JPH04344237A - Automatic cutting laminator - Google Patents
Automatic cutting laminatorInfo
- Publication number
- JPH04344237A JPH04344237A JP3145199A JP14519991A JPH04344237A JP H04344237 A JPH04344237 A JP H04344237A JP 3145199 A JP3145199 A JP 3145199A JP 14519991 A JP14519991 A JP 14519991A JP H04344237 A JPH04344237 A JP H04344237A
- Authority
- JP
- Japan
- Prior art keywords
- films
- photosensitive resin
- film
- laminator
- substrate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000005520 cutting process Methods 0.000 title claims abstract description 32
- 239000011347 resin Substances 0.000 claims abstract description 18
- 229920005989 resin Polymers 0.000 claims abstract description 18
- 239000000758 substrate Substances 0.000 claims description 34
- 238000001179 sorption measurement Methods 0.000 claims description 4
- 238000002788 crimping Methods 0.000 claims 1
- 238000010030 laminating Methods 0.000 abstract description 12
- 238000010276 construction Methods 0.000 abstract 1
- 238000005096 rolling process Methods 0.000 abstract 1
- 238000000034 method Methods 0.000 description 8
- 238000003475 lamination Methods 0.000 description 7
- 238000005192 partition Methods 0.000 description 4
- 230000001681 protective effect Effects 0.000 description 4
- 238000004891 communication Methods 0.000 description 2
- 238000001514 detection method Methods 0.000 description 2
- 230000002093 peripheral effect Effects 0.000 description 2
- 238000004804 winding Methods 0.000 description 2
- 230000003749 cleanliness Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000000149 penetrating effect Effects 0.000 description 1
- 230000037303 wrinkles Effects 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
- B32B37/14—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the properties of the layers
- B32B37/16—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the properties of the layers with all layers existing as coherent layers before laminating
- B32B37/22—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the properties of the layers with all layers existing as coherent layers before laminating involving the assembly of both discrete and continuous layers
- B32B37/223—One or more of the layers being plastic
- B32B37/226—Laminating sheets, panels or inserts between two continuous plastic layers
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2457/00—Electrical equipment
- B32B2457/08—PCBs, i.e. printed circuit boards
Landscapes
- Laminated Bodies (AREA)
- Lining Or Joining Of Plastics Or The Like (AREA)
- Manufacturing Of Printed Circuit Boards (AREA)
Abstract
Description
【０００１】0001
【産業上の利用分野】本発明は、レジストとなる感光性
樹脂フィルム（以下、ドライフィルムという）を回路パ
ターン形成用の銅張り積層基板（以下、基板という）に
貼り合わせるための自動カッティングラミネータに関す
る。[Field of Industrial Application] The present invention relates to an automatic cutting laminator for laminating a photosensitive resin film (hereinafter referred to as a dry film) serving as a resist onto a copper-clad laminate board (hereinafter referred to as a substrate) for forming a circuit pattern. .
【０００２】0002
【従来の技術】現在、銅張り積層基板へのレジスト塗布
方法としては、簡便さ、清潔さ、生産性の理由からドラ
イフィルムによりラミネート法が主流を占めている。こ
のラミネート法では、基板にドライフィルムを貼り合わ
せるにあたって、基板とフィルム間に気泡が巻き込まれ
ないようにすることと、しわが発生しないようにするこ
とにも最も注意が払われている。BACKGROUND OF THE INVENTION At present, as a method for applying resist to copper-clad laminated substrates, the lamination method using dry film is the mainstream method for reasons of simplicity, cleanliness, and productivity. In this lamination method, when attaching the dry film to the substrate, the greatest care is taken to prevent air bubbles from getting caught between the substrate and the film and to prevent wrinkles from occurring.
【０００３】このような対策が施された従来のラミネー
タとしては、たとえば特公昭５９−４６１１６号、特開
昭６２−２７１４８号の各公報に記載されるものなどが
知られている。特公昭５９−４６１１６号のものでは、
フィルムを一種のゲート（真空ベイル）に吸着させて、
このゲートを基板面に移動し、ゲートの真空を解除した
あとにフィルムを基板面に貼り付けるようにしている。Conventional laminators with such measures are known, for example, those described in Japanese Patent Publication No. 59-46116 and Japanese Patent Application Laid-open No. 62-27148. In the one of Special Publication No. 59-46116,
The film is adsorbed to a kind of gate (vacuum bail),
This gate is moved to the substrate surface, and after releasing the vacuum at the gate, the film is attached to the substrate surface.
【０００４】また特開昭６２−２７１４８号のものでは
、全周に亙って真空吸着面が形成されている真空ドラム
（予備圧着ロール）と、基板に近接して設けられた真空
吸引用の支持ホルダとを有し、これら真空ドラムと支持
ホルダとでフィルムを吸着保持しながら基板面にフィル
ムが貼り付けられる。[0004] Furthermore, in Japanese Patent Application Laid-Open No. 62-27148, a vacuum drum (preliminary pressure roll) is provided with a vacuum suction surface over its entire circumference, and a vacuum drum (preliminary pressure roll) is provided close to the substrate for vacuum suction. The film is attached to the substrate surface while being attracted and held by the vacuum drum and the support holder.
【０００５】なお、基板面の縁を残してフィルムを貼り
付けるいわゆる額縁ラミネートを行なうものでは、たと
えば特開昭５６−４９５９２号の公報に記載されている
ものが知られている。[0005] For example, there is known a method for performing so-called frame lamination, in which a film is pasted leaving the edges of the substrate surface, as described in Japanese Patent Application Laid-open No. 56-49592.
【０００６】[0006]
【発明が解決しようとする課題】ところで、真空吸引可
能なゲートを用いるラミネータでは、ゲートへのフィル
ムの吸引、ゲートの移動、吸引の解除、ゲートの元位置
への復帰というように、フィルムの送り動作が間欠的と
なってしまう欠点がある。また真空ドラムを用いるもの
では、このドラムの全周が吸着面となっているため、こ
の真空ドラムと本圧着ロール間に真空吸引可能な支持ホ
ルダを設ける必要があり、構成が複雑化する。またこの
ラミネータでは、フィルムの切断をロール上の回転刃に
よって行なっており、切断機構の複雑化を招いている。[Problems to be Solved by the Invention] By the way, in a laminator that uses a gate that can be vacuum-suctioned, the film is fed by suctioning the film to the gate, moving the gate, releasing the suction, and returning the gate to its original position. The disadvantage is that the operation is intermittent. Further, in the case of using a vacuum drum, since the entire circumference of the drum is a suction surface, it is necessary to provide a support holder capable of vacuum suction between the vacuum drum and the main pressure roll, which complicates the structure. Furthermore, in this laminator, the film is cut by a rotary blade on a roll, resulting in a complicated cutting mechanism.
【０００７】本発明は、このような従来の技術が持つ課
題を解決するために提案されたものであり、フィルムの
送りを連続的に行なえるとともに、装置の構成が簡単化
される自動カッティングラミネータを提供することを目
的とする。The present invention has been proposed in order to solve the problems of the conventional technology, and provides an automatic cutting laminator that allows continuous film feeding and simplifies the configuration of the device. The purpose is to provide
【０００８】[0008]
【課題を解決するための手段】この目的を達成するため
に本発明は、送り込まれる感光性樹脂フィルムを真空吸
引用回転ロールのロール面に吸着させながら基板面に導
くとともに、切断手段によって所要の貼り付け長さに切
断した感光性樹脂フィルムを基板面に圧着するラミネー
タにおいて、送り込まれる感光性樹脂フィルムがローラ
面と接触する部位から基板面に接触する部位までの範囲
、すなわち実質的にフィルムを吸着移送するのに必要な
所要範囲だけに吸着面部が形成される真空吸引用回転ロ
ールによって感光性樹脂フィルムを吸着して、この感光
性樹脂フィルムを基板面に導いて圧着することを特徴と
する。[Means for Solving the Problems] In order to achieve this object, the present invention has a method of guiding a photosensitive resin film fed in to a substrate surface while adhering it to the roll surface of a rotary roll for vacuum suction, and cutting it into the required size by cutting means. In a laminator that pressure-bonds a photosensitive resin film cut to the attachment length onto a substrate surface, the area where the photosensitive resin film being fed is in contact with the roller surface to the area where it contacts the substrate surface, that is, the film is substantially The photosensitive resin film is adsorbed by a rotating roll for vacuum suction, in which an adsorption surface portion is formed only in the required range for adsorption and transfer, and the photosensitive resin film is guided to the substrate surface and pressure-bonded. .
【０００９】また本発明は、上記切断手段が、フィルム
の幅方向に張られた熱線によって感光性樹脂フィルムを
切断する熱線切断装置により構成される。Further, in the present invention, the cutting means is constituted by a hot wire cutting device that cuts the photosensitive resin film with a hot wire stretched in the width direction of the film.
【００１０】0010
【作用】上述した請求項１に対応する構成によれば、真
空吸引用回転ロールの所要範囲だけに吸着面部が形成さ
れているので、不要な部位でフィルムが吸着されず、動
作タイミングに応じた吸引の解除などの操作が不要とな
る。したがって、連続的にフィルムを吸引移送しながら
基板にラミネートできる。[Operation] According to the structure corresponding to claim 1 described above, since the suction surface portion is formed only in the required range of the rotary roll for vacuum suction, the film is not suctioned in unnecessary areas and Operations such as canceling suction are not required. Therefore, the film can be laminated onto the substrate while being continuously transferred by suction.
【００１１】また請求項２に対応する構成によれば、熱
線切断装置によって切断手段が構成されるので、フィル
ムの切断を瞬時に行なうことができる。したがって、真
空吸引用回転ロール上に回転刃を設ける場合のように、
フィルム切断時に回転ロールの回転を一時的に停止して
フィルムを切断する必要がなく、真空吸引用回転ロール
によって連続的にフィルムを移送しながらフィルムの切
断も行なえる。Further, according to the structure corresponding to claim 2, since the cutting means is constituted by a hot wire cutting device, the film can be cut instantly. Therefore, as in the case where a rotary blade is provided on a rotary roll for vacuum suction,
When cutting the film, there is no need to temporarily stop the rotation of the rotating roll to cut the film, and the film can be cut while being continuously transported by the vacuum suction rotating roll.
【００１２】0012
【実施例】以下、本発明による自動カッティングラミネ
ータの具体的な実施例を図面に基づき詳細に説明する。
図１に、このラミネータの一実施例を示す。DESCRIPTION OF THE PREFERRED EMBODIMENTS Specific embodiments of the automatic cutting laminator according to the present invention will be described in detail below with reference to the drawings. FIG. 1 shows an embodiment of this laminator.
【００１３】この図で、上側のロール１ａに巻かれた感
光性樹脂フィルム（ドライフィルム）２ａは、送りロー
ル３ａ，４ａによってロール１ａから引き出され、熱線
切断装置（ヒートカッタ）５ａを経て、上側ラミネート
ロール６ａに送り出される。また下側のロール１ｂから
送りロール３ｂ，４ｂによって引き出されたドライフィ
ルム２ｂは、熱線切断装置５ｂを経て、下側ラミネート
ロール６ｂに送り出される。このときフィルム面に貼り
付けられていた保護フィルム７ａ，７ｂは、剥離ロール
８ａ，８ｂによって剥がされ、保護フィルム巻取りロー
ル９ａ，９ｂにそれぞれ巻き取られる。In this figure, a photosensitive resin film (dry film) 2a wound around the upper roll 1a is pulled out from the roll 1a by feed rolls 3a and 4a, passed through a hot wire cutting device (heat cutter) 5a, and then cut into the upper roll 1a. It is sent out to a laminating roll 6a. Further, the dry film 2b drawn out from the lower roll 1b by the feed rolls 3b and 4b is sent out to the lower lamination roll 6b via a hot wire cutting device 5b. At this time, the protective films 7a and 7b stuck to the film surface are peeled off by peeling rolls 8a and 8b, and wound up by protective film winding rolls 9a and 9b, respectively.
【００１４】熱線切断装置５ａ，５ｂは、フィルム２ａ
，２ｂの幅方向に亙って熱線１０ａ，１０ｂを張架する
切断部１１ａ，１１ｂがフィルム２ａ，２ｂの切断動作
時にシリンダ１２ａ，１２ｂによって駆動されてフィル
ム面方向に移動するようになっており、このとき熱線１
０ａ，１０ｂがフィルム面に接触し、フィルム２ａ，２
ｂが幅方向に亙って瞬時に切断される。The hot wire cutting devices 5a and 5b cut the film 2a.
, 2b, which extend the hot wires 10a, 10b across the width of the films 2a, 2b, are driven by cylinders 12a, 12b to move in the direction of the film surface during the cutting operation of the films 2a, 2b. , at this time hot wire 1
0a and 10b contact the film surface, and the films 2a and 2
b is instantly cut across the width direction.
【００１５】真空吸引用回転ロールを構成するラミネー
トロール６ａ，６ｂは、図２に示すように固定シャフト
１３の外周部に軸受１４を介して回転ドラム１５が間隔
を隔てて回転自在に設けられている。回転ドラム１５に
は、固定シャフト１３側に貫通する多数の吸引口１４が
フィルム２ａ，２ｂの幅わたりに全周に亙って穿設され
ている。固定シャフト１３の中心部には、外部の真空源
に接続される吸引路１６が軸方向に形成されている。固
定シャフト１３の外周部には、図３に示すように回転ド
ラム１５の内周面に気密に摺接し、回転ドラム面１５Ａ
に形成される吸着面部１７の範囲を決める２つの隔壁１
８，１８が突設されている。これら隔壁１８，１８は、
シャフト中心に対してたとえば９０°の角度で突出して
おり、隔壁１８，１８と回転ドラム１５、固定シャフト
１３間に真空室１９が形成される。この真空室１９とシ
ャフト１３側の吸引路１６は、複数の連通孔２０によっ
て接続されている。これにより回転ドラム面１５Ａには
固定シャフト１３によって定められる位置と範囲に吸着
面部１７が形成され、この吸着面部１７から外れたフィ
ルム２ａ，２ｂは自動的に吸着が解除されて、ドラム面
１５Ａから剥離される。As shown in FIG. 2, the laminate rolls 6a and 6b constituting the vacuum suction rotary rolls include rotary drums 15 rotatably provided at a spaced interval on the outer periphery of a fixed shaft 13 via bearings 14. There is. A large number of suction ports 14 penetrating toward the fixed shaft 13 are provided in the rotating drum 15 over the entire circumference across the width of the films 2a and 2b. A suction path 16 connected to an external vacuum source is formed in the center of the fixed shaft 13 in the axial direction. As shown in FIG. 3, the outer peripheral portion of the fixed shaft 13 is in airtight sliding contact with the inner peripheral surface of the rotating drum 15, and has a rotating drum surface 15A.
Two partition walls 1 that determine the range of the suction surface portion 17 formed in
8 and 18 are provided protrudingly. These partition walls 18, 18 are
It protrudes at an angle of, for example, 90 degrees with respect to the center of the shaft, and a vacuum chamber 19 is formed between the partition walls 18, 18, the rotating drum 15, and the fixed shaft 13. This vacuum chamber 19 and the suction path 16 on the shaft 13 side are connected through a plurality of communication holes 20 . As a result, a suction surface portion 17 is formed on the rotating drum surface 15A at a position and range determined by the fixed shaft 13, and the films 2a and 2b that have come off the suction surface portion 17 are automatically released from suction and are removed from the drum surface 15A. Peeled off.
【００１６】この吸着面部１７は、送り込まれるドライ
フィルム２ａ，２ｂがドラム面１５Ａと接触する部位か
ら基板２１面に接触する部位までの範囲、すなわち実質
的にフィルム２ａ，２ｂを吸着移送するのに必要な所要
範囲だけに上下のラミネートロール６ａ，６ｂにそれぞ
れ形成されており（図１参照）、これら吸着面部１７，
１７によってフィルム２ａ，２ｂの吸着移送が行なわれ
る。The suction surface portion 17 is designed to cover a range from a portion where the dry films 2a and 2b that are fed in contact with the drum surface 15A to a portion where they contact the surface of the substrate 21, that is, to substantially suction and transfer the films 2a and 2b. These suction surface portions 17,
17, the films 2a and 2b are attracted and transferred.
【００１７】上下のラミネートロール６ａ，６ｂ間には
、送りロール２２によって基板２１が送り込まれ、ラミ
ネートロール６ａ，６ｂ間を出た基板２１は、ロール２
３ａ，２３ｂ間を通過して送り出される。A substrate 21 is fed between the upper and lower lamination rolls 6a and 6b by a feed roll 22, and the substrate 21 that has passed between the lamination rolls 6a and 6b is transferred to the roll 2.
It passes between 3a and 23b and is sent out.
【００１８】つぎに、このように構成される自動カッテ
ィングラミネータの動作を説明する。まず、図示しない
基板検出センサによって基板２１の前端が検出されると
、フィルム２ａ，２ｂが、回転するラミネートロール６
ａ，６ｂに送り込まれ、フィルム２ａ，２ｂの先端縁が
ラミネートロール６ａ，６ｂの吸着面部１７，１７に吸
着される。フィルム２ａ，２ｂは吸着状態のまま、回転
するラミネートロール６ａ，６ｂによって基板２１の表
裏面にそれぞれ運ばれ、上下のラミネートロール６ａ，
６ｂにより基板２１の先端からやや後退した位置にフィ
ルム先端縁が熱圧着される。フィルム先端縁が基板２１
の表裏に固着されたあとは、回転するドラム面１５Ａの
吸着面部１７，１７の範囲から外れ、フィルム先端縁の
吸着は自動的に解除される。以降は、回転する上下のラ
ミネートロール６ａ，６ｂによってフィルム２ａ，２ｂ
が吸着されながら連続して基板面に送り込まれ、基板２
１の表裏にラミネートされていく。Next, the operation of the automatic cutting laminator constructed as described above will be explained. First, when the front end of the substrate 21 is detected by a substrate detection sensor (not shown), the films 2a and 2b are transferred to the rotating laminating roll 6.
a, 6b, and the leading edges of the films 2a, 2b are attracted to the attraction surfaces 17, 17 of the laminating rolls 6a, 6b. The films 2a and 2b are carried to the front and back surfaces of the substrate 21 by the rotating laminating rolls 6a and 6b, respectively, while remaining in an adsorbed state, and are then moved to the upper and lower laminating rolls 6a, 6b.
6b, the leading edge of the film is thermocompression bonded to a position slightly set back from the leading end of the substrate 21. The leading edge of the film is the substrate 21
After being fixed to the front and back sides of the film, the film moves out of the range of the suction surfaces 17, 17 of the rotating drum surface 15A, and the suction of the leading edge of the film is automatically released. After that, the films 2a, 2b are separated by the rotating upper and lower laminating rolls 6a, 6b.
is continuously fed to the substrate surface while being attracted, and the substrate 2
The front and back sides of 1 are laminated.
【００１９】基板検出センサによって基板２１の後端が
検出されると、額縁ラミネートを行ないうる適切な位置
で上下のフィルム２ａ，２ｂが熱線切断装置５ａ，５ｂ
によってそれぞれ切断される。フィルム２ａ，２ｂが基
板２１の表裏面に完全に貼り付けられると、図４に示す
ように額縁状にドライフィルム２ａ，２ｂを圧着したラ
ミネート基板２４が作られる。なお、上下のラミネート
ロール６ａ，６ｂの径は同一のものであってもよい。When the rear end of the substrate 21 is detected by the substrate detection sensor, the upper and lower films 2a, 2b are cut by hot wire cutting devices 5a, 5b at appropriate positions where frame lamination can be performed.
are respectively disconnected by. When the films 2a and 2b are completely attached to the front and back surfaces of the substrate 21, a laminate substrate 24 is produced in which the dry films 2a and 2b are pressed into a picture frame shape as shown in FIG. Note that the diameters of the upper and lower laminating rolls 6a and 6b may be the same.
【００２０】[0020]
【発明の効果】以上説明したように本発明によれば、フ
ィルムの吸着移送に必要な所要範囲だけに吸着面部が形
成される真空吸引用ロールを用いているので、フィルム
の送りが連続的になるとともに、従来用いていた吸引可
能な支持ホルダが不要となり、装置の構成が簡単化され
る。[Effects of the Invention] As explained above, according to the present invention, since a vacuum suction roll is used in which the suction surface portion is formed only in the required area for suction and transfer of the film, the film can be fed continuously. At the same time, the conventionally used suctionable support holder is no longer necessary, and the configuration of the device is simplified.
【００２１】また熱線切断方式を採用しているので、従
来のような回転刃による切断方式に比べ速やかな切断動
作が可能となるとともに、大幅に切断機構が簡略化され
る。Furthermore, since the hot wire cutting method is adopted, it is possible to perform a cutting operation more quickly than the conventional cutting method using a rotary blade, and the cutting mechanism is greatly simplified.
【図１】本発明による自動カッティングラミネータの一
実施例を示す構成図である。FIG. 1 is a configuration diagram showing an embodiment of an automatic cutting laminator according to the present invention.
【図２】図１のラミネータに用いられるラミネートロー
ルの断面図である。FIG. 2 is a sectional view of a laminate roll used in the laminator of FIG. 1.
【図３】図２のＡ−Ａ線断面図である。FIG. 3 is a sectional view taken along line AA in FIG. 2;
【図４】ドライフィルムがラミネートされた基板の平面
図である。FIG. 4 is a plan view of a substrate laminated with a dry film.
１ａ，１ｂ ロール
２ａ，２ｂ 感光性樹脂フィルム
３ａ，３ｂ，４ａ，４ｂ 送りロール５ａ，５ｂ
熱線切断装置
６ａ，６ｂ ラミネートロール
７ａ，７ｂ 保護フィルム
８ａ，８ｂ 剥離ロール
９ａ，９ｂ 保護フィルム巻取りロール１０ａ，１０
ｂ 熱線
１１ａ，１１ｂ 切断部
１２ａ，１２ｂ シリンダ
１３ 固定シャフト
１５ 回転ドラム
１５Ａ ドラム面
１６ 吸引路
１７ 吸着面部
１８ 隔壁
１９ 真空室
２０ 連通孔
２１ 基板
２２ 送りロール
２３ａ，２３ｂ ロール
２４ ラミネート基板1a, 1b Rolls 2a, 2b Photosensitive resin films 3a, 3b, 4a, 4b Feeding rolls 5a, 5b
Hot wire cutting devices 6a, 6b Laminating rolls 7a, 7b Protective films 8a, 8b Peeling rolls 9a, 9b Protective film winding rolls 10a, 10
b Hot wires 11a, 11b Cutting portions 12a, 12b Cylinder 13 Fixed shaft 15 Rotating drum 15A Drum surface 16 Suction path 17 Adsorption surface portion 18 Partition wall 19 Vacuum chamber 20 Communication hole 21 Substrate 22 Feed rolls 23a, 23b Roll 24 Laminated substrate
Claims (2)
空吸引用回転ロールのロール面に吸着させながら基板面
に導くとともに、切断手段によって所要の貼り付け長さ
に切断した感光性樹脂フィルムを基板面に圧着するラミ
ネータにおいて、実質的にフィルムを吸着移送するのに
必要な所要範囲だけに吸着面部が形成される真空吸引用
回転ロールによって感光性樹脂フィルムを吸着して、こ
の感光性樹脂フィルムを基板面に導いて圧着することを
特徴とする自動カッティングラミネータ。Claim 1: The photosensitive resin film being sent in is guided to the substrate surface while being adsorbed to the roll surface of a rotating roll for vacuum suction, and the photosensitive resin film cut to the required attachment length by a cutting means is placed on the substrate surface. In the laminator that presses the photosensitive resin film, the photosensitive resin film is adsorbed by a rotating roll for vacuum suction, which has an adsorption surface area only in the necessary area to absorb and transfer the film, and then the photosensitive resin film is attached to the substrate surface. An automatic cutting laminator that is characterized by guiding and crimping.
張られた熱線によって感光性樹脂フィルムを切断する熱
線切断装置により構成されることを特徴とする請求項１
記載の自動カッティングラミネータ。2. Claim 1, wherein the cutting means is constituted by a hot wire cutting device that cuts the photosensitive resin film with a hot wire stretched in the width direction of the film.
Automatic cutting laminator as described.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3145199A JPH04344237A (en) | 1991-05-22 | 1991-05-22 | Automatic cutting laminator |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3145199A JPH04344237A (en) | 1991-05-22 | 1991-05-22 | Automatic cutting laminator |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH04344237A true JPH04344237A (en) | 1992-11-30 |
Family
ID=15379708
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP3145199A Pending JPH04344237A (en) | 1991-05-22 | 1991-05-22 | Automatic cutting laminator |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH04344237A (en) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH06244538A (en) * | 1993-02-03 | 1994-09-02 | Morton Internatl Spa | Method and apparatus for removing cover sheet from laminated substrate |
| JPH0994882A (en) * | 1995-09-29 | 1997-04-08 | Washin Kogyo Kk | Laminator |
| JP2001076743A (en) * | 1999-07-02 | 2001-03-23 | Toyota Motor Corp | Thin film laminating device |
| US6618939B2 (en) * | 1998-02-27 | 2003-09-16 | Kabushiki Kaisha Miyake | Process for producing resonant tag |
| JP2006523150A (en) * | 2003-03-21 | 2006-10-12 | サン−ゴバン グラス フランス | Method for arranging functional film on substrate such as glass sheet and film coating apparatus for carrying out the method |
-
1991
- 1991-05-22 JP JP3145199A patent/JPH04344237A/en active Pending
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH06244538A (en) * | 1993-02-03 | 1994-09-02 | Morton Internatl Spa | Method and apparatus for removing cover sheet from laminated substrate |
| JPH0994882A (en) * | 1995-09-29 | 1997-04-08 | Washin Kogyo Kk | Laminator |
| US6618939B2 (en) * | 1998-02-27 | 2003-09-16 | Kabushiki Kaisha Miyake | Process for producing resonant tag |
| US7256738B2 (en) | 1998-02-27 | 2007-08-14 | Kabushiki Kaisha Miyake | Resonant circuits |
| JP2001076743A (en) * | 1999-07-02 | 2001-03-23 | Toyota Motor Corp | Thin film laminating device |
| JP2006523150A (en) * | 2003-03-21 | 2006-10-12 | サン−ゴバン グラス フランス | Method for arranging functional film on substrate such as glass sheet and film coating apparatus for carrying out the method |
| JP4653074B2 (en) * | 2003-03-21 | 2011-03-16 | サン−ゴバン グラス フランス | Method for arranging functional film on substrate such as glass sheet and film coating apparatus for carrying out the method |
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