JPH0424998A - Manufacture of multilayer printed board - Google Patents
Manufacture of multilayer printed boardInfo
- Publication number
- JPH0424998A JPH0424998A JP12510590A JP12510590A JPH0424998A JP H0424998 A JPH0424998 A JP H0424998A JP 12510590 A JP12510590 A JP 12510590A JP 12510590 A JP12510590 A JP 12510590A JP H0424998 A JPH0424998 A JP H0424998A
- Authority
- JP
- Japan
- Prior art keywords
- circuit board
- layer circuit
- outer layer
- inner layer
- alignment plate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000004519 manufacturing process Methods 0.000 title claims description 5
- 239000000853 adhesive Substances 0.000 claims abstract description 12
- 230000001070 adhesive effect Effects 0.000 claims abstract description 12
- 238000000465 moulding Methods 0.000 claims description 12
- 238000010438 heat treatment Methods 0.000 claims description 3
- 238000003475 lamination Methods 0.000 description 4
- 239000002184 metal Substances 0.000 description 4
- 229910052751 metal Inorganic materials 0.000 description 4
- 238000000034 method Methods 0.000 description 4
- 229920005989 resin Polymers 0.000 description 4
- 239000011347 resin Substances 0.000 description 4
- 239000011888 foil Substances 0.000 description 2
- 238000003860 storage Methods 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 239000011889 copper foil Substances 0.000 description 1
- 238000005553 drilling Methods 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 239000004744 fabric Substances 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 238000003384 imaging method Methods 0.000 description 1
- 238000005304 joining Methods 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 229920001187 thermosetting polymer Polymers 0.000 description 1
Landscapes
- Production Of Multi-Layered Print Wiring Board (AREA)
Abstract
Description
本発明は、電気機器や電子機器において使用される多層
プリント配線板の製造方法に関するものである。The present invention relates to a method for manufacturing a multilayer printed wiring board used in electrical equipment and electronic equipment.
多層プリント配線板は、回路パターンを形成した内層回
路板と、同様に回路パターンを形成した外層回路板とを
プリプレグで作成される接着シートを介して重ね、これ
を加熱加圧成形して内層回路板と外層回路板とを積層−
像化することによって製造されている。そしてこのよう
に積層成形をおこなうにあたって、内層回路板の回路パ
ターンと外層回路板の回路パターンとを相互に位置合わ
せした状態で内層回路板と外層回路板とを積層する必要
がある。
このために従来は第４図に示すようにして内層回路板と
外層回路板の位置合わせをおこなっていた。すなわち、
内層回路板１と外層回路板２にそれぞれ〃イド孔６ ａ
ｔ ６ ｂを設けると共に接着シート３にも〃イド孔１
１を設け、これらを上下に積み重ね、ガイドピン４を設
けた位置合わせプレート５の上にセットすると共に〃イ
ド孔６１Ｌｔ ６ ｂ及び１１にガイドピン４を挿入す
る。このように内層回路板１と外層回路板２の各ガイド
孔６ ａ、 ６ ｂにガイドピン４を挿入することによ
って、ガイド７１６ａ、６ｂを基準にして内層回路板１
と外層回路板２とは位置決めされることになる。そして
〃イド孔１２を設けた押さえプレート１３を上に重ねて
〃イド孔１２にガイドピン４の上端を差し込ませること
によって、上下のプレー） ５．１３開に内層回路板１
や外層回路板２を挟持し、この状態で積層成形装置にセ
ットしてホットプレス盤で所定時間加熱加圧成形するよ
うにして−・る。A multilayer printed wiring board is made by stacking an inner layer circuit board with a circuit pattern formed thereon and an outer layer circuit board also forming a circuit pattern with an adhesive sheet made of prepreg interposed therebetween, and molding them under heat and pressure to form the inner layer circuit board. Laminating the board and outer layer circuit board.
Manufactured by imaging. In performing lamination molding in this manner, it is necessary to laminate the inner layer circuit board and the outer layer circuit board with the circuit patterns on the inner layer circuit board and the circuit patterns on the outer layer circuit board aligned with each other. For this purpose, the inner layer circuit board and the outer layer circuit board have conventionally been aligned as shown in FIG. That is,
Id holes 6a are provided in the inner layer circuit board 1 and the outer layer circuit board 2, respectively.
t 6 b and also in the adhesive sheet 3.
1, stacked up and down, set on the alignment plate 5 provided with the guide pin 4, and insert the guide pin 4 into the id holes 61Lt6b and 11. By inserting the guide pins 4 into the respective guide holes 6 a and 6 b of the inner layer circuit board 1 and the outer layer circuit board 2 in this way, the inner layer circuit board 1 is aligned with the guides 716 a and 6 b as a reference.
and the outer layer circuit board 2 are to be positioned. 5.13 Open the inner layer circuit board 1 by stacking the holding plate 13 with the ID hole 12 on top and inserting the upper end of the guide pin 4 into the ID hole 12.
Then, the outer layer circuit board 2 is sandwiched, and in this state, it is set in a lamination molding machine and heated and pressure molded for a predetermined period of time using a hot press machine.
しかし、この方法では上下のプレー）５．１３間に内層
回路板１や外層回路板２を挟持して保持しておく必要が
あるために、かさ張ったり重量が重くなって保管や運搬
に支障があり、また積層成形装置へのセット段数が少な
くなって生産性にも問題が生じるものであり、さらには
加熱加圧成形の際に接着シートの樹脂がガイドビン４の
周囲に付着して成形後に取り外すことが困難になると−
）う問題が生じるものであった。
本発明は上記の点に鑑みて為されたものであり、位置合
わせプレートと一体にしたまま積層の成形をおこなうよ
うな必要がない多層プリント配線板の製造方法を提供す
ることを目的とするものである。However, with this method, it is necessary to sandwich and hold the inner layer circuit board 1 and outer layer circuit board 2 between the upper and lower plates, which makes it bulky and heavy, which hinders storage and transportation. In addition, the number of stages set in the laminated molding device is reduced, which causes productivity problems.Furthermore, the resin of the adhesive sheet adheres to the area around the guide bin 4 during hot and pressure molding, resulting in molding problems. If it becomes difficult to remove later -
) This caused problems. The present invention has been made in view of the above points, and it is an object of the present invention to provide a method for manufacturing a multilayer printed wiring board that does not require lamination molding while integrated with a positioning plate. It is.
本発明に係る多層プリント配線板の製造方法は、内層回
路板１と外層回路板２を接着シート３を介して重ね、ガ
イドピン４を突設した位置合わせプレート５にこれらを
セットして内層回路板１と外層回路板２にそれぞれ設け
たガイド孔６ ａ、 ６ ｂにガイドビン４を通すこと
によって内層回路板１と外層回路板２を相互に位置合わ
せし、次ν・で位置合わせプレート５に上下方向のみに
開口するように形成した通孔７を通して内層回路板１と
外層回路板２とをカシメ等して結合させ、この後にこれ
を位置合わせプレート５から取り出して、加熱加圧成形
することを特徴とするものである。The method for manufacturing a multilayer printed wiring board according to the present invention includes stacking an inner layer circuit board 1 and an outer layer circuit board 2 with an adhesive sheet 3 interposed therebetween, and setting them on a positioning plate 5 having guide pins 4 protruding from the inner layer circuit board 1 and the outer layer circuit board 2. The inner layer circuit board 1 and the outer layer circuit board 2 are mutually aligned by passing the guide pins 4 through the guide holes 6 a and 6 b provided in the board 1 and the outer layer circuit board 2, respectively, and then the alignment plate 5 is aligned with ν. The inner layer circuit board 1 and the outer layer circuit board 2 are joined together by caulking or the like through a through hole 7 formed to open only in the vertical direction, and then taken out from the alignment plate 5 and molded under heat and pressure. It is characterized by this.
【作 用１
本発明にあっては、内層回路板１と外層回路板２にそれ
ぞれ設けたガイド孔６ ａｔ ６ ｂにガイドピン４を
通すことによって内層回路板１と外層回路板２を相互に
位置合わせし、次いで内層回路板１と外層回路板２とを
カシメ等して結合させるようにしているために、内層回
路板１と外層回路板２とは位置合わせした状態で結合さ
れて（１て相互に位置がずれることがなし位置合わせプ
レート５から取り出した状態で加熱加圧成形に供するこ
とができる。また、位置合わせプレート５に上下方向の
みに開口するように形成した通孔７を通して内層回路板
１と外層回路板２とをカシメ等して結合させるようにし
ているために、通孔７を通して位置合わせプレート５が
邪魔になることなく内層回路板１と外層回路板２とを結
合させる作業を容易におこなうことができる。
【実施例］
以下本発明を実施例によって詳述する。
内層回路板１や外層回路板２は例えば、ガラス布等の基
材にエポキシ樹脂等の熱硬化性樹脂フェスを含浸乾燥し
て調製したプリプレグを複数枚重ねると共にこの片側も
しくは両側に銅箔等の金属箔を重ね、これを加熱加圧成
形することによって金属箔張り積層板を作成し、この金
属箔張り積層板の金属箔をエツチング処理等することに
よって回路形成して、製造することができる。そして各
内層回路板１や外層回路板２の端部には少なくとも二箇
所において、それぞれに形成した回路パターンと所定の
位置関係を設定された〃イド孔６ａ。
６ｂがドリル加工などで穿設しである。このガイド孔６
ａｔ ６ ｂを合わせて内層回路板１と外層回路板２
とを重ねると、各回路板１，２に形成した回路パターン
が相互に正確な位置関係で位置合わせされるように、ガ
イド孔６ ａｔ ６ ｂの位置は設定されているもので
あり、またその内径は後述のガイドビン４の外径にほぼ
等しい寸法に設定しである。
また、接着シート３としてはプリプレグが用いられるも
のであり、この接着シート３の端部にもガイド孔６ ａ
、 ６ ｂと対応する位置において〃イド孔１１が穿設
しである。このガイド孔１１は特に正確な位置に設ける
必要はなく、いわゆるバカ穴でよい。
一方、位置合わせプレート５は金属平板などで形成され
るものであり、位置合わせプレート５の端部の上面には
上記〃イド孔６ ａ、 ６ ｂに正確に対応する位置に
おいてガイドビン４が突設しである。
また位置合わせプレート５の端部には上下に開口する通
孔７が穿設しである。この通孔７は上下にのみ開口する
孔として形成されるものであり、ガイドビン４の両側に
設けるようにしである。第１図の実施例では通孔７は丸
孔として形成するようにしたが、孔の形状は限定される
ものではなく、三角孔や四角孔などであってもよい。
しかして第１図に示すように、内層回路板１と外層回路
板２とを接着シート３を介して重ね、それぞれの〃イド
孔６ａ、６ｂ、１１をγイドビン４に被挿しで位置合わ
せプレート５の上面にセットする。このように〃イド孔
６ａ、６ｂをガイドビン４に被挿した状態で内層回路板
１と外層回路板２を重ねることによって、内層回路板１
と外層回路板２とはそれぞれの回路パターンが自動的に
位置合わせされることになる。次ぎに、このように位置
合わせして各内層回路板１と外層回路板２とを重ねた状
態で、内層回路板１と外層回路板２をカシメ等して結合
させる。このカシメ等の作業は通孔７を通しておこなう
ことができるものであり、例えば第２図に示すように内
層回路板１、外層回路板２、接着シート３に黄銅などの
中空リベット１４を通してカシメることによっておこな
うことができる。リベット１４を通す前の孔中は作業も
、リベット１４を通す作業も、リベット１４をカシメる
作業も総て、位置合わせプレート５が邪魔になることな
く通孔７を通しておこなうことができるものである。こ
こで、通孔７は第１図に想像線で示すように位置合わせ
プレート５の端面においても開口する切欠として形成す
ることも可能であるが、このように切欠としで形成する
と、切欠端縁部（イ矢印で示す）の強度が弱くなってこ
の部分に変形が発生し易くなり、位置合わせプレート５
の耐久寿命が短くなるという問題や、またこの切欠ａｍ
部に引っ掛かって作業に支障を米すおそれがあるという
問題などがある。このために本発明では通孔７はこの上
うな切欠としてではなく、位置合わせプレート５の上下
方向にのみ開口するように形成しているのである。
上記のようにカシメ等して内層回路板１と外層回路板２
とを結合させると内層回路板１と外層回路板２とはもは
や位置ずれするおそれがないので、位置合わせプレート
５から取り出して保管や運搬をおこなうことができる。
そして積層成形をおこなうにあたっては、第３図に示す
ように、位置合わせプレート５から取り出した内層回路
板１と外層回路板２の結合品を鏡板１５とクツション板
１６とを介して積層成形装置のホットプレス盤１７の間
にセットし、加熱加圧成形することによっておこなうこ
とができ、接着シート３を介して内層回路板１と外層回
路板２とを積層一体化した多層プリント配線板を製造す
ることができる。この成形において、内層回路板１と外
層回路板２はカシメ等で結合されているために、接着シ
ート３の樹脂の流動などに伴って内層回路板１と外層回
路板２とが位置ずれするようなことなく、相互の回路パ
ターンを正確に位置合わせした状態で内層回路板１と外
層回路板２とを積層一体化することができるものである
。
【発明の効果】
上述のように本発明にあっては、内層回路板と外層回路
板にそれぞれ設けた〃イド孔にガイドビンを通すことに
よって内層回路板と外層回路板を相互に位置合わせし、
次いで内層回路板と外層回路板とをカシメ等して結合さ
せるようにしたので、内層回路板と外層回路板とは位置
合わせした状態で結合されていて相互に位置がずれるこ
とがないものであり、位置合わせプレートから取り呂し
た状態で保管や運搬、さらに加熱加圧成形に供すること
が可能になるものである。また、位置合わせプレートに
形成した通孔を通して内層回路板と外層回路板とをカシ
メ等して結合させるようにしているので、通孔を通して
位置合わせプレートが邪魔になる。：となく内層回路板
と外層回路板とを結合させる作業を容易におこなうこと
ができるものであり、しかも通孔は位置合わせプレート
に上下方向のみに開口するように形成しているので、辺
欠として形成する場合のような、切欠端縁部で位置合わ
せプレートの強度が弱（なってこの部分に変形が発生し
たり、この切欠端縁部に引っ掛かって作業に支障を来し
たりするようなことがなくなるものである。[Function 1] In the present invention, the inner layer circuit board 1 and the outer layer circuit board 2 are connected to each other by passing the guide pins 4 through the guide holes 6 at 6 b provided in the inner layer circuit board 1 and the outer layer circuit board 2, respectively. Since the inner layer circuit board 1 and the outer layer circuit board 2 are aligned and then combined by caulking or the like, the inner layer circuit board 1 and the outer layer circuit board 2 are combined in an aligned state (1 The inner layer can be subjected to heat and pressure molding after being taken out from the alignment plate 5 without being mutually misaligned. Since the circuit board 1 and the outer circuit board 2 are joined together by caulking or the like, the inner circuit board 1 and the outer circuit board 2 can be joined together without the alignment plate 5 getting in the way through the through hole 7. [Examples] The present invention will be described in detail below with reference to Examples.The inner layer circuit board 1 and the outer layer circuit board 2 are made of a thermosetting resin such as epoxy resin on a base material such as glass cloth. A metal foil-clad laminate is created by layering multiple sheets of prepreg prepared by impregnating and drying a resin face, layering metal foil such as copper foil on one or both sides, and forming this under heat and pressure. It can be manufactured by forming a circuit by etching the metal foil of the stretched laminate.And at least two circuits are formed at the ends of each inner layer circuit board 1 and outer layer circuit board 2. The guide holes 6a and 6b are set in a predetermined positional relationship with the pattern and are drilled by drilling, etc. This guide hole 6
At 6 b together to form inner layer circuit board 1 and outer layer circuit board 2
The positions of the guide holes 6 at 6 b are set so that the circuit patterns formed on each circuit board 1 and 2 are aligned with each other in an accurate positional relationship when The inner diameter is set to be approximately equal to the outer diameter of the guide bin 4, which will be described later. Furthermore, prepreg is used as the adhesive sheet 3, and guide holes 6a are also formed at the ends of the adhesive sheet 3.
, 6b. An id hole 11 is bored at a position corresponding to 6b. This guide hole 11 does not need to be provided at a particularly accurate position, and may be a so-called blank hole. On the other hand, the alignment plate 5 is formed of a flat metal plate or the like, and a guide bin 4 is protruded from the top surface of the end of the alignment plate 5 at a position that corresponds exactly to the above-mentioned id holes 6a and 6b. It is set up. In addition, a through hole 7 that opens upward and downward is provided at the end of the alignment plate 5. This through hole 7 is formed as a hole that opens only upward and downward, and is designed to be provided on both sides of the guide bin 4. In the embodiment shown in FIG. 1, the through hole 7 is formed as a round hole, but the shape of the hole is not limited, and may be a triangular hole, a square hole, or the like. As shown in FIG. 1, the inner layer circuit board 1 and the outer layer circuit board 2 are stacked with the adhesive sheet 3 interposed therebetween, and the respective id holes 6a, 6b, 11 are inserted into the γ ID bin 4 to form an alignment plate. Set it on the top of 5. In this way, by stacking the inner layer circuit board 1 and the outer layer circuit board 2 with the guide holes 6a and 6b inserted into the guide bin 4, the inner layer circuit board 1
The circuit patterns of the outer layer circuit board 2 and the outer layer circuit board 2 are automatically aligned. Next, with the inner layer circuit boards 1 and the outer layer circuit boards 2 aligned in this manner and stacked, the inner layer circuit boards 1 and the outer layer circuit boards 2 are combined by caulking or the like. This work such as riveting can be performed through the through hole 7, and for example, as shown in FIG. This can be done by The work in the hole before passing the rivet 14, the work of passing the rivet 14 through, and the work of caulking the rivet 14 can all be carried out through the through hole 7 without the positioning plate 5 getting in the way. . Here, the through hole 7 can be formed as a notch that opens also in the end face of the alignment plate 5 as shown by the imaginary line in FIG. 1, but if it is formed as a notch in this way, the notch edge The strength of the part (indicated by the arrow A) becomes weaker and deformation occurs easily in this part, and the
The problem is that the durable life of the am
There is a problem that there is a risk that it may get caught in the parts and interfere with the work. For this reason, in the present invention, the through hole 7 is not formed as a cutout, but is formed so as to open only in the vertical direction of the alignment plate 5. By caulking etc. as above, the inner layer circuit board 1 and the outer layer circuit board 2 are attached.
When these are combined, there is no longer a risk that the inner layer circuit board 1 and the outer layer circuit board 2 will be misaligned, so they can be taken out from the alignment plate 5 for storage or transportation. In order to carry out lamination molding, as shown in FIG. This can be carried out by setting it between hot press machines 17 and heating and pressurizing it to produce a multilayer printed wiring board in which the inner layer circuit board 1 and the outer layer circuit board 2 are laminated and integrated via the adhesive sheet 3. be able to. In this molding, since the inner layer circuit board 1 and the outer layer circuit board 2 are joined together by caulking or the like, there is a possibility that the inner layer circuit board 1 and the outer layer circuit board 2 may be misaligned due to the flow of the resin of the adhesive sheet 3. The inner layer circuit board 1 and the outer layer circuit board 2 can be laminated and integrated with the mutual circuit patterns accurately aligned without any problems. [Effects of the Invention] As described above, in the present invention, the inner layer circuit board and the outer layer circuit board are aligned with each other by passing the guide bins through the holes provided in the inner layer circuit board and the outer layer circuit board, respectively. ,
Next, the inner layer circuit board and the outer layer circuit board are connected by caulking or the like, so that the inner layer circuit board and the outer layer circuit board are connected in an aligned state and do not shift relative to each other. This makes it possible to store and transport the product while it is removed from the alignment plate, and further to subject it to heating and pressure molding. Further, since the inner layer circuit board and the outer layer circuit board are connected by caulking or the like through the through holes formed in the alignment plate, the alignment plate becomes an obstacle when the through holes are passed through. : The work of joining the inner layer circuit board and the outer layer circuit board can be easily performed, and since the through holes are formed in the alignment plate so that they open only in the vertical direction, there is no edge cut. The strength of the alignment plate may be weak at the notch edge, such as when forming a Things will disappear.
第１図は本発明の一実施例の分解斜視図、第２図は同上
の断面図、第３図は同上の分解正面図、第４図は従来例
の分解斜視図である。
１は内層回路板、２は外層回路板、３は接着シート、４
はガイドピン、５は位置合わせプレート、６ ａｔ ６
ｂは〃イド孔、７は通孔である。FIG. 1 is an exploded perspective view of an embodiment of the present invention, FIG. 2 is a sectional view of the same, FIG. 3 is an exploded front view of the same, and FIG. 4 is an exploded perspective view of a conventional example. 1 is an inner layer circuit board, 2 is an outer layer circuit board, 3 is an adhesive sheet, 4
is the guide pin, 5 is the alignment plate, 6 at 6
b is an id hole, and 7 is a through hole.
Claims (1)
ね、ガイドピンを突設した位置合わせプレートにこれら
をセットして内層回路板と外層回路板にそれぞれ設けた
ガイド孔にガイドピンを通すことによって内層回路板と
外層回路板を相互に位置合わせし、次いで位置合わせプ
レートに上下方向のみに開口するように形成した通孔を
通して内層回路板と外層回路板とをカシメ等して結合さ
せ、この後にこれを位置合わせプレートから取り出して
、加熱加圧成形することを特徴とする多層プリント配線
板の製造方法。(1) Overlap the inner layer circuit board and the outer layer circuit board with an adhesive sheet interposed between them, set them on the alignment plate with guide pins protruding, and insert the guide pins into the guide holes provided on the inner layer circuit board and the outer layer circuit board, respectively. The inner layer circuit board and the outer layer circuit board are aligned with each other by passing through the holes, and then the inner layer circuit board and the outer layer circuit board are joined by caulking or the like through a through hole formed in the alignment plate so as to open only in the vertical direction. A method for producing a multilayer printed wiring board, which is characterized in that the board is then taken out from the alignment plate and subjected to heating and pressure molding.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12510590A JPH071828B2 (en) | 1990-05-15 | 1990-05-15 | Method for manufacturing multilayer printed wiring board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12510590A JPH071828B2 (en) | 1990-05-15 | 1990-05-15 | Method for manufacturing multilayer printed wiring board |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0424998A true JPH0424998A (en) | 1992-01-28 |
| JPH071828B2 JPH071828B2 (en) | 1995-01-11 |
Family
ID=14901975
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP12510590A Expired - Lifetime JPH071828B2 (en) | 1990-05-15 | 1990-05-15 | Method for manufacturing multilayer printed wiring board |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH071828B2 (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR100746361B1 (en) * | 2006-07-11 | 2007-08-06 | 삼성전기주식회사 | Method for manufacturing printed circuit board |
| WO2012073935A1 (en) * | 2010-12-03 | 2012-06-07 | シャープ株式会社 | Rear surface electrode-type solar battery cell, solar battery module, solar battery wafer, and solar battery module production method |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20070112274A (en) * | 2005-03-15 | 2007-11-22 | 씨-코어 테크놀로지즈, 인코포레이티드 | Manufacturing process: how to construct constraining core material into printed wiring board |
| USRE45637E1 (en) | 2005-08-29 | 2015-07-28 | Stablcor Technology, Inc. | Processes for manufacturing printed wiring boards |
| US9332632B2 (en) | 2014-08-20 | 2016-05-03 | Stablcor Technology, Inc. | Graphene-based thermal management cores and systems and methods for constructing printed wiring boards |
-
1990
- 1990-05-15 JP JP12510590A patent/JPH071828B2/en not_active Expired - Lifetime
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR100746361B1 (en) * | 2006-07-11 | 2007-08-06 | 삼성전기주식회사 | Method for manufacturing printed circuit board |
| WO2012073935A1 (en) * | 2010-12-03 | 2012-06-07 | シャープ株式会社 | Rear surface electrode-type solar battery cell, solar battery module, solar battery wafer, and solar battery module production method |
| JP2012119602A (en) * | 2010-12-03 | 2012-06-21 | Sharp Corp | Back electrode type solar cell, solar cell module, solar cell wafer and method of manufacturing solar cell module |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH071828B2 (en) | 1995-01-11 |
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