JPH0155567B2 - - Google Patents
Info
- Publication number
- JPH0155567B2 JPH0155567B2 JP57094471A JP9447182A JPH0155567B2 JP H0155567 B2 JPH0155567 B2 JP H0155567B2 JP 57094471 A JP57094471 A JP 57094471A JP 9447182 A JP9447182 A JP 9447182A JP H0155567 B2 JPH0155567 B2 JP H0155567B2
- Authority
- JP
- Japan
- Prior art keywords
- coil
- paint
- polyborosiloxane
- baking
- silicone
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000003973 paint Substances 0.000 claims description 25
- 229920005989 resin Polymers 0.000 claims description 21
- 239000011347 resin Substances 0.000 claims description 21
- 238000000034 method Methods 0.000 claims description 8
- 239000003960 organic solvent Substances 0.000 claims description 7
- 229920002050 silicone resin Polymers 0.000 claims description 6
- 239000004020 conductor Substances 0.000 claims description 5
- 239000011256 inorganic filler Substances 0.000 claims description 5
- 229910003475 inorganic filler Inorganic materials 0.000 claims description 5
- 238000010438 heat treatment Methods 0.000 claims description 4
- 238000010304 firing Methods 0.000 claims description 2
- 238000000576 coating method Methods 0.000 description 12
- 239000011248 coating agent Substances 0.000 description 11
- 229920001296 polysiloxane Polymers 0.000 description 8
- 238000009413 insulation Methods 0.000 description 7
- 239000002904 solvent Substances 0.000 description 7
- SECXISVLQFMRJM-UHFFFAOYSA-N N-Methylpyrrolidone Chemical compound CN1CCCC1=O SECXISVLQFMRJM-UHFFFAOYSA-N 0.000 description 6
- 238000010292 electrical insulation Methods 0.000 description 5
- 239000000395 magnesium oxide Substances 0.000 description 5
- CPLXHLVBOLITMK-UHFFFAOYSA-N magnesium oxide Inorganic materials [Mg]=O CPLXHLVBOLITMK-UHFFFAOYSA-N 0.000 description 5
- AXZKOIWUVFPNLO-UHFFFAOYSA-N magnesium;oxygen(2-) Chemical compound [O-2].[Mg+2] AXZKOIWUVFPNLO-UHFFFAOYSA-N 0.000 description 5
- 238000004519 manufacturing process Methods 0.000 description 5
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 4
- 239000004327 boric acid Substances 0.000 description 4
- 238000005470 impregnation Methods 0.000 description 4
- -1 montmorinite Substances 0.000 description 4
- 238000007747 plating Methods 0.000 description 4
- 239000002966 varnish Substances 0.000 description 4
- WFDIJRYMOXRFFG-UHFFFAOYSA-N Acetic anhydride Chemical compound CC(=O)OC(C)=O WFDIJRYMOXRFFG-UHFFFAOYSA-N 0.000 description 3
- KGBXLFKZBHKPEV-UHFFFAOYSA-N boric acid Chemical compound OB(O)O KGBXLFKZBHKPEV-UHFFFAOYSA-N 0.000 description 3
- 238000002156 mixing Methods 0.000 description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- FXHOOIRPVKKKFG-UHFFFAOYSA-N N,N-Dimethylacetamide Chemical compound CN(C)C(C)=O FXHOOIRPVKKKFG-UHFFFAOYSA-N 0.000 description 2
- CTQNGGLPUBDAKN-UHFFFAOYSA-N O-Xylene Chemical compound CC1=CC=CC=C1C CTQNGGLPUBDAKN-UHFFFAOYSA-N 0.000 description 2
- WYURNTSHIVDZCO-UHFFFAOYSA-N Tetrahydrofuran Chemical compound C1CCOC1 WYURNTSHIVDZCO-UHFFFAOYSA-N 0.000 description 2
- XLOMVQKBTHCTTD-UHFFFAOYSA-N Zinc monoxide Chemical compound [Zn]=O XLOMVQKBTHCTTD-UHFFFAOYSA-N 0.000 description 2
- MCMNRKCIXSYSNV-UHFFFAOYSA-N Zirconium dioxide Chemical compound O=[Zr]=O MCMNRKCIXSYSNV-UHFFFAOYSA-N 0.000 description 2
- YRKCREAYFQTBPV-UHFFFAOYSA-N acetylacetone Chemical compound CC(=O)CC(C)=O YRKCREAYFQTBPV-UHFFFAOYSA-N 0.000 description 2
- 238000006243 chemical reaction Methods 0.000 description 2
- 239000007795 chemical reaction product Substances 0.000 description 2
- JKWMSGQKBLHBQQ-UHFFFAOYSA-N diboron trioxide Chemical compound O=BOB=O JKWMSGQKBLHBQQ-UHFFFAOYSA-N 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 229910052759 nickel Inorganic materials 0.000 description 2
- 229920002545 silicone oil Polymers 0.000 description 2
- 239000007787 solid Substances 0.000 description 2
- 239000008096 xylene Substances 0.000 description 2
- QIJNJJZPYXGIQM-UHFFFAOYSA-N 1lambda4,2lambda4-dimolybdacyclopropa-1,2,3-triene Chemical compound [Mo]=C=[Mo] QIJNJJZPYXGIQM-UHFFFAOYSA-N 0.000 description 1
- QTWJRLJHJPIABL-UHFFFAOYSA-N 2-methylphenol;3-methylphenol;4-methylphenol Chemical compound CC1=CC=C(O)C=C1.CC1=CC=CC(O)=C1.CC1=CC=CC=C1O QTWJRLJHJPIABL-UHFFFAOYSA-N 0.000 description 1
- 229910052582 BN Inorganic materials 0.000 description 1
- PZNSFCLAULLKQX-UHFFFAOYSA-N Boron nitride Chemical compound N#B PZNSFCLAULLKQX-UHFFFAOYSA-N 0.000 description 1
- 239000004593 Epoxy Substances 0.000 description 1
- JOYRKODLDBILNP-UHFFFAOYSA-N Ethyl urethane Chemical compound CCOC(N)=O JOYRKODLDBILNP-UHFFFAOYSA-N 0.000 description 1
- 229910039444 MoC Inorganic materials 0.000 description 1
- ZLMJMSJWJFRBEC-UHFFFAOYSA-N Potassium Chemical compound [K] ZLMJMSJWJFRBEC-UHFFFAOYSA-N 0.000 description 1
- 239000004111 Potassium silicate Substances 0.000 description 1
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 1
- 239000004110 Zinc silicate Substances 0.000 description 1
- JFBZPFYRPYOZCQ-UHFFFAOYSA-N [Li].[Al] Chemical compound [Li].[Al] JFBZPFYRPYOZCQ-UHFFFAOYSA-N 0.000 description 1
- YKTSYUJCYHOUJP-UHFFFAOYSA-N [O--].[Al+3].[Al+3].[O-][Si]([O-])([O-])[O-] Chemical compound [O--].[Al+3].[Al+3].[O-][Si]([O-])([O-])[O-] YKTSYUJCYHOUJP-UHFFFAOYSA-N 0.000 description 1
- GNKTZDSRQHMHLZ-UHFFFAOYSA-N [Si].[Si].[Si].[Ti].[Ti].[Ti].[Ti].[Ti] Chemical compound [Si].[Si].[Si].[Ti].[Ti].[Ti].[Ti].[Ti] GNKTZDSRQHMHLZ-UHFFFAOYSA-N 0.000 description 1
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 1
- 229920000180 alkyd Polymers 0.000 description 1
- 125000000217 alkyl group Chemical group 0.000 description 1
- SXQXMCWCWVCFPC-UHFFFAOYSA-N aluminum;potassium;dioxido(oxo)silane Chemical compound [Al+3].[K+].[O-][Si]([O-])=O.[O-][Si]([O-])=O SXQXMCWCWVCFPC-UHFFFAOYSA-N 0.000 description 1
- ANBBXQWFNXMHLD-UHFFFAOYSA-N aluminum;sodium;oxygen(2-) Chemical compound [O-2].[O-2].[Na+].[Al+3] ANBBXQWFNXMHLD-UHFFFAOYSA-N 0.000 description 1
- 125000003118 aryl group Chemical group 0.000 description 1
- 239000010425 asbestos Substances 0.000 description 1
- CCDWGDHTPAJHOA-UHFFFAOYSA-N benzylsilicon Chemical compound [Si]CC1=CC=CC=C1 CCDWGDHTPAJHOA-UHFFFAOYSA-N 0.000 description 1
- 229910052796 boron Inorganic materials 0.000 description 1
- 229910052810 boron oxide Inorganic materials 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 239000002734 clay mineral Substances 0.000 description 1
- 230000000052 comparative effect Effects 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 229930003836 cresol Natural products 0.000 description 1
- OLLFKUHHDPMQFR-UHFFFAOYSA-N dihydroxy(diphenyl)silane Chemical compound C=1C=CC=CC=1[Si](O)(O)C1=CC=CC=C1 OLLFKUHHDPMQFR-UHFFFAOYSA-N 0.000 description 1
- 125000000118 dimethyl group Chemical group [H]C([H])([H])* 0.000 description 1
- KPUWHANPEXNPJT-UHFFFAOYSA-N disiloxane Chemical class [SiH3]O[SiH3] KPUWHANPEXNPJT-UHFFFAOYSA-N 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 239000004615 ingredient Substances 0.000 description 1
- NLYAJNPCOHFWQQ-UHFFFAOYSA-N kaolin Chemical compound O.O.O=[Al]O[Si](=O)O[Si](=O)O[Al]=O NLYAJNPCOHFWQQ-UHFFFAOYSA-N 0.000 description 1
- 229910052622 kaolinite Inorganic materials 0.000 description 1
- 229910000464 lead oxide Inorganic materials 0.000 description 1
- HCWCAKKEBCNQJP-UHFFFAOYSA-N magnesium orthosilicate Chemical compound [Mg+2].[Mg+2].[O-][Si]([O-])([O-])[O-] HCWCAKKEBCNQJP-UHFFFAOYSA-N 0.000 description 1
- 239000000391 magnesium silicate Substances 0.000 description 1
- 229910052919 magnesium silicate Inorganic materials 0.000 description 1
- 235000019792 magnesium silicate Nutrition 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 229910044991 metal oxide Inorganic materials 0.000 description 1
- 150000004706 metal oxides Chemical class 0.000 description 1
- 239000010445 mica Substances 0.000 description 1
- 229910052618 mica group Inorganic materials 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- DLJZGBGIFQRQAL-UHFFFAOYSA-N nitroboron Chemical compound [B][N+]([O-])=O DLJZGBGIFQRQAL-UHFFFAOYSA-N 0.000 description 1
- 239000012299 nitrogen atmosphere Substances 0.000 description 1
- RIFHPKDYLRBSGB-UHFFFAOYSA-N nitrosilicon Chemical compound [O-][N+]([Si])=O RIFHPKDYLRBSGB-UHFFFAOYSA-N 0.000 description 1
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 description 1
- YEXPOXQUZXUXJW-UHFFFAOYSA-N oxolead Chemical compound [Pb]=O YEXPOXQUZXUXJW-UHFFFAOYSA-N 0.000 description 1
- RVTZCBVAJQQJTK-UHFFFAOYSA-N oxygen(2-);zirconium(4+) Chemical compound [O-2].[O-2].[Zr+4] RVTZCBVAJQQJTK-UHFFFAOYSA-N 0.000 description 1
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N phenol group Chemical group C1(=CC=CC=C1)O ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 1
- 239000002798 polar solvent Substances 0.000 description 1
- 229920001921 poly-methyl-phenyl-siloxane Polymers 0.000 description 1
- 238000012643 polycondensation polymerization Methods 0.000 description 1
- 238000006068 polycondensation reaction Methods 0.000 description 1
- 229920000728 polyester Polymers 0.000 description 1
- 229910052700 potassium Inorganic materials 0.000 description 1
- 239000011591 potassium Substances 0.000 description 1
- NNHHDJVEYQHLHG-UHFFFAOYSA-N potassium silicate Chemical compound [K+].[K+].[O-][Si]([O-])=O NNHHDJVEYQHLHG-UHFFFAOYSA-N 0.000 description 1
- 235000019353 potassium silicate Nutrition 0.000 description 1
- 229910052913 potassium silicate Inorganic materials 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- HNJBEVLQSNELDL-UHFFFAOYSA-N pyrrolidin-2-one Chemical compound O=C1CCCN1 HNJBEVLQSNELDL-UHFFFAOYSA-N 0.000 description 1
- 229910052895 riebeckite Inorganic materials 0.000 description 1
- 150000003839 salts Chemical class 0.000 description 1
- 229910000077 silane Inorganic materials 0.000 description 1
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 description 1
- 229910010271 silicon carbide Inorganic materials 0.000 description 1
- 229910001388 sodium aluminate Inorganic materials 0.000 description 1
- 238000003756 stirring Methods 0.000 description 1
- 239000000454 talc Substances 0.000 description 1
- 229910052623 talc Inorganic materials 0.000 description 1
- YLQBMQCUIZJEEH-UHFFFAOYSA-N tetrahydrofuran Natural products C=1C=COC=1 YLQBMQCUIZJEEH-UHFFFAOYSA-N 0.000 description 1
- LLZRNZOLAXHGLL-UHFFFAOYSA-J titanic acid Chemical compound O[Ti](O)(O)O LLZRNZOLAXHGLL-UHFFFAOYSA-J 0.000 description 1
- 239000010936 titanium Substances 0.000 description 1
- 229910052719 titanium Inorganic materials 0.000 description 1
- MTPVUVINMAGMJL-UHFFFAOYSA-N trimethyl(1,1,2,2,2-pentafluoroethyl)silane Chemical compound C[Si](C)(C)C(F)(F)C(F)(F)F MTPVUVINMAGMJL-UHFFFAOYSA-N 0.000 description 1
- UONOETXJSWQNOL-UHFFFAOYSA-N tungsten carbide Chemical compound [W+]#[C-] UONOETXJSWQNOL-UHFFFAOYSA-N 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
- 238000004804 winding Methods 0.000 description 1
- 239000011787 zinc oxide Substances 0.000 description 1
- XSMMCTCMFDWXIX-UHFFFAOYSA-N zinc silicate Chemical compound [Zn+2].[O-][Si]([O-])=O XSMMCTCMFDWXIX-UHFFFAOYSA-N 0.000 description 1
- 235000019352 zinc silicate Nutrition 0.000 description 1
- 229910001928 zirconium oxide Inorganic materials 0.000 description 1
- GFQYVLUOOAAOGM-UHFFFAOYSA-N zirconium(iv) silicate Chemical compound [Zr+4].[O-][Si]([O-])([O-])[O-] GFQYVLUOOAAOGM-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F41/00—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties
- H01F41/02—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils, or magnets
- H01F41/04—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils, or magnets for manufacturing coils
- H01F41/12—Insulating of windings
- H01F41/127—Encapsulating or impregnating
Landscapes
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Insulating Of Coils (AREA)
Description
（発明の技術分野）
本発明は絶縁性を低下させることのないコイル
の含浸処理方法に関する。
（発明の技術的背景）
一般に導体上に電気絶縁塗料を塗布焼付けてな
る絶縁電線の特性は、同種の絶縁塗料を用いた場
合でも、その焼付度によつて大きく変化すること
が知られている。
すなわち焼付けが不充分で塗膜がアンダーキユ
ア状態のときは、可撓性は良好であるが耐溶剤性
が不充分となり、反対に焼付けが過度で塗膜がオ
ーバーキユア状態の場合には、耐溶剤性は良好で
あるが可撓性が劣悪になる。
特性が焼付度に依存するこのような傾向は、特
に直径が1.0mm以上の大サイズの導体を用いた絶
縁電線において顕著にみられる。
一方、ポリボロシロキサン樹脂とシリコーン樹
脂と無機充填剤とを有機溶剤中に溶解又は分散さ
せてなる塗料が近年開発され、耐熱性電気絶縁塗
料として絶縁電線製造の分野に広く使用されつつ
ある。
この塗料を塗布焼付けてなる絶縁電線は、従来
の有機物系絶縁塗膜を有するものに比べて耐熱性
や耐溶剤性に極めて優れている反面、塗膜の可撓
性等の機械的強度が若干乏しいという欠点がある
ので、特にコイルとして使用する際等充分な可撓
性を必要とする使用態様においては、塗膜がアン
ダーキユア状態で焼付けを停止し可撓性を向上さ
せて成形することが行なわれている。
（背景技術の問題点）
しかしながらこのような絶縁電線においては、
塗膜の耐溶剤性が不充分であるため、コイル巻後
の含浸処理工程で電気絶縁性が極端に低下してし
まうという難点があつた。
すなわち、一般に絶縁電線でコイルを製作する
場合には、コイルの機械的特性および電気絶縁性
をさらに向上させる目的で、コイル全体を絶縁処
理ワニス中に含浸し乾燥させて一体に固めること
が行なわれているが、その際処理ワニス中の有機
溶剤によつて塗膜の溶解やふくれが生じ、絶縁特
性が著るしく低下してしまうという難点があつ
た。
（発明の目的）
本発明はこのような難点を解消するためになさ
れたもので、電気絶縁性の良好なコイルを得るた
めの含浸処理方法を提供することを目的とする。
（発明の概要）
すなわち本発明は、ポリボロシロキサン樹脂と
シリコーン樹脂と無機質充填剤を有機溶剤に溶解
または分散させてなるポリボロシロキサン樹脂系
塗料を導体上に塗布し、塗膜がアンダーキユア状
態で焼付けを停止してなる絶縁電線をコイル状に
成形し、これを250℃以上の温度で所定時間加熱
処理した後、全体をポリボロシロキサン樹脂系塗
料中に含浸し、ポリボロシロキサン樹脂系塗料層
を焼成することを特徴とするコイルの含浸処理方
法である。
本発明においてコイル成形前の絶縁電線製造に
用いるポリボロシロキサン樹脂系塗料としては、
特に以下に述べる配合成分をＮ−メチル−２−ピ
ロリドン、ジメチルアセトアミドのような極性溶
剤或いはフエノール系溶剤等の有機溶剤に溶解又
は分散させてなるポリボロシロキサン樹脂系塗料
を使用する。
すなわちこの塗料は(イ)ポリボロシロキサン樹脂
と、(ロ)シリコーン、シリコーンアルキツド、シリ
コーンポリエステル、シリコーンアクリル、シリ
コーンエポキシ、シリコーンウレタンのようなシ
リコーン系樹脂と、(ハ)ガラス、アスベスト、カオ
リナイト、モンモリナイト等の粘土鉱物、雲母、
タルク、酸化アルミニウム、酸化ホウ素、酸化ジ
ルコニウム、酸化鉛、酸化亜鉛、酸化マグネシウ
ム、タングステンカーバイド、チタニウムカーバ
イド、モリブデンカーバイド、シリコンカーバイ
ド、ジルコニアチタン、ニトロケイ素、ニトロホ
ウ素、窒化ホウ素、アルミン酸ナトリウム、チタ
ン酸カリウム、ケイ酸カリウム、ケイ酸アルミニ
ウム、ケイ酸マグネシウム、ケイ酸亜鉛、ケイ酸
ジルコニウム、ケイ酸チタニウム、ケイ酸カリウ
ムアルミニウム、ケイ酸リチウムアルミニウム、
以上のうち数種の金属酸化物を混合溶融したセラ
ミツクフリツト等の無機充填剤の微粉末を、(イ)の
ポリボロシロキサン樹脂100重量部（以下単に部
と示す。）に対して(ロ)シリコーン系樹脂を５〜400
部、これらの合計量100部に対して(ハ)無機充填剤
を５〜300部の割合で配合し、前記有機溶剤中に
溶解又は分散させてなり、塗料として極めて常用
温度が高く優れた耐熱性を有する。
尚、この塗料のベースとなる(イ)ポリボロシロキ
サン樹脂は、主に(a)SiX4，SiRX3，SiRR′X2で表
わされるシラン化合物（但し、上式中Ｒ，R′は
アルキル基又はアリール基、Ｘは水酸基、アルコ
キシル基、アセトキシル基、ハロゲン基であつ
て、Ｘが水酸基の場合はその脱水縮合物も含む）
の１種又は２種以上と(b)ホウ酸、無水ホウ酸、ホ
ウ酸金属塩、ハロゲン化ホウ素、ホウ酸エステル
の１種又は２種以上とを、Si：Ｂの原子比で１：
10〜10：１好ましくは５：１〜１：５の範囲で50
〜800℃で加熱して縮重合させることにより得ら
れるものであり、この反応の溶剤として用いられ
るアセチルアセトン、無水酢酸、クレゾール、テ
トラヒドロフラン、キシレン、Ｎ−メチル−２−
ピロリドン、ジメチルアセトアミドのような有機
溶剤をそのまま塗料の溶剤として用いることもで
きる。またこの塗料はコイルの含浸用絶縁ワニス
として用いても、高い処理効果を得ることができ
る。
本発明の処理方法においては、以上に述べたよ
うなポリボロシロキサン樹脂系塗料を導体上に塗
布し焼付条件をコントロールすることにより塗膜
が完全に架橋硬化する前の段階で焼付け完了す
る。次いで得られた可撓性の良好な絶縁電線をコ
イル状に成形した後、250℃以上の温度で所定時
間加熱処理を行ないアンダーキユア状態の塗膜を
完全に架橋硬化させ、しかる後全体をポリボロシ
ロキサン樹脂系塗料中に含浸し加熱してポリボロ
シロキサン樹脂系塗料層を乾燥固化させる方法が
採られる。
（発明の実施例）
次に本発明の実施例について記載する。
実施例 １〜２
まず以下のようにしてポリボロシロキサン樹脂
溶液を調整し、これを用いて絶縁電線を製造し
た。
〔ポリボロシロキサン樹脂溶液の調整〕
ジフエニルジヒドロキシシラン432ｇ（２モ
ル）、ホウ酸83ｇ（1.3モル）、粘度（25℃）が10
センチストークスのジメチルシリコーンオイル
256ｇをフラスコに入れ、窒素雰囲気中で撹拌下
に室温から400℃まで６時間を要して昇温させ、
更に400℃で１時間加熱撹拌して縮重合反応を行
つた。反応過程で66ｇの水と70ｇの未反応の低分
子量シリコーンオイルが溜出除去された。
得られた反応生成物は常温で無色固形状であつ
て、収量は525ｇであつた。
上記反応生成物をＮ−メチル−２−ピロリドン
に溶解させて不揮発分（250℃×0.5h＋300℃×
1h）45.6％の樹脂溶液とした。
〔絶縁電線No.１の製造〕
前記ポリボロシロキサン樹脂溶液333ｇと、東
芝シリコーンTSR116（東芝シリコーン社製、フ
エニルメチルシリコーン樹脂のキシレン50％溶液
の商品名）300ｇと、酸化マグネシウム（MgO）
120ｇおよびＮ−メチル−２−ピロリドン300ｇと
を混合して耐熱塗料を得た〔ポリボロシロキサ
ン：シリコーン樹脂：MgO〔固形分比〕＝50：
50：40〕。
この耐熱塗料を、炉長7.4ｍの縦型焼付機を用
いて、焼付温度450℃、焼付線速4.0ｍ／分、塗布
回数６回の条件で直径1.0mmのニツケルメツキ
（メツキ厚1.5μ）銅線上に塗布焼付けし、更に空
焼温度450℃、線速4.0ｍ／分の条件で３回空焼き
を繰返し絶縁電線を得た。得られた絶縁電線の特
性を第１表に示す。
(Technical Field of the Invention) The present invention relates to a method for impregnating a coil without reducing insulation properties. (Technical Background of the Invention) It is known that the characteristics of insulated wires, which are generally made by coating and baking electrical insulating paint on a conductor, vary greatly depending on the degree of baking, even when the same type of insulating paint is used. . In other words, if the baking is insufficient and the coating is undercured, the flexibility will be good but the solvent resistance will be insufficient.On the other hand, if the baking is excessive and the coating is overcured, the solvent resistance will be poor. is good, but the flexibility is poor. This tendency for characteristics to depend on the degree of seizure is particularly noticeable in insulated wires using large conductors with a diameter of 1.0 mm or more. On the other hand, paints made by dissolving or dispersing polyborosiloxane resins, silicone resins, and inorganic fillers in organic solvents have been developed in recent years, and are being widely used as heat-resistant electrical insulation paints in the field of manufacturing insulated wires. Insulated wires made by coating and baking this paint have extremely superior heat resistance and solvent resistance compared to those with conventional organic insulation coatings, but on the other hand, the mechanical strength due to the flexibility of the coating film is slightly lower. Therefore, in applications that require sufficient flexibility, such as when used as a coil, it is necessary to stop baking while the coating film is in an undercured state and improve flexibility before molding. It is. (Problems with the background technology) However, in such insulated wires,
Since the solvent resistance of the coating film was insufficient, there was a problem in that the electrical insulation properties were extremely reduced during the impregnation treatment step after coil winding. In other words, when a coil is generally manufactured using insulated wire, the entire coil is impregnated in insulation treatment varnish and dried to solidify into one piece in order to further improve the mechanical properties and electrical insulation properties of the coil. However, the problem was that the organic solvent in the treated varnish caused the coating to dissolve and blister, resulting in a significant drop in insulation properties. (Object of the Invention) The present invention has been made to solve these difficulties, and an object of the present invention is to provide an impregnation treatment method for obtaining a coil with good electrical insulation. (Summary of the Invention) That is, the present invention applies a polyborosiloxane resin paint made by dissolving or dispersing a polyborosiloxane resin, a silicone resin, and an inorganic filler in an organic solvent onto a conductor, and leaves the paint film in an undercured state. After stopping baking, the insulated wire is formed into a coil shape, heat treated at a temperature of 250°C or higher for a predetermined period of time, and then the whole is impregnated in polyborosiloxane resin paint to form a polyborosiloxane resin paint layer. This is a coil impregnation treatment method characterized by firing a coil. In the present invention, the polyborosiloxane resin paint used for manufacturing insulated wires before coil forming is as follows:
In particular, a polyborosiloxane resin paint is used, which is prepared by dissolving or dispersing the ingredients described below in a polar solvent such as N-methyl-2-pyrrolidone and dimethylacetamide, or an organic solvent such as a phenolic solvent. In other words, this paint contains (a) polyborosiloxane resin, (b) silicone resin such as silicone, silicone alkyd, silicone polyester, silicone acrylic, silicone epoxy, and silicone urethane, and (c) glass, asbestos, and kaolinite. , clay minerals such as montmorinite, mica,
Talc, aluminum oxide, boron oxide, zirconium oxide, lead oxide, zinc oxide, magnesium oxide, tungsten carbide, titanium carbide, molybdenum carbide, silicon carbide, zirconia titanium, nitrosilicon, nitroboron, boron nitride, sodium aluminate, titanic acid Potassium, potassium silicate, aluminum silicate, magnesium silicate, zinc silicate, zirconium silicate, titanium silicate, potassium aluminum silicate, lithium aluminum silicate,
A fine powder of an inorganic filler such as ceramic frit made by mixing and melting several of the metal oxides mentioned above is added to 100 parts by weight of the polyborosiloxane resin (a) (hereinafter simply referred to as parts). ) Silicone resin 5 to 400
(c) Inorganic filler is blended at a ratio of 5 to 300 parts with respect to 100 parts of the total amount, and dissolved or dispersed in the organic solvent, and has excellent heat resistance as a paint with extremely high common temperatures. have sex. Note that (a) polyborosiloxane resin, which is the base of this paint, is mainly a silane compound represented by (a) SiX 4 , SiRX 3 , SiRR'X 2 (in the above formula, R and R' are alkyl groups). or an aryl group;
and (b) one or more of boric acid, boric anhydride, boric acid metal salt, boron halide, and boric acid ester in an atomic ratio of Si:B of 1:
50 in the range of 10-10:1 preferably 5:1-1:5
It is obtained by condensation polymerization by heating at ~800℃, and the solvent used for this reaction is acetylacetone, acetic anhydride, cresol, tetrahydrofuran, xylene, N-methyl-2-
Organic solvents such as pyrrolidone and dimethylacetamide can also be used as they are as paint solvents. Further, this paint can also be used as an insulating varnish for impregnating coils to obtain high treatment effects. In the treatment method of the present invention, the polyborosiloxane resin paint as described above is applied onto the conductor and the baking conditions are controlled to complete baking before the coating film is completely crosslinked and hardened. Next, the obtained insulated wire with good flexibility is formed into a coil shape, and then heat treated at a temperature of 250°C or higher for a predetermined period of time to completely crosslink and cure the undercured coating, and then the whole is made of polyborosamide. A method is adopted in which the polyborosiloxane resin paint layer is dried and solidified by impregnating it into a siloxane resin paint and heating it. (Examples of the invention) Next, examples of the invention will be described. Examples 1 to 2 First, a polyborosiloxane resin solution was prepared as follows, and an insulated wire was manufactured using this. [Preparation of polyborosiloxane resin solution] Diphenyldihydroxysilane 432g (2 mol), boric acid 83g (1.3 mol), viscosity (25°C) 10
centistokes dimethyl silicone oil
256g was placed in a flask and the temperature was raised from room temperature to 400°C over 6 hours under stirring in a nitrogen atmosphere.
The mixture was further heated and stirred at 400°C for 1 hour to carry out a polycondensation reaction. During the reaction process, 66 g of water and 70 g of unreacted low molecular weight silicone oil were distilled off. The obtained reaction product was a colorless solid at room temperature, and the yield was 525 g. The above reaction product was dissolved in N-methyl-2-pyrrolidone, and the non-volatile content (250°C x 0.5h + 300°C x
1h) 45.6% resin solution. [Production of No. 1 insulated wire] 333 g of the above polyborosiloxane resin solution, 300 g of Toshiba Silicone TSR116 (manufactured by Toshiba Silicone Co., Ltd., trade name of 50% xylene solution of phenylmethyl silicone resin), and magnesium oxide (MgO).
A heat-resistant paint was obtained by mixing 120 g and 300 g of N-methyl-2-pyrrolidone [polyborosiloxane: silicone resin: MgO [solid content ratio] = 50:
50:40]. This heat-resistant paint was applied to 1.0 mm diameter nickel plating (1.5 μm plating thickness) copper using a vertical baking machine with a furnace length of 7.4 m at a baking temperature of 450°C, a baking line speed of 4.0 m/min, and 6 coats. The insulated wire was coated and baked, and then baked three times at a baking temperature of 450° C. and a wire speed of 4.0 m/min to obtain an insulated wire. Table 1 shows the properties of the obtained insulated wire.
【表】【table】
TSR116 100部と酸化マグネシウム45部を混合
して得られた塗料を直径1.0mmのニツケルメツキ
（メツキ厚1.5μ）銅線上に塗布し、No.１の絶縁電
線と同様な条件で焼付けを行なつて絶縁電線を得
た。この絶縁電線の特性を第２表に示す。
A paint obtained by mixing 100 parts of TSR116 and 45 parts of magnesium oxide was applied onto a 1.0 mm diameter nickel plating (plating thickness 1.5 μm) copper wire and baked under the same conditions as the No. 1 insulated wire. Obtained insulated wire. The characteristics of this insulated wire are shown in Table 2.
【表】
次にこれらの絶縁電線を用いてツイストペアを
作り、これらを第３表に示す条件で加熱処理した
後、前述の絶縁電線No.１の製造に使用した耐熱塗
料中に10分間浸漬し、次いで250℃から400℃まで
15分間かけて昇温して含浸層を焼成した。処理後
のツイストペアの絶縁抵抗を第３表に示す。
尚、第３表中比較例は、No.１およびNo.２の絶縁
電線でツイストペアを成形し、その後加熱処理を
行なうことなくそのまま絶縁処理を行なつたもの
でり、比較のために挙げたものである。[Table] Next, twisted pairs were made using these insulated wires, and after being heat treated under the conditions shown in Table 3, they were immersed for 10 minutes in the heat-resistant paint used to manufacture the above-mentioned insulated wire No. 1. , then from 250℃ to 400℃
The impregnated layer was baked by increasing the temperature over 15 minutes. Table 3 shows the insulation resistance of the twisted pair after treatment. The comparative examples in Table 3 are those in which a twisted pair was formed using the No. 1 and No. 2 insulated wires, and then insulation treatment was performed without heat treatment. It is something.
【表】
（発明の効果）
以上の実施例からも明らかなように、本発明の
方法によれば、絶縁処理ワニスでの含浸処理工程
で塗膜の溶解やふくれが生じることがなく、電気
絶縁性に優れ耐熱性の高い絶縁コイルを得ること
ができる。[Table] (Effects of the invention) As is clear from the above examples, according to the method of the present invention, the coating film does not dissolve or blister during the impregnation treatment process with the insulation treatment varnish, and the electrical insulation An insulated coil with excellent properties and high heat resistance can be obtained.
Claims (1)
ン樹脂と無機質充填剤を有機溶剤に溶解または分
散させてなるポリボロシロキサン樹脂系塗料を塗
布し、アンダーキユア状態に焼きつけてなる絶縁
電線をコイル状に成型し、これを250℃以上の温
度で加熱処理した後、全体を前記ポリボロシロキ
サン樹脂系塗料で含浸処理をし、次いでこれを焼
成することを特徴とするコイルの含浸処理方法。1. A polyborosiloxane resin paint made by dissolving or dispersing polyborosiloxane resin, silicone resin, and inorganic filler in an organic solvent is applied to the conductor, and an insulated wire is formed by baking it into an undercured state and forming it into a coil shape. A method for impregnating a coil, comprising heating the coil at a temperature of 250° C. or higher, impregnating the entire body with the polyborosiloxane resin paint, and then firing the coil.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9447182A JPS58212114A (en) | 1982-06-02 | 1982-06-02 | Impregnation treatment of coil |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9447182A JPS58212114A (en) | 1982-06-02 | 1982-06-02 | Impregnation treatment of coil |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS58212114A JPS58212114A (en) | 1983-12-09 |
| JPH0155567B2 true JPH0155567B2 (en) | 1989-11-27 |
Family
ID=14111190
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP9447182A Granted JPS58212114A (en) | 1982-06-02 | 1982-06-02 | Impregnation treatment of coil |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS58212114A (en) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0642418B2 (en) * | 1987-06-22 | 1994-06-01 | 株式会社東芝 | Heat resistant insulated wire |
| ITMI20111036A1 (en) * | 2011-06-09 | 2012-12-10 | F & B Internat S R L | MAGNETIC FIELD INDUCTOR |
| CN102664086B (en) * | 2012-05-30 | 2013-06-12 | 西北有色金属研究院 | Insulation processing method of MgB2 wire strip |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS50106157A (en) * | 1974-01-28 | 1975-08-21 | ||
| JPS56110217A (en) * | 1980-02-05 | 1981-09-01 | Matsushita Electric Ind Co Ltd | Manufacture of electromagnetic coil |
| JPS5736721A (en) * | 1980-08-13 | 1982-02-27 | Showa Electric Wire & Cable Co |
-
1982
- 1982-06-02 JP JP9447182A patent/JPS58212114A/en active Granted
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS50106157A (en) * | 1974-01-28 | 1975-08-21 | ||
| JPS56110217A (en) * | 1980-02-05 | 1981-09-01 | Matsushita Electric Ind Co Ltd | Manufacture of electromagnetic coil |
| JPS5736721A (en) * | 1980-08-13 | 1982-02-27 | Showa Electric Wire & Cable Co |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS58212114A (en) | 1983-12-09 |
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