JPH0440118B2 - - Google Patents

Info

Publication number: JPH0440118B2
Authority: JP; Japan
Prior art keywords: laser; pulse; dulling; switch; roll
Prior art date: 1987-12-11
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.): Expired - Lifetime

Application number

JP63022038A

Other languages

English (en)

Japanese (ja)

Other versions

JPH01254392A (ja

Inventor

Katsuhiro Minamida

Junya Suehiro

Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)

Nippon Steel Corp

Original Assignee

Nippon Steel Corp

Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)

1987-12-11

Filing date

1988-02-03

Publication date

1992-07-01

1988-02-03 Application filed by Nippon Steel Corp filed Critical Nippon Steel Corp

1988-02-03 Priority to JP63022038A priority Critical patent/JPH01254392A/ja

1988-02-24 Priority to EP88902201A priority patent/EP0308512B1/en

1988-02-24 Priority to PCT/JP1988/000194 priority patent/WO1988006504A1/ja

1988-02-24 Priority to DE3850330T priority patent/DE3850330T2/de

1988-10-18 Priority to US07/305,121 priority patent/US4947023A/en

1989-10-11 Publication of JPH01254392A publication Critical patent/JPH01254392A/ja

1992-07-01 Publication of JPH0440118B2 publication Critical patent/JPH0440118B2/ja

Status Granted legal-status Critical Current

Links

238000000034 method Methods 0.000 claims description 18
230000015572 biosynthetic process Effects 0.000 claims description 3
238000003786 synthesis reaction Methods 0.000 claims description 3
230000001678 irradiating effect Effects 0.000 claims description 2
101100048228 Homo sapiens UBP1 gene Proteins 0.000 description 5
101100117629 Saccharomyces cerevisiae (strain ATCC 204508 / S288c) LCB3 gene Proteins 0.000 description 5
101100500049 Saccharomyces cerevisiae (strain ATCC 204508 / S288c) YSR3 gene Proteins 0.000 description 5
102100040065 Upstream-binding protein 1 Human genes 0.000 description 5
238000010586 diagram Methods 0.000 description 5
101100339482 Colletotrichum orbiculare (strain 104-T / ATCC 96160 / CBS 514.97 / LARS 414 / MAFF 240422) HOG1 gene Proteins 0.000 description 4
230000005284 excitation Effects 0.000 description 4
230000003287 optical effect Effects 0.000 description 3
238000005452 bending Methods 0.000 description 2
230000000694 effects Effects 0.000 description 2
238000003754 machining Methods 0.000 description 2
230000010287 polarization Effects 0.000 description 2
230000000630 rising effect Effects 0.000 description 2
239000010979 ruby Substances 0.000 description 2
229910001750 ruby Inorganic materials 0.000 description 2
229910000831 Steel Inorganic materials 0.000 description 1
238000005422 blasting Methods 0.000 description 1
230000007423 decrease Effects 0.000 description 1
238000005553 drilling Methods 0.000 description 1
238000009760 electrical discharge machining Methods 0.000 description 1
230000008020 evaporation Effects 0.000 description 1
238000001704 evaporation Methods 0.000 description 1
239000000463 material Substances 0.000 description 1
230000008018 melting Effects 0.000 description 1
238000002844 melting Methods 0.000 description 1
230000010355 oscillation Effects 0.000 description 1
239000010453 quartz Substances 0.000 description 1
238000007788 roughening Methods 0.000 description 1
238000000926 separation method Methods 0.000 description 1
VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 1
239000010959 steel Substances 0.000 description 1
239000000126 substance Substances 0.000 description 1
230000003746 surface roughness Effects 0.000 description 1
230000001360 synchronised effect Effects 0.000 description 1

Classifications

- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/067—Dividing the beam into multiple beams, e.g. multifocusing
- B23K26/0676—Dividing the beam into multiple beams, e.g. multifocusing into dependently operating sub-beams, e.g. an array of spots with fixed spatial relationship or for performing simultaneously identical operations
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/0604—Shaping the laser beam, e.g. by masks or multi-focusing by a combination of beams
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/352—Working by laser beam, e.g. welding, cutting or boring for surface treatment
- B23K26/355—Texturing

Landscapes

Physics & Mathematics (AREA)
Optics & Photonics (AREA)
Engineering & Computer Science (AREA)
Plasma & Fusion (AREA)
Mechanical Engineering (AREA)
Laser Beam Processing (AREA)

JP63022038A 1987-02-24 1988-02-03 製品表面のダル加工法 Granted JPH01254392A (ja)

Priority Applications (5)

Application Number	Priority Date	Filing Date	Title
JP63022038A JPH01254392A (ja)	1987-12-11	1988-02-03	製品表面のダル加工法
EP88902201A EP0308512B1 (en)	1987-02-24	1988-02-24	Apparatus for dull finish of roll with pulse laser
PCT/JP1988/000194 WO1988006504A1 (en)	1987-02-24	1988-02-24	Method and apparatus for dull finish of roll with pulse laser
DE3850330T DE3850330T2 (de)	1987-02-24	1988-02-24	Gerät zur mattveredelung einer rolle mittels impulslaser.
US07/305,121 US4947023A (en)	1987-02-24	1988-10-18	Method and apparatus for roll dulling by pulse laser beam

Applications Claiming Priority (3)

Application Number	Priority Date	Filing Date	Title
JP62-313620		1987-12-11
JP31362087		1987-12-11
JP63022038A JPH01254392A (ja)	1987-12-11	1988-02-03	製品表面のダル加工法

Publications (2)

Publication Number	Publication Date
JPH01254392A JPH01254392A (ja)	1989-10-11
JPH0440118B2 true JPH0440118B2 (zh)	1992-07-01

Family

ID=26359197

Family Applications (1)

Application Number	Title	Priority Date	Filing Date
JP63022038A Granted JPH01254392A (ja)	1987-02-24	1988-02-03	製品表面のダル加工法

Country Status (1)

Country	Link
JP (1)	JPH01254392A (zh)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
US5391856A (en) *	1991-01-11	1995-02-21	Nippon Steel Corporation	Cooling drum for casting thin cast pieces and method and apparatus for forming dimples in peripheral surface of the drum
EP0656241B1 (en)	1993-06-04	1998-12-23	Seiko Epson Corporation	Apparatus and method for laser machining
JPH10156571A (ja) *	1996-12-02	1998-06-16	Toshiba Electron Eng Corp	レーザ加工装置
US6897405B2 (en) *	2001-11-30	2005-05-24	Matsushita Electric Industrial Co., Ltd.	Method of laser milling using constant tool path algorithm
JP5188364B2 (ja) *	2008-11-11	2013-04-24	パナソニック株式会社	レーザ加工方法

1988
- 1988-02-03 JP JP63022038A patent/JPH01254392A/ja active Granted

Also Published As

Publication number	Publication date
JPH01254392A (ja)	1989-10-11

Publication	Publication Date	Title
US4947023A (en)	1990-08-07	Method and apparatus for roll dulling by pulse laser beam
EP2465634B1 (en)	2021-11-10	Laser machining device and laser machining method
US20050224469A1 (en)	2005-10-13	Efficient micro-machining apparatus and method employing multiple laser beams
US20220121082A1 (en)	2022-04-21	High-Speed Dynamic Beam Shaping
US20060114948A1 (en)	2006-06-01	Workpiece processing system using a common imaged optical assembly to shape the spatial distributions of light energy of multiple laser beams
WO2000041839A1 (en)	2000-07-20	Laser beam machining and laser beam machine
JP2002192371A (ja)	2002-07-10	レーザ加工方法及びレーザ加工装置
JP2002192368A (ja)	2002-07-10	レーザ加工装置
JP2005074479A (ja)	2005-03-24	レーザ加工装置、及びレーザ加工方法
WO2001051244A1 (en)	2001-07-19	Apparatus for and method of targeting
JPH11170072A (ja)	1999-06-29	レーザー加工方法及び装置、並びに非導電性透明基板の回路形成方法及び装置
WO2006062766A2 (en)	2006-06-15	Efficient micro-machining apparatus and method employing multiple laser beams
JPH0440118B2 (zh)	1992-07-01
KR100371125B1 (ko)	2003-08-19	저가의 평균 전력과 휘도가 높은 고상 펄스 레이저 시스템
JP7008740B2 (ja)	2022-01-25	最適化されたレーザー切断
JP2002543984A (ja)	2002-12-24	レーザを用いた工作物の除去装置
JP3463281B2 (ja)	2003-11-05	多軸レーザ加工装置及びレーザ加工方法
JP2002239772A (ja)	2002-08-28	レーザ加工方法およびその装置
JPS6182989A (ja)	1986-04-26	円筒形の金属製被処理物に刻線を形成する方法
JPH0327313B2 (zh)	1991-04-15
JPH0327314B2 (zh)	1991-04-15
JPH11123577A (ja)	1999-05-11	脆性材のレーザー加工方法
JP3604014B2 (ja)	2004-12-22	レーザ加工装置及び加工方法
JP2021030249A (ja)	2021-03-01	レーザー加工装置、及びレーザー加工方法
JP2965419B2 (ja)	1999-10-18	鋳片鋳造用冷却ドラムのディンプル加工装置