JPH04359069A - Silver powder for electro conductive coating and electro conductive coating using the same - Google Patents
Silver powder for electro conductive coating and electro conductive coating using the sameInfo
- Publication number
- JPH04359069A JPH04359069A JP3134055A JP13405591A JPH04359069A JP H04359069 A JPH04359069 A JP H04359069A JP 3134055 A JP3134055 A JP 3134055A JP 13405591 A JP13405591 A JP 13405591A JP H04359069 A JPH04359069 A JP H04359069A
- Authority
- JP
- Japan
- Prior art keywords
- flake
- thickness
- silver powder
- less
- maximum
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 title claims abstract description 29
- 238000000576 coating method Methods 0.000 title abstract description 31
- 239000011248 coating agent Substances 0.000 title abstract description 30
- 239000002245 particle Substances 0.000 claims abstract description 25
- 239000000843 powder Substances 0.000 claims abstract description 14
- 239000011521 glass Substances 0.000 claims abstract description 6
- 238000002844 melting Methods 0.000 claims abstract description 6
- 230000008018 melting Effects 0.000 claims abstract description 6
- 239000002966 varnish Substances 0.000 claims abstract description 4
- 239000003973 paint Substances 0.000 claims description 38
- 239000000919 ceramic Substances 0.000 abstract description 21
- 238000000034 method Methods 0.000 abstract description 3
- 239000003960 organic solvent Substances 0.000 abstract description 2
- 238000004220 aggregation Methods 0.000 abstract 1
- 230000002776 aggregation Effects 0.000 abstract 1
- 239000003112 inhibitor Substances 0.000 abstract 1
- 239000000126 substance Substances 0.000 abstract 1
- 239000010408 film Substances 0.000 description 25
- 230000000052 comparative effect Effects 0.000 description 11
- 229910000679 solder Inorganic materials 0.000 description 9
- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 description 6
- 239000000853 adhesive Substances 0.000 description 5
- 229910052709 silver Inorganic materials 0.000 description 5
- 239000004332 silver Substances 0.000 description 5
- SQGYOTSLMSWVJD-UHFFFAOYSA-N silver(1+) nitrate Chemical compound [Ag+].[O-]N(=O)=O SQGYOTSLMSWVJD-UHFFFAOYSA-N 0.000 description 5
- 230000006378 damage Effects 0.000 description 4
- 230000001070 adhesive effect Effects 0.000 description 3
- 239000004020 conductor Substances 0.000 description 3
- 238000005336 cracking Methods 0.000 description 3
- 238000010304 firing Methods 0.000 description 3
- WSFSSNUMVMOOMR-UHFFFAOYSA-N Formaldehyde Chemical compound O=C WSFSSNUMVMOOMR-UHFFFAOYSA-N 0.000 description 2
- 230000000181 anti-adherent effect Effects 0.000 description 2
- 239000007864 aqueous solution Substances 0.000 description 2
- 239000000203 mixture Substances 0.000 description 2
- 239000002244 precipitate Substances 0.000 description 2
- 235000011121 sodium hydroxide Nutrition 0.000 description 2
- 238000009736 wetting Methods 0.000 description 2
- 229910000831 Steel Inorganic materials 0.000 description 1
- 239000012298 atmosphere Substances 0.000 description 1
- 238000000889 atomisation Methods 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 239000003638 chemical reducing agent Substances 0.000 description 1
- 239000000470 constituent Substances 0.000 description 1
- 238000010908 decantation Methods 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 235000014113 dietary fatty acids Nutrition 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 229930195729 fatty acid Natural products 0.000 description 1
- 239000000194 fatty acid Substances 0.000 description 1
- 150000004665 fatty acids Chemical class 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 238000002156 mixing Methods 0.000 description 1
- 238000007639 printing Methods 0.000 description 1
- 238000006722 reduction reaction Methods 0.000 description 1
- 229910001961 silver nitrate Inorganic materials 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- 238000004544 sputter deposition Methods 0.000 description 1
- 239000010959 steel Substances 0.000 description 1
- 230000003746 surface roughness Effects 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
- 238000007740 vapor deposition Methods 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Abstract
Description
【０００１】0001
【産業上の利用分野】本発明は、導電塗料用の銀粉及び
それを用いた導電塗料であり、特に薄型のセラミックス
素子に焼付して電極又は導体を形成するのに好適な導電
塗料に関するものである。[Field of Industrial Application] The present invention relates to silver powder for conductive paints and conductive paints using the same, and particularly to conductive paints suitable for baking on thin ceramic elements to form electrodes or conductors. be.
【０００２】0002
【従来の技術】導電塗料用銀粉末としては、種々のもの
が市販され、これを用いた導電塗料も種々開発されてい
る。しかし、最近、厚さが１００μｍ 以下の薄型のセ
ラミックス素子に従来の導電塗料を用いて電極又は導体
を形成した場合、セラミックス素子に変形あるいは破壊
が生じるという問題が出てきた。このセラミックス素子
の変形あるいは破壊の原因は定かではないが、セラミッ
クス素子が薄型のため、その強度が小さいことと、従来
の導電塗料では４μｍ 以上の厚さの塗膜しか形成でき
ないため焼成の際に収縮し、その応力がセラミックス素
子を変形させるか、もしくはセラミックス素子の破壊強
度を超えるために、セラミックス素子が破壊するものと
考えられる。BACKGROUND OF THE INVENTION Various types of silver powder for conductive paints are commercially available, and various conductive paints using the same have also been developed. However, recently, when electrodes or conductors are formed on a thin ceramic element having a thickness of 100 μm or less using a conventional conductive paint, a problem has arisen that the ceramic element may be deformed or destroyed. The cause of this deformation or destruction of the ceramic element is not clear, but it is because the ceramic element is thin and has low strength, and because conventional conductive paint can only form a coating film with a thickness of 4 μm or more, it is difficult to It is thought that the ceramic element breaks due to shrinkage and the resulting stress deforms the ceramic element or exceeds the breaking strength of the ceramic element.
【０００３】0003
【発明が解決しようとする課題】本発明者等は、上記セ
ラミックス素子の変形もしくは破壊を導電塗料側で防止
すべく、種々検討した結果、導電塗料の塗膜を焼成する
ことにより塗膜を形成する際の収縮を極力小さくするた
めに、塗膜厚さを２μｍ 以下とすること、この際に用
いる導電塗料用銀粉は導電性を確保するため銀粒子をフ
レーク状とし、その最大フレーク径／フレーク厚さの比
を１００以上、３００以下とすれば、塗膜厚さを２μｍ
以下としても、銀粒子同志の接触点が確保され、良好
な導電性が得られること、また得られた塗膜は焼成の際
の収縮が小さいと同時に、塗膜厚さが均一で緻密な塗膜
が形成できること等を見出し、本発明を完成したもので
ある。[Problems to be Solved by the Invention] The present inventors have conducted various studies to prevent the deformation or destruction of the above-mentioned ceramic elements on the conductive paint side. In order to minimize the shrinkage during coating, the coating thickness should be 2 μm or less.The silver powder for conductive paint used at this time is made of silver particles in the form of flakes to ensure conductivity, and the maximum flake diameter / flake If the thickness ratio is 100 or more and 300 or less, the coating thickness is 2 μm.
Even if the following conditions are used, the points of contact between the silver particles are secured and good conductivity is obtained, and the resulting coating film has little shrinkage during firing, and at the same time has a uniform coating thickness and a dense coating. They discovered that a film could be formed and completed the present invention.
【０００４】0004
【問題を解決するための手段】即ち、本発明は最大粒径
が４０μｍ 以下で、フレーク厚さが２μｍ 以下のフ
レーク状粉末であり、最大フレーク径／フレーク厚の比
が１００以上、３００以下のフレーク状粒子が最小８０
重量％含有する導電塗料用銀粉及び、この導電塗料用銀
粉３０重量部以上、６０重量部以下、低融点ガラスフリ
ットを１重量部以上、１０重量部以下、残部が有機ワニ
スであることを特徴とする導電塗料である。[Means for Solving the Problem] That is, the present invention provides a flaky powder with a maximum particle size of 40 μm or less and a flake thickness of 2 μm or less, and a maximum flake diameter/flake thickness ratio of 100 or more and 300 or less. Minimum flake particles are 80
Silver powder for conductive paints containing 30 parts by weight or more and 60 parts by weight or less of this silver powder for conductive paints, 1 part by weight or more of low melting point glass frit and 10 parts by weight or less, and the remainder being organic varnish. It is a conductive paint.
【０００５】[0005]
【作用】本発明の導電塗料用銀粉は最大粒径が４０μｍ
以下でフレーク厚さが２μｍ 以下のフレーク状粉末
であることが必要である。これは、最大粒径が４０μｍ
以上の粒子が含まれると、導電塗料とした場合に塗料
のチクソ性が大きくなり、均一な塗膜面が得られなくな
り、フレーク厚さが、２μｍ 以上のフレーク状粉末が
含まれると銀粒子自身の厚みのために、２μｍ以下の塗
膜が形成できないという理由による。[Action] The silver powder for conductive paint of the present invention has a maximum particle size of 40 μm.
It is necessary that the flake-like powder has a flake thickness of 2 μm or less. This has a maximum particle size of 40 μm.
If the above particles are contained, the thixotropy of the paint becomes large when used as a conductive paint, making it impossible to obtain a uniform coating surface, and if the flake-like powder with a thickness of 2 μm or more is contained, the silver particles themselves This is because a coating film of 2 μm or less cannot be formed due to the thickness.
【０００６】また、最大フレーク径／フレーク厚の比が
１００以上、３００以下のフレーク状粒子を最少８０重
量％含むことが必要である。最大フレーク径／フレーク
厚の比が１００以下の粒子が含まれると導電塗料として
塗膜を形成した場合、焼成時の収縮が大きく銀粒子間の
接触が少なくなり、緻密で均一な厚みを持った電極が得
られなくなり、その結果セラミックス素子の破壊、導通
不良を生じるので好ましくない。[0006] Furthermore, it is necessary to contain at least 80% by weight of flaky particles having a maximum flake diameter/flake thickness ratio of 100 or more and 300 or less. If particles with a ratio of maximum flake diameter/flake thickness of 100 or less are included, when a coating film is formed as a conductive paint, the shrinkage during firing will be large and contact between silver particles will be reduced, resulting in a dense and uniform thickness. This is not preferable because it becomes impossible to obtain an electrode, resulting in destruction of the ceramic element and poor conduction.
【０００７】また、最大フレーク径／フレーク厚の比が
３００以上の粒子が含まれると、導電塗料とした場合に
、塗料のチクソ性が大きくなり、塗膜厚が均一に形成で
きない等の印刷性が悪くなるので好ましくない。なお、
最大フレーク径／フレーク厚の比が１００以上、３００
以下のフレーク状粒子が全部である。導電塗料用銀粉が
好ましいが、実質的にはこれが８０重量％であれば導電
塗料とした場合の特性に影響はない。これが８０重量％
以下となると、前記、セラミックス素子の変形あるいは
破壊、導通不良、チクソ性が大きくなることによる印刷
性の悪化が生じ好ましくない。Furthermore, if particles with a ratio of maximum flake diameter/flake thickness of 300 or more are included, when used as a conductive paint, the thixotropy of the paint increases, resulting in poor printability such as the inability to form a uniform coating film thickness. This is not preferable because it worsens the condition. In addition,
Maximum flake diameter/flake thickness ratio is 100 or more, 300
The following flake-like particles are all included. Silver powder for conductive paint is preferred, but if it is 80% by weight, it will not affect the properties of the conductive paint. This is 80% by weight
If it is below, the above-mentioned deformation or destruction of the ceramic element, poor conduction, and deterioration of printability due to increased thixotropy are undesirable.
【０００８】本発明の導電塗料は、前記本発明の導電塗
料用銀粉と低融点ガラスフリット及び有機ワニスより構
成されるが、それぞれの配合量を規定したのは以下の通
りである。本発明の導電塗料用銀粉を３０重量部以上、
６０重量部以下としたのは、３０重量部より少なくなる
と、塗膜面に隙間が生じ、均一な塗膜が得られないため
であり、また、６０重量部より多くなると、塗料の粘度
特性が悪くなり印刷が困難なうえに、現在のスクリーン
技術では２μｍ 以下の塗膜を形成ることが不可能なた
めである。更に、低融点ガラスフリットを１重量部以上
、１０重量部以下としたのは、１重量部より少なくする
とセラミックス素子と電極層との強度が弱くなるためで
あり、１０重量部より多くするとハンダ濡れ性が悪くな
るためである。The conductive paint of the present invention is composed of the silver powder for conductive paint of the present invention, a low melting point glass frit, and an organic varnish, and the blending amounts of each are defined as follows. 30 parts by weight or more of silver powder for conductive paint of the present invention,
The reason why it is set at 60 parts by weight or less is that if it is less than 30 parts by weight, gaps will appear on the coating surface and a uniform coating film will not be obtained.If it is more than 60 parts by weight, the viscosity characteristics of the paint will deteriorate. This is because not only is it difficult to print, but also it is impossible to form a coating film with a thickness of 2 μm or less using current screen technology. Furthermore, the reason why the low melting point glass frit is set to be 1 part by weight or more and 10 parts by weight or less is that if it is less than 1 part by weight, the strength of the ceramic element and the electrode layer will be weakened, and if it is more than 10 parts by weight, it will cause solder wetting. This is because sex becomes worse.
【０００９】なお、本発明の導電塗料用銀粉は化学還元
法、アトマイズ法等で製造した塊状又は球状の粉末を有
機溶剤等の凝着防止剤を含むボールミルの中で偏平化す
ることにより得ることができるが、微細でしかも偏平と
なる条件を選定する必要がある。また、蒸着、スパッタ
リング法による薄膜を破砕することでも本発明の導電塗
料用銀粉が得られる。The silver powder for conductive paint of the present invention can be obtained by flattening a lump or spherical powder produced by a chemical reduction method, an atomization method, etc. in a ball mill containing an anti-adhesive agent such as an organic solvent. However, it is necessary to select conditions that will result in a fine and flat surface. Further, the silver powder for conductive paint of the present invention can also be obtained by crushing a thin film formed by vapor deposition or sputtering.
【００１０】0010
【実施例】以下、実施例について説明する。硝酸銀水溶
液（ＡｇＮＯ３ １００ｇ／Ｈ２Ｏ ３０００ｍｌ）に
ホルマリン（６０ｍｌ）を添加し、次いで苛性ソーダ水
溶液（ＮａＯＨ ５０ｇ／Ｈ２Ｏ ２００ｍｌ）を添加
し、白色沈澱物を生成させる。こうして得られた沈澱物
をデカンテーションにより充分に水洗し、ろ過した後低
温乾燥を行った。こうして得られた粉末をボールミル中
に入れ凝着防止剤として高級脂肪酸とスチールボールを
同時に入れ偏平化し、フレーク状粒子とした。この時の
条件を１４種類変えることにより、表１に示す最大フレ
ーク径／フレーク厚の粉末が得られた。なお、本実施例
で得られた銀粉末は全てが、最大粒径が４０μｍ 以下
でフレーク厚が２μｍ 以下のフレーク状粉末であり、
最大フレーク径／フレーク厚の比が１００以上、３００
以下のフレーク状粒子を８０重量％以上含有していた。[Example] Examples will be described below. Formalin (60 ml) is added to a silver nitrate aqueous solution (AgNO3 100 g/H2O 3000 ml), followed by a caustic soda aqueous solution (NaOH 50 g/H2O 200 ml) to form a white precipitate. The precipitate thus obtained was thoroughly washed with water by decantation, filtered, and then dried at low temperature. The powder thus obtained was placed in a ball mill, and higher fatty acids and steel balls were added as an anti-adhesive agent at the same time to flatten the powder into flake-like particles. By changing 14 conditions at this time, powders having the maximum flake diameter/flake thickness shown in Table 1 were obtained. Note that all of the silver powders obtained in this example were flaky powders with a maximum particle size of 40 μm or less and a flake thickness of 2 μm or less,
Maximum flake diameter/flake thickness ratio is 100 or more, 300
It contained 80% by weight or more of the following flake particles.
【００１１】なお、最大フレーク径／フレーク厚の比の
測定及び含有率については、電子顕微鏡により観察し、
最大粒径はレーザ回折粒度測定機を用いて測定した。以
上のようにして得られた、導電塗料用銀粉末を表１に示
す成分組成の実施例の導電塗料を粘度が２００ポイズに
なるように作成した。各ペースト組成物をクリーン印刷
（２５０メッシュスクリーン） にてセラミックス素子
（２１φ， 厚さ１００ μｍ）上に１９φの大きさ
に印刷した。これを乾燥機に入れて、１５０ ℃， １
０分間乾燥処理を施した。
次にこの塗布層を大気雰囲気中で７００ ℃の温度で１
５分間焼成した。この際、昇温及び降温時間を含めて合
計６０分間、炉の中にセラミックス素子を入れた。これ
により表２に示すような導電塗膜が形成された。[0011] The measurement of the ratio of maximum flake diameter/flake thickness and the content rate were observed using an electron microscope.
The maximum particle size was measured using a laser diffraction particle size analyzer. The silver powder for conductive paint obtained as described above was used to prepare a conductive paint having a composition shown in Table 1 and having a viscosity of 200 poise. Each paste composition was printed to a size of 19φ on a ceramic element (21φ, thickness 100 μm) using clean printing (250 mesh screen). Put this in the dryer and heat at 150℃, 1
A drying process was performed for 0 minutes. This coated layer was then heated for 1 time at a temperature of 700°C in an air atmosphere.
Baked for 5 minutes. At this time, the ceramic element was placed in the furnace for a total of 60 minutes, including the time for temperature rise and temperature fall. As a result, a conductive coating film as shown in Table 2 was formed.
【００１２】0012
【表１】[Table 1]
【００１３】[0013]
【表２】[Table 2]
【００１４】膜厚は電子顕微鏡により測定、粗さは塗膜
の表面粗さを測定した。ハンダ付性についてはハンダ喰
ワレとハンダ濡れ率で評価し、ハンダ喰ワレの小さいも
のを○、少し喰われるものを△、ハンダ喰ワレの大きな
ものを×とした。この時のハンダ条件はＳ２０６，２３
０℃，５秒浸漬とした。空隙率は塗膜面の隙間の割合を
示し、２０％以上となると電気特性が得られなくなるた
め不可とした。強度は、塗膜とセラミックス素子との接
着強度を測定し、素子破壊するものを○、界面破壊する
ものを×とした。The film thickness was measured using an electron microscope, and the roughness was measured by the surface roughness of the coating film. Solderability was evaluated based on solder cracking and solder wetting rate, and those with small solder cracks were rated ○, those with slight solder cracks were rated △, and those with large solder cracks were rated ×. The soldering conditions at this time are S206, 23
It was immersed at 0°C for 5 seconds. The porosity indicates the percentage of gaps on the surface of the coating film, and when it exceeds 20%, electrical properties cannot be obtained, so it was judged as unacceptable. The strength was determined by measuring the adhesive strength between the coating film and the ceramic element, and rated as ○ if the element was destroyed, and × if the interface was destroyed.
【００１５】[0015]
【比較例】本発明の実施例のうち、ボーミルの条件を変
更した以外は、実施例と同じ方法で表１に比較例として
示す８種類の粉末を製造し、実施例と同じ方法で導電塗
料を作成し、セラミックス素子に導電塗膜を形成した。
この導電塗膜の特性を表２に示す。[Comparative Example] Eight types of powders shown as comparative examples in Table 1 were manufactured in the same manner as in the examples of the present invention, except that the Baumill conditions were changed. was created and a conductive coating film was formed on the ceramic element. Table 2 shows the properties of this conductive coating.
【００１６】表１及び表２から、本発明の実施例におい
ては膜厚より生じる応力による素子変形も見られず、空
隙率も小さいために、ハンダ喰ワレも少なく、所定の電
気特性が得られ、セラミックス素子との接着強度も良好
となる。すなわち、膜厚が２μｍ 以下で均一で緻密な
塗膜が得られるのに対し、比較例をみると、比較例１で
は、最大粒径が４０μｍ を越えるため、均一な塗膜面
が得られず、膜厚が大きくなり、素子変形が生じる。比
較例２では最大フレーク径／フレーク厚の比が１００以
上、３００以下の銀粉末の含有量が８０重量％より少な
いため、焼成時の収縮が大きくなり、導通不良、あるい
は素子変形を生じる。比較例３では、最大フレーク径／
フレーク厚の比が１００以下のために、塗膜形成時の収
縮が大きく、導通不良を生じたり、膜厚が厚いために素
子変形を生じる。比較例４では、最大フレーク径／フレ
ーク厚の比が３００以上のため、塗料のチクソ性が大き
くなり、印刷性が悪くなるので、塗膜粗さが大きくなり
、膜厚も厚くなるため、焼成時の応力が大きくなって素
子変形が生じる。比較例５及び６では、低融点ガラスフ
リットが１重量部以下あるいは１０重量部以上のため、
比較例５では接着強度が弱く、比較例６では、ハンダ濡
れ性が悪い。比較例７では、銀粉末の含有量が３０重量
部より少ないために、空隙率が大きく電気特性が得られ
ないうえにハンダ喰ワレも大きい。比較例８では、銀粉
末の含有量が６０重量部より多いために塗料の粘度特性
の悪さから、塗膜粗さが大きくなり、膜厚も厚くなるた
め素子変形が生じる。従って、本発明の構成要件を欠く
導電塗料用銀粉は薄型のセラミックス素子には適用でき
ないことが明らかである。From Tables 1 and 2, in the examples of the present invention, no element deformation due to stress caused by the film thickness was observed, and since the porosity was small, there was little solder cracking, and the desired electrical characteristics were obtained. , the adhesive strength with ceramic elements is also improved. In other words, a uniform and dense coating film can be obtained with a film thickness of 2 μm or less, whereas in Comparative Example 1, a uniform coating surface cannot be obtained because the maximum particle size exceeds 40 μm. , the film thickness increases and element deformation occurs. In Comparative Example 2, the content of silver powder with a maximum flake diameter/flake thickness ratio of 100 or more and 300 or less is less than 80% by weight, so shrinkage during firing becomes large, resulting in poor conduction or device deformation. In Comparative Example 3, the maximum flake diameter/
Since the flake thickness ratio is less than 100, shrinkage during coating film formation is large, resulting in poor conduction, and the thick film causes device deformation. In Comparative Example 4, the ratio of maximum flake diameter/flake thickness was 300 or more, which increased the thixotropy of the paint and worsened printability, resulting in increased coating film roughness and thicker film thickness. When the stress increases, element deformation occurs. In Comparative Examples 5 and 6, since the low melting point glass frit was 1 part by weight or less or 10 parts by weight or more,
Comparative Example 5 had weak adhesive strength, and Comparative Example 6 had poor solder wettability. In Comparative Example 7, since the content of silver powder was less than 30 parts by weight, the porosity was large and electrical properties could not be obtained, and the solder cracking was also large. In Comparative Example 8, since the content of silver powder was more than 60 parts by weight, the viscosity characteristics of the paint were poor, resulting in increased coating film roughness and increased film thickness, resulting in element deformation. Therefore, it is clear that silver powder for conductive coatings lacking the constituent requirements of the present invention cannot be applied to thin ceramic elements.
【００１７】[0017]
【発明の効果】以上のように、本発明の導電塗料用銀粉
又は導電塗料は厚みが２μｍ 以下で均一な塗膜を形成
し、しかも、ハンダ付けが可能であるため従来の塗料で
は適用できなかったような薄型の素子、特に薄型セラミ
ックス素子の電極又は導体の形成に非常に有効である。
更に、本発明の導電塗料用銀粉は低温焼成（５００℃）
用の導電塗料にも適用が可能である。[Effects of the Invention] As described above, the silver powder for conductive paint or conductive paint of the present invention forms a uniform coating film with a thickness of 2 μm or less, and can be soldered, which cannot be applied with conventional paints. It is very effective for forming electrodes or conductors of thin elements such as thin ceramic elements, especially thin ceramic elements. Furthermore, the silver powder for conductive paint of the present invention can be fired at a low temperature (500°C).
It can also be applied to conductive paints for use.
Claims (2)
ク厚さが２μｍ 以下のフレーク状粉末であり、最大フ
レーク径／フレーク厚の比が１００以上、３００以下の
フレーク状粒子が最小８０重量％含有する導電塗料用銀
粉。Claim 1: A flake-like powder with a maximum particle size of 40 μm or less and a flake thickness of 2 μm or less, containing a minimum of 80% by weight of flake-like particles with a maximum flake diameter/flake thickness ratio of 100 or more and 300 or less. Silver powder for conductive paint.
ク厚さが２μｍ 以下のフレーク状粉末であり、最大フ
レーク径／フレーク厚の比が１００以上、３００以下の
フレーク状粒子が最小８０重量％含有する導電塗料用銀
粉３０重量部以上、６０重量部以下、低融点ガラスフリ
ットを１重量部以上、１０重量部以下、残部が有機ワニ
スであることを特徴とする導電塗料。2. A flake-like powder with a maximum particle size of 40 μm or less and a flake thickness of 2 μm or less, containing a minimum of 80% by weight of flake-like particles with a maximum flake diameter/flake thickness ratio of 100 or more and 300 or less. A conductive paint comprising 30 parts by weight or more and 60 parts by weight or less of silver powder for conductive paint, 1 part by weight or more of low melting point glass frit and 10 parts by weight or less, and the balance being an organic varnish.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3134055A JPH0826251B2 (en) | 1991-06-05 | 1991-06-05 | Silver powder for baking type conductive paint and baking type conductive paint using the same |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3134055A JPH0826251B2 (en) | 1991-06-05 | 1991-06-05 | Silver powder for baking type conductive paint and baking type conductive paint using the same |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH04359069A true JPH04359069A (en) | 1992-12-11 |
| JPH0826251B2 JPH0826251B2 (en) | 1996-03-13 |
Family
ID=15119311
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP3134055A Expired - Lifetime JPH0826251B2 (en) | 1991-06-05 | 1991-06-05 | Silver powder for baking type conductive paint and baking type conductive paint using the same |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0826251B2 (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH09208867A (en) * | 1996-02-01 | 1997-08-12 | Toyo Alum Kk | Coating composition and method for forming coating film |
| WO2013108701A1 (en) * | 2012-01-20 | 2013-07-25 | 東洋アルミニウム株式会社 | Conductive filler of flake form |
| JPWO2015064567A1 (en) * | 2013-10-31 | 2017-03-09 | 昭和電工株式会社 | Conductive composition for thin film printing and method for forming thin film conductive pattern |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6140316A (en) * | 1984-07-18 | 1986-02-26 | エレクトロ マテリアルズ コーポレーシヨン オブ アメリカ | Directly solderable electroconductive composition |
| JPS6143644A (en) * | 1984-07-18 | 1986-03-03 | エレクトロ マテリアルズ コ−ポレイシヨン オブ アメリカ | Solderable, soft and substrate-bondalbe conductive composition, preparation and use |
| JPS6280907A (en) * | 1985-04-23 | 1987-04-14 | 昭和電工株式会社 | Conductive paste |
| JPS636069A (en) * | 1986-01-22 | 1988-01-12 | ビー ケミカル カンパニー | Emi shielding paint and manufacture |
-
1991
- 1991-06-05 JP JP3134055A patent/JPH0826251B2/en not_active Expired - Lifetime
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6140316A (en) * | 1984-07-18 | 1986-02-26 | エレクトロ マテリアルズ コーポレーシヨン オブ アメリカ | Directly solderable electroconductive composition |
| JPS6143644A (en) * | 1984-07-18 | 1986-03-03 | エレクトロ マテリアルズ コ−ポレイシヨン オブ アメリカ | Solderable, soft and substrate-bondalbe conductive composition, preparation and use |
| JPS6280907A (en) * | 1985-04-23 | 1987-04-14 | 昭和電工株式会社 | Conductive paste |
| JPS636069A (en) * | 1986-01-22 | 1988-01-12 | ビー ケミカル カンパニー | Emi shielding paint and manufacture |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH09208867A (en) * | 1996-02-01 | 1997-08-12 | Toyo Alum Kk | Coating composition and method for forming coating film |
| WO2013108701A1 (en) * | 2012-01-20 | 2013-07-25 | 東洋アルミニウム株式会社 | Conductive filler of flake form |
| JPWO2015064567A1 (en) * | 2013-10-31 | 2017-03-09 | 昭和電工株式会社 | Conductive composition for thin film printing and method for forming thin film conductive pattern |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0826251B2 (en) | 1996-03-13 |
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