JPH0430741B2 - - Google Patents
Info
- Publication number
- JPH0430741B2 JPH0430741B2 JP59127005A JP12700584A JPH0430741B2 JP H0430741 B2 JPH0430741 B2 JP H0430741B2 JP 59127005 A JP59127005 A JP 59127005A JP 12700584 A JP12700584 A JP 12700584A JP H0430741 B2 JPH0430741 B2 JP H0430741B2
- Authority
- JP
- Japan
- Prior art keywords
- flexible film
- opening
- lead group
- group
- bent
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 239000004065 semiconductor Substances 0.000 claims description 13
- 239000011347 resin Substances 0.000 claims description 5
- 229920005989 resin Polymers 0.000 claims description 5
- 238000005452 bending Methods 0.000 claims description 2
- 239000004020 conductor Substances 0.000 description 5
- 238000000034 method Methods 0.000 description 5
- KAKZBPTYRLMSJV-UHFFFAOYSA-N Butadiene Chemical compound C=CC=C KAKZBPTYRLMSJV-UHFFFAOYSA-N 0.000 description 2
- 239000004593 Epoxy Substances 0.000 description 2
- 239000004642 Polyimide Substances 0.000 description 2
- 239000003990 capacitor Substances 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 229920001721 polyimide Polymers 0.000 description 2
- 238000005476 soldering Methods 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 1
- 230000002349 favourable effect Effects 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 238000012423 maintenance Methods 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 229920000728 polyester Polymers 0.000 description 1
- 229920001296 polysiloxane Polymers 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/495—Lead-frames or other flat leads
- H01L23/49572—Lead-frames or other flat leads consisting of thin flexible metallic tape with or without a film carrier
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/50—Tape automated bonding [TAB] connectors, i.e. film carriers; Manufacturing methods related thereto
Landscapes
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Wire Bonding (AREA)
Description
【発明の詳細な説明】
産業上の利用分野
本発明は可撓性フイルムを用い、少なくとも半
導体素子を搭載した立体的な実装体に関するもの
である。DETAILED DESCRIPTION OF THE INVENTION Field of Industrial Application The present invention relates to a three-dimensional package using a flexible film and mounting at least a semiconductor element.
従来例の構成とその問題点
近年、半導体素子を多数個用いるデバイス、機
器の開発が促進されてきている。これは、いずれ
も、多数個のIC，LSIを一定の面積を有する基板
に、高密度にしかも薄型に搭載しなければならな
い。従来の実装方法においては、IC，LSIはDIL
やフラツトパツク型のパツケージに収容した形や
フイルムキヤリヤ方法において、リード群のみを
切断したものを比較的厚い回路基板上に平面的に
搭載させていた。ところが、平面的な面積に限界
があると、前記回路基板を複数に分割し、前記回
路基板上に可撓性フイルムを貼合せておき、前記
複数の分割領域で可撓性フイルムを折曲げてい
た。2. Description of the Related Art Structures of Conventional Examples and Their Problems In recent years, the development of devices and equipment that use a large number of semiconductor elements has been promoted. In either case, a large number of ICs and LSIs must be mounted thinly and densely on a board with a certain area. In conventional mounting methods, ICs and LSIs are DIL
In the case of housing in a flat pack type package or film carrier method, only a group of leads were cut and mounted flat on a relatively thick circuit board. However, if there is a limit to the planar area, the circuit board may be divided into a plurality of parts, a flexible film is pasted onto the circuit board, and the flexible film is bent at the plurality of divided areas. Ta.
このような方法においては、回路基板を分割す
る工程や、新たに可撓性フイルムを貼合せる工程
を要するために、実装体のコストが著じるしく高
いものであつた。また、IC，LSIの半導体素子の
搭載においても、パツケージングの形にして実装
されるために、IC，LSIの実装面積や実装体積が
大きくなるばかりか、半田づけ等の接続点の数が
著じるしく増大し、信頼性上も好ましいものでは
なかつた。 This method requires a process of dividing the circuit board and a process of newly bonding a flexible film, resulting in a significantly high cost of the package. Furthermore, when mounting semiconductor elements in ICs and LSIs, they are mounted in the form of packaging, which not only increases the mounting area and volume of the ICs and LSIs, but also significantly increases the number of connection points such as soldering. It increased considerably and was not favorable in terms of reliability.
発明の目的
本発明は、従来のこのような問題に鑑み、基板
形成時の工数や接続点数が著じるしく少なく、小
型でかつ立体的で安価な実装体を提供することを
目的とする。OBJECTS OF THE INVENTION In view of these conventional problems, it is an object of the present invention to provide a compact, three-dimensional, and inexpensive mounting body that significantly reduces the number of man-hours and connection points during board formation.
発明の構成
本発明は少なくとも一定幅の可撓性フイルム上
に複数の第１および第２の開孔部を設け、かつ前
記可撓性フイルム上に導体配線すなわちリード群
を形成せしめ、複数の第１の開孔部においては、
前記リード群が突出され、これに半導体素子の電
極が接続され、一方第２の開孔部においては、前
記リード群が延在して開孔部を横断せしめ、前記
第２の開孔部で前記可撓性フイルムを折曲げた構
成である。Structure of the Invention The present invention provides a plurality of first and second openings on a flexible film having at least a certain width, and forms a conductor wiring, that is, a group of leads on the flexible film. In the opening part 1,
The group of leads protrudes and is connected to an electrode of a semiconductor element, while in the second aperture, the group of leads extends to cross the aperture, and in the second aperture. This is a structure in which the flexible film is bent.
実施例の説明
搬送用のスプロケツト２が形成された可撓性フ
イルム（例えば、ポリイミイド、ガラスエポキ
シ、ポリエステル等の可撓性樹脂フイルム）１上
に開孔部３，３′，４が形成され、かつ、導体配
線５とリード群６が形成されている。Description of Examples Opening portions 3, 3', 4 are formed on a flexible film (for example, a flexible resin film of polyimide, glass epoxy, polyester, etc.) 1 on which a sprocket 2 for conveyance is formed, Further, conductor wiring 5 and lead group 6 are formed.
開孔部３，３′には、リード群６が可撓性フイ
ルムの端部より突出た構造であつて、リード群６
には半導体素子７，７′の電極が接合されている。
ここで開孔部３，３′の大きさは、半導体素子７，
７′よりもわずかに大き目に形成されるものであ
る。また開孔部４では、リード群６′が前記開孔
部４を横断する如くに形成される。更に、可撓性
フイルム１上の導体配線５には、抵抗やコンデン
サーの如くのチツプ部品８，８′が例えば半田づ
け固定されるものである。 The openings 3 and 3' have a structure in which a lead group 6 protrudes from the end of the flexible film.
The electrodes of the semiconductor elements 7, 7' are connected to the electrodes of the semiconductor elements 7, 7'.
Here, the sizes of the openings 3 and 3' are determined by the size of the semiconductor elements 7 and 3'.
It is formed slightly larger than 7'. Further, in the opening 4, a lead group 6' is formed so as to cross the opening 4. Further, chip components 8, 8' such as resistors and capacitors are fixed to the conductor wiring 5 on the flexible film 1 by, for example, soldering.
次に可撓性フイルム１を第１図ａに示した破線
９で切断し、開孔部４の領域でリード群６′を折
曲げれば第１図ｂの構造を得ることができる。こ
の従来の構成においては、開孔部４には、リード
群６′のみしか残存させていない。第１図ｂの構
成であれば、可撓性フイルムを任意の形状に切断
１′後、開孔部４によつて折曲げることが容易に
でき更に、半導体素子の電極がリード群に直接、
接続されているから、実装体の平面積が小さく、
小型の形状を容易に実現できるものである。 Next, the flexible film 1 is cut along the dashed line 9 shown in FIG. 1a, and the lead group 6' is bent in the area of the opening 4 to obtain the structure shown in FIG. 1b. In this conventional configuration, only the lead group 6' remains in the opening 4. With the configuration shown in FIG. 1b, the flexible film can be easily bent through the opening 4 after cutting into an arbitrary shape 1', and furthermore, the electrodes of the semiconductor element can be directly connected to the lead group.
Because they are connected, the surface area of the mounting body is small.
A compact shape can be easily realized.
また第２図の構成は、可撓性フイルム１を９で
切断する際、前記開孔部４の両端の可撓性フイル
ム領域１′をリード群６′に沿つて残存させた構成
である。可撓性フイルムのみを折曲げると、樹脂
特有の弾性力で、所定の形状に維持できないばか
りか、折曲げ部分の曲率を相当に必要とするため
に、無駄な実装面積を必要としてしまう。本発明
の如く、折曲げ領域に開孔部を形成し、リード群
で折曲げてしまうと、金属特有の形状維持効果で
容易に変形、加工できるものである。第２図ｂの
如く、前記開孔部４のリード群６′と平行して、
その片端または両端に可撓性フイルムの一部９を
残存させれば、少なくとも前記リード群６′の機
械的保護を期待できるものである。 Further, the configuration shown in FIG. 2 is such that when the flexible film 1 is cut at 9, the flexible film regions 1' at both ends of the opening 4 are left along the lead group 6'. If only the flexible film is bent, not only will it not be possible to maintain a predetermined shape due to the elastic force unique to the resin, but also a considerable amount of curvature will be required at the bent portion, resulting in a wasted mounting area. If an opening is formed in the bending region and the lead group is bent as in the present invention, it can be easily deformed and processed due to the shape maintenance effect peculiar to metals. As shown in FIG. 2b, parallel to the lead group 6' of the opening 4,
By leaving a portion 9 of the flexible film at one or both ends, it can be expected that at least the lead group 6' will be mechanically protected.
第３図の構成は、開孔部４の折曲げたリード群
６′の領域に樹脂１０を塗布したものであつて、
リード群６′を電気的および機械的に保護せんと
するものである。樹脂１０はエポキシ系、シリコ
ーン系、ポリイミイド系、ブタジエン系等の組成
を用いることができる。 In the configuration shown in FIG. 3, resin 10 is applied to the area of the bent lead group 6' of the opening 4.
The purpose is to electrically and mechanically protect the lead group 6'. The resin 10 can be made of epoxy, silicone, polyimide, butadiene, or the like.
次に第４図で他の実施例を説明する。可撓性フ
イルム１上に、さらに開孔部１１を形成し、リー
ド群６″を横断させ、破線９に沿つて、切断する
（第４図ａ）。この切断によつて、開孔部１１のリ
ード群６″は、その一部を残存させて、切断され、
開孔部４の領域でリード群６′を折曲げる。切断
されたリード群６″は他の回路基板に半田づけ固
定される電極端子としての役目を有する。第４図
ｂにおいて回路基板１２上には、配線パターン１
３が形成されており、前記配線パターン１３にリ
ード群６″を半田づけ１４し固定するものである。 Next, another embodiment will be explained with reference to FIG. Further, an opening 11 is formed on the flexible film 1, and cut across the lead group 6'' along the broken line 9 (FIG. 4a). The lead group 6″ is cut, leaving a part of it,
The lead group 6' is bent in the area of the opening 4. The cut lead group 6'' serves as an electrode terminal to be soldered and fixed to another circuit board. In FIG.
3 is formed, and the lead group 6'' is soldered 14 and fixed to the wiring pattern 13.
このような構成により、可撓性フイルム上に一
括して形成した導体配線やリード群に半導体素子
や、抵抗、コンデンサー等のチツプ部品を搭載
し、開孔部で自由に折曲げ、実装体を小型にし、
かつ、開孔部のリード群を用いて、他の回路基板
に容易に接続できるものである。 With this configuration, semiconductor elements, resistors, capacitors, and other chip components are mounted on the conductor wiring and lead groups formed all at once on the flexible film, and the mounted body is folded freely at the openings. Make it small and
Moreover, it can be easily connected to another circuit board using the lead group in the opening.
発明の効果
可撓性フイルム上に一括して形成した導体配
線、リード群上に半導体素子やチツプ部品を直
接搭載するので、前記半導体素子やチツプ部品
の電極との接続点数が著じるしく少なく、か
つ、配線距離が短かく、信頼性の高い実装体を
提供できる。Effects of the Invention Since semiconductor elements and chip parts are directly mounted on conductor wiring and lead groups formed all at once on a flexible film, the number of connection points with electrodes of the semiconductor elements and chip parts is significantly reduced. In addition, a highly reliable mounting body with short wiring distance can be provided.
可撓性フイルムに開孔部を設け、これにリー
ド群を横断させ、この領域を折曲げることがで
きるので実装体の形状を任意に形成できるた
め、実装自由度の高い実装体を実現できるばか
りか、実装面積を著じるしく小さくできる。 Openings are provided in the flexible film, and the lead group is passed through the openings, and this area can be bent, allowing the mounting body to be formed into any shape, making it possible to create a mounting body with a high degree of freedom in mounting. Alternatively, the mounting area can be significantly reduced.
実装体にわざわざ、外部回路基板との接続端
子を形成しなくても、前記可撓性フイルムに開
孔部やリード群を形成する段階で一括して設け
ることができる。したがつて、実装体の接続点
数が少なく、かつコストを安価にできるもので
ある。 There is no need to take the trouble to form connection terminals to the external circuit board on the mounting body, and they can be provided all at once at the stage of forming the openings and the lead group in the flexible film. Therefore, the number of connection points of the mounting body is small and the cost can be reduced.
第１図ａ，ｂは本発明の第１の実施例の実装体
の折り曲げ前、後の斜視図、第２図ａ，ｂは本発
明の第１の実施例を改良した実装体の折り曲げ
前、後を示す斜視図、第３図ａ，ｂは本発明の第
２の実施例の実装体の斜視図、折り曲げ断面図、
第４図ａ，ｂは本発明の第３の実施例の実装体の
斜視図、折り曲げ断面図である。
１……可撓性フイルム、３，３′，４，１１…
…開孔部、６，６′，６″……リード群、７……半
導体素子、８，８′……チツプ部品。
Figures 1a and b are perspective views of a mounting body according to the first embodiment of the present invention before and after folding, and Figures 2a and b are before and after folding of a mounting body that is an improved version of the first embodiment of the present invention. , a perspective view showing the rear; FIGS. 3a and 3b are perspective views and folded sectional views of the mounting body of the second embodiment of the present invention;
FIGS. 4a and 4b are a perspective view and a folded sectional view of a mounting body according to a third embodiment of the present invention. 1... Flexible film, 3, 3', 4, 11...
...Opening portion, 6, 6', 6''... Lead group, 7... Semiconductor element, 8, 8'... Chip parts.
Claims (1)
可撓性フイルム上に形成され前記第１の開孔部よ
り突出したリード群に半導体素子の電極が接合さ
れ、少なくとも前記リード群の他端が、前記第２
の開孔部を横折するとともに、前記第２の開孔部
領域において、前記可撓性フイルムを折曲げたこ
とを特徴とする実装体。 ２ 第２の開孔部領域において、横断するリード
群のみを残存させて、前記リード群を折曲げたこ
とを特徴とする特許請求の範囲第１項記載の実装
体。 ３ 第２の開孔部領域において、可撓性フイルム
の一部を残存させて、リード群とともに折曲げた
ことを特徴とする特許請求の範囲第１項記載の実
装体。 ４ 第２の開孔部領域において折曲げた後、前記
開孔部領域に樹脂層を形成したことを特徴とする
特許請求の範囲第１項記載の実装体。 ５ 可撓性フイルムに第３の開孔部を形成し、前
記第３の開孔部のリード群を他の回路基板に接続
したことを特徴とする特許請求の範囲第１項記載
の実装体。[Scope of Claims] 1. Electrodes of a semiconductor element are bonded to a group of leads formed on a flexible film having at least first and second openings and protruding from the first openings; The other end of the lead group is connected to the second
A mounting body characterized in that the flexible film is folded in the second opening area and the flexible film is bent in the second opening area. 2. The mount assembly according to claim 1, wherein the lead group is bent so that only the crossing lead group remains in the second opening region. 3. The mounting body according to claim 1, wherein a part of the flexible film is left in the second opening area and is bent together with the lead group. 4. The mount according to claim 1, wherein after bending in the second aperture region, a resin layer is formed in the aperture region. 5. The mounted body according to claim 1, wherein a third opening is formed in the flexible film, and a group of leads of the third opening are connected to another circuit board. .
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP59127005A JPS616832A (en) | 1984-06-20 | 1984-06-20 | Material to be loaded |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP59127005A JPS616832A (en) | 1984-06-20 | 1984-06-20 | Material to be loaded |
Related Child Applications (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP6256503A Division JP2606673B2 (en) | 1994-10-21 | 1994-10-21 | Mounted body |
| JP6256502A Division JP2568812B2 (en) | 1994-10-21 | 1994-10-21 | Mounted body |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS616832A JPS616832A (en) | 1986-01-13 |
| JPH0430741B2 true JPH0430741B2 (en) | 1992-05-22 |
Family
ID=14949322
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP59127005A Granted JPS616832A (en) | 1984-06-20 | 1984-06-20 | Material to be loaded |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS616832A (en) |
Families Citing this family (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6223124A (en) * | 1985-07-23 | 1987-01-31 | Sharp Corp | Film carrier lsi |
| JPH07122713B2 (en) * | 1988-07-11 | 1995-12-25 | 株式会社東芝 | Flexible wiring board, manufacturing method thereof, and electronic component |
| EP0388312A3 (en) * | 1989-03-17 | 1991-04-24 | Furukawa Denki Kogyo Kabushiki Kaisha | Chip carrier with improved flexing characteristic |
| JP2538112Y2 (en) * | 1991-05-21 | 1997-06-11 | シャープ株式会社 | Mounting board |
| JP2570519B2 (en) * | 1991-06-05 | 1997-01-08 | 日立電線株式会社 | TAB tape carrier |
| JP2763445B2 (en) * | 1992-04-03 | 1998-06-11 | 三菱電機株式会社 | High frequency signal wiring and bonding device therefor |
| KR100524484B1 (en) * | 1998-07-29 | 2006-01-12 | 삼성전자주식회사 | LCD module |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS51140174A (en) * | 1975-05-28 | 1976-12-02 | Sharp Kk | Method of connecting flexible substrate and other devices |
| JPS538575B2 (en) * | 1974-12-16 | 1978-03-30 | ||
| JPS55166988A (en) * | 1979-06-14 | 1980-12-26 | Olympus Optical Co | Flexible printed circuit board |
| JPS5775450A (en) * | 1980-10-28 | 1982-05-12 | Matsushita Electric Ind Co Ltd | Manufacture of electronic circuit device |
| JPS60216573A (en) * | 1984-04-12 | 1985-10-30 | Seiko Epson Corp | Manufacture of flexible printed circuit board |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS538575U (en) * | 1976-07-07 | 1978-01-25 | ||
| JPS5364248U (en) * | 1976-11-04 | 1978-05-30 | ||
| JPS58188684U (en) * | 1982-06-10 | 1983-12-15 | セイコーエプソン株式会社 | electronic display device |
-
1984
- 1984-06-20 JP JP59127005A patent/JPS616832A/en active Granted
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS538575B2 (en) * | 1974-12-16 | 1978-03-30 | ||
| JPS51140174A (en) * | 1975-05-28 | 1976-12-02 | Sharp Kk | Method of connecting flexible substrate and other devices |
| JPS55166988A (en) * | 1979-06-14 | 1980-12-26 | Olympus Optical Co | Flexible printed circuit board |
| JPS5775450A (en) * | 1980-10-28 | 1982-05-12 | Matsushita Electric Ind Co Ltd | Manufacture of electronic circuit device |
| JPS60216573A (en) * | 1984-04-12 | 1985-10-30 | Seiko Epson Corp | Manufacture of flexible printed circuit board |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS616832A (en) | 1986-01-13 |
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| Date | Code | Title | Description |
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