JPH04367459A - Part feed tape and device - Google Patents
Part feed tape and deviceInfo
- Publication number
- JPH04367459A JPH04367459A JP3134635A JP13463591A JPH04367459A JP H04367459 A JPH04367459 A JP H04367459A JP 3134635 A JP3134635 A JP 3134635A JP 13463591 A JP13463591 A JP 13463591A JP H04367459 A JPH04367459 A JP H04367459A
- Authority
- JP
- Japan
- Prior art keywords
- tape
- component supply
- hole
- component
- contact piece
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000011295 pitch Substances 0.000 claims description 4
- 238000007789 sealing Methods 0.000 abstract description 3
- 238000007666 vacuum forming Methods 0.000 abstract 1
- 230000000694 effects Effects 0.000 description 2
- 230000037431 insertion Effects 0.000 description 2
- 238000003780 insertion Methods 0.000 description 2
- 230000001105 regulatory effect Effects 0.000 description 1
- 230000000630 rising effect Effects 0.000 description 1
- 238000005096 rolling process Methods 0.000 description 1
Landscapes
- Packages (AREA)
- Supply And Installment Of Electrical Components (AREA)
Abstract
Description
【０００１】0001
【産業上の利用分野】本発明は、電子部品を基板に実装
する実装機に使用する部品供給テープおよび部品供給装
置に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a component supply tape and a component supply device used in a mounting machine for mounting electronic components on a board.
【０００２】0002
【従来の技術】近年、電子部品の実装機が多用され、電
子部品の微小化，軽量化等に伴い実装の精度が要求され
ており、その実装機に対応する部品供給テープおよび部
品供給装置が求められている。[Background Art] In recent years, mounting machines for electronic components have been frequently used, and as electronic components become smaller and lighter, mounting precision is required. It has been demanded.
【０００３】従来、この種の部品供給テープおよび部品
供給装置は図６および図７に示すような構成のものがあ
った。以下その構成について図面を参照しながら説明す
る。図に示すように、部品供給装置は巻取りリール１に
セットされた部品供給テープ２をテープ搬送部３に搬送
するもので、テープ押さえ板４で部品供給テープ２が矢
印Ａの方向に戻らないよう押さえている。また部品供給
テープ２は部品封入穴５を有し、その部品封入穴５に電
子部品６を装着してテープ押さえ板４の位置までトップ
テープ７でその表面を覆っている。Conventionally, this type of component supply tape and component supply device have been constructed as shown in FIGS. 6 and 7. The configuration will be explained below with reference to the drawings. As shown in the figure, the component supply device conveys the component supply tape 2 set on the take-up reel 1 to the tape transport section 3, and the tape holding plate 4 prevents the component supply tape 2 from returning in the direction of arrow A. I'm holding it down. Further, the component supply tape 2 has a component enclosure hole 5, and an electronic component 6 is mounted in the component enclosure hole 5, and its surface is covered with a top tape 7 up to the position of the tape pressing plate 4.
【０００４】0004
【発明が解決しようとする課題】しかしながら上記従来
の構成では、微小化，軽量化された電子部品６が部品供
給テープ２とともに、トップテープ７が剥がされた状態
で高速でテープ搬送部３に搬送されるので、電子部品６
は部品封入穴５内で上下左右に動き正しい位置で搬送で
きないという問題があった。[Problems to be Solved by the Invention] However, in the above-mentioned conventional configuration, the miniaturized and lightweight electronic components 6 are transported together with the component supply tape 2 to the tape transport section 3 at high speed with the top tape 7 removed. Therefore, electronic components 6
There was a problem in that the parts moved vertically and horizontally within the parts enclosure hole 5 and could not be conveyed in the correct position.
【０００５】本発明は上記従来の問題を解決するもので
、高速度で搬送しても安定した姿勢で搬送することがで
きる部品供給テープおよび部品供給装置を提供すること
を目的とする。The present invention solves the above-mentioned conventional problems, and aims to provide a component supply tape and a component supply device that can convey a component in a stable posture even when conveyed at high speed.
【０００６】[0006]
【課題を解決するための手段】本発明は上記目的を達成
するために、部品供給テープは等ピッチ間隔で配列形成
された部品封入穴の表面および側面の少なくとも一方に
貫通孔を有するものであり、また部品供給装置は部品供
給テープの貫通孔と対応する面の搬送径路中にテープ当
接片を設け、テープ当接片に貫通孔と連通する真空経路
を穿設した構成を有している。[Means for Solving the Problems] In order to achieve the above object, the present invention provides a component supply tape having through-holes on at least one of the surface and side surface of the component-sealing holes arranged at equal pitch intervals. In addition, the component supply device has a configuration in which a tape contact piece is provided in the conveyance path on a surface corresponding to the through hole of the component supply tape, and a vacuum path communicating with the through hole is bored in the tape contact piece. .
【０００７】[0007]
【作用】上記した構成において、部品供給テープに装着
された電子部品は貫通孔と真空経路からテープ当接片に
吸いよせられるので、部品封入穴内で方向性が変位され
た電子部品は矯正されて搬送できる。[Operation] In the above configuration, the electronic components mounted on the component supply tape are drawn to the tape abutting piece from the through hole and the vacuum path, so electronic components whose directionality has been displaced within the component enclosure hole are corrected. Can be transported.
【０００８】[0008]
【実施例】以下、本発明の一実施例について、図１〜図
４を参照しながら説明する。なお、本実施例において、
前述の従来例に示したものと同一構成部品には同じ符号
を付し、その説明は省略する。図に示すように、部品供
給テープ１１は等ピッチ間隔で配列形成された部品封入
穴１２を有し、その側面に貫通孔１３を設けている。ま
た部品供給装置はテープ搬送部３の上部側面の搬送径路
中にテープ当接片１４を設け、このテープ当接片１４に
は部品供給テープ１１の貫通孔１３と対応する面に貫通
孔１３と連通する真空経路１５を穿設した構成としてい
る。また真空経路１５は真空手段（図示せず）によって
空気が吸引されている。Embodiment An embodiment of the present invention will be described below with reference to FIGS. 1 to 4. In addition, in this example,
Components that are the same as those shown in the prior art example described above are given the same reference numerals, and their explanations will be omitted. As shown in the figure, the component supply tape 11 has component enclosure holes 12 arranged at equal pitches, and through holes 13 are provided on the side surfaces thereof. In addition, the component supply device is provided with a tape contact piece 14 in the conveyance path on the upper side surface of the tape conveyance section 3, and this tape contact piece 14 has through holes 13 on the surface corresponding to the through holes 13 of the component supply tape 11. It has a configuration in which a communicating vacuum path 15 is provided. Further, air is sucked into the vacuum path 15 by a vacuum means (not shown).
【０００９】上記構成において動作を説明すると、巻取
りリール１にセットされた部品供給テープ１１がテープ
搬送部３に搬送されると、部品封入穴１２に装着された
電子部品６は貫通孔１３と真空経路１５からテープ当接
片１４に吸いよせられるので、方向性が変位された電子
部品６は矯正されて搬送される。To explain the operation in the above configuration, when the component supply tape 11 set on the take-up reel 1 is conveyed to the tape conveying section 3, the electronic component 6 mounted in the component insertion hole 12 is inserted into the through hole 13. Since the electronic component 6 is sucked from the vacuum path 15 by the tape contact piece 14, the electronic component 6 whose directionality has been displaced is corrected and transported.
【００１０】図５は、実施例の部品供給装置を用いた実
装機の一例を示すものである。図において、１６は部品
供給テーブルであり、前述した実施例の部品供給装置を
固定保持し、所定の部品供給行なうように位置決めされ
て駆動可能となっている。１７はヘッドで間欠運動を行
なう。１８は部品吸着ノズルであり、ヘッド１７の周縁
に回動可能であり、かつ昇降自在に取り付けられている
。１９はプリント基板であり、Ｘ−Ｙ２方向に動くＸ−
Ｙテーブル２０に支持されている。２１は電子部品６の
姿勢を規正する姿勢規正装置である。FIG. 5 shows an example of a mounting machine using the component supply device of the embodiment. In the figure, reference numeral 16 denotes a component supply table, which fixedly holds the component supply device of the above-described embodiment and is positioned and driven so as to supply a predetermined component. 17 performs intermittent motion with a head. Reference numeral 18 denotes a component suction nozzle, which is rotatably attached to the periphery of the head 17 and is movable up and down. 19 is a printed circuit board, which moves in the X-Y direction.
It is supported by a Y table 20. Reference numeral 21 denotes an attitude regulating device that regulates the attitude of the electronic component 6.
【００１１】以上のように構成された実装機について以
下その作用を説明する。まず部品供給装置により電子部
品６を吸着した吸着ノズル１８はヘッド１７の間欠回転
運動により装着位置へ移動する。この移動中に、姿勢規
正装置２１により電子部品６の姿勢を定め、プリント基
板１９の所定位置が装着位置に合致するようにＸ−Ｙテ
ーブル２０の位置決めを行ない、ついで、吸着ノズル１
８が下降し、プリント基板１９に電子部品６を装着する
。The operation of the mounting machine constructed as described above will be explained below. First, the suction nozzle 18 that has suctioned the electronic component 6 by the component supply device is moved to the mounting position by the intermittent rotational movement of the head 17. During this movement, the posture adjustment device 21 determines the posture of the electronic component 6, the X-Y table 20 is positioned so that the predetermined position of the printed circuit board 19 matches the mounting position, and then the suction nozzle 1
8 descends and mounts the electronic component 6 on the printed circuit board 19.
【００１２】このように、実施例の部品供給テープおよ
び部品供給装置を使用すると、部品供給テープを搬送す
るときに、電子部品６の転がり，浮き上がり・立ち，振
動等の挙動が抑えられるので、正しい姿勢での取り出し
が可能となり、部品取り出し手量を減少できる。[0012] As described above, when the component supply tape and component supply device of the embodiment are used, when the component supply tape is conveyed, the electronic components 6 are prevented from rolling, rising, standing up, vibration, etc. It is possible to take out the parts in the correct position, reducing the amount of effort required to take out the parts.
【００１３】なお、部品供給テープの底面に貫通孔を設
け部品供給装置のテープ当接片はその貫通孔と連通する
位置に設けても同様な作用効果を得る。The same effect can be obtained even if a through hole is provided in the bottom of the component supply tape and the tape abutting piece of the component supply device is provided at a position communicating with the through hole.
【００１４】[0014]
【発明の効果】上記実施例から明らかなように本発明の
部品供給テープおよび部品供給装置は、等ピッチ間隔で
配列形成された部品封入穴の表面および側面の少なくと
も一方に貫通孔を有し、この貫通孔と対応する面の搬送
径路中にテープ当接片を設け、前記テープ当接片に前記
貫通孔と連通する真空経路を穿設したものであり、この
構成とすることにより、高速度で搬送しても安定した姿
勢で搬送することができ、精度の高い電子部品の実装が
できる。Effects of the Invention As is clear from the above embodiments, the component supply tape and component supply device of the present invention have through holes on at least one of the surface and side surface of the component enclosure holes arranged at equal pitch intervals, A tape abutting piece is provided in the conveyance path on a surface corresponding to the through hole, and a vacuum path communicating with the through hole is bored in the tape abutting piece.With this configuration, high speed Even when transported in a stable position, electronic components can be mounted with high precision.
【図１】本発明の一実施例における部品供給テープおよ
び部品供給装置の外観斜視図FIG. 1 is an external perspective view of a component supply tape and a component supply device according to an embodiment of the present invention.
【図２】同部品供給テープおよび部品供給装置の拡大図
[Figure 2] Enlarged view of the component supply tape and component supply device
【図３】（ａ）同部品供給テープの電子部品の収納状態
を示す外観斜視図
（ｂ）同部品供給テープの電子部品の収納状態を示す平
面図FIG. 3: (a) External perspective view showing how electronic components are stored on the component supply tape; (b) Plan view showing how electronic components are stored on the component supply tape.
【図４】（ａ）同部品供給テープのテープ当接片の側面
図
（ｂ）同テープ当接部の図２におけるＡ−Ａ線での断面
図FIG. 4: (a) Side view of the tape abutting piece of the component supply tape; (b) Cross-sectional view of the tape abutting portion taken along line A-A in FIG. 2;
【図５】部品供給装置を使用した実装機の外観斜視図[Figure 5] External perspective view of a mounting machine using a component supply device
【
図６】従来の部品供給装置の外観斜視図[
Figure 6: External perspective view of a conventional parts supply device
【図７】（ａ）
部品供給テープの外観斜視図（ｂ）部品供給テープの平
面図[Figure 7] (a)
External perspective view of the parts supply tape (b) Plan view of the parts supply tape
１１ 部品供給テープ １２ 部品封入穴 １３ 貫通孔 11 Parts supply tape 12 Parts insertion hole 13 Through hole
Claims (2)
入穴の表面および側面の少なくとも一方に貫通孔を有す
る部品供給テープ。1. A component supply tape having through holes on at least one of the surface and side surfaces of component enclosure holes arranged at equal pitches.
孔と対応する面の搬送径路中にテープ当接片を設け、前
記テープ当接片に前記貫通孔と連通する真空径経路を穿
設した部品供給装置。2. A tape abutting piece is provided in the conveyance path on a surface corresponding to the through hole of the component supply tape according to claim 1, and a vacuum diameter path communicating with the through hole is bored in the tape abutting piece. parts supply device.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3134635A JPH04367459A (en) | 1991-06-06 | 1991-06-06 | Part feed tape and device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3134635A JPH04367459A (en) | 1991-06-06 | 1991-06-06 | Part feed tape and device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH04367459A true JPH04367459A (en) | 1992-12-18 |
Family
ID=15132983
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP3134635A Pending JPH04367459A (en) | 1991-06-06 | 1991-06-06 | Part feed tape and device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH04367459A (en) |
-
1991
- 1991-06-06 JP JP3134635A patent/JPH04367459A/en active Pending
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