JPH06216524A - Manufacture of composite printed wiring board - Google Patents
Manufacture of composite printed wiring boardInfo
- Publication number
- JPH06216524A JPH06216524A JP7038492A JP7038492A JPH06216524A JP H06216524 A JPH06216524 A JP H06216524A JP 7038492 A JP7038492 A JP 7038492A JP 7038492 A JP7038492 A JP 7038492A JP H06216524 A JPH06216524 A JP H06216524A
- Authority
- JP
- Japan
- Prior art keywords
- wiring board
- printed wiring
- ceramic
- film
- thickness
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Landscapes
- Laminated Bodies (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
Abstract
Description
【０００１】[0001]
【産業上の利用分野】本発明は、プリント配線板に種々
の形状を有する構造物を一体化した複合プリント配線板
の製造方法に関し、特に、高脆性プリント配線板に異形
状の構造物を一体化したり、あるいは高脆性プリント配
線板を多層化する方法に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method of manufacturing a composite printed wiring board in which structures having various shapes are integrated with a printed wiring board, and in particular, a highly brittle printed wiring board is provided with a heterogeneous structure. The present invention relates to a method for forming a multi-layered or highly brittle printed wiring board.
【０００２】[0002]
【従来の技術】プリント配線板を構成する絶縁材料は、
ガラスエポキシ等の有機材料とアルミナ、ムライト等の
無機材料とに大別される。中でも、無機材料を使用した
セラミック配線板は高耐熱性や高放熱性、低熱膨張性を
生かして特徴のある利用分野を築いている。しかしなが
ら、セラミック配線板の多層化技術は、蒸着、スパッタ
リングによる薄膜多層化方法、あるいはグリーンシート
を使用し、印刷した導体ペーストとコファイヤーによる
厚膜多層化方法によるものが一般的であり、これらの方
法は加工工程が複雑であり量産性に劣るものであった。2. Description of the Related Art Insulating materials that make up printed wiring boards are
It is roughly classified into organic materials such as glass epoxy and inorganic materials such as alumina and mullite. Among them, ceramic wiring boards using inorganic materials are building a unique application field by taking advantage of high heat resistance, high heat dissipation and low thermal expansion. However, the ceramic wiring board multi-layering technology is generally a thin-film multi-layering method by vapor deposition, sputtering, or a thick-film multi-layering method using a printed conductor paste and a cofire using a green sheet. The method had complicated processing steps and was inferior in mass productivity.
【０００３】一方、有機材料を使用したプリント配線板
は量産性に富み、さらに導体回路の微細加工や多層化が
比較的容易なため、民生機器用のほか産業機器用にも広
く使用されている。しかし、電子機器の軽薄短小化に伴
ってプリント配線板における配線回路の高密度化、実装
部品の高集積化および信号処理の高速化が要求される昨
今においては、プリント配線板に対して高放熱特性が要
求されるに到った。On the other hand, a printed wiring board using an organic material is highly mass-producible, and since it is relatively easy to perform fine processing and multi-layering of a conductor circuit, it is widely used not only for consumer equipment but also for industrial equipment. . However, with the recent trend toward lighter, thinner, shorter, and smaller electronic devices, there is a demand for higher density of wiring circuits in printed wiring boards, higher integration of mounted components, and faster signal processing. The characteristics have been demanded.
【０００４】また、半導体搭載装置の小型薄型化の要求
から、プリント配線板へのＴＳＯＰ（Ｔｈｉｎ Ｓｍａ
ｌｌ Ｏｕｔｌｉｎｅ Ｐａｃｋａｇｅ）、ベアチップ
が実装される場合が多くなり、プリント配線板の低熱膨
張化の要求も高まってきている。即ち、プリント配線板
に搭載される半導体部品として、部品厚みが著しく薄型
化されたことによりシリコンの熱膨張係数に極めて近い
半導体集積回路パッケージや半導体素子そのものがが使
用されるため、それを搭載すプリント配線板の熱膨張係
数を搭載される半導体部品に近似させないと、実装時に
熱膨張差により接続部に破損が生じたり、半導体部品に
亀裂が入る等の不良が発生するのである。In addition, in response to the demand for smaller and thinner semiconductor mounted devices, TSOP (Thin Sma) for printed wiring boards has been demanded.
11), bare chips are often mounted, and there is an increasing demand for low thermal expansion of printed wiring boards. That is, as a semiconductor component to be mounted on a printed wiring board, a semiconductor integrated circuit package or a semiconductor element itself, which has a coefficient of thermal expansion extremely close to that of silicon due to a significantly thinned component thickness, is used. Unless the coefficient of thermal expansion of the printed wiring board is approximated to that of the semiconductor component to be mounted, the difference in thermal expansion during mounting may cause damage to the connection part, or defects such as cracks in the semiconductor component.
【０００５】このようなプリント配線板の低熱膨張化の
要求に対応するために、セラミックと熱硬化性樹脂によ
る複合体を用いたプリント配線板が注目されている。例
えば、熱膨張係数が約２．５ｐｐｍのコージェライト
（２ＭｇＯ2・２ＡｌＯ3・５ＳｉＯ）の多孔質セラミッ
ク焼結体の気孔部にエポキシ樹脂を含浸した絶縁層を用
いてプリント配線板を形成する試みがなされている。し
かしながら、このように絶縁層が非常に脆い材料によっ
て構成されたプリント配線板と他の構造材料とを真空多
段プレスで積層すると、加圧時において前記絶縁層に亀
裂が生じ、耐湿性を低下させるという問題点があった。In order to meet such a demand for a low thermal expansion of the printed wiring board, a printed wiring board using a composite of ceramic and thermosetting resin is drawing attention. For example, an attempt to form a printed wiring board using an insulating layer impregnated with epoxy resin in the pores of a porous ceramic sintered body of cordierite (2MgO 2 · 2AlO 3 · 5SiO) having a thermal expansion coefficient of about 2.5 ppm. Has been done. However, when a printed wiring board and another structural material in which the insulating layer is made of a very brittle material as described above are laminated by a vacuum multi-stage press, a crack occurs in the insulating layer at the time of pressurization, which lowers the moisture resistance. There was a problem.
【０００６】すなわち、通常のガラス・エポキシ複合材
から成るプリント配線板の多層化方法は、内層基板の上
下に接着層を介して外層基板を積層して成る積層体を真
空状態で上下から熱板により加熱加圧する多段プレスに
よるものであった。また、層間でのボイド発生を防止す
るために適宜真空多段プレスを用いていた。しかしなが
ら、これらの多段プレスは圧力源である熱板は平行・平
滑板であるために、プリント配線板の起伏に合わせて接
触することは無く、プリント配線板全体に成形に必要な
圧力を均等に加えるには基板の凹凸の凹の部分に焦点を
合わせる必要が有り、凸の部分には必要以上の圧力が加
わるものであった。特にセラミック等の高脆性材料に対
しては、部分的に応力がかかると、割れ、クラックが発
生するものであった。また、セラミック等の高脆性材料
から成る平板同士を接着する際にも、割れ、クラックが
発生する割合が非常に高いものであった。That is, in a multilayer method of a normal printed wiring board made of a glass / epoxy composite material, a laminated body formed by laminating outer layer substrates on the upper and lower sides of an inner layer substrate with an adhesive layer interposed therebetween is heated from the upper and lower sides in a vacuum state. It was due to the multi-stage press of heating and pressurizing by. Further, in order to prevent the occurrence of voids between layers, a vacuum multi-stage press is appropriately used. However, in these multi-stage presses, the hot plate, which is the pressure source, is a parallel / smooth plate, so there is no contact according to the ups and downs of the printed wiring board, and the pressure required for molding is evenly distributed over the entire printed wiring board. In order to add it, it was necessary to focus on the concave portion of the unevenness of the substrate, and excessive pressure was applied to the convex portion. In particular, when a high brittle material such as ceramic is partially stressed, cracks or cracks are generated. Further, when flat plates made of highly brittle materials such as ceramics are bonded to each other, cracks and cracks occur at a very high rate.
【０００７】[0007]
【発明が解決しようとする課題】本発明は、以上の経緯
を鑑みてなされたものでありその解決しようとする課題
は、セラミック等の高脆性材料を基板のコアとしたプリ
ント配線板に種々の形状を有する成形物を接着する際の
割れ、クラックが発生であり、その目的とすることろ
は、セラミック等の高脆性材料を基板のコアとしたプリ
ント配線板に種々の形状を有する成形物を接着する際の
割れ、クラックが発生しない複合プリント配線板の製造
方法を提供することである。SUMMARY OF THE INVENTION The present invention has been made in view of the above circumstances, and it is an object of the present invention to solve various problems in printed wiring boards having a highly brittle material such as ceramic as a core of the substrate. Cracks and cracks occur when bonding shaped products having a shape, and the purpose is to create molded products with various shapes on a printed wiring board with a highly brittle material such as ceramics as the core of the substrate. It is an object of the present invention to provide a method for manufacturing a composite printed wiring board that does not cause cracks or cracks during bonding.
【０００８】[0008]
【課題を解決するための手段】以上の課題を解決する為
に、本発明が採った手段を実施例に於いて使用する符号
を付して説明すると、「セラミックあるいはガラスの緻
密体あるいはこれらの多孔質体を焼結して成る絶縁性骨
材の気孔部に樹脂が充填されて成る絶縁層を有するプリ
ント配線板（１０）と、樹脂、セラミック、金属、ガラ
スから選ばれる少なくとも１種を主成分とする構造物と
を、熱硬化性樹脂接着層（１３）を介して積層し、次い
で、この積層体を厚み０．５mm〜５．０mmの耐熱性およ
び柔軟性のある不織布あるいは織布から成るクッション
（１４）で覆い、さらに、この積層体およびこのクッシ
ョンを厚み０．０３mm〜２．０mmの耐熱性および柔軟性
のあるフィルム（１５）で密封し、内部を真空脱気した
後に、耐圧密閉容器内にて気体あるいは液体により加熱
加圧して一体化する。」であり、さらには、「この構造
物のプリント配線板と接するコーナー部が０．２mm以上
面取りされていること」である。In order to solve the above problems, the means adopted by the present invention will be described with reference to the reference numerals used in the examples. A printed wiring board (10) having an insulating layer formed by filling a resin into pores of an insulating aggregate formed by sintering a porous body, and at least one selected from resin, ceramic, metal, and glass. The structure as a component is laminated via a thermosetting resin adhesive layer (13), and then the laminate is made of a heat-resistant and flexible nonwoven fabric or woven fabric having a thickness of 0.5 mm to 5.0 mm. The laminated body and the cushion are sealed with a heat-resistant and flexible film (15) having a thickness of 0.03 mm to 2.0 mm, and the inside is vacuum degassed, and then pressure-resistant. Closed container At integrated by heating and pressing by a gas or liquid. A ", and further, a" to the corner portion in contact with the printed wiring board of this structure are chamfered or 0.2mm ".
【０００９】[0009]
【作用】セラミック等の高脆性材料によって構成される
プリント配線板（１０）に他の構造物を接着一体化する
際に、プリント配線板（１０）と被接着構造物とを接着
層（１３）を介して積層した積層体を耐熱性および柔軟
性のあるクッション（１４）によって被覆し、さらに、
これらをフィルム（１５）によって密封し内部を真空脱
気した後に、耐圧密閉容器内にて等方的に加熱加圧する
のであるが、積層体と密封フィルム（１５）の間に耐熱
性および柔軟性のあるクッション（１４）を介在させる
のは、積層体の形状が起伏に富み、その凹部が非常に深
い場合に、耐熱性および柔軟性のあるフィルム（１５）
をもってしても積層体の形状に追従することができず、
積層体全体に等方的に加熱加圧することが困難だからで
あり、極端な場合、積層体の凸部によってフィルム（１
５）が破損する恐れがあるからである。つまり、積層体
と密封フィルム（１５）の間に耐熱性および柔軟性のあ
るクッション（１４）を介在させることによって、起伏
に富んだ形状を有する積層体であっても、フィルム（１
５）を破損すること無く積層体に対して等方的に加熱加
圧処理を施すことが可能となるのである。When a printed wiring board (10) made of a highly brittle material such as ceramic is bonded and integrated with another structure, the printed wiring board (10) and the structure to be bonded are bonded together by an adhesive layer (13). The laminated body laminated via the heat-resistant and flexible cushion (14),
These are sealed with a film (15) and the interior is vacuum degassed, and then isotropically heated and pressurized in a pressure-resistant closed container. Heat resistance and flexibility between the laminate and the sealing film (15). The intervening cushion (14) has a film (15) that is heat resistant and flexible when the shape of the laminate is undulating and the recesses are very deep.
Even if it does not follow the shape of the laminate,
This is because it is difficult to heat and pressurize the entire laminate isotropically, and in extreme cases, the film (1
This is because 5) may be damaged. In other words, by interposing the heat-resistant and flexible cushion (14) between the laminate and the sealing film (15), the film (1
It is possible to heat and pressurize the laminate isotropically without damaging 5).
【００１０】なお、クッション（１４）の厚みは０．５
mm〜５．０mmであることが望ましい。厚みが０．５mm未
満のクッションであると、積層体の起伏に追従すること
ができずクッションと積層体の間に空隙が生じ、積層体
凸部に集中的に圧力が加わり割れ、クラックを防止する
ことがてきないのであり、逆に、厚みが０．５mmより厚
いと、積層体とフィルムとの間隔が大きくなり、積層体
へ十分な熱や圧力が加わらず密着が悪くなるからであ
る。よって、クッションとなる材料としては、ガラス繊
維、セラミック繊維、紙、ポリイミド繊維、テフロン線
から選ばれるいずれか少なくとも１種の不織布あるいは
織布がより好ましい。The thickness of the cushion (14) is 0.5.
It is desirable that the thickness is from 5.0 mm to 5.0 mm. If the thickness of the cushion is less than 0.5 mm, it is not possible to follow ups and downs of the laminated body, and a gap is created between the cushion and the laminated body, pressure is intensively applied to the convex portion of the laminated body, and cracks and cracks are prevented. On the contrary, if the thickness is more than 0.5 mm, the distance between the laminate and the film becomes large, and sufficient heat and pressure are not applied to the laminate, resulting in poor adhesion. Therefore, as the material for the cushion, at least one kind of non-woven fabric or woven fabric selected from glass fiber, ceramic fiber, paper, polyimide fiber, and Teflon wire is more preferable.
【００１１】また、耐熱性、柔軟性のあるフィルム（１
５）としては、ポリイミド、ポリアミド、ポリプロピレ
ン、ポリカーボネート、ポリメチルペンテンから選ばれ
るいずれか少なくとも１種のフィルムを使うことがより
好ましい。その厚みに関しては、厚み０．０３mm〜２．
０mmであることが好ましい。つまり、積層体を密封し内
部を真空にするため、厚みが０．０３mm未満であるとフ
ィルム自身の強度が弱く、かつフィルムにピンホールが
出やすくなるため不利であり、逆に、厚みが２mmより厚
いと積層体への追従が悪く、積層体へ均一に温度や圧力
がいきわたらないからである。Further, a film having heat resistance and flexibility (1
As 5), it is more preferable to use at least one film selected from the group consisting of polyimide, polyamide, polypropylene, polycarbonate and polymethylpentene. Regarding the thickness, the thickness is 0.03 mm to 2.
It is preferably 0 mm. In other words, since the laminate is sealed and the inside is evacuated, if the thickness is less than 0.03 mm, the strength of the film itself is weak, and pinholes are easily formed in the film, which is disadvantageous. This is because if the thickness is thicker, the followability to the laminate is poor and the temperature and pressure are not evenly distributed to the laminate.
【００１２】さらに、高脆性のプリント配線板（１０）
に他の構造物を接着一体化するにあたり、耐圧密閉容器
内にて気体あるいは液体を媒体として加熱加圧して行う
ことによって、積層対の起伏に追従したフィルム（１
５）の仮想接面に対して垂直な方向に均一な圧力を加え
ることができるのである。すなわち、所謂等方加圧がで
きるのである。これによって、積層体の一部分に局所的
に圧力が加えられることによる割れ、クラックの発生を
防止できるのである。Furthermore, a printed wiring board (10) having high brittleness
In adhering and integrating other structures to the film, the film (1) that follows the undulations of the laminated pair is performed by heating and pressurizing with gas or liquid as a medium in a pressure-resistant airtight container.
It is possible to apply a uniform pressure in the direction perpendicular to the virtual contact surface of 5). That is, so-called isotropic pressure can be applied. This makes it possible to prevent the occurrence of cracks and cracks due to local pressure being applied to a part of the laminate.
【００１３】[0013]
【表１】 [Table 1]
【００１４】さらにまた、表１に面取り量とその形状に
対する割れやクラック不良発生頻度を示す。これによる
と、被接着物である構造物のコーナーが少なくとも０．
２mm面取りされていることによって、面取り形状に関わ
らずプリント配線板（１０）や他の構造物に割れやクラ
ックは発生しない。また、ここでの不良数は、構造物の
不良数とプリント配線板（１０）の不良数の合計を示
す。Further, Table 1 shows the amount of chamfering and the frequency of occurrence of cracks and crack defects with respect to the shape. According to this, the corners of the structure to be adhered are at least 0.
By chamfering by 2 mm, cracks or cracks do not occur in the printed wiring board (10) or other structures regardless of the chamfered shape. The number of defects here indicates the total number of defects of the structure and the number of defects of the printed wiring board (10).
【００１５】[0015]
【実施例】以下に、本発明の複合プリント配線板の製造
方法に関する実施例を示す。 （実施例１）図１に本実施例に係わるプリント配線板
（１０）の製造方法を示し、製造方法を順に説明する
と、絶縁性骨材原料としてコージェライト（２ＭｇＯ2
・２ＡｌＯ3・５ＳｉＯ）を用い、これをシート成形し
て厚み０．５mm、３８０×３００mmの成形体を得た。こ
れを１２４０℃で焼成し、厚み０．４７mm、３５２×２
７０mm、気孔率３０％の多孔質コージェライト焼結体と
し、その焼結体にエポキシ樹脂をオートクレーブにて真
空含浸した後に、その焼結体の両面に１８μｍ銅箔をラ
ミネートし、次いで、この基板に面取りを０．２０〜
０．２５mm施した。その後、露光、現像、エッチングに
より回路形成をしセラミック複合プリント配線板（１
０）とした。EXAMPLES Examples of the method for manufacturing the composite printed wiring board of the present invention will be shown below. (Embodiment 1) FIG. 1 shows a method for manufacturing a printed wiring board (10) according to this embodiment, and the manufacturing method will be described in order. As a raw material for an insulating aggregate, cordierite (2MgO 2) is used.
.2AlO 3 .5SiO) was used to form a sheet into a molded body having a thickness of 0.5 mm and 380 × 300 mm. This is fired at 1240 ° C, thickness 0.47mm, 352 × 2
A porous cordierite sintered body of 70 mm and a porosity of 30% was vacuum-impregnated with an epoxy resin in an autoclave, and then 18 μm copper foil was laminated on both surfaces of the sintered body, and then this substrate was used. Chamfer on 0.20
0.25 mm was applied. After that, the circuit is formed by exposure, development and etching, and the ceramic composite printed wiring board (1
0).
【００１６】このセラミック複合プリント配線板（１
０）を内層基板として、その両面に０．１mmの樹脂含有
量７０％のガラスクロス・エポキシ樹脂プリプレグ（１
３）を介して１８μｍ銅箔を積層して積層体とした。そ
して、この積層体をその表面に鏡面加工を施したステン
レス板を介して１５組積み重ね、厚み１．５mmのガラス
織布（１４）で全面を覆い、プレス治具であるアルミプ
レート（１８）と厚み０．８mmのポリアミドフィルム
（１５）を粘土（１７）で貼り合わせ、積層体群を密封
し内部を真空脱気した後、耐圧密閉容器内にてＮ2ガス
を加圧媒体（１６）として等方加圧・加熱して接着一体
化させた。圧力は１分間あたり１Ｋｇｆ／ｃｍ2の速さ
で９Ｋｇｆ／ｃｍ2まで加圧し、温度は最大１８０℃ま
で加熱した。接着した積層体の穴、端面、コーナー等か
らクラックの発生は無く、接着強度は３．５Ｋｇｆ／ｃ
ｍと高いものであった。同様に板厚を変えて積層プレス
した結果を真空多段プレスと比較して次の表２に示す。This ceramic composite printed wiring board (1
0) as the inner layer substrate, glass cloth / epoxy resin prepreg with a resin content of 70% of 0.1 mm on both sides (1)
18 μm copper foil was laminated via 3) to obtain a laminate. Then, 15 sets of this laminated body are stacked through a stainless plate having a mirror-finished surface, the entire surface is covered with a glass woven cloth (14) having a thickness of 1.5 mm, and an aluminum plate (18) as a pressing jig is formed. After laminating a 0.8 mm-thick polyamide film (15) with clay (17), hermetically sealing the laminate group and degassing the inside by vacuum, N 2 gas was used as a pressurizing medium (16) in a pressure-resistant airtight container. Isotropically pressurized and heated to bond and integrate. Pressure pressurized to 9 Kgf / cm 2 at a rate of 1 minute per 1 Kgf / cm 2, the temperature was heated up to 180 ° C.. No cracks were generated from the holes, end faces, corners, etc. of the bonded laminate, and the adhesive strength was 3.5 Kgf / c
It was as high as m. Similarly, the results of laminating presses with different plate thicknesses are shown in Table 2 below in comparison with the vacuum multi-stage press.
【００１７】[0017]
【表２】 [Table 2]
【００１８】表２からも明らかなように、耐圧密閉容器
による等方加圧はセラミック厚み、基板面取り量に係わ
らず積層体の良好な接着が出来た。しかしながら真空多
段プレスはセラミック厚みが厚い時は良好な接着が出来
たが、セラミック厚みが薄くなると基板の破断が多くな
りプリント配線板としての機能を果たさなくなってい
た。As is clear from Table 2, the isotropic pressurization by the pressure-resistant airtight container can achieve good adhesion of the laminate regardless of the ceramic thickness and the chamfering amount of the substrate. However, the vacuum multi-stage press was able to perform good adhesion when the ceramic thickness was thick, but when the ceramic thickness was thin, the substrate was often fractured and could not function as a printed wiring board.
【００１９】[0019]
【表３】 [Table 3]
【００２０】同様に、ガラス織布（１４）の厚み、ポリ
アミドフィルム（１５）の厚みを変えた場合の結果を表
３に示す。表からも明かなように、ガラス織布（１
４）、ポリアミドフィルム（１５）のいずれか一方でも
最適数値範囲外のものは接着強度が低くなったり、クラ
ックが発生し、良好な接着がえられなかった。Similarly, Table 3 shows the results when the thickness of the woven glass fabric (14) and the thickness of the polyamide film (15) were changed. As you can see from the table, woven glass cloth (1
If either one of 4) and the polyamide film (15) is out of the optimum numerical range, the adhesive strength becomes low or cracks occur, and good adhesion cannot be obtained.
【００２１】（実施例２）実施例１と同様の絶縁性骨材
を有するスルーホールおよび導体回路形成した電子部品
搭載用のセラミック複合プリント配線板（１０）の所定
の位置に、保護膜として光感光型のソルダーレジストを
形成した。そのソルダーレジストには回路形成基板に貼
り合わせる封止樹脂流れ防止のためのセラミックダムの
（大きさ＋片側０．１５mm以上）のクリアランスを含む
電子部品搭載のための開口が形成されている。そのセラ
ミックダムのコーナー部には０．２mmのＲ面取りが施さ
れるとともに、その底面には接着温度１５０℃の熱硬化
性接着シートが予め仮接着されている。そのセラミック
ダムをプリント配線板（１０）の所定の位置に接合する
為に、治具板を回路形成基板とピンを用いて合わせてお
く。治具板のセラミックダムを入れる箇所にはセラミッ
クダムの大きさより片側０．０５mmの中抜きを設けた。
治具板の厚み精度は、セラミックダムに熱硬化性接着シ
ートを貼り付けた時の厚みに対し±３０μｍとした。前
記積層体に厚み１．５mmのガラス織布（１４）で全面を
覆い、プレス治具であるアルミプレート（１８）と厚み
０．８mmのポリアミドフィルム（１５）を粘土（１７）
で貼り合わせ、積層体を密封し内部を真空脱気した後
に、耐圧密閉容器にて圧力を１Ｋｇｆ／ｃｍ2の速さで
５Ｋｇｆ／ｃｍ2まで等方的に加圧し、１６０℃まで加
熱した。(Embodiment 2) A ceramic composite printed wiring board (10) for mounting electronic parts on which through holes and conductor circuits having the same insulating aggregate as in Embodiment 1 are formed is provided as a protective film at a predetermined position. A photosensitive solder resist was formed. The solder resist has an opening for mounting an electronic component including a clearance of (size + 0.15 mm or more on one side) of the ceramic dam for preventing the flow of the sealing resin to be bonded to the circuit forming substrate. A 0.2 mm round chamfer is applied to the corner portion of the ceramic dam, and a thermosetting adhesive sheet having an adhesion temperature of 150 ° C. is temporarily adhered to the bottom surface in advance. In order to join the ceramic dam to a predetermined position on the printed wiring board (10), the jig plate is aligned with the circuit forming board by using pins. A hole of 0.05 mm on one side of the size of the ceramic dam was provided in the jig plate where the ceramic dam was inserted.
The thickness accuracy of the jig plate was ± 30 μm with respect to the thickness when the thermosetting adhesive sheet was attached to the ceramic dam. The entire surface of the laminated body is covered with a glass woven cloth (14) having a thickness of 1.5 mm, and an aluminum plate (18) as a pressing jig and a polyamide film (15) having a thickness of 0.8 mm are clay (17).
Bonded, the internal seal the laminate after vacuum degassing, isotropically pressurizes the pressure in a pressure-resistant closed vessel at a rate of 1 Kgf / cm 2 to 5 Kgf / cm 2, was heated to 160 ° C..
【００２２】その結果、セラミックダムおよびプリント
配線板（１０）には割れ、クラック、カケは発生せず、
プリント配線板（１０）に対するセラミックダムの接着
強度は３．２Ｋｇｆ／ｃｍと良好であった。一方、比較
として真空多段プレスで同様な積層をした場合には熱板
によりセラミックダムに応力が集中しセラミックダムに
割れ、クラック、カケを発生させ、尚且つプリント配線
板にもクラックを発生させた。As a result, the ceramic dam and the printed wiring board (10) were free from cracks, cracks and chips.
The adhesive strength of the ceramic dam to the printed wiring board (10) was as good as 3.2 Kgf / cm. On the other hand, as a comparison, when similar layers were laminated by a vacuum multi-stage press, stress was concentrated on the ceramic dam by the hot plate, causing cracks, cracks and chips in the ceramic dam, and also cracks in the printed wiring board. .
【００２３】[0023]
【発明の効果】以上詳述したように、本発明の複合プリ
ント配線板の製造方法によれば、種々の形状をしたセラ
ミックあるいはガラスの緻密体またはこれらの多孔質体
からなる焼結体の気孔部に樹脂が充填された絶縁層をコ
アとしたプリント配線板に、樹脂、セラミック、金属、
ガラスからなる種々の形状をした構造物を強固に、しか
も欠陥無く接着一体化できる。従って、セラミック複合
プリント配線板のような高脆性のプリント配線板に対し
て、放熱板、ダム付き、ネジ付き、取りつけ穴付きの基
板とする加工が容易にでき、さらに、湾曲したり直角に
曲がった基板など複雑な形状をした基板を製造すること
もできる。As described in detail above, according to the method for manufacturing a composite printed wiring board of the present invention, the pores of a ceramic or glass dense body having various shapes or a sintered body formed of these porous bodies are obtained. The printed wiring board with an insulating layer core filled with resin, resin, ceramic, metal,
Structures of various shapes made of glass can be firmly bonded and integrated without defects. Therefore, a highly brittle printed wiring board such as a ceramic composite printed wiring board can be easily processed into a heat sink, a dam, a board with a screw, and a mounting hole, and can be bent or bent at a right angle. It is also possible to manufacture a substrate having a complicated shape such as a curved substrate.
【図１】本発明の複合プリント配線板の断面図である。FIG. 1 is a sectional view of a composite printed wiring board of the present invention.
１０ プリント配線板 １３ 接着剤層（プリプレグ） １４ クッション（ガラス織布） １５ フィルム １６ 加圧媒体 １７ 粘土 １８ アルミプレート 10 Printed Wiring Board 13 Adhesive Layer (Prepreg) 14 Cushion (Glass Woven Cloth) 15 Film 16 Pressurizing Medium 17 Clay 18 Aluminum Plate
─────────────────────────────────────────────────────
─────────────────────────────────────────────────── ───
【手続補正書】[Procedure amendment]
【提出日】平成５年１０月８日[Submission date] October 8, 1993
【手続補正１】[Procedure Amendment 1]
【補正対象書類名】明細書[Document name to be amended] Statement
【補正対象項目名】図２[Name of item to be corrected] Figure 2
【補正方法】追加[Correction method] Added
【補正内容】[Correction content]
【図２】 本発明の他の実施例を示す断面図である。FIG. 2 is a sectional view showing another embodiment of the present invention.
Claims (2)
はこれらの多孔質体を焼結して成る絶縁性骨材の気孔部
に樹脂が充填されて成る絶縁層を有するプリント配線板
と、樹脂、セラミック、金属、ガラスから選ばれる少な
くとも１種を主成分とする構造物とを、熱硬化性樹脂接
着層を介して積層し、 次いで、この積層体を厚み０．５mm〜５．０mmの耐熱性
および柔軟性のある不織布あるいは織布から成るクッシ
ョンで覆い、 さらに、前記積層体および前記クッションを厚み０．０
３mm〜２．０mmの耐熱性および柔軟性のあるフィルムで
密封し、内部を真空脱気した後に、 耐圧密閉容器内にて気体あるいは液体により加熱加圧し
て一体化することを特徴とする複合プリント配線板の製
造方法。1. A printed wiring board having an insulating layer formed by filling a resin into pores of an insulating aggregate formed by sintering a dense body of ceramic or glass or a porous body of these, a resin, a ceramic, A structure containing at least one selected from metal and glass as a main component is laminated via a thermosetting resin adhesive layer, and this laminate is then heat-resistant and flexible with a thickness of 0.5 mm to 5.0 mm. Covered with a cushion made of a non-woven fabric or a woven fabric, and further, the laminate and the cushion have a thickness of 0.0
A composite print characterized by sealing with a film with heat resistance and flexibility of 3 mm to 2.0 mm, degassing the inside, and heating and pressurizing with a gas or liquid in a pressure-resistant closed container to integrate them. Wiring board manufacturing method.
コーナー部が０．２mm以上面取りされていることを特徴
とする請求項１に記載の複合プリント配線板の製造方
法。2. The method for manufacturing a composite printed wiring board according to claim 1, wherein a corner portion of the structure which is in contact with the printed wiring board is chamfered by 0.2 mm or more.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7038492A JP3023492B2 (en) | 1992-02-19 | 1992-02-19 | Manufacturing method of composite printed wiring board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7038492A JP3023492B2 (en) | 1992-02-19 | 1992-02-19 | Manufacturing method of composite printed wiring board |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH06216524A true JPH06216524A (en) | 1994-08-05 |
| JP3023492B2 JP3023492B2 (en) | 2000-03-21 |
Family
ID=13429902
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP7038492A Expired - Fee Related JP3023492B2 (en) | 1992-02-19 | 1992-02-19 | Manufacturing method of composite printed wiring board |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP3023492B2 (en) |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR100390011B1 (en) * | 2001-07-26 | 2003-07-04 | 삼성전기주식회사 | Autoclave for preparing the high performance ball grid array substrate and method for preparing the HP-BGA using the same |
| US6708401B2 (en) * | 2000-03-29 | 2004-03-23 | Matsushita Electric Industrial Co., Ltd. | Method of manufacturing article having electronic circuit |
| US7152314B2 (en) | 2003-01-29 | 2006-12-26 | Fujitsu Limited | Method of manufacturing circuit board |
| JP2007128968A (en) * | 2005-11-01 | 2007-05-24 | Tdk Corp | Method of manufacturing complex circuit board |
| JP2007227881A (en) * | 2005-11-14 | 2007-09-06 | Tdk Corp | Composite wiring board, and method of manufacturing same |
| CN114938579A (en) * | 2022-05-06 | 2022-08-23 | 深圳市百柔新材料技术有限公司 | Method for repairing circuit by adopting conductive paste |
-
1992
- 1992-02-19 JP JP7038492A patent/JP3023492B2/en not_active Expired - Fee Related
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6708401B2 (en) * | 2000-03-29 | 2004-03-23 | Matsushita Electric Industrial Co., Ltd. | Method of manufacturing article having electronic circuit |
| KR100390011B1 (en) * | 2001-07-26 | 2003-07-04 | 삼성전기주식회사 | Autoclave for preparing the high performance ball grid array substrate and method for preparing the HP-BGA using the same |
| US7152314B2 (en) | 2003-01-29 | 2006-12-26 | Fujitsu Limited | Method of manufacturing circuit board |
| JP2007128968A (en) * | 2005-11-01 | 2007-05-24 | Tdk Corp | Method of manufacturing complex circuit board |
| JP2007227881A (en) * | 2005-11-14 | 2007-09-06 | Tdk Corp | Composite wiring board, and method of manufacturing same |
| CN114938579A (en) * | 2022-05-06 | 2022-08-23 | 深圳市百柔新材料技术有限公司 | Method for repairing circuit by adopting conductive paste |
| CN114938579B (en) * | 2022-05-06 | 2024-04-26 | 深圳市百柔新材料技术有限公司 | Method for repairing circuit by adopting conductive paste |
Also Published As
| Publication number | Publication date |
|---|---|
| JP3023492B2 (en) | 2000-03-21 |
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