JPH04301641A - Damping-waterless planographic printing plate - Google Patents
Damping-waterless planographic printing plateInfo
- Publication number
- JPH04301641A JPH04301641A JP6695791A JP6695791A JPH04301641A JP H04301641 A JPH04301641 A JP H04301641A JP 6695791 A JP6695791 A JP 6695791A JP 6695791 A JP6695791 A JP 6695791A JP H04301641 A JPH04301641 A JP H04301641A
- Authority
- JP
- Japan
- Prior art keywords
- group
- hydroxy
- silane
- carbon atoms
- ethoxy
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 229920002379 silicone rubber Polymers 0.000 claims abstract description 30
- 239000004945 silicone rubber Substances 0.000 claims abstract description 30
- 229920001296 polysiloxane Polymers 0.000 claims abstract description 24
- 125000003342 alkenyl group Chemical group 0.000 claims abstract description 12
- 239000000203 mixture Substances 0.000 claims abstract description 11
- 125000000217 alkyl group Chemical group 0.000 claims abstract description 8
- 239000003054 catalyst Substances 0.000 claims abstract description 8
- 125000003545 alkoxy group Chemical group 0.000 claims abstract description 7
- 125000003118 aryl group Chemical group 0.000 claims abstract description 7
- 125000004423 acyloxy group Chemical group 0.000 claims abstract description 6
- 239000003431 cross linking reagent Substances 0.000 claims abstract description 5
- 125000004432 carbon atom Chemical group C* 0.000 claims description 24
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 19
- 239000000758 substrate Substances 0.000 claims description 6
- 125000005843 halogen group Chemical group 0.000 claims description 5
- 125000004435 hydrogen atom Chemical group [H]* 0.000 claims description 5
- 125000003368 amide group Chemical group 0.000 claims description 3
- 125000003277 amino group Chemical group 0.000 claims description 3
- 125000002344 aminooxy group Chemical group [H]N([H])O[*] 0.000 claims description 3
- 239000000126 substance Substances 0.000 claims description 3
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims description 2
- 125000004453 alkoxycarbonyl group Chemical group 0.000 claims description 2
- 229910052799 carbon Inorganic materials 0.000 claims description 2
- 125000001820 oxy group Chemical group [*:1]O[*:2] 0.000 claims 1
- -1 amino, aminoxy Chemical group 0.000 abstract description 39
- 239000002904 solvent Substances 0.000 abstract description 12
- 238000011161 development Methods 0.000 abstract description 10
- 238000006243 chemical reaction Methods 0.000 abstract description 8
- 238000000034 method Methods 0.000 abstract description 7
- 238000004132 cross linking Methods 0.000 abstract description 3
- 238000004090 dissolution Methods 0.000 abstract description 3
- 229910052736 halogen Inorganic materials 0.000 abstract 2
- 150000002367 halogens Chemical class 0.000 abstract 2
- 238000000016 photochemical curing Methods 0.000 abstract 2
- 238000001723 curing Methods 0.000 abstract 1
- BLRPTPMANUNPDV-UHFFFAOYSA-N Silane Chemical compound [SiH4] BLRPTPMANUNPDV-UHFFFAOYSA-N 0.000 description 47
- 229910000077 silane Inorganic materials 0.000 description 47
- 125000001301 ethoxy group Chemical group [H]C([H])([H])C([H])([H])O* 0.000 description 38
- 229920000642 polymer Polymers 0.000 description 20
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 18
- 150000001875 compounds Chemical class 0.000 description 13
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- CTQNGGLPUBDAKN-UHFFFAOYSA-N O-Xylene Chemical compound CC1=CC=CC=C1C CTQNGGLPUBDAKN-UHFFFAOYSA-N 0.000 description 6
- 239000004205 dimethyl polysiloxane Substances 0.000 description 6
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- 239000000178 monomer Substances 0.000 description 4
- XNGIFLGASWRNHJ-UHFFFAOYSA-N phthalic acid Chemical compound OC(=O)C1=CC=CC=C1C(O)=O XNGIFLGASWRNHJ-UHFFFAOYSA-N 0.000 description 4
- SMZOUWXMTYCWNB-UHFFFAOYSA-N 2-(2-methoxy-5-methylphenyl)ethanamine Chemical compound COC1=CC=C(C)C=C1CCN SMZOUWXMTYCWNB-UHFFFAOYSA-N 0.000 description 3
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- KRKNYBCHXYNGOX-UHFFFAOYSA-N citric acid Chemical compound OC(=O)CC(O)(C(O)=O)CC(O)=O KRKNYBCHXYNGOX-UHFFFAOYSA-N 0.000 description 3
- 229920001577 copolymer Polymers 0.000 description 3
- MTHSVFCYNBDYFN-UHFFFAOYSA-N diethylene glycol Chemical compound OCCOCCO MTHSVFCYNBDYFN-UHFFFAOYSA-N 0.000 description 3
- 238000010438 heat treatment Methods 0.000 description 3
- 229920000620 organic polymer Polymers 0.000 description 3
- 239000003504 photosensitizing agent Substances 0.000 description 3
- KBPLFHHGFOOTCA-UHFFFAOYSA-N 1-Octanol Chemical compound CCCCCCCCO KBPLFHHGFOOTCA-UHFFFAOYSA-N 0.000 description 2
- HZAXFHJVJLSVMW-UHFFFAOYSA-N 2-Aminoethan-1-ol Chemical compound NCCO HZAXFHJVJLSVMW-UHFFFAOYSA-N 0.000 description 2
- VVBLNCFGVYUYGU-UHFFFAOYSA-N 4,4'-Bis(dimethylamino)benzophenone Chemical compound C1=CC(N(C)C)=CC=C1C(=O)C1=CC=C(N(C)C)C=C1 VVBLNCFGVYUYGU-UHFFFAOYSA-N 0.000 description 2
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- QUSNBJAOOMFDIB-UHFFFAOYSA-N Ethylamine Chemical compound CCN QUSNBJAOOMFDIB-UHFFFAOYSA-N 0.000 description 2
- PEDCQBHIVMGVHV-UHFFFAOYSA-N Glycerine Chemical compound OCC(O)CO PEDCQBHIVMGVHV-UHFFFAOYSA-N 0.000 description 2
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- 239000004721 Polyphenylene oxide Substances 0.000 description 2
- OFOBLEOULBTSOW-UHFFFAOYSA-N Propanedioic acid Natural products OC(=O)CC(O)=O OFOBLEOULBTSOW-UHFFFAOYSA-N 0.000 description 2
- FDLQZKYLHJJBHD-UHFFFAOYSA-N [3-(aminomethyl)phenyl]methanamine Chemical compound NCC1=CC=CC(CN)=C1 FDLQZKYLHJJBHD-UHFFFAOYSA-N 0.000 description 2
- WNLRTRBMVRJNCN-UHFFFAOYSA-N adipic acid Chemical compound OC(=O)CCCCC(O)=O WNLRTRBMVRJNCN-UHFFFAOYSA-N 0.000 description 2
- 125000003302 alkenyloxy group Chemical group 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- WPYMKLBDIGXBTP-UHFFFAOYSA-N benzoic acid Chemical compound OC(=O)C1=CC=CC=C1 WPYMKLBDIGXBTP-UHFFFAOYSA-N 0.000 description 2
- RWCCWEUUXYIKHB-UHFFFAOYSA-N benzophenone Chemical compound C=1C=CC=CC=1C(=O)C1=CC=CC=C1 RWCCWEUUXYIKHB-UHFFFAOYSA-N 0.000 description 2
- 239000012965 benzophenone Substances 0.000 description 2
- WGQKYBSKWIADBV-UHFFFAOYSA-N benzylamine Chemical compound NCC1=CC=CC=C1 WGQKYBSKWIADBV-UHFFFAOYSA-N 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 2
- VYHBFRJRBHMIQZ-UHFFFAOYSA-N bis[4-(diethylamino)phenyl]methanone Chemical compound C1=CC(N(CC)CC)=CC=C1C(=O)C1=CC=C(N(CC)CC)C=C1 VYHBFRJRBHMIQZ-UHFFFAOYSA-N 0.000 description 2
- HQABUPZFAYXKJW-UHFFFAOYSA-N butan-1-amine Chemical compound CCCCN HQABUPZFAYXKJW-UHFFFAOYSA-N 0.000 description 2
- 239000012954 diazonium Substances 0.000 description 2
- 150000001989 diazonium salts Chemical class 0.000 description 2
- AYOHIQLKSOJJQH-UHFFFAOYSA-N dibutyltin Chemical compound CCCC[Sn]CCCC AYOHIQLKSOJJQH-UHFFFAOYSA-N 0.000 description 2
- MROCJMGDEKINLD-UHFFFAOYSA-N dichlorosilane Chemical compound Cl[SiH2]Cl MROCJMGDEKINLD-UHFFFAOYSA-N 0.000 description 2
- XBDQKXXYIPTUBI-UHFFFAOYSA-N dimethylselenoniopropionate Natural products CCC(O)=O XBDQKXXYIPTUBI-UHFFFAOYSA-N 0.000 description 2
- 229920001971 elastomer Polymers 0.000 description 2
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- VOZRXNHHFUQHIL-UHFFFAOYSA-N glycidyl methacrylate Chemical compound CC(=C)C(=O)OCC1CO1 VOZRXNHHFUQHIL-UHFFFAOYSA-N 0.000 description 2
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- NAQMVNRVTILPCV-UHFFFAOYSA-N hexane-1,6-diamine Chemical compound NCCCCCCN NAQMVNRVTILPCV-UHFFFAOYSA-N 0.000 description 2
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- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 description 2
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- JHPBZFOKBAGZBL-UHFFFAOYSA-N (3-hydroxy-2,2,4-trimethylpentyl) 2-methylprop-2-enoate Chemical compound CC(C)C(O)C(C)(C)COC(=O)C(C)=C JHPBZFOKBAGZBL-UHFFFAOYSA-N 0.000 description 1
- QFDDZIRGHKFRMR-UHFFFAOYSA-N 10-butylacridin-9-one Chemical compound C1=CC=C2N(CCCC)C3=CC=CC=C3C(=O)C2=C1 QFDDZIRGHKFRMR-UHFFFAOYSA-N 0.000 description 1
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- XGZNHFPFJRZBBT-UHFFFAOYSA-N ethanol;titanium Chemical compound [Ti].CCO.CCO.CCO.CCO XGZNHFPFJRZBBT-UHFFFAOYSA-N 0.000 description 1
- SBRXLTRZCJVAPH-UHFFFAOYSA-N ethyl(trimethoxy)silane Chemical compound CC[Si](OC)(OC)OC SBRXLTRZCJVAPH-UHFFFAOYSA-N 0.000 description 1
- YLQWCDOCJODRMT-UHFFFAOYSA-N fluoren-9-one Chemical compound C1=CC=C2C(=O)C3=CC=CC=C3C2=C1 YLQWCDOCJODRMT-UHFFFAOYSA-N 0.000 description 1
- 235000011187 glycerol Nutrition 0.000 description 1
- RRAMGCGOFNQTLD-UHFFFAOYSA-N hexamethylene diisocyanate Chemical compound O=C=NCCCCCCN=C=O RRAMGCGOFNQTLD-UHFFFAOYSA-N 0.000 description 1
- 239000003112 inhibitor Substances 0.000 description 1
- 238000007689 inspection Methods 0.000 description 1
- 239000012948 isocyanate Substances 0.000 description 1
- 150000002513 isocyanates Chemical class 0.000 description 1
- NIMLQBUJDJZYEJ-UHFFFAOYSA-N isophorone diisocyanate Chemical compound CC1(C)CC(N=C=O)CC(C)(CN=C=O)C1 NIMLQBUJDJZYEJ-UHFFFAOYSA-N 0.000 description 1
- 239000010410 layer Substances 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- QSHDDOUJBYECFT-UHFFFAOYSA-N mercury Chemical compound [Hg] QSHDDOUJBYECFT-UHFFFAOYSA-N 0.000 description 1
- 229910052753 mercury Inorganic materials 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- FQPSGWSUVKBHSU-UHFFFAOYSA-N methacrylamide Chemical compound CC(=C)C(N)=O FQPSGWSUVKBHSU-UHFFFAOYSA-N 0.000 description 1
- 125000005395 methacrylic acid group Chemical group 0.000 description 1
- ZEIWWVGGEOHESL-UHFFFAOYSA-N methanol;titanium Chemical compound [Ti].OC.OC.OC.OC ZEIWWVGGEOHESL-UHFFFAOYSA-N 0.000 description 1
- 239000005055 methyl trichlorosilane Substances 0.000 description 1
- JLUFWMXJHAVVNN-UHFFFAOYSA-N methyltrichlorosilane Chemical compound C[Si](Cl)(Cl)Cl JLUFWMXJHAVVNN-UHFFFAOYSA-N 0.000 description 1
- BFXIKLCIZHOAAZ-UHFFFAOYSA-N methyltrimethoxysilane Chemical compound CO[Si](C)(OC)OC BFXIKLCIZHOAAZ-UHFFFAOYSA-N 0.000 description 1
- 238000002156 mixing Methods 0.000 description 1
- ZIUHHBKFKCYYJD-UHFFFAOYSA-N n,n'-methylenebisacrylamide Chemical compound C=CC(=O)NCNC(=O)C=C ZIUHHBKFKCYYJD-UHFFFAOYSA-N 0.000 description 1
- OMNKZBIFPJNNIO-UHFFFAOYSA-N n-(2-methyl-4-oxopentan-2-yl)prop-2-enamide Chemical compound CC(=O)CC(C)(C)NC(=O)C=C OMNKZBIFPJNNIO-UHFFFAOYSA-N 0.000 description 1
- SLCVBVWXLSEKPL-UHFFFAOYSA-N neopentyl glycol Chemical compound OCC(C)(C)CO SLCVBVWXLSEKPL-UHFFFAOYSA-N 0.000 description 1
- 229920003986 novolac Polymers 0.000 description 1
- 150000002902 organometallic compounds Chemical class 0.000 description 1
- RPQRDASANLAFCM-UHFFFAOYSA-N oxiran-2-ylmethyl prop-2-enoate Chemical compound C=CC(=O)OCC1CO1 RPQRDASANLAFCM-UHFFFAOYSA-N 0.000 description 1
- WXZMFSXDPGVJKK-UHFFFAOYSA-N pentaerythritol Chemical compound OCC(CO)(CO)CO WXZMFSXDPGVJKK-UHFFFAOYSA-N 0.000 description 1
- 239000000049 pigment Substances 0.000 description 1
- 239000002985 plastic film Substances 0.000 description 1
- 229920006255 plastic film Polymers 0.000 description 1
- 229920001485 poly(butyl acrylate) polymer Polymers 0.000 description 1
- 229920001084 poly(chloroprene) Polymers 0.000 description 1
- 229920003229 poly(methyl methacrylate) Polymers 0.000 description 1
- 229920002647 polyamide Polymers 0.000 description 1
- 229920002857 polybutadiene Polymers 0.000 description 1
- 229920006267 polyester film Polymers 0.000 description 1
- 229920005906 polyester polyol Polymers 0.000 description 1
- 239000004645 polyester resin Substances 0.000 description 1
- 229920001225 polyester resin Polymers 0.000 description 1
- 229920000120 polyethyl acrylate Polymers 0.000 description 1
- 229920001223 polyethylene glycol Polymers 0.000 description 1
- 238000006116 polymerization reaction Methods 0.000 description 1
- 239000004926 polymethyl methacrylate Substances 0.000 description 1
- 229920005862 polyol Polymers 0.000 description 1
- 150000003077 polyols Chemical class 0.000 description 1
- 229920002635 polyurethane Polymers 0.000 description 1
- 239000004814 polyurethane Substances 0.000 description 1
- 229920005749 polyurethane resin Polymers 0.000 description 1
- 239000011118 polyvinyl acetate Substances 0.000 description 1
- 229920002689 polyvinyl acetate Polymers 0.000 description 1
- 229920002451 polyvinyl alcohol Polymers 0.000 description 1
- BDERNNFJNOPAEC-UHFFFAOYSA-N propan-1-ol Chemical compound CCCO BDERNNFJNOPAEC-UHFFFAOYSA-N 0.000 description 1
- 235000019260 propionic acid Nutrition 0.000 description 1
- IUVKMZGDUIUOCP-BTNSXGMBSA-N quinbolone Chemical compound O([C@H]1CC[C@H]2[C@H]3[C@@H]([C@]4(C=CC(=O)C=C4CC3)C)CC[C@@]21C)C1=CCCC1 IUVKMZGDUIUOCP-BTNSXGMBSA-N 0.000 description 1
- 239000000376 reactant Substances 0.000 description 1
- 230000002940 repellent Effects 0.000 description 1
- 239000005871 repellent Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 238000007790 scraping Methods 0.000 description 1
- FDNAPBUWERUEDA-UHFFFAOYSA-N silicon tetrachloride Chemical compound Cl[Si](Cl)(Cl)Cl FDNAPBUWERUEDA-UHFFFAOYSA-N 0.000 description 1
- 239000010959 steel Substances 0.000 description 1
- 229920003048 styrene butadiene rubber Polymers 0.000 description 1
- 239000011975 tartaric acid Substances 0.000 description 1
- 235000002906 tartaric acid Nutrition 0.000 description 1
- LFQCEHFDDXELDD-UHFFFAOYSA-N tetramethyl orthosilicate Chemical compound CO[Si](OC)(OC)OC LFQCEHFDDXELDD-UHFFFAOYSA-N 0.000 description 1
- 239000010936 titanium Substances 0.000 description 1
- 229910052719 titanium Inorganic materials 0.000 description 1
- DVKJHBMWWAPEIU-UHFFFAOYSA-N toluene 2,4-diisocyanate Chemical compound CC1=CC=C(N=C=O)C=C1N=C=O DVKJHBMWWAPEIU-UHFFFAOYSA-N 0.000 description 1
- YZVRVDPMGYFCGL-UHFFFAOYSA-N triacetyloxysilyl acetate Chemical compound CC(=O)O[Si](OC(C)=O)(OC(C)=O)OC(C)=O YZVRVDPMGYFCGL-UHFFFAOYSA-N 0.000 description 1
- ZOYFEXPFPVDYIS-UHFFFAOYSA-N trichloro(ethyl)silane Chemical compound CC[Si](Cl)(Cl)Cl ZOYFEXPFPVDYIS-UHFFFAOYSA-N 0.000 description 1
- CPUDPFPXCZDNGI-UHFFFAOYSA-N triethoxy(methyl)silane Chemical compound CCO[Si](C)(OCC)OCC CPUDPFPXCZDNGI-UHFFFAOYSA-N 0.000 description 1
- ZIBGPFATKBEMQZ-UHFFFAOYSA-N triethylene glycol Chemical compound OCCOCCOCCO ZIBGPFATKBEMQZ-UHFFFAOYSA-N 0.000 description 1
- 229920002554 vinyl polymer Polymers 0.000 description 1
Abstract
Description
【0001】0001
【産業上の利用分野】本発明は湿し水不要平版印刷用原
版に関するものであり、さらに詳しくは、基板上にイン
キを受容しうる感光層とインキを反発しうるシリコ−ン
ゴム層とを、この順に設けてなる湿し水不要平版印刷用
原版に関するものである。[Field of Industrial Application] The present invention relates to a lithographic printing original plate that does not require dampening water. More specifically, the present invention relates to a lithographic printing original plate that does not require dampening water. The present invention relates to a lithographic printing original plate that does not require dampening water and is provided in this order.
【0002】0002
【従来の技術】従来から、シリコ−ンゴム層をインキ反
発層とする湿し水不要平版印刷用原版が知られている。
特公昭44−23042号、特公昭46−16044号
、特公昭54−26923号、特公昭61−54222
号、特公昭55−22781号公報等には、基板上に感
光層、シリコ−ンゴム層を、この順に設けた湿し水不要
平版印刷用原版が開示されている。これらの平版印刷用
原版においては、露光後、現像により、未露光部(画線
部)のシリコ−ンゴム層を除去し、下層のインキ受容性
の感光層を露出させて刷版を作製するものである。この
場合、画像形成は感光層のみで行われ、感光性のないシ
リコ−ンゴム層は画像形成に関与しない。そのため、露
光後における画線部と非画線部のシリコ−ンゴム層の差
は感光層との接着力の差のみであり、溶剤に対する溶解
性には差がなく、画線部のシリコ−ンゴム層を除去する
には物理的な力でかき取ることが必要不可欠であった。
したがって、溶剤による溶解といった単純な現像工程で
は不十分であり、物理的な力により画線部のシリコ−ン
ゴム層を除去する工程が加わるため、現像工程全体が複
雑となり、時間もかかるという欠点を有していた。BACKGROUND OF THE INVENTION Hitherto, there has been known a lithographic printing original plate that does not require dampening water and has a silicone rubber layer as an ink repellent layer. Special Publication No. 44-23042, Special Publication No. 46-16044, Special Publication No. 54-26923, Special Publication No. 61-54222
Japanese Patent Publication No. 55-22781 discloses a lithographic printing original plate that does not require dampening water and has a photosensitive layer and a silicone rubber layer provided in this order on a substrate. In these lithographic printing original plates, after exposure, the silicone rubber layer in the unexposed areas (image areas) is removed by development, and the underlying ink-receptive photosensitive layer is exposed to produce a printing plate. It is. In this case, image formation is performed only on the photosensitive layer, and the non-photosensitive silicone rubber layer does not participate in image formation. Therefore, after exposure, the only difference between the silicone rubber layer in the image area and the non-image area is the difference in adhesive strength with the photosensitive layer, and there is no difference in solubility in solvents. Scraping with physical force was essential to remove the layer. Therefore, a simple development process such as dissolving with a solvent is not sufficient, and a process of removing the silicone rubber layer in the image area using physical force is added, making the entire development process complicated and time-consuming. had.
【0003】0003
【発明が解決しようとする課題】本発明の目的は、前記
に示したような問題点を解決し、シリコ−ンゴム層に感
光性があり、それゆえ露光後における画線部と非画線部
のシリコ−ンゴム層には溶剤に対する溶解性に差がある
ため、溶剤による溶解のみで画線部のシリコ−ンゴム層
を除去でき、物理的な力で除去する工程を必要とせず、
現像工程全体を簡単にすることができる湿し水不要平版
印刷用原版を提供することにある。[Problems to be Solved by the Invention] An object of the present invention is to solve the above-mentioned problems, and to provide a silicone rubber layer that is photosensitive, so that the image area and the non-image area are different after exposure. Because the silicone rubber layer has a different solubility in solvents, the silicone rubber layer in the image area can be removed simply by dissolving it with a solvent, without the need for a process of removing it using physical force.
To provide a lithographic printing original plate that does not require dampening water and can simplify the entire development process.
【0004】0004
【課題を解決するための手段】かかる本発明の目的は、
基板上に光硬化性感光層およびシリコ−ンゴム層をこの
順に設けてなる湿し水不要平版印刷用原版において、該
シリコ−ンゴム層が下記のA、B、およびC成分から主
としてなる光硬化性シリコ−ン組成物である湿し水不要
平版印刷用原版によって達成される。[Means for Solving the Problems] The purpose of the present invention is to
In an original plate for lithographic printing that does not require dampening water, and in which a photocurable photosensitive layer and a silicone rubber layer are provided in this order on a substrate, the silicone rubber layer is a photocurable material mainly consisting of the following components A, B, and C. This is achieved by using a lithographic printing original plate that does not require dampening water and is a silicone composition.
【0005】A.分子中に1個以上の一般式(I)で示
される構造を有するオルガノポリシロキサン[0005]A. Organopolysiloxane having one or more structures represented by general formula (I) in the molecule
【0006
】0006
]
【化3】[Chemical 3]
【0007】(式中、Wは水素原子、ハロゲン原子、炭
素数1〜10のアルキル基、アルコキシ基、アシルオキ
シ基、炭素数2〜10のアルケニル基、炭素数6〜10
のアリ−ル基、およびアルコキシカルボニル基の群から
選ばれる少なくとも1種である。)
B.一般式(II)で表わされる架橋剤(In the formula, W is a hydrogen atom, a halogen atom, an alkyl group having 1 to 10 carbon atoms, an alkoxy group, an acyloxy group, an alkenyl group having 2 to 10 carbon atoms, or an alkenyl group having 6 to 10 carbon atoms.
is at least one selected from the group consisting of aryl groups and alkoxycarbonyl groups. )B. Crosslinking agent represented by general formula (II)
【0008】[0008]
【化4】[C4]
【0009】(式中、R1は炭素数1〜10のアルキル
基、炭素数2〜10のアルケニル基、および炭素数6〜
10のアリ−ル基の群から選ばれる少なくとも1種であ
り、Xは水素原子、ハロゲン原子、アミノ基、アミノオ
キシ基、炭素数1〜10のアルコキシ基、アミド基、ア
シルオキシ基、炭素数2〜10のアルケニルオキシ基、
および炭素数3〜10のケトオキシム基の群から選ばれ
る少なくとも1種である。nは0または1を示す。)C
.硬化触媒
すなわち、本発明は特定の2−ヒドロキシ−2−フェニ
ル−2−ベンゾイルエトキシ基や2−ヒドロキシ−2−
(2−フリル)−2−(2−フロイル)エトキシ基、お
よび2−ヒドロキシ−2−(2−チオフェン)−2−(
2−チオフェンカルボニル)エトキシ基の群から選ばれ
る少なくとも1種を分子中に1個以上有する感光性オル
ガノポリシロキサンをシリコ−ンゴム層の主要構成成分
として用いたことを大きな特徴とするものであり、これ
により現像性の著しく改良された湿し水不要平版印刷用
原版を得ることができたものである。(In the formula, R1 is an alkyl group having 1 to 10 carbon atoms, an alkenyl group having 2 to 10 carbon atoms, and an alkenyl group having 6 to 10 carbon atoms.
At least one type selected from the group of 10 aryl groups, and X is a hydrogen atom, a halogen atom, an amino group, an aminooxy group, an alkoxy group having 1 to 10 carbon atoms, an amide group, an acyloxy group, or a 2-carbon group. ~10 alkenyloxy groups,
and at least one kind selected from the group of ketoxime groups having 3 to 10 carbon atoms. n represents 0 or 1. )C
.. The curing catalyst, that is, the present invention uses a specific 2-hydroxy-2-phenyl-2-benzoylethoxy group or 2-hydroxy-2-
(2-furyl)-2-(2-furoyl)ethoxy group, and 2-hydroxy-2-(2-thiophene)-2-(
The major feature is that a photosensitive organopolysiloxane having at least one type selected from the group of 2-thiophenecarbonyl) ethoxy groups in the molecule is used as the main component of the silicone rubber layer. As a result, it was possible to obtain a lithographic printing original plate that did not require dampening water and had significantly improved developability.
【0010】本発明に用いられる基板としては、通常の
湿し水不要平版印刷用原版において使用されているもの
であれば、いずれでもよい。例えば、アルミニウム、銅
、亜鉛、鋼等の金属板、ポリエステルのようなプラスチ
ックフィルム、もしくはコ−ト紙等が挙げられる。The substrate used in the present invention may be any substrate as long as it is used in ordinary lithographic printing plates that do not require dampening water. Examples include metal plates such as aluminum, copper, zinc, and steel, plastic films such as polyester, and coated paper.
【0011】基板上には接着性向上、検版性向上、その
他の目的で、さらにプライマ−層をコ−ティングして支
持体として用いることも可能である。プライマ−層とし
ては、エポキシ樹脂、尿素樹脂、ベンゾグアナミン樹脂
、メラミン樹脂、もしくはポリエステル樹脂等が単独、
または混合して用いられる。[0011] It is also possible to further coat the substrate with a primer layer and use it as a support for improving adhesion, plate inspection, and other purposes. As the primer layer, epoxy resin, urea resin, benzoguanamine resin, melamine resin, or polyester resin may be used alone or
Or used in combination.
【0012】また本発明に用いられる光硬化性感光層と
しては、例えば次の■〜■のものが挙げられる。[0012] Examples of the photocurable photosensitive layer used in the present invention include the following (1) to (2).
【0013】■ラジカル重合性のエチレン性不飽和結合
を有するモノマ、プレポリマ、およびポリマの一種もし
くは二種以上を成分とし、光増感剤を添加することによ
り得られる光重合性感光層。ここで、ラジカル重合性の
エチレン性不飽和結合を有するモノマ、プレポリマ、お
よびポリマとしては公知の沸点100℃以上のアクロイ
ル基またはメタクロイル基を有する化合物ならいずれで
もよく、代表的な例を次に挙げる。(2) A photopolymerizable photosensitive layer containing one or more of radically polymerizable ethylenically unsaturated bond-containing monomers, prepolymers, and polymers as components, and obtained by adding a photosensitizer. Here, the monomer, prepolymer, and polymer having a radically polymerizable ethylenically unsaturated bond may be any known compound having an acroyl group or a methacryloyl group with a boiling point of 100°C or higher, and typical examples are listed below. .
【0014】(1)次に示すアルコ−ル類のアクリル酸
またはメタクリル酸エステル。
メタノ−ル、エタノ−ル、プロパノ−ル、ヘキサノ−ル
、オクタノ−ル、シクロヘキサノ−ル、エチレングリコ
−ル、プロピレングリコ−ル、ジエチレングリコ−ル、
トリエチレングリコ−ル、テトラエチレングリコ−ル、
ポリエチレングリコ−ル、グリセリン、トリメチロ−ル
プロパン、ペンタエリスリト−ル等。(1) Acrylic acid or methacrylic ester of the following alcohols. Methanol, ethanol, propanol, hexanol, octanol, cyclohexanol, ethylene glycol, propylene glycol, diethylene glycol,
triethylene glycol, tetraethylene glycol,
Polyethylene glycol, glycerin, trimethylolpropane, pentaerythritol, etc.
【0015】(2)次に示すアミン類、カルボン酸類と
アクリル酸グリシジルエステル、またはメタクリル酸グ
リシジルエステルとの反応生成物。
メチルアミン、エチルアミン、ブチルアミン、ベンジル
アミン、エチレンジアミン、ジエチレントリアミン、ヘ
キサメチレンジアミン、p−キシリレンジアミン、m−
キシリレンジアミン、エタノ−ルアミン、ジメチルアミ
ン、アニリン等。
酢酸、プロピオン酸、安息香酸、アクリル酸、メタクリ
ル酸、コハク酸、マレイン酸、フタル酸、、酒石酸、ク
エン酸等。(2) A reaction product of the following amines or carboxylic acids with glycidyl acrylate or glycidyl methacrylate. Methylamine, ethylamine, butylamine, benzylamine, ethylenediamine, diethylenetriamine, hexamethylenediamine, p-xylylenediamine, m-
Xylylene diamine, ethanolamine, dimethylamine, aniline, etc. Acetic acid, propionic acid, benzoic acid, acrylic acid, methacrylic acid, succinic acid, maleic acid, phthalic acid, tartaric acid, citric acid, etc.
【0016】(3)次に示すようなアミド誘導体。
アクリルアミド、メタクリルアミド、N−メチロ−ルア
クリルアミド、メチレンビスアクリルアミド、ジアセト
ンアクリルアミド等。(3) Amide derivatives as shown below. Acrylamide, methacrylamide, N-methylolacrylamide, methylenebisacrylamide, diacetone acrylamide, etc.
【0017】(4)エポキシ化合物とアクリル酸または
メタクリル酸との反応物。
(5)イソシアネ−ト含有化合物とβ−ヒドロキシエチ
ルアクリレ−トまたはβ−ヒドロキシエチルメタクリレ
−トとの反応物。(4) A reaction product of an epoxy compound and acrylic acid or methacrylic acid. (5) A reaction product of an isocyanate-containing compound and β-hydroxyethyl acrylate or β-hydroxyethyl methacrylate.
【0018】これらの化合物の一種または二種以上を構
成成分とし、さらに必要があれば、これらの化合物と混
合しえる有機高分子化合物を添加することも可能である
。One or more of these compounds can be used as a constituent component, and if necessary, it is also possible to add an organic polymer compound that can be mixed with these compounds.
【0019】このような有機高分子化合物としては、次
に示すようなポリマ、コポリマを挙げることができる。Examples of such organic polymer compounds include the following polymers and copolymers.
【0020】(1)アクリル酸エステル、メタクリル酸
エステル、アクリロニトリルのポリマ、例えばポリアク
リル酸エチル、ポリアクリル酸ブチル、ポリメタクリル
酸メチル等、およびそれらのコポリマ。
(2)未加硫ゴム、例えばポリブタジエン、、ポリイソ
ブチレン、ポリクロロプレン、スチレンブタジエンゴム
等。
(3)ビニルポリマ、例えばポリ酢酸ビニル、ポリビニ
ルアルコ−ル、ポリブチルブチラ−ル等、およびそれら
のコポリマ。(1) Polymers of acrylic esters, methacrylic esters, acrylonitrile, such as polyethyl acrylate, polybutyl acrylate, polymethyl methacrylate, etc., and copolymers thereof. (2) Unvulcanized rubber, such as polybutadiene, polyisobutylene, polychloroprene, styrene-butadiene rubber, etc. (3) Vinyl polymers, such as polyvinyl acetate, polyvinyl alcohol, polybutyl butyral, etc., and copolymers thereof.
【0021】(4)ポリエ−テル、例えばポリエチレン
オキシド等。
(5)ポリエステル、例えばフタル酸、イソフタル酸、
マレイン酸、アジピン酸等とエチレングリコ−ル、1,
4−ブタンジオ−ル、1,6−ヘキサンジオ−ル、ネオ
ペンチルグリコ−ル等の反応生成物。
(6)ポリウレタン、例えばトリレンジイソシアネ−ト
、ヘキサメチレンジイソシアネ−ト、イソホロンジイソ
シアネ−ト、ジフェニルメタンジイソシアネ−ト等と1
,4−ブタンジオ−ル、1,6−ヘキサンジオ−ル、(
4)のポリエ−テルポリオ−ル、(5)で得られるポリ
エステルポリオ−ル等との反応生成物。
(7)エポキシ樹脂
(8)ポリアミド
添加する光増感剤としては、ベンゾフェノン、フルオレ
ノン、キサントン、チオキサントン、N−メチルアクリ
ドン、N−ブチルアクリドン、ベンゾインエチルエ−テ
ル、4,4´−ビス(ジメチルアミノ)ベンゾフェノン
、4,4´−ビス(ジエチルアミノ)ベンゾフェノン、
2−クロロチオキサントン等が挙げられるが、チオキサ
ントン類、アクリドン類が特に有効である。(4) Polyether, such as polyethylene oxide. (5) Polyesters, such as phthalic acid, isophthalic acid,
Maleic acid, adipic acid, etc. and ethylene glycol, 1,
Reaction products such as 4-butanediol, 1,6-hexanediol, neopentyl glycol, etc. (6) Polyurethane, such as tolylene diisocyanate, hexamethylene diisocyanate, isophorone diisocyanate, diphenylmethane diisocyanate, etc.
, 4-butanediol, 1,6-hexanediol, (
A reaction product with the polyether polyol obtained in (4), the polyester polyol obtained in (5), etc. (7) Epoxy resin (8) Polyamide Photosensitizers to be added include benzophenone, fluorenone, xanthone, thioxanthone, N-methylacridone, N-butylacridone, benzoin ethyl ether, 4,4'-bis (dimethylamino)benzophenone, 4,4'-bis(diethylamino)benzophenone,
Examples include 2-chlorothioxanthone, and thioxanthone and acridones are particularly effective.
【0022】■光二量化型の不飽和モノマを用いる感光
層。例えば桂皮酸エステル類を用いるもの。(2) A photosensitive layer using a photodimerizable unsaturated monomer. For example, those using cinnamic acid esters.
【0023】■エポキシ基を有する化合物とジアゾニウ
ム塩とを組み合わせた感光層。例えば、ジアゾニウム塩
として2,5−ジエトキシ−4−(p−トルイルチオ)
ベンゼンジアゾニウムヘキサフロロフォスフェ−ト等を
用いるもの。(2) A photosensitive layer comprising a combination of a compound having an epoxy group and a diazonium salt. For example, 2,5-diethoxy-4-(p-toluylthio) as a diazonium salt.
Those using benzenediazonium hexafluorophosphate, etc.
【0024】■環化ゴム、ノボラック樹脂とアジド化合
物とを組み合わせた感光層。例えばアジド化合物として
4,4′−ジアジドベンゾフェノン等を用いるもの。(2) A photosensitive layer made of a combination of cyclized rubber, novolac resin and azide compound. For example, 4,4'-diazide benzophenone or the like is used as the azide compound.
【0025】これらの感光層のうちでは■が特に好まし
い。■の感光層の各成分の配合割合については特に限定
されないが、好ましくは前記のラジカル重合性のエチレ
ン性不飽和結合を有するモノマ、プレポリマ、およびポ
リマの一種もしくは二種以上を100重量部、より好ま
しくは有機高分子化合物を1〜500重量部添加し、光
増感剤を0.5〜50重量部加え、膜厚0.1〜100
μでもうけることによって得られるものがよい。Among these photosensitive layers, (2) is particularly preferred. The proportion of each component in the photosensitive layer (2) is not particularly limited, but preferably 100 parts by weight of one or more of the radically polymerizable ethylenically unsaturated bond-containing monomer, prepolymer, and polymer. Preferably, 1 to 500 parts by weight of an organic polymer compound and 0.5 to 50 parts by weight of a photosensitizer are added, and the film thickness is 0.1 to 100 parts by weight.
The one that can be obtained by making it with μ is better.
【0026】前記の諸成分に加えて、必要に応じて染料
、顔料、重合禁止剤等の添加物を加えることも可能であ
る。In addition to the above-mentioned components, additives such as dyes, pigments, and polymerization inhibitors may be added as necessary.
【0027】また、本発明に用いられるシリコ−ン組成
物としては、成分として分子中に1個以上の一般式(I
)で示される構造を有するオルガノポリシロキサンが用
いられる。このようなオルガノポリシロキサンは、例え
ば一般式(III)で示されるシリコ−ン化合物と一般
式(IV)で示されるオルガノポリシロキサンとを、式
(V)のように反応させることにより得られる。The silicone composition used in the present invention also contains one or more compounds of the general formula (I) as a component in the molecule.
) is used. Such an organopolysiloxane can be obtained, for example, by reacting a silicone compound represented by the general formula (III) with an organopolysiloxane represented by the general formula (IV) as shown in the formula (V).
【0028】[0028]
【化5】[C5]
【0029】(式中、R2は炭素数1〜10のアルキル
基、炭素数2〜10のアルケニル基、および炭素数6〜
10のアリ−ル基の群から選ばれる少なくとも1種であ
り、Y、Zは水素原子、ハロゲン原子、アミノ基、アミ
ノオキシ基、炭素数1〜10のアルコキシ基、アミド基
、アシルオキシ基、炭素数2〜10のアルケニルオキシ
基、および炭素数3〜10のケトオキシム基の群から選
ばれる少なくとも1種であり、それぞれ、同一でも異な
っていてもよい。mは0または1を示す。)(In the formula, R2 is an alkyl group having 1 to 10 carbon atoms, an alkenyl group having 2 to 10 carbon atoms, and an alkenyl group having 6 to 10 carbon atoms.
is at least one selected from the group of 10 aryl groups, and Y and Z are hydrogen atoms, halogen atoms, amino groups, aminooxy groups, alkoxy groups having 1 to 10 carbon atoms, amide groups, acyloxy groups, carbon It is at least one selected from the group of alkenyloxy groups having 2 to 10 carbon atoms and ketooxime groups having 3 to 10 carbon atoms, and each of them may be the same or different. m represents 0 or 1. )
【0030
】0030
]
【化6】[C6]
【0031】(式中、R3、R4は炭素数1〜10の置
換もしくは非置換のアルキル基、炭素数2〜10の置換
もしくは非置換のアルケニル基、および炭素数6〜10
の置換もしくは非置換のアリ−ル基の群から選ばれる少
なくとも1種である。lは2以上の整数である。)(In the formula, R3 and R4 are a substituted or unsubstituted alkyl group having 1 to 10 carbon atoms, a substituted or unsubstituted alkenyl group having 2 to 10 carbon atoms, and a substituted or unsubstituted alkenyl group having 6 to 10 carbon atoms.
is at least one kind selected from the group of substituted or unsubstituted aryl groups. l is an integer of 2 or more. )
【0
032】0
032]
【化7】[C7]
【0033】(式中、R2、Y、Z、R3、R4および
lは前述のものと同一である。)一般式(III)で示
されるシリコ−ン化合物と一般式(IV)で示されるオ
ルガノポリシロキサンとの配合割合については特に限定
されないが、好ましくはモル比1:0.5〜1:2で反
応させるのがよい。(In the formula, R2, Y, Z, R3, R4 and l are the same as those described above.) A silicone compound represented by the general formula (III) and an organometallic compound represented by the general formula (IV) Although there are no particular limitations on the blending ratio with polysiloxane, it is preferable to react at a molar ratio of 1:0.5 to 1:2.
【0034】一般式(III)で示されるシリコ−ン化
合物の具体例としては、ジアセトキシメチル(2−ヒド
ロキシ−2−フェニル−2−ベンゾイルエトキシ)シラ
ン、ジアセトキシメチル[2−ヒドロキシ−2−(2−
フリル)−2−(2−フロイル)エトキシ]シラン、ジ
アセトキシメチル[2−ヒドロキシ−2−(2−チオフ
ェン)−2−(2−チオフェンカルボニル)エトキシ]
シラン、ジアセトキシエチル(2−ヒドロキシ−2−フ
ェニル−2−ベンゾイルエトキシ)シラン、ジアセトキ
シエチル[2−ヒドロキシ−2−(2−フリル)−2−
(2−フロイル)エトキシ]シラン、ジアセトキシエチ
ル[2−ヒドロキシ−2−(2−チオフェン)−2−(
2−チオフェンカルボニル)エトキシ]シラン、ジアセ
トキシブチル(2−ヒドロキシ−2−フェニル−2−ベ
ンゾイルエトキシ)シラン、ジアセトキシブチル[2−
ヒドロキシ−2−(2−フリル)−2−(2−フロイル
)エトキシ]シラン、ジアセトキシブチル[2−ヒドロ
キシ−2−(2−チオフェン)−2−(2−チオフェン
カルボニル)エトキシ]シラン、ジアセトキシヘキシル
[2−ヒドロキシ−2−(4−メトキシフェニル)−2
−(4−メトキシベンゾイル)エトキシ]シラン、ジア
セトキシヘキシル[2−ヒドロキシ−2−(2−フリル
)−2−(2−フロイル)エトキシ]シラン、ジアセト
キシヘキシル[2−ヒドロキシ−2−(2−チオフェン
)−2−(2−チオフェンカルボニル)エトキシ]シラ
ン、ジアセトキシオクチル[2−ヒドロキシ−2−(4
−メチルフェニル)−2−(4−メチルベンゾイル)エ
トキシ]シラン、ジアセトキシオクチル[2−ヒドロキ
シ−2−(2−フリル)−2−(2−フロイル)エトキ
シ]シラン、ジアセトキシオクチル[2−ヒドロキシ−
2−(2−チオフェン)−2−(2−チオフェンカルボ
ニル)エトキシ]シラン、ジアセトキシビニル(2−ヒ
ドロキシ−2−フェニル−2−ベンゾイルエトキシ)シ
ラン、ジアセトキシビニル[2−ヒドロキシ−2−(2
−フリル)−2−(2−フロイル)エトキシ]シラン、
ジアセトキシビニル[2−ヒドロキシ−2−(2−チオ
フェン)−2−(2−チオフェンカルボニル)エトキシ
]シラン、ジアセトキシジ(2−ヒドロキシ−2−フェ
ニル−2−ベンゾイルエトキシ)シラン、ジアセトキシ
ジ[2−ヒドロキシ−2−(2−フリル)−2−(2−
フロイル)エトキシ]シラン、ジアセトキシジ[2−ヒ
ドロキシ−2−(2−チオフェン)−2−(2−チオフ
ェンカルボニル)エトキシ]シラン、メチル(2−ヒド
ロキシ−2−フェニル−2−ベンゾイルエトキシ)ジク
ロロシラン、メチル[2−ヒドロキシ−2−(2−フリ
ル)−2−(2−フロイル)エトキシ]ジクロロシラン
、メチル[2−ヒドロキシ−2−(2−チオフェン)−
2−(2−チオフェンカルボニル)エトキシ]ジクロロ
シラン、ジメトキシメチル(2−ヒドロキシ−2−フェ
ニル−2−ベンゾイルエトキシ)シラン、ジメトキシメ
チル[2−ヒドロキシ−2−(2−フリル)−2−(2
−フロイル)エトキシ]シラン、ジメトキシメチル[2
−ヒドロキシ−2−(2−チオフェン)−2−(2−チ
オフェンカルボニル)エトキシ]シラン、ジメトキシエ
チル(2−ヒドロキシ−2−フェニル−2−ベンゾイル
エトキシ)シラン、ジメトキシエチル[2−ヒドロキシ
−2−(2−フリル)−2−(2−フロイル)エトキシ
]シラン、ジメトキシエチル[2−ヒドロキシ−2−(
2−チオフェン)−2−(2−チオフェンカルボニル)
エトキシ]シラン、ジメトキシブチル(2−ヒドロキシ
−2−フェニル−2−ベンゾイルエトキシ)シラン、ジ
メトキシブチル[2−ヒドロキシ−2−(2−フリル)
−2−(2−フロイル)エトキシ]シラン、ジメトキシ
ブチル[2−ヒドロキシ−2−(2−チオフェン)−2
−(2−チオフェンカルボニル)エトキシ]シラン、ジ
エトキシメチル(2−ヒドロキシ−2−フェニル−2−
ベンゾイルエトキシ)シラン、ジエトキシメチル[2−
ヒドロキシ−2−(2−フリル)−2−(2−フロイル
)エトキシ]シラン、ジエトキシメチル[2−ヒドロキ
シ−2−(2−チオフェン)−2−(2−チオフェンカ
ルボニル)エトキシ]シラン、ジエトキシエチル(2−
ヒドロキシ−2−フェニル−2−ベンゾイルエトキシ)
シラン、ジエトキシエチル[2−ヒドロキシ−2−(2
−フリル)−2−(2−フロイル)エトキシ]シラン、
ジエトキシエチル[2−ヒドロキシ−2−(2−チオフ
ェン)−2−(2−チオフェンカルボニル)エトキシ]
シラン、ジメトキシジ(2−ヒドロキシ−2−フェニル
−2−ベンゾイルエトキシ)シラン、ジメトキシジ[2
−ヒドロキシ−2−(2−フリル)−2−(2−フロイ
ル)エトキシ]シラン、ジメトキシジ[2−ヒドロキシ
−2−(2−チオフェン)−2−(2−チオフェンカル
ボニル)エトキシ]シラン、ジエトキシジ(2−ヒドロ
キシ−2−フェニル−2−ベンゾイルエトキシ)シラン
、ジエトキシジ[2−ヒドロキシ−2−(2−フリル)
−2−(2−フロイル)エトキシ]シラン、ジエトキシ
ジ[2−ヒドロキシ−2−(2−チオフェン)−2−(
2−チオフェンカルボニル)エトキシ]シラン、ジブト
キシジ[2−ヒドロキシ−2−(3−エチルフェニル)
−2−(3−エチルベンゾイル)エトキシ]シラン、ジ
ブトキシジ[2−ヒドロキシ−2−(2−フリル)−2
−(2−フロイル)エトキシ]シラン、ジブトキシジ[
2−ヒドロキシ−2−(2−チオフェン)−2−(2−
チオフェンカルボニル)エトキシ]シラン、ジヘキシロ
キシジ(2−ヒドロキシ−2−フェニル−2−ベンゾイ
ルエトキシ)シラン、ジヘキシロキシジ[2−ヒドロキ
シ−2−(2−フリル)−2−(2−フロイル)エトキ
シ]シラン、ジヘキシロキシジ[2−ヒドロキシ−2−
(2−チオフェン)−2−(2−チオフェンカルボニル
)エトキシ]シラン、ジ(メチルエチルケトオキシム)
ジ(2−ヒドロキシ−2−フェニル−2−ベンゾイルエ
トキシ)シラン、ジ(メチルエチルケトオキシム)ジ[
2−ヒドロキシ−2−(2−フリル)−2−(2−フロ
イル)エトキシ]シラン、ジ(メチルエチルケトオキシ
ム)ジ[2−ヒドロキシ−2−(2−チオフェン)−2
−(2−チオフェンカルボニル)エトキシ]シラン、メ
チルジ(メチルエチルケトオキシム)(2−ヒドロキシ
−2−フェニル−2−ベンゾイルエトキシ)シラン、メ
チルジ(メチルエチルケトオキシム)[2−ヒドロキシ
−2−(2−フリル)−2−(2−フロイル)エトキシ
]シラン、メチルジ(メチルエチルケトオキシム)[2
−ヒドロキシ−2−(2−チオフェン)−2−(2−チ
オフェンカルボニル)エトキシ]シラン、ジイソプロペ
ニルメチル(2−ヒドロキシ−2−フェニル−2−ベン
ゾイルエトキシ)シラン、ジイソプロペニルメチル[2
−ヒドロキシ−2−(2−フリル)−2−(2−フロイ
ル)エトキシ]シラン、ジイソプロペニルメチル[2−
ヒドロキシ−2−(2−チオフェン)−2−(2−チオ
フェンカルボニル)エトキシ]シラン等が挙げられるが
、これらに限定されない。これらの内で特に好ましいも
のは、Y、Zがアセトキシ基のものである。Specific examples of the silicone compound represented by the general formula (III) include diacetoxymethyl(2-hydroxy-2-phenyl-2-benzoylethoxy)silane, diacetoxymethyl[2-hydroxy-2- (2-
Furyl)-2-(2-furoyl)ethoxy]silane, diacetoxymethyl[2-hydroxy-2-(2-thiophene)-2-(2-thiophenecarbonyl)ethoxy]
Silane, diacetoxyethyl (2-hydroxy-2-phenyl-2-benzoylethoxy) silane, diacetoxyethyl [2-hydroxy-2-(2-furyl)-2-
(2-furoyl)ethoxy]silane, diacetoxyethyl[2-hydroxy-2-(2-thiophene)-2-(
2-thiophenecarbonyl)ethoxy]silane, diacetoxybutyl(2-hydroxy-2-phenyl-2-benzoylethoxy)silane, diacetoxybutyl[2-
hydroxy-2-(2-furyl)-2-(2-furoyl)ethoxy]silane, diacetoxybutyl[2-hydroxy-2-(2-thiophene)-2-(2-thiophenecarbonyl)ethoxy]silane, Acetoxyhexyl [2-hydroxy-2-(4-methoxyphenyl)-2
-(4-methoxybenzoyl)ethoxy]silane, diacetoxyhexyl[2-hydroxy-2-(2-furyl)-2-(2-furoyl)ethoxy]silane, diacetoxyhexyl[2-hydroxy-2-(2-furyl)-2-(2-furyl)ethoxy]silane, -thiophene)-2-(2-thiophenecarbonyl)ethoxy]silane, diacetoxyoctyl[2-hydroxy-2-(4
-methylphenyl)-2-(4-methylbenzoyl)ethoxy]silane, diacetoxyoctyl[2-hydroxy-2-(2-furyl)-2-(2-furoyl)ethoxy]silane, diacetoxyoctyl[2- hydroxy-
2-(2-thiophene)-2-(2-thiophenecarbonyl)ethoxy]silane, diacetoxyvinyl(2-hydroxy-2-phenyl-2-benzoylethoxy)silane, diacetoxyvinyl[2-hydroxy-2-( 2
-furyl)-2-(2-furoyl)ethoxy]silane,
Diacetoxyvinyl[2-hydroxy-2-(2-thiophene)-2-(2-thiophenecarbonyl)ethoxy]silane, diacetoxydi(2-hydroxy-2-phenyl-2-benzoylethoxy)silane, diacetoxydi[2-hydroxy -2-(2-Frill)-2-(2-
Furoyl)ethoxy]silane, diacetoxydi[2-hydroxy-2-(2-thiophene)-2-(2-thiophenecarbonyl)ethoxy]silane, methyl(2-hydroxy-2-phenyl-2-benzoylethoxy)dichlorosilane, Methyl[2-hydroxy-2-(2-furyl)-2-(2-furoyl)ethoxy]dichlorosilane, methyl[2-hydroxy-2-(2-thiophene)-
2-(2-thiophenecarbonyl)ethoxy]dichlorosilane, dimethoxymethyl(2-hydroxy-2-phenyl-2-benzoylethoxy)silane, dimethoxymethyl[2-hydroxy-2-(2-furyl)-2-(2
-furoyl)ethoxy]silane, dimethoxymethyl[2
-hydroxy-2-(2-thiophene)-2-(2-thiophenecarbonyl)ethoxy]silane, dimethoxyethyl(2-hydroxy-2-phenyl-2-benzoylethoxy)silane, dimethoxyethyl[2-hydroxy-2- (2-furyl)-2-(2-furoyl)ethoxy]silane, dimethoxyethyl[2-hydroxy-2-(
2-thiophene)-2-(2-thiophenecarbonyl)
ethoxy]silane, dimethoxybutyl(2-hydroxy-2-phenyl-2-benzoylethoxy)silane, dimethoxybutyl[2-hydroxy-2-(2-furyl)
-2-(2-furoyl)ethoxy]silane, dimethoxybutyl[2-hydroxy-2-(2-thiophene)-2
-(2-thiophenecarbonyl)ethoxy]silane, diethoxymethyl(2-hydroxy-2-phenyl-2-
benzoylethoxy)silane, diethoxymethyl [2-
hydroxy-2-(2-furyl)-2-(2-furoyl)ethoxy]silane, diethoxymethyl[2-hydroxy-2-(2-thiophene)-2-(2-thiophenecarbonyl)ethoxy]silane, Ethoxyethyl (2-
hydroxy-2-phenyl-2-benzoylethoxy)
Silane, diethoxyethyl [2-hydroxy-2-(2
-furyl)-2-(2-furoyl)ethoxy]silane,
Diethoxyethyl [2-hydroxy-2-(2-thiophene)-2-(2-thiophenecarbonyl)ethoxy]
Silane, dimethoxydi(2-hydroxy-2-phenyl-2-benzoylethoxy)silane, dimethoxydi[2
-hydroxy-2-(2-furyl)-2-(2-furoyl)ethoxy]silane, dimethoxydi[2-hydroxy-2-(2-thiophene)-2-(2-thiophenecarbonyl)ethoxy]silane, diethoxydi( 2-hydroxy-2-phenyl-2-benzoylethoxy)silane, diethoxydi[2-hydroxy-2-(2-furyl)
-2-(2-furoyl)ethoxy]silane, diethoxydi[2-hydroxy-2-(2-thiophene)-2-(
2-thiophenecarbonyl)ethoxy]silane, dibutoxydi[2-hydroxy-2-(3-ethylphenyl)
-2-(3-ethylbenzoyl)ethoxy]silane, dibutoxydi[2-hydroxy-2-(2-furyl)-2
-(2-furoyl)ethoxy]silane, dibutoxydi[
2-Hydroxy-2-(2-thiophene)-2-(2-
thiophenecarbonyl)ethoxy]silane, dihexyloxydi(2-hydroxy-2-phenyl-2-benzoylethoxy)silane, dihexyloxydi[2-hydroxy-2-(2-furyl)-2-(2-furoyl)ethoxy]silane, dihexyloxydi[2-hydroxy-2-(2-furyl)-2-(2-furoyl)ethoxy]silane [2-hydroxy-2-
(2-thiophene)-2-(2-thiophenecarbonyl)ethoxy]silane, di(methylethylketoxime)
Di(2-hydroxy-2-phenyl-2-benzoylethoxy)silane, di(methylethylketoxime)di[
2-hydroxy-2-(2-furyl)-2-(2-furoyl)ethoxy]silane, di(methylethylketoxime)di[2-hydroxy-2-(2-thiophene)-2
-(2-thiophenecarbonyl)ethoxy]silane, methyldi(methylethylketoxime)(2-hydroxy-2-phenyl-2-benzoylethoxy)silane, methyldi(methylethylketoxime)[2-hydroxy-2-(2-furyl)- 2-(2-furoyl)ethoxy]silane, methyldi(methylethylketoxime)[2
-hydroxy-2-(2-thiophene)-2-(2-thiophenecarbonyl)ethoxy]silane, diisopropenylmethyl(2-hydroxy-2-phenyl-2-benzoylethoxy)silane, diisopropenylmethyl[2
-Hydroxy-2-(2-furyl)-2-(2-furoyl)ethoxy]silane, diisopropenylmethyl[2-
Examples include, but are not limited to, hydroxy-2-(2-thiophene)-2-(2-thiophenecarbonyl)ethoxy]silane and the like. Among these, particularly preferred are those in which Y and Z are acetoxy groups.
【0035】また一般式(IV)で示されるオルガノポ
リシロキサンは、分子量1000〜100万のものが好
ましい。具体例としては、ジメチルポリシロキサン、ジ
エチルポリシロキサン、ジブチルポリシロキサン、ジヘ
キシルポリシロキサン、ジオクチルポリシロキサン、メ
チルエチルポリシロキサン、メチルフェニルポリシロキ
サン、メチルビニルポリシロキサン、およびこれらのポ
リシロキサンの混合物等が挙げられるが、メチル基が6
0%を超えるものが特に好ましい。The organopolysiloxane represented by the general formula (IV) preferably has a molecular weight of 1,000 to 1,000,000. Specific examples include dimethylpolysiloxane, diethylpolysiloxane, dibutylpolysiloxane, dihexylpolysiloxane, dioctylpolysiloxane, methylethylpolysiloxane, methylphenylpolysiloxane, methylvinylpolysiloxane, and mixtures of these polysiloxanes. However, the methyl group is 6
Particularly preferred are those exceeding 0%.
【0036】また本発明のシリコ−ン組成物として用い
られる一般式(II)で表わされる架橋剤の具体例とし
ては、メチルトリアセトキシシラン、エチルトリアセト
キシシラン、ブチルトリアセトキシシラン、ビニルトリ
アセトキシシラン、ヘキシルトリアセトキシシラン、オ
クチルトリアセトキシシラン、メチルトリメトキシシラ
ン、エチルトリメトキシシラン、ブチルトリメトキシシ
ラン、メチルトリエトキシシラン、メチルトリクロロシ
ラン、エチルトリクロロシラン、メチルトリ(メチルエ
チルケトオキシム)シラン、エチルトリ(メチルエチル
ケトオキシム)シラン、メチルトリイソプロペニルシラ
ン、テトラアセトキシシラン、テトラメトキシシラン、
テトラエトキシシラン、テトラクロロシラン、テトラ(
メチルエチルケトオキシム)シラン、テトライソプロペ
ニルシラン等が挙げられるが、これらに限定されない。Specific examples of the crosslinking agent represented by the general formula (II) used in the silicone composition of the present invention include methyltriacetoxysilane, ethyltriacetoxysilane, butyltriacetoxysilane, and vinyltriacetoxysilane. , hexyltriacetoxysilane, octyltriacetoxysilane, methyltrimethoxysilane, ethyltrimethoxysilane, butyltrimethoxysilane, methyltriethoxysilane, methyltrichlorosilane, ethyltrichlorosilane, methyltri(methylethylketoxime)silane, ethyltri(methylethylketoxime) ) silane, methyltriisopropenylsilane, tetraacetoxysilane, tetramethoxysilane,
Tetraethoxysilane, tetrachlorosilane, tetra(
Examples include, but are not limited to, methyl ethyl ketoxime) silane, tetraisopropenyl silane, and the like.
【0037】本発明に用いられる硬化触媒としては、シ
ラノ−ル構造どうしを反応させる触媒であればどのよう
なものでもよいが、スズあるいはチタン系触媒が特に好
ましい。具体例としてはジメチルスズジアセテ−ト、ジ
エチルスズジアセテ−ト、ジブチルスズジアセテ−ト、
ジヘキシルスズジアセテ−ト、ジブチルスズジラウレ−
ト、ジブチルスズジマレエ−ト、テトラメトキシチタン
、テトラエトキシチタン、テトラブトキシチタン等が挙
げられるが、これらに限定されない。The curing catalyst used in the present invention may be any catalyst as long as it causes silanol structures to react with each other, but tin or titanium catalysts are particularly preferred. Specific examples include dimethyltin diacetate, diethyltin diacetate, dibutyltin diacetate,
Dihexyltin diacetate, dibutyltin dilauret
Examples include, but are not limited to, dibutyltin dimaleate, tetramethoxytitanium, tetraethoxytitanium, and tetrabutoxytitanium.
【0038】これらの硬化触媒と紫外線等の照射により
、分子中に1個以上の一般式(I)で示される構造を有
するオルガノポリシロキサンは式(VI)の硬化反応を
起こす。By using these curing catalysts and irradiation with ultraviolet rays or the like, the organopolysiloxane having one or more structures represented by the general formula (I) in its molecule undergoes the curing reaction of the formula (VI).
【0039】[0039]
【化8】[Chemical formula 8]
【0040】シリコ−ンゴム層中の各成分の配合割合に
ついては特に限定されないが、好ましくは前記の分子中
に1個以上の一般式(I)で示される構造を有するオル
ガノポリシロキサンを100重量部に、前記の一般式(
II)で表わされる架橋剤を0.1〜20重量部、そし
て前記の硬化触媒を0.1〜10重量部加えた組成で、
膜厚0.5〜50μでもうけることにより得られるもの
がよい。The proportion of each component in the silicone rubber layer is not particularly limited, but preferably 100 parts by weight of organopolysiloxane having one or more structures represented by the general formula (I) in the molecule. , the above general formula (
A composition containing 0.1 to 20 parts by weight of the crosslinking agent represented by II) and 0.1 to 10 parts by weight of the curing catalyst,
It is preferable to obtain a film with a thickness of 0.5 to 50 μm.
【0041】本発明の特徴の一つは、紫外線等の照射に
より式(VI)のような架橋反応を起こすシリコ−ン組
成物を湿し水不要平版印刷用原版のシリコ−ンゴム層に
用いたことである。この湿し水不要平版印刷用原版では
、露光前のシリコ−ンゴム層は溶剤に容易に溶解するが
、露光後の露光部のシリコ−ンゴム層は式(VI)の架
橋反応により硬化するため、露光部(非画線部)と未露
光部(画線部)のシリコ−ンゴム層とでは溶剤に対する
溶解性に大きな差が生じる。そのため物理的な力で未露
光部を除去する必要がなくなり、溶剤による溶解という
化学的な現像のみにより未露光部を簡単に除去できるも
のである。One of the features of the present invention is that a silicone composition that undergoes a crosslinking reaction as shown in formula (VI) when irradiated with ultraviolet rays or the like is used in the silicone rubber layer of a lithographic printing original plate that does not require dampening water. That's true. In this lithographic printing original plate that does not require dampening water, the silicone rubber layer before exposure is easily dissolved in a solvent, but after exposure, the silicone rubber layer in the exposed area is hardened by the crosslinking reaction of formula (VI). There is a large difference in solubility in a solvent between the silicone rubber layer in the exposed area (non-image area) and the unexposed area (image area). Therefore, there is no need to remove the unexposed areas by physical force, and the unexposed areas can be easily removed only by chemical development such as dissolution with a solvent.
【0042】[0042]
【実施例】以下、実施例により、具体的に説明する。[Examples] Hereinafter, the present invention will be explained in detail using examples.
【0043】実施例1
チッソ(株)製PS340(両末端シラノ−ル構造のジ
メチルポリシロキサン)17gとジアセトキシメチル(
2−ヒドロキシ−2−フェニル−2−ベンゾイルエトキ
シ)シラン4gとをトルエン25g中室温で3時間反応
させた。(以下、この反応で得られたポリマを重合体(
I)と略する。)厚さ0.3mmのアルミ板上に下記の
感光層を塗布し、120℃、2分で加熱乾燥し、厚さ6
μの塗膜を形成した。Example 1 17 g of PS340 (dimethylpolysiloxane with silanol structure at both ends) manufactured by Chisso Corporation and diacetoxymethyl (
4 g of 2-hydroxy-2-phenyl-2-benzoylethoxy)silane were reacted in 25 g of toluene at room temperature for 3 hours. (Hereinafter, the polymer obtained by this reaction will be referred to as a polymer (
Abbreviated as I). ) The following photosensitive layer was coated on an aluminum plate with a thickness of 0.3 mm, and dried by heating at 120°C for 2 minutes to form a layer with a thickness of 6 mm.
A coating film of μ was formed.
【0044】
(a)N,N,N′,N′−テトラキス(2−ヒドロキ
シ−3−メタクロイルオキシプロピル)−m−キシリレ
ンジアミン(グリシジルメタクリレ−トとm−キシリレ
ンジアミンの4:1モル比反応物)
100重量部(b)“パン
デックス”T−5201(大日本インキ化学工業(株)
製ポリウレタン樹脂)
150重量部(c)N−メチルア
クリドン
5重量部(d)4
,4′−ビス(ジエチルアミノ)ベンゾフェノン
5重量部(e)ジメチルホルムアミ
ド
800重量部この感光層の上に、
次の組成を有するシリコ−ン溶液を塗布、80℃、3分
で加熱乾燥し、厚さ3μのシリコ−ンゴム層をもうけた
。(a) N,N,N',N'-tetrakis(2-hydroxy-3-methacroyloxypropyl)-m-xylylenediamine (4 of glycidyl methacrylate and m-xylylenediamine: 1 molar ratio reactant)
100 parts by weight (b) “Pandex” T-5201 (Dainippon Ink & Chemicals Co., Ltd.)
Made of polyurethane resin)
150 parts by weight (c) N-methylacridone
5 parts by weight (d) 4
,4'-bis(diethylamino)benzophenone
5 parts by weight (e) dimethylformamide
800 parts by weight on this photosensitive layer,
A silicone solution having the following composition was applied and dried by heating at 80°C for 3 minutes to form a silicone rubber layer with a thickness of 3μ.
【0045】
(a)重合体(I)
100重量部(b)エチルトリアセトキシシラン
2重量部(c)ジブチルスズジアセテ−ト
0.2重量部(d)トルエン
300重量部このようにし
てもうけたシリコ−ンゴム層の表面にポリエステルフィ
ルムをラミネ−トし、平版印刷用原版を得た。この印刷
用原版の表面に150線/インチの画像を有するポジフ
ィルムを真空密着させて、3kWの高圧水銀灯を用いて
55秒露光し、キシレンで現像した。露光部のシリコ−
ンゴム層はキシレン不溶となったが、未露光部のシリコ
−ンゴム層は溶解除去され、容易に現像できた。この現
像のみにより、ポジフィルムに忠実な画像を形成した。
この印刷版を用いて湿し水なしで印刷を行ったところ、
ポジフィルムの画像を忠実に再現した印刷物が得られ、
10万枚以上の印刷が可能である事がわかった。(a) Polymer (I)
100 parts by weight (b) Ethyltriacetoxysilane
2 parts by weight (c) dibutyltin diacetate
0.2 parts by weight (d) toluene
A polyester film was laminated on the surface of the silicone rubber layer (300 parts by weight) thus obtained to obtain a lithographic printing original plate. A positive film having an image of 150 lines/inch was vacuum-adhered to the surface of this printing original plate, exposed for 55 seconds using a 3 kW high-pressure mercury lamp, and developed with xylene. Silicone in exposed area
Although the silicone rubber layer became insoluble in xylene, the silicone rubber layer in the unexposed area was dissolved and removed and could be easily developed. Only by this development, an image faithful to the positive film was formed. When printing was performed using this printing plate without dampening water,
You can obtain printed matter that faithfully reproduces the positive film image,
It turned out that it was possible to print more than 100,000 sheets.
【0046】比較例1厚さ0.3mmのアルミ板上に実
施例1と同様の感光層をもうけ、この感光層の上に、次
の組成を有するシリコ−ン溶液を塗布、80℃、3分で
加熱乾燥し、厚さ3μのシリコ−ンゴム層をもうけた。Comparative Example 1 A photosensitive layer similar to that of Example 1 was formed on an aluminum plate with a thickness of 0.3 mm, and a silicone solution having the following composition was coated on the photosensitive layer, and heated at 80° C. for 30 minutes. It was dried by heating for 30 minutes to form a silicone rubber layer with a thickness of 3 μm.
【0047】
(a)チッソ(株)製PS343.5(両末端シラノ−
ル構造のジメチルポリシロキサン)
100重量部(b)
エチルトリアセトキシシラン
12重量部(c
)ジブチルスズジアセテ−ト
0.2重量部(
d)トルエン
300重量部このようにして得られた印刷用原版を
用いて、実施例1と同様の露光、現像を試みた。しかし
ながら、キシレンで溶解するだけでは未露光部のシリコ
−ンゴム層は除去されず、それゆえポジフィルムに忠実
な画像を得ることはできなかった。この印刷版を用いて
印刷を行ったところ、ポジフィルムの画像を忠実に再現
した印刷物は得られなかった。(a) PS343.5 manufactured by Chisso Corporation (silano-terminated at both ends)
dimethylpolysiloxane with a structure of
100 parts by weight (b)
Ethyltriacetoxysilane
12 parts by weight (c
) Dibutyltin diacetate
0.2 parts by weight (
d) Toluene
300 parts by weight Using the printing original plate thus obtained, exposure and development were attempted in the same manner as in Example 1. However, simply dissolving with xylene did not remove the silicone rubber layer in the unexposed areas, and therefore it was not possible to obtain an image faithful to a positive film. When printing was carried out using this printing plate, a printed matter that faithfully reproduced the image of the positive film could not be obtained.
【0048】実施例2
チッソ(株)製PS341(両末端シラノ−ル構造のジ
メチルポリシロキサン)30gとジアセトキシジ(2−
ヒドロキシ−2−フェニル−2−ベンゾイルエトキシ)
シラン4.5gとをトルエン41g中室温で3時間反応
させた。(以下、この反応で得られたポリマを重合体(
II)と略する。)実施例1の重合体(I)の代わりに
重合体(II)を用いて実施例1と同様の印刷用原版を
作製した。Example 2 30 g of PS341 (dimethylpolysiloxane with silanol structure at both ends) manufactured by Chisso Corporation and diacetoxydi(2-
hydroxy-2-phenyl-2-benzoylethoxy)
4.5 g of silane was reacted with 41 g of toluene at room temperature for 3 hours. (Hereinafter, the polymer obtained by this reaction will be referred to as a polymer (
It is abbreviated as II). ) A printing original plate similar to that in Example 1 was prepared using Polymer (II) instead of Polymer (I) in Example 1.
【0049】この印刷用原版を用いて、実施例1と同様
の露光、現像を行ったところ、キシレンで溶解するだけ
でポジフィルムに忠実な画像を得ることができた。この
印刷版を用いて湿し水なしで印刷を行ったところ、ポジ
フィルムを忠実に再現した印刷物が得られ、10万枚以
上の印刷が可能であることがわかった。When this printing original plate was used for exposure and development in the same manner as in Example 1, it was possible to obtain an image faithful to a positive film simply by dissolving it with xylene. When printing was carried out using this printing plate without dampening water, it was found that printed matter that faithfully reproduced positive film was obtained, and that more than 100,000 copies could be printed.
【0050】実施例3
チッソ(株)製PS342.5(両末端シラノ−ル構造
のジメチルポリシロキサン)40gとジ[2−ヒドロキ
シ−2−(2−フリル)−2−(2−フロイル)エトキ
シ]ジクロロシラン1.2gとをトルエン49g中室温
で3時間反応させた。(以下、この反応で得られたポリ
マを重合体(III)と略する。)実施例1の重合体(
I)の代わりに重合体(III)を用いて実施例1と同
様の印刷用原版を作製した。Example 3 40 g of PS342.5 (dimethylpolysiloxane with silanol structure at both ends) manufactured by Chisso Corporation and di[2-hydroxy-2-(2-furyl)-2-(2-furoyl)ethoxy] ] 1.2 g of dichlorosilane was reacted in 49 g of toluene at room temperature for 3 hours. (Hereinafter, the polymer obtained by this reaction will be abbreviated as polymer (III).) The polymer of Example 1 (
A printing original plate similar to that in Example 1 was prepared using polymer (III) instead of I).
【0051】この印刷用原版を用いて、実施例1と同様
の露光、現像を行ったところ、キシレンで溶解するだけ
でポジフィルムに忠実な画像を得ることができた。この
印刷版を用いて湿し水なしで印刷を行ったところ、ポジ
フィルムを忠実に再現した印刷物が得られ、10万枚以
上の印刷が可能であることがわかった。When this printing original plate was used for exposure and development in the same manner as in Example 1, an image faithful to a positive film could be obtained simply by dissolving it in xylene. When printing was carried out using this printing plate without dampening water, it was found that printed matter that faithfully reproduced positive film was obtained, and that more than 100,000 copies could be printed.
【0052】実施例4
チッソ(株)製PS340(両末端シラノ−ル構造のジ
メチルポリシロキサン)17gとジアセトキシジ[2−
ヒドロキシ−2−(2−チオフェン)−2−(2−チオ
フェンカルボニル)エトキシ]シラン6.2gとをトル
エン28g中室温で3時間反応させた。(以下、この反
応で得られたポリマを重合体(IV)と略する。)実施
例1の重合体(I)の代わりに重合体(IV)を用いて
実施例1と同様の印刷用原版を作製した。Example 4 17 g of PS340 (dimethylpolysiloxane with silanol structure at both ends) manufactured by Chisso Corporation and diacetoxydi[2-
6.2 g of hydroxy-2-(2-thiophene)-2-(2-thiophenecarbonyl)ethoxy]silane was reacted in 28 g of toluene at room temperature for 3 hours. (Hereinafter, the polymer obtained by this reaction will be abbreviated as Polymer (IV).) The same printing original plate as in Example 1 was prepared using Polymer (IV) instead of Polymer (I) in Example 1. was created.
【0053】この印刷用原版を用いて、実施例1と同様
の露光、現像を行ったところ、キシレンで溶解するだけ
でポジフィルムに忠実な画像を得ることができた。この
印刷版を用いて湿し水なしで印刷を行ったところ、ポジ
フィルムを忠実に再現した印刷物が得られ、10万枚以
上の印刷が可能であることがわかった。When this printing original plate was exposed and developed in the same manner as in Example 1, it was possible to obtain an image faithful to a positive film simply by dissolving it in xylene. When printing was carried out using this printing plate without dampening water, it was found that printed matter that faithfully reproduced positive film was obtained, and that more than 100,000 copies could be printed.
【0054】[0054]
【発明の効果】本発明は上述のごとく構成し、感光性が
あり、紫外線等の露光に対して高い光硬化性を示し、か
つ露光前には溶剤に簡単に溶解するシリコ−ンゴム層を
有しているので、露光部と未露光部における溶剤に対す
る溶解性に大きな差を発生させ、未露光部のシリコ−ン
ゴム層を物理的な力で除去する必要がなく、溶剤による
溶解のみで除去できる、現像工程全体が極めて簡単な湿
し水不要平版印刷用原版を得ることができる。Effects of the Invention The present invention is constructed as described above, and has a silicone rubber layer that is photosensitive, exhibits high photocurability when exposed to ultraviolet light, and is easily dissolved in a solvent before exposure. This creates a large difference in solubility in solvents between the exposed and unexposed areas, and there is no need to use physical force to remove the silicone rubber layer in the unexposed areas, and it can be removed simply by dissolving it with a solvent. , it is possible to obtain a lithographic printing original plate in which the entire development process is extremely simple and does not require dampening water.
Claims (1)
ゴム層をこの順に設けてなる湿し水不要平版印刷用原版
において、該シリコ−ンゴム層が下記のA、B、および
C成分から主としてなる光硬化性シリコ−ン組成物であ
ることを特徴とする湿し水不要平版印刷用原版。 A.分子中に1個以上の一般式(I)で示される構造を
有するオルガノポリシロキサン 【化1】 (式中、Wは水素原子、ハロゲン原子、炭素数1〜10
のアルキル基、アルコキシ基、アシルオキシ基、炭素数
2〜10のアルケニル基、炭素数6〜10のアリ−ル基
、およびアルコキシカルボニル基の群から選ばれる少な
くとも1種である。) B.一般式(II)で表わされる架橋剤【化2】 (式中、R1は炭素数1〜10のアルキル基、炭素数2
〜10のアルケニル基、および炭素数6〜10のアリ−
ル基の群から選ばれる少なくとも1種であり、Xは水素
原子、ハロゲン原子、アミノ基、アミノオキシ基、炭素
数1〜10のアルコキシ基、アミド基、アシルオキシ基
、炭素数2〜10のアルケニルオキシ基、および炭素数
3〜10のケトオキシム基の群から選ばれる少なくとも
1種である。nは0または1である。)C.硬化触媒Claim 1. A lithographic printing original plate that does not require dampening water, comprising a photocurable photosensitive layer and a silicone rubber layer provided in this order on a substrate, wherein the silicone rubber layer is made of the following components A, B, and C. A lithographic printing original plate that does not require dampening water and is characterized by being mainly a photocurable silicone composition. A. Organopolysiloxane having one or more structures represented by the general formula (I) in the molecule [Formula 1] (wherein, W is a hydrogen atom, a halogen atom, a carbon number of 1 to 10
is at least one selected from the group consisting of an alkyl group, an alkoxy group, an acyloxy group, an alkenyl group having 2 to 10 carbon atoms, an aryl group having 6 to 10 carbon atoms, and an alkoxycarbonyl group. ) B. A crosslinking agent represented by the general formula (II) [Chemical formula 2] (wherein, R1 is an alkyl group having 1 to 10 carbon atoms,
~10 alkenyl groups, and aryl groups having 6 to 10 carbon atoms
X is a hydrogen atom, a halogen atom, an amino group, an aminooxy group, an alkoxy group having 1 to 10 carbon atoms, an amide group, an acyloxy group, and an alkenyl group having 2 to 10 carbon atoms. It is at least one selected from the group of oxy groups and ketooxime groups having 3 to 10 carbon atoms. n is 0 or 1. )C. curing catalyst
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP6695791A JPH04301641A (en) | 1991-03-29 | 1991-03-29 | Damping-waterless planographic printing plate |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP6695791A JPH04301641A (en) | 1991-03-29 | 1991-03-29 | Damping-waterless planographic printing plate |
Publications (1)
Publication Number | Publication Date |
---|---|
JPH04301641A true JPH04301641A (en) | 1992-10-26 |
Family
ID=13331015
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP6695791A Pending JPH04301641A (en) | 1991-03-29 | 1991-03-29 | Damping-waterless planographic printing plate |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH04301641A (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6040115A (en) * | 1996-11-14 | 2000-03-21 | Kodak Polychrome Graphics Llc | Processless planographic printing plate |
-
1991
- 1991-03-29 JP JP6695791A patent/JPH04301641A/en active Pending
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6040115A (en) * | 1996-11-14 | 2000-03-21 | Kodak Polychrome Graphics Llc | Processless planographic printing plate |
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