2014103149A (en) * | 2012-11-16 | 2014-06-05 | Tokyo Electron Ltd | Substrate processing apparatus and substrate processing method, and computer readable recording medium recording substrate processing program |
-
1990
- 1990-06-11 JP JP2152413A patent/JPH0444323A/en active Pending
-
1991
- 1991-06-11 KR KR1019910009697A patent/KR930011433B1/en not_active IP Right Cessation
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO1995002473A1 (en) * | 1993-07-16 | 1995-01-26 | Cfmt, Inc. | Static megasonic cleaning system for cleaning objects |
| WO1997048129A1 (en) * | 1996-06-14 | 1997-12-18 | Seiko Epson Corporation | Pull-up drying method and drying apparatus |
| US6179930B1 (en) | 1996-06-14 | 2001-01-30 | Seiko Epson Corporation | Pull-up drying method and apparatus |
| JP2014103149A (en) * | 2012-11-16 | 2014-06-05 | Tokyo Electron Ltd | Substrate processing apparatus and substrate processing method, and computer readable recording medium recording substrate processing program |
Also Published As
| Publication number | Publication date |
|---|---|
| KR930011433B1 (en) | 1993-12-06 |
| KR920001642A (en) | 1992-01-30 |
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