JPH0441976Y2 - - Google Patents
Info
- Publication number
- JPH0441976Y2 JPH0441976Y2 JP1985153310U JP15331085U JPH0441976Y2 JP H0441976 Y2 JPH0441976 Y2 JP H0441976Y2 JP 1985153310 U JP1985153310 U JP 1985153310U JP 15331085 U JP15331085 U JP 15331085U JP H0441976 Y2 JPH0441976 Y2 JP H0441976Y2
- Authority
- JP
- Japan
- Prior art keywords
- workpiece
- case
- suction chamber
- spinner
- coating liquid
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000011248 coating agent Substances 0.000 claims description 36
- 238000000576 coating method Methods 0.000 claims description 36
- 239000007788 liquid Substances 0.000 claims description 26
- 239000002904 solvent Substances 0.000 claims description 24
- 239000007789 gas Substances 0.000 description 6
- 239000003595 mist Substances 0.000 description 5
- 229910052787 antimony Inorganic materials 0.000 description 3
- WATWJIUSRGPENY-UHFFFAOYSA-N antimony atom Chemical compound [Sb] WATWJIUSRGPENY-UHFFFAOYSA-N 0.000 description 3
- 238000000034 method Methods 0.000 description 3
- 230000000694 effects Effects 0.000 description 2
- 239000012634 fragment Substances 0.000 description 2
- 239000011261 inert gas Substances 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- 238000010521 absorption reaction Methods 0.000 description 1
- 230000002411 adverse Effects 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 238000009792 diffusion process Methods 0.000 description 1
- 238000007599 discharging Methods 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 238000005192 partition Methods 0.000 description 1
- 229920002120 photoresistant polymer Polymers 0.000 description 1
Landscapes
- Coating Apparatus (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1985153310U JPH0441976Y2 (zh) | 1985-10-07 | 1985-10-07 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1985153310U JPH0441976Y2 (zh) | 1985-10-07 | 1985-10-07 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS6262870U JPS6262870U (zh) | 1987-04-18 |
JPH0441976Y2 true JPH0441976Y2 (zh) | 1992-10-02 |
Family
ID=31072077
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP1985153310U Expired JPH0441976Y2 (zh) | 1985-10-07 | 1985-10-07 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH0441976Y2 (zh) |
Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5990928A (ja) * | 1982-11-16 | 1984-05-25 | Dainippon Screen Mfg Co Ltd | 回転式表面処理装置 |
-
1985
- 1985-10-07 JP JP1985153310U patent/JPH0441976Y2/ja not_active Expired
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5990928A (ja) * | 1982-11-16 | 1984-05-25 | Dainippon Screen Mfg Co Ltd | 回転式表面処理装置 |
Also Published As
Publication number | Publication date |
---|---|
JPS6262870U (zh) | 1987-04-18 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JPH0444216Y2 (zh) | ||
KR920000674B1 (ko) | 기판의 회전식 표면처리장치 | |
US5180431A (en) | Apparatus for applying liquid agent on surface of rotating substrate | |
KR100224463B1 (ko) | 도포장치 및 그 제어방법 | |
JPS61283126A (ja) | 処理ステ−シヨン内壁の洗浄方法と装置 | |
JP3945569B2 (ja) | 現像装置 | |
JPS6341630B2 (zh) | ||
JPH0441976Y2 (zh) | ||
JPH0444217Y2 (zh) | ||
JPH0441975Y2 (zh) | ||
JP2003080159A (ja) | 回転塗布装置 | |
CN114653503A (zh) | 涂胶机及其工艺腔 | |
JPH0725256Y2 (ja) | スピンナー装置 | |
JPH09122560A (ja) | 回転式塗布装置 | |
JP2948043B2 (ja) | 回転式基板処理装置 | |
JP2724870B2 (ja) | 処理装置 | |
JP3627651B2 (ja) | 半導体ウエハの表面処理方法及びその装置 | |
JP2907387B2 (ja) | 回転処理装置 | |
JP3794886B2 (ja) | 半導体ウエハのエッチング方法及びエッチング装置 | |
JPS63283131A (ja) | 半導体用回転塗布機 | |
JPS6339966Y2 (zh) | ||
JP3191379B2 (ja) | ウェハ乾燥装置と半導体装置の製造方法 | |
JPS60234323A (ja) | 半導体集積回路装置の製造装置 | |
JPH0621040A (ja) | 噴流式ウェットエッチング装置 | |
KR20240106163A (ko) | 기판 처리 장치 |