JPH04298343A - Composite type damping metal plate - Google Patents
Composite type damping metal plateInfo
- Publication number
- JPH04298343A JPH04298343A JP3176591A JP3176591A JPH04298343A JP H04298343 A JPH04298343 A JP H04298343A JP 3176591 A JP3176591 A JP 3176591A JP 3176591 A JP3176591 A JP 3176591A JP H04298343 A JPH04298343 A JP H04298343A
- Authority
- JP
- Japan
- Prior art keywords
- conductive filler
- resin layer
- metal plate
- viscoelastic resin
- particle size
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
- 229910052751 metal Inorganic materials 0.000 title claims abstract description 38
- 239000002184 metal Substances 0.000 title claims abstract description 38
- 238000013016 damping Methods 0.000 title claims abstract description 24
- 239000002131 composite material Substances 0.000 title claims abstract description 16
- 229920005989 resin Polymers 0.000 claims abstract description 35
- 239000011347 resin Substances 0.000 claims abstract description 35
- 239000011231 conductive filler Substances 0.000 claims abstract description 32
- 239000002245 particle Substances 0.000 claims abstract description 29
- 238000003466 welding Methods 0.000 abstract description 17
- 238000009826 distribution Methods 0.000 abstract description 2
- 238000004519 manufacturing process Methods 0.000 abstract description 2
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 4
- 229910000831 Steel Inorganic materials 0.000 description 4
- 239000000463 material Substances 0.000 description 4
- 238000000034 method Methods 0.000 description 4
- 239000010959 steel Substances 0.000 description 4
- 229910001335 Galvanized steel Inorganic materials 0.000 description 3
- 239000000853 adhesive Substances 0.000 description 3
- 230000001070 adhesive effect Effects 0.000 description 3
- 239000011248 coating agent Substances 0.000 description 3
- 238000000576 coating method Methods 0.000 description 3
- 230000007547 defect Effects 0.000 description 3
- 239000008397 galvanized steel Substances 0.000 description 3
- 239000002966 varnish Substances 0.000 description 3
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 230000000704 physical effect Effects 0.000 description 2
- 229920001225 polyester resin Polymers 0.000 description 2
- 239000004645 polyester resin Substances 0.000 description 2
- 239000000843 powder Substances 0.000 description 2
- 239000002904 solvent Substances 0.000 description 2
- 239000010935 stainless steel Substances 0.000 description 2
- 229910001220 stainless steel Inorganic materials 0.000 description 2
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 239000004566 building material Substances 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 239000005038 ethylene vinyl acetate Substances 0.000 description 1
- 238000001125 extrusion Methods 0.000 description 1
- 229910002804 graphite Inorganic materials 0.000 description 1
- 239000010439 graphite Substances 0.000 description 1
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 238000005192 partition Methods 0.000 description 1
- 229920001200 poly(ethylene-vinyl acetate) Polymers 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 229920002689 polyvinyl acetate Polymers 0.000 description 1
- 239000011118 polyvinyl acetate Substances 0.000 description 1
- 229920000915 polyvinyl chloride Polymers 0.000 description 1
- 239000004800 polyvinyl chloride Substances 0.000 description 1
- 238000005507 spraying Methods 0.000 description 1
- 229920005992 thermoplastic resin Polymers 0.000 description 1
- 229920001187 thermosetting polymer Polymers 0.000 description 1
- 238000005406 washing Methods 0.000 description 1
- 229910052725 zinc Inorganic materials 0.000 description 1
- 239000011701 zinc Substances 0.000 description 1
Abstract
Description
【００１】001
【産業上の利用分野】本発明は、振動による騒音が問題
になる構造体において、抵抗溶接で固着する場合に適し
た複合型制振金属板に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a composite vibration-damping metal plate suitable for being fixed by resistance welding in structures where noise caused by vibration is a problem.
【００２】002]
【従来技術】近年、一般家庭や職場では、作業環境改善
のため、騒音や振動を規制する傾向にある。このような
動向に対応するため、装置メ−カ−では騒音源や振動源
の部材や外板に制振性を付与したり、制振性能を向上さ
せることを試み、その一環として複合型制振金属板を使
用している。BACKGROUND OF THE INVENTION In recent years, there has been a trend in general households and workplaces to regulate noise and vibration in order to improve the working environment. In order to respond to these trends, equipment manufacturers are trying to improve vibration damping performance by adding damping properties to the parts and outer panels of noise and vibration sources, and as part of these efforts, they have introduced composite mold control. A shaken metal plate is used.
【００３】この複合型制振金属板として、従来一般に使
用されているものは、２枚の金属板の間に膜厚が２０μ
ｍ以上の粘弾性樹脂層を形成して、サンドイッチ構造に
したもので、その制振作用は、金属板に加えられた振動
エネルギ−を粘弾性樹脂層で熱エネルギ−に変換して、
振動や振動による騒音を低減させることに基づいている
。[003] The composite damping metal plate that has been commonly used has a film thickness of 20 μm between the two metal plates.
A sandwich structure is formed by forming a viscoelastic resin layer with a thickness of more than m.
It is based on reducing vibrations and noise caused by vibrations.
【００４】ところで、この複合型制振金属板は、従来よ
り洗濯機やプリンタ−の外板、自動車のオイルパンやル
−ムパ−テ−ションパネル、建材のシャッタ−や屋根に
使用されているが、これらの用途に使用する場合、用途
によってはスポット溶接のような抵抗溶接で固着せねば
ならない場合がある。By the way, this composite vibration-damping metal plate has been used for the outer panels of washing machines and printers, the oil pans and room partition panels of automobiles, and the shutters and roofs of building materials. However, when used for these purposes, it may be necessary to fix the material by resistance welding such as spot welding depending on the purpose.
【００５】しかし、複合型制振金属板には、中間に絶縁
体の粘弾性樹脂層が存在するため、外側の金属板に電極
を接続しただけでは抵抗溶接できない。そこで、抵抗溶
接する場合には、両側の金属板の間に短絡回路を別途設
けて、溶接初期段階にその短絡回路に電流を流すことに
より溶接部分の樹脂を溶融させ、その後、両側の金属板
を接触させて、両金属板の間に電流を流す分流溶接法に
よらなければならなかった。しかし、この方法は、短絡
回路を設けなければならず、また、溶接時間も長いため
、作業性に劣るものであった。However, since the composite damping metal plate has an insulating viscoelastic resin layer in the middle, resistance welding cannot be performed simply by connecting an electrode to the outer metal plate. Therefore, when performing resistance welding, a short circuit is separately provided between the metal plates on both sides, and a current is passed through the short circuit during the initial stage of welding to melt the resin at the welding part, and then the metal plates on both sides are brought into contact. Therefore, it was necessary to use a shunt welding method in which a current is passed between the two metal plates. However, this method requires a short circuit and requires a long welding time, resulting in poor workability.
【００６】そこで、このような作業性の問題のない複合
型制振金属板として、粘弾性樹脂層に導電性フィラ−を
含有させて、粘弾性樹脂層に導電性を付与することによ
りダイレクト溶接可能にしたものが開発されている。こ
の複合型制振金属板では、粘弾性樹脂層の膜厚より小さ
い導電性フィラ−を用いると、導電性フィラ−の一部し
か金属板と接触せず、良好な溶接性を得ることができな
いため、製造の際、目標膜厚より大きい導電フィラ−を
樹脂に予め分散させて、金属板積層時に強い圧力をかけ
て、粘弾性樹脂層を変形させ、導電性フィラ−の大部分
が金属板と接触するようにしていた。[006] Therefore, in order to create a composite type vibration damping metal plate that does not have such workability problems, a conductive filler is contained in the viscoelastic resin layer to impart conductivity to the viscoelastic resin layer, so that direct welding can be performed. Something has been developed that makes it possible. In this composite vibration-damping metal plate, if a conductive filler that is smaller than the thickness of the viscoelastic resin layer is used, only a portion of the conductive filler comes into contact with the metal plate, making it impossible to obtain good weldability. Therefore, during manufacturing, a conductive filler larger than the target film thickness is dispersed in the resin in advance, and strong pressure is applied when laminating the metal plates to deform the viscoelastic resin layer, so that most of the conductive filler is dispersed in the metal plate. I was trying to get in touch with him.
【００７】007]
【発明が解決しようとする課題】しかしながら、導電性
フィラ−の大部分が金属板と接触するようにすると、導
電性フィラ−が両側の金属板のずり変形を拘束するため
、制振性が低下し、また、膜厚より大きい導電性フィラ
−は高価であるため、導電性フィラ−を含有させない複
合型制振金属板に比べて大きなコストアップになるもの
であった。本発明は、かかる問題を解決した複合型制振
金属板を提供するものである。[Problem to be Solved by the Invention] However, if most of the conductive filler is in contact with the metal plate, the conductive filler restrains the shear deformation of the metal plates on both sides, resulting in a decrease in vibration damping performance. Furthermore, since a conductive filler larger than the film thickness is expensive, the cost increases significantly compared to a composite damping metal plate that does not contain a conductive filler. The present invention provides a composite damping metal plate that solves this problem.
【００８】008
【課題を解決するための手段】本発明は、粘弾性樹脂層
に粒径の異なる２種の導電性フィラ−を含有させて、制
振性の向上とコストダウンを図った。すなわち、重量分
布基準で粒子の球相当径を測定した場合の重量平均粒径
を導電性フィラ−の重量平均粒径ｄμｍと定義した場合
、該重量平均粒径ｄμｍが粘弾性樹脂層の膜厚Ｔμｍの
０．８〜３．０倍の導電性フィラ−０．３〜７体積％と
、０．５μｍ以上、膜厚Ｔμｍの０．８倍未満の導電性
フィラ−０．１〜１０体積％とを粘弾性樹脂層に含有さ
せた。[Means for Solving the Problems] In the present invention, two types of conductive fillers having different particle sizes are contained in a viscoelastic resin layer to improve vibration damping properties and reduce costs. In other words, if the weight average particle diameter when measuring the equivalent spherical diameter of particles based on weight distribution is defined as the weight average particle diameter dμm of the conductive filler, then the weight average particle diameter dμm is the thickness of the viscoelastic resin layer. Conductive filler with a thickness of 0.8 to 3.0 times Tμm - 0.3 to 7% by volume; conductive filler with a thickness of 0.5 μm or more and less than 0.8 times Tμm - 0.1 to 10% by volume were contained in the viscoelastic resin layer.
【００９】009]
【作用】ここで、粒径の大きい導電性フィラ−として、
重量平均粒径ｄμｍが粘弾性樹脂の膜厚Ｔμｍの０．８
〜３．０倍のものを０．３〜７体積％含有させるように
したのは、粒径、含有量がこれらの下限より小さいと、
充分な抵抗溶接性が得られず、上限より大きいと、粘弾
性樹脂層と金属板との接着力が不足してしまうからであ
る。導電性フィラ−の粒径としては、重量平均粒径が粘
弾性樹脂の膜厚Ｔμｍの０．９〜２．０倍のものが好ま
しく、含有量としては、０．５〜５体積％が好ましい。[Function] Here, as a conductive filler with a large particle size,
The weight average particle diameter dμm is 0.8 of the film thickness Tμm of the viscoelastic resin.
The reason why the particle size and content are smaller than these lower limits is that the particle size and content are smaller than these lower limits.
This is because sufficient resistance weldability cannot be obtained, and if the resistance is greater than the upper limit, the adhesive force between the viscoelastic resin layer and the metal plate will be insufficient. The particle size of the conductive filler is preferably one in which the weight average particle size is 0.9 to 2.0 times the film thickness T μm of the viscoelastic resin, and the content is preferably 0.5 to 5% by volume. .
【０１０】また、粒径の小さい導電性フィラ−として、
重量平均粒径が０．５μｍ以上、膜厚Ｔμｍの０．８倍
未満のものを０．１〜１０体積％含有させるようにした
のは、粒径、含有量がこれらの下限より小さいと、抵抗
溶接性を改善する効果が小さく、上限より大きいと、粘
弾性樹脂層と金属板との接着力が不足してしまうからで
ある。この導電性フィラ−の粒径としては、重量平均粒
径が０．８μｍ以上、粘弾性樹脂の膜厚Ｔμｍの０．５
倍未満のものが好ましく、含有量としては、０．５〜５
体積％が好ましい。[010] Also, as a conductive filler with a small particle size,
The reason why particles with a weight average particle size of 0.5 μm or more and less than 0.8 times the film thickness T μm are contained is 0.1 to 10% by volume, because if the particle size and content are smaller than these lower limits, This is because the effect of improving resistance weldability is small, and if it is larger than the upper limit, the adhesive force between the viscoelastic resin layer and the metal plate will be insufficient. The particle size of this conductive filler is such that the weight average particle size is 0.8 μm or more and 0.5 μm of the film thickness T μm of the viscoelastic resin.
Preferably, the content is less than 0.5 to 5 times
Volume % is preferred.
【０１１】前記２種の導電性フィラ−は、含有させる粘
弾性樹脂の物性、例えば、軟化温度、高温での粘度など
により溶接性が異なるので、前記含有量の範囲内で含有
割合を調整する。[011] The two types of conductive fillers have different weldability depending on the physical properties of the viscoelastic resin they contain, such as softening temperature and viscosity at high temperatures, so the content ratio is adjusted within the above content range. .
【０１２】各導電性フィラ−は、同一材質のものを使用
してもよく、異なった材質のものを混合使用してもよい
。導電性フィラ−としては、従来、鉄、ステンレス、銅
、亜鉛、ニッケルなどの金属粉末やグラファイト粉末な
どが使用されているが、材質の限定はなく、従来より使
用されているもの、あるいはこれと同等以上の物性を示
すものであれば使用できる。Each conductive filler may be made of the same material, or may be a mixture of different materials. Conventionally, metal powders such as iron, stainless steel, copper, zinc, and nickel, and graphite powders have been used as conductive fillers, but there are no limitations on the material. It can be used as long as it exhibits the same or better physical properties.
【０１３】粘弾性樹脂や金属板の種類にも限定はなく、
好ましい粘弾性樹脂としては、ポリ酢酸ビニル、エチレ
ン−酢酸ビニル共重合体、ポリ塩化ビニルなどの熱可塑
性樹脂やポリエステル系、エポキシ系などの熱硬化性樹
脂が掲げられ、好ましい金属板としては、冷延鋼板、各
種めっき鋼板、ステンレス鋼板、アルミニウム板などが
掲げられる。[013] There are no restrictions on the type of viscoelastic resin or metal plate.
Preferred viscoelastic resins include thermoplastic resins such as polyvinyl acetate, ethylene-vinyl acetate copolymer, and polyvinyl chloride, and thermosetting resins such as polyester and epoxy resins. Products include rolled steel sheets, various types of plated steel sheets, stainless steel sheets, and aluminum sheets.
【０１４】本発明の複合型制振金属板の製造は、粘弾性
樹脂がワニスである場合、ワニス中に導電性フィラ−を
所定量分散させて、それをロ−ルコ−ト法やスプレ−法
で片方の金属板に塗布した後、溶剤の乾燥あるいは焼き
付けを行って、塗布面に他の金属板を貼合わせ、両金属
板を加圧ロ−ルやプレスで圧着すればよい。また、粘弾
性樹脂がフィルムである場合には、ロ−ルミルやニ−ダ
−などの混練機により導電性フィラ−を樹脂中に練り込
んで、それを押し出し機などで押し出して、まずフィル
ムを作製した後、このフィルムの両側に金属板を貼合わ
せて、加熱しながら加圧ロ−ルやプレスで圧着する方法
、あるいはフィルムの押し出しを金属板の上に行って、
押し出し直後に他の金属板を貼合わせ、両金属板を加圧
ロ−ルなどで圧着する方法によればよい。[014] When the viscoelastic resin is a varnish, the composite damping metal plate of the present invention can be manufactured by dispersing a predetermined amount of conductive filler in the varnish and applying it by roll coating or spray coating. After coating one metal plate by the method, the solvent is dried or baked, another metal plate is bonded to the coated surface, and both metal plates are pressed together using a pressure roll or press. In addition, when the viscoelastic resin is a film, conductive filler is kneaded into the resin using a kneader such as a roll mill or kneader, and then extruded using an extruder to form a film. After the film is produced, metal plates are pasted on both sides of the film, and the film is crimped with a pressure roll or press while heating, or the film is extruded onto the metal plate.
Immediately after extrusion, another metal plate may be bonded together, and both metal plates may be crimped using a pressure roll or the like.
【０１５】粘弾性樹脂層の膜厚は、２０〜１００μｍに
するのが好ましい。２０μｍ未満であると、接着力や制
振性が低く、１００μｍを超えると、プレス加工や絞り
加工のような成形加工性が低下する。[015] The thickness of the viscoelastic resin layer is preferably 20 to 100 μm. If it is less than 20 μm, adhesive strength and vibration damping properties will be low, and if it exceeds 100 μm, moldability such as press working or drawing work will be deteriorated.
【０１６】016]
【実施例】ポリエステル系樹脂ワニスに表１に示すよう
に重量平均粒径の大きいＡグル−プと重量平均粒径の小
さいＢグル−プのニッケル粉末を所定量均一に混合分散
させて、それを溶融亜鉛めっき鋼帯（板厚０．４ｍｍ）
にロ−ルコ−タ−で塗布した後、溶剤の乾燥、焼き付け
を行って、樹脂面に同一の溶融亜鉛めっき鋼帯を加圧ロ
−ルで積層し、粘弾性樹脂層膜厚が４５μｍの複合型制
振鋼帯を製造した。なお、ニッケル粉末としては、重量
平均粒径が２００μｍ、６０μｍ、４８μｍ、１４μｍ
、３μｍ、０．４μｍのものを分散させた。[Example] As shown in Table 1, a predetermined amount of nickel powder of Group A with a large weight average particle size and Group B with a small weight average particle size is uniformly mixed and dispersed in a polyester resin varnish. Hot dip galvanized steel strip (plate thickness 0.4mm)
After coating with a roll coater, the solvent was dried and baked, and the same hot-dip galvanized steel strip was laminated on the resin surface with a pressure roll to form a viscoelastic resin layer with a thickness of 45 μm. A composite damping steel strip was manufactured. The nickel powder has a weight average particle size of 200 μm, 60 μm, 48 μm, and 14 μm.
, 3 μm, and 0.4 μm were dispersed.
【０１７】以上のようにして製造した複合型制振鋼帯の
制振性、溶接性を次の方法で試験した。この試験結果を
表２に示す。
（１）制振性
寸法１５ｍｍ×２００ｍｍの試験片の温度２０℃での損
失係数ηを電磁加振法により測定し、周波数２００Ｈｚ
に換算した。The vibration damping properties and weldability of the composite vibration damping steel strip produced as described above were tested in the following manner. The test results are shown in Table 2. (1) Vibration damping The loss coefficient η of a test piece with dimensions 15 mm x 200 mm at a temperature of 20°C was measured by the electromagnetic vibration method, and the frequency was 200 Hz.
It was converted into
【０１８】（２）溶接性
寸法２５ｍｍ×１００ｍｍの試験片を板厚０．５ｍｍの
溶融亜鉛めっき鋼板にスポット溶接した。溶接は、先端
径４．０ｍｍの電極を用いて、加圧力２００Ｋｇ、通電
時間６サイクル、通電電流１０ＫＡの条件で各試験片当
たり５０回繰り返し、溶接状態を外観から評価し、溶接
欠陥毎に欠陥発生率を計算した。なお、溶接欠陥で円周
切れとはナゲットの円周部が溶断する現象である。(2) Weldability A test piece with dimensions of 25 mm x 100 mm was spot welded to a hot-dip galvanized steel plate with a thickness of 0.5 mm. Welding was repeated 50 times for each test piece using an electrode with a tip diameter of 4.0 mm under the conditions of a pressurizing force of 200 kg, energizing time 6 cycles, and energizing current 10 KA.The welding condition was evaluated from the appearance and defects were identified for each welding defect. Incidence rates were calculated. Note that a circumferential break due to a welding defect is a phenomenon in which the circumferential portion of the nugget is fused.
【０１９】019]
【表１】[Table 1]
【０２０】020]
【表２】[Table 2]
【０２１】021]
【発明の効果】以上のように、本発明の複合型制振金属
板は、抵抗溶接でダイレクト溶接可能であると同時に、
優れた制振性を示す。また、粘弾性樹脂層膜厚より大き
い高価な導電性フィラ−の使用量を少なくできるため、
コストダウンできる。[Effects of the Invention] As described above, the composite vibration damping metal plate of the present invention can be directly welded by resistance welding, and at the same time,
Shows excellent vibration damping properties. In addition, since the amount of expensive conductive filler that is larger than the thickness of the viscoelastic resin layer can be reduced,
Cost can be reduced.
Claims (1)
させた粘弾性樹脂層を形成し、その粘弾性樹脂層の膜厚
が２０μｍ以上である複合型制振金属板において、重量
分布基準で粒子の球相当径を測定した場合の重量平均粒
径を導電性フィラ−の重量平均粒径ｄμｍと定義した場
合、該重量平均粒径ｄμｍが粘弾性樹脂層の膜厚Ｔμｍ
の０．８〜３．０倍の導電性フィラ−０．３〜７体積％
と、０．５μｍ以上、膜厚Ｔμｍの０．８倍未満の導電
性フィラ−０．１〜１０体積％とを粘弾性樹脂層に含有
させたことを特徴とする複合型制振金属板。[Claim 1] A composite vibration damping metal plate in which a viscoelastic resin layer containing a conductive filler is formed between two metal plates, and the thickness of the viscoelastic resin layer is 20 μm or more. If the weight average particle diameter when measuring the equivalent spherical diameter of the particles as a standard is defined as the weight average particle diameter dμm of the conductive filler, then the weight average particle diameter dμm is the thickness Tμm of the viscoelastic resin layer.
0.8 to 3.0 times the conductive filler - 0.3 to 7% by volume
and 0.1 to 10% by volume of a conductive filler having a thickness of 0.5 μm or more and less than 0.8 times the film thickness T μm in a viscoelastic resin layer.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3176591A JPH04298343A (en) | 1991-01-31 | 1991-01-31 | Composite type damping metal plate |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3176591A JPH04298343A (en) | 1991-01-31 | 1991-01-31 | Composite type damping metal plate |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH04298343A true JPH04298343A (en) | 1992-10-22 |
Family
ID=12340137
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP3176591A Withdrawn JPH04298343A (en) | 1991-01-31 | 1991-01-31 | Composite type damping metal plate |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH04298343A (en) |
-
1991
- 1991-01-31 JP JP3176591A patent/JPH04298343A/en not_active Withdrawn
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A300 | Application deemed to be withdrawn because no request for examination was validly filed |
Free format text: JAPANESE INTERMEDIATE CODE: A300 Effective date: 19980514 |