JPH04362199A - Electroplating device - Google Patents
Electroplating deviceInfo
- Publication number
- JPH04362199A JPH04362199A JP13456791A JP13456791A JPH04362199A JP H04362199 A JPH04362199 A JP H04362199A JP 13456791 A JP13456791 A JP 13456791A JP 13456791 A JP13456791 A JP 13456791A JP H04362199 A JPH04362199 A JP H04362199A
- Authority
- JP
- Japan
- Prior art keywords
- anode
- plating
- copper
- cathode
- electrolytic cell
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000009713 electroplating Methods 0.000 title claims abstract description 14
- 238000007747 plating Methods 0.000 claims abstract description 76
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 26
- 239000010949 copper Substances 0.000 claims abstract description 26
- 229910052802 copper Inorganic materials 0.000 claims abstract description 26
- 239000003011 anion exchange membrane Substances 0.000 claims abstract description 8
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 abstract description 16
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 abstract description 14
- JPVYNHNXODAKFH-UHFFFAOYSA-N Cu2+ Chemical compound [Cu+2] JPVYNHNXODAKFH-UHFFFAOYSA-N 0.000 abstract description 13
- 229910001431 copper ion Inorganic materials 0.000 abstract description 11
- 239000000758 substrate Substances 0.000 abstract description 9
- 229910052697 platinum Inorganic materials 0.000 abstract description 8
- 239000000203 mixture Substances 0.000 abstract description 7
- 229910000365 copper sulfate Inorganic materials 0.000 abstract description 3
- ARUVKPQLZAKDPS-UHFFFAOYSA-L copper(II) sulfate Chemical compound [Cu+2].[O-][S+2]([O-])([O-])[O-] ARUVKPQLZAKDPS-UHFFFAOYSA-L 0.000 abstract description 3
- 239000003792 electrolyte Substances 0.000 abstract 5
- 239000007788 liquid Substances 0.000 abstract 1
- JBJWASZNUJCEKT-UHFFFAOYSA-M sodium;hydroxide;hydrate Chemical compound O.[OH-].[Na+] JBJWASZNUJCEKT-UHFFFAOYSA-M 0.000 abstract 1
- 239000000243 solution Substances 0.000 description 29
- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 description 12
- 238000006243 chemical reaction Methods 0.000 description 7
- -1 hydroxide ions Chemical class 0.000 description 5
- KWYUFKZDYYNOTN-UHFFFAOYSA-M Potassium hydroxide Chemical compound [OH-].[K+] KWYUFKZDYYNOTN-UHFFFAOYSA-M 0.000 description 3
- 238000010586 diagram Methods 0.000 description 3
- 238000001556 precipitation Methods 0.000 description 3
- 239000007864 aqueous solution Substances 0.000 description 2
- JZCCFEFSEZPSOG-UHFFFAOYSA-L copper(II) sulfate pentahydrate Chemical compound O.O.O.O.O.[Cu+2].[O-]S([O-])(=O)=O JZCCFEFSEZPSOG-UHFFFAOYSA-L 0.000 description 2
- 239000008151 electrolyte solution Substances 0.000 description 2
- 239000001257 hydrogen Substances 0.000 description 2
- 229910052739 hydrogen Inorganic materials 0.000 description 2
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- ZAMOUSCENKQFHK-UHFFFAOYSA-N Chlorine atom Chemical compound [Cl] ZAMOUSCENKQFHK-UHFFFAOYSA-N 0.000 description 1
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 1
- 230000002411 adverse Effects 0.000 description 1
- 239000000460 chlorine Substances 0.000 description 1
- 229910052801 chlorine Inorganic materials 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- YADSGOSSYOOKMP-UHFFFAOYSA-N dioxolead Chemical compound O=[Pb]=O YADSGOSSYOOKMP-UHFFFAOYSA-N 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000007772 electroless plating Methods 0.000 description 1
- 229910002804 graphite Inorganic materials 0.000 description 1
- 239000010439 graphite Substances 0.000 description 1
- 150000002500 ions Chemical class 0.000 description 1
- 239000010936 titanium Substances 0.000 description 1
- 229910052719 titanium Inorganic materials 0.000 description 1
Abstract
Description
【０００１】0001
【産業上の利用分野】本発明は電気めっき装置に関し、
特に印刷配線板用の電気めっき装置に関する。[Industrial Application Field] The present invention relates to an electroplating device,
In particular, it relates to electroplating equipment for printed wiring boards.
【０００２】0002
【従来の技術】従来の印刷配線板の電気めっきは、図２
に示すように、めっき槽１に例えば、硫酸及び硫酸銅か
らなるめっき液２を満たす。次に陽極として銅ボール１
３をアノードケース１４に入れ、さらにこれらをアノー
ドバック１５に入れ、めっき槽１に浸漬する。[Prior Art] Conventional electroplating for printed wiring boards is shown in Figure 2.
As shown in , a plating bath 1 is filled with a plating solution 2 made of, for example, sulfuric acid and copper sulfate. Next, copper ball 1 is used as an anode.
3 are placed in the anode case 14, and further placed in the anode bag 15, and immersed in the plating bath 1.
【０００３】次に、所望の箇所に穴あけを施し、無電解
めっき処理を行った基板４をめっき治具に取り付け、め
っき槽１に浸漬する。次に、銅ボール１３を陽極，基板
４を陰極として直流電流を流す。これによって、銅ボー
ル１３より銅イオンがめっき液２中に溶解し、基板４に
銅が析出される。[0003] Next, the substrate 4, which has been subjected to electroless plating with holes drilled at desired locations, is attached to a plating jig and immersed in the plating bath 1. Next, a direct current is applied using the copper ball 13 as an anode and the substrate 4 as a cathode. As a result, copper ions are dissolved into the plating solution 2 from the copper balls 13, and copper is deposited on the substrate 4.
【０００４】0004
【発明が解決しようとする課題】この従来の電気めっき
に用いられる電気めっき装置では、陽極として銅ボール
を使用しているため、めっきを行う事により銅が溶解し
、銅ボールの表面積が徐々に小さくなるため、陽極の表
面積を一定にする事が困難である。このため、めっき液
の組成の変動や電流密度の分布が不均一になり、銅めっ
きの厚さが不均一になるという問題点がある。また、銅
ボールを補給する時の作業がめっき槽上で行なわれ、硫
酸雰囲気，高電流，重い銅ボールの運搬等で作業環境が
よくないという問題点もある。[Problem to be solved by the invention] Since the electroplating equipment used in this conventional electroplating uses copper balls as anodes, the copper dissolves during plating, and the surface area of the copper balls gradually decreases. Because of the small size, it is difficult to keep the surface area of the anode constant. Therefore, there is a problem in that the composition of the plating solution changes and the current density distribution becomes non-uniform, resulting in non-uniform copper plating thickness. Another problem is that the work for replenishing copper balls is carried out on a plating bath, and the working environment is not good due to the sulfuric acid atmosphere, high current, and transportation of heavy copper balls.
【０００５】また、良好なめっき品質を得るためには、
めっき液の浴組成を管理する必要があるが、めっき液の
銅濃度は高くなる傾向にあるため、定期的にめっき液を
希釈する必要があり、定期的なラインの停止及び多大な
浴管理工数を必要としていた。[0005] Furthermore, in order to obtain good plating quality,
It is necessary to control the bath composition of the plating solution, but since the copper concentration in the plating solution tends to be high, it is necessary to dilute the plating solution periodically, resulting in regular line stoppages and a large amount of bath management man-hours. was needed.
【０００６】本発明の目的は、めっき液の組成の変動や
電流密度の分布の不均一をなくし、悪影響下での作業を
減らすことのできる電気めっき装置を提出することにあ
る。An object of the present invention is to provide an electroplating apparatus that can eliminate variations in the composition of a plating solution and non-uniformity in current density distribution, thereby reducing work under adverse conditions.
【０００７】[0007]
【課題を解決するための手段】本発明の電気めっき装置
は、めっき槽と、このめっき槽内に設置される不溶性の
陽極と、陰イオン交換膜により陽極室と陰極室とに分離
された電解槽と、この陽極室と陰極室内にそれぞれ設置
される銅電極と不溶性の陰極と、前記めっき槽と前記陽
極室とに満されるめっき液を循環させるためのめっき液
循環手段とを含むものである。[Means for Solving the Problems] The electroplating apparatus of the present invention includes a plating tank, an insoluble anode installed in the plating tank, and an electrolytic plating device separated into an anode chamber and a cathode chamber by an anion exchange membrane. It includes a tank, a copper electrode and an insoluble cathode installed in the anode chamber and the cathode chamber, respectively, and a plating solution circulation means for circulating the plating solution filled in the plating tank and the anode chamber.
【０００８】硫酸及び硫酸銅の水溶液からなるめっき液
に於いて、陽極として不溶性の電極を用いてめっきを行
うと、陰極である基板側では次の（１）式の反応が起こ
り、金属銅の析出が生じる。When plating is performed using an insoluble electrode as an anode in a plating solution consisting of an aqueous solution of sulfuric acid and copper sulfate, the following reaction (1) occurs on the substrate side, which is the cathode, and the reaction of the following formula (1) occurs, and the reaction of the following formula (1) occurs on the substrate side, which is the cathode. Precipitation occurs.
【０００９】
Ｃｕ２＋＋２ｅ− →Ｃｕ０
……（１）陽極である不溶性電極側では、次の
（２）式の反応が起こる。[0009] Cu2++2e− →Cu0
...(1) On the insoluble electrode side, which is the anode, the following reaction (2) occurs.
【００１０】
Ｈ２ Ｏ→２Ｈ＋ ＋１／２Ｏ２ ↑＋２ｅ−
……
（２）次に、陰イオン交換膜によって陽極室と陰極室の
２つの小部屋に仕切られた電解槽を設け、陽極室に銅電
極を陰極室に陰極を設置する。陽極室には、前述しため
っき液を満たし、陰極室には電解質溶液、例えば水酸化
ナトリウム水溶液を満たす。そして両電極間に直流電流
を流すと、陽極側では、次の（３）式の反応が生じる。[0010] H2 O→2H+ +1/2O2 ↑+2e−
……
(2) Next, an electrolytic cell is provided which is partitioned into two small chambers, an anode chamber and a cathode chamber, by an anion exchange membrane, and a copper electrode is installed in the anode chamber and a cathode is installed in the cathode chamber. The anode chamber is filled with the above-mentioned plating solution, and the cathode chamber is filled with an electrolyte solution, such as an aqueous sodium hydroxide solution. When a direct current is passed between the two electrodes, the following reaction (3) occurs on the anode side.
【００１１】
Ｃｕ０ →Ｃｕ２＋＋２ｅ−
……（３）これにより、めっき液中に銅が溶解
し、銅イオンが蓄積される。[0011] Cu0 →Cu2++2e−
(3) As a result, copper is dissolved in the plating solution and copper ions are accumulated.
【００１２】陽極室と陰極室との間では、陰極室中の水
酸イオンが陰イオン交換膜を通り、陽極室内へ入るが、
めっき液中の水素イオンで中和される。陰極側では、次
の（４）式の反応だけが起こり、陽極室へ移動する水酸
イオンが生成される。Between the anode chamber and the cathode chamber, hydroxide ions in the cathode chamber pass through the anion exchange membrane and enter the anode chamber.
Neutralized by hydrogen ions in the plating solution. On the cathode side, only the reaction of the following equation (4) occurs, and hydroxide ions that move to the anode chamber are generated.
【００１３】
Ｈ２ Ｏ＋ｅ− →ＯＨ− ＋１／２Ｈ２ ↑
…
…（４）次に、前述しためっき槽とこの電解槽の陽極室
を配管でつなぎ、めっき液を循環させる事により、めっ
き槽内でめっき反応により消費される銅イオンを電解槽
の陽極室内で蓄積される銅イオンにより補なう事ができ
る。[0013] H2 O+e− →OH− +1/2H2 ↑
…
...(4) Next, by connecting the aforementioned plating bath and the anode chamber of this electrolytic cell with piping and circulating the plating solution, the copper ions consumed by the plating reaction in the plating bath are transferred to the anode chamber of the electrolytic cell. This can be compensated by accumulated copper ions.
【００１４】（１）式，（３）式より、めっき槽で流す
電流値と電解槽で流す電流値を等しくしてやれば、めっ
きの析出で消費した銅イオンの量と、銅電極より溶解す
る銅イオンの量は等しくなるため、めっき液中の銅イオ
ン濃度は常に一定となる。また、（２）式と（４）式よ
り、めっき槽と電解槽の電流値を等しくする事により、
等モルづつ水素イオンと水酸イオンが生成され、これら
は等モル比で中和されるため、めっき液中の硫酸濃度も
常に一定となる。従って、めっき液の組成を常に一定に
保ちながら、電気めっきを行う事が可能となり、めっき
槽の陽極の面積は常に一定であるため、電流密度の分布
が常に均一である電気めっきができる。From equations (1) and (3), if the current value flowing in the plating tank and the current value flowing in the electrolytic tank are made equal, the amount of copper ions consumed during plating precipitation and the amount of copper dissolved from the copper electrode can be calculated. Since the amount of ions is equal, the copper ion concentration in the plating solution is always constant. Also, from equations (2) and (4), by making the current values of the plating tank and the electrolytic tank equal,
Hydrogen ions and hydroxide ions are generated in equimolar amounts and are neutralized in an equimolar ratio, so the sulfuric acid concentration in the plating solution is always constant. Therefore, it is possible to perform electroplating while keeping the composition of the plating solution constant, and since the area of the anode of the plating tank is always constant, electroplating can be performed in which the current density distribution is always uniform.
【００１５】[0015]
【実施例】次に、本発明の実施例について図面を参照し
て説明する。図１は、本発明の一実施例の構成図である
。Embodiments Next, embodiments of the present invention will be described with reference to the drawings. FIG. 1 is a configuration diagram of an embodiment of the present invention.
【００１６】めっき槽１内に、不溶性の陽極として白金
電極３Ａ，３Ｂを設置する。この時、白金電極３Ａ，３
Ｂの表面積は、めっき治具の有効めっき面積と同等とし
た。次に陰イオン交換膜６によって、陽極室と陰極室に
仕切られた電解槽５を設け、陽極室に陽極として銅電極
８を設置し、陰極室に陰極として白金電極９を設置する
。めっき槽１内のめっき液２を、電解槽５の陽極室に送
るためにポンプ１０Ｂを介して配管を継ぐ。また、電解
槽５の陽極室のめっき液２Ａをめっき槽１へ送るため、
ポンプ１０Ａとフィルター１１を介して配管を継ぐ。Platinum electrodes 3A and 3B are installed in the plating tank 1 as insoluble anodes. At this time, platinum electrodes 3A, 3
The surface area of B was made equal to the effective plating area of the plating jig. Next, an electrolytic cell 5 partitioned into an anode chamber and a cathode chamber by an anion exchange membrane 6 is provided, a copper electrode 8 is installed as an anode in the anode chamber, and a platinum electrode 9 is installed as a cathode in the cathode chamber. In order to send the plating solution 2 in the plating tank 1 to the anode chamber of the electrolytic tank 5, piping is connected via a pump 10B. In addition, in order to send the plating solution 2A in the anode chamber of the electrolytic tank 5 to the plating tank 1,
Piping is connected via the pump 10A and filter 11.
【００１７】次にこのように構成された本実施例の操作
について説明する。めっき槽１及び電解槽５の陽極室に
めっき液２，２Ａを満たし、ポンプ１０Ａ，１０Ｂを動
かし、めっき液２，２Ａを循環させる。使用しためっき
液２，２Ａの組成は、硫酸２００ｇ／ｌ，硫酸銅五水塩
７０ｇ／ｌ，塩素６０ｐｐｍである。Next, the operation of this embodiment configured as described above will be explained. The anode chambers of the plating tank 1 and electrolytic tank 5 are filled with plating solutions 2 and 2A, and the pumps 10A and 10B are operated to circulate the plating solutions 2 and 2A. The composition of the plating solutions 2 and 2A used was 200 g/l of sulfuric acid, 70 g/l of copper sulfate pentahydrate, and 60 ppm of chlorine.
【００１８】また、電解槽５の陰極室に電解液７として
１０ｇ／ｌの水酸化ナトリウム水溶液を入れる。水酸化
ナトリウムの代りに水酸化カリウムでもよい。次に、所
望の箇所に穴あけを施され、無電解銅めっき処理が行な
われた基板４をめっき治具に取り付け、めっき槽１中の
めっき液２に浸漬する。Further, a 10 g/l aqueous sodium hydroxide solution is introduced into the cathode chamber of the electrolytic cell 5 as the electrolytic solution 7. Potassium hydroxide may be used instead of sodium hydroxide. Next, the substrate 4 with holes drilled at desired locations and subjected to electroless copper plating is attached to a plating jig and immersed in the plating solution 2 in the plating bath 1.
【００１９】陰極電流密度を２．０Ａ／ｄｍ２ として
、設定めっき厚２５μｍ，めっき時間５７分のめっきを
行った。これと同時に電解槽５の両電極間８，９に、め
っき槽で流した電流値と等しい電流を流した。そしてめ
っき前後に於ける硫酸濃度，銅濃度を分析したところ、
それぞれ、２００ｇ／ｌ，７０ｇ／ｌ（硫酸銅五水塩と
して）であり、めっき前後での変化は見られなかった。
また、基板のめっき厚の分布を調べたところ、バラツキ
が小さく非常に良好であった。Plating was carried out at a cathode current density of 2.0 A/dm2, a set plating thickness of 25 μm, and a plating time of 57 minutes. At the same time, a current equal to the current value passed in the plating tank was passed between the two electrodes 8 and 9 of the electrolytic tank 5. When we analyzed the sulfuric acid concentration and copper concentration before and after plating, we found that
They were 200 g/l and 70 g/l (as copper sulfate pentahydrate), respectively, and no changes were observed before and after plating. Furthermore, when the distribution of the plating thickness of the substrate was investigated, it was found that the variation was small and very good.
【００２０】上述した実施例では、めっき液の循環手段
として２台のポンプを用いた場合について説明したが、
めっき槽１の上部からオーバーフローによりめっき液２
を電解槽５の陽極室へ流出させてもよい。この場合、め
っき液循環のポンプを１台に減らすことができる。[0020] In the above-mentioned embodiment, a case was explained in which two pumps were used as means for circulating the plating solution.
Plating solution 2 overflows from the top of plating tank 1.
may be allowed to flow out into the anode chamber of the electrolytic cell 5. In this case, the number of pumps for circulating the plating solution can be reduced to one.
【００２１】また不溶性の電極として白金の代りに、白
金めっきチタン板，グラファイト，過酸化鉛等を用いる
ことができる。Furthermore, instead of platinum, a platinum-plated titanium plate, graphite, lead peroxide, etc. can be used as the insoluble electrode.
【００２２】[0022]
【発明の効果】以上説明したように本発明は、めっき槽
の陽極に不溶性の電極を用い、銅の補充を、電解槽で行
うことにより、陽極の表面積は、常に一定となり、また
、めっきの析出により消費した銅イオンは、常時銅イオ
ンのみを同等量補充できるため、電流密度の分布が常に
一定で、浴組成の変動のないめっきができるという効果
を有する。[Effects of the Invention] As explained above, the present invention uses an insoluble electrode as the anode of the plating tank and replenishes copper in the electrolytic tank, so that the surface area of the anode is always constant, and the plating Since the copper ions consumed by precipitation can be constantly replenished with the same amount of copper ions, the current density distribution is always constant and plating can be performed without fluctuations in bath composition.
【図１】本発明の一実施例の構成図。FIG. 1 is a configuration diagram of an embodiment of the present invention.
【図２】従来の電気めっき装置の構成図。FIG. 2 is a configuration diagram of a conventional electroplating apparatus.
１ めっき槽 ２，２Ａ めっき液 ３Ａ，３Ｂ 白金電極 ４ 基板 ５ 電解槽 ６ 陰イオン交換膜 ７ 水酸化ナトリウム水溶液 ８ 銅電極 ９ 白金電極 １０Ａ，１０Ｂ ポンプ １１ フィルター １３ 銅ボール １４ アノードケース １５ アノードバック 1 Plating tank 2,2A Plating solution 3A, 3B Platinum electrode 4 Board 5 Electrolytic cell 6 Anion exchange membrane 7 Sodium hydroxide aqueous solution 8 Copper electrode 9 Platinum electrode 10A, 10B Pump 11 Filter 13 Copper ball 14 Anode case 15 Anode back
Claims (1)
れる不溶性の陽極と、陰イオン交換膜により陽極室と陰
極室とに分離された電解槽と、この陽極室と陰極室内に
それぞれ設置される銅電極と不溶性の陰極と、前記めっ
き槽と前記陽極室とに満されるめっき液を循環させるた
めのめっき液循環手段とを含むことを特徴とする電気め
っき装置。[Claim 1] A plating tank, an insoluble anode installed in the plating tank, an electrolytic tank separated into an anode chamber and a cathode chamber by an anion exchange membrane, and installed respectively in the anode chamber and the cathode chamber. An electroplating apparatus comprising a copper electrode, an insoluble cathode, and a plating solution circulating means for circulating a plating solution filled in the plating tank and the anode chamber.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP13456791A JPH04362199A (en) | 1991-06-06 | 1991-06-06 | Electroplating device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP13456791A JPH04362199A (en) | 1991-06-06 | 1991-06-06 | Electroplating device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH04362199A true JPH04362199A (en) | 1992-12-15 |
Family
ID=15131361
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP13456791A Pending JPH04362199A (en) | 1991-06-06 | 1991-06-06 | Electroplating device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH04362199A (en) |
Cited By (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2001092604A3 (en) * | 2000-05-31 | 2002-04-25 | De Nora Elettrodi Spa | Electrolysis cell for restoring the concentration of metal ions in processes of electroplating |
| CN1333442C (en) * | 2000-10-02 | 2007-08-22 | 先进微装置公司 | Plating system with remote secondary anode for semiconductor manufacturing |
| JP2009242940A (en) * | 2008-03-11 | 2009-10-22 | C Uyemura & Co Ltd | Continuous copper electroplating method |
| KR101067694B1 (en) * | 2011-05-20 | 2011-09-27 | 주식회사 삼원알텍 | Copper eleminating system for anodizing treatment of metal |
| KR101311274B1 (en) * | 2011-08-05 | 2013-09-25 | 주식회사 삼원알텍 | Copper eleminating system for Anodizing Treatment of Metal |
| JP2016225082A (en) * | 2015-05-28 | 2016-12-28 | 昭和電線ケーブルシステム株式会社 | Method for producing oxide superconducting wire rod |
| WO2019050688A1 (en) * | 2017-09-05 | 2019-03-14 | Wisconsin Alumni Research Foundation | Electrochemical oxidation of 5-hydroxymethylfurfural using copper-based anodes |
| US10655233B2 (en) | 2015-01-08 | 2020-05-19 | Wisconsin Alumni Research Foundation | Electrochemical and photoelectrochemical oxidation of 5-hydroxymethylfurfural to 2,5-furandicarboxylic acid and 2,5-diformylfuran |
| US11142833B2 (en) | 2017-10-09 | 2021-10-12 | Wisconsin Alumni Research Foundation | Electrochemical oxidation of aromatic aldehydes in acidic media |
| CN114438563A (en) * | 2022-02-18 | 2022-05-06 | 崇辉半导体有限公司 | System for automatically supplementing silver ions, silver spraying and plating system and silver spraying and plating process |
-
1991
- 1991-06-06 JP JP13456791A patent/JPH04362199A/en active Pending
Cited By (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2001092604A3 (en) * | 2000-05-31 | 2002-04-25 | De Nora Elettrodi Spa | Electrolysis cell for restoring the concentration of metal ions in processes of electroplating |
| CN1333442C (en) * | 2000-10-02 | 2007-08-22 | 先进微装置公司 | Plating system with remote secondary anode for semiconductor manufacturing |
| JP2009242940A (en) * | 2008-03-11 | 2009-10-22 | C Uyemura & Co Ltd | Continuous copper electroplating method |
| KR101067694B1 (en) * | 2011-05-20 | 2011-09-27 | 주식회사 삼원알텍 | Copper eleminating system for anodizing treatment of metal |
| KR101311274B1 (en) * | 2011-08-05 | 2013-09-25 | 주식회사 삼원알텍 | Copper eleminating system for Anodizing Treatment of Metal |
| US10655233B2 (en) | 2015-01-08 | 2020-05-19 | Wisconsin Alumni Research Foundation | Electrochemical and photoelectrochemical oxidation of 5-hydroxymethylfurfural to 2,5-furandicarboxylic acid and 2,5-diformylfuran |
| JP2016225082A (en) * | 2015-05-28 | 2016-12-28 | 昭和電線ケーブルシステム株式会社 | Method for producing oxide superconducting wire rod |
| WO2019050688A1 (en) * | 2017-09-05 | 2019-03-14 | Wisconsin Alumni Research Foundation | Electrochemical oxidation of 5-hydroxymethylfurfural using copper-based anodes |
| US10669639B2 (en) * | 2017-09-05 | 2020-06-02 | Wisconsin Alumni Research Foundation | Eletrochemical oxidation of 5-hydroxymethylfurfural using copper-based anodes |
| US11142833B2 (en) | 2017-10-09 | 2021-10-12 | Wisconsin Alumni Research Foundation | Electrochemical oxidation of aromatic aldehydes in acidic media |
| CN114438563A (en) * | 2022-02-18 | 2022-05-06 | 崇辉半导体有限公司 | System for automatically supplementing silver ions, silver spraying and plating system and silver spraying and plating process |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US6099711A (en) | Process for the electrolytic deposition of metal layers | |
| US6379520B1 (en) | Plating apparatus | |
| US8801912B2 (en) | Continuous copper electroplating method | |
| US6120673A (en) | Method and device for regenerating tin-plating solutions | |
| US5143593A (en) | Method of copper plating | |
| ITMI20011374A1 (en) | ELECTROLYSIS CELL FOR THE RESTORATION OF THE CONCENTRATION OF METAL IONS IN ELECTRODEPOSITION PROCESSES | |
| US6899803B2 (en) | Method and device for the regulation of the concentration of metal ions in an electrolyte and use thereof | |
| US20060151328A1 (en) | Method of electroplating a workpiece having high-aspect ratio holes | |
| JPH04362199A (en) | Electroplating device | |
| TWI683931B (en) | Anode for electrolytic copper plating and electrolytic copper plating device using the same | |
| JP3352081B2 (en) | Printed circuit board copper plating equipment | |
| CN101492831B (en) | Anode apparatus for electroplating and electroplating apparatus comprising the same | |
| JPH10121297A (en) | Electrolytic copper plating device using insoluble anode and copper plating method employing the device | |
| JP2510422B2 (en) | Copper plating method for printed circuit boards | |
| JP2001316893A (en) | Surface treatment method and device using insoluble anode | |
| JP2017008404A (en) | Plating device and plating method | |
| JP3903120B2 (en) | Copper sulfate plating method | |
| JP3110444U (en) | Electrolytic recovery device for metal and electrolytic plating system | |
| JPH0236677B2 (en) | ||
| JPH04193977A (en) | Method for electroplating | |
| JPS6141799A (en) | Method for supplying tin ion to electrolytic tinning bath | |
| JPH05302199A (en) | Method for controlling composition of copper plating bath in copper plating using insoluble anode | |
| US20050051434A1 (en) | Method and apparatus for controlling electrolytic solution | |
| JP3157678U (en) | Electrolytic plating system | |
| CN217378033U (en) | Chlorine-free gas-electricity regeneration PCB acid cycle etching system |