JPH04265746A - Manufacture of multilayer laminated board - Google Patents
Manufacture of multilayer laminated boardInfo
- Publication number
- JPH04265746A JPH04265746A JP3026584A JP2658491A JPH04265746A JP H04265746 A JPH04265746 A JP H04265746A JP 3026584 A JP3026584 A JP 3026584A JP 2658491 A JP2658491 A JP 2658491A JP H04265746 A JPH04265746 A JP H04265746A
- Authority
- JP
- Japan
- Prior art keywords
- vacuum
- atmosphere
- multilayer laminate
- manufacture
- multilayer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 24
- 229920005989 resin Polymers 0.000 claims abstract description 19
- 239000011347 resin Substances 0.000 claims abstract description 19
- 238000000034 method Methods 0.000 claims abstract description 18
- 238000007789 sealing Methods 0.000 claims abstract description 10
- 230000006837 decompression Effects 0.000 abstract description 4
- 238000010438 heat treatment Methods 0.000 abstract description 4
- 238000010030 laminating Methods 0.000 abstract 1
- 230000003068 static effect Effects 0.000 abstract 1
- 229920005992 thermoplastic resin Polymers 0.000 description 8
- 239000000463 material Substances 0.000 description 7
- 239000002390 adhesive tape Substances 0.000 description 4
- 239000004734 Polyphenylene sulfide Substances 0.000 description 3
- 239000004020 conductor Substances 0.000 description 3
- 239000011888 foil Substances 0.000 description 3
- 239000002184 metal Substances 0.000 description 3
- 229920000069 polyphenylene sulfide Polymers 0.000 description 3
- 230000001681 protective effect Effects 0.000 description 3
- 229920001187 thermosetting polymer Polymers 0.000 description 3
- 239000004744 fabric Substances 0.000 description 2
- 238000003475 lamination Methods 0.000 description 2
- 238000000465 moulding Methods 0.000 description 2
- LSNNMFCWUKXFEE-UHFFFAOYSA-M Bisulfite Chemical compound OS([O-])=O LSNNMFCWUKXFEE-UHFFFAOYSA-M 0.000 description 1
- 239000004696 Poly ether ether ketone Substances 0.000 description 1
- 239000004697 Polyetherimide Substances 0.000 description 1
- 239000004721 Polyphenylene oxide Substances 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 229920000570 polyether Polymers 0.000 description 1
- 229920002530 polyetherether ketone Polymers 0.000 description 1
- 229920001601 polyetherimide Polymers 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 239000009719 polyimide resin Substances 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
Landscapes
- Laminated Bodies (AREA)
- Casting Or Compression Moulding Of Plastics Or The Like (AREA)
Abstract
Description
【０００１】［発明の目的］[Object of the invention]
【０００２】0002
【産業上の利用分野】本発明は多層積層板の製造方法に
係り、たとえば熱可塑性樹脂を絶縁層とした多層プリン
ト配線板の製造などに適する多層積層板の製造方法に関
する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for manufacturing a multilayer laminate, and more particularly, to a method for manufacturing a multilayer laminate suitable for manufacturing a multilayer printed wiring board having an insulating layer made of thermoplastic resin.
【０００３】0003
【従来の技術】たとえば、電子機器類の小形化や回路機
能の向上などに対応して、電子部品を搭載・実装するプ
リント配線板においても、導体パターンの多層化が図ら
れている。すなわち、実装用プリント配線板などの構成
において、絶縁基板層内に所要の導体パターンを多層的
に内装させるとともに、所要の導体パターン層間をいわ
ゆるブライドホール、ベイリドホールおよびスルーホー
ルなどを介して電気的に接続した構成の多層プリント配
線板が広く実用に供されている。2. Description of the Related Art For example, in response to the miniaturization of electronic devices and improvement of circuit functions, printed wiring boards on which electronic components are mounted and mounted have multilayered conductor patterns. In other words, in the configuration of printed wiring boards for mounting, etc., the required conductor patterns are installed in multiple layers within the insulating substrate layer, and the required conductor pattern layers are electrically connected via so-called blind holes, bailed holes, through holes, etc. Multilayer printed wiring boards having a connected configuration are widely used in practical use.
【０００４】ところで、前記多層プリント配線板など多
層積層板の構成においては、一般に熱硬化性樹脂もしく
は熱可塑性樹脂を絶縁層として積層している。しかして
、この種の多層積層板は、一般に次のような手段で製造
されている。たとえば、ポリフェニレンサルファイド樹
脂などから成る熱可塑性樹脂層（フイルム）を用意し、
この熱可塑性樹脂フイルムの所要枚数を重ね（積層し）
、加熱加圧プレスによって、成型一体化して所要の積層
板を得ている。このような多層積層板の製造は、熱硬化
性樹脂をたとえばクロス類などの基材に含浸させたプリ
プレグを用いた場合もほぼ同様に行われている。By the way, in the construction of a multilayer laminate such as the multilayer printed wiring board, thermosetting resin or thermoplastic resin is generally laminated as an insulating layer. However, this type of multilayer laminate is generally manufactured by the following method. For example, a thermoplastic resin layer (film) made of polyphenylene sulfide resin is prepared,
Layer (laminate) the required number of thermoplastic resin films.
The desired laminate is obtained by integrally molding the laminate using a heated and pressurized press. The production of such a multilayer laminate is carried out in substantially the same way when using a prepreg in which a base material such as cloth is impregnated with a thermosetting resin.
【０００５】一方、前記加熱加圧プレスによる積層一体
化手段に対し、内部に真空（減圧）雰囲気の形成が可能
で、外圧によって容易に変形する容器を利用する方式も
知られている。すなわち、図４にその実施態様を断面的
に示すように、先ず真空排気源に接続する配管接続口を
有するベース板（プラテン）１上に、たとえば熱可塑性
樹脂層（フイルム）２の複数枚を積層して配置する。次
いで、前記積層・配置した熱可塑性樹脂層（フイルム）
２上に、保護用基材３を配置した後、これらを完全に覆
うように耐熱性で変形容易なフイルム４を配置し、この
フイルム４の周辺部を前記ベース板（プラテン）１上に
、たとえば耐熱性の両面粘着テープ５を介して気密に封
止する。しかる後、この気密封止体を前記熱可塑性樹脂
が軟化するに十分な所要の温度を保持し得るオートクレ
ーブ内に装着し、気密封止体内を真空（減圧）に排気す
る。このような操作によって、前記積層体は密着一体化
して、所望の多層積層体たとえば多層プリント配線板を
得ることができる。[0005] On the other hand, in contrast to the above-mentioned lamination and integration means using a heating and pressurizing press, a method is also known that uses a container that can form a vacuum (reduced pressure) atmosphere inside and is easily deformed by external pressure. That is, as shown in cross-section in this embodiment in FIG. Arrange in layers. Next, the laminated and arranged thermoplastic resin layer (film)
After placing the protective base material 3 on the base plate 2, a heat-resistant and easily deformable film 4 is placed so as to completely cover them, and the peripheral part of this film 4 is placed on the base plate (platen) 1. For example, it is hermetically sealed using a heat-resistant double-sided adhesive tape 5. Thereafter, this hermetically sealed body is placed in an autoclave capable of maintaining a required temperature sufficient to soften the thermoplastic resin, and the inside of the hermetically sealed body is evacuated to a vacuum (reduced pressure). By such an operation, the laminate is closely integrated to obtain a desired multilayer laminate, such as a multilayer printed wiring board.
【０００６】[0006]
【発明が解決しようとする課題】前記真空（減圧）−外
圧利用系の多層積層板の製造方法の場合は、設備面が比
較的簡略化されるので、たとえば小形の積層板などの製
造に適するといえるが、実施の点で次のような問題があ
る。すなわち、比較的高価な両面粘着テープなど用いる
ため、コスト的に適用し得ない場合が往々ある。しかも
、耐熱性で変形容易なフイルム４の配置し、このフイル
ム４周辺部の両面粘着テープ５による気密封止および処
理後の除去などの手作業を要し、操作が繁雑で作業性も
劣るばかりでなく、両面粘着テープ５による気密封止の
信頼性、ベース板（プラテン）１の移動に簡易リフトな
ど要する（重く、また加熱昇温で接触難のため）という
問題もある。[Problems to be Solved by the Invention] In the case of the method for manufacturing multilayer laminates using the vacuum (reduced pressure)/external pressure system, the equipment is relatively simple, so it is suitable for manufacturing, for example, small laminates. However, there are the following problems in terms of implementation. That is, since it uses a relatively expensive double-sided adhesive tape, it is often not applicable due to cost considerations. Moreover, it requires manual labor such as arranging the heat-resistant and easily deformable film 4, airtightly sealing the periphery of the film 4 with double-sided adhesive tape 5, and removing it after processing, resulting in complicated operations and poor workability. In addition, there are also problems in that the reliability of the airtight seal with the double-sided adhesive tape 5 is low, and that a simple lift is required to move the base plate (platen) 1 (because it is heavy and difficult to contact due to heating and temperature rise).
【０００７】本発明は上記事情に対処してなされたもの
で、簡易な治具の使用によって操作などの簡易化を図っ
た実用性の高い多層積層板の製造方法を提供することを
目的とする。The present invention has been made in response to the above-mentioned circumstances, and it is an object of the present invention to provide a highly practical method for manufacturing a multilayer laminate, which simplifies operations by using a simple jig. .
【０００８】［発明の構成］[Configuration of the invention]
【０００９】[0009]
【課題を解決するための手段】本発明に係る多層積層板
の製造方法は、真空（減圧）雰囲気下に積層・配置した
樹脂層を、加熱雰囲気下で加熱・密着させて積層一体化
する多層積層板の製造方法において、前記真空（減圧）
雰囲気下を、少なくとも一端側が真空排気口を有しかつ
気密に着脱可能な封止具で封止された耐熱性で変形容易
な容器にて形成することを特徴とする。[Means for Solving the Problems] The method for manufacturing a multilayer laminate according to the present invention is a method for manufacturing a multilayer laminate in which resin layers are laminated and arranged in a vacuum (reduced pressure) atmosphere and then heated and brought into close contact with each other in a heated atmosphere to integrate the multilayer laminate. In the method for manufacturing a laminate, the vacuum (reduced pressure)
The atmosphere is formed by a heat-resistant and easily deformable container that has a vacuum exhaust port on at least one end side and is hermetically sealed with a removable sealer.
【００１０】0010
【作用】本発明に係る多層積層板の製造方法においては
、気体によって加熱加圧されて、内装した積層樹脂層を
密着・一体化するため、少なくとも一端側が真空排気口
を有しかつ気密に着脱可能な封止具で封止された耐熱性
で変形容易な容器、たとえば金属箔容器など特殊な治具
を用いる。しかして、外側から均一な加圧が可能となる
ばかりでなく、被加工体としての樹脂層の積層配置や気
密封止作業なども大幅に簡易化しながら、信頼性の高い
多層積層板を得ることが可能である。[Function] In the method for manufacturing a multilayer laminate according to the present invention, at least one end side has a vacuum exhaust port and is airtightly attached and detached in order to adhere and integrate the inner laminated resin layers by heating and pressurizing with gas. Use a special jig, such as a heat-resistant and easily deformable container sealed with a suitable closure, such as a metal foil container. This not only makes it possible to apply pressure uniformly from the outside, but also greatly simplifies the lamination arrangement of resin layers as a workpiece and hermetic sealing work, while producing a highly reliable multilayer laminate. is possible.
【００１１】[0011]
【実施例】以下、本発明に係る多層積層板の製造方法の
実施態様例を模式的に示す図１、図２および図３を参照
し、本発明の実施例を説明する。先ず、次のように構成
された真空（減圧）雰囲気を形成可能な容器（治具）６
を用意した。すなわち、図１平面的に示すような金属箔
製の耐熱性で変形容易な、一端が開口する被加工体が余
裕をもって入る袋６ａと、前記袋６ａの開口部に装着さ
れた真空排気口６ｂを有する封止具 ６ｃ とから成る
真空（減圧）雰囲気を形成可能な容器６を用意する。な
お、前記封止具 ６ｃ は袋６ａの開口部に対して、た
とえば密閉用ボルト６ｄによって着脱自在に装着されて
おり、被加工体としての樹脂層の積層配置時あるいは積
層一体化後の取り出し時に着脱される。EXAMPLES Examples of the present invention will be described below with reference to FIGS. 1, 2, and 3, which schematically show embodiments of the method for manufacturing a multilayer laminate according to the present invention. First, a container (jig) 6 that can form a vacuum (reduced pressure) atmosphere is constructed as follows.
prepared. That is, as shown in plan view in FIG. 1, there is a bag 6a made of metal foil that is heat-resistant and easily deformable, and has one end open so that a workpiece can be accommodated therein, and a vacuum exhaust port 6b attached to the opening of the bag 6a. A container 6 capable of forming a vacuum (reduced pressure) atmosphere is prepared. Note that the sealing tool 6c is detachably attached to the opening of the bag 6a, for example, by a sealing bolt 6d, and is used when the resin layers as the workpiece are stacked or taken out after being integrated. It is attached and detached.
【００１２】一方、被加工体としてたとえば厚さ５０μ
ｍ ，長さ２００ｍｍ ，幅２００ｍｍ のポリフェニ
レンサルファイド樹脂フイルム２複数枚を用意する。次
いで、前記真空（減圧）雰囲気を形成可能な容器６の封
止具６ｃを取り外し、図２に斜視的に示すごとく開口部
を介して袋６ａ内に、予め用意しておいた保護用基材、
前記用意した樹脂フイルム２を順次積層して配置した後
、さらに保護用基材を積層した。しかる後、前記取り外
した封止具６ｃを気密に装着して、図３に側面的に示す
ように真空（減圧）雰囲気を形成可能な容器６内に、被
加工体を封入・装着した。On the other hand, the workpiece has a thickness of 50 μm, for example.
Prepare two or more polyphenylene sulfide resin films having a length of 200 mm, a length of 200 mm, and a width of 200 mm. Next, the sealing member 6c of the container 6 capable of forming a vacuum (decompression) atmosphere is removed, and the protective base material prepared in advance is inserted into the bag 6a through the opening as shown perspectively in FIG. ,
After the resin films 2 prepared above were sequentially laminated and arranged, a protective base material was further laminated. Thereafter, the removed sealing member 6c was attached airtightly, and the workpiece was sealed and attached in a container 6 capable of creating a vacuum (decompression) atmosphere, as shown from the side in FIG.
【００１３】上記の被加工体を封入・装着した容器（治
具）６を、真空排気管を具備したオートクレーブ内に装
着した。つまり、容器（治具）６の封止具 ６ｃ に設
けられている真空排気口６ｂを、前記オートクレーブ内
の真空排気管に接続して配置した。しかる後、前記容器
（治具）６内を真空（減圧）排気する一方、オートクレ
ーブ内の温度をたとえば ℃程度とし、 分間
保持して周面側から加熱加圧して密着・一体化した積層
体（積層板）を得た。この加圧成型において、容器（治
具）６内に封入・装着された被加工体は、外側（周面側
）からほぼ均一圧力が加えられるため、全体的に緻密で
一様に密着した多層積層板が形成された。The container (jig) 6 in which the above-mentioned workpiece was sealed and mounted was placed in an autoclave equipped with a vacuum exhaust pipe. That is, the vacuum exhaust port 6b provided in the sealing tool 6c of the container (jig) 6 was connected to the vacuum exhaust pipe inside the autoclave. Thereafter, the inside of the container (jig) 6 is evacuated (depressurized), and the temperature inside the autoclave is set to, for example, about ℃, and held for a minute to heat and pressurize from the circumferential side to form a tightly bonded and integrated laminate ( A laminate) was obtained. In this pressure molding, the workpiece sealed and installed in the container (jig) 6 is subjected to almost uniform pressure from the outside (circumferential surface side), resulting in a dense and uniformly adhered multi-layered workpiece as a whole. A laminate was formed.
【００１４】なお、上記では被加工体として、ポリフェ
ニレンサルファイド樹脂フイルムを使用した例を示した
が、たとえばポリエーテルイミド樹脂フイルム、ポリエ
ーテルエーテルケトン樹脂フイルム、ポリエーテルスル
フォン酸樹脂フイルム、ポリイミド樹脂フイルムなど他
の熱可塑性樹脂フイルム（層）、もしくはこれらの樹脂
をたとえば絶縁紙やクロス類に含侵被着させた構成のも
のであってもよい。さらに、熱可塑性樹脂に限らずたと
えばエポキシ樹脂など熱硬化性樹脂のプリプレグタイプ
のものを素材とした多層積層板の製造も可能である。勿
論これらの場合、積層する各樹脂層面に所要の導体パタ
ーンを形成しておくことによって、多層プリント配線板
を得ることも可能である。[0014] In the above example, a polyphenylene sulfide resin film was used as the workpiece, but other materials such as polyetherimide resin film, polyether ether ketone resin film, polyether sulfonic acid resin film, polyimide resin film, etc. Other thermoplastic resin films (layers) or structures in which these resins are impregnated and adhered to, for example, insulating paper or cloth may also be used. Furthermore, it is also possible to manufacture a multilayer laminate using not only a thermoplastic resin but also a prepreg-type thermosetting resin such as an epoxy resin. Of course, in these cases, it is also possible to obtain a multilayer printed wiring board by forming a required conductive pattern on the surface of each resin layer to be laminated.
【００１５】さらに、前記では容器（治具）６の被加工
体を封入・装着する耐熱性で変形容易な袋６ａを金属箔
で構成した例を示したが、所要の耐熱性、変形容易性お
よび気密性を有するものであれば、他の材質製であって
もよい。Further, in the above example, the heat-resistant and easily deformable bag 6a for enclosing and mounting the workpiece of the container (jig) 6 is constructed of metal foil. It may also be made of other materials as long as it has airtightness.
【００１６】[0016]
【発明の効果】上記のように、本発明に係る多層積層板
の製造方法によれば、比較的高価な資材など用いること
なく、また繁雑な操作も要せずに、品質面でもすぐれた
多層積層板を容易に得ることができる。換言すると、良
好な作業性によって所要の絶縁積層板あるいは多層プリ
ント配線板などを、量産的にかつ低コストで製造し得る
ことになる。Effects of the Invention As described above, according to the method for manufacturing a multilayer laminate according to the present invention, a multilayer board with excellent quality can be produced without using relatively expensive materials or complicated operations. Laminated plates can be easily obtained. In other words, due to good workability, required insulating laminates or multilayer printed wiring boards can be mass-produced at low cost.
【図１】本発明に係る多層積層板の製造方法において用
いる真空（減圧）雰囲気を形成可能な容器（治具）例を
示す平面図。FIG. 1 is a plan view showing an example of a container (jig) capable of forming a vacuum (reduced pressure) atmosphere used in the method for manufacturing a multilayer laminate according to the present invention.
【図２】本発明に係る多層積層板の製造方法において真
空（減圧）雰囲気を形成可能な容器（治具）内に被加工
体を封入・装着した態様を模式的に示す斜視図。FIG. 2 is a perspective view schematically showing a mode in which a workpiece is enclosed and mounted in a container (jig) capable of forming a vacuum (reduced pressure) atmosphere in the method for manufacturing a multilayer laminate according to the present invention.
【図３】本発明に係る多層積層板の製造方法において真
空（減圧）雰囲気を形成可能な容器（治具）内に被加工
体を封入・装着し封止したた態様を模式的に示す側面図
。FIG. 3 is a side view schematically showing an embodiment in which a workpiece is enclosed, mounted, and sealed in a container (jig) capable of forming a vacuum (reduced pressure) atmosphere in the method for manufacturing a multilayer laminate according to the present invention. figure.
【図４】従来の多層積層板の製造方法において真空（減
圧）雰囲気を形成可能な容器（治具）内に被加工体を封
入・装着し封止したた態様を模式的に示す断面図。FIG. 4 is a cross-sectional view schematically showing a state in which a workpiece is enclosed, mounted, and sealed in a container (jig) capable of forming a vacuum (reduced pressure) atmosphere in a conventional method for manufacturing a multilayer laminate.
Claims (1)
た樹脂層を、加熱雰囲気下で加熱・密着させて積層一体
化する多層積層板の製造方法において、前記真空（減圧
）雰囲気下を、少なくとも一端側が真空排気口を有しか
つ気密に着脱可能な封止具で封止された耐熱性で変形容
易な容器にて形成することを特徴とする多層積層板の製
造方法。1. A method for producing a multilayer laminate, in which resin layers stacked and arranged under a vacuum (reduced pressure) atmosphere are heated and brought into close contact with each other in a heated atmosphere to integrate them, wherein the under vacuum (reduced pressure) atmosphere comprises: 1. A method for manufacturing a multilayer laminate, comprising forming a heat-resistant and easily deformable container having a vacuum exhaust port on at least one end side and hermetically sealed with a removable sealing device.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3026584A JPH04265746A (en) | 1991-02-21 | 1991-02-21 | Manufacture of multilayer laminated board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3026584A JPH04265746A (en) | 1991-02-21 | 1991-02-21 | Manufacture of multilayer laminated board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH04265746A true JPH04265746A (en) | 1992-09-21 |
Family
ID=12197598
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP3026584A Withdrawn JPH04265746A (en) | 1991-02-21 | 1991-02-21 | Manufacture of multilayer laminated board |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH04265746A (en) |
-
1991
- 1991-02-21 JP JP3026584A patent/JPH04265746A/en not_active Withdrawn
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A300 | Application deemed to be withdrawn because no request for examination was validly filed |
Free format text: JAPANESE INTERMEDIATE CODE: A300 Effective date: 19980514 |