JPH04348938A - Manufacture of laminated sheet - Google Patents
Manufacture of laminated sheetInfo
- Publication number
- JPH04348938A JPH04348938A JP17908591A JP17908591A JPH04348938A JP H04348938 A JPH04348938 A JP H04348938A JP 17908591 A JP17908591 A JP 17908591A JP 17908591 A JP17908591 A JP 17908591A JP H04348938 A JPH04348938 A JP H04348938A
- Authority
- JP
- Japan
- Prior art keywords
- epoxy resin
- copper foil
- prepreg
- laminate
- melting point
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000004519 manufacturing process Methods 0.000 title claims description 5
- 239000003822 epoxy resin Substances 0.000 claims abstract description 18
- 229920000647 polyepoxide Polymers 0.000 claims abstract description 18
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 12
- 239000011889 copper foil Substances 0.000 claims abstract description 12
- QGBSISYHAICWAH-UHFFFAOYSA-N dicyandiamide Chemical compound NC(N)=NC#N QGBSISYHAICWAH-UHFFFAOYSA-N 0.000 claims abstract description 6
- 238000002844 melting Methods 0.000 claims abstract description 6
- 230000008018 melting Effects 0.000 claims abstract description 6
- 239000006087 Silane Coupling Agent Substances 0.000 claims abstract description 5
- 239000003795 chemical substances by application Substances 0.000 claims description 6
- 239000000463 material Substances 0.000 claims description 6
- 239000000835 fiber Substances 0.000 claims description 3
- 239000002184 metal Substances 0.000 claims description 2
- 229910052751 metal Inorganic materials 0.000 claims description 2
- 238000000034 method Methods 0.000 abstract description 4
- 230000002349 favourable effect Effects 0.000 abstract 1
- 239000011800 void material Substances 0.000 abstract 1
- 229920005989 resin Polymers 0.000 description 11
- 239000011347 resin Substances 0.000 description 11
- 238000010292 electrical insulation Methods 0.000 description 6
- 239000002966 varnish Substances 0.000 description 5
- 238000009472 formulation Methods 0.000 description 4
- 239000000203 mixture Substances 0.000 description 4
- 229920003986 novolac Polymers 0.000 description 4
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 description 3
- RAXXELZNTBOGNW-UHFFFAOYSA-N imidazole Natural products C1=CNC=N1 RAXXELZNTBOGNW-UHFFFAOYSA-N 0.000 description 3
- 238000000465 moulding Methods 0.000 description 3
- PXKLMJQFEQBVLD-UHFFFAOYSA-N bisphenol F Chemical compound C1=CC(O)=CC=C1CC1=CC=C(O)C=C1 PXKLMJQFEQBVLD-UHFFFAOYSA-N 0.000 description 2
- 239000003054 catalyst Substances 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- 239000012535 impurity Substances 0.000 description 2
- 150000002500 ions Chemical class 0.000 description 2
- 229920001187 thermosetting polymer Polymers 0.000 description 2
- HVLLSGMXQDNUAL-UHFFFAOYSA-N triphenyl phosphite Chemical compound C=1C=CC=CC=1OP(OC=1C=CC=CC=1)OC1=CC=CC=C1 HVLLSGMXQDNUAL-UHFFFAOYSA-N 0.000 description 2
- KXGFMDJXCMQABM-UHFFFAOYSA-N 2-methoxy-6-methylphenol Chemical compound [CH]OC1=CC=CC([CH])=C1O KXGFMDJXCMQABM-UHFFFAOYSA-N 0.000 description 1
- 229930185605 Bisphenol Natural products 0.000 description 1
- ZAMOUSCENKQFHK-UHFFFAOYSA-N Chlorine atom Chemical compound [Cl] ZAMOUSCENKQFHK-UHFFFAOYSA-N 0.000 description 1
- -1 Cl- Chemical class 0.000 description 1
- 238000010521 absorption reaction Methods 0.000 description 1
- 229910052801 chlorine Inorganic materials 0.000 description 1
- 239000000460 chlorine Substances 0.000 description 1
- 230000000052 comparative effect Effects 0.000 description 1
- 239000007822 coupling agent Substances 0.000 description 1
- 238000003795 desorption Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000004744 fabric Substances 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 description 1
- 229920001568 phenolic resin Polymers 0.000 description 1
- 239000005011 phenolic resin Substances 0.000 description 1
- 239000002904 solvent Substances 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Landscapes
- Laminated Bodies (AREA)
- Manufacturing Of Printed Wiring (AREA)
Abstract
Description
【０００１】0001
【産業上の利用分野】本発明は、成形性の良好な高電気
絶縁性の熱硬化性樹脂積層板に関するものであり、高密
度プリント配線板に好適に使用される基板を提供するも
のである。[Field of Industrial Application] The present invention relates to a highly electrically insulating thermosetting resin laminate with good moldability, and provides a substrate suitable for use in high-density printed wiring boards. .
【０００２】0002
【従来の技術】従来、電気絶縁性の良好な熱硬化性樹脂
積層板の樹脂配合処方としては、樹脂あるいは硬化剤中
のＣｌ−、Ｂｒ−、ＳＯ４２−、Ｎａ＋、ＮＨ４＋など
のイオンの低減、これらのイオンの脱離の少ない硬化触
媒の使用、又はノボラック型エポキシ樹脂の使用、ある
いはジシアンジアミドの当量の減少、ノボラック型フェ
ノール樹脂硬化剤の使用などの方法があった。これらの
方法はいずれも高電気絶縁化の目的のために有効な方法
であるが、イオン性不純物の低減は費用がかかり、エポ
キシ樹脂や硬化剤の処方については硬化性や成形型の点
で必ずしも満足するものとはなっていない。[Prior Art] Conventionally, resin formulations for thermosetting resin laminates with good electrical insulation include reducing ions such as Cl-, Br-, SO42-, Na+, and NH4+ in the resin or curing agent; There have been methods such as using a curing catalyst that causes less desorption of these ions, using a novolak type epoxy resin, reducing the equivalent weight of dicyandiamide, and using a novolak type phenolic resin curing agent. All of these methods are effective for the purpose of achieving high electrical insulation, but reducing ionic impurities is expensive, and the formulation of epoxy resins and curing agents is not always necessary in terms of curability and molding molds. It is not satisfactory.
【０００３】0003
【発明が解決しようとする課題】このような点から、本
発明は、成形性及び硬化性が良好で、電気絶縁性の良好
なエポキシ樹脂積層板を得ることを目的とするものであ
る。SUMMARY OF THE INVENTION In view of the above, an object of the present invention is to obtain an epoxy resin laminate having good moldability and curability, and good electrical insulation.
【０００４】0004
【課題を解決するための手段】本発明は、エポキシ樹脂
積層板を繊維基材に含浸して得たプリプレグを一枚もし
くは複数枚重ね、この片面又は両面に銅箔を重ね、金属
鏡面板間で加熱加圧成形する積層板の製造方法において
、硬化剤であるジシアンジアミドがエポキシ樹脂１当量
に対し０．３〜０．４当量であり、前記プリプリレグの
融点が９０℃以上であり、かつ銅箔としてシランカップ
リング剤処理をした銅箔を使用することを特徴とする積
層板の製造方法を要旨とするものである。[Means for Solving the Problems] The present invention involves stacking one or more prepregs obtained by impregnating an epoxy resin laminate into a fiber base material, overlaying copper foil on one or both sides of the prepreg, and interposing the mirror-finished metal plates. In the method for producing a laminate in which dicyandiamide as a curing agent is used in an amount of 0.3 to 0.4 equivalent per equivalent of epoxy resin, the melting point of the prepreg is 90°C or higher, and copper foil is used. The gist of this invention is a method for manufacturing a laminate, which is characterized by using copper foil treated with a silane coupling agent.
【０００５】本発明に用いられるエポキシ樹脂は、通常
のエポキシ樹脂積層板に用いられるものであり、ビスフ
ェノールＡ型、ビスフェノールＦ型、ノボラック型など
特に限定されないが、ビスフェノール型のものに少量の
ノボラック型のものを配合した樹脂が、種々の特性の向
上がみられ好ましい。また必要により難燃化のために臭
素化したものを用いることがてきる。なお、当然のこと
であるが、イオン性不純物の少ないものを使用するのが
好ましい。The epoxy resin used in the present invention is one used in ordinary epoxy resin laminates, and is not particularly limited to bisphenol A type, bisphenol F type, novolac type, etc., but bisphenol type and a small amount of novolac type are used. A resin blended with the following is preferable because it shows improvements in various properties. Moreover, if necessary, a brominated material can be used for flame retardancy. Note that, as a matter of course, it is preferable to use a material containing less ionic impurities.
【０００６】次に、硬化剤としてジシアンジアミドを用
いる。通常ジシアンジアミドはエポキシ樹脂に対して０
．５〜０．８当量が適量であるが本発明においては、そ
れより少量用い、０．３〜０．４当量が適当である。
更にイミダゾール、トリフェニルフォスファイト、ＤＢ
Ｕなどの硬化触媒を少量配合する。Next, dicyandiamide is used as a curing agent. Usually dicyandiamide is 0 for epoxy resin.
．． A suitable amount is 5 to 0.8 equivalents, but in the present invention, a smaller amount is used, and 0.3 to 0.4 equivalents are suitable. Furthermore, imidazole, triphenylphosphite, DB
Add a small amount of curing catalyst such as U.
【０００７】このような配合では、硬化性が低下するの
で、ワニスとした後加熱によりゲルタイムを３〜５分／
１７０℃ に調整するのが好ましい。このワニスを繊
維基材に含浸し乾燥してプリプレグとする際、ゲルタイ
ムを１〜１．５分／１７０℃、融点を９０℃以上とした
プリプレグを得るように加熱乾燥する。このようにして
、ジシアンアミドの配合量低減による硬化性の低下を実
質的に防止することができる。ゲルタイムを調整せずに
加熱加圧成形後加熱して後硬化させることもできるが、
積層板の厚み精度が低下することがある。[0007] With such a formulation, curing properties decrease, so after making the varnish, the gel time is increased by 3 to 5 minutes/5 minutes by heating.
It is preferable to adjust the temperature to 170°C. When this varnish is impregnated into a fiber base material and dried to produce a prepreg, the prepreg is heated to obtain a prepreg with a gel time of 1 to 1.5 minutes/170°C and a melting point of 90°C or higher. In this way, a decrease in curability due to a reduction in the amount of dicyanamide blended can be substantially prevented. It is also possible to post-cure by heating after heat-pressure molding without adjusting the gel time.
The thickness accuracy of the laminate may decrease.
【０００８】このように調整したプリプレグを使用する
ことにより、加熱加圧成形時の樹脂の溶解粘度を必要以
上に低下させずに成形が可能となり、かつジシアンアミ
ドの量が少ないので硬化速度はあまり速くなく、樹脂の
基材への浸透や脱泡のための適正な粘度を比較的長い時
間保つこととができる。[0008] By using the prepreg prepared in this way, it is possible to mold the resin during heat and pressure molding without lowering its melt viscosity more than necessary, and since the amount of dicyanamide is small, the curing speed is not too fast. Therefore, it is possible to maintain an appropriate viscosity for a relatively long time to allow the resin to penetrate into the base material and to defoam.
【０００９】このようなプリプレグを従来の表面粗化し
た銅箔とともに成形すると、粗化面への樹脂の浸透及び
粗化面の脱泡が困難であるので、銅箔に、エポキシ樹脂
、好ましくは予め脱泡した塩素エポキシ樹脂をコートす
るか、樹脂の流れをよくするシランシカップリング剤で
処理する必要がある。前者の場合より後者の方が特性及
び取扱いの容易さの点で好ましい。[0009] When such a prepreg is molded together with a conventional copper foil with a roughened surface, it is difficult to penetrate the resin into the roughened surface and to defoam the roughened surface. It is necessary to coat it with a chlorine epoxy resin that has been degassed in advance, or to treat it with a silane coupling agent that improves the flow of the resin. The latter is preferable to the former in terms of properties and ease of handling.
【００１０】0010
【実施例】以下、実施例により本発明を説明する。表１
に示す配合に溶剤を加え、樹脂分５０％のエポキシ樹脂
ワニスを得た。このワニスをガラスクロスに含浸、乾燥
して樹脂分４５％のプリプレグを得た。ワニスのゲルタ
イムとともにプリプレグをゲルタイム及び融点を表１に
示す。[Examples] The present invention will be explained below with reference to Examples. Table 1
A solvent was added to the formulation shown above to obtain an epoxy resin varnish with a resin content of 50%. A glass cloth was impregnated with this varnish and dried to obtain a prepreg with a resin content of 45%. Table 1 shows the gel time and melting point of the prepreg as well as the gel time of the varnish.
【００１１】[0011]
【表１】[Table 1]
【００１２】上記プリプレグ８枚とその表面に銅箔を重
ね、湿度１７０℃、圧力６０Ｋｇ／ｃｍ２で６０分間成
形し、厚さ１．６ｍｍの両面銅張積層板を得た。銅箔は
実施例１，２ではエポキシランカップリング剤で処理し
たもの、実施例３では脱泡したエポキシ樹脂をコートし
たもの、比較例では処理しないものを使用した。得られ
た積層板の特性をその成形性とともに表２に示す。[0012] Eight sheets of the above prepreg and copper foil were layered on their surfaces and molded for 60 minutes at a humidity of 170°C and a pressure of 60 kg/cm2 to obtain a double-sided copper-clad laminate with a thickness of 1.6 mm. The copper foil used in Examples 1 and 2 was treated with an epoxylan coupling agent, in Example 3 it was coated with defoamed epoxy resin, and in the comparative example it was not treated. The properties of the obtained laminate are shown in Table 2 along with its formability.
【００１３】[0013]
【表２】[Table 2]
【００１４】表２から明らかなように、実施例により得
られた積層板は成形性が良好であり、電気絶縁特性もす
ぐれている。As is clear from Table 2, the laminates obtained in the Examples have good moldability and excellent electrical insulation properties.
【００１５】[0015]
【発明の効果】本発明により得られたエポキシ樹脂積層
板は、ボイドの残留がないなど成形性が良好であり、電
気絶縁性、特に吸水後の電気絶縁性が優れている。従っ
て、高密度プリント配線板として使用するに適している
。EFFECTS OF THE INVENTION The epoxy resin laminate obtained by the present invention has good moldability with no residual voids, and has excellent electrical insulation properties, especially electrical insulation properties after water absorption. Therefore, it is suitable for use as a high-density printed wiring board.
Claims (1)
して得たプリプレグを一枚もしくは複数枚重ね、この片
面又は両面に銅箔を重ね、金属鏡面板間で加熱加圧成形
する積層板の製造方法において、硬化剤であるジシアン
ジアミドがエポキシ樹脂１当量に対し０．３〜０．４当
量であり、前記プリプリレグの融点が９０℃以上であり
、かつ銅箔としてシランカップリング剤処理をした銅箔
又はエポキシ樹脂をコートした銅箔を使用することを特
徴とする積層板の製造方法。Claim 1: A laminate in which one or more prepregs obtained by impregnating an epoxy resin laminate into a fiber base material are stacked, copper foil is stacked on one or both sides of the prepreg, and heat and pressure is formed between metal mirror plates. In the manufacturing method, the amount of dicyandiamide as a hardening agent is 0.3 to 0.4 equivalent per equivalent of epoxy resin, the melting point of the prepuri leg is 90 ° C. or higher, and the copper foil is treated with a silane coupling agent. A method for producing a laminate, characterized by using copper foil or copper foil coated with epoxy resin.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP17908591A JPH04348938A (en) | 1991-04-19 | 1991-04-19 | Manufacture of laminated sheet |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP17908591A JPH04348938A (en) | 1991-04-19 | 1991-04-19 | Manufacture of laminated sheet |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH04348938A true JPH04348938A (en) | 1992-12-03 |
Family
ID=16059820
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP17908591A Pending JPH04348938A (en) | 1991-04-19 | 1991-04-19 | Manufacture of laminated sheet |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH04348938A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2007005606A (en) * | 2005-06-24 | 2007-01-11 | Hitachi Chem Co Ltd | Method of manufacturing prepreg for multilayer printed wiring board |
-
1991
- 1991-04-19 JP JP17908591A patent/JPH04348938A/en active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2007005606A (en) * | 2005-06-24 | 2007-01-11 | Hitachi Chem Co Ltd | Method of manufacturing prepreg for multilayer printed wiring board |
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