JPH04289685A - Transparent sheet-like heater - Google Patents
Transparent sheet-like heaterInfo
- Publication number
- JPH04289685A JPH04289685A JP3078197A JP7819791A JPH04289685A JP H04289685 A JPH04289685 A JP H04289685A JP 3078197 A JP3078197 A JP 3078197A JP 7819791 A JP7819791 A JP 7819791A JP H04289685 A JPH04289685 A JP H04289685A
- Authority
- JP
- Japan
- Prior art keywords
- transparent
- layer
- film
- thin film
- conductive
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000010410 layer Substances 0.000 claims abstract description 52
- 239000010408 film Substances 0.000 claims abstract description 38
- 239000010409 thin film Substances 0.000 claims abstract description 30
- 239000012790 adhesive layer Substances 0.000 claims abstract description 28
- 239000011347 resin Substances 0.000 claims abstract description 26
- 229920005989 resin Polymers 0.000 claims abstract description 26
- 239000000758 substrate Substances 0.000 claims abstract description 16
- 239000002184 metal Substances 0.000 claims description 20
- 229910052751 metal Inorganic materials 0.000 claims description 20
- 239000011888 foil Substances 0.000 claims description 13
- 239000000853 adhesive Substances 0.000 abstract description 10
- 230000001070 adhesive effect Effects 0.000 abstract description 10
- NIXOWILDQLNWCW-UHFFFAOYSA-M acrylate group Chemical group C(C=C)(=O)[O-] NIXOWILDQLNWCW-UHFFFAOYSA-M 0.000 abstract description 9
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 abstract description 5
- 239000011889 copper foil Substances 0.000 abstract description 4
- 238000010030 laminating Methods 0.000 abstract description 2
- 238000004544 sputter deposition Methods 0.000 abstract description 2
- 239000004973 liquid crystal related substance Substances 0.000 description 16
- 238000000034 method Methods 0.000 description 15
- 239000004820 Pressure-sensitive adhesive Substances 0.000 description 4
- 238000010438 heat treatment Methods 0.000 description 4
- 239000000843 powder Substances 0.000 description 4
- 238000002834 transmittance Methods 0.000 description 4
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 3
- 229910052802 copper Inorganic materials 0.000 description 3
- 239000010949 copper Substances 0.000 description 3
- 230000007547 defect Effects 0.000 description 3
- 229910052737 gold Inorganic materials 0.000 description 3
- 239000010931 gold Substances 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- 229920006267 polyester film Polymers 0.000 description 3
- 239000004065 semiconductor Substances 0.000 description 3
- 238000000576 coating method Methods 0.000 description 2
- 230000007423 decrease Effects 0.000 description 2
- 238000010304 firing Methods 0.000 description 2
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 2
- 239000000203 mixture Substances 0.000 description 2
- 229920006122 polyamide resin Polymers 0.000 description 2
- 239000002952 polymeric resin Substances 0.000 description 2
- 238000007639 printing Methods 0.000 description 2
- 230000001681 protective effect Effects 0.000 description 2
- 229910052709 silver Inorganic materials 0.000 description 2
- 239000010944 silver (metal) Substances 0.000 description 2
- 229920003002 synthetic resin Polymers 0.000 description 2
- XOLBLPGZBRYERU-UHFFFAOYSA-N tin dioxide Chemical compound O=[Sn]=O XOLBLPGZBRYERU-UHFFFAOYSA-N 0.000 description 2
- 238000011179 visual inspection Methods 0.000 description 2
- 239000004925 Acrylic resin Substances 0.000 description 1
- 229910017944 Ag—Cu Inorganic materials 0.000 description 1
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- 239000004593 Epoxy Substances 0.000 description 1
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 229910052804 chromium Inorganic materials 0.000 description 1
- 230000000052 comparative effect Effects 0.000 description 1
- 238000011109 contamination Methods 0.000 description 1
- 230000002950 deficient Effects 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 239000000428 dust Substances 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 238000001125 extrusion Methods 0.000 description 1
- 229910052736 halogen Inorganic materials 0.000 description 1
- 150000002367 halogens Chemical class 0.000 description 1
- PJXISJQVUVHSOJ-UHFFFAOYSA-N indium(III) oxide Inorganic materials [O-2].[O-2].[O-2].[In+3].[In+3] PJXISJQVUVHSOJ-UHFFFAOYSA-N 0.000 description 1
- 238000007689 inspection Methods 0.000 description 1
- 238000003475 lamination Methods 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- PXHVJJICTQNCMI-UHFFFAOYSA-N nickel Substances [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 229920005668 polycarbonate resin Polymers 0.000 description 1
- 239000004431 polycarbonate resin Substances 0.000 description 1
- 229920001225 polyester resin Polymers 0.000 description 1
- 239000004645 polyester resin Substances 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 239000009719 polyimide resin Substances 0.000 description 1
- 238000001556 precipitation Methods 0.000 description 1
- 230000002265 prevention Effects 0.000 description 1
- 238000003672 processing method Methods 0.000 description 1
- 239000011241 protective layer Substances 0.000 description 1
- 238000007650 screen-printing Methods 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 229920001187 thermosetting polymer Polymers 0.000 description 1
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 description 1
- 229920002554 vinyl polymer Polymers 0.000 description 1
Abstract
Description
【０００１】0001
【産業上の利用分野】本発明は、透明面状ヒーターに関
し、特に液晶素子用ヒーターに関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a transparent heater, and more particularly to a heater for liquid crystal elements.
【０００２】液晶素子の動作特性は、それが設置されて
いる環境温度に大きく影響される。温度が低くなると、
例えば０℃以下の温度になると応答速度が低下し、また
−３０℃以下になると実用上支障をきたす様になる。The operating characteristics of a liquid crystal element are greatly influenced by the environmental temperature in which it is installed. When the temperature drops,
For example, when the temperature is below 0°C, the response speed decreases, and when the temperature is below -30°C, it becomes a practical problem.
【０００３】例えば、自動車等の各種ディスプレーとし
て使用されるものでは、低温度であっても正常に作動す
ることが望まれる。[0003] For example, devices used as various displays in automobiles and the like are desired to operate normally even at low temperatures.
【０００４】従来その様な環境下で使用される液晶素子
は、格子状又は周辺に枠状の発熱抵抗体を配置して加熱
する方法（例えば、特開昭５８−１２６５１７号公報，
実開昭５９−１０６１２４号公報）が提案されている。
この方法は、液晶素子全体に亘って、均一に加熱するこ
とが困難であり、不透明な発熱抵抗体を配置することに
より、液晶素子の表示の邪魔になったり、また表示面積
の縮小等の不都合がある。[0004] Conventionally, liquid crystal elements used in such an environment have been heated by a heating resistor arranged in a lattice shape or around the periphery (for example, as disclosed in Japanese Unexamined Patent Publication No. 126517/1983,
Japanese Utility Model Application Publication No. 59-106124) has been proposed. With this method, it is difficult to uniformly heat the entire liquid crystal element, and the placement of an opaque heating resistor may interfere with the display of the liquid crystal element, and may also reduce the display area. There is.
【０００５】近年、透明シート上に金属薄膜を形成した
発熱体が提案されている。例えば、実公昭６１−１９６
２２２号公報がある。しかしながら、液晶素子全体を均
一に、かつ効率的に加熱することは困難であった。[0005] In recent years, a heating element in which a metal thin film is formed on a transparent sheet has been proposed. For example, Jikko Sho 61-196
There is a publication No. 222. However, it has been difficult to uniformly and efficiently heat the entire liquid crystal element.
【０００６】本発明者等は、かかる問題点を解消すべく
鋭意検討した結果、本発明に到達した。[0006] The inventors of the present invention have made extensive studies to solve these problems, and as a result, have arrived at the present invention.
【０００７】即ち、透明基板上に積層した透明導電性薄
膜の両端部に電極を設け、この電極に電圧を印加するこ
とにより電極間の該透明導電性薄膜に熱を発生する様に
した透明面状ヒーターに於て、接着層，透明基板，透明
導電性薄膜，透明絶縁層，接着層及び透明フイルムの順
に積層された構成体であり、かつ、前記透明導電性薄膜
の両端部は、導電性樹脂，絶縁性接着層を有する導電性
金属箔及び該導電性金属箔を被覆した導電性樹脂からな
る電極を有する透明面状ヒーターである。That is, a transparent surface in which electrodes are provided at both ends of a transparent conductive thin film laminated on a transparent substrate, and heat is generated in the transparent conductive thin film between the electrodes by applying a voltage to the electrodes. The heater has a structure in which an adhesive layer, a transparent substrate, a transparent conductive thin film, a transparent insulating layer, an adhesive layer, and a transparent film are laminated in this order, and both ends of the transparent conductive thin film are conductive. This is a transparent planar heater having an electrode made of a resin, a conductive metal foil having an insulating adhesive layer, and a conductive resin covering the conductive metal foil.
【０００８】本発明によれば液晶素子全体を均一に、か
つ効率的に加熱することが可能となる。According to the present invention, it is possible to uniformly and efficiently heat the entire liquid crystal element.
【０００９】図１に本発明の透明面状ヒーターの断面図
を示す。FIG. 1 shows a cross-sectional view of the transparent sheet heater of the present invention.
【００１０】本発明に使用される透明基板１はポリエス
テル樹脂，ポリナフタレート樹脂，ポリアミド樹脂，ポ
リイミド樹脂，アクリレート樹脂，ポリカーボネート樹
脂の他に在来公知の高分子樹脂が使用でき、板状，フイ
ルム状いずれでもよい。次の電極加工、保護層加工、更
には、偏光板への張りつけ等の加工、軽量性、耐衝撃性
の点から、フイルム状で５０〜５００μｍ厚みの高分子
樹脂が用いられる。特に７５〜１８０μｍ厚みが好適で
ある。The transparent substrate 1 used in the present invention can be made of polyester resin, polynaphthalate resin, polyamide resin, polyimide resin, acrylate resin, polycarbonate resin, or conventionally known polymer resins, and may be in the form of a plate or a film. Any condition is acceptable. A polymer resin in the form of a film with a thickness of 50 to 500 μm is used from the viewpoints of subsequent processing such as electrode processing, protective layer processing, and further processing such as attachment to a polarizing plate, light weight, and impact resistance. Particularly suitable is a thickness of 75 to 180 μm.
【００１１】本発明の接着層３は、在来公知の接着剤，
感圧性粘着剤のいずれでも使用出来るが、前記透明基板
への加工性、後述する偏光板１１への貼り合せ及び耐久
性の点からアクリレート系感圧性粘着剤が好んで用いら
れる。The adhesive layer 3 of the present invention is made of a conventionally known adhesive,
Although any pressure-sensitive adhesive can be used, an acrylate-based pressure-sensitive adhesive is preferably used from the viewpoint of workability to the transparent substrate, attachment to the polarizing plate 11 described below, and durability.
【００１２】接着層３の厚みは特に制限はないが、通常
５〜１００μｍであり、特に１０〜７０μｍが常用され
ている。尚接着層３は、あらかじめ透明基板１へ加工し
た後、透明導電性薄膜２を加工してもよく、また一旦透
明基板１へ透明導電性薄膜２を加工した後、他面へ加工
することも出来る。特に後者の場合に良質の透明導電性
薄膜２を得ることが出来る。The thickness of the adhesive layer 3 is not particularly limited, but it is usually 5 to 100 μm, particularly 10 to 70 μm. The adhesive layer 3 may be formed by processing the transparent conductive thin film 2 on the transparent substrate 1 in advance, or may be processed on the other side after the transparent conductive thin film 2 is processed on the transparent substrate 1. I can do it. Particularly in the latter case, a high quality transparent conductive thin film 2 can be obtained.
【００１３】透明基板１，透明導電性薄膜２，透明絶縁
層４，電極及び接着層８を有する透明フイルム９を加工
した後、接着層３を加工してもよい。特に、この場合は
、前記の如く、あらかじめ接着層３を加工した場合に比
較して、その後の加工及び取扱い中に於ける接着剤の裁
断粉及び加工工程での接着剤のはみ出しによる各層間へ
の混入を除くことが出来るので、より収率よく透明面状
ヒーターを得ることが出来る。この加工法をとる場合は
、加工工程で、透明基板１への傷の発生、又はオリゴマ
ー発生防止の為、あらかじめ、透明基板１の背面へ、適
宜発生防止層を加工しておく事が好ましい。[0013] After processing the transparent film 9 having the transparent substrate 1, transparent conductive thin film 2, transparent insulating layer 4, electrodes and adhesive layer 8, the adhesive layer 3 may be processed. In particular, in this case, compared to the case where the adhesive layer 3 is processed in advance as described above, there is a possibility that there will be damage between each layer due to cutting powder of the adhesive during subsequent processing and handling and adhesive extrusion during the processing process. Since contamination can be removed, transparent planar heaters can be obtained with higher yield. When this processing method is used, it is preferable to process an appropriate prevention layer on the back surface of the transparent substrate 1 in advance in order to prevent the generation of scratches or oligomers on the transparent substrate 1 during the processing step.
【００１４】本発明法に於ける透明導電性薄膜４は、通
常金属薄膜，半導体薄膜等がある。金属薄膜は、Ａｇ，
Ｃｕ，Ａｕ，Ｎｉ，Ａｌ，Ｃｒ等が知られているが、透
明性と導電性の点から、Ａｇ，Ｃｕ，Ａｕの群より選ば
れた１種又は合金として用いるのが好ましい。The transparent conductive thin film 4 used in the method of the present invention is usually a metal thin film, a semiconductor thin film, or the like. The metal thin film is made of Ag,
Cu, Au, Ni, Al, Cr, etc. are known, but from the viewpoint of transparency and conductivity, it is preferable to use one selected from the group of Ag, Cu, and Au or an alloy.
【００１５】金属薄膜の膜厚は、透明性及び印加電圧に
対する発生熱量の点から、１０オングストローム以上５
００オングストローム以下が選ばれ、特に、５０オング
ストローム以上３００オングストロームが好んで用いら
れる。もちろん、更に透明性を向上させる為に高屈折率
誘電体層を組合せた構成にしてもよい。The thickness of the metal thin film is 10 angstroms or more from the viewpoint of transparency and the amount of heat generated with respect to the applied voltage.
00 angstroms or less is selected, and in particular, 50 angstroms or more and 300 angstroms are preferably used. Of course, in order to further improve transparency, a structure may be adopted in which a high refractive index dielectric layer is combined.
【００１６】半導体薄膜は、Ｉｎ２ Ｏ３ ，ＳｎＯ２
，ＩＴＯなどが知られているが、発生熱量の点から２
００オングストローム以上７０００オングストロームの
膜厚のものが使用され、特に７００オングストローム以
上５０００オングストロームが好ましい。半導体薄膜は
膜厚が厚くなると屈曲耐性が低下するので注意が必要と
なる。[0016] The semiconductor thin film is made of In2O3, SnO2
, ITO, etc. are known, but in terms of the amount of heat generated, 2
A film thickness of 00 angstroms or more and 7000 angstroms is used, and a film thickness of 700 angstroms or more and 5000 angstroms is particularly preferred. As semiconductor thin films become thicker, their bending resistance decreases, so care must be taken.
【００１７】電気抵抗値，電極加工及び透明絶縁層４の
加工等の点からは、特に前記の金属薄膜がすぐれている
。The above metal thin film is particularly excellent in terms of electrical resistance, electrode processing, and processing of the transparent insulating layer 4.
【００１８】これらの薄膜は前記の透明基板１の上に、
在来公知の方法で形成される。These thin films are placed on the transparent substrate 1 described above.
It is formed by a conventionally known method.
【００１９】本発明法に於ける透明絶縁層４は、従来公
知の熱硬化型，紫外線硬化型の樹脂が使用される。透明
であればいかなる樹脂でもよいが、特に耐久性の点から
ハロゲン元素の含有量の少ないものがよく、通常５００
ｐｐｍ 以下、特に１００ｐｐｍ 以下が好ましい。透
明絶縁層４は、従来公知の印刷法，塗工法等で設けられ
るが、膜厚は２〜５０μｍであり、特に５〜３０μｍで
ある。For the transparent insulating layer 4 in the method of the present invention, conventionally known thermosetting or ultraviolet curing resins are used. Any resin may be used as long as it is transparent, but from the viewpoint of durability, one with a low content of halogen elements is preferred, and is usually 500%
ppm or less, particularly preferably 100 ppm or less. The transparent insulating layer 4 is provided by a conventionally known printing method, coating method, etc., and has a film thickness of 2 to 50 μm, particularly 5 to 30 μm.
【００２０】本発明法に於ける電極１０は、透明導電性
薄膜２の両端部（電気回路的意味での両端部）へ形成さ
れる。The electrodes 10 in the method of the present invention are formed on both ends (both ends in the sense of an electric circuit) of the transparent conductive thin film 2.
【００２１】透明導電性薄膜２の上に、導電性樹脂５を
在来公知の方法、例えば、印刷法，塗工法で形成する。
導電性樹脂層５は、通常銀粉，金粉，カーボン粉、その
他の金属粉と、ビニル系，フェノール系，エポキシ系，
ポリアミド系等の樹脂との混合体のいずれでも使用出来
る。特に電極としての導電性の点から、銀粉と上記樹脂
系との混合体が好んで用いられる。膜厚は、焼成後の膜
厚として、２〜２０μｍ、通常５〜２０μｍである。A conductive resin 5 is formed on the transparent conductive thin film 2 by a conventionally known method such as a printing method or a coating method. The conductive resin layer 5 is usually made of silver powder, gold powder, carbon powder, or other metal powder, and vinyl, phenol, epoxy, or other metal powder.
Any mixture with a polyamide resin or the like can be used. In particular, from the viewpoint of conductivity as an electrode, a mixture of silver powder and the above resin system is preferably used. The film thickness after firing is 2 to 20 μm, usually 5 to 20 μm.
【００２２】本発明法は、前記導電性樹脂層５の上に、
絶縁性接着層を有する導電性金属箔６を設ける。導電性
金属箔６は、銅，銀，金、その他の金属箔いずれでも使
用出来るが、銅箔で充分であり、通常５〜５０μｍの膜
厚が用いられるが、該導電性金属箔６を導電性樹脂層５
への加工性、その後の導電性樹脂層７の加工性及び透明
フイルム９の加工性と、気泡かみ込み等の外観不良を回
避するためにも、導電性金属箔６の膜厚は１５〜５０μ
ｍが好んで用いられる。[0022] In the method of the present invention, on the conductive resin layer 5,
A conductive metal foil 6 having an insulating adhesive layer is provided. The conductive metal foil 6 can be copper, silver, gold, or any other metal foil, but copper foil is sufficient and a film thickness of 5 to 50 μm is usually used. Resin layer 5
The film thickness of the conductive metal foil 6 is 15 to 50μ in order to improve the processability of the conductive resin layer 7, the subsequent processability of the conductive resin layer 7, the processability of the transparent film 9, and to avoid appearance defects such as air bubbles.
m is preferably used.
【００２３】尚、前記導電性金属箔６に設けられている
絶縁性接着層は、通常、加工性の点から５〜１００μｍ
膜厚の感圧粘着剤が設けられる。特に、導電性樹脂層５
への接着力及び電極部１０の全体厚み、透明フイルム９
加工後の気泡かみ込み防止等から、１０〜６０μｍが好
んで用いられる。絶縁性接着層は、従来の如き導電性接
着剤に比べて、コストを安く抑えることが出来、かつ、
前述の如く、電極部全体の膜厚を薄く抑えることが出来
るので、加工性の点ですぐれている。Note that the insulating adhesive layer provided on the conductive metal foil 6 usually has a thickness of 5 to 100 μm from the viewpoint of processability.
A film thickness of pressure sensitive adhesive is provided. In particular, the conductive resin layer 5
Adhesive force to the electrode part 10, overall thickness of the transparent film 9
A thickness of 10 to 60 μm is preferably used to prevent air bubbles from being trapped after processing. The insulating adhesive layer can reduce costs compared to conventional conductive adhesives, and
As mentioned above, since the film thickness of the entire electrode portion can be kept small, it is excellent in terms of workability.
【００２４】本発明法は、前記導電性金属箔６の全体を
被覆した様に、該導電性金属箔６の上に導電性樹脂層７
を１層又は２層重ねて加工する。導電性樹脂層７は、前
記の導電性樹脂層５と同じ材料を用いてもよく、又、前
記に記載した違った材料を用いてもよい。１層当りの膜
厚は、焼成後２〜２０μｍ、好ましくは５〜２０μｍで
ある。１層加工では、導電性金属箔の端部への導電性樹
脂層の乗りが悪い場合があるので、２層加工が好ましい
。In the method of the present invention, a conductive resin layer 7 is formed on the conductive metal foil 6 so that the conductive metal foil 6 is entirely covered.
Processed in one or two layers. The conductive resin layer 7 may be made of the same material as the conductive resin layer 5, or may be made of a different material as described above. The film thickness per layer is 2 to 20 μm, preferably 5 to 20 μm after firing. In one-layer processing, the conductive resin layer may not adhere well to the ends of the conductive metal foil, so two-layer processing is preferable.
【００２５】本発明法に於て、前記の構成体へ更に接着
層８を有する透明フイルム９を在来公知の方法、例えば
ラミネート等の方法により設ける。接着層８は特に制限
はなく、前記の接着層３と同じ種類の膜厚５〜１００μ
ｍ、特に１０〜７０μｍが常用される。透明フイルム９
は前記の透明基板１と同じ種類の材料から用いられ、通
常１〜１００μｍ、特に５〜５０μｍの厚みが好んで用
いられる。In the method of the present invention, a transparent film 9 having an adhesive layer 8 is further provided on the above-mentioned structure by a conventionally known method such as lamination. The adhesive layer 8 is not particularly limited, and may be the same type as the adhesive layer 3 with a thickness of 5 to 100 μm.
m, especially 10 to 70 μm is commonly used. transparent film 9
is made of the same kind of material as the transparent substrate 1, and preferably has a thickness of usually 1 to 100 μm, particularly 5 to 50 μm.
【００２６】かくして得られた構成体１５は、あらかじ
め偏光板１１，液晶素子１２及び偏光板１３と積層され
た上に、圧着して使用される。The thus obtained structural body 15 is used by laminating the polarizing plate 11, the liquid crystal element 12, and the polarizing plate 13 in advance, and then press-bonding the layers.
【００２７】次に実施例を示すが、本発明法は何らこれ
に限定されるものではない。Examples will be shown next, but the method of the present invention is not limited thereto.
【００２８】[0028]
【実施例１】ポリエステルフイルム１２５μｍの上に、
真空度３×１０−３Ｔｏｒｒ下、Ａｇ−Ｃｕ（Ｃｕ１０
重量％）ターゲットを用いて、スパッタリングを行い、
１６０オングストローム膜厚の導電性薄膜層を形成して
透明導電性フイルムを得る。可視光透過率７５％（ａｔ
５５０ｎｍ），表面抵抗７Ω／□であった。[Example 1] On a 125 μm polyester film,
Ag-Cu (Cu10
Sputtering is performed using a target (% by weight),
A conductive thin film layer having a thickness of 160 angstroms is formed to obtain a transparent conductive film. Visible light transmittance 75% (at
550 nm), and the surface resistance was 7Ω/□.
【００２９】次に、前記透明導電性フイルムの背面にア
クリレート系感圧粘着剤４０μｍを加工して、粘着剤付
きの透明導電性フイルムを得る。Next, a 40 μm thick acrylate pressure-sensitive adhesive is applied to the back surface of the transparent conductive film to obtain a transparent conductive film coated with an adhesive.
【００３０】上記の透明導電性フイルムを１００ｍｍ角
に裁断して、両端部各々１０ｍｍずつ残してアクリレー
ト系透明絶縁層（帝国インキ製，ＴＥＣ−４４４０）を
８０ｍｍの巾で、膜厚２０μｍになる様にスクリーン印
刷の後、紫外光を照射して固化せしめる。The above-mentioned transparent conductive film was cut into 100 mm square pieces, and an acrylate-based transparent insulating layer (manufactured by Teikoku Ink, TEC-4440) was cut to a width of 80 mm and a film thickness of 20 μm, leaving 10 mm on each end. After screen printing, it is irradiated with ultraviolet light to harden it.
【００３１】その後、両端部へ１０ｍｍ巾で、Ａｇペー
ストを１０μｍ膜厚（乾燥後膜厚換算）で印刷し、１０
０℃で３０分間乾燥し、第１層目の導電性樹脂層をうる
。
続いて、巾５ｍｍ、長さ１２０ｍｍアクリレート系粘着
層２０μｍを有する膜厚３０μｍの銅箔を、第１層目の
導電性樹脂の上に貼りつけ、更にその上に、１０ｍｍ巾
で第１層目と全く同様にＡｇペーストを第２層目，第３
層目と印刷して乾燥する。[0031] After that, Ag paste was printed on both ends with a width of 10 mm to a film thickness of 10 μm (converted to film thickness after drying).
Dry at 0° C. for 30 minutes to obtain a first conductive resin layer. Next, a copper foil with a thickness of 30 μm having a width of 5 mm and a length of 120 mm and an acrylate adhesive layer of 20 μm is pasted on top of the first layer of conductive resin, and on top of that, a first layer with a width of 10 mm is applied. In exactly the same way as above, apply Ag paste to the second and third layers.
Print layers and dry.
【００３２】更に、上記の構成体の上、アクリレート系
粘着剤（膜厚２０μｍ）を有するポリエステルフイルム
２５μｍ厚よりなる１００ｍｍ角の保護フイルムを全面
に亘って被覆する様にラミネートして透明面状ヒーター
をうる。かくして得られたヒーターの可視光透過率は７
３％で、５．５Ωであった。Furthermore, on the above structure, a 100 mm square protective film made of a 25 μm thick polyester film having an acrylate adhesive (20 μm thick) was laminated so as to cover the entire surface, thereby forming a transparent planar heater. get it. The visible light transmittance of the thus obtained heater was 7.
At 3%, it was 5.5Ω.
【００３３】上記の如く得られたヒーターを目視で検査
し、０．１５ｍｍ以下の異物を合格基準として、外観合
格率を算出した結果、６０％が合格であった。次いで、
上記で得れらたヒーターを図３の如く偏光板・液晶素子
・偏光板へ圧着して、−２０℃の恒温槽中に保持し、電
極部へ１３Ｖの電圧を１分間印加したところ、ヒーター
の表面温度は、面内５点測定で、５℃±３℃の範囲に入
っており、液晶素子を駆動させたところ、全面均一に駆
動していた。The heaters obtained as described above were visually inspected, and the appearance acceptance rate was calculated using foreign matter of 0.15 mm or less as an acceptance criterion, and as a result, 60% passed the inspection. Then,
The heater obtained above was pressure-bonded to the polarizing plate, liquid crystal element, and polarizing plate as shown in Figure 3, and kept in a constant temperature oven at -20°C. When a voltage of 13V was applied to the electrode part for 1 minute, the heater The surface temperature was measured at five points within the surface and was within the range of 5°C±3°C, and when the liquid crystal element was driven, it was driven uniformly over the entire surface.
【００３４】[0034]
【実施例２】実施例１に於て、あらかじめ背面にシリコ
ン系のハードコート層を加工したポリエステルフイルム
（１２５μｍ）に、実施例１と同様に、導電性薄膜層を
形成した。可視光透過率７６％，表面抵抗７．１Ω／□
の導電性フイルムが得られた。[Example 2] In the same manner as in Example 1, a conductive thin film layer was formed on a polyester film (125 μm) whose back surface had been previously processed with a silicon-based hard coat layer. Visible light transmittance 76%, surface resistance 7.1Ω/□
A conductive film was obtained.
【００３５】上記導電性フイルムに、実施例１と同じ条
件下で、透明絶縁層を印刷し、次いで第１層の導電性樹
脂層，アクリレート系粘着層付き銅箔，第２層及び第３
層目の導電性樹脂層を積層し、更に実施例１と同様に保
護フイルムをラミネートを行う。続いて、あらかじめ、
離型フイルムで挟んだアクリレート系粘着層（膜厚４０
μｍ）を有するフイルムを、一方の離型フイルムを剥離
しながら、該粘着層を前記ハードコート処理面へ転写し
て透明面状ヒーターをうる。可視光透過率７３．５％，
５．６Ωであった。A transparent insulating layer was printed on the above conductive film under the same conditions as in Example 1, and then a first conductive resin layer, a copper foil with an acrylate adhesive layer, a second layer, and a third layer were printed on the conductive film.
Conductive resin layers are laminated, and a protective film is further laminated in the same manner as in Example 1. Next, in advance,
Acrylate adhesive layer sandwiched between release films (thickness: 40 mm)
A transparent sheet heater is obtained by transferring the adhesive layer onto the hard coated surface while peeling off one of the release films. Visible light transmittance 73.5%,
It was 5.6Ω.
【００３６】実施例１と同様に目視検査により、外観合
格率を調べたところ、８０％が合格であった。実施例１
の不合格にみられた様な粘着剤粉による異物の欠点が大
巾に低減しており、加工中に混入したとみられるゴミに
起因する異物がほとんどであった。[0036] As in Example 1, the appearance pass rate was examined by visual inspection, and 80% passed. Example 1
The defects caused by foreign particles caused by adhesive powder, which were seen in the rejected products, have been greatly reduced, and most of the defects were caused by dust that seemed to have gotten mixed in during processing.
【００３７】尚、実施例１と同様に、−２０℃の恒温槽
中に保持し、１３Ｖ、１分電圧印加した場合の表面温度
は、面内５点測定で、５℃±３℃の範囲に入っており、
実施例１と同様に駆動された液晶素子は、全面均一に作
動していた。[0037] Similarly to Example 1, when the surface temperature is kept in a -20°C constant temperature bath and a voltage of 13V is applied for 1 minute, the surface temperature is measured at 5 points on the surface and is within the range of 5°C ± 3°C. It is in
The liquid crystal element driven in the same manner as in Example 1 operated uniformly over the entire surface.
【００３８】[0038]
【比較例１】実施例２に於て、背面をハードコート層を
加工することなく、又背面に粘着層を転写する工程を省
略した以外は全て実施例２の如く、ヒーターを作製した
。[Comparative Example 1] A heater was produced in the same manner as in Example 2 except that the hard coat layer was not processed on the back surface and the step of transferring the adhesive layer to the back surface was omitted.
【００３９】目視検査による外観合格率は、２０％であ
った。不良品を調べたところ、背面に多数の傷が入って
おり、又、ヒーター全体が加工中の加熱処理によるオリ
ゴマーの析出により白濁していることが認められた。The appearance pass rate by visual inspection was 20%. When the defective product was inspected, it was found that there were many scratches on the back surface, and that the entire heater was cloudy due to oligomer precipitation due to heat treatment during processing.
【００４０】得られた透明面状ヒーターを液晶素子の偏
光板側へ、ヒーターの面端電極部を冶具で押えて、実施
例１と同様に−２０℃下で面内温度を測定したところ、
５℃±１５℃とバラツキが大きく、液晶素子を駆動させ
たところ、液晶素子の面内は、作動している部分と作動
が極めてにぶい部分とが混在し、更には中央部の一部が
作動しなかった。The obtained transparent planar heater was placed on the polarizing plate side of the liquid crystal element, and the surface end electrode portion of the heater was held down with a jig, and the in-plane temperature was measured at -20° C. in the same manner as in Example 1.
There is a large variation of 5°C ± 15°C, and when the liquid crystal element is driven, there are parts in the plane of the liquid crystal element that are operating and parts that are extremely slow to operate, and even a part of the center part is not activated. I didn't.
【図１】本発明の透明面状ヒーターの断面概念図を表わ
す。FIG. 1 shows a conceptual cross-sectional view of a transparent sheet heater of the present invention.
【図２】液晶素子と組合せて使用した場合の断面概念図
を表わす。FIG. 2 shows a conceptual cross-sectional view when used in combination with a liquid crystal element.
１ 透明基板
２ 透明導電性薄膜３，８
接着層
４ 透明絶縁層
５，７ 導電性樹脂層
６ 絶縁性接着層付き導電性金属箔
９ 透明フイルム
１０ 電極
１１，１３ 偏光板
１２ 液晶素子
１４ バックライト1 Transparent substrate 2 Transparent conductive thin film 3, 8
Adhesive layer 4 Transparent insulating layers 5, 7 Conductive resin layer 6 Conductive metal foil with insulating adhesive layer 9 Transparent film 10 Electrodes 11, 13 Polarizing plate 12 Liquid crystal element 14 Backlight
Claims (1)
端部に電極を設け、この電極に電圧を印加することによ
り電極間の該透明導電性薄膜に熱を発生する様にした透
明面状ヒーターに於て、接着層，透明基板，透明導電性
薄膜，透明絶縁層，接着層及び透明フイルムの順に積層
された構成体であり、かつ、前記透明導電性薄膜の両端
部は、導電性樹脂，絶縁性接着層を有する導電性金属箔
及び該導電性金属箔を被覆した導電性樹脂からなる電極
を有することを特徴とする透明面状ヒーター。[Claim 1] A transparent surface having electrodes provided at both ends of a transparent conductive thin film laminated on a transparent substrate, and applying a voltage to the electrodes to generate heat in the transparent conductive thin film between the electrodes. The heater has a structure in which an adhesive layer, a transparent substrate, a transparent conductive thin film, a transparent insulating layer, an adhesive layer, and a transparent film are laminated in this order, and both ends of the transparent conductive thin film are conductive. A transparent planar heater comprising a resin, a conductive metal foil having an insulating adhesive layer, and an electrode made of a conductive resin covering the conductive metal foil.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3078197A JPH04289685A (en) | 1991-03-19 | 1991-03-19 | Transparent sheet-like heater |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3078197A JPH04289685A (en) | 1991-03-19 | 1991-03-19 | Transparent sheet-like heater |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH04289685A true JPH04289685A (en) | 1992-10-14 |
Family
ID=13655289
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP3078197A Pending JPH04289685A (en) | 1991-03-19 | 1991-03-19 | Transparent sheet-like heater |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH04289685A (en) |
Cited By (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5493102A (en) * | 1993-01-27 | 1996-02-20 | Mitsui Toatsu Chemicals, Inc. | Transparent panel heater |
| JPH0888077A (en) * | 1994-09-19 | 1996-04-02 | Mitsui Toatsu Chem Inc | Transparent flat heater and its manufacture |
| KR20020088908A (en) * | 2001-05-22 | 2002-11-29 | 주식회사 제이디텍 | Surface type heating body by conductive material |
| DE10129220A1 (en) * | 2001-06-01 | 2002-12-12 | Siemens Ag | Motor vehicle display arrangement, has two carrier-brackets one of which is made of flexible foil |
| KR20060005276A (en) * | 2004-07-12 | 2006-01-17 | 김영철 | Attachable anti-fog film using transparent conducting film |
| JP2006024500A (en) * | 2004-07-09 | 2006-01-26 | Gunze Ltd | Transparent surface exothermic body and its manufacturing method |
| JP2006024501A (en) * | 2004-07-09 | 2006-01-26 | Gunze Ltd | Transparent surface exothermic body and its manufacturing method |
| JP2006119418A (en) * | 2004-10-22 | 2006-05-11 | Gunze Ltd | Transparent planar heater and method for manufacturing same |
| CN110554451A (en) * | 2018-05-31 | 2019-12-10 | 住友化学株式会社 | Laminate and method for producing same |
| WO2020026898A1 (en) | 2018-08-02 | 2020-02-06 | 日東電工株式会社 | Heater and article with heater |
| JP2020167106A (en) * | 2019-03-29 | 2020-10-08 | 日東電工株式会社 | heater |
-
1991
- 1991-03-19 JP JP3078197A patent/JPH04289685A/en active Pending
Cited By (19)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5750267A (en) * | 1993-01-27 | 1998-05-12 | Mitsui Toatsu Chemicals, Inc. | Transparent conductive laminate |
| US5493102A (en) * | 1993-01-27 | 1996-02-20 | Mitsui Toatsu Chemicals, Inc. | Transparent panel heater |
| JPH0888077A (en) * | 1994-09-19 | 1996-04-02 | Mitsui Toatsu Chem Inc | Transparent flat heater and its manufacture |
| KR20020088908A (en) * | 2001-05-22 | 2002-11-29 | 주식회사 제이디텍 | Surface type heating body by conductive material |
| DE10129220B4 (en) * | 2001-06-01 | 2008-02-07 | Siemens Ag | display |
| DE10129220A1 (en) * | 2001-06-01 | 2002-12-12 | Siemens Ag | Motor vehicle display arrangement, has two carrier-brackets one of which is made of flexible foil |
| JP2006024500A (en) * | 2004-07-09 | 2006-01-26 | Gunze Ltd | Transparent surface exothermic body and its manufacturing method |
| JP2006024501A (en) * | 2004-07-09 | 2006-01-26 | Gunze Ltd | Transparent surface exothermic body and its manufacturing method |
| KR20060005276A (en) * | 2004-07-12 | 2006-01-17 | 김영철 | Attachable anti-fog film using transparent conducting film |
| JP2006119418A (en) * | 2004-10-22 | 2006-05-11 | Gunze Ltd | Transparent planar heater and method for manufacturing same |
| JP4662751B2 (en) * | 2004-10-22 | 2011-03-30 | グンゼ株式会社 | Transparent sheet heating element and manufacturing method thereof |
| CN110554451A (en) * | 2018-05-31 | 2019-12-10 | 住友化学株式会社 | Laminate and method for producing same |
| JP2019211771A (en) * | 2018-05-31 | 2019-12-12 | 住友化学株式会社 | Laminate and production method of the same |
| JP2020116955A (en) * | 2018-05-31 | 2020-08-06 | 住友化学株式会社 | Laminate and method for manufacturing the same |
| CN110554451B (en) * | 2018-05-31 | 2022-06-07 | 住友化学株式会社 | Laminate and method for producing same |
| WO2020026898A1 (en) | 2018-08-02 | 2020-02-06 | 日東電工株式会社 | Heater and article with heater |
| JP2020021663A (en) * | 2018-08-02 | 2020-02-06 | 日東電工株式会社 | Heater and article with heater |
| KR20210038571A (en) | 2018-08-02 | 2021-04-07 | 닛토덴코 가부시키가이샤 | Heater and heater attachment |
| JP2020167106A (en) * | 2019-03-29 | 2020-10-08 | 日東電工株式会社 | heater |
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