JPH0436238U - - Google Patents

Info

Publication number
JPH0436238U
JPH0436238U JP1990078400U JP7840090U JPH0436238U JP H0436238 U JPH0436238 U JP H0436238U JP 1990078400 U JP1990078400 U JP 1990078400U JP 7840090 U JP7840090 U JP 7840090U JP H0436238 U JPH0436238 U JP H0436238U
Authority
JP
Japan
Prior art keywords
wiring pattern
cap
tape carrier
external wiring
semiconductor device
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1990078400U
Other languages
English (en)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1990078400U priority Critical patent/JPH0436238U/ja
Publication of JPH0436238U publication Critical patent/JPH0436238U/ja
Pending legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/50Tape automated bonding [TAB] connectors, i.e. film carriers; Manufacturing methods related thereto

Landscapes

  • Wire Bonding (AREA)

Description

【図面の簡単な説明】
第1図は本実施例に係る半導体装置を示す構成
図、第2図は本実施例に係るテープキヤリアの上
面を示す平面図、第3図はその裏面を示す背面図
、第4図はその断面図、第5図は本実施例に係る
組立法を示す工程図、第6図は本実施例に係るキ
ヤツプを示す底面図、第7図はその斜視図、第8
図は従来のテープキヤリアを示す平面図、第9図
は従来例に係る半導体装置を示す構成図である。 Aは半導体装置、1は絶縁性基材、2は内部配
線パターン、2lはリード線、3は外部配線パタ
ーン、3lはリード線、4はテープキヤリア、5
は半導体素子、6はバンプ、7はキヤツプ、8は
ストツパである。

Claims (1)

    【実用新案登録請求の範囲】
  1. 絶縁性基材上に内部配線パターンと外部配線パ
    ターンが連続的に形成されてなるテープキヤリア
    にボンデイングされた半導体素子を上記テープキ
    ヤリアと共に被覆するキヤツプを有すると共に、
    該キヤツプの外側面に沿つて上記外部配線パター
    ンが導出されてなる半導体装置。
JP1990078400U 1990-07-24 1990-07-24 Pending JPH0436238U (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1990078400U JPH0436238U (ja) 1990-07-24 1990-07-24

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1990078400U JPH0436238U (ja) 1990-07-24 1990-07-24

Publications (1)

Publication Number Publication Date
JPH0436238U true JPH0436238U (ja) 1992-03-26

Family

ID=31621643

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1990078400U Pending JPH0436238U (ja) 1990-07-24 1990-07-24

Country Status (1)

Country Link
JP (1) JPH0436238U (ja)

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