JPH04120174A - Resin composition for vibration damping material - Google Patents
Resin composition for vibration damping materialInfo
- Publication number
- JPH04120174A JPH04120174A JP2240445A JP24044590A JPH04120174A JP H04120174 A JPH04120174 A JP H04120174A JP 2240445 A JP2240445 A JP 2240445A JP 24044590 A JP24044590 A JP 24044590A JP H04120174 A JPH04120174 A JP H04120174A
- Authority
- JP
- Japan
- Prior art keywords
- particles
- resin
- particle diameter
- vibration damping
- resin composition
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000013016 damping Methods 0.000 title claims abstract description 31
- 239000011342 resin composition Substances 0.000 title claims abstract description 18
- 239000000463 material Substances 0.000 title claims abstract description 11
- 239000002245 particle Substances 0.000 claims abstract description 69
- 229920005989 resin Polymers 0.000 claims abstract description 31
- 239000011347 resin Substances 0.000 claims abstract description 31
- 239000011164 primary particle Substances 0.000 claims abstract description 3
- 238000003466 welding Methods 0.000 abstract description 15
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 abstract description 9
- 239000000203 mixture Substances 0.000 abstract description 6
- 239000010419 fine particle Substances 0.000 abstract description 5
- 229920001225 polyester resin Polymers 0.000 abstract description 3
- 239000004645 polyester resin Substances 0.000 abstract description 3
- 229910002012 Aerosil® Inorganic materials 0.000 abstract description 2
- 229910052759 nickel Inorganic materials 0.000 abstract description 2
- 239000000377 silicon dioxide Substances 0.000 abstract description 2
- 229910052708 sodium Inorganic materials 0.000 abstract description 2
- 239000011734 sodium Substances 0.000 abstract description 2
- 238000002156 mixing Methods 0.000 abstract 2
- 230000001413 cellular effect Effects 0.000 abstract 1
- 229910052751 metal Inorganic materials 0.000 description 18
- 239000002184 metal Substances 0.000 description 18
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 9
- 229910052799 carbon Inorganic materials 0.000 description 9
- 229910000831 Steel Inorganic materials 0.000 description 7
- 239000000843 powder Substances 0.000 description 7
- 239000010959 steel Substances 0.000 description 7
- 238000000034 method Methods 0.000 description 6
- 239000011163 secondary particle Substances 0.000 description 6
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 5
- 238000011156 evaluation Methods 0.000 description 5
- 238000004438 BET method Methods 0.000 description 4
- JHIVVAPYMSGYDF-UHFFFAOYSA-N cyclohexanone Chemical compound O=C1CCCCC1 JHIVVAPYMSGYDF-UHFFFAOYSA-N 0.000 description 4
- 230000000694 effects Effects 0.000 description 4
- 239000002904 solvent Substances 0.000 description 4
- 241000557626 Corvus corax Species 0.000 description 3
- 230000000052 comparative effect Effects 0.000 description 3
- 239000002923 metal particle Substances 0.000 description 3
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- 239000003795 chemical substances by application Substances 0.000 description 2
- 239000010960 cold rolled steel Substances 0.000 description 2
- 239000008119 colloidal silica Substances 0.000 description 2
- 238000007756 gravure coating Methods 0.000 description 2
- 239000012948 isocyanate Substances 0.000 description 2
- 150000002513 isocyanates Chemical class 0.000 description 2
- 238000010030 laminating Methods 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 239000012046 mixed solvent Substances 0.000 description 2
- 239000003973 paint Substances 0.000 description 2
- 229920000728 polyester Polymers 0.000 description 2
- 238000003825 pressing Methods 0.000 description 2
- 239000010935 stainless steel Substances 0.000 description 2
- 229910001220 stainless steel Inorganic materials 0.000 description 2
- 229910002014 Aerosil® 130 Inorganic materials 0.000 description 1
- 229910000967 As alloy Inorganic materials 0.000 description 1
- 239000004593 Epoxy Substances 0.000 description 1
- VGGSQFUCUMXWEO-UHFFFAOYSA-N Ethene Chemical compound C=C VGGSQFUCUMXWEO-UHFFFAOYSA-N 0.000 description 1
- 239000005977 Ethylene Substances 0.000 description 1
- 229910001335 Galvanized steel Inorganic materials 0.000 description 1
- 229910001209 Low-carbon steel Inorganic materials 0.000 description 1
- 229920000459 Nitrile rubber Polymers 0.000 description 1
- 229910019142 PO4 Inorganic materials 0.000 description 1
- 239000004952 Polyamide Substances 0.000 description 1
- 239000002253 acid Substances 0.000 description 1
- 150000007513 acids Chemical class 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 150000001412 amines Chemical class 0.000 description 1
- 239000011324 bead Substances 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 150000001721 carbon Chemical class 0.000 description 1
- 239000006229 carbon black Substances 0.000 description 1
- -1 cilMos AglSnlwN sb Substances 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 239000011246 composite particle Substances 0.000 description 1
- 230000006835 compression Effects 0.000 description 1
- 238000007906 compression Methods 0.000 description 1
- 229920001577 copolymer Polymers 0.000 description 1
- 238000002425 crystallisation Methods 0.000 description 1
- 230000008025 crystallization Effects 0.000 description 1
- 230000003247 decreasing effect Effects 0.000 description 1
- 239000002270 dispersing agent Substances 0.000 description 1
- 239000006185 dispersion Substances 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 229920001971 elastomer Polymers 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 238000001125 extrusion Methods 0.000 description 1
- 239000008397 galvanized steel Substances 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 239000010954 inorganic particle Substances 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- JEIPFZHSYJVQDO-UHFFFAOYSA-N iron(III) oxide Inorganic materials O=[Fe]O[Fe]=O JEIPFZHSYJVQDO-UHFFFAOYSA-N 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 239000011368 organic material Substances 0.000 description 1
- NBIIXXVUZAFLBC-UHFFFAOYSA-K phosphate Chemical compound [O-]P([O-])([O-])=O NBIIXXVUZAFLBC-UHFFFAOYSA-K 0.000 description 1
- 239000010452 phosphate Substances 0.000 description 1
- 229920002037 poly(vinyl butyral) polymer Polymers 0.000 description 1
- 229920002647 polyamide Polymers 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 229920005749 polyurethane resin Polymers 0.000 description 1
- 229920002689 polyvinyl acetate Polymers 0.000 description 1
- 239000011118 polyvinyl acetate Substances 0.000 description 1
- 239000004800 polyvinyl chloride Substances 0.000 description 1
- 229920000915 polyvinyl chloride Polymers 0.000 description 1
- 230000002265 prevention Effects 0.000 description 1
- 239000005060 rubber Substances 0.000 description 1
- 229920006395 saturated elastomer Polymers 0.000 description 1
- 229910052814 silicon oxide Inorganic materials 0.000 description 1
- 229920003048 styrene butadiene rubber Polymers 0.000 description 1
- 229920003051 synthetic elastomer Polymers 0.000 description 1
- 239000005061 synthetic rubber Substances 0.000 description 1
- 229920005992 thermoplastic resin Polymers 0.000 description 1
- 229920001187 thermosetting polymer Polymers 0.000 description 1
- 210000001685 thyroid gland Anatomy 0.000 description 1
Abstract
Description
【発明の詳細な説明】
（産業上の利用分野）
本発明は制振材料用樹脂組成物の改良に関するものであ
り、安定したスポット溶接が可能な制振材料用樹脂組成
物に関するものである。DETAILED DESCRIPTION OF THE INVENTION (Field of Industrial Application) The present invention relates to improvements in resin compositions for vibration damping materials, and more particularly to resin compositions for vibration damping materials that allow stable spot welding.
（従来の技術）
従来、２枚の鋼板間に介在させる樹脂組成物として導電
性粒子を配合しないものとさせたものが知られている。(Prior Art) Conventionally, a resin composition interposed between two steel plates that does not contain conductive particles is known.
前者においては鋼板間に介在させた樹脂が絶縁層として
働き、鋼板間に電流が流れにくい為に溶接時には電流の
バイパス回路を設ける必要がある。このためにスポット
溶接のたびにバイパス回路として鋼板間に金具を取り付
けるという手間がかかり負担が大きいという問題があっ
た。後者の方式は、制振鋼板用樹脂にステンレス、鉄、
ニッケル、アルミなどの金属粒子を含有させることによ
り電気抵抗を下げ、溶接性を付与し、通常の溶接作業に
より制振鋼板にスポット溶接を行なおうとするもので、
バイパス回路を設ける必要がなく、作業性に優れている
。しかしながら、実際には、使用する金属粒子の粒径が
小さいと均一に樹脂中に分散させることが困難であり、
またスポット溶接時に電流が流れにくいという問題があ
る。粒径が大きな場合においても金属粒子の含有量が多
くないと溶接に充分な電流が通じにくいという問題点が
あった。In the former case, the resin interposed between the steel plates acts as an insulating layer, making it difficult for current to flow between the steel plates, so it is necessary to provide a current bypass circuit during welding. For this reason, there is a problem in that it is time-consuming and burdensome to attach metal fittings between the steel plates as a bypass circuit every time spot welding is performed. The latter method uses stainless steel, iron,
By containing metal particles such as nickel and aluminum, the electrical resistance is lowered and weldability is imparted, allowing spot welding to damping steel plates using normal welding operations.
There is no need to provide a bypass circuit, and the workability is excellent. However, in reality, if the particle size of the metal particles used is small, it is difficult to uniformly disperse them in the resin.
Another problem is that it is difficult for current to flow during spot welding. Even when the particle size is large, there is a problem that it is difficult to conduct sufficient current for welding unless the content of metal particles is large.
（発明が解決しようとする課題）
制振性能等の諸性能を損なうことなく安定なスポット溶
接性の付与が可能な制振材料用樹脂組成物を提供するも
のである。(Problems to be Solved by the Invention) It is an object of the present invention to provide a resin composition for a vibration damping material that can provide stable spot weldability without impairing various performances such as vibration damping performance.
（課題を解決するための手段）
本発明者らは上記のような問題を解決するために種々の
研究を重ねた結果、２０〜１１００ｕの導電性粒子に粒
径５ｍμ〜２０μｍの２種類以上の異なる粒径を持つ粒
子を制振性樹脂にある比率で混合したものを制振材料用
樹脂組成物として用いることによりスポット溶接性に優
れた制振性金属積層体が得られることを見いだし本発明
に到達した。(Means for Solving the Problems) As a result of various studies carried out by the present inventors in order to solve the above-mentioned problems, the present inventors have found that two or more types of conductive particles of 20 to 1100 u with particle diameters of 5 mμ to 20 μm are used. It was discovered that a vibration-damping metal laminate with excellent spot weldability can be obtained by using a mixture of particles with different particle sizes in a vibration-damping resin at a certain ratio as a resin composition for a vibration-damping material, and the present invention has been made based on this discovery. reached.
すなわち、本発明は、−次粒子平均粒径０．００５〜２
０μｍの粒子（Ａ）、平均粒径２０〜１００μｍの導電
性粒子（Ｂ）とを極性基をＯ〜１０００当量／トン含有
した粘弾性樹脂（Ｃ）に式１）〜式４）を満足する割合
で配合したことを特徴とする制振材料用樹脂組成物であ
る。That is, in the present invention, the average particle size of the -order particles is 0.005 to 2.
A viscoelastic resin (C) containing particles (A) with a diameter of 0 μm, conductive particles (B) with an average particle size of 20 to 100 μm, and O to 1000 equivalents/ton of polar groups satisfies formulas 1) to 4). This is a resin composition for a vibration damping material, characterized in that the resin composition is blended in the following proportions.
式１） ０．０１≦Ａの表面積／粒径（／／ｇ・ｍμ
）≦１０００
式２） Ａ＋Ｂ＋Ｃ＝１００（重量部）式３） ０
．０５≦（Ａ＋Ｂ）／ （Ａ＋Ｂ＋Ｃ）≦ ０．５
式４） ０．０１≦Ａ／ （Ａ＋Ｂ）≦０．５金属積
金属製造時の条件及びその後の経時変化に伴い粒径が大
きな導電性粒子Ｂ単独では金属板間の接触が不完全にな
り金属板−金属板間の通電経路が生じにくくなると考え
られ、本発明においては、導電性粒子Ｂ以外に粒径の小
さな粒子Ａが介在する事により、導電性粒子Ｂと樹脂の
界面において、樹脂の局所的硬化や結晶化等の緩和が起
こり絶縁層が導電性粒子Ｂ界面に形成されにくくなる為
、また、導電性粒子Ｂの樹脂中での配向が変化する事等
により、より良好な通電経路が確保されるようになると
考えられる。粒子の含有率としては組成物中５〜５０重
量％の範囲がよい。含有率が５重量％未満であるとスポ
ット溶接性に効果がなく、５０重量％を超えると制振性
を低下させるため好ましくない。また粒子Ａゝと導電性
粒子Ｂとの全重量における粒子Ａの割合は１〜５０重量
％であり、１〜２０重量％が好ましい。１％未満では溶
接性の改善効果がなく、５０重量％を超えると溶接性が
好ましくない。粒子Ａとしては粒径の小さな方が溶接性
にとって好ましいが、粒径が小さいほど分散が困難にな
る。粒子Ａが微細な為に樹脂中に均一に分散されないと
導電性粒子Ｂと金属板間の通電経路の形成に十分寄与し
にくくなり、粒子Ａが樹脂中で凝集体などを生じて樹脂
組成物の制振性及び金属板への接着強度等に悪影響を与
える。これを防ぐ為に極性基ををする樹脂を粒子Ａの分
散剤として使用してもよい。極性基としては一〇〇ＯＨ
，−５Ｏ３Ｈ，−０ＳＯ３Ｈ，−ＰＯ（ＯＨ）２．：Ｐ
Ｏ（ＯＨ）等の酸またはそれらのアミン、ＬＩＮ Ｎａ
１にの塩が挙げられ、これら極性基の樹脂中の含有量は
１０００当量／トン以下である。Formula 1) Surface area/particle size of 0.01≦A (//g・mμ
)≦1000 Formula 2) A+B+C=100 (parts by weight) Formula 3) 0
．． 05≦(A+B)/(A+B+C)≦0.5 Equation 4) 0.01≦A/(A+B)≦0.5 Conductive particles whose particle size becomes large due to the conditions during metal production and subsequent changes over time It is thought that if B alone is used, the contact between the metal plates will be incomplete and it will be difficult to create a current-carrying path between the metal plates.In the present invention, particles A with a small particle size are present in addition to the conductive particles B. As a result, local hardening and crystallization of the resin are relaxed at the interface between the conductive particles B and the resin, making it difficult for an insulating layer to be formed at the interface of the conductive particles B. It is thought that a better current conduction path can be secured by changing the orientation of the . The content of the particles is preferably in the range of 5 to 50% by weight in the composition. If the content is less than 5% by weight, there is no effect on spot weldability, and if it exceeds 50% by weight, vibration damping properties are deteriorated, which is not preferable. The proportion of particles A in the total weight of particles A and conductive particles B is 1 to 50% by weight, preferably 1 to 20% by weight. If it is less than 1%, there is no effect of improving weldability, and if it exceeds 50% by weight, weldability is unfavorable. As for particles A, a smaller particle size is preferable for better weldability, but the smaller the particle size, the more difficult it is to disperse. Since the particles A are so fine that they are not uniformly dispersed in the resin, they will not be able to sufficiently contribute to the formation of a current-carrying path between the conductive particles B and the metal plate, and the particles A will form aggregates in the resin, causing the resin composition to deteriorate. It has a negative effect on the vibration damping properties of the metal plate and the adhesive strength to the metal plate. In order to prevent this, a resin having a polar group may be used as a dispersant for the particles A. 100OH as a polar group
, -5O3H, -0SO3H, -PO(OH)2. :P
Acids such as O(OH) or their amines, LIN Na
The content of these polar groups in the resin is 1000 equivalents/ton or less.
粒子の分散法としては少量の極性基を有する樹脂で粒子
を分散させた後、他の樹脂に配合するか、極性基を持つ
制振性樹脂を使用してもよい。As a method for dispersing the particles, the particles may be dispersed with a small amount of a resin having a polar group and then blended with another resin, or a damping resin having a polar group may be used.
粒子Ａとしては、電気抵抗の比抵抗が１０・Ｃ１１以上
の多孔質性粒子であり、エアロジェル、シリカ等の多孔
質粒子、非導電性金属含有多孔質粒子、非導電性多孔質
カーボンブラック（０，２ＶＦＣ１比抵抗値１Ω＠ｃ１
以上）等が挙げられる。Particle A is a porous particle with a specific electrical resistance of 10/C11 or more, and includes porous particles such as airgel and silica, non-conductive metal-containing porous particles, and non-conductive porous carbon black ( 0.2VFC1 specific resistance value 1Ω@c1
above), etc.
この場合、粒子Ａの比表面積／粒径の比は０゜０１〜１
０００（Ｉ／ｇ−ｍμ）であり、好ましくは０．０３〜
３００（Ｉ／ｇ−ｍμ）、より好ましくは０．１〜１０
０（Ｔ１７ｇ−ｍμ）である。In this case, the ratio of specific surface area/particle size of particle A is 0°01 to 1
000 (I/g-mμ), preferably 0.03 to
300 (I/g-mμ), more preferably 0.1-10
0 (T17g-mμ).
導電性粒子Ｂとしては、電気抵抗の比抵抗値１Ω” ｃ
ｍｍ横溝ある、Ｍｇ１Ａ１１Ｓ ｉｓ ＴｉｌＶ％Ｃｒ
１Ｍｎ１Ｆｅｚ Ｃｏｔ ＮｔｌＣｕｌＺｎｌＺｒｌｐ
ｃｉｌＭｏｓ ＡｇｌＳｎｌｗＮ ｓｂ等の単体の金属
粉、またはこれらの合金粉やこれらの酸化金属粉等の無
機粒子、表面に金属や有機材料を被膜した複合粒子が挙
げられる。The conductive particles B have a specific resistance value of 1Ω” c
mm horizontal groove, Mg1A11S is TilV%Cr
1Mn1Fez Cot NtlCulZnlZrlp
Examples include single metal powders such as cilMos AglSnlwN sb, inorganic particles such as alloy powders of these powders and oxidized metal powders thereof, and composite particles whose surfaces are coated with metals or organic materials.
粒子Ａと導電粒子Ｂの併用により、粒子全体の配合重量
を低減することが可能である。By using Particles A and Conductive Particles B in combination, it is possible to reduce the blended weight of the entire particles.
制振材料用の粘弾性樹脂Ｃとしてはポリアミド、ポリ酢
酸ビニル、ポリ塩化ビニル、ポリビニルブチラール、エ
チレン・酢酸ビニル共重合体、飽和ポリエステルなどの
熱可塑性樹脂、ニトリルゴム、スチレン拳ブタジェンゴ
ム、塩化ゴムなどの合成ゴム、さらに、イソシアネート
反応によるポリウレタン樹脂、ゴム変性エポキシ樹脂、
またはイソシアネート、エポキシ等を用いた熱硬化性樹
脂などを少なくとも１種類以上使用できる。Viscoelastic resins C for vibration damping materials include polyamide, polyvinyl acetate, polyvinyl chloride, polyvinyl butyral, ethylene/vinyl acetate copolymer, thermoplastic resins such as saturated polyester, nitrile rubber, styrene butadiene rubber, chlorinated rubber, etc. synthetic rubber, polyurethane resin by isocyanate reaction, rubber-modified epoxy resin,
Alternatively, at least one type of thermosetting resin using isocyanate, epoxy, etc. can be used.
本発明の粘弾性樹脂組成物と積層する金属板としては軟
鋼板、高張力鋼板、亜鉛メツキ鋼板及びステンレス鋼板
などが挙げられ、これらの鋼板は燐酸塩処理などの防錆
処理を施してから使用に供する事もできる。Examples of metal plates to be laminated with the viscoelastic resin composition of the present invention include mild steel plates, high-tensile steel plates, galvanized steel plates, and stainless steel plates, and these steel plates may be used after being subjected to rust prevention treatment such as phosphate treatment. It can also be served.
制振材料用樹脂組成物の厚みとしては用途により適宜選
択する事ができ、通常は１０μｍ以上が好適であるが、
より厚みを薄くすることも可能である。The thickness of the resin composition for vibration damping material can be selected as appropriate depending on the application, and is usually preferably 10 μm or more.
It is also possible to make the thickness even thinner.
本発明の樹脂組成物を用いて制振積層体を製造する方法
の例としては、極性基を有する樹脂を溶剤に溶解し、こ
れに粒子Ａを添加してボールミルやロール、ペイントシ
ェーカー ホモジナイザーなどにより均一に分散させた
後、他の樹脂や粒子Ｂを配合・混合して、ペーストとし
ても良いし、粒子Ａと樹脂を溶剤存在下に上記分散装置
により均一に配合・混合させた後、導電性粒子Ｂをこれ
に均一に配合・混合させペーストとしても良い。As an example of a method for producing a vibration damping laminate using the resin composition of the present invention, a resin having a polar group is dissolved in a solvent, particles A are added thereto, and the mixture is processed using a ball mill, a roll, a paint shaker, a homogenizer, etc. After uniformly dispersing, other resins and particles B may be blended and mixed to form a paste, or particles A and resin may be uniformly blended and mixed in the presence of a solvent using the above dispersion device, and then conductive Particles B may be uniformly blended and mixed therein to form a paste.
これを一方、もしくは、両方の金属板にグラビアコート
法などにより塗布し、次いで溶剤を揮散させて制振樹脂
層を形成する。未塗布の金属板もしくは制振樹脂塗布金
属板を形成した制振樹脂層上にセットし、熱板でプレス
するか、熱ロールで貼合わせることにより本発明の制振
積層体が得られる。This is applied to one or both metal plates by gravure coating or the like, and then the solvent is evaporated to form a damping resin layer. The damping laminate of the present invention can be obtained by setting an uncoated metal plate or a damping resin-coated metal plate on the formed damping resin layer and pressing with a hot plate or laminating with a hot roll.
また、別の方法として、上記グラビアコート法または押
し出し成形法によって、制振樹脂層を離型紙上にフィル
ム状に形成し、形成されたフィルムを２枚の金属板の間
にはさみ込んで熱プレスまたは熱ロールにより貼合わせ
る方法も採用する事ができる。Alternatively, a damping resin layer is formed into a film shape on a release paper using the gravure coating method or extrusion molding method, and the formed film is sandwiched between two metal plates and heat pressed or heated. A method of laminating using rolls can also be adopted.
（実施例）
以下、本発明の制振積層体について、実施例を挙げてよ
り具体的に説明する。(Example) Hereinafter, the damping laminate of the present invention will be described in more detail with reference to Examples.
１、 樹脂溶液（１）
極性基（スルホン酸ナトリウム基）含有ポリエステル樹
脂（東洋紡績株式会社製ポリエステルＲＶ５３０）
３５重量％のアノン／ツルペッツ＃１００（１／１）溶
液
ＮＶ＝３５％
λ 樹脂溶液■
エポキシ硬化型のブロック共重合ポリエステル樹脂組成
物の３５重量％アノン／ツルペッツ＃１００ （１／１
）溶液。1. Resin solution (1) Polyester resin containing polar groups (sodium sulfonate group) (Polyester RV530 manufactured by Toyobo Co., Ltd.) 35% by weight Anon/Tsurupez #100 (1/1) solution NV = 35% λ Resin solution ■ 35% by weight of epoxy-curable block copolymerized polyester resin composition Anone/Tsurupez #100 (1/1
)solution.
スポット溶接性評価
実施例と比較例を溶接条件として加圧力１６０ｋｇ ／
ＣＪ １溶接電流８ＫＡで溶接試験を行ない、溶接の
安定性、溶接の外観等を判定した。Using spot weldability evaluation examples and comparative examples as welding conditions, welding force was 160 kg/
A welding test was conducted using CJ 1 welding current of 8KA, and welding stability, welding appearance, etc. were evaluated.
実施例 １
樹脂溶液■９５部にアロエジル３８０（日本アロエジル
株式会社製のコロイド状シリカ：平均−次粒径７ｍμ、
ＢＥＴ法比法面表面積３８０ｔ／／１、７５部、ツルペ
ッツ＃１００／アノン（１／１）混合溶媒を３．２５部
加え、ホモジナイザー（日本精機株式会社製、ＡＭ−９
）にて、１５分間１ ８ ０ ０ ０ｒ．ｐ．ｍで攪拌
した。これに粒径５１〜７０μｍのＮｉ粉８．７５部と
硬化剤０．１７部５部を加え、十分に攪拌混合し、ペー
ストを調整した。Example 1 Aloesil 380 (colloidal silica manufactured by Nippon Aloesil Co., Ltd.: average primary particle size 7 mμ,
BET method ratio surface area 380t//1, 75 parts, 3.25 parts of Tsurupetz #100/Anon (1/1) mixed solvent were added, and a homogenizer (manufactured by Nippon Seiki Co., Ltd., AM-9) was added.
) for 15 minutes at 18000r. p. The mixture was stirred at m. To this, 8.75 parts of Ni powder having a particle size of 51 to 70 μm and 0.17 parts and 5 parts of a hardening agent were added and thoroughly stirred and mixed to prepare a paste.
そして、上記のペーストを０．５ｍｍ厚み×２ ０ ０
Ｘ ２ ０ ０ 、、の冷延鋼板に乾燥後の膜厚が５
０μｍとなるように塗布した後、溶剤を加熱により揮散
させて膜厚５０μｍの制振樹脂層を得た。Then, apply the above paste to a thickness of 0.5mm x 200
The film thickness after drying on the cold-rolled steel plate of X 2 0 0 is 5.
After coating to a thickness of 0 μm, the solvent was evaporated by heating to obtain a damping resin layer with a thickness of 50 μm.
次に、上記制振樹脂層上に同寸法の冷延鋼板を重ね合わ
せ、熱圧着機にて圧着温度２２０℃、加圧力３ １ ０
ｋｇ ／ ｃＪ Ｎ時間３０秒の条件にて加熱、加圧
し、制振積層体を作製し、これを１８０℃に３０分間保
持した。Next, a cold-rolled steel plate of the same size is superimposed on the vibration-damping resin layer, and a thermocompression bonding machine is used at a compression temperature of 220°C and a pressing force of 3 10.
kg/cJN for 30 seconds to produce a damping laminate, which was then held at 180° C. for 30 minutes.
スポット溶接性および制振積層体についての評価結果は
、第１表に示した。The evaluation results for spot weldability and damping laminates are shown in Table 1.
実施例２〜３および比較例１
実施例１におけるアロエジル３８０に代えて、それぞれ
アエロジル１３０（日本アエロジル株式会社製 コロイ
ダルシリカニー次粒子平均径１３ｍμ、ＢＥＴ法比法面
表面積１３０♂／ ％比表面積／粒径＝８．１３ Ｃｒ
ｌ／ｇ−ｍμ））、およびサイロイド６５（富士デヴイ
ソン株式会社製酸化ケイ素ニー次粒子平均径４μｍ１Ｂ
ＥＴ法比表面積７００ｎ？／ｇ１比表面積／粒子径＝０
．１７５（ｍ２／ｇ−ｍμ））を用いて実施例１と同様
にして積層体の評価を行なった。また粒子Ａを用いない
場合（比較例１）も同様に評価を行った。Examples 2 to 3 and Comparative Example 1 In place of Aloesil 380 in Example 1, Aerosil 130 (manufactured by Nippon Aerosil Co., Ltd., colloidal silica secondary particle average diameter 13 mμ, BET method normal surface area 130♂/% specific surface area/ Particle size = 8.13 Cr
l/g-mμ)), and Thyroid 65 (Fuji Davison Co., Ltd. silicon oxide secondary particle average diameter 4 μm 1B
ET method specific surface area 700n? /g1 specific surface area/particle size=0
．． The laminate was evaluated in the same manner as in Example 1 using 175 (m2/g-mμ)). Furthermore, evaluation was conducted in the same manner when Particle A was not used (Comparative Example 1).
その結果を第１表に示す。The results are shown in Table 1.
表
＊１ ×＝著しく不安定
Δ：はぼ安定
０：安定
＊２ 膨れ、焼け、溶断の有無
Ｏ：なし、 Δ：少々あり、×：著しい＊３０：変化な
し、 △：やや低下あり、×：低下大実施例 ４
樹脂溶液（ＩＮｌ、４３部とツルペッツ＃１００／アノ
ン（１／１）混合溶媒７．４３部、ラーベン２０００
（コロンビャン・カーボン日本株式会社製カーボン−次
粒子平均径１８ｍμ、ＢＥＴ法比法面表面積１９０ｒｌ
／
（ぜ７ｇ−ｍμ）４部にガラスピーズを加え、ペイント
シェーカーでカーボンペーストを調整した。Table *1 × = Significantly unstable Δ: Stable 0: Stable *2 Blistering, burning, and fusing O: None, Δ: Slightly present, ×: Significant *30: No change, △: Slightly decreased, × : Large decrease example 4 Resin solution (INl, 43 parts, Tsurpez #100/Anon (1/1) mixed solvent 7.43 parts, Raven 2000
(Columbian Carbon Japan Co., Ltd. Carbon secondary particle average diameter 18 mμ, BET method slope surface area 190 rl
Glass beads were added to 4 parts (7 g-mμ), and a carbon paste was prepared using a paint shaker.
このカーボンペース）４．４５部と樹脂溶液■３４、２
９部、Ｎｉ粉３．３９部、硬化剤０ 、０Ｅｉ６７部を
加え、十分に攪拌混合し、ペーストを調整した。This carbon paste) 4.45 parts and resin solution ■34.2
9 parts of Ni powder, 3.39 parts of Ni powder, and 67 parts of curing agent 0 and 0Ei were added and thoroughly stirred and mixed to prepare a paste.
制振積層体は、実施例１と同様の方法により作製し評価
した。評価結果は第２表に示した。The damping laminate was produced and evaluated in the same manner as in Example 1. The evaluation results are shown in Table 2.
実施例５〜８
実施例４におけるラーベン２０００に代えて、それぞれ
ラーベン４１０（コロンビャン・カーボン日本株式会社
製カーボンニー次粒子平均径７０ｍμ、ＢＥＴ法比法面
表面積２４ｇ，比表面積／粒径＝０．３４ （ｎＦ／ｇ
−ｍμ））、ラーベン８９０（同上社製カーボンニー次
粒子平均径３。Examples 5 to 8 In place of Raben 2000 in Example 4, Raben 410 (manufactured by Colombian Carbon Japan Co., Ltd., carbon secondary particle average diameter 70 mμ, BET method specific surface area 24 g, specific surface area/particle size = 0. 34 (nF/g
-mμ)), Raven 890 (manufactured by the same company, carbon secondary particle average diameter 3.
ｍｕ、ＢＥＴ法比法面表面積７ ｔｌ／ｇ，比表面積／
粒径＝２．５（ｍ２／ｇ−ｍμ））、ラーベン１５００
（同上社製カーボンニー次粒子平均径１８ｍμ、ＢＥＴ
法比法面表面積２１ＯｒＩ／
＝１１．７（ｍ２／ｇ−ｍμ））およびラーベン５００
０ （同上社製カーボンニー次平均粒径１２ｍμ、ＢＥ
Ｔ法表面積４ ３ ０ ＋／／ｇ１比表面積／粒径＝３
５．８（ｒＩ／ｇ−ｍμ））を用いて実施例４と同様に
して積層体を製造し評価した。mu, BET ratio slope surface area 7 tl/g, specific surface area/
Particle size = 2.5 (m2/g-mμ)), Raven 1500
(Carbon secondary particle average diameter 18 mμ manufactured by the same company, BET
Normal surface area 21OrI/ = 11.7 (m2/g-mμ)) and Raven 500
0 (manufactured by the same company, carbon secondary average particle size 12 mμ, BE
T method surface area 4 3 0 +//g1 specific surface area/particle size = 3
5.8 (rI/g-mμ)), a laminate was produced and evaluated in the same manner as in Example 4.
評価結果は第２表に示した。The evaluation results are shown in Table 2.
第 ２ 表
＊２
＊３
膨れ、焼け、溶断のを無
○：なし、 △：少々あり、×：著しい○：変化なし、
△：やや低下あり、×：低下大（発明の効果）
本発明の樹脂組成物は、通常の粒径の大きな導電粒子と
粒径の微細な粒子とを含有し、かつ微細な粒子が安定に
分散しているため、本発明の樹脂組成物を用いた金属積
層体は、安定したスポット溶接が可能であり、工業的意
義は大きい。Table 2 *2 *3 No blistering, burning, or fusing ○: None, △: Slightly present, ×: Significant ○: No change,
△: Slight decrease, ×: Large decrease (effect of the invention) The resin composition of the present invention contains ordinary conductive particles with a large particle size and fine particles with a fine particle size, and the fine particles are stable. Since it is dispersed, the metal laminate using the resin composition of the present invention can be stably spot welded, and has great industrial significance.
特許出願人 東洋紡績株式会社Patent applicant: Toyobo Co., Ltd.
Claims (1)
平均粒径２０〜１００μｍの導電性粒子（Ｂ）とを極性
基を０〜１０００当量／トン含有した粘弾性樹脂（Ｃ）
に式１）〜式４）を満足する割合で配合したことを特徴
とする制振材料用樹脂組成物。 式１）０．０１≦Ａの表面積／粒径（ｍ＾２／ｇ・ｍμ
）≦１０００ 式２）Ａ＋Ｂ＋Ｃ＝１００（重量部） 式３）０．０５≦（Ａ＋Ｂ）／（Ａ＋Ｂ＋Ｃ）≦０．５ 式４）０．０１≦Ａ／（Ａ＋Ｂ）≦０．５[Claims] Particles (A) having an average primary particle diameter of 0.005 to 20 μm,
Viscoelastic resin (C) containing conductive particles (B) with an average particle size of 20 to 100 μm and 0 to 1000 equivalents/ton of polar groups
A resin composition for a vibration damping material, characterized in that the resin composition is blended with the formulas 1) to 4) in a proportion satisfying the formulas 1) to 4). Formula 1) 0.01≦A surface area/particle size (m^2/g・mμ
)≦1000 Formula 2) A+B+C=100 (parts by weight) Formula 3) 0.05≦(A+B)/(A+B+C)≦0.5 Formula 4) 0.01≦A/(A+B)≦0.5
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2240445A JPH04120174A (en) | 1990-09-10 | 1990-09-10 | Resin composition for vibration damping material |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2240445A JPH04120174A (en) | 1990-09-10 | 1990-09-10 | Resin composition for vibration damping material |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH04120174A true JPH04120174A (en) | 1992-04-21 |
Family
ID=17059605
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2240445A Pending JPH04120174A (en) | 1990-09-10 | 1990-09-10 | Resin composition for vibration damping material |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH04120174A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104530595A (en) * | 2014-12-24 | 2015-04-22 | 陈程 | High-strength PVC (polyvinyl chloride) conducting composite material and preparation method thereof |
-
1990
- 1990-09-10 JP JP2240445A patent/JPH04120174A/en active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104530595A (en) * | 2014-12-24 | 2015-04-22 | 陈程 | High-strength PVC (polyvinyl chloride) conducting composite material and preparation method thereof |
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