JPH04259206A - Manufacture of protective film for chip part - Google Patents

Abstract

PURPOSE:To prevent the corrosion of an element by a plating solution at the time of plating, and to obviate the breaking of the element by laminating sheets having insulating properties such as glass on the surface and rear of a laminate, in which laminated ceramic capacitor non-baked sheets and internal electrode sheets are laminated, respectively and baking the whole and forming protective films to the element. CONSTITUTION:Upper protective sheets 1, lower protective sheets 2, internal electrode sheets 3 and laminated ceramic capacitor non-baked sheets 4 are laminated under specified conditions, and baked and the sheets are cut in a stick shape in the vertical direction to the coated surfaces of external electrodes. Since both side faces are not protected under the state of a stick, the coating surface 5 of protective paste, etc., is coated with protective paste, etc., and the sheets are cut in a splinter shape and both end sections of an external-electrode coated surface 6, from which the internal electrodes are exposed, are coated with the external electrodes, and the whole is baked, thus obtaining an element. Accordingly, when the upper layers of both end sections of the external electrodes of said element are plated through the manufacture of a protective film for the element, the corrosion of said element by a plating solution is prevented, thus obviating the breaking of said element.

Description

【発明の詳細な説明】[Detailed description of the invention]

【０００１】0001

【産業上の利用分野】　　この発明は、コンデンサ等の
チップ状部品本体の表裏面に保護膜を形成する方法に関
するものである。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for forming protective films on the front and back surfaces of a chip-shaped component body such as a capacitor.

【０００２】0002

【従来の技術】　　従来、コンデンサ等のチップ状部品
（以下、素子という）は、形成された積層セラミックコ
ンデンサ未焼成シートに内部電極シートを交互に露出す
るように積層、焼成し、更に内部電極が露出した端面に
外部電極を塗布、焼付けすることによる素子が提案され
ている。[Prior Art] Conventionally, chip-shaped parts (hereinafter referred to as elements) such as capacitors are produced by laminating and firing internal electrode sheets on unfired sheets of multilayer ceramic capacitors so that internal electrode sheets are exposed alternately, and then forming internal electrodes. Elements have been proposed in which external electrodes are coated and baked on the exposed end faces.

【０００３】0003

【発明が解決しようとする課題】　　素子の外部電極が
塗布された両端部の上層にめっきを行なう場合、素子が
めっき液により浸食され素子の破壊が発生するという欠
点がある。[Problems to be Solved by the Invention] When plating is performed on the upper layer of both ends of an element coated with external electrodes, there is a drawback that the element is eroded by the plating solution and the element is destroyed.

【０００４】0004

【課題を解決するための手段】　　上記の欠点を解決す
るために本発明は、積層セラミックコンデンサ未焼成シ
ートと内部電極シートを積層した表裏面にそれぞれガラ
ス等の絶縁性を持つシートを更に積層、焼成し、素子に
対する保護膜を形成することにより、めっき時に素子が
めっき液により侵食されるのを防ぎ、素子の破壊を防止
することが可能である。[Means for Solving the Problems] In order to solve the above-mentioned drawbacks, the present invention further laminates insulating sheets such as glass on the front and back surfaces of the laminated multilayer ceramic capacitor unfired sheet and internal electrode sheet. By baking and forming a protective film on the element, it is possible to prevent the element from being eroded by the plating solution during plating and to prevent the element from being destroyed.

【０００５】[0005]

【実施例】【Example】

【図１】は、本発明の概略を説明するための積層構造図
である。FIG. 1 is a stacked structure diagram for explaining the outline of the present invention.

【図２】は、スティック状に切断した時の保護塗装面を
表わす。１は上部保護シート、２は下部保護シート、３
は内部電極シート、４は積層セラミックコンデンサ未焼
成シート、５は保護ペースト等の塗装面、６は外部電極
塗装面である。FIG. 2 shows the protective coating surface when cut into stick shapes. 1 is the upper protective sheet, 2 is the lower protective sheet, 3
4 is an internal electrode sheet, 4 is an unfired multilayer ceramic capacitor sheet, 5 is a surface coated with a protective paste, etc., and 6 is a coated surface of an external electrode.

【図１】の様な条件で積層し、焼成後シートを外部電極
塗装面に対して垂直方向にスティック状に切断する。The sheets were laminated under the conditions shown in FIG. 1, and after firing, the sheets were cut into stick shapes in a direction perpendicular to the external electrode coated surface.

【図２】の様にスティック状態では両側面は未保護なの
で保護ペースト等で５を塗布後、個片状に切断し内部電
極が露出した６の両端部に外部電極を塗布、焼付けする
ことにより素子を得た。このように本発明の素子の保護
膜製造法により素子の外部電極の両端部の上層にめっき
を行なう場合、素子がめっき液により侵食されるのを防
ぎ、素子の破壊を防止することが確認できた。As shown in Fig. 2, both sides are unprotected in the stick state, so after applying 5 with a protective paste, etc., cut into individual pieces, apply external electrodes to both ends of 6 where the internal electrodes are exposed, and bake. I got the element. As described above, when plating the upper layer of both ends of the external electrode of the device using the method of manufacturing a protective film for the device of the present invention, it was confirmed that the device is prevented from being eroded by the plating solution and the device is prevented from being destroyed. Ta.

【０００６】[0006]

【発明の効果】　　この発明は、以上説明したように積
層セラミックコンデンサ未焼成シートと内部電極シート
を積層した表裏面にそれぞれガラス等の絶縁性を持つシ
ートを更に積層、焼成し素子に対する保護膜を形成する
ことにより、めっき時に素子がめっき液により侵食され
るのを防ぎ、素子の破壊を防止することが可能である。[Effects of the Invention] As explained above, this invention further laminates insulating sheets such as glass on the front and back surfaces of the laminated unfired sheets and internal electrode sheets of a multilayer ceramic capacitor, and bakes them to form a protective film for the elements. By forming this, it is possible to prevent the element from being eroded by the plating solution during plating, and to prevent the element from being destroyed.

【図面の簡単な説明】[Brief explanation of the drawing]

【図１】　　本発明の概略を説明するための積層構造図
である。FIG. 1 is a stacked structure diagram for explaining the outline of the present invention.

【図２】　　スティック状に切断したときの断面図であ
る。FIG. 2 is a cross-sectional view when cut into a stick shape.

【符号の説明】[Explanation of symbols]

１　　上部保護シート ２　　下部保護シート ３　　内部電極シート ４　　積層セラミックコンデンサ未焼成シート５　　保
護ぺ−スト等の塗装面 ６　　外部電極塗装面1 Upper protective sheet 2 Lower protective sheet 3 Internal electrode sheet 4 Multilayer ceramic capacitor unfired sheet 5 Painted surface with protective paste etc. 6 External electrode painted surface

Claims (1)

【特許請求の範囲】[Claims] 【請求項１】　　　　コンデンサ等のチップ状部品本体
の表裏面に保護膜を形成する方法で、積層セラミックコ
ンデンサ等の未焼成シートと内部電極シートを積層した
表裏面にそれぞれガラス等の絶縁性を持つシートを更に
積層し、焼成する事によりチップ状部品に対する保護膜
を形成することを特徴とする保護膜の製造方法。[Claim 1] A method of forming a protective film on the front and back surfaces of a chip-like component body such as a capacitor, in which an unfired sheet and an internal electrode sheet of a multilayer ceramic capacitor are laminated and each layer has an insulating property such as glass. A method for manufacturing a protective film, which comprises forming a protective film for a chip-shaped component by further laminating sheets and firing the sheets.