JPH04236269A - Electrically conductive coating material - Google Patents
Electrically conductive coating materialInfo
- Publication number
- JPH04236269A JPH04236269A JP3018465A JP1846591A JPH04236269A JP H04236269 A JPH04236269 A JP H04236269A JP 3018465 A JP3018465 A JP 3018465A JP 1846591 A JP1846591 A JP 1846591A JP H04236269 A JPH04236269 A JP H04236269A
- Authority
- JP
- Japan
- Prior art keywords
- powder
- weight
- average particle
- electrically conductive
- parts
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000463 material Substances 0.000 title claims abstract description 12
- 239000012799 electrically-conductive coating Substances 0.000 title abstract 2
- 239000000843 powder Substances 0.000 claims abstract description 91
- 239000002245 particle Substances 0.000 claims abstract description 19
- 239000000203 mixture Substances 0.000 claims abstract description 7
- 239000011521 glass Substances 0.000 claims description 15
- 239000011248 coating agent Substances 0.000 claims description 8
- 238000000576 coating method Methods 0.000 claims description 8
- 230000003647 oxidation Effects 0.000 abstract description 10
- 238000007254 oxidation reaction Methods 0.000 abstract description 10
- 238000012856 packing Methods 0.000 abstract description 5
- 230000006866 deterioration Effects 0.000 abstract 1
- 238000010304 firing Methods 0.000 description 21
- 238000007639 printing Methods 0.000 description 7
- 229920003002 synthetic resin Polymers 0.000 description 6
- 239000000057 synthetic resin Substances 0.000 description 6
- 239000000523 sample Substances 0.000 description 4
- LYCAIKOWRPUZTN-UHFFFAOYSA-N Ethylene glycol Chemical compound OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 description 3
- DNIAPMSPPWPWGF-UHFFFAOYSA-N Propylene glycol Chemical compound CC(O)CO DNIAPMSPPWPWGF-UHFFFAOYSA-N 0.000 description 3
- 239000011230 binding agent Substances 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 239000011159 matrix material Substances 0.000 description 3
- 238000000034 method Methods 0.000 description 3
- 238000002156 mixing Methods 0.000 description 3
- 238000007650 screen-printing Methods 0.000 description 3
- 239000000758 substrate Substances 0.000 description 3
- 239000001856 Ethyl cellulose Substances 0.000 description 2
- ZZSNKZQZMQGXPY-UHFFFAOYSA-N Ethyl cellulose Chemical compound CCOCC1OC(OC)C(OCC)C(OCC)C1OC1C(O)C(O)C(OC)C(CO)O1 ZZSNKZQZMQGXPY-UHFFFAOYSA-N 0.000 description 2
- PEDCQBHIVMGVHV-UHFFFAOYSA-N Glycerine Chemical compound OCC(O)CO PEDCQBHIVMGVHV-UHFFFAOYSA-N 0.000 description 2
- WUOACPNHFRMFPN-UHFFFAOYSA-N alpha-terpineol Chemical compound CC1=CCC(C(C)(C)O)CC1 WUOACPNHFRMFPN-UHFFFAOYSA-N 0.000 description 2
- SQIFACVGCPWBQZ-UHFFFAOYSA-N delta-terpineol Natural products CC(C)(O)C1CCC(=C)CC1 SQIFACVGCPWBQZ-UHFFFAOYSA-N 0.000 description 2
- 238000001035 drying Methods 0.000 description 2
- 235000019325 ethyl cellulose Nutrition 0.000 description 2
- 229920001249 ethyl cellulose Polymers 0.000 description 2
- 238000004898 kneading Methods 0.000 description 2
- 239000003973 paint Substances 0.000 description 2
- 239000002904 solvent Substances 0.000 description 2
- 229940116411 terpineol Drugs 0.000 description 2
- 239000004925 Acrylic resin Substances 0.000 description 1
- 229920000178 Acrylic resin Polymers 0.000 description 1
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- 229920002134 Carboxymethyl cellulose Polymers 0.000 description 1
- 230000002411 adverse Effects 0.000 description 1
- 238000000889 atomisation Methods 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 238000009835 boiling Methods 0.000 description 1
- 229910052799 carbon Inorganic materials 0.000 description 1
- 239000001768 carboxy methyl cellulose Substances 0.000 description 1
- 235000010948 carboxy methyl cellulose Nutrition 0.000 description 1
- 239000008112 carboxymethyl-cellulose Substances 0.000 description 1
- 239000001913 cellulose Substances 0.000 description 1
- 229920002678 cellulose Polymers 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 230000001747 exhibiting effect Effects 0.000 description 1
- 239000000835 fiber Substances 0.000 description 1
- 235000011187 glycerol Nutrition 0.000 description 1
- 125000002887 hydroxy group Chemical group [H]O* 0.000 description 1
- 239000000155 melt Substances 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 229920000609 methyl cellulose Polymers 0.000 description 1
- 239000001923 methylcellulose Substances 0.000 description 1
- 239000003960 organic solvent Substances 0.000 description 1
- WXZMFSXDPGVJKK-UHFFFAOYSA-N pentaerythritol Chemical compound OCC(CO)(CO)CO WXZMFSXDPGVJKK-UHFFFAOYSA-N 0.000 description 1
- 229920003023 plastic Polymers 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 229920000728 polyester Polymers 0.000 description 1
- 238000005507 spraying Methods 0.000 description 1
- 229920002803 thermoplastic polyurethane Polymers 0.000 description 1
Abstract
Description
【０００１】0001
【産業上の利用分野】本発明は電子回路用電極や配線導
体の形成に用いられる導電性ペーストや導電性塗料磁気
シールド塗料等に用いられる導電性コーティング材料に
関するものである。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to conductive coating materials used in conductive pastes, conductive paints, magnetic shield paints, etc. used in the formation of electronic circuit electrodes and wiring conductors.
【０００２】0002
【従来の技術】例えばプラズマディスプレーにあっては
ガラス製のバックプレート側に電極（陰極）をプリント
形成し、カバープレート側に透明電極（陽極）を該陰極
と対向して形成し、両電極間に電圧を印加して放電・発
色させるものである。[Prior Art] For example, in a plasma display, an electrode (cathode) is printed on the glass back plate side, a transparent electrode (anode) is formed on the cover plate side facing the cathode, and a space between the two electrodes is formed. A voltage is applied to the battery to cause it to discharge and develop color.
【０００３】上記電極をバックプレート側に形成するに
は金属粉末を合成樹脂溶液であるビヒクルに分散した導
電性ペーストを該バックプレート表面にスクリーン印刷
等により厚膜印刷層を形成し、乾燥した後大気中で焼成
して導電性の焼成膜とする方法が採用されている。[0003] In order to form the above-mentioned electrode on the back plate side, a thick film printing layer is formed on the surface of the back plate by screen printing or the like with a conductive paste in which metal powder is dispersed in a vehicle which is a synthetic resin solution, and after drying. A method of firing in the atmosphere to form a conductive fired film has been adopted.
【０００４】従来から上記導電性ペーストにはＮｉ 粉
末が用いられていたが、上記のように大気中で焼成する
際にＮｉ が酸化し、該焼成膜の導電性が失われると云
う問題があり、これを防止するためにＮｉ 粉末にＢ粉
末を添加した導電性ペーストが提供されている（特公昭
６０−１６０４１号）。Conventionally, Ni powder has been used in the conductive paste, but as mentioned above, there is a problem in that the Ni oxidizes during firing in the atmosphere and the fired film loses its conductivity. In order to prevent this, a conductive paste in which B powder is added to Ni powder has been provided (Japanese Patent Publication No. 16041/1986).
【０００５】上記導電性ペーストによる厚膜印刷層にあ
っては大気中での焼成によりＢ粉末が選択的に酸化され
てＢ２Ｏ３となり、その結果Ｎｉ 粉末の酸化が防止さ
れるのである。[0005] In the thick film printed layer made of the conductive paste, the B powder is selectively oxidized to B2O3 by firing in the atmosphere, and as a result, oxidation of the Ni powder is prevented.
【０００６】[0006]
【発明が解決しようとする課題】しかしながら上記従来
の導電性ペーストにあってはＮｉ 粉末の粒径が大きい
と厚膜印刷層を印刷する時の印刷性が悪化するし、焼成
膜内のＮｉ 粒子の充填密度が小さく導電性が低下する
。一方Ｎｉ 粉末の粒径が小さいと焼成膜内のＮｉ 粒
子の充填密度は大きくなるが、Ｎｉ 粒子の総表面積が
大きくなる結果Ｂ粉末が存在するにも関わらず焼成中に
Ｎｉ 粒子が酸化され易くなる。[Problems to be Solved by the Invention] However, in the conventional conductive paste described above, if the particle size of the Ni powder is large, the printability when printing a thick film printing layer deteriorates, and the Ni particles in the fired film deteriorate. The packing density is small and the conductivity is reduced. On the other hand, when the particle size of the Ni powder is small, the packing density of the Ni particles in the fired film increases, but as a result of the increased total surface area of the Ni particles, the Ni particles are easily oxidized during firing despite the presence of the B powder. Become.
【０００７】[0007]
【課題を解決するための手段】本発明は上記従来の課題
を解決するための手段として、Ｎｉ 粉末、Ｂ粉末、ガ
ラスフリット、およびビヒクルからなり、該Ｎｉ 粉末
は平均粒径３μｍ以上の粗粉末と平均粒径２μｍ以下の
微粉末との重量比率が３０：７０から８０：２０である
混合物であり、該Ｂ粉末はＮｉ粉末とＢ粉末との合計を
１００重量部とした場合２．０から１０重量部の範囲で
含まれる導電性コーティング材料を提供するものである
。[Means for Solving the Problems] As a means for solving the above conventional problems, the present invention consists of Ni powder, B powder, glass frit, and a vehicle, and the Ni powder is a coarse powder with an average particle size of 3 μm or more. and a fine powder with an average particle size of 2 μm or less in a weight ratio of 30:70 to 80:20. Conductive coating materials in the range of 10 parts by weight are provided.
【０００８】本発明を以下に詳細に説明する。本発明に
用いられるＮｉ 粉末は平均粒径３μｍ以上の粗粉末と
平均粒径２μｍ以下の微粉末との混合物であり、該混合
物中の粗粉末と微粉末との混合比率は３０：７０から８
０：２０とされている。またＢ粉末はＮｉ 粉末とＢ粉
末との合計を１００重量部とした場合２．０から１０重
量部の範囲で含まれる。The present invention will be explained in detail below. The Ni powder used in the present invention is a mixture of coarse powder with an average particle size of 3 μm or more and fine powder with an average particle size of 2 μm or less, and the mixing ratio of the coarse powder and fine powder in the mixture is 30:70 to 8.
It is said to be 0:20. Further, the B powder is contained in an amount of 2.0 to 10 parts by weight when the total of Ni powder and B powder is 100 parts by weight.
【０００９】即ちＮｉ 粉末中に該粗粉末が３０重量％
以下、即ち該微粉末が７０重量％以上の割合で含まれて
いると、該Ｎｉ 粉末の総表面積が大きくなり、Ｂ粉末
存在下においても焼成中にＮｉ 粉末の酸化が起こり易
く、一方Ｎｉ 粉末中に該粗粉末が８０重量％以上、即
ち該微粉末が２０重量％以下の割合で含まれていると、
導電性コーティング材料の印刷性が悪化し、また形成さ
れる厚膜印刷層中のＮｉ 粉末の充填密度が小さくなり
良好な導電性が得られなくなる。That is, the coarse powder is 30% by weight in the Ni powder.
Below, if the fine powder is contained in a proportion of 70% by weight or more, the total surface area of the Ni powder becomes large, and oxidation of the Ni powder tends to occur during firing even in the presence of the B powder; When the coarse powder is contained in the proportion of 80% by weight or more, that is, the fine powder is contained in the proportion of 20% by weight or less,
The printability of the conductive coating material deteriorates, and the packing density of the Ni powder in the thick film printing layer that is formed becomes small, making it impossible to obtain good conductivity.
【００１０】またＢ粉末が２．０重量部以下の割合で含
まれるとＢ粉末によるＮｉ 粉末の酸化防止効果が充分
でなく、一方１０重量部以上含まれていると形成される
厚膜印刷層の導電性が悪化する。Furthermore, if the B powder is contained in a proportion of 2.0 parts by weight or less, the effect of preventing the oxidation of the Ni powder by the B powder will not be sufficient, while if it is contained in a proportion of 10 parts by weight or more, a thick film printed layer will be formed. conductivity deteriorates.
【００１１】本発明に用いられるガラスフリットは５５
０℃以下の軟化点を有するものが望ましい。何となれば
上記Ｂ粉末が活性化される温度は５５０℃からであり、
したがって厚膜印刷層の焼成温度も５５０℃以上とされ
るので、焼成時ガラスフリットが充分軟化するためには
ガラスフリットの軟化点は５５０℃以下が望ましい。し
かしガラスフリットが４００℃以下の軟化点を有する場
合には焼成中のガラスフリットの軟化が著しく厚膜印刷
層の変形を惹起するおそれがあるし、また厚膜印刷層の
耐熱性も低下する。該ガラスフリットは通常Ｎｉ 粉末
とＢ粉末との合計を１００重量部とした場合に５〜１５
重量部の範囲で添加される。何となればガラスフリット
はＮｉ 粉末のバインダーとしての役目を果たすもので
、５重量部以下の添加量ではバインダー効果が小さく、
一方１５重量部以上の添加量ではＮｉ 粉末を希釈して
導電性に悪影響を与える。The glass frit used in the present invention is 55
It is desirable to have a softening point of 0°C or lower. The reason is that the temperature at which the B powder is activated is from 550°C.
Therefore, since the firing temperature of the thick film printing layer is also set at 550°C or higher, the softening point of the glass frit is preferably 550°C or lower in order to sufficiently soften the glass frit during firing. However, if the glass frit has a softening point of 400° C. or lower, the softening of the glass frit during firing may cause significant deformation of the thick film print layer, and the heat resistance of the thick film print layer may also decrease. The glass frit usually contains 5 to 15 parts by weight when the total of Ni powder and B powder is 100 parts by weight.
It is added in a range of parts by weight. The reason is that glass frit serves as a binder for Ni powder, and if the amount added is less than 5 parts by weight, the binder effect is small.
On the other hand, if the amount added is 15 parts by weight or more, the Ni powder will be diluted and the conductivity will be adversely affected.
【００１２】本発明のビヒクルは合成樹脂溶液であり、
使用される合成樹脂としてはメチルセルロース、エチル
セルロース、メトキシセルロース、エトキシセルロース
、カルボキシメチルセルロース等のセルロース誘導体、
その他アクリル樹脂、ウレタン樹脂等の焼成によりカー
ボンを厚膜印刷層中に残存させない合成樹脂を選択する
ことが望ましい。また該合成樹脂を溶解させる溶剤とし
てはエチレングリコール、プロピレングリコール、グリ
セリン、ペンタエリスリトール、テルピネオール等の水
酸基を有する還元性の高沸点有機溶剤を選択することが
望ましい。The vehicle of the present invention is a synthetic resin solution,
Synthetic resins used include cellulose derivatives such as methylcellulose, ethylcellulose, methoxycellulose, ethoxycellulose, and carboxymethylcellulose;
In addition, it is desirable to select synthetic resins such as acrylic resins and urethane resins that do not leave carbon in the thick film printing layer when fired. As the solvent for dissolving the synthetic resin, it is desirable to select a reducing high-boiling organic solvent having a hydroxyl group such as ethylene glycol, propylene glycol, glycerin, pentaerythritol, or terpineol.
【００１３】本発明の導電性コーティング材料は上記成
分を三本ロールミル、ボールミル、アトライター等の混
練機により混練することによって調製され、ガラス、セ
ラミック、プラスチック等の基板にスクリーン印刷、ス
プレー等により通常１０〜３０μｍの膜厚に塗布され、
上記したようにＢ粉末の活性化する５５０℃以上の温度
で焼成される。しかし焼成温度が６５０℃以上になると
Ｂ粉末存在下でもＮｉ 粉末の酸化が起こるおそれがあ
るので望ましい焼成温度は５５０℃〜６５０℃とする。
焼成は大気中で行なう。焼成によりビヒクルを構成する
溶剤および合成樹脂は揮散し、ガラスフリットは溶融し
てＮｉ 粉末を分散したマトリクスを形成する。そして
Ｂ粉末はＢ２Ｏ３となりマトリクス中に混合される。こ
のようにして基材表面に導電性かつ磁気シールド性の焼
成膜が形成される。The conductive coating material of the present invention is prepared by kneading the above components using a kneading machine such as a three-roll mill, a ball mill, or an attriter, and is usually applied to a substrate such as glass, ceramic, or plastic by screen printing, spraying, etc. It is applied to a film thickness of 10 to 30 μm,
As described above, the B powder is fired at a temperature of 550° C. or higher, which activates the B powder. However, if the firing temperature is 650°C or higher, oxidation of the Ni powder may occur even in the presence of the B powder, so the preferred firing temperature is 550°C to 650°C. Firing is performed in the atmosphere. By firing, the solvent and synthetic resin constituting the vehicle are volatilized, and the glass frit is melted to form a matrix in which Ni powder is dispersed. Then, the B powder becomes B2O3 and is mixed into the matrix. In this way, an electrically conductive and magnetically shielding fired film is formed on the surface of the base material.
【００１４】[0014]
【作用】本発明の導電性コーティング材料は例えば導電
性ペーストとして基板上にスクリーン印刷により厚膜印
刷されるが、この際、Ｎｉ 粉末中の平均粒径３μｍ以
上の粗粉末は８０重量％以下の混合比であるから印刷性
は悪化しない。また形成された厚膜印刷層内においては
Ｎｉ 粉末中の平均粒径が２μｍ以下の微粉末は７０重
量％以下の混合比であるから該Ｎｉ 粉末の総表面積は
過大とならず焼成中にＮｉ の酸化が起こりにくい。し
かし該微粉末はＮｉ 粉末中に２０重量％以上含まれて
おり、該微粉末は粗粉末相互の間隙を充填し、その結果
得られた導電性焼成膜中のＮｉ 粉末の充填密度は高く
なり、良好な導電性が得られる。[Operation] The conductive coating material of the present invention is thick-film printed on a substrate by screen printing, for example, as a conductive paste. At this time, the coarse powder with an average particle size of 3 μm or more in the Ni powder accounts for 80% by weight or less. Printability does not deteriorate because of the mixing ratio. In addition, in the formed thick film printing layer, since the fine powder with an average particle size of 2 μm or less in the Ni powder is mixed at a mixing ratio of 70% by weight or less, the total surface area of the Ni powder does not become excessive, and the Ni powder is removed during firing. oxidation is less likely to occur. However, the fine powder is contained in the Ni powder in an amount of 20% by weight or more, and the fine powder fills the gaps between the coarse powders, resulting in a high packing density of the Ni powder in the resulting conductive fired film. , good conductivity can be obtained.
【００１５】一方Ｂは厚膜印刷層内中Ｎｉ 粉末とＢ粉
末との合計を１００重量部とした場合、２．０重量部以
上含まれているので、該厚膜印刷層を大気中で焼成した
時選択的に酸化されてＢ２Ｏ３となりＮｉ 粉末の酸化
を防止する。しかしＢ粉末は１０重量部以下とされてい
るので得られる導電性焼成膜の導電性はＢ粉末により阻
害されない。On the other hand, since B is contained in an amount of 2.0 parts by weight or more when the total of Ni powder and B powder in the thick film printed layer is 100 parts by weight, the thick film printed layer is baked in the atmosphere. When this happens, it is selectively oxidized to become B2O3, which prevents the oxidation of the Ni powder. However, since the amount of B powder is 10 parts by weight or less, the conductivity of the resulting conductive fired film is not inhibited by the B powder.
【００１６】ガラスフリットは焼成中に溶融してＮｉ
粉末を被覆して空気との直接接触を阻止しＮｉ 粉末の
酸化を防止し、また導電性焼成膜中ではＮｉ 粉末を分
散したマトリクスを形成してＮｉ 粉末に対するバイン
ダーとしての役目を果たす。[0016] The glass frit melts during firing and becomes Ni.
The powder is coated to prevent direct contact with air to prevent oxidation of the Ni powder, and in the conductive fired film, a matrix in which the Ni powder is dispersed is formed to serve as a binder for the Ni powder.
【００１７】[0017]
【実施例】Ｎｉ 粉末としてアトマイズ法により製造し
た平均粒径１１．５μｍの粗粉末と、湿式還元法で製造
した平均粒径０．８μｍの微粉末との混合物を用い、Ｂ
粉末として平均粒径０．７μｍのアモルファスタイプの
ものを用いた。更にガラスフリットとしては軟化点４４
０℃のものを用い、ビヒクルとしてはエチルセルロース
のテルピネオール溶液を用いた。[Example] Using a Ni powder, a mixture of a coarse powder with an average particle size of 11.5 μm produced by an atomization method and a fine powder with an average particle diameter of 0.8 μm produced by a wet reduction method was used.
An amorphous type powder with an average particle size of 0.7 μm was used. Furthermore, as a glass frit, the softening point is 44.
A temperature of 0° C. was used, and a terpineol solution of ethyl cellulose was used as the vehicle.
【００１８】上記成分は表１に示す組成で混合され、三
本ロールミルにより混練して導電性ペーストサンプルＮ
ｏ．１〜Ｎｏ．１１を調製した。The above components were mixed in the composition shown in Table 1 and kneaded in a three-roll mill to form conductive paste sample N.
o. 1~No. 11 was prepared.
【表１】[Table 1]
【００１９】上記サンプルＮｏ．１〜Ｎｏ．１１はガラ
ス基板表面に♯２００ポリエステル繊維製スクリーンを
用いて巾５ｍｍ、長さ２０ｍｍの短冊形に印刷され、２
００℃で乾燥した後６１０℃×１０分の大気中での焼成
を３回行ない、焼成のつど該焼成膜の表面抵抗値（ｍΩ
／□）を４探針法（共和理研製抵抗測定器７０５ＲＬ）
で測定するとともに該焼成膜の表面状態を肉眼で判断し
た。なお該焼成膜の厚さは２０μｍであった。その結果
を表２に示す。[0019] The above sample No. 1~No. 11 is printed in a rectangular shape with a width of 5 mm and a length of 20 mm using a #200 polyester fiber screen on the surface of the glass substrate, and 2
After drying at 00°C, baking was performed in the air at 610°C for 10 minutes three times, and the surface resistance value (mΩ) of the baked film was
/□) using the 4-probe method (Kyowa Riken resistance measuring device 705RL)
At the same time, the surface condition of the fired film was judged with the naked eye. Note that the thickness of the fired film was 20 μm. The results are shown in Table 2.
【表２】[Table 2]
【００２０】表２によれば、本発明のサンプルＮｏ．１
〜Ｎｏ．７は焼成回数によらず安定して低い抵抗値を示
すが、微粉末を７０重量％以上含むＮｏ．８ではＮｉ
粉末の酸化が進む結果高抵抗値を示し、しかも焼成回数
により抵抗値が大きく変化し、粗粉末を８０重量％以上
含むＮｏ．９では同様に焼成回数により不安定な高抵抗
値を示し、またＢ粉末を２重量部以下で含むＮｏ．１０
ではＮｉ 粉末は殆ど酸化されて非導電性となり、Ｂ粉
末を１０重量部以上でで含むＮｏ．１１は焼成回数によ
り不安定な高抵抗値を示す。According to Table 2, sample No. of the present invention. 1
~No. No. 7 shows a stable low resistance value regardless of the number of firings, but No. 7, which contains 70% by weight or more of fine powder, shows a stable low resistance value regardless of the number of firings. In 8, Ni
As a result of the oxidation of the powder, it shows a high resistance value, and the resistance value changes greatly depending on the number of firings. Similarly, No. 9 showed an unstable high resistance value depending on the number of firing times, and No. 9 contained B powder in an amount of 2 parts by weight or less. 10
In No. 2, most of the Ni powder is oxidized and becomes non-conductive, and in No. 1 containing 10 parts by weight or more of B powder. No. 11 shows an unstable high resistance value depending on the number of firings.
【００２１】[0021]
【考案の効果】したがって本発明の導電性コーティング
材料による塗膜は焼成によってもＮｉ 粉末の酸化が防
止され、良好な導電性を示す焼成膜が得られる。また繰
り返し焼成によっても導電性の変化が少なく安定であり
、このような特徴は特に繰り返し焼成の行なわれるプラ
ズマディスプレーの電極形成材料として有用である。[Effects of the Invention] Therefore, in the coating film made of the conductive coating material of the present invention, oxidation of the Ni powder is prevented even when fired, and a fired film exhibiting good conductivity can be obtained. In addition, it is stable with little change in conductivity even after repeated firing, and these characteristics make it particularly useful as an electrode-forming material for plasma displays that undergo repeated firing.
Claims (1)
よびビヒクルからなり、該Ｎｉ 粉末は平均粒径３μｍ
以上の粗粉末と平均粒径２μｍ以下の微粉末との重量比
率が３０：７０から８０：２０である混合物であり、該
Ｂ粉末はＮｉ 粉末とＢ粉末との合計を１００重量部と
した場合２．０から１０重量部の範囲で含まれることを
特徴とする導電性コーティング材料Claim 1: Consisting of Ni powder, B powder, glass frit, and vehicle, the Ni powder has an average particle size of 3 μm.
It is a mixture of the above coarse powder and fine powder with an average particle size of 2 μm or less in a weight ratio of 30:70 to 80:20, and the B powder is a mixture where the total of Ni powder and B powder is 100 parts by weight. 2.0 to 10 parts by weight of a conductive coating material
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3018465A JPH04236269A (en) | 1991-01-17 | 1991-01-17 | Electrically conductive coating material |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3018465A JPH04236269A (en) | 1991-01-17 | 1991-01-17 | Electrically conductive coating material |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH04236269A true JPH04236269A (en) | 1992-08-25 |
Family
ID=11972388
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP3018465A Pending JPH04236269A (en) | 1991-01-17 | 1991-01-17 | Electrically conductive coating material |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH04236269A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2007018884A (en) * | 2005-07-07 | 2007-01-25 | Noritake Co Ltd | Conductive paste |
| JP2015011979A (en) * | 2013-07-02 | 2015-01-19 | 大研化学工業株式会社 | Conductive paste for atmospheric firing, and method for manufacturing the same |
| WO2016075743A1 (en) * | 2014-11-10 | 2016-05-19 | 大研化学工業株式会社 | Conductive paste for atmospheric firing and method for producing same |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS51138898A (en) * | 1975-04-21 | 1976-11-30 | Engelhard Min & Chem | Base metal conductor which can be calcinated in atmosphere |
-
1991
- 1991-01-17 JP JP3018465A patent/JPH04236269A/en active Pending
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS51138898A (en) * | 1975-04-21 | 1976-11-30 | Engelhard Min & Chem | Base metal conductor which can be calcinated in atmosphere |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2007018884A (en) * | 2005-07-07 | 2007-01-25 | Noritake Co Ltd | Conductive paste |
| JP2015011979A (en) * | 2013-07-02 | 2015-01-19 | 大研化学工業株式会社 | Conductive paste for atmospheric firing, and method for manufacturing the same |
| WO2016075743A1 (en) * | 2014-11-10 | 2016-05-19 | 大研化学工業株式会社 | Conductive paste for atmospheric firing and method for producing same |
| KR20170043595A (en) * | 2014-11-10 | 2017-04-21 | 다이켄카가쿠 코교 가부시키가이샤 | Conductive paste for atmospheric firing and method for producing same |
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