JPH04237905A - Coated electric wire - Google Patents
Coated electric wireInfo
- Publication number
- JPH04237905A JPH04237905A JP3073549A JP7354991A JPH04237905A JP H04237905 A JPH04237905 A JP H04237905A JP 3073549 A JP3073549 A JP 3073549A JP 7354991 A JP7354991 A JP 7354991A JP H04237905 A JPH04237905 A JP H04237905A
- Authority
- JP
- Japan
- Prior art keywords
- parts
- inorganic filler
- polyborosiloxane
- wire
- paint
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000011256 inorganic filler Substances 0.000 claims abstract description 23
- 229910003475 inorganic filler Inorganic materials 0.000 claims abstract description 23
- 239000003973 paint Substances 0.000 claims abstract description 15
- 229920002050 silicone resin Polymers 0.000 claims abstract description 10
- 239000004020 conductor Substances 0.000 claims abstract description 8
- 239000011248 coating agent Substances 0.000 abstract description 16
- 238000000576 coating method Methods 0.000 abstract description 16
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 abstract description 8
- CTQNGGLPUBDAKN-UHFFFAOYSA-N O-Xylene Chemical compound CC1=CC=CC=C1C CTQNGGLPUBDAKN-UHFFFAOYSA-N 0.000 abstract description 7
- 239000008096 xylene Substances 0.000 abstract description 7
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 abstract description 5
- 239000000843 powder Substances 0.000 abstract description 3
- ZLMJMSJWJFRBEC-UHFFFAOYSA-N Potassium Chemical compound [K] ZLMJMSJWJFRBEC-UHFFFAOYSA-N 0.000 abstract description 2
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 abstract description 2
- 238000002156 mixing Methods 0.000 description 7
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 3
- 230000007423 decrease Effects 0.000 description 3
- 239000000835 fiber Substances 0.000 description 3
- 239000003960 organic solvent Substances 0.000 description 3
- OYPRJOBELJOOCE-UHFFFAOYSA-N Calcium Chemical compound [Ca] OYPRJOBELJOOCE-UHFFFAOYSA-N 0.000 description 2
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- FYYHWMGAXLPEAU-UHFFFAOYSA-N Magnesium Chemical compound [Mg] FYYHWMGAXLPEAU-UHFFFAOYSA-N 0.000 description 2
- LRHPLDYGYMQRHN-UHFFFAOYSA-N N-Butanol Chemical compound CCCCO LRHPLDYGYMQRHN-UHFFFAOYSA-N 0.000 description 2
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- 229910019142 PO4 Inorganic materials 0.000 description 2
- XLOMVQKBTHCTTD-UHFFFAOYSA-N Zinc monoxide Chemical compound [Zn]=O XLOMVQKBTHCTTD-UHFFFAOYSA-N 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 2
- 239000011575 calcium Substances 0.000 description 2
- 229910052791 calcium Inorganic materials 0.000 description 2
- 230000015556 catabolic process Effects 0.000 description 2
- 230000000052 comparative effect Effects 0.000 description 2
- 238000005260 corrosion Methods 0.000 description 2
- 230000007797 corrosion Effects 0.000 description 2
- NJLLQSBAHIKGKF-UHFFFAOYSA-N dipotassium dioxido(oxo)titanium Chemical compound [K+].[K+].[O-][Ti]([O-])=O NJLLQSBAHIKGKF-UHFFFAOYSA-N 0.000 description 2
- ZXEKIIBDNHEJCQ-UHFFFAOYSA-N isobutanol Chemical compound CC(C)CO ZXEKIIBDNHEJCQ-UHFFFAOYSA-N 0.000 description 2
- 239000011777 magnesium Substances 0.000 description 2
- 229910052749 magnesium Inorganic materials 0.000 description 2
- 150000001247 metal acetylides Chemical class 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 150000004767 nitrides Chemical class 0.000 description 2
- 235000021317 phosphate Nutrition 0.000 description 2
- 150000003013 phosphoric acid derivatives Chemical class 0.000 description 2
- 229920001296 polysiloxane Polymers 0.000 description 2
- 150000004760 silicates Chemical class 0.000 description 2
- 229910021332 silicide Inorganic materials 0.000 description 2
- ZNQVEEAIQZEUHB-UHFFFAOYSA-N 2-ethoxyethanol Chemical compound CCOCCO ZNQVEEAIQZEUHB-UHFFFAOYSA-N 0.000 description 1
- SVONRAPFKPVNKG-UHFFFAOYSA-N 2-ethoxyethyl acetate Chemical compound CCOCCOC(C)=O SVONRAPFKPVNKG-UHFFFAOYSA-N 0.000 description 1
- 229920000178 Acrylic resin Polymers 0.000 description 1
- 239000004925 Acrylic resin Substances 0.000 description 1
- ZOXJGFHDIHLPTG-UHFFFAOYSA-N Boron Chemical compound [B] ZOXJGFHDIHLPTG-UHFFFAOYSA-N 0.000 description 1
- DKPFZGUDAPQIHT-UHFFFAOYSA-N Butyl acetate Natural products CCCCOC(C)=O DKPFZGUDAPQIHT-UHFFFAOYSA-N 0.000 description 1
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 description 1
- DGAQECJNVWCQMB-PUAWFVPOSA-M Ilexoside XXIX Chemical compound C[C@@H]1CC[C@@]2(CC[C@@]3(C(=CC[C@H]4[C@]3(CC[C@@H]5[C@@]4(CC[C@@H](C5(C)C)OS(=O)(=O)[O-])C)C)[C@@H]2[C@]1(C)O)C)C(=O)O[C@H]6[C@@H]([C@H]([C@@H]([C@H](O6)CO)O)O)O.[Na+] DGAQECJNVWCQMB-PUAWFVPOSA-M 0.000 description 1
- WHXSMMKQMYFTQS-UHFFFAOYSA-N Lithium Chemical compound [Li] WHXSMMKQMYFTQS-UHFFFAOYSA-N 0.000 description 1
- 229910052581 Si3N4 Inorganic materials 0.000 description 1
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 description 1
- QCWXUUIWCKQGHC-UHFFFAOYSA-N Zirconium Chemical compound [Zr] QCWXUUIWCKQGHC-UHFFFAOYSA-N 0.000 description 1
- 229920000180 alkyd Polymers 0.000 description 1
- 229910052788 barium Inorganic materials 0.000 description 1
- DSAJWYNOEDNPEQ-UHFFFAOYSA-N barium atom Chemical compound [Ba] DSAJWYNOEDNPEQ-UHFFFAOYSA-N 0.000 description 1
- 229910052796 boron Inorganic materials 0.000 description 1
- QHIWVLPBUQWDMQ-UHFFFAOYSA-N butyl prop-2-enoate;methyl 2-methylprop-2-enoate;prop-2-enoic acid Chemical compound OC(=O)C=C.COC(=O)C(C)=C.CCCCOC(=O)C=C QHIWVLPBUQWDMQ-UHFFFAOYSA-N 0.000 description 1
- 229910052804 chromium Inorganic materials 0.000 description 1
- 239000011651 chromium Substances 0.000 description 1
- 239000010941 cobalt Substances 0.000 description 1
- 229910017052 cobalt Inorganic materials 0.000 description 1
- GUTLYIVDDKVIGB-UHFFFAOYSA-N cobalt atom Chemical compound [Co] GUTLYIVDDKVIGB-UHFFFAOYSA-N 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 235000013870 dimethyl polysiloxane Nutrition 0.000 description 1
- 239000004205 dimethyl polysiloxane Substances 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- FUZZWVXGSFPDMH-UHFFFAOYSA-N hexanoic acid Chemical compound CCCCCC(O)=O FUZZWVXGSFPDMH-UHFFFAOYSA-N 0.000 description 1
- 230000001771 impaired effect Effects 0.000 description 1
- 229910052500 inorganic mineral Inorganic materials 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- 229910052744 lithium Inorganic materials 0.000 description 1
- -1 magnesium oxyhydroxide Chemical compound 0.000 description 1
- WPBNNNQJVZRUHP-UHFFFAOYSA-L manganese(2+);methyl n-[[2-(methoxycarbonylcarbamothioylamino)phenyl]carbamothioyl]carbamate;n-[2-(sulfidocarbothioylamino)ethyl]carbamodithioate Chemical compound [Mn+2].[S-]C(=S)NCCNC([S-])=S.COC(=O)NC(=S)NC1=CC=CC=C1NC(=S)NC(=O)OC WPBNNNQJVZRUHP-UHFFFAOYSA-L 0.000 description 1
- 239000011707 mineral Substances 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 229920001558 organosilicon polymer Polymers 0.000 description 1
- 229920000435 poly(dimethylsiloxane) Polymers 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 229920001225 polyester resin Polymers 0.000 description 1
- 239000004645 polyester resin Substances 0.000 description 1
- 239000011591 potassium Substances 0.000 description 1
- 229910052700 potassium Inorganic materials 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 description 1
- 229910010271 silicon carbide Inorganic materials 0.000 description 1
- LIVNPJMFVYWSIS-UHFFFAOYSA-N silicon monoxide Chemical class [Si-]#[O+] LIVNPJMFVYWSIS-UHFFFAOYSA-N 0.000 description 1
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 1
- 229910052814 silicon oxide Inorganic materials 0.000 description 1
- 239000011734 sodium Substances 0.000 description 1
- 229910052708 sodium Inorganic materials 0.000 description 1
- 239000002904 solvent Substances 0.000 description 1
- 239000007921 spray Substances 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 239000010936 titanium Substances 0.000 description 1
- 229910052719 titanium Inorganic materials 0.000 description 1
- BIKXLKXABVUSMH-UHFFFAOYSA-N trizinc;diborate Chemical class [Zn+2].[Zn+2].[Zn+2].[O-]B([O-])[O-].[O-]B([O-])[O-] BIKXLKXABVUSMH-UHFFFAOYSA-N 0.000 description 1
- 239000011701 zinc Substances 0.000 description 1
- 229910052725 zinc Inorganic materials 0.000 description 1
- 239000011787 zinc oxide Substances 0.000 description 1
- 229910052726 zirconium Inorganic materials 0.000 description 1
Landscapes
- Insulated Conductors (AREA)
Abstract
Description
【０００１】0001
【産業上の利用分野】本発明は耐熱性を有すると共にピ
ンホール状の剥離のない塗膜が導体上に形成された被覆
電線に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a coated wire having heat resistance and a coating film formed on a conductor without pinhole-like peeling.
【０００２】0002
【従来の技術及びその問題点】特開昭６３−２５００１
２号公報には、ポリボロシロキサン、シリコーン樹脂及
び無機充填材からなる耐熱性塗料が導体上に塗装焼付け
されている被覆電線が開示されている。上記公報に記載
の被覆電線は、被覆されている塗膜が耐熱性に優れると
共に良好な耐食性、耐衝撃性を示すので、高温雰囲気下
においても使用することができるという優れた特性を有
している。他方、上記公報に記載の被覆電線について、
さらに詳細に検討したところ、この被覆電線に使用され
る塗料から形成される塗膜を高温に暴露すると、ポリボ
ロシロキサンが無機物に転化するに伴って体積収縮し、
導体に達するピンホールが生成する場合があることが判
明した。この塗膜に発生するピンホールのため、上記耐
熱性塗料を被覆した電線は、耐湿性が完全ではないとい
う、解決すべき問題点がある。[Prior art and its problems] JP-A-63-25001
Publication No. 2 discloses a covered electric wire in which a heat-resistant paint consisting of polyborosiloxane, silicone resin, and inorganic filler is painted and baked onto a conductor. The coated wire described in the above publication has excellent properties such that it can be used even in high-temperature atmospheres because the coated wire has excellent heat resistance, as well as good corrosion resistance and impact resistance. There is. On the other hand, regarding the covered wire described in the above publication,
A more detailed study revealed that when the coating film formed from the paint used for this coated wire is exposed to high temperatures, the volume shrinks as the polyborosiloxane converts into an inorganic substance.
It has been found that pinholes reaching the conductor may be created. Because of the pinholes that occur in the coating film, electric wires coated with the heat-resistant paint do not have perfect moisture resistance, which is a problem that needs to be solved.
【０００３】0003
【問題点を解決するための技術的手段】本発明は優れた
耐熱性及び導体と塗膜との密着性が改良された被覆電線
を提供する。本発明によれば、ポリボロシロキサン、シ
リコーン樹脂、粒状の無機充填材、及び短繊維状の無機
充填材からなる耐熱性塗料がが導体上に塗装焼付けされ
てい被覆電線が提供される。[Technical Means for Solving the Problems] The present invention provides a covered wire with excellent heat resistance and improved adhesion between the conductor and the coating film. According to the present invention, a coated electric wire is provided in which a heat-resistant paint consisting of polyborosiloxane, a silicone resin, a granular inorganic filler, and a short fibrous inorganic filler is painted and baked onto a conductor.
【０００４】本発明におけるポリボロシロキサンは公知
の有機ケイ素重合体であり、例えば特公昭５８−４７３
２号公報に記載の方法に従って調製することができる。
ポリボロシロキサンの数平均分子量は通常５００〜１０
０００、好ましくは１０００〜５０００である。The polyborosiloxane used in the present invention is a known organosilicon polymer, for example, as disclosed in Japanese Patent Publication No. 58-473.
It can be prepared according to the method described in Publication No. 2. The number average molecular weight of polyborosiloxane is usually 500 to 10
000, preferably 1000-5000.
【０００５】本発明におけるシリコーン樹脂の具体例と
しては、ジメチルポリシロキサン、メチルフェニルポリ
シロキサン、ジフェニルポリシロキサンなどの純シリコ
ーン樹脂、純シリコーン樹脂をアルキッド樹脂、ポリエ
ステル樹脂、アクリル樹脂、エポキシ樹脂などの変成用
樹脂と反応させた変成シリコーンが挙げられる。シリコ
ーン樹脂の配合割合は、ポリボロシロキサン１００重量
部当たり、１０〜９００重量部、特に５０〜５００重量
部であることが好ましい。シリコーン樹脂の配合割合が
過度に小さいと焼付け塗膜の可撓性が低下し、その割合
が過度に高くなると焼付け塗膜の耐熱性及び耐食性が低
下する。Specific examples of silicone resins used in the present invention include pure silicone resins such as dimethylpolysiloxane, methylphenylpolysiloxane, and diphenylpolysiloxane, and modified pure silicone resins such as alkyd resins, polyester resins, acrylic resins, and epoxy resins. For example, modified silicone reacted with a commercially available resin. The blending ratio of the silicone resin is preferably 10 to 900 parts by weight, particularly 50 to 500 parts by weight, per 100 parts by weight of polyborosiloxane. If the blending ratio of silicone resin is too small, the flexibility of the baked coating will decrease, and if the proportion is too high, the heat resistance and corrosion resistance of the baked coating will decrease.
【０００６】本発明における粒状の無機充填材としては
、酸化物、ホウ化物、リン酸塩、ケイ酸塩、ケイ化物、
ホウ化物、窒化物及び炭化物から選ばれる少なくとも一
種が使用される。その例としては、マグネシウム、カル
シウム、バリウム、チタン、ジルコニウム、クロム、マ
ンガン、鉄、コバルト、ニッケル、銅、亜鉛、ホウ素、
アルミニウム、ケイ素の酸化物、炭化物、窒化物、ケイ
化物、ホウ化物、リチウム、ナトリウム、カリウム、マ
グネシウム、カルシウムあるいは亜鉛のホウ酸塩、リン
酸塩、ケイ酸塩が挙げられる。粒状の無機充填材の平均
直径は通常２〜２０μｍである。The granular inorganic fillers used in the present invention include oxides, borides, phosphates, silicates, silicides,
At least one selected from borides, nitrides, and carbides is used. Examples include magnesium, calcium, barium, titanium, zirconium, chromium, manganese, iron, cobalt, nickel, copper, zinc, boron,
Mention may be made of aluminum, silicon oxides, carbides, nitrides, silicides, borides, lithium, sodium, potassium, magnesium, calcium or zinc borates, phosphates and silicates. The average diameter of the granular inorganic filler is usually 2 to 20 μm.
【０００７】粒状の無機充填材と併用される短繊維状の
無機充填材は、ウイスカ及チョップド繊維の両者を包含
する。短繊維状の無機充填材としてはそれ自体公知のも
のをすべて使用することができ、その例としては、チタ
ン酸カリウム、炭化ケイ素、窒化ケイ素、アルミナ、ア
ルミナ・ボリア、酸化亜鉛、オキシ水酸化マグネシウム
などのウイスカあるいチョップド繊維が挙げられる。短
繊維状の無機充填材の直径は通常０．１〜１０μｍであ
り、長さ／直径（ｌ／ｄ）は通常５〜１００である。Short fiber inorganic fillers used in combination with particulate inorganic fillers include both whiskers and chopped fibers. As short fibrous inorganic fillers, all known per se can be used, examples include potassium titanate, silicon carbide, silicon nitride, alumina, alumina boria, zinc oxide, magnesium oxyhydroxide. Examples include whiskers or chopped fibers such as. The diameter of the short fibrous inorganic filler is usually 0.1 to 10 μm, and the length/diameter (l/d) is usually 5 to 100.
【０００８】粒状及び短繊維状の無機充填材の合計配合
割合は、ポリボロシロキサン１００重量部当たり、１０
〜９００重量部、特に５０〜５００重量部であることが
好ましい。無機充填材の合計配合割合が過度に小さいと
、塗膜の密着性が低下し、その割合が過度に高くなると
塗膜の可撓性が低下する。The total blending ratio of granular and short fibrous inorganic fillers is 10 parts by weight per 100 parts by weight of polyborosiloxane.
It is preferably from 50 to 500 parts by weight, particularly from 50 to 500 parts by weight. If the total blending ratio of the inorganic fillers is too small, the adhesion of the coating film will be reduced, and if the ratio is too high, the flexibility of the coating film will be reduced.
【０００９】高温下での塗膜の剥離がないかきわめて少
ない塗膜を形成するためには、粒状の無機充填材と短繊
維状の無機充填材とを併用することが必須である。短繊
維状の無機充填材の配合割合は、無機充填材の全量１０
０重量部当たり、５〜７５重量部である。短繊維状の無
機充填材の配合割合が過度に小さいと高温下で塗膜が剥
離しやすくなり、その割合を過度に高くすると、塗料自
体の流動性が損なわれるようになる。尚、無機充填材と
して短繊維状の無機充填材のみを使用することも考えら
れるが、塗料中で短繊維状の無機充填材が絡み合って、
結果として塗料の流動性が低下し、塗料の塗布あるいは
吹きつけが困難となる。[0009] In order to form a coating film that exhibits no or very little peeling of the coating film at high temperatures, it is essential to use a granular inorganic filler and a short fibrous inorganic filler in combination. The blending ratio of short fibrous inorganic filler is 10% of the total amount of inorganic filler.
5 to 75 parts by weight per 0 parts by weight. If the blending ratio of the short fibrous inorganic filler is too small, the coating film will easily peel off at high temperatures, and if the ratio is too high, the fluidity of the paint itself will be impaired. It is also possible to use only short fibrous inorganic fillers as the inorganic filler, but short fibrous inorganic fillers become intertwined in the paint.
As a result, the fluidity of the paint decreases, making it difficult to apply or spray the paint.
【００１０】本発明における塗料成分は有機溶剤に分散
又は溶解して使用される。有機溶剤としては、ポリボロ
シロキサン及びシリコーン樹脂の溶解能がある溶剤であ
ればすべて使用することができる。その具体例としては
、トルエン、キシレン、ｎ−ブタノール、イソブタノー
ル、酢酸ブチル、ミネラルスピリット、ソルベントナフ
サ、エチルセロソルブ、セロソルブアセテートが挙げら
れる。有機溶剤の使用割合は、塗膜形成性成分の種類及
び配合割合に応じて種々異なるが、本発明の開示に従っ
て当業者が適宜決定することができる。The coating components in the present invention are used after being dispersed or dissolved in an organic solvent. Any organic solvent can be used as long as it is capable of dissolving polyborosiloxane and silicone resin. Specific examples include toluene, xylene, n-butanol, isobutanol, butyl acetate, mineral spirit, solvent naphtha, ethyl cellosolve, and cellosolve acetate. The proportion of the organic solvent to be used varies depending on the type and blending proportion of the film-forming components, and can be appropriately determined by those skilled in the art in accordance with the disclosure of the present invention.
【００１１】本発明の被覆電線は、上記の耐熱性塗料を
、銅線、アルミニウム線、好ましくはニッケルメッキ銅
線、銀メッキ銅線、ステンレスクラッド銅線などのメッ
キ銅線に、常法によって塗布焼付けすることによって、
得ることができる。[0011] The coated electric wire of the present invention is obtained by applying the heat-resistant paint described above to a copper wire, an aluminum wire, preferably a plated copper wire such as a nickel-plated copper wire, a silver-plated copper wire, or a stainless clad copper wire, by a conventional method. By baking,
Obtainable.
【００１２】0012
【実施例】以下に実施例及び比較例を示す。実施例にお
いて特別の言及がない限り、「％」及び「部」は、それ
ぞれ、「重量％」及び「重量部」を示す。[Example] Examples and comparative examples are shown below. Unless otherwise specified in the examples, "%" and "parts" refer to "% by weight" and "parts by weight," respectively.
【００１３】実施例１
特公昭５８−４７３２号公報に記載の方法に従って調製
した数平均分子量１５００のポリボリシロキサンの５０
％キシレン溶液１００部、メチルフェニルポリシロキサ
ンの５０％キシレン溶液（東芝シリコーン社製、ＴＳＲ
−１１６）１００部、平均直径３μｍの粒状アルミナ粉
末１００部、直径１μｍ、長さ５０μｍのチタン酸カリ
ウムウイスカ２０部、及びキシレン５０部をミキサーに
より混合して耐熱性塗料を調製した。この塗料を、外径
１．０ｍｍのニッケルメッキ銅線上に焼付け温度４００
℃、線速８ｍ／分の条件で、６回塗布焼付けて、絶縁厚
さ４０μｍの被覆電線を得た。得られた被覆電線の絶縁
破壊電圧及び５００℃で１時間加熱した後の絶縁破壊電
圧を表１に示す。Example 1 Polybolysiloxane with a number average molecular weight of 1500 prepared according to the method described in Japanese Patent Publication No. 58-4732.
% xylene solution, 50% xylene solution of methylphenylpolysiloxane (manufactured by Toshiba Silicone Co., Ltd., TSR
-116) 100 parts of granular alumina powder with an average diameter of 3 μm, 20 parts of potassium titanate whiskers with a diameter of 1 μm and a length of 50 μm, and 50 parts of xylene were mixed in a mixer to prepare a heat-resistant paint. This paint is baked on a nickel-plated copper wire with an outer diameter of 1.0 mm at a temperature of 400.
C. and a wire speed of 8 m/min, the coating was applied and baked six times to obtain a coated wire with an insulation thickness of 40 .mu.m. Table 1 shows the dielectric breakdown voltage of the obtained covered wire and the dielectric breakdown voltage after heating at 500° C. for 1 hour.
【００１４】比較例１
粒状のアルミナ粉末１００部のみを配合した以外は実施
例１を繰り返した。結果を表１に示す。Comparative Example 1 Example 1 was repeated except that only 100 parts of granular alumina powder was blended. The results are shown in Table 1.
【表１】[Table 1]
Claims (1)
状の無機充填材、及び短繊維状の無機充填材からなる耐
熱性塗料がが導体上に塗装焼付けされていることを特徴
とする被覆電線。1. A covered electric wire characterized in that a heat-resistant paint consisting of polyborosiloxane, silicone resin, granular inorganic filler, and short fibrous inorganic filler is painted and baked onto a conductor.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3073549A JPH04237905A (en) | 1991-01-18 | 1991-01-18 | Coated electric wire |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3073549A JPH04237905A (en) | 1991-01-18 | 1991-01-18 | Coated electric wire |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH04237905A true JPH04237905A (en) | 1992-08-26 |
Family
ID=13521430
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP3073549A Pending JPH04237905A (en) | 1991-01-18 | 1991-01-18 | Coated electric wire |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH04237905A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO1999048112A1 (en) * | 1998-03-16 | 1999-09-23 | Pavel Kupilik | Cable |
-
1991
- 1991-01-18 JP JP3073549A patent/JPH04237905A/en active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO1999048112A1 (en) * | 1998-03-16 | 1999-09-23 | Pavel Kupilik | Cable |
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