JP2013038156A - Manufacturing method of printed wiring board - Google Patents

Manufacturing method of printed wiring board Download PDF

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JP2013038156A
JP2013038156A JP2011171733A JP2011171733A JP2013038156A JP 2013038156 A JP2013038156 A JP 2013038156A JP 2011171733 A JP2011171733 A JP 2011171733A JP 2011171733 A JP2011171733 A JP 2011171733A JP 2013038156 A JP2013038156 A JP 2013038156A
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solder resist
wiring board
printed wiring
resin film
film
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JP5768574B2 (en
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Koji Shigeta
晃二 重田
Goro Ideta
吾朗 出田
Hajime Abe
元 安部
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Mitsubishi Electric Corp
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Abstract

PROBLEM TO BE SOLVED: To obtain a printed wiring board which prevents a solder resist pattern from becoming an under cut shape and peeling and also prevents bridge failures and short circuits which are caused by soldering.SOLUTION: A manufacturing method of a printed wiring board includes the steps of: forming a resin film 5 for repelling a liquid solder resist 6 on a mounting pad 2 formed on an insulation substrate 1; applying and drying the liquid solder resist 6 on the insulation substrate 1 on which the resin film 5 is formed to form an uncured solder resist film 7; forming a photo-cured solder resist pattern 10 by conducting development after exposing the uncured solder resist film 7 through a photo mask 8; and removing the resin film 5.

Description

本発明はプリント配線板の製造方法に関するものであり、さらに詳しくは、はんだ付けによる電子部品実装時の短絡を防ぐプリント配線板の製造方法に関するものである。   The present invention relates to a method for manufacturing a printed wiring board, and more particularly to a method for manufacturing a printed wiring board that prevents a short circuit when mounting electronic components by soldering.

プリント配線板は、絶縁基板上に銅配線、実装パッド等が形成され、はんだ付けによる電子部品実装時に、不要な部分にはんだが付着して短絡等の不良とならないよう、実装パッド以外の部分に、はんだの付着を防止するソルダレジストパターンが形成されている。   The printed wiring board has copper wiring, mounting pads, etc. formed on an insulating substrate, and when mounting electronic components by soldering, solder is attached to unnecessary parts to prevent defects such as short circuits. A solder resist pattern for preventing the adhesion of solder is formed.

ソルダレジストは、液状とフィルム状の２種に大別することができる。これらは、絶縁基板上に未硬化のソルダレジスト膜を作製する工程が異なっている。本発明は、液状のソルダレジストを用いてソルダレジストパターンを形成するプリント配線板の製造方法に関するものであり、以降液状のソルダレジストを用いた場合についてのみ説明する。   Solder resists can be roughly classified into two types, liquid and film. These differ in the process of producing an uncured solder resist film on an insulating substrate. The present invention relates to a method for manufacturing a printed wiring board in which a solder resist pattern is formed using a liquid solder resist. Hereinafter, only the case where a liquid solder resist is used will be described.

液状のソルダレジストは、光硬化性樹脂と熱硬化性樹脂の混合物で、一般に写真製版を用いてソルダレジストパターンを形成する。つまり、液状のソルダレジストを絶縁基板面に塗布、乾燥して、指触乾燥の状態とした未硬化のソルダレジスト膜を形成する。次に、フォトマスクを用いて露光、現像して不要なソルダレジスト膜を除去し、はんだの付着を防止したい部分にのみソルダレジストパターンを形成する。   The liquid solder resist is a mixture of a photocurable resin and a thermosetting resin, and generally forms a solder resist pattern using photolithography. In other words, a liquid solder resist is applied to the surface of the insulating substrate and dried to form an uncured solder resist film in a dry-to-touch state. Next, an unnecessary solder resist film is removed by exposure and development using a photomask, and a solder resist pattern is formed only on a portion where solder adhesion is desired to be prevented.

一方、プリント配線板上にＱＦＰ（Ｑｕａd Ｆｌａｔ Ｐａｃｋａｇｅ）等の高密度多端子の部品を実装する要請から、実装パッドは狭ピッチ化が進み、その場合でも十分な電流密度を確保できるよう、厚膜化が進んでいる。   On the other hand, due to the demand for mounting high-density multi-terminal components such as QFP (Quad Flat Package) on the printed wiring board, the mounting pads have been made narrower, and even in that case, a thick film can be secured. Is progressing.

この狭ピッチ、厚膜の実装パッドが形成された絶縁基板上に一様に液状のソルダレジストを塗布し、乾燥して未硬化のソルダレジスト膜を形成すると、実装パッド部分と、実装パッド間の部分の高低差により、未硬化のソルダレジスト膜の表面に凹凸が形成される。この状態でフォトマスクを用いて紫外線により露光すると、フォトマスクを未硬化のソルダレジスト膜の表面に均一に密着させることができない。つまり、実装パッド間の部分では未硬化のソルダレジスト膜の表面は凹形状となり、フォトマスクは離れた状態となる。   When a liquid solder resist is uniformly applied on the insulating substrate on which the narrow pitch, thick film mounting pads are formed and dried to form an uncured solder resist film, the space between the mounting pad portion and the mounting pad is reduced. Unevenness is formed on the surface of the uncured solder resist film due to the height difference of the portions. If the photomask is exposed to ultraviolet rays in this state, the photomask cannot be uniformly adhered to the surface of the uncured solder resist film. That is, the surface of the uncured solder resist film has a concave shape in the portion between the mounting pads, and the photomask is separated.

未硬化のソルダレジスト膜とフォトマスクが離れていると、露光パターンの周囲の回折、未硬化のソルダレジスト膜とフォトマスク間の多重反射等により露光パターンのボケが生じる。その結果、未硬化のソルダレジスト膜の下部では、紫外線照度が低く、硬化が不十分となるため、現像後のソルダレジストパターンの断面は上部より絶縁基板に接する下部の方が狭い、いわゆるアンダーカット型となる。   When the uncured solder resist film and the photomask are separated, the exposure pattern is blurred due to diffraction around the exposure pattern, multiple reflection between the uncured solder resist film and the photomask, and the like. As a result, under the uncured solder resist film, the UV illuminance is low and curing is insufficient, so the cross section of the solder resist pattern after development is narrower in the lower part in contact with the insulating substrate than in the upper part, so-called undercut Become a mold.

アンダーカット型のソルダレジストパターンでは、ソルダレジストパターンとプリント配線板を構成する絶縁基板との接触面積が小さく、ソルダレジストパターンの剥離が生じやすく、はんだ付けした時に、ソルダレジストパターンの剥離が生じた部分では、実装パッド間のブリッジ不良による短絡が生じやすくなる。   In the undercut solder resist pattern, the contact area between the solder resist pattern and the insulating substrate constituting the printed wiring board is small, and the solder resist pattern is likely to be peeled off. When soldering, the solder resist pattern is peeled off. In the portion, a short circuit is likely to occur due to a bridging failure between the mounting pads.

この問題に対応するため、現像速度が異なる2種類以上の液状のソルダレジストを用い、絶縁基板面に近い下層ほど現像速度を速くした、多層の未硬化のソルダレジスト膜を作製し、下層の現像時間を短縮することで、１層のみの場合よりも相対現像時間を短くして、ソルダレジストパターンの断面をアンダーカット型としない製造方法が提案されている（例えば、特許文献１）。   To cope with this problem, two or more types of liquid solder resists with different development speeds were used, and a multilayer uncured solder resist film was prepared with a lower development speed closer to the insulating substrate surface. There has been proposed a manufacturing method in which the relative development time is made shorter than in the case of only one layer by reducing the time, and the cross section of the solder resist pattern is not an undercut type (for example, Patent Document 1).

しかし、本製造方法を用いた場合であっても、未硬化のソルダレジスト膜の表面の凹凸に起因する露光パターンのボケは発生する。そのためソルダレジストパターンの断面がアンダーカット型となることを防ぐことはできず、ソルダレジストパターンの剥離、それに起因するはんだ付け時のブリッジ不良による短絡を防ぐことはできない。   However, even when this manufacturing method is used, blurring of the exposure pattern due to unevenness on the surface of the uncured solder resist film occurs. Therefore, the cross section of the solder resist pattern cannot be prevented from becoming an undercut type, and it is impossible to prevent the solder resist pattern from being peeled off and short-circuiting due to a bridging failure during soldering.

特開２０００−１３００４号公報JP 2000-13004 A

プリント配線板の実装パッドは狭ピッチ化、厚膜化している。このような実装パッドが形成された絶縁基板面に液状のソルダレジストを一様に塗布、乾燥すると、実装パッドの有無に起因する高低差のため未硬化のソルダレジスト膜の表面に凹凸ができる。この時、フォトマスクを未硬化のソルダレジスト膜の表面に均一に密着することができず露光パターンのボケが生じる。このため、未硬化のソルダレジスト膜の絶縁基板に接する下部では紫外線照度が低く、硬化が不十分となり、現像後のソルダレジストパターンの断面はアンダーカット型となる。このアンダーカット型のソルダレジストパターンは剥離が生じやすく、はんだ付けした時に、実装パッド間のブリッジ不良による短絡が生じやすくなるという課題があった。   The mounting pads of the printed wiring board are made narrower and thicker. When a liquid solder resist is uniformly applied and dried on the surface of the insulating substrate on which such mounting pads are formed, unevenness is formed on the surface of the uncured solder resist film due to the height difference caused by the presence or absence of the mounting pads. At this time, the photomask cannot be uniformly adhered to the surface of the uncured solder resist film, and the exposure pattern is blurred. For this reason, in the lower part of the uncured solder resist film in contact with the insulating substrate, the ultraviolet illuminance is low and the curing is insufficient, and the cross section of the solder resist pattern after development is an undercut type. This undercut solder resist pattern is likely to be peeled off, and when soldered, there is a problem that a short circuit due to a bridging failure between mounting pads is likely to occur.

本発明は、このような課題を解決するためになされたもので、ソルダレジストパターンがアンダーカット型となることを防止し、はんだ付けによる電子部品実装時のブリッジ不良による短絡を防止するプリント配線板の製造方法を提供することを目的とする。   The present invention has been made to solve such a problem, and prevents a solder resist pattern from becoming an undercut type, and prevents a short circuit due to a bridging failure when mounting an electronic component by soldering. It aims at providing the manufacturing method of.

本発明のプリント配線板の製造方法は、絶縁基板上に形成された実装パッドに液状のソルダレジストをはじく樹脂膜を形成する工程と、樹脂膜を形成した絶縁基板上に液状のソルダレジストを塗布及び乾燥して未硬化のソルダレジスト膜を形成する工程と、未硬化のソルダレジスト膜にフォトマスクを介して露光を行なった後、現像を行なうことにより光硬化したソルダレジストパターンを形成する工程と、樹脂膜を除去する工程と、を備えるものである。   The method for producing a printed wiring board of the present invention includes a step of forming a resin film that repels a liquid solder resist on a mounting pad formed on an insulating substrate, and a liquid solder resist is applied on the insulating substrate on which the resin film is formed. And a step of forming an uncured solder resist film by drying, and a step of forming a photo-cured solder resist pattern by performing development after exposing the uncured solder resist film through a photomask, and And a step of removing the resin film.

本発明のプリント配線板の製造方法を用いることで、ソルダレジストパターンの断面がアンダーカット型となること防止でき、ソルダレジストパターンの剥離が生じにくく、はんだ付けによる電子部品実装時のブリッジ不良による短絡を防止できる。   By using the printed wiring board manufacturing method of the present invention, the cross section of the solder resist pattern can be prevented from becoming an undercut type, the solder resist pattern is hardly peeled off, and a short circuit due to a bridging failure when mounting electronic components by soldering Can be prevented.

本発明の実施の形態１のプリント配線板の製造方法を説明する断面模式図である。It is a cross-sectional schematic diagram explaining the manufacturing method of the printed wiring board of Embodiment 1 of this invention. 本発明の実施の形態２のプリント配線板の製造方法を説明する断面模式図である。It is a cross-sectional schematic diagram explaining the manufacturing method of the printed wiring board of Embodiment 2 of this invention.

実施の形態１．
図１を用いて、本発明の実施の形態１のプリント配線板の製造方法を説明する。図１は、本発明の実施の形態１のプリント配線板の製造方法を説明する断面模式図である。 Embodiment 1 FIG.
A method for manufacturing a printed wiring board according to Embodiment 1 of the present invention will be described with reference to FIG. FIG. 1 is a schematic cross-sectional view illustrating a method for manufacturing a printed wiring board according to Embodiment 1 of the present invention.

絶縁基板１上に、実装パッドピッチが２５０μｍ（実装パッド間隔１５０μｍ）、実装パッドの厚みが１００μｍの実装パッド２が形成されている。   A mounting pad 2 having a mounting pad pitch of 250 μm (mounting pad spacing of 150 μm) and a mounting pad thickness of 100 μm is formed on the insulating substrate 1.

絶縁基板１面の実装パッド２上にメタルマスク４を用いた印刷法により、樹脂膜５を形成する。この樹脂膜５は液状のソルダレジスト６をはじく性質を有するもので、シリコーン系離型剤を樹脂膜５の材料として用いる。印刷法に用いるメタルマスク４はメタル部４ａと開口部４ｂを有しており、メタルマスク４の開口部４ｂの位置を実装パッド２に合わせる。次に、メタルマスク４の上面にシリコーン系離型剤５ａを塗り広げ、スキージを用いて擦ることで、メタルマスク４の開口部４ｂ下の実装パッド２のみにシリコーン系離型剤が塗布され、乾燥後液状のソルダレジスト６をはじく樹脂膜５が形成される（図１（ａ））。   A resin film 5 is formed on the mounting pad 2 on the surface of the insulating substrate 1 by a printing method using a metal mask 4. The resin film 5 has a property of repelling the liquid solder resist 6, and a silicone release agent is used as a material for the resin film 5. The metal mask 4 used for the printing method has a metal part 4 a and an opening 4 b, and the position of the opening 4 b of the metal mask 4 is aligned with the mounting pad 2. Next, the silicone-based release agent 5a is spread on the upper surface of the metal mask 4 and rubbed with a squeegee so that the silicone-type release agent is applied only to the mounting pad 2 under the opening 4b of the metal mask 4, After drying, a resin film 5 that repels the liquid solder resist 6 is formed (FIG. 1A).

次に絶縁基板１上に液状のソルダレジスト６をエアスプレー法を用いて塗布する。液状のソルダレジスト６としては紫外線を照射することにより硬化する光硬化性を有するものを用いる。液状のソルダレジスト６はシリコーン系離型剤からなる樹脂膜５の部分でははじき、塗布することができない。したがって液状のソルダレジスト６は実装パッド２上には塗布することができず、実装パッド２の間の部分にのみ塗布される（図１（ｂ））。   Next, a liquid solder resist 6 is applied on the insulating substrate 1 using an air spray method. As the liquid solder resist 6, a resist having photocurability that is cured by irradiation with ultraviolet rays is used. The liquid solder resist 6 repels at the portion of the resin film 5 made of a silicone release agent and cannot be applied. Therefore, the liquid solder resist 6 cannot be applied onto the mounting pad 2 and is applied only to the portion between the mounting pads 2 (FIG. 1B).

その後、液状のソルダレジスト６を塗布した絶縁基板１を乾燥して、指触乾燥の状態とした未硬化のソルダレジスト膜７を形成する（図１（ｃ））。   Thereafter, the insulating substrate 1 to which the liquid solder resist 6 is applied is dried to form an uncured solder resist film 7 in a dry-to-touch state (FIG. 1C).

次に、未硬化のソルダレジスト膜７にフォトマスク８を介して露光を行ない、硬化させる部分のみに紫外線９を照射する。具体的には、フォトマスク８は紫外線を透過する開口部８ａと、紫外線を透過しない遮光部８ｂからなり、開口部８ａを硬化させる実装パッド２の間の部分に合わせ、平行光方式の紫外線光源を用いた露光装置を適用し、紫外線９を照射する（図１（ｄ））。未硬化のソルダレジスト膜７は、シリコーン系離型剤が塗布された実装パッド２上には形成されず、実装パッド２の間のみに形成されているので、未硬化のソルダレジスト膜７の表面に凹凸はなく、フォトマスク８を密着させることができる。そのためフォトマスク８の露光パターンのボケはほとんどなく、露光パターンの周辺部分のソルダレジスト膜が硬化不十分となることはない。   Next, the uncured solder resist film 7 is exposed through the photomask 8 and only the portion to be cured is irradiated with the ultraviolet rays 9. Specifically, the photomask 8 includes an opening portion 8a that transmits ultraviolet rays and a light shielding portion 8b that does not transmit ultraviolet rays. The photomask 8 is aligned with a portion between the mounting pads 2 that cure the opening portions 8a. Then, an ultraviolet ray 9 is applied (FIG. 1 (d)). Since the uncured solder resist film 7 is not formed on the mounting pad 2 to which the silicone-based release agent is applied, but is formed only between the mounting pads 2, the surface of the uncured solder resist film 7 There is no unevenness, and the photomask 8 can be adhered. Therefore, there is almost no blurring of the exposure pattern of the photomask 8, and the solder resist film in the peripheral portion of the exposure pattern does not become insufficiently cured.

次に、露光を行なった絶縁基板１を現像液で洗浄して、未硬化のソルダレジスト膜７を除去し、実装パッド２の間に、光硬化したソルダレジストパターン１０を形成する（図１（ｅ））。さらに、テトラヒドロフランで洗浄し、実装パッド２上の樹脂膜５を除去してプリント配線板３を得る（図１（ｆ））。   Next, the exposed insulating substrate 1 is washed with a developing solution, the uncured solder resist film 7 is removed, and a photocured solder resist pattern 10 is formed between the mounting pads 2 (FIG. 1 ( e)). Furthermore, it wash | cleans with tetrahydrofuran, The resin film 5 on the mounting pad 2 is removed, and the printed wiring board 3 is obtained (FIG.1 (f)).

本実施の形態に示す方法で製造したプリント配線板３では、実装パッド２の間のソルダレジストパターン１０の断面は、上部も絶縁基板１に接する下部もほぼ同じ幅であり、アンダーカット型とはならず、良好な形状とすることができた。本プリント配線板３を用いて、はんだ付けにより電子部品実装した場合でも、ソルダレジストパターン１０の剥離はなく、ブリッジ不良による短絡のない、良好な製品を得ることができた。   In the printed wiring board 3 manufactured by the method shown in the present embodiment, the cross section of the solder resist pattern 10 between the mounting pads 2 is substantially the same width at the upper part and the lower part in contact with the insulating substrate 1. In other words, it was possible to obtain a good shape. Even when the printed wiring board 3 was used to mount an electronic component by soldering, the solder resist pattern 10 was not peeled off, and a good product without a short circuit due to a bridge failure could be obtained.

本実施の形態においては、実装パッドピッチが２５０μｍ（実装パッド間隔１５０μｍ）、実装パッドの厚みが１００μｍの実装パッド２を用いたが、実装パッドピッチ、実装パッド間隔、実装パッドの厚みは特に限定するものではなく、通常のプリント配線板用の実装パッドに用いる実装パッドピッチ、実装パッド間隔、実装パッドの厚みを適用することができる。特に、実装パッド間隔が５００μｍ以下、実装パッドの厚みが３０μｍ以上の実装パッドを用いた場合には、本発明の効果は顕著となり、はんだ付けによる電子部品実装時のブリッジ不良による短絡の発生を大きく改善することができる。   In the present embodiment, the mounting pad 2 having a mounting pad pitch of 250 μm (mounting pad spacing of 150 μm) and a mounting pad thickness of 100 μm is used, but the mounting pad pitch, mounting pad spacing, and mounting pad thickness are particularly limited. Instead, a mounting pad pitch, a mounting pad interval, and a mounting pad thickness used for a mounting pad for a normal printed wiring board can be applied. In particular, when a mounting pad having a mounting pad spacing of 500 μm or less and a mounting pad thickness of 30 μm or more is used, the effect of the present invention becomes remarkable, and the occurrence of a short circuit due to a bridging failure when mounting electronic components by soldering is greatly increased. Can be improved.

また本実施の形態においては、樹脂膜５の材料としてシリコーン系離型剤をメタルマスク４を用いた印刷法により塗布したため、位置精度よく塗布することができ、シリコーン系離型剤の位置ずれにより過剰に液状のソルダレジスト６の付着を阻害することがない。   Moreover, in this Embodiment, since the silicone type mold release agent was apply | coated by the printing method using the metal mask 4 as a material of the resin film 5, it can apply | coat with a positional accuracy, and the position shift of a silicone type mold release agent is carried out. The excessive adhesion of the solder resist 6 is not hindered.

実施の形態２
図２を用いて、本発明の実施の形態２のプリント配線板の製造方法を説明する。図２は、本発明の実施の形態２のプリント配線板の製造方法を説明する断面模式図である。本実施の形態においては、液状のソルダレジストをはじく樹脂膜５の材料であるシリコーン系離型剤の塗布方法が転写法である以外は、実施の形態１と同じ工程によりプリント配線板を製造する。図２において、図１と同一の符号を付した部分は、図１と同一又は相当部分を示すものである。 Embodiment 2
A method for manufacturing a printed wiring board according to the second embodiment of the present invention will be described with reference to FIG. FIG. 2 is a schematic cross-sectional view illustrating a method for manufacturing a printed wiring board according to Embodiment 2 of the present invention. In the present embodiment, a printed wiring board is manufactured by the same process as in the first embodiment, except that the application method of the silicone-based mold release agent that is the material of the resin film 5 that repels the liquid solder resist is the transfer method. . 2, the same reference numerals as those in FIG. 1 denote the same or corresponding parts as those in FIG.

絶縁基板１上に実装パッド２が形成されており、この実装パッド２上に転写版１１を用いて、樹脂膜５の材料であるシリコーン系離型剤を転写する。転写法はＳＵＳなどの金属板からなる転写版１１を用いる。転写版１１の実装パッド２に対向する面の全面にシリコーン系離型剤５ａを塗布し、押し当てることで凸部にのみシリコーン系離型剤を移し取る。したがって、絶縁基板１面に形成した凸部である実装パッド上のみにシリコーン系離型剤が塗布され、乾燥後液状のソルダレジスト６をはじく樹脂膜５が形成される（図２（ａ））。   A mounting pad 2 is formed on the insulating substrate 1, and a silicone release agent that is a material of the resin film 5 is transferred onto the mounting pad 2 using a transfer plate 11. The transfer method uses a transfer plate 11 made of a metal plate such as SUS. The silicone mold release agent 5a is applied to the entire surface of the transfer plate 11 facing the mounting pad 2, and pressed to transfer the silicone mold release agent only to the convex portions. Accordingly, a silicone-based mold release agent is applied only on the mounting pad, which is a convex portion formed on the surface of the insulating substrate 1, and a resin film 5 that repels the liquid solder resist 6 after drying is formed (FIG. 2 (a)). .

転写したシリコーン系離型剤を乾燥後、実施の形態１と同様に、液状のソルダレジスト６をエアスプレー法により塗布する（図２（ｂ））。塗布した液状のソルダレジスト６を乾燥し、指触乾燥の状態として未硬化のソルダレジスト膜７を得る（図２（ｃ））。   After the transferred silicone release agent is dried, a liquid solder resist 6 is applied by an air spray method as in the first embodiment (FIG. 2B). The applied liquid solder resist 6 is dried to obtain an uncured solder resist film 7 in a dry state of touch (FIG. 2 (c)).

さらに、フォトマスク８を用いて平行光方式の紫外線光源を用いた露光装置を用いて紫外線を照射する。本実施の形態においても、実施の形態１と同様に紫外線を照射した部分が硬化するソルダレジストを用いたので、フォトマスク８の開口部８ａを実装パッド２の間に配置する（図２（ｄ））。露光を行なった絶縁基板１を現像液で洗浄して、未硬化のソルダレジスト膜７を除去し、実装パッド２の間に、ソルダレジストパターン１０を形成する（図２（ｅ））。最後に、テトラヒドロフランで洗浄し、実装パッド２上の樹脂膜５を除去してプリント配線板３を得る（図２（ｆ））。   Further, the photomask 8 is used to irradiate ultraviolet rays using an exposure apparatus using a parallel light type ultraviolet light source. Also in the present embodiment, since the solder resist that cures the portion irradiated with ultraviolet rays is used as in the first embodiment, the opening 8a of the photomask 8 is disposed between the mounting pads 2 (FIG. 2D). )). The exposed insulating substrate 1 is washed with a developing solution, the uncured solder resist film 7 is removed, and a solder resist pattern 10 is formed between the mounting pads 2 (FIG. 2E). Finally, it is washed with tetrahydrofuran, and the resin film 5 on the mounting pad 2 is removed to obtain the printed wiring board 3 (FIG. 2 (f)).

本実施の形態に示す方法で製造したプリント配線板３では、実装パッド２間のソルダレジストパターン１０の断面は、上部も絶縁基板１に接する下部もほぼ同じ幅であり、アンダーカット型とはならなかった。本プリント配線板３を用いてはんだ付けにより電子部品実装した場合でも、ソルダレジストパターン１０の剥離や、ブリッジ不良による短絡も生じることはなく、良好な製品を得ることができた。   In the printed wiring board 3 manufactured by the method shown in the present embodiment, the cross section of the solder resist pattern 10 between the mounting pads 2 is almost the same width at the upper part and the lower part in contact with the insulating substrate 1, which is different from the undercut type. There wasn't. Even when this printed wiring board 3 was used to mount electronic components by soldering, peeling of the solder resist pattern 10 and short-circuiting due to bridging defects did not occur, and a good product could be obtained.

本実施の形態においては、転写法を用いてシリコーン系離型剤を塗布している。転写法は転写版１１の実装パッド２に対向する面の全面にシリコーン系離型剤を塗布し、押し当てることで凸部である実装パッド２上にシリコーン系離型剤を移し取るものである。したがって、位置合わせを行なうことなく転写することができるため、工程時間を短縮することができる。   In the present embodiment, a silicone release agent is applied using a transfer method. In the transfer method, a silicone release agent is applied to the entire surface of the transfer plate 11 facing the mounting pad 2 and pressed to transfer the silicone release agent onto the mounting pad 2 that is a convex portion. . Therefore, since the transfer can be performed without alignment, the process time can be shortened.

転写版１１の上に塗布した液状のソルダレジスト６をはじく樹脂膜５の材料であるシリコーン系離型剤の厚みは特に限定するものではないが、実装パッド２上に塗布したシリコーン系離型剤が十分に液状のソルダレジストをはじく点、また実装パッド２上に転写したシリコーン系離型剤が液だれ等を生じない点から、実装パッドの厚みの２０〜８０％程度とすることが最も適している。   The thickness of the silicone release agent that is the material of the resin film 5 that repels the liquid solder resist 6 applied on the transfer plate 11 is not particularly limited, but the silicone release agent applied on the mounting pad 2 Is best suited to 20-80% of the thickness of the mounting pad because it repels a sufficiently liquid solder resist and the silicone release agent transferred onto the mounting pad 2 does not cause dripping. ing.

なお、上述した各実施の形態においては、エアスプレー法を用いて液状のソルダレジスト６を絶縁基板１上に塗布したが、カーテンコート法、ディッピング法、スピンコート法等、通常の基板面に樹脂溶液を塗布する方法を用いることができる。   In each of the above-described embodiments, the liquid solder resist 6 is applied onto the insulating substrate 1 using an air spray method. However, a resin is applied to a normal substrate surface such as a curtain coating method, a dipping method, or a spin coating method. A method of applying a solution can be used.

また上述した各実施の形態においては、平行光方式の紫外線光源を用いた露光装置を適用したが、フォトマスク８を未硬化のソルダレジスト膜７の表面に密着させることができ、露光パターン周辺のボケを防止する効果を有するので、散乱光方式の紫外線光源を用いた露光装置も適用することができる。   In each of the above-described embodiments, an exposure apparatus using a parallel light ultraviolet light source is applied. However, the photomask 8 can be brought into close contact with the surface of the uncured solder resist film 7, and the periphery of the exposure pattern. Since it has the effect of preventing blurring, an exposure apparatus using a scattered light type ultraviolet light source can also be applied.

また上述した各実施の形態においては、樹脂膜５の除去にテトラヒドロフランを用いたが、特に限定するものではなく、ジクロロエタン等の樹脂膜５を溶解することができる有機溶剤を用いることができる。   Further, in each of the above-described embodiments, tetrahydrofuran is used for removing the resin film 5, but there is no particular limitation, and an organic solvent that can dissolve the resin film 5 such as dichloroethane can be used.

さらに上述した各実施の形態においては、液状のソルダレジスト６をはじく樹脂膜５の材料としてシリコーン系離型剤を用いたが、樹脂膜の材料の種類は特に限定するものではなく、液状のソルダレジスト６をはじき、実装パッド２上にソルダレジストを塗布することができない、シリコーン系樹脂及びフッ素系樹脂の少なくとも一方を含む樹脂膜を用いることができる。   Further, in each of the above-described embodiments, the silicone-based mold release agent is used as the material of the resin film 5 that repels the liquid solder resist 6, but the type of the material of the resin film is not particularly limited, and the liquid solder A resin film containing at least one of a silicone-based resin and a fluorine-based resin that cannot repel the resist 6 and apply a solder resist on the mounting pad 2 can be used.

本発明は、その発明の範囲内において、各実施の形態を自由に組み合わせたり、各実施の形態を適宜、変更、省略することができる。   Within the scope of the present invention, the present invention can be freely combined with each other, or can be appropriately modified or omitted.

１ 絶縁基板
２ 実装パッド
３ プリント配線板
４ メタルマスク
５ 樹脂膜
６ 液状のソルダレジスト
８ フォトマスク
１０ ソルダレジストパターン
１１ 転写版 DESCRIPTION OF SYMBOLS 1 Insulating board 2 Mounting pad 3 Printed wiring board 4 Metal mask 5 Resin film 6 Liquid solder resist 8 Photomask 10 Solder resist pattern 11 Transfer plate

Claims (4)

絶縁基板上に形成された実装パッドに液状のソルダレジストをはじく樹脂膜を形成する工程と、
前記樹脂膜を形成した前記絶縁基板上に前記液状のソルダレジストを塗布及び乾燥して未硬化のソルダレジスト膜を形成する工程と、
前記未硬化のソルダレジスト膜にフォトマスクを介して露光を行なった後、現像を行なうことにより光硬化したソルダレジストパターンを形成する工程と、
前記樹脂膜を除去する工程と、を備えるプリント配線板の製造方法。 Forming a resin film that repels a liquid solder resist on a mounting pad formed on an insulating substrate;
Applying and drying the liquid solder resist on the insulating substrate on which the resin film has been formed to form an uncured solder resist film;
Forming a photocured solder resist pattern by performing development after exposing the uncured solder resist film through a photomask; and
And a step of removing the resin film. 前記樹脂膜が、シリコーン系樹脂及びフッ素系樹脂の少なくとも一方を含む樹脂膜であることを特徴とする請求項１に記載のプリント配線板の製造方法。   The method for manufacturing a printed wiring board according to claim 1, wherein the resin film is a resin film containing at least one of a silicone resin and a fluorine resin. 前記樹脂膜を印刷法を用いて形成することを特徴とする請求項１または請求項２に記載のプリント配線板の製造方法。 The method for manufacturing a printed wiring board according to claim 1, wherein the resin film is formed using a printing method. 前記樹脂膜を転写法を用いて形成することを特徴とする請求項１または請求項２に記載のプリント配線板の製造方法。 The method for manufacturing a printed wiring board according to claim 1, wherein the resin film is formed by a transfer method.
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