JPH04341564A - Vacuum deposition device - Google Patents
Vacuum deposition deviceInfo
- Publication number
- JPH04341564A JPH04341564A JP14259491A JP14259491A JPH04341564A JP H04341564 A JPH04341564 A JP H04341564A JP 14259491 A JP14259491 A JP 14259491A JP 14259491 A JP14259491 A JP 14259491A JP H04341564 A JPH04341564 A JP H04341564A
- Authority
- JP
- Japan
- Prior art keywords
- prevention plate
- evaporation
- slits
- slit
- deposition
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000001771 vacuum deposition Methods 0.000 title abstract 3
- 238000001704 evaporation Methods 0.000 claims abstract description 62
- 238000000151 deposition Methods 0.000 claims abstract description 41
- 230000008021 deposition Effects 0.000 claims abstract description 39
- 239000002245 particle Substances 0.000 claims abstract description 28
- 230000008020 evaporation Effects 0.000 claims description 57
- 230000002265 prevention Effects 0.000 claims description 56
- 238000007738 vacuum evaporation Methods 0.000 claims description 10
- 238000010438 heat treatment Methods 0.000 description 5
- 238000010586 diagram Methods 0.000 description 3
- 239000000428 dust Substances 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 239000007789 gas Substances 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 238000007740 vapor deposition Methods 0.000 description 2
- 230000002411 adverse Effects 0.000 description 1
- 239000003990 capacitor Substances 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 239000003989 dielectric material Substances 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- 238000007689 inspection Methods 0.000 description 1
- 238000012423 maintenance Methods 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 238000009751 slip forming Methods 0.000 description 1
- 238000001179 sorption measurement Methods 0.000 description 1
Abstract
Description
【０００１】0001
【産業上の利用分野】この発明は、真空中で各種金属や
セラミック、有機物等の電導体、絶縁誘導体、焦電体を
被処理物に蒸着するときに用いられる真空蒸着装置に関
するものである。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a vacuum evaporation apparatus used to evaporate various metals, ceramics, organic conductors, insulating dielectrics, and pyroelectric materials onto objects to be treated in vacuum.
【０００２】0002
【従来の技術】従来の真空蒸着装置は図９に示されてお
り、同図において、真空槽１内の上部には固定又は移動
自在な被処理物２が配置され、下部には蒸発源３が配置
され、両者の間には移動自在なシャッタ４が配置されて
いる。更に、被処理物２とシャッタ４との間にはマスク
５が配置されている。なお、図中、６は蒸発源３に接続
された蒸発電源、７は真空槽１内を真空排気する真空排
気系である。2. Description of the Related Art A conventional vacuum evaporation apparatus is shown in FIG. 9, in which a fixed or movable workpiece 2 is placed in the upper part of a vacuum chamber 1, and an evaporation source 3 is placed in the lower part. A movable shutter 4 is arranged between the two. Further, a mask 5 is arranged between the object 2 and the shutter 4. In the figure, 6 is an evaporation power source connected to the evaporation source 3, and 7 is an evacuation system that evacuates the inside of the vacuum chamber 1.
【０００３】このような真空蒸着用蒸発源においては、
蒸発源３が十分に蒸発可能な状態になってから、シャッ
タ４を開くと、蒸発源３より蒸発した粒子がマスク５の
穴を通過して、被処理物２に蒸着される。その場合、蒸
発した粒子の蒸発分布にしたがって被処理物２が蒸着さ
れる。なお、蒸着後はシャッタ４が閉じられる。[0003] In such an evaporation source for vacuum evaporation,
When the shutter 4 is opened after the evaporation source 3 is in a state where it can evaporate sufficiently, the particles evaporated from the evaporation source 3 pass through the holes in the mask 5 and are deposited on the object 2 to be processed. In that case, the object to be processed 2 is deposited according to the evaporation distribution of the evaporated particles. Note that the shutter 4 is closed after the vapor deposition.
【０００４】0004
【発明が解決しようとする課題】従来の真空蒸着用蒸発
源は、蒸発源３より粒子が蒸発するとき、その蒸発粒子
の飛翔を制限する障害物がないため、蒸発粒子の指向性
が少なくなり、被処理物２以外の不必要な部分にも蒸発
粒子が蒸着して、真空槽１内を汚すと共に、電子部品の
制作上に悪影響を及ぼす塵を発生させる問題があった。
また、真空槽１内を汚した蒸着物を除去することが難し
いうえ、真空槽１内を大気に戻したときには、真空槽１
内に蒸着した蒸着物が酸化したり、あるいは水分を吸着
したりするため、真空槽１内を再度真空排気する際、そ
れらがガスを放出して、真空槽１内を良好な真空状態に
再生することが出来なくなる問題が起きた。更に、指向
性をもたせた蒸発源３が１個しか存在していなかったた
め、被処理物２に多層膜を形成することが出来ない等の
問題があった。[Problem to be Solved by the Invention] In the conventional evaporation source for vacuum evaporation, when particles are evaporated from the evaporation source 3, there is no obstacle that restricts the flight of the evaporated particles, so the directionality of the evaporated particles is reduced. However, there is a problem in that the evaporated particles are deposited on unnecessary parts other than the object to be processed 2, contaminating the inside of the vacuum chamber 1, and generating dust that has an adverse effect on the production of electronic parts. Furthermore, it is difficult to remove deposits that have contaminated the inside of the vacuum chamber 1, and when the inside of the vacuum chamber 1 is returned to the atmosphere,
The vapor deposited inside the chamber oxidizes or adsorbs moisture, so when the inside of the vacuum chamber 1 is evacuated again, these gases are released and the inside of the vacuum chamber 1 is restored to a good vacuum state. A problem arose that made it impossible to do so. Furthermore, since there was only one directional evaporation source 3, there was a problem that a multilayer film could not be formed on the object 2 to be treated.
【０００５】この発明の目的は、従来の上記問題を解決
して、真空槽内で汚れおよびゴミを発生させず、大気に
戻された真空槽内を再度真空排気する際にガスの放出を
少なくでき、しかも、被処理物に指向性を持った多層膜
を形成することの可能な真空蒸着装置を提供することで
ある。An object of the present invention is to solve the above-mentioned conventional problems, to prevent the generation of dirt and dust in the vacuum chamber, and to reduce the release of gas when the vacuum chamber is evacuated again after being returned to the atmosphere. It is an object of the present invention to provide a vacuum evaporation apparatus capable of forming a directional multilayer film on an object to be processed.
【０００６】[0006]
【課題を解決するための手段】上記目的を達成するため
に、この発明は、蒸発源より蒸発した蒸発粒子を被処理
物に蒸着させる真空蒸着装置において、前記蒸発源を複
数個配置すると共に、前記各蒸発源と被処理物との間に
、前記蒸発粒子の指向性を持って通過するスリットを備
えた固定防着板と、同じく前記蒸発粒子の通過するスリ
ットを備えた回転防着板とを配設し、前記回転防着板の
回転により、前記固定防着板のスリットと前記回転防着
板のスリットとの少なくとも一部が重なったときのみ、
前記蒸発源より蒸発した蒸発粒子が各スリットを通過し
て、被処理物に多層膜を形成することを特徴とするもの
である。[Means for Solving the Problems] In order to achieve the above object, the present invention provides a vacuum evaporation apparatus for depositing evaporated particles evaporated from an evaporation source onto a workpiece, in which a plurality of evaporation sources are arranged, and A fixed deposition prevention plate provided with a slit through which the evaporated particles pass with directionality, and a rotary deposition prevention plate provided with a slit through which the evaporated particles pass, between each of the evaporation sources and the object to be treated. only when the slits of the fixed deposition-proofing plate and the slits of the rotating deposition-proofing plate overlap at least partially due to the rotation of the rotating deposition-proofing plate,
This method is characterized in that the evaporated particles evaporated from the evaporation source pass through each slit to form a multilayer film on the object to be processed.
【０００７】[0007]
【作用】この発明においては、回転防着板を回転させ、
固定防着板のスリットと回転防着板のスリットとの少な
くとも一部が重なると、１個の蒸発源より蒸発した蒸発
粒子が各スリットを通過して、その蒸発粒子による膜が
被処理物に形成される。その後、上記各スリット同士が
重ならないように上記回転防着板の回転を制御させ、そ
して、上記回転防着板と別の回転防着板を回転させると
共に、その他の蒸発源を加熱させると、その他の蒸発源
より蒸発した蒸発粒子は、上記と同じ要領にて、被処理
物に既に形成されている膜の上に別の膜を形成して、被
処理物に多層膜を形成するようになる。[Operation] In this invention, the rotary adhesion prevention plate is rotated,
When at least a portion of the slits on the fixed deposition prevention plate and the slits on the rotating deposition prevention plate overlap, evaporated particles evaporated from one evaporation source pass through each slit, and a film of the evaporated particles is formed on the object to be treated. It is formed. After that, the rotation of the rotary deposition prevention plate is controlled so that the slits do not overlap with each other, and the rotary deposition prevention plate and another rotary deposition prevention plate are rotated, and the other evaporation sources are heated, The evaporated particles evaporated from other evaporation sources form another film on top of the film already formed on the object to be processed, in the same manner as above, to form a multilayer film on the object to be processed. Become.
【０００８】[0008]
【実施例】以下、この発明の実施例について図面を参照
しながら説明する。この発明の第１実施例の真空蒸着装
置は図１および図２に示されており、同図において、仕
切弁１１を介して被処理物セット室１２に連通された蒸
着室１３内には被処理物１４が配置され、その被処理物
１４は蒸着室１３外の駆動源１５によって回転速度の調
整や移動が可能になっている。蒸着室１３の下部には仕
切弁１６を介して蒸発室１７と、同じく仕切弁１８を介
して蒸発室１９とが並列に連通されている。蒸発室１７
内には被処理物１４方向にスリット２０ａを備えた固定
防着板２０と、その内側に位置するスリット２１ａを備
えた回転防着板２１と、その回転防着板２１内に設けら
れた蒸発源２２とが収容され、また、蒸発室１９内にも
被処理物１４方向にスリット２３ａを備えた固定防着板
２３と、その内側に位置するスリット２４ａを備えた回
転防着板２４と、その回転防着板２４内に設けられた蒸
発源２５とが収容されている。蒸発室１７の詳細は図２
および図３に示されている。Embodiments Hereinafter, embodiments of the present invention will be described with reference to the drawings. A vacuum evaporation apparatus according to a first embodiment of the present invention is shown in FIGS. A processing object 14 is arranged, and the rotational speed of the processing object 14 can be adjusted and moved by a drive source 15 outside the vapor deposition chamber 13. At the bottom of the deposition chamber 13, an evaporation chamber 17 and an evaporation chamber 19 are communicated in parallel via a gate valve 16 and an evaporation chamber 19 via a gate valve 18, respectively. Evaporation chamber 17
Inside, there is a fixed deposition prevention plate 20 with a slit 20a in the direction of the object to be treated 14, a rotating deposition prevention plate 21 with a slit 21a located inside the fixed deposition prevention plate 20, and an evaporation prevention plate 21 provided inside the rotational deposition prevention plate 21. A fixed adhesion prevention plate 23 in which the source 22 is housed and also provided with a slit 23a in the direction of the object to be treated 14 in the evaporation chamber 19, and a rotary adhesion prevention plate 24 provided with a slit 24a located inside the fixed adhesion prevention plate 23, An evaporation source 25 provided within the rotational deposition prevention plate 24 is accommodated. Details of the evaporation chamber 17 are shown in Figure 2.
and shown in FIG.
【０００９】なお、図１、図２、図３および図４におい
て、２６は仕切弁、２７はマスク、２８は真空排気弁、
２９は真空ポンプ、３０は加熱源である。In addition, in FIGS. 1, 2, 3 and 4, 26 is a gate valve, 27 is a mask, 28 is a vacuum exhaust valve,
29 is a vacuum pump, and 30 is a heating source.
【００１０】上記第１実施例においては、真空中に被処
理物セット室１２より蒸着室１３内に移動されてきた被
処理物１４に膜を形成する場合、まず、仕切弁１６を開
き、蒸発室１７内の蒸発源２２を加熱して、蒸発源２２
より蒸発粒子を蒸発させながら、回転防着板２１を回転
させる。回転防着板２１の回転により、回転防着板２１
のスリット２１ａと固定防着板２０のスリット２０ａと
の少なくとも一部が重なると、蒸発源２２より蒸発した
蒸発粒子が各スリット２１ａ、２０ａを通過して、蒸発
粒子による膜が被処理物１４に形成される。In the first embodiment, when forming a film on the workpiece 14 that has been moved from the workpiece setting chamber 12 into the evaporation chamber 13 in vacuum, the gate valve 16 is first opened and the evaporation starts. By heating the evaporation source 22 in the chamber 17, the evaporation source 22
The rotational adhesion prevention plate 21 is rotated while further evaporating the evaporated particles. Due to the rotation of the rotational deposition prevention plate 21, the rotational deposition prevention plate 21
When at least a portion of the slit 21a and the slit 20a of the fixed adhesion prevention plate 20 overlap, the evaporated particles evaporated from the evaporation source 22 pass through each slit 21a and 20a, and a film of evaporated particles is formed on the object 14 to be treated. It is formed.
【００１１】その後、蒸発源２２の加熱を停止させ、そ
の代わりに、仕切弁１８を開いて、蒸発室１９内の蒸発
源２５を加熱させながら、回転防着板２４を回転させる
。回転防着板２４の回転により、回転防着板２４のスリ
ット２４ａと固定防着板２３のスリット２３ａとの少な
くとも一部が重なると、蒸発源２５より蒸発した蒸発粒
子が各スリット２４ａ、２３ａを通過して、蒸発粒子に
よる膜が被処理物１４既に形成されている膜の上に別の
膜が形成され、被処理物に多層膜が形成されるようにな
る。その場合、膜厚は回転防着板２１、２４の回転速度
やスリットの巾に影響される。また、蒸発源２２および
蒸発源２５の同時加熱で、仕切弁１６、１８の同時開放
のまま回転防着板２１、２４の相互づらし制御により連
続的多層膜が形成される。なお、第１実施例では仕切弁
１６、１８を閉じることにより、蒸発室１７、１９を蒸
着室１３より区切ることが出来るので、蒸発室１７、１
９の保守、点検等が容易になる。Thereafter, the heating of the evaporation source 22 is stopped, and instead of this, the gate valve 18 is opened and the rotary adhesion prevention plate 24 is rotated while the evaporation source 25 in the evaporation chamber 19 is heated. When the rotation of the rotary deposition prevention plate 24 causes at least a portion of the slit 24a of the rotational deposition prevention plate 24 and the slit 23a of the fixed deposition prevention plate 23 to overlap, the evaporated particles evaporated from the evaporation source 25 pass through each slit 24a, 23a. As the evaporated particles pass through the object 14, another film is formed on the already formed film, and a multilayer film is formed on the object. In that case, the film thickness is influenced by the rotational speed of the rotational adhesion prevention plates 21 and 24 and the width of the slit. Moreover, by simultaneous heating of the evaporation source 22 and the evaporation source 25, a continuous multilayer film is formed by controlling the rotational adhesion prevention plates 21 and 24 to shift relative to each other while the gate valves 16 and 18 are simultaneously opened. In the first embodiment, the evaporation chambers 17 and 19 can be separated from the deposition chamber 13 by closing the gate valves 16 and 18.
9, maintenance, inspection, etc. become easier.
【００１２】次に、第２実施例が図５に示されているが
、この第２実施例は被処理物４１が回転又は直線運動を
するもので、３個の蒸発源４２、４３、４４が使用され
ている。図中、４５、４６、４７は固定防着板、４５ａ
、４６ａ、４７ａは固定防着板のスリット、４８、４９
、５０は回転防着板、４８ａ、４９ａ、５０ａは回転防
着板のスリットである。Next, a second embodiment is shown in FIG. 5, in which the object 41 to be treated rotates or moves linearly, and three evaporation sources 42, 43, 44 are used. is used. In the figure, 45, 46, 47 are fixed attachment prevention plates, 45a
, 46a, 47a are slits of the fixed adhesion prevention plate, 48, 49
, 50 is a rotational adhesion prevention plate, and 48a, 49a, and 50a are slits in the rotational adhesion prevention plate.
【００１３】次に、第３実施例が図６および図７に示さ
れているが、これらの図において、固定防着板６１や回
転防着板６２は平板である。図中、６０は被処理物、６
１ａは固定防着板のスリット、６２ａは回転防着板のス
リット、６３は蒸発源、６４は加熱源、６５は被処理物
回転式取付台である。Next, a third embodiment is shown in FIGS. 6 and 7, and in these figures, the fixed deposition prevention plate 61 and the rotating deposition prevention plate 62 are flat plates. In the figure, 60 is the object to be processed, 6
1a is a slit in a fixed adhesion-preventing plate, 62a is a slit in a rotating adhesion-preventing plate, 63 is an evaporation source, 64 is a heating source, and 65 is a rotating mounting base for the object to be processed.
【００１４】次に、第４実施例が図８に示されているが
、この第４実施例はコンデンサを制作するためのもので
、同図において、７１は被処理物、７２、７３、７４は
蒸発源、７５、７６、７７は固定防着板、７５ａ、７６
ａ、７７ａは固定防着板のスリット、７８、７９、８０
は回転防着板、７８ａ、７９ａ、８０ａは回転防着板の
スリットである。Next, a fourth embodiment is shown in FIG. 8, which is for producing a capacitor, and in the same figure, 71 is a workpiece, 72, 73, 74 is an evaporation source, 75, 76, 77 are fixed adhesion prevention plates, 75a, 76
a, 77a are slits of the fixed adhesion prevention plate, 78, 79, 80
is a rotational adhesion prevention plate, and 78a, 79a, and 80a are slits of the rotational adhesion prevention plate.
【００１５】[0015]
【発明の効果】この発明は、次のような効果を奏する。
■複数の蒸発源を用いているので、被処理物に多層膜を
形成することが出来る。
■回転防着板の回転により、固定防着板のスリットと回
転防着板のスリットとの少なくとも一部が重なると、蒸
発源より蒸発した蒸発粒子が各スリットを通過して、そ
の蒸発粒子による膜が被処理物にだけ形成され、その以
外の不必要な部分に蒸発粒子が蒸着しなくなるので、蒸
着室内が汚れたり、また、電子部品の制作上に悪影響を
及ぼす塵を発生させたりすることがなくなる。
■蒸発粒子による膜が被処理物以外の不必要な部分に形
成されないので、蒸着室を大気に戻して、再度真空排気
する場合、蒸着室内に蒸着した蒸着物の酸化や水分の吸
着に起因するガス放出がなくなり、蒸着室内を良好な真
空状態に再生することが出来る。
■回転防着板の回転速度の位相をづらし制御を行うこと
により連続的に多層膜を成膜出来る。また、スリット巾
を調整することによって、被処理物に形成される膜の膜
厚を制御することができる。[Effects of the Invention] The present invention has the following effects. ■Since multiple evaporation sources are used, a multilayer film can be formed on the object to be treated. ■When the rotation of the rotary deposition prevention plate causes at least a portion of the slits of the fixed deposition prevention plate and the slits of the rotating deposition prevention plate to overlap, the evaporated particles evaporated from the evaporation source pass through each slit, and the evaporated particles The film is formed only on the object to be processed, and the evaporated particles are not deposited on other unnecessary parts, which can cause the inside of the deposition chamber to become dirty or generate dust that has a negative impact on the production of electronic parts. disappears. ■A film of evaporated particles is not formed on unnecessary parts other than the object to be processed, so when the evaporation chamber is returned to the atmosphere and evacuated again, the problem is caused by oxidation of the evaporated material deposited in the evaporation chamber and adsorption of moisture. Gas emission is eliminated, and the inside of the deposition chamber can be regenerated into a good vacuum state. ■Multilayer films can be continuously formed by controlling the rotational speed of the rotating anti-adhesion plate by shifting its phase. Further, by adjusting the slit width, the thickness of the film formed on the object to be processed can be controlled.
【図１】この発明の第１実施例の立面を示す立面説明図
[Fig. 1] An explanatory elevational view showing an elevational view of a first embodiment of the present invention.
【図２】この発明の第１実施例の側面を示す側面説明図
[Fig. 2] A side explanatory diagram showing a side view of the first embodiment of the present invention.
【図３】この発明の第１実施例に用いられている蒸発室
内の詳細を示す立面説明図FIG. 3 is an explanatory elevational view showing details of the interior of the evaporation chamber used in the first embodiment of the present invention.
【図４】この発明の第１実施例に用いられている蒸発室
内の詳細を示す側面説明図FIG. 4 is an explanatory side view showing details of the inside of the evaporation chamber used in the first embodiment of the present invention.
【図５】この発明の第２実施例を示す立面説明図FIG. 5 is an explanatory elevational view showing a second embodiment of the present invention.
【図６
】この発明の第３実施例を示す立面説明図[Figure 6
] An elevation view showing a third embodiment of the present invention
【図７】この
発明の第３実施例を示す平面説明図FIG. 7 is an explanatory plan view showing a third embodiment of the present invention.
【図８】この発明の
第４実施例を示す説明図FIG. 8 is an explanatory diagram showing a fourth embodiment of the present invention
【図９】従来の真空蒸着装置を
示す説明図[Fig. 9] Explanatory diagram showing a conventional vacuum evaporation apparatus
１４・・・・・被処理物
２０・・・・・固定防着板
２０ａ・・・・固定防着板のスリット
２１・・・・・回転防着板
２１ａ・・・・回転防着板のスリット
２２・・・・・蒸発源
２３・・・・・固定防着板
２３ａ・・・・固定防着板のスリット
２４・・・・・回転防着板
２４ａ・・・・回転防着板のスリット
２５・・・・・蒸発源
４１・・・・・被処理物
４２、４３、４４・・・・・・蒸発源
４５、４６、４７・・・・・・固定防着板４５ａ、４６
ａ、４７ａ・・・固定防着板のスリット４８、４９、５
０・・・・・・回転防着板４８ａ、４９ａ、５０ａ・・
・回転防着板のスリット６０・・・・・被処理物
６１・・・・・固定防着板
６１ａ・・・・固定防着板のスリット
６２・・・・・回転防着板
６２ａ・・・・回転防着板のスリット
６３・・・・・蒸発源
６４・・・・・加熱源
６５・・・・・被処理物回転式取付台
７１・・・・・被処理物
７２、７３、７４・・・・・・蒸発源14...Processed object 20...Fixed adhesion prevention plate 20a...Slit 21 of fixed adhesion prevention plate...Rotating adhesion prevention plate 21a...Rotating adhesion prevention plate Slit 22...Evaporation source 23...Fixed deposition prevention plate 23a...Fixed deposition prevention plate slit 24...Rotating deposition prevention plate 24a...Rotating deposition prevention plate Slit 25...Evaporation source 41...Workpiece 42, 43, 44...Evaporation source 45, 46, 47...Fixed adhesion prevention plates 45a, 46
a, 47a...Slits 48, 49, 5 of fixed adhesion prevention plate
0...Rotation prevention plates 48a, 49a, 50a...
・Slit 60 of rotating anti-adhesion plate...Workpiece 61...Fixed anti-adhesion plate 61a...Slit 62 of fixed anti-adhesion plate...Rotating anti-adhesion plate 62a... ... Slit of rotating anti-adhesion plate 63 ... Evaporation source 64 ... Heat source 65 ... Workpiece rotary mounting base 71 ... Workpiece 72, 73, 74... Evaporation source
Claims (1)
蒸着させる真空蒸着装置において、前記蒸発源を複数個
配置すると共に、前記各蒸発源と被処理物との間に、前
記蒸発粒子の通過するスリットを備えた固定防着板と、
同じく前記蒸発粒子の通過するスリットを備えた回転防
着板とを配設し、前記回転防着板の回転により、前記固
定防着板のスリットと前記回転防着板のスリットとの少
なくとも一部が重なったときのみ、前記蒸発源より蒸発
した蒸発粒子が各スリットを通過して、被処理物に多層
膜を形成することを特徴とする真空蒸着装置。1. A vacuum evaporation apparatus for depositing evaporated particles evaporated from an evaporation source onto a workpiece, wherein a plurality of the evaporation sources are arranged, and the evaporation particles are disposed between each evaporation source and the workpiece. a fixed adhesion prevention plate equipped with a slit through which the
A rotary deposition prevention plate having slits through which the evaporated particles pass is also disposed, and by rotation of the rotation deposition prevention plate, at least a portion of the slits of the fixed deposition prevention plate and the slits of the rotating deposition prevention plate are disposed. A vacuum evaporation apparatus characterized in that only when the evaporation sources overlap, the evaporated particles evaporated from the evaporation source pass through each slit to form a multilayer film on the object to be processed.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14259491A JPH04341564A (en) | 1991-05-19 | 1991-05-19 | Vacuum deposition device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14259491A JPH04341564A (en) | 1991-05-19 | 1991-05-19 | Vacuum deposition device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH04341564A true JPH04341564A (en) | 1992-11-27 |
Family
ID=15318939
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP14259491A Pending JPH04341564A (en) | 1991-05-19 | 1991-05-19 | Vacuum deposition device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH04341564A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2001291589A (en) * | 2000-03-03 | 2001-10-19 | Eastman Kodak Co | Thermal physical vapor deposition source |
| JP2014065973A (en) * | 2011-03-11 | 2014-04-17 | Sharp Corp | Vapor deposition particle injecting device and vapor deposition device |
-
1991
- 1991-05-19 JP JP14259491A patent/JPH04341564A/en active Pending
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2001291589A (en) * | 2000-03-03 | 2001-10-19 | Eastman Kodak Co | Thermal physical vapor deposition source |
| JP4520059B2 (en) * | 2000-03-03 | 2010-08-04 | イーストマン コダック カンパニー | Thermal physical vapor deposition source |
| JP2014065973A (en) * | 2011-03-11 | 2014-04-17 | Sharp Corp | Vapor deposition particle injecting device and vapor deposition device |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| KR100637896B1 (en) | Vacuum deposition apparatus of organic substances | |
| US5773088A (en) | Treatment system including vacuum isolated sources and method | |
| GB2170822A (en) | A method for the production of substrates coated with a uniform dispersion of extremely fine granules | |
| ES8206081A1 (en) | Method of making layered capacitors, and apparatus therefor. | |
| JP2004047452A5 (en) | ||
| JPH04341564A (en) | Vacuum deposition device | |
| JP2008013834A (en) | Substrate tray and film-forming apparatus | |
| JPS62284076A (en) | Formation of thin film and its device | |
| JPS6127462B2 (en) | ||
| KR20150136080A (en) | Sputtering device | |
| JP2006274396A5 (en) | ||
| JP4177021B2 (en) | Method for controlling vapor deposition apparatus and vapor deposition apparatus | |
| JPH04323362A (en) | Formation of multilayer film and its forming device | |
| JPH0542507B2 (en) | ||
| JPH0633225A (en) | Vacuum deposition device | |
| JPH01205071A (en) | Multilayered film forming device | |
| JP2776807B2 (en) | Method for manufacturing semiconductor device | |
| JPS5939664B2 (en) | Method of forming a solar heat absorption film on the surface of metal foil | |
| JPS61227170A (en) | Sputtering device | |
| JPS59208074A (en) | Sheet type film forming device | |
| JPH05267091A (en) | Manufacture of laminated thin film capacitor | |
| JPS60100665A (en) | Apparatus for producing thin film | |
| JPH06336672A (en) | Vapor deposition device | |
| KR20070051602A (en) | Vacuum deposition apparatus of organic substances | |
| JPH07138760A (en) | Continuous vacuum vapor deposition device |