JPH04225298A - Manufacture of board for multilayer printed-circuit - Google Patents
Manufacture of board for multilayer printed-circuitInfo
- Publication number
- JPH04225298A JPH04225298A JP2419308A JP41930890A JPH04225298A JP H04225298 A JPH04225298 A JP H04225298A JP 2419308 A JP2419308 A JP 2419308A JP 41930890 A JP41930890 A JP 41930890A JP H04225298 A JPH04225298 A JP H04225298A
- Authority
- JP
- Japan
- Prior art keywords
- printed wiring
- wiring boards
- inner layer
- guide
- layer printed
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 13
- 238000000034 method Methods 0.000 claims abstract description 7
- 238000010438 heat treatment Methods 0.000 claims abstract description 6
- 238000003475 lamination Methods 0.000 claims description 4
- 239000011888 foil Substances 0.000 claims description 2
- 238000010030 laminating Methods 0.000 claims description 2
- 239000010410 layer Substances 0.000 abstract description 29
- 239000011229 interlayer Substances 0.000 abstract description 3
- 239000000463 material Substances 0.000 abstract description 3
- 239000011347 resin Substances 0.000 description 5
- 229920005989 resin Polymers 0.000 description 5
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 4
- 238000010586 diagram Methods 0.000 description 4
- 239000010949 copper Substances 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000011889 copper foil Substances 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000007796 conventional method Methods 0.000 description 1
- 238000005553 drilling Methods 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 239000002648 laminated material Substances 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
Landscapes
- Reinforced Plastic Materials (AREA)
- Laminated Bodies (AREA)
- Casting Or Compression Moulding Of Plastics Or The Like (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
Abstract
Description
【０００１】0001
【産業上の利用分野】この発明は電子回路機器に用いら
れる多層プリント回路基板の製造法に関するものである
。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method of manufacturing a multilayer printed circuit board used in electronic circuit equipment.
【０００２】0002
【従来技術およびその問題点】５層以上の多層プリント
回路板は、一般に、内層用プリント回路板２枚以上を、
プリプレグを介し、銅箔または銅箔張積層板を少なくと
も１表面に配置して重ね合せ、全体を加熱加圧積層一体
化して多層プリント回路用基板を作成し、次いで層間を
回路接続させるためにスルーホール孔を開けてスルーホ
ール孔の壁面にスルーホール鍍金して接続し、外層に回
路パターンを形成する、等の種々の工程を経て、多層プ
リント回路板を得ている。このように、加熱加圧積層後
に外側からスルーホール孔を加工し、スルーホール孔の
壁面にスルーホール鍍金して、内層の層間および外層銅
箔との間を電気的に接続するので、内層プリント回路板
の層間位置は正確に合わせる必要があり、最低５０〜１
００ミクロン以下に保つ必要がある。そこで従来の製造
法はピンラミと称せられる方法が用いられている。六層
プリント回路基板を例にとると、第７図に説明するよう
に、位置合せ用のガイドビン１４，…，１４を立設した
上下合せ金型１０，１０′を用い、２枚の内層用両面プ
リント回路板１８，１９、２枚の外層用片面銅張積層基
板１６ａ，１６ｂ、および間に介装するプリプレグ１７
，１７，１７に、それぞれ位置合せ用のガイド孔を形成
して、下側金型１０に立設のガイドピン１４，…，１４
に下側外層用片面銅張積層板１６ａ、プリプレグ１７、
内層用両面プリント回路板１８、プリプレグ１７、内層
用両面プリント回路板１９、プリプレグ１７、上側外層
用片面銅張積層板１６ｂの順にそれぞれガイド孔に挿入
しながら位置合せして多層プリント回路基板１枚分を積
み重ね、必要により多数枚分を積み重ねる場合は間に予
めガイドピンが遊挿する孔を開けた鏡面板１５を介して
同様に積み重ね、最後に上側金型１０′を合わせて加圧
加熱し積層一体化することがおこなわれていて、内層用
両面プリント回路板２枚の層間の位置精度は約１００ミ
クロン以下とされている。しかしながら、この従来の多
層プリント回路基板の製造法は加圧加熱時にプリプレグ
１７，１７，１７の樹脂が流れ出てガイドピン１４，…
，１４の回りまで至り、更にプリプレグ樹脂の硬化によ
る収縮がガイドピンに大きなストレスとしてかかり強固
に接着する事態が発生する問題点がある。また、プリプ
レグ樹脂がガイドピンに一旦接着するとガイドピン１４
，…を取り外すことになるが、ガイドピンを取り外す作
業の際に、積層一体化物に金型１０，１０′の重量が加
算され大変に重いものを移動することが屡々必要になり
その移動作業に危険を伴うと云う問題点があると共に、
ガイドピンを取り外す等の解板作業に手間取ると云う問
題点もある。また、重量が重いために大型プレスでの成
形が難しく、量産性に劣ると云う問題もある。[Prior art and its problems] Multilayer printed circuit boards with five or more layers generally have two or more inner layer printed circuit boards,
A multilayer printed circuit board is created by placing copper foil or copper foil-clad laminates on at least one surface and laminating them together via prepreg, heating and pressurizing the whole to create a multilayer printed circuit board, and then through-laying the layers to make circuit connections. A multilayer printed circuit board is obtained through various steps such as drilling holes, through-hole plating and connection to the walls of the through-holes, and forming a circuit pattern on the outer layer. In this way, the through-holes are processed from the outside after lamination under heat and pressure, and the walls of the through-holes are plated to electrically connect between the inner layers and the outer copper foil, so the inner layer can be printed. The interlayer positions of the circuit board must be aligned accurately, at least 50 to 1
It is necessary to keep it below 0.00 microns. Therefore, as a conventional manufacturing method, a method called pin lamination is used. Taking a six-layer printed circuit board as an example, as illustrated in FIG. double-sided printed circuit boards 18, 19, two single-sided copper-clad laminate boards 16a, 16b for the outer layer, and a prepreg 17 interposed between them.
, 17, 17 are formed with guide holes for positioning, respectively, and guide pins 14, .
one-sided copper-clad laminate 16a for the lower outer layer, prepreg 17,
Double-sided printed circuit board 18 for inner layer, prepreg 17, double-sided printed circuit board 19 for inner layer, prepreg 17, and single-sided copper clad laminate 16b for upper outer layer are inserted into the guide holes in this order and aligned to form one multilayer printed circuit board. If necessary, if a large number of sheets are to be piled up, they are piled up in the same way through a mirror plate 15 in which a hole for a guide pin is loosely inserted, and finally the upper mold 10' is placed together and heated under pressure. Lamination and integration are performed, and the positional accuracy between the two inner-layer double-sided printed circuit boards is approximately 100 microns or less. However, in this conventional method of manufacturing a multilayer printed circuit board, the resin of the prepregs 17, 17, 17 flows out during pressurization and heating, and the guide pins 14, . . .
. In addition, once the prepreg resin is adhered to the guide pin, the guide pin 14
,... However, when removing the guide pins, the weight of the molds 10 and 10' is added to the integrated laminated product, and it is often necessary to move a very heavy object. There is a problem that it is dangerous, and
Another problem is that it takes time to perform plate disassembly work such as removing guide pins. Further, due to the heavy weight, it is difficult to mold using a large press, and there is also the problem that mass productivity is poor.
【０００３】0003
【問題点を解決するための手段】この発明は、上記問題
点を解決するために、内層用プリント配線板２枚以上を
、プリプレグを介し、導電箔または導電箔張積層板を少
なくとも１表面に配置して重ね合せ、鏡面板に挟んで熱
盤間で加熱加圧積層一体化する多層プリント回路用基板
の製造法において、鏡面板周辺の周囲四辺または対向二
辺に熱盤に対して垂直に立設されたガイドピンを有する
位置決め治具を配置し、内層用プリント配線板を鏡面板
に対して拡大幅に形成すると共に該拡大幅部に内層用プ
リント配線板相互間の位置合せ用のガイド孔を形成して
、該ガイド孔に前記位置決め治具のガイドピンを挿通さ
せて内層用プリント配線板相互の位置合せ状態を保ちつ
つ全体を加熱加圧積層一体化することを特徴とする多層
プリント回路用基板の製造法に構成したのである。位置
決め治具は、第３図に示すように棒状または環状に形成
したものである。棒状のものはこれを、第４図に示すよ
うに、環状に組合せ固定してもよくまた対向２列配置で
もよい。尚、対向２列配置する場合は、第４図（イ）に
示すように棒状体の端縁部に突出部３ａを形成すると垂
直安定性がよくなる。棒状または環状の位置決め治具は
、第５図に示すように、その断面が一般的には矩形であ
るが、長手方向にリブ３ｂを形成すると重量の増加を少
なくして補強できるので長尺物に対して変形が少なくな
る。また位置決め治具は加熱温度に対し寸法安定性に優
れたものが好ましく、高精度のものを要求する場合には
、第６図に示すように、芯材３１の両側に芯材の熱膨張
係数を補償する熱膨張係数の別材３２，３２で挟む積層
構造物を用いて位置決め治具を形成すると温度変化が極
めて少なくすることができる。[Means for Solving the Problems] In order to solve the above-mentioned problems, the present invention provides two or more inner layer printed wiring boards with conductive foil or conductive foil-clad laminates on at least one surface via prepreg. In the manufacturing method of multilayer printed circuit boards, which are arranged, stacked, sandwiched between mirror plates, and integrated by heating and pressurizing between hot platens, there are A positioning jig with upright guide pins is arranged to form the inner layer printed wiring board to an enlarged width with respect to the mirror plate, and a guide for positioning the inner layer printed wiring boards is placed in the enlarged width portion. A multilayer print, characterized in that a hole is formed and a guide pin of the positioning jig is inserted into the guide hole, and the entire printed wiring board for inner layers is laminated and integrated under heat and pressure while maintaining mutual alignment of the inner layer printed wiring boards. It was configured as a method for manufacturing circuit boards. The positioning jig is formed into a rod shape or an annular shape as shown in FIG. As shown in FIG. 4, the rod-shaped rods may be combined and fixed in a ring shape, or may be arranged in two rows facing each other. In the case of arranging the rods in two rows facing each other, vertical stability can be improved by forming protrusions 3a on the end edges of the rod-shaped bodies as shown in FIG. 4(a). As shown in Fig. 5, rod-shaped or annular positioning jigs generally have a rectangular cross section, but if ribs 3b are formed in the longitudinal direction, they can be reinforced with less increase in weight, so they can be used for long objects. deformation is reduced. In addition, it is preferable that the positioning jig has excellent dimensional stability with respect to the heating temperature.If a high-precision one is required, as shown in FIG. If the positioning jig is formed using a laminated structure sandwiched between separate materials 32, 32 having a coefficient of thermal expansion that compensates for this, temperature changes can be extremely reduced.
【０００３】0003
【作用】本願発明は積層材の拡大幅を有する内層用プリ
ント回路板のみの拡大幅部に位置合わせ用のガイド孔を
形成するので、プリプレグ樹脂のフローがガイドピンま
で到ることが少なくなり、従ってガイドピンを接着固定
することが少なくなる。仮に、プリプレグ樹脂のフロー
がガイドピンに至った場合でも、全体の重量が位置決め
治具が軽量化している重量だけ軽くなって、接着したガ
イドピンを取り外し解板するための移動作業の危険度が
軽減する。[Function] Since the present invention forms guide holes for positioning only in the enlarged width part of the inner layer printed circuit board having an enlarged width of the laminated material, the flow of prepreg resin is less likely to reach the guide pins. Therefore, it becomes less necessary to adhesively fix the guide pin. Even if the flow of prepreg resin reaches the guide pin, the overall weight will be reduced by the weight of the positioning jig, and the risk of moving work to remove and disassemble the bonded guide pin will be reduced. Reduce.
【０００４】0004
【発明の効果】このように、この発明の多層プリント回
路基板の製造法は、軽量な位置決め治具を用いて層間位
置を高精度に保つことができると共に、プリプレグ樹脂
のフローによるガイドピンへの接着が少ないものとなり
、仮にガイドピンに接着した場合でも全体の重量が位置
決め治具が軽量化している重量だけ軽くなって、接着し
たガイドピンを取り外し解板するための移動作業の危険
度が軽減すると云う効果がある。また、位置決め治具を
用いる以外は従来の鏡面板をそのまま使用するので、大
型のプレスでも成形が可能となり、量産性に優れると云
う効果もある。[Effects of the Invention] As described above, the method for manufacturing a multilayer printed circuit board of the present invention can maintain the interlayer position with high precision using a lightweight positioning jig, and also allows the flow of prepreg resin to prevent the guide pins from moving. There is less adhesion, and even if it is glued to the guide pin, the overall weight will be reduced by the weight of the positioning jig, reducing the risk of moving work to remove and disassemble the glued guide pin. Then, there is an effect. In addition, since the conventional mirror plate is used as is except for the use of a positioning jig, molding can be performed even with a large press, which has the advantage of being excellent in mass production.
【図１】この発明の実施例に係る六層プリント配線基板
の製造法の説明断面図である。FIG. 1 is a sectional view illustrating a method for manufacturing a six-layer printed wiring board according to an embodiment of the present invention.
【図２】図１のＩＩ−ＩＩ′断面図である。FIG. 2 is a sectional view taken along line II-II' in FIG. 1;
【図３】位置決め治具の配置図である。FIG. 3 is a layout diagram of a positioning jig.
【図４】位置決め治具の配置図である。FIG. 4 is a layout diagram of a positioning jig.
【図５】置決め治具の立体断面図である。FIG. 5 is a three-dimensional cross-sectional view of the positioning jig.
【図６】位置決め治具の立体断面図である。FIG. 6 is a three-dimensional cross-sectional view of the positioning jig.
【図７】従来例を説明する六層プリント配線基板の製造
法説明図である。FIG. 7 is an explanatory diagram of a method of manufacturing a six-layer printed wiring board, explaining a conventional example.
【図８】従来例における積層一体化物と下側金型とが接
着一体化した状態の説明図である。FIG. 8 is an explanatory diagram of a conventional example in which the integrated laminate and the lower mold are bonded and integrated.
１，１′，１１，１１′…それぞれ熱盤。
２，２′，１２，１２′…それぞれクッション材。
３…位置決め治具。
３ａ…突出部。
３ｂ…リブ。
４，１４…それぞれガイドピン。
５，１５…それぞれ鏡面板。
６ａ，１６ａ…それぞれ下側の外層用片面銅張積層板。
６ｂ，１６ｂ…それぞれ上側の外層用片面銅張積層板。
７，１７……それぞれプリプレグ。
８ａ，１８ａ，９ａ，１９ａ……それぞれ内層用両面プ
リント回路板。
１０……下側金型。
１０′……上側金型。1, 1', 11, 11'...heat plates respectively. 2, 2', 12, 12'... Cushion material respectively. 3...Positioning jig. 3a...Protrusion. 3b...Rib. 4, 14...Guide pins respectively. 5, 15... Each mirror plate. 6a, 16a... Single-sided copper-clad laminates for the lower outer layer, respectively. 6b, 16b... Single-sided copper-clad laminate for the upper outer layer, respectively. 7, 17...each prepreg. 8a, 18a, 9a, 19a... double-sided printed circuit boards for inner layers, respectively. 10...Lower mold. 10′...Upper mold.
Claims (1)
リプレグを介し、導電箔または導電箔張積層板を少なく
とも１表面に配置して重ね合せ、鏡面板に挟んで熱盤間
で加熱加圧積層一体化する多層プリント回路用基板の製
造法において、鏡面板周辺の周囲四辺または対向二辺に
熱盤に対して垂直に立設されたガイドピンを有する位置
決め治具を配置し、内層用プリント配線板を鏡面板に対
して拡大幅に形成すると共に該拡大幅部に内層用プリン
ト配線板相互間の位置合せ用のガイド孔を形成して、該
ガイド孔に前記位置決め治具のガイドピンを挿通させて
内層用プリント配線板相互の位置合せ状態を保ちつつ全
体を加熱加圧積層一体化することを特徴とする多層プリ
ント回路用基板の製造法。[Claim 1] Two or more inner layer printed wiring boards are stacked with conductive foil or conductive foil-clad laminate placed on at least one surface via prepreg, sandwiched between mirror plates, and heated and pressed between hot platens. In a method for manufacturing multilayer printed circuit boards that integrates lamination, positioning jigs with guide pins installed perpendicular to the heating plate are placed on the four sides around the mirror plate or on the two opposite sides, and the inner layer printed The wiring board is formed to have an enlarged width with respect to the mirror plate, and a guide hole for positioning the inner layer printed wiring boards is formed in the enlarged width part, and a guide pin of the positioning jig is inserted into the guide hole. A method for manufacturing a multilayer printed circuit board, characterized by inserting the inner layer printed wiring boards and laminating them together under heat and pressure while maintaining mutual alignment of the inner layer printed wiring boards.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2419308A JP2507238B2 (en) | 1990-12-26 | 1990-12-26 | Method for manufacturing multilayer printed circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2419308A JP2507238B2 (en) | 1990-12-26 | 1990-12-26 | Method for manufacturing multilayer printed circuit board |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH04225298A true JPH04225298A (en) | 1992-08-14 |
| JP2507238B2 JP2507238B2 (en) | 1996-06-12 |
Family
ID=18526905
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2419308A Expired - Lifetime JP2507238B2 (en) | 1990-12-26 | 1990-12-26 | Method for manufacturing multilayer printed circuit board |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2507238B2 (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115715060A (en) * | 2022-11-17 | 2023-02-24 | 深圳市海凌科达科技有限公司 | HDI board manufacturing method for improving through blind hole matching precision |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS63305594A (en) * | 1987-06-05 | 1988-12-13 | Sumitomo Bakelite Co Ltd | Manufacture of multilayer printed circuit board |
-
1990
- 1990-12-26 JP JP2419308A patent/JP2507238B2/en not_active Expired - Lifetime
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS63305594A (en) * | 1987-06-05 | 1988-12-13 | Sumitomo Bakelite Co Ltd | Manufacture of multilayer printed circuit board |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115715060A (en) * | 2022-11-17 | 2023-02-24 | 深圳市海凌科达科技有限公司 | HDI board manufacturing method for improving through blind hole matching precision |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2507238B2 (en) | 1996-06-12 |
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