JPH043992A - Solder printing method - Google Patents
Solder printing methodInfo
- Publication number
- JPH043992A JPH043992A JP10496690A JP10496690A JPH043992A JP H043992 A JPH043992 A JP H043992A JP 10496690 A JP10496690 A JP 10496690A JP 10496690 A JP10496690 A JP 10496690A JP H043992 A JPH043992 A JP H043992A
- Authority
- JP
- Japan
- Prior art keywords
- paste
- wiring board
- printed wiring
- solder
- solder paste
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 229910000679 solder Inorganic materials 0.000 title claims abstract description 37
- 238000007639 printing Methods 0.000 title claims abstract description 17
- 238000000034 method Methods 0.000 title description 18
- 239000000843 powder Substances 0.000 claims abstract description 5
- 230000004907 flux Effects 0.000 claims abstract description 4
- 239000000203 mixture Substances 0.000 claims abstract description 4
- 239000011347 resin Substances 0.000 claims abstract description 4
- 229920005989 resin Polymers 0.000 claims abstract description 4
- 230000001678 irradiating effect Effects 0.000 claims description 3
- 239000000178 monomer Substances 0.000 abstract description 4
- 238000004132 cross linking Methods 0.000 abstract description 2
- 230000005496 eutectics Effects 0.000 abstract description 2
- 230000008018 melting Effects 0.000 abstract description 2
- 238000002844 melting Methods 0.000 abstract description 2
- 229920000642 polymer Polymers 0.000 abstract description 2
- 230000005540 biological transmission Effects 0.000 abstract 2
- 229910020220 Pb—Sn Inorganic materials 0.000 abstract 1
- 239000003795 chemical substances by application Substances 0.000 abstract 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 abstract 1
- 239000006071 cream Substances 0.000 description 10
- 238000007650 screen-printing Methods 0.000 description 7
- 238000005476 soldering Methods 0.000 description 7
- 229910052751 metal Inorganic materials 0.000 description 6
- 239000002184 metal Substances 0.000 description 6
- 238000005516 engineering process Methods 0.000 description 3
- 238000004806 packaging method and process Methods 0.000 description 3
- CDBYLPFSWZWCQE-UHFFFAOYSA-L Sodium Carbonate Chemical compound [Na+].[Na+].[O-]C([O-])=O CDBYLPFSWZWCQE-UHFFFAOYSA-L 0.000 description 2
- IDCBOTIENDVCBQ-UHFFFAOYSA-N TEPP Chemical compound CCOP(=O)(OCC)OP(=O)(OCC)OCC IDCBOTIENDVCBQ-UHFFFAOYSA-N 0.000 description 2
- 239000003292 glue Substances 0.000 description 2
- 239000003999 initiator Substances 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- RSWGJHLUYNHPMX-UHFFFAOYSA-N Abietic-Saeure Natural products C12CCC(C(C)C)=CC2=CCC2C1(C)CCCC2(C)C(O)=O RSWGJHLUYNHPMX-UHFFFAOYSA-N 0.000 description 1
- YCKRFDGAMUMZLT-UHFFFAOYSA-N Fluorine atom Chemical compound [F] YCKRFDGAMUMZLT-UHFFFAOYSA-N 0.000 description 1
- KHPCPRHQVVSZAH-HUOMCSJISA-N Rosin Natural products O(C/C=C/c1ccccc1)[C@H]1[C@H](O)[C@@H](O)[C@@H](O)[C@@H](CO)O1 KHPCPRHQVVSZAH-HUOMCSJISA-N 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 239000012670 alkaline solution Substances 0.000 description 1
- 239000007864 aqueous solution Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000000839 emulsion Substances 0.000 description 1
- 229910052731 fluorine Inorganic materials 0.000 description 1
- 239000011737 fluorine Substances 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 239000003960 organic solvent Substances 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 229910000029 sodium carbonate Inorganic materials 0.000 description 1
- 238000005507 spraying Methods 0.000 description 1
- KHPCPRHQVVSZAH-UHFFFAOYSA-N trans-cinnamyl beta-D-glucopyranoside Natural products OC1C(O)C(O)C(CO)OC1OCC=CC1=CC=CC=C1 KHPCPRHQVVSZAH-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3457—Solder materials or compositions; Methods of application thereof
Landscapes
- Screen Printers (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
Description
【発明の詳細な説明】
〔産業上の利用分野〕
本発明は半田印刷方法に関し、特に、リフロー半田付け
に適用しうる高密度実装対応の半田印刷方法に関する。DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a solder printing method, and particularly to a solder printing method that can be applied to reflow soldering and is compatible with high-density packaging.
近年の電子機器は小型軽量化、高機能化と、いわゆる、
ポータプル化が促進されてきているにのため、半導体素
子においてもボータプル化に対応するために、パッケー
ジの小型化及び多ビン化が要求されてきている。これら
の半導体素子のパッケージには、ＤＩＲ，ＳＭＤ及びフ
ィルムキャリア等の形態があるが、前記の理由のため、
パッケージ形態の主流がＤＩＲからＳＭＤへと移行して
きた。ＳＭＤを回路基板に実装する方法としては、回路
基板上の電極パッド上にクリーム半田を印刷した後、Ｓ
ＭＤのリードを電極パッドに位置合わせして仮止めし、
ふっ素糸有機溶剤蒸気中あるいはＩＲ炉中で加熱する事
により、クリーム半田を溶融して電極パッドとリードと
を接続する、いわゆる、リフロー半田付けが主流となっ
ている。In recent years, electronic devices have become smaller, lighter, and more highly functional.
As the trend towards portaples has been promoted, there has been a demand for smaller packages and multi-bin packages for semiconductor devices as well, in order to accommodate the trend towards portaples. Packages for these semiconductor devices include DIR, SMD, film carrier, etc., but for the reasons mentioned above,
The mainstream packaging format has shifted from DIR to SMD. The method of mounting SMD on a circuit board is to print cream solder on the electrode pads on the circuit board, and then
Align the MD lead with the electrode pad and temporarily secure it.
The mainstream is so-called reflow soldering, which connects electrode pads and leads by melting cream solder by heating the fluorine thread in organic solvent vapor or in an IR furnace.
しかしながら、上述した理由のためＳＭＤのリードのピ
ッチは狭くなる傾向にあり、従来のりフロー半田付けの
方法では対応が不可能になりつつある。However, due to the above-mentioned reasons, the pitch of SMD leads tends to become narrower, and it is becoming impossible to cope with this by the conventional glue flow soldering method.
従来のりフロー半田付けのための半田印刷方法としでは
、クリーム半田をスクリーン印刷する方法がある。As a conventional solder printing method for glue flow soldering, there is a method of screen printing cream solder.
第２図（ａ）〜第２図（ｃ）は従来の一例を説明するた
めの断面図である。まず、第２図（ａ＞の如く、印刷配
線板１の電極パッド２の位置に孔３を有するメタルマス
ク４を位置合わせして固定する。このとき印刷配線板１
とメタルマスク４との間には約１ｍｍのギャップを持た
せる。FIGS. 2(a) to 2(c) are cross-sectional views for explaining an example of the conventional technology. First, as shown in FIG.
A gap of approximately 1 mm is provided between the metal mask 4 and the metal mask 4.
次いで、第２図（ｂ）の如く、メタルマスク４上にクリ
ーム半田５を乗せ、スキージ６を押し動かすことにより
クリーム半田５を孔３を通過させ電極パッド２上に印刷
する。このときスキージ６に引きずられてメタルマスク
４が動く事や、ギャップを設けた事によりクリーム半田
５と電極パッド２との位置ずれは最大でも±３００μｍ
となる。Next, as shown in FIG. 2(b), cream solder 5 is placed on the metal mask 4, and by pushing and moving the squeegee 6, the cream solder 5 passes through the holes 3 and is printed on the electrode pads 2. At this time, due to the movement of the metal mask 4 being dragged by the squeegee 6 and the provision of a gap, the positional deviation between the cream solder 5 and the electrode pad 2 is at most ±300 μm.
becomes.
更に、第２図（ｃ）の如く、メタルマスクを印刷配線板
１から引き上げて印刷工程を終える。Furthermore, as shown in FIG. 2(c), the metal mask is pulled up from the printed wiring board 1 to complete the printing process.
上述した従来の半田印刷方法は、以下に説明する欠点を
有している。即ち、第３図（ａ＞の如く、スクリーン印
刷による半田印刷方法は、電極パッド２の位置に対する
印刷後のクリーム半田５の位置ずれの大きさ（図でｄｘ
、ｄｙで示す大きさ）が最大で±３００μｍと大きい。The conventional solder printing method described above has the following drawbacks. That is, as shown in FIG. 3 (a), the solder printing method by screen printing is based on the size of the positional deviation of the cream solder 5 after printing with respect to the position of the electrode pad 2 (dx in the figure).
, dy) is as large as ±300 μm at maximum.
このため、クリーム半田５が隣接する電極パッドに近づ
きすぎた場合には、第３図（ｂ）の如く、リフロー半田
付は後にブリッジ１２が発生する。ところで、高密度実
装を目的として電極パッドのピッチサイズ（＝Ｗ＋Ｓ）
を小さくするためには、パッド間隔Ｓを小さく設計する
必要があるが、この場合、上記の減少は更に起こりやす
くなる。Therefore, if the cream solder 5 comes too close to the adjacent electrode pad, a bridge 12 will occur after reflow soldering, as shown in FIG. 3(b). By the way, for the purpose of high-density mounting, the pitch size of electrode pads (=W+S)
In order to reduce the pad spacing S, it is necessary to design the pad spacing S to be small, but in this case, the above reduction is more likely to occur.
以上説明した位置ずれに起因するブリッジ発生は、高密
度実装の実現を防げる最も大きな障害であり、このため
、スクリーン印刷による半田印刷方法における実現可能
な最挟のパッドピッチサイズは０．４ｍｍとされている
。The occurrence of bridging due to positional misalignment as explained above is the biggest obstacle that prevents the realization of high-density packaging. Therefore, the closest pad pitch size that can be realized in the solder printing method using screen printing is set to 0.4 mm. ing.
更に、スクリーン印刷法ではクリーム半田のだれや目詰
りのため仕上り形状が不均一になり易いので、リフロー
後の歩留りが低下する。Furthermore, in the screen printing method, the finished shape tends to be uneven due to dripping or clogging of the cream solder, which reduces the yield after reflow.
本発明の半田印刷方法は、半田粉末をフラックス成分４
と光硬化性樹脂とを含む混合物中に分散させたペースト
を印刷配線板に印刷する工程と、前記ペーストの所定の
位置に選択的に光照射し硬化部を形成する工程と、前記
ペーストの前記硬化部以外を溶解除去する工程とを含ん
で構成される。In the solder printing method of the present invention, solder powder is mixed with a flux component of 4
a step of printing a paste dispersed in a mixture containing a photocurable resin and a photocurable resin on a printed wiring board; a step of selectively irradiating light to predetermined positions of the paste to form a cured portion; The method includes a step of dissolving and removing portions other than the hardened portion.
次に、本発明の実施例について、図面を参照して詳細に
説明する。Next, embodiments of the present invention will be described in detail with reference to the drawings.
第１図（ａ）〜同図（ｃ）は本発明の一実施例を説明す
るための断面図である。FIGS. 1(a) to 1(c) are sectional views for explaining one embodiment of the present invention.
まず、第１図（ａ）の如く、印刷配線板１に感光性半田
ペースト７をスクリーン印刷する。ここで、感光性半田
ペースト７は半田粉末（Ｐｂ−３ｎ共晶半田、平均粒径
は１０μｍ以下が望ましい）を５０〜８０重量部と、ロ
ジン系フラックス１０〜２０重量部と、反応開始剤０．
１〜１重量部と、モノマー１０〜３０重量部とを含む混
合物中に分散させてペースト状にしたものである。上記
のように製造した感光性半田ペースト７は、紫外光を照
射することによって成分中の反応開始剤がラジカル化し
、モノマー同士を架橋反応させることにより高分子鎖と
なり、アルカリ水溶液に対して不溶化するようになって
いる。このスクリーン印刷には１５０メツシユ、エマル
ジョン厚１００μｍのテトロンメツシュスクリーン１３
を用い、印刷領域は使用する感光性半田ペースト７を最
少限にとどめる事と印刷時の位置ずれとを考慮し、電極
パッド２を囲む領域とした。First, as shown in FIG. 1(a), a photosensitive solder paste 7 is screen printed on a printed wiring board 1. Here, the photosensitive solder paste 7 contains 50 to 80 parts by weight of solder powder (Pb-3n eutectic solder, preferably the average particle size is 10 μm or less), 10 to 20 parts by weight of rosin flux, and 0 parts by weight of a reaction initiator. ．．
It is made into a paste by dispersing it in a mixture containing 1 to 1 part by weight of a monomer and 10 to 30 parts by weight of a monomer. In the photosensitive solder paste 7 manufactured as described above, the reaction initiator in the components is radicalized by irradiation with ultraviolet light, and the monomers undergo a crosslinking reaction with each other to form a polymer chain and become insoluble in an aqueous alkaline solution. It looks like this. This screen printing uses 150 meshes and 13 Tetron mesh screens with an emulsion thickness of 100 μm.
The printing area was set to be an area surrounding the electrode pad 2 in consideration of minimizing the amount of photosensitive solder paste 7 used and taking into consideration positional deviation during printing.
次いで第１図（ｂ）の如く、印刷配線板１の電極パッド
２の位置に透光部８を有するフォトマスク９を位置合わ
せして重ね合わせ、透光部８を通して感光性半田ペース
ト７に紫外光１０を照射して硬化部１１を形成する。こ
のとき、フォトマスク９は印刷配線板１上に設けた合わ
せマークを利用して位置合わせを行なうので透光部８と
電極パッド２との位置ずれは最大でも±１００μｍとな
る。Next, as shown in FIG. 1(b), a photomask 9 having a transparent part 8 is aligned and overlapped with the electrode pad 2 of the printed wiring board 1, and ultraviolet light is applied to the photosensitive solder paste 7 through the transparent part 8. A hardened portion 11 is formed by irradiating light 10. At this time, since the photomask 9 is aligned using alignment marks provided on the printed wiring board 1, the positional deviation between the light-transmitting portion 8 and the electrode pad 2 is ±100 μm at the maximum.
更に、第１図（ｃ）の如く、印刷配線板１に炭酸ナトリ
ウム１重量部を含む水溶液をスプレーする事により硬化
部１１以外の部分を溶解除去する。この後、０．３ｍｍ
ピッチのリードを有するＱＦＰを位置合わせして接着剤
で仮止めし、リフロー半田付けを行なったところ、ブリ
ッジする事なく実装できた。Furthermore, as shown in FIG. 1(c), by spraying an aqueous solution containing 1 part by weight of sodium carbonate onto the printed wiring board 1, the portions other than the hardened portions 11 are dissolved and removed. After this, 0.3mm
When we aligned the QFP with pitch leads, temporarily fixed it with adhesive, and performed reflow soldering, it was possible to mount it without bridging.
本発明の半田印刷方法は、フォトプロセスを用いて印刷
するので、以下に説明する利点を有する。Since the solder printing method of the present invention uses a photo process to print, it has the following advantages.
（１）位置ずれの大きさがスクリーン印刷法では最大で
３００μｍであるのに対し、本発明の半田印刷方法では
最大でも１００μｍと小さいので、パッドのピッチサイ
ズを０．３ｍｍまで狭くでき高密度実装が可能となる。(1) While the size of misalignment is 300 μm at maximum in the screen printing method, the size of misalignment is as small as 100 μm at the maximum in the solder printing method of the present invention, so the pad pitch size can be narrowed to 0.3 mm, allowing high-density mounting. becomes possible.
（２）スクリーン印刷法で発生するダレや目詰りが全く
起こらず、仕上り形状を均一に印刷できるので、半田付
けの歩留りを向上する事が可能となる。(2) Since the finished shape can be printed uniformly without any sag or clogging that occurs with screen printing, it is possible to improve the soldering yield.
第１図（ａ）〜同図（ｃ）は本発明の一実施例を示す断
面図、第２図（ａ）〜同図（ｃ）は従来の技術を説明す
るための断面図、第３図及び同図（ｂ）は従来技術の欠
点を説明するための平面図である。
１・・・印刷配線板、２・・・電極パッド、３・・・孔
、４・・・メタルマスク、５・・・クリーム半田、６・
・・スキージ、７・・・感光性半田ペースト、８・・・
透光部、９・・・フォトマスク、１０・・・紫外光、１
１・・・硬化部、１２・・・ブリッジ、１３・・・テト
ロンメツシュスクリーン。1(a) to 1(c) are cross-sectional views showing one embodiment of the present invention, FIGS. 2(a) to 2(c) are sectional views for explaining the conventional technology, and FIG. The figure and FIG. 2(b) are plan views for explaining the drawbacks of the prior art. DESCRIPTION OF SYMBOLS 1... Printed wiring board, 2... Electrode pad, 3... Hole, 4... Metal mask, 5... Cream solder, 6...
... Squeegee, 7... Photosensitive solder paste, 8...
Transparent part, 9... Photomask, 10... Ultraviolet light, 1
1... Hardened part, 12... Bridge, 13... Tetron mesh screen.
Claims (1)
物中に分散させたペーストを印刷配線板に印刷する工程
と、前記ペーストの所定の位置に選択的に光照射し硬化
部を形成する工程と、前記ペーストの前記硬化部以外を
溶解除去する工程とを含む事を特徴とする半田印刷方法
。A step of printing a paste in which solder powder is dispersed in a mixture containing a flux component and a photocurable resin on a printed wiring board, and a step of selectively irradiating light onto predetermined positions of the paste to form a hardened portion. , a step of dissolving and removing portions of the paste other than the hardened portion.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10496690A JPH043992A (en) | 1990-04-20 | 1990-04-20 | Solder printing method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10496690A JPH043992A (en) | 1990-04-20 | 1990-04-20 | Solder printing method |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH043992A true JPH043992A (en) | 1992-01-08 |
Family
ID=14394848
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP10496690A Pending JPH043992A (en) | 1990-04-20 | 1990-04-20 | Solder printing method |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH043992A (en) |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5564617A (en) * | 1992-09-03 | 1996-10-15 | Lucent Technologies Inc. | Method and apparatus for assembling multichip modules |
| WO2007145480A1 (en) * | 2006-06-15 | 2007-12-21 | Sang Jun Bae | Solder paste and method for forming solder bumps using the same |
| JP2008503896A (en) * | 2004-06-25 | 2008-02-07 | インテル コーポレイション | Method of forming solder bumps using paste that maintains shape after UV irradiation |
| JP2008135518A (en) * | 2006-11-28 | 2008-06-12 | Matsushita Electric Ind Co Ltd | Electronic component mounting structure and method for manufacturing the structure |
| JP2008140834A (en) * | 2006-11-30 | 2008-06-19 | Matsushita Electric Ind Co Ltd | Conductive bump and formation method therefor, and semiconductor device using the formation method |
| US8120188B2 (en) | 2006-11-28 | 2012-02-21 | Panasonic Corporation | Electronic component mounting structure and method for manufacturing the same |
-
1990
- 1990-04-20 JP JP10496690A patent/JPH043992A/en active Pending
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5564617A (en) * | 1992-09-03 | 1996-10-15 | Lucent Technologies Inc. | Method and apparatus for assembling multichip modules |
| JP2008503896A (en) * | 2004-06-25 | 2008-02-07 | インテル コーポレイション | Method of forming solder bumps using paste that maintains shape after UV irradiation |
| WO2007145480A1 (en) * | 2006-06-15 | 2007-12-21 | Sang Jun Bae | Solder paste and method for forming solder bumps using the same |
| JP2009540598A (en) * | 2006-06-15 | 2009-11-19 | ジュン ベ，サン | Method of forming solder bump using solder paste and solder paste |
| JP2008135518A (en) * | 2006-11-28 | 2008-06-12 | Matsushita Electric Ind Co Ltd | Electronic component mounting structure and method for manufacturing the structure |
| US8120188B2 (en) | 2006-11-28 | 2012-02-21 | Panasonic Corporation | Electronic component mounting structure and method for manufacturing the same |
| JP2008140834A (en) * | 2006-11-30 | 2008-06-19 | Matsushita Electric Ind Co Ltd | Conductive bump and formation method therefor, and semiconductor device using the formation method |
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