JPH04213357A - Thermoplastic resin composition with high performance - Google Patents
Thermoplastic resin composition with high performanceInfo
- Publication number
- JPH04213357A JPH04213357A JP40132290A JP40132290A JPH04213357A JP H04213357 A JPH04213357 A JP H04213357A JP 40132290 A JP40132290 A JP 40132290A JP 40132290 A JP40132290 A JP 40132290A JP H04213357 A JPH04213357 A JP H04213357A
- Authority
- JP
- Japan
- Prior art keywords
- resin
- present
- composition
- polyphenylene sulfide
- titanate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
- 239000011342 resin composition Substances 0.000 title claims description 7
- 229920005992 thermoplastic resin Polymers 0.000 title abstract description 7
- 229920005989 resin Polymers 0.000 claims abstract description 37
- 239000011347 resin Substances 0.000 claims abstract description 37
- 239000000203 mixture Substances 0.000 claims abstract description 19
- 229920001955 polyphenylene ether Polymers 0.000 claims abstract description 19
- 239000004734 Polyphenylene sulfide Substances 0.000 claims abstract description 18
- 229920000069 polyphenylene sulfide Polymers 0.000 claims abstract description 18
- 125000003545 alkoxy group Chemical group 0.000 claims abstract description 5
- 150000001875 compounds Chemical class 0.000 claims description 7
- 238000002156 mixing Methods 0.000 claims description 5
- 239000012744 reinforcing agent Substances 0.000 claims description 5
- 229920006258 high performance thermoplastic Polymers 0.000 claims description 3
- -1 poly(2-methyl-6-ethyl-1,4-phenylene ether) Polymers 0.000 description 14
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 11
- 239000000835 fiber Substances 0.000 description 7
- 238000012360 testing method Methods 0.000 description 7
- FPYJFEHAWHCUMM-UHFFFAOYSA-N maleic anhydride Chemical compound O=C1OC(=O)C=C1 FPYJFEHAWHCUMM-UHFFFAOYSA-N 0.000 description 5
- 238000000034 method Methods 0.000 description 5
- 229920000642 polymer Polymers 0.000 description 5
- RTZKZFJDLAIYFH-UHFFFAOYSA-N ether Substances CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 description 4
- XLYMOEINVGRTEX-UHFFFAOYSA-N fumaric acid monoethyl ester Chemical class CCOC(=O)C=CC(O)=O XLYMOEINVGRTEX-UHFFFAOYSA-N 0.000 description 4
- 125000001449 isopropyl group Chemical group [H]C([H])([H])C([H])(*)C([H])([H])[H] 0.000 description 4
- 239000011490 mineral wool Substances 0.000 description 4
- 239000004721 Polyphenylene oxide Substances 0.000 description 3
- UMHKOAYRTRADAT-UHFFFAOYSA-N [hydroxy(octoxy)phosphoryl] octyl hydrogen phosphate Chemical compound CCCCCCCCOP(O)(=O)OP(O)(=O)OCCCCCCCC UMHKOAYRTRADAT-UHFFFAOYSA-N 0.000 description 3
- 125000004018 acid anhydride group Chemical group 0.000 description 3
- 239000000654 additive Substances 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 239000003365 glass fiber Substances 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 3
- 229910052751 metal Inorganic materials 0.000 description 3
- 239000002184 metal Chemical class 0.000 description 3
- 230000000704 physical effect Effects 0.000 description 3
- 229920013636 polyphenyl ether polymer Polymers 0.000 description 3
- 239000000126 substance Substances 0.000 description 3
- 238000009864 tensile test Methods 0.000 description 3
- 150000007934 α,β-unsaturated carboxylic acids Chemical class 0.000 description 3
- WYTZZXDRDKSJID-UHFFFAOYSA-N (3-aminopropyl)triethoxysilane Chemical compound CCO[Si](OCC)(OCC)CCCN WYTZZXDRDKSJID-UHFFFAOYSA-N 0.000 description 2
- XLYMOEINVGRTEX-ONEGZZNKSA-N (e)-4-ethoxy-4-oxobut-2-enoic acid Chemical class CCOC(=O)\C=C\C(O)=O XLYMOEINVGRTEX-ONEGZZNKSA-N 0.000 description 2
- 239000005995 Aluminium silicate Substances 0.000 description 2
- VTYYLEPIZMXCLO-UHFFFAOYSA-L Calcium carbonate Chemical compound [Ca+2].[O-]C([O-])=O VTYYLEPIZMXCLO-UHFFFAOYSA-L 0.000 description 2
- XLYMOEINVGRTEX-ARJAWSKDSA-N Ethyl hydrogen fumarate Chemical class CCOC(=O)\C=C/C(O)=O XLYMOEINVGRTEX-ARJAWSKDSA-N 0.000 description 2
- WQDUMFSSJAZKTM-UHFFFAOYSA-N Sodium methoxide Chemical compound [Na+].[O-]C WQDUMFSSJAZKTM-UHFFFAOYSA-N 0.000 description 2
- PPBRXRYQALVLMV-UHFFFAOYSA-N Styrene Chemical compound C=CC1=CC=CC=C1 PPBRXRYQALVLMV-UHFFFAOYSA-N 0.000 description 2
- 239000000956 alloy Substances 0.000 description 2
- 229910045601 alloy Inorganic materials 0.000 description 2
- 238000005275 alloying Methods 0.000 description 2
- 235000012211 aluminium silicate Nutrition 0.000 description 2
- 239000003963 antioxidant agent Substances 0.000 description 2
- TZCXTZWJZNENPQ-UHFFFAOYSA-L barium sulfate Chemical compound [Ba+2].[O-]S([O-])(=O)=O TZCXTZWJZNENPQ-UHFFFAOYSA-L 0.000 description 2
- OSGAYBCDTDRGGQ-UHFFFAOYSA-L calcium sulfate Chemical compound [Ca+2].[O-]S([O-])(=O)=O OSGAYBCDTDRGGQ-UHFFFAOYSA-L 0.000 description 2
- 239000013256 coordination polymer Substances 0.000 description 2
- 238000004132 cross linking Methods 0.000 description 2
- 239000012760 heat stabilizer Substances 0.000 description 2
- 239000003112 inhibitor Substances 0.000 description 2
- NLYAJNPCOHFWQQ-UHFFFAOYSA-N kaolin Chemical compound O.O.O=[Al]O[Si](=O)O[Si](=O)O[Al]=O NLYAJNPCOHFWQQ-UHFFFAOYSA-N 0.000 description 2
- 238000004898 kneading Methods 0.000 description 2
- 239000004611 light stabiliser Substances 0.000 description 2
- 239000000314 lubricant Substances 0.000 description 2
- 239000010445 mica Substances 0.000 description 2
- 229910052618 mica group Inorganic materials 0.000 description 2
- NISOCYUAQBTSBZ-UHFFFAOYSA-N n-methyl-n-(2-phenylethyl)prop-2-yn-1-amine Chemical compound C#CCN(C)CCC1=CC=CC=C1 NISOCYUAQBTSBZ-UHFFFAOYSA-N 0.000 description 2
- 239000002994 raw material Substances 0.000 description 2
- 150000003839 salts Chemical class 0.000 description 2
- 238000010998 test method Methods 0.000 description 2
- NIDNOXCRFUCAKQ-RNGGSSJXSA-N (1r,2r,3s,4s)-bicyclo[2.2.1]hept-5-ene-2,3-dicarboxylic acid Chemical compound C1[C@@H]2C=C[C@H]1[C@H](C(=O)O)[C@@H]2C(O)=O NIDNOXCRFUCAKQ-RNGGSSJXSA-N 0.000 description 1
- XPNGNIFUDRPBFJ-UHFFFAOYSA-N (2-methylphenyl)methanol Chemical compound CC1=CC=CC=C1CO XPNGNIFUDRPBFJ-UHFFFAOYSA-N 0.000 description 1
- KNDQHSIWLOJIGP-UMRXKNAASA-N (3ar,4s,7r,7as)-rel-3a,4,7,7a-tetrahydro-4,7-methanoisobenzofuran-1,3-dione Chemical compound O=C1OC(=O)[C@@H]2[C@H]1[C@]1([H])C=C[C@@]2([H])C1 KNDQHSIWLOJIGP-UMRXKNAASA-N 0.000 description 1
- MRAKLTZPBIBWFH-ONEGZZNKSA-N (e)-2-ethenylbut-2-enedioic acid Chemical class OC(=O)\C=C(/C=C)C(O)=O MRAKLTZPBIBWFH-ONEGZZNKSA-N 0.000 description 1
- DMWVYCCGCQPJEA-UHFFFAOYSA-N 2,5-bis(tert-butylperoxy)-2,5-dimethylhexane Chemical compound CC(C)(C)OOC(C)(C)CCC(C)(C)OOC(C)(C)C DMWVYCCGCQPJEA-UHFFFAOYSA-N 0.000 description 1
- STMDPCBYJCIZOD-UHFFFAOYSA-N 2-(2,4-dinitroanilino)-4-methylpentanoic acid Chemical class CC(C)CC(C(O)=O)NC1=CC=C([N+]([O-])=O)C=C1[N+]([O-])=O STMDPCBYJCIZOD-UHFFFAOYSA-N 0.000 description 1
- GVJRTUUUJYMTNQ-UHFFFAOYSA-N 2-(2,5-dioxofuran-3-yl)acetic acid Chemical compound OC(=O)CC1=CC(=O)OC1=O GVJRTUUUJYMTNQ-UHFFFAOYSA-N 0.000 description 1
- SMZOUWXMTYCWNB-UHFFFAOYSA-N 2-(2-methoxy-5-methylphenyl)ethanamine Chemical compound COC1=CC=C(C)C=C1CCN SMZOUWXMTYCWNB-UHFFFAOYSA-N 0.000 description 1
- JAHNSTQSQJOJLO-UHFFFAOYSA-N 2-(3-fluorophenyl)-1h-imidazole Chemical compound FC1=CC=CC(C=2NC=CN=2)=C1 JAHNSTQSQJOJLO-UHFFFAOYSA-N 0.000 description 1
- FALRKNHUBBKYCC-UHFFFAOYSA-N 2-(chloromethyl)pyridine-3-carbonitrile Chemical compound ClCC1=NC=CC=C1C#N FALRKNHUBBKYCC-UHFFFAOYSA-N 0.000 description 1
- NIXOWILDQLNWCW-UHFFFAOYSA-N 2-Propenoic acid Natural products OC(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 1
- KKOHCQAVIJDYAF-UHFFFAOYSA-N 2-dodecylbenzenesulfonic acid;propan-2-ol;titanium Chemical compound [Ti].CC(C)O.CCCCCCCCCCCCC1=CC=CC=C1S(O)(=O)=O.CCCCCCCCCCCCC1=CC=CC=C1S(O)(=O)=O.CCCCCCCCCCCCC1=CC=CC=C1S(O)(=O)=O KKOHCQAVIJDYAF-UHFFFAOYSA-N 0.000 description 1
- XUDBVJCTLZTSDC-UHFFFAOYSA-N 2-ethenylbenzoic acid Chemical class OC(=O)C1=CC=CC=C1C=C XUDBVJCTLZTSDC-UHFFFAOYSA-N 0.000 description 1
- NMSZFQAFWHFSPE-UHFFFAOYSA-N 3-(oxiran-2-ylmethoxycarbonyl)but-3-enoic acid Chemical compound OC(=O)CC(=C)C(=O)OCC1CO1 NMSZFQAFWHFSPE-UHFFFAOYSA-N 0.000 description 1
- OXYZDRAJMHGSMW-UHFFFAOYSA-N 3-chloropropyl(trimethoxy)silane Chemical compound CO[Si](OC)(OC)CCCCl OXYZDRAJMHGSMW-UHFFFAOYSA-N 0.000 description 1
- AYKYXWQEBUNJCN-UHFFFAOYSA-N 3-methylfuran-2,5-dione Chemical compound CC1=CC(=O)OC1=O AYKYXWQEBUNJCN-UHFFFAOYSA-N 0.000 description 1
- OFNISBHGPNMTMS-UHFFFAOYSA-N 3-methylideneoxolane-2,5-dione Chemical compound C=C1CC(=O)OC1=O OFNISBHGPNMTMS-UHFFFAOYSA-N 0.000 description 1
- SJECZPVISLOESU-UHFFFAOYSA-N 3-trimethoxysilylpropan-1-amine Chemical compound CO[Si](OC)(OC)CCCN SJECZPVISLOESU-UHFFFAOYSA-N 0.000 description 1
- XDLMVUHYZWKMMD-UHFFFAOYSA-N 3-trimethoxysilylpropyl 2-methylprop-2-enoate Chemical compound CO[Si](OC)(OC)CCCOC(=O)C(C)=C XDLMVUHYZWKMMD-UHFFFAOYSA-N 0.000 description 1
- DUGLMATUSUVYMV-UHFFFAOYSA-N 7-oxabicyclo[2.2.1]hepta-1,3,5-triene Chemical compound C1=C(O2)C=CC2=C1 DUGLMATUSUVYMV-UHFFFAOYSA-N 0.000 description 1
- 229920000049 Carbon (fiber) Polymers 0.000 description 1
- VGGSQFUCUMXWEO-UHFFFAOYSA-N Ethene Chemical compound C=C VGGSQFUCUMXWEO-UHFFFAOYSA-N 0.000 description 1
- 239000005977 Ethylene Substances 0.000 description 1
- PEEHTFAAVSWFBL-UHFFFAOYSA-N Maleimide Chemical compound O=C1NC(=O)C=C1 PEEHTFAAVSWFBL-UHFFFAOYSA-N 0.000 description 1
- CERQOIWHTDAKMF-UHFFFAOYSA-N Methacrylic acid Chemical compound CC(=C)C(O)=O CERQOIWHTDAKMF-UHFFFAOYSA-N 0.000 description 1
- ABLZXFCXXLZCGV-UHFFFAOYSA-N Phosphorous acid Chemical compound OP(O)=O ABLZXFCXXLZCGV-UHFFFAOYSA-N 0.000 description 1
- 241001483078 Phyto Species 0.000 description 1
- 239000004696 Poly ether ether ketone Substances 0.000 description 1
- 239000004952 Polyamide Substances 0.000 description 1
- 239000004962 Polyamide-imide Substances 0.000 description 1
- 239000004695 Polyether sulfone Substances 0.000 description 1
- 239000004697 Polyetherimide Substances 0.000 description 1
- OFOBLEOULBTSOW-UHFFFAOYSA-N Propanedioic acid Natural products OC(=O)CC(O)=O OFOBLEOULBTSOW-UHFFFAOYSA-N 0.000 description 1
- 229910052581 Si3N4 Inorganic materials 0.000 description 1
- 229910000831 Steel Inorganic materials 0.000 description 1
- KDYFGRWQOYBRFD-UHFFFAOYSA-N Succinic acid Natural products OC(=O)CCC(O)=O KDYFGRWQOYBRFD-UHFFFAOYSA-N 0.000 description 1
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 description 1
- 239000007983 Tris buffer Substances 0.000 description 1
- 241001147388 Uncia Species 0.000 description 1
- 229910021536 Zeolite Inorganic materials 0.000 description 1
- 239000006096 absorbing agent Substances 0.000 description 1
- 238000010521 absorption reaction Methods 0.000 description 1
- 230000032683 aging Effects 0.000 description 1
- 125000003277 amino group Chemical group 0.000 description 1
- 239000011324 bead Substances 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 239000000440 bentonite Substances 0.000 description 1
- 229910000278 bentonite Inorganic materials 0.000 description 1
- SVPXDRXYRYOSEX-UHFFFAOYSA-N bentoquatam Chemical compound O.O=[Si]=O.O=[Al]O[Al]=O SVPXDRXYRYOSEX-UHFFFAOYSA-N 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- KDYFGRWQOYBRFD-NUQCWPJISA-N butanedioic acid Chemical compound O[14C](=O)CC[14C](O)=O KDYFGRWQOYBRFD-NUQCWPJISA-N 0.000 description 1
- 229910000019 calcium carbonate Inorganic materials 0.000 description 1
- 239000000378 calcium silicate Substances 0.000 description 1
- 229910052918 calcium silicate Inorganic materials 0.000 description 1
- OYACROKNLOSFPA-UHFFFAOYSA-N calcium;dioxido(oxo)silane Chemical compound [Ca+2].[O-][Si]([O-])=O OYACROKNLOSFPA-UHFFFAOYSA-N 0.000 description 1
- 239000006229 carbon black Substances 0.000 description 1
- 239000004917 carbon fiber Substances 0.000 description 1
- 150000001735 carboxylic acids Chemical class 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 239000004927 clay Substances 0.000 description 1
- 239000003086 colorant Substances 0.000 description 1
- 230000000052 comparative effect Effects 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 229920001577 copolymer Polymers 0.000 description 1
- 238000007334 copolymerization reaction Methods 0.000 description 1
- 239000007822 coupling agent Substances 0.000 description 1
- 239000003484 crystal nucleating agent Substances 0.000 description 1
- 238000000354 decomposition reaction Methods 0.000 description 1
- OTARVPUIYXHRRB-UHFFFAOYSA-N diethoxy-methyl-[3-(oxiran-2-ylmethoxy)propyl]silane Chemical compound CCO[Si](C)(OCC)CCCOCC1CO1 OTARVPUIYXHRRB-UHFFFAOYSA-N 0.000 description 1
- GYZLOYUZLJXAJU-UHFFFAOYSA-N diglycidyl ether Chemical compound C1OC1COCC1CO1 GYZLOYUZLJXAJU-UHFFFAOYSA-N 0.000 description 1
- HTDKEJXHILZNPP-UHFFFAOYSA-N dioctyl hydrogen phosphate Chemical compound CCCCCCCCOP(O)(=O)OCCCCCCCC HTDKEJXHILZNPP-UHFFFAOYSA-N 0.000 description 1
- XMQYIPNJVLNWOE-UHFFFAOYSA-N dioctyl hydrogen phosphite Chemical compound CCCCCCCCOP(O)OCCCCCCCC XMQYIPNJVLNWOE-UHFFFAOYSA-N 0.000 description 1
- HNPSIPDUKPIQMN-UHFFFAOYSA-N dioxosilane;oxo(oxoalumanyloxy)alumane Chemical compound O=[Si]=O.O=[Al]O[Al]=O HNPSIPDUKPIQMN-UHFFFAOYSA-N 0.000 description 1
- NJLLQSBAHIKGKF-UHFFFAOYSA-N dipotassium dioxido(oxo)titanium Chemical compound [K+].[K+].[O-][Ti]([O-])=O NJLLQSBAHIKGKF-UHFFFAOYSA-N 0.000 description 1
- 239000000975 dye Substances 0.000 description 1
- 125000003700 epoxy group Chemical group 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 150000002148 esters Chemical class 0.000 description 1
- FWDBOZPQNFPOLF-UHFFFAOYSA-N ethenyl(triethoxy)silane Chemical compound CCO[Si](OCC)(OCC)C=C FWDBOZPQNFPOLF-UHFFFAOYSA-N 0.000 description 1
- NKSJNEHGWDZZQF-UHFFFAOYSA-N ethenyl(trimethoxy)silane Chemical compound CO[Si](OC)(OC)C=C NKSJNEHGWDZZQF-UHFFFAOYSA-N 0.000 description 1
- WOXXJEVNDJOOLV-UHFFFAOYSA-N ethenyl-tris(2-methoxyethoxy)silane Chemical compound COCCO[Si](OCCOC)(OCCOC)C=C WOXXJEVNDJOOLV-UHFFFAOYSA-N 0.000 description 1
- 238000001125 extrusion Methods 0.000 description 1
- 238000010101 extrusion blow moulding Methods 0.000 description 1
- 238000005187 foaming Methods 0.000 description 1
- NKHAVTQWNUWKEO-UHFFFAOYSA-N fumaric acid monomethyl ester Natural products COC(=O)C=CC(O)=O NKHAVTQWNUWKEO-UHFFFAOYSA-N 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 230000009477 glass transition Effects 0.000 description 1
- VOZRXNHHFUQHIL-UHFFFAOYSA-N glycidyl methacrylate Chemical class CC(=C)C(=O)OCC1CO1 VOZRXNHHFUQHIL-UHFFFAOYSA-N 0.000 description 1
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 description 1
- 238000009863 impact test Methods 0.000 description 1
- 238000001746 injection moulding Methods 0.000 description 1
- VZCYOOQTPOCHFL-UPHRSURJSA-N maleic acid Chemical compound OC(=O)\C=C/C(O)=O VZCYOOQTPOCHFL-UPHRSURJSA-N 0.000 description 1
- 239000011976 maleic acid Substances 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 239000000155 melt Substances 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 125000005641 methacryl group Chemical group 0.000 description 1
- VNWKTOKETHGBQD-UHFFFAOYSA-N methane Chemical compound C VNWKTOKETHGBQD-UHFFFAOYSA-N 0.000 description 1
- NKHAVTQWNUWKEO-IHWYPQMZSA-N methyl hydrogen fumarate Chemical compound COC(=O)\C=C/C(O)=O NKHAVTQWNUWKEO-IHWYPQMZSA-N 0.000 description 1
- LVHBHZANLOWSRM-UHFFFAOYSA-N methylenebutanedioic acid Natural products OC(=O)CC(=C)C(O)=O LVHBHZANLOWSRM-UHFFFAOYSA-N 0.000 description 1
- 239000006082 mold release agent Substances 0.000 description 1
- 239000012778 molding material Substances 0.000 description 1
- CWQXQMHSOZUFJS-UHFFFAOYSA-N molybdenum disulfide Chemical compound S=[Mo]=S CWQXQMHSOZUFJS-UHFFFAOYSA-N 0.000 description 1
- 229910052982 molybdenum disulfide Inorganic materials 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- KBJFYLLAMSZSOG-UHFFFAOYSA-N n-(3-trimethoxysilylpropyl)aniline Chemical compound CO[Si](OC)(OC)CCCNC1=CC=CC=C1 KBJFYLLAMSZSOG-UHFFFAOYSA-N 0.000 description 1
- 239000002667 nucleating agent Substances 0.000 description 1
- CAQIWIAAHXOQOS-UHFFFAOYSA-N octadecanoic acid;propan-2-ol;titanium Chemical compound [Ti].CC(C)O.CCCCCCCCCCCCCCCCCC(O)=O.CCCCCCCCCCCCCCCCCC(O)=O.CCCCCCCCCCCCCCCCCC(O)=O CAQIWIAAHXOQOS-UHFFFAOYSA-N 0.000 description 1
- RPQRDASANLAFCM-UHFFFAOYSA-N oxiran-2-ylmethyl prop-2-enoate Chemical class C=CC(=O)OCC1CO1 RPQRDASANLAFCM-UHFFFAOYSA-N 0.000 description 1
- 238000005191 phase separation Methods 0.000 description 1
- 239000000049 pigment Substances 0.000 description 1
- 239000004014 plasticizer Substances 0.000 description 1
- 229920001643 poly(ether ketone) Polymers 0.000 description 1
- 229920001652 poly(etherketoneketone) Polymers 0.000 description 1
- 229920002492 poly(sulfone) Polymers 0.000 description 1
- 229920002647 polyamide Polymers 0.000 description 1
- 229920006122 polyamide resin Polymers 0.000 description 1
- 229920002312 polyamide-imide Polymers 0.000 description 1
- 239000004417 polycarbonate Substances 0.000 description 1
- 229920000515 polycarbonate Polymers 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 229920000728 polyester Polymers 0.000 description 1
- 229920006393 polyether sulfone Polymers 0.000 description 1
- 229920002530 polyetherether ketone Polymers 0.000 description 1
- 229920001601 polyetherimide Polymers 0.000 description 1
- 229920001470 polyketone Polymers 0.000 description 1
- 229920000098 polyolefin Polymers 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 239000002296 pyrolytic carbon Substances 0.000 description 1
- 238000011160 research Methods 0.000 description 1
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 description 1
- 229910010271 silicon carbide Inorganic materials 0.000 description 1
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 1
- 238000004513 sizing Methods 0.000 description 1
- 239000010959 steel Substances 0.000 description 1
- 229940014800 succinic anhydride Drugs 0.000 description 1
- 238000003786 synthesis reaction Methods 0.000 description 1
- 239000000454 talc Substances 0.000 description 1
- 229910052623 talc Inorganic materials 0.000 description 1
- OGIDPMRJRNCKJF-UHFFFAOYSA-N titanium oxide Inorganic materials [Ti]=O OGIDPMRJRNCKJF-UHFFFAOYSA-N 0.000 description 1
- 238000004448 titration Methods 0.000 description 1
- VZCYOOQTPOCHFL-UHFFFAOYSA-N trans-butenedioic acid Natural products OC(=O)C=CC(O)=O VZCYOOQTPOCHFL-UHFFFAOYSA-N 0.000 description 1
- DQZNLOXENNXVAD-UHFFFAOYSA-N trimethoxy-[2-(7-oxabicyclo[4.1.0]heptan-4-yl)ethyl]silane Chemical compound C1C(CC[Si](OC)(OC)OC)CCC2OC21 DQZNLOXENNXVAD-UHFFFAOYSA-N 0.000 description 1
- BPSIOYPQMFLKFR-UHFFFAOYSA-N trimethoxy-[3-(oxiran-2-ylmethoxy)propyl]silane Chemical compound CO[Si](OC)(OC)CCCOCC1CO1 BPSIOYPQMFLKFR-UHFFFAOYSA-N 0.000 description 1
- 125000000391 vinyl group Chemical class [H]C([*])=C([H])[H] 0.000 description 1
- 229920002554 vinyl polymer Chemical class 0.000 description 1
- 239000010456 wollastonite Substances 0.000 description 1
- 229910052882 wollastonite Inorganic materials 0.000 description 1
- 239000010457 zeolite Substances 0.000 description 1
- 229910000859 α-Fe Inorganic materials 0.000 description 1
Abstract
Description
【０００１】0001
【産業上の利用分野】本発明は、ポリフェニレンサルフ
ァイド樹脂組成物に関するものである。詳しくは、機械
的特性、特にウェルド強度、熱時剛性、靱性が改良され
た、高性能化された熱可塑性樹脂組成物に関するもので
ある。FIELD OF THE INVENTION This invention relates to polyphenylene sulfide resin compositions. Specifically, the present invention relates to a high-performance thermoplastic resin composition with improved mechanical properties, particularly weld strength, stiffness under heat, and toughness.
【０００２】0002
【従来の技術】ポリフェニレンサルファイド樹脂は、耐
熱エ−ジング特性、耐薬品性、難燃性にすぐれた樹脂と
して知られているが、この樹脂単独では非常に脆いとい
う大きな欠点を有しており、また、ガラス転移温度（以
下Ｔｇと略す）が約９０℃と比較的低いために、高温下
の使用時においては剛性が低下してしまうなど、いまだ
数多くの解決すべき問題点を有している。[Prior Art] Polyphenylene sulfide resin is known as a resin with excellent heat aging resistance, chemical resistance, and flame retardancy, but this resin alone has the major drawback of being extremely brittle. Furthermore, since the glass transition temperature (hereinafter abbreviated as Tg) is relatively low at approximately 90°C, there are still many problems that need to be resolved, such as a decrease in rigidity when used at high temperatures. .
【０００３】これらの問題点を解決するために、ポリフ
ェニレンサルファイド樹脂に、ポリフェニレンエ−テル
樹脂をアロイ化し、その特性を改良しようという試みは
従来より数多くなされてきた（例えば特開昭５０−１５
６５６１号公報、特開昭５９−２１３７５８号公報など
。）しかしながら、ポリフェニレンサルファイド樹脂と
ポリフェニレンエ−テル樹脂のような全く性質の異なる
樹脂をアロイ化しようとした場合、単純に両者を溶融混
練しただけでは、著しい相分離が起こり、全く商品価値
のないものとなってしまう。また、ポリアミド樹脂、エ
ポキシ樹脂などを配合して両者の混和性を改良しようと
した試みも行なわれてはいるものの、成形品として用い
ようとした場合の機械的特性は、いまだ実用上満足でき
るレベルまでには達していなかった。In order to solve these problems, many attempts have been made to improve the properties of polyphenylene sulfide resin by alloying it with polyphenylene ether resin.
6561, JP-A-59-213758, etc. ) However, when attempting to alloy resins with completely different properties such as polyphenylene sulfide resin and polyphenylene ether resin, simply melting and kneading the two will result in significant phase separation, resulting in a product that has no commercial value. It becomes. In addition, although attempts have been made to improve the miscibility of the two by blending polyamide resins and epoxy resins, the mechanical properties when used as molded products are still at a level that is practically satisfactory. had not reached that point.
【０００４】0004
【発明が解決しようとする課題】本発明は、ポリフェニ
レンサルファイド樹脂の有する特性を失うことなく、ポ
リフェニレンエ−テル樹脂をアロイ化することにより、
ウェルド強度にすぐれ、熱時剛性、靱性が改良された、
高性能化された熱可塑性樹脂組成物およびこれらよりな
る成形体を提供するという課題を解決するものである。Problems to be Solved by the Invention The present invention has been achieved by alloying polyphenylene ether resin without losing the properties of polyphenylene sulfide resin.
Excellent weld strength, improved rigidity and toughness when heated,
The object of the present invention is to provide a thermoplastic resin composition with improved performance and a molded article made of the same.
【０００５】[0005]
【課題を解決するための手段】本発明者らは、ポリフェ
ニレンサルファイド樹脂に、ポリフェニレンエ−テル樹
脂をアロイ化し、高性能化された熱可塑性樹脂組成物お
よびこれらからなる成形体を得るために研究を重ねた結
果、
（Ａ）ポリフェニレンサルファイド樹脂（Ｂ）ポリフェ
ニレンエ−テル樹脂
（Ｃ）アルコキシ基含有化合物
（Ｄ）補強剤
からなる組成物であって、（Ａ）、（Ｂ）、（Ｃ）およ
び（Ｄ）の配合量をそれぞれａ、ｂ、ｃ、ｄ重量％とす
るとき１≦ａ≦９９、１≦ｂ≦９９、０．００１≦ｃ≦
２０、０≦ｄ≦８０（ただしａ＋ｂ＋ｃ＋ｄ＝１００）
であることを特徴とする高性能化された熱可塑性樹脂組
成物が、成形体として用いた場合にウェルド強度、熱時
剛性、靱性にすぐれることを見い出し、本発明を完成し
た。[Means for Solving the Problems] The present inventors conducted research in order to alloy polyphenylene sulfide resin with polyphenylene ether resin to obtain a thermoplastic resin composition with improved performance and a molded article made of the same. As a result of stacking (A) polyphenylene sulfide resin (B) polyphenylene ether resin (C) alkoxy group-containing compound (D) reinforcing agent, (A), (B), (C) When the blending amounts of and (D) are respectively a, b, c, and d weight%, 1≦a≦99, 1≦b≦99, 0.001≦c≦
20, 0≦d≦80 (however, a+b+c+d=100)
The present invention has been completed based on the discovery that a high-performance thermoplastic resin composition characterized by the following properties has excellent weld strength, heat rigidity, and toughness when used as a molded article.
【０００６】本発明に用いられる成分（Ａ）のポリフェ
ニレンサルファイド樹脂とは、一般式The polyphenylene sulfide resin as component (A) used in the present invention has the general formula
【０００７】[0007]
【化１】[Chemical formula 1]
【０００８】で示される構造単位を６０ｍｏｌ％以上、
好ましくは８０ｍｏｌ％以上含有する重合体であり、例
えば特公昭４４−２７６７１号公報、特公昭４５−３３
６８号公報、特公昭５２−１２２４０号公報等に開示さ
れている方法を任意に選択して製造することができる。
上記重合体の他の構造単位としては、60 mol% or more of the structural unit represented by
Preferably, it is a polymer containing 80 mol% or more, for example, Japanese Patent Publication No. 44-27671, Japanese Patent Publication No. 45-33
The method disclosed in Japanese Patent Publication No. 68, Japanese Patent Publication No. 52-12240, etc. can be arbitrarily selected for production. Other structural units of the above polymer include:
【０００９】[0009]
【化２】[Case 2]
【００１０】などの中から選択された構造単位を４０ｍ
ｏｌ％以下、好ましくは２０ｍｏｌ％以下の範囲で含有
してもよい。本発明に用いられる成分（Ａ）のポリフェ
ニレンサルファイド樹脂の溶融粘度は、好ましくは１０
０〜２００，０００ポイズ（測定温度３２０℃、剪断速
度１０３ ／秒）であり、更に好ましくは２００〜５０
，０００ポイズである。40 m of structural units selected from [0010] etc.
It may be contained in a range of ol% or less, preferably 20 mol% or less. The melt viscosity of the polyphenylene sulfide resin as component (A) used in the present invention is preferably 10
0 to 200,000 poise (measurement temperature 320°C, shear rate 103/sec), more preferably 200 to 50 poise
,000 poise.
【００１１】また、成分（Ａ）のポリフェニレンサルフ
ァイド樹脂には、必要に応じ、公知の添加剤、例えば熱
安定剤、光安定剤、紫外線吸収線、酸化防止剤、滑剤、
結晶核剤、着色剤、架橋促進剤、架橋防止剤などを任意
に選択して配合することができる。本発明に用いられる
成分（Ｂ）のポリフェニレンエ−テル樹脂としては、一
般式、In addition, the polyphenylene sulfide resin of component (A) may contain known additives, such as heat stabilizers, light stabilizers, ultraviolet absorption, antioxidants, lubricants,
Crystal nucleating agents, coloring agents, crosslinking accelerators, crosslinking inhibitors, and the like can be arbitrarily selected and blended. The polyphenylene ether resin as component (B) used in the present invention has the general formula:
【００１２】0012
【化３】[Chemical formula 3]
【００１３】で表わされる構造単位からなる重合体であ
り、例えば、ポリ（２，６−ジメチル−１，４−フェニ
レンエ−テル）、ポリ（２，６−ジエチル−１，４−フ
ェニレンエ−テル）、ポリ（２，６−ジプロビル−１，
４−フェニレンエ−テル）、ポリ（２−メチル−６−エ
チル−１，４−フェニレンエ−テル）、ポリ（２−エチ
ル−６−プロピル−１，４−フェニレンエ−テル）、ポ
リ（２，６−ジアリル−１，４−フェニレンエ−テル）
、ポリ（２−メチル−６−アリル−１，４−フェニレン
エ−テル）、ポリ（２，６−ジクロロ−１，４−フェニ
レンエ−テル）、ポリ（２，６−ジブロモ−１，４−フ
ェニレンエ−テル）、ポリ（２−クロロ−６−ブロモ−
１，４−フェニレンエ−テル）、ポリ（２，６−ジフル
オロ−１，４−フェニレンエ−テル）、ポリ（２，６，
８−トリメチル−１．４−フェニレンエ−テル）、ポリ
（２，３，５，６−テトラブロモ−１．４−フェニレン
エ−テル）など、あるいはこれらの混合物、共重合体な
どを例示することができる。It is a polymer consisting of a structural unit represented by , poly(2,6-diprovir-1,
4-phenylene ether), poly(2-methyl-6-ethyl-1,4-phenylene ether), poly(2-ethyl-6-propyl-1,4-phenylene ether), poly(2,6 -diallyl-1,4-phenylene ether)
, poly(2-methyl-6-allyl-1,4-phenylene ether), poly(2,6-dichloro-1,4-phenylene ether), poly(2,6-dibromo-1,4-phenylene ether) -ter), poly(2-chloro-6-bromo-
1,4-phenylene ether), poly(2,6-difluoro-1,4-phenylene ether), poly(2,6,
8-trimethyl-1,4-phenylene ether), poly(2,3,5,6-tetrabromo-1,4-phenylene ether), or mixtures and copolymers thereof. .
【００１４】また、成分（Ｂ）のポリフェニレンエ−テ
ル樹脂が、α，β−不飽和カルボン酸、又はその誘導体
のグラフト、共重合などによって変成されていることは
相溶性の点で特に好ましい。ここで用いられるα，β−
不飽和カルボン酸、又はその誘導体としては、マレイン
酸、無水マレイン酸、コハク酸、無水コハク酸、ハイミ
ック酸、無水ハイミック酸、イタコン酸、無水イタコン
酸、無水シトラコン酸、無水アコニット酸、マレイン酸
モノメチルエステル、マレイン酸モノエチルエステル、
マレイン酸モノエチルエステルの金属塩、フマル酸モノ
エチルエステル、ビニル安息香酸、ビニルフマル酸、フ
マル酸モノエチルエステルの金属塩、グリシジルメタク
リレ−ト、グリシジルアクリレ−ト、アリルグリシジル
エ−テル、ビニルグリシジルエ−テル、グリシジルイタ
コネ−ト、アクリル酸、メタクリル酸、マレイミドなど
を例示することができるが、なかでも酸無水基を有する
か、エポキシ基を有する化合物が好ましく、特に酸無水
基を有するものが好ましい。[0014] Furthermore, it is particularly preferable from the viewpoint of compatibility that the polyphenylene ether resin of component (B) is modified by grafting or copolymerization with an α,β-unsaturated carboxylic acid or a derivative thereof. α, β− used here
Unsaturated carboxylic acids or derivatives thereof include maleic acid, maleic anhydride, succinic acid, succinic anhydride, himic acid, himic anhydride, itaconic acid, itaconic anhydride, citraconic anhydride, aconitic anhydride, monomethyl maleate. ester, maleic acid monoethyl ester,
Metal salts of maleic acid monoethyl ester, fumaric acid monoethyl ester, vinyl benzoic acid, vinyl fumaric acid, metal salts of fumaric acid monoethyl ester, glycidyl methacrylate, glycidyl acrylate, allyl glycidyl ether, vinyl Examples include glycidyl ether, glycidyl itaconate, acrylic acid, methacrylic acid, maleimide, etc. Among them, compounds having an acid anhydride group or an epoxy group are preferable, particularly those having an acid anhydride group. is preferred.
【００１５】前記ポリフェニレンエ−テル樹脂に結合す
るα，β−不飽和カルボン酸、又はその誘導体の結合量
は、０．００１〜５０ｍｏｌ％の範囲が好ましく、０．
０１〜１０ｍｏｌ％の範囲が特に好ましい。また、ポリ
フェニレンエ−テル樹脂への、α，β−不飽和カルボン
酸、又はその誘導体のグラフト、共重合方法は、従来公
知の技術を用いて行なうことができる。The amount of α,β-unsaturated carboxylic acid or its derivative bound to the polyphenylene ether resin is preferably in the range of 0.001 to 50 mol%, and 0.001 to 50 mol%.
A range of 0.01 to 10 mol% is particularly preferred. Further, the method of grafting and copolymerizing the α,β-unsaturated carboxylic acid or its derivative onto the polyphenylene ether resin can be carried out using conventionally known techniques.
【００１６】本発明に用いられる成分（Ｃ）のアルコキ
シ基含有化合物としては、一般式、The alkoxy group-containing compound as component (C) used in the present invention has the general formula:
【００１７】[0017]
【化４】[C4]
【００１８】からなる分子構造を、その分子中に含有す
る化合物である。これらの化合物としては、例えば、ビ
ニルトリス（β−メトキシエトキシ）シラン、ビニルト
リスエトキシシラン、ビニルトリメトキシシラン、γ−
メタクリロキシプロピルトリメトキシシラン、β−（３
，４−エポキシシクロヘキシル）エチルトリメトキシシ
ラン、γ−グリシドキシプロピルトリメトキシシラン、
γ−グリシドキシプロピルメチルジエトキシシラン、Ｎ
−β（アミノエチル）γ−アミノプロピルトリメトキシ
シラン、Ｎ−β（アミノエチル）γ−アミノプロピルジ
メトキシシラン、γ−アミノプロピルトリエトキシシラ
ン、Ｎ−フェニル−γ−アミノプロピルトリメトキシシ
ラン、γ−メルカプトプロピルトリメトシシラン、γ−
クロロプロピルトリメトキシシラン、イソプロピルトリ
ステアロイルチタネ−ト、イソプロピルトリス（ジオク
チルパイロホスフェ−ト）チタネ−ト、イソプロピルト
リ（Ｎ−アミノエチル−アミノエチル）チタネ−ト、テ
トラオクチルビス（ジトリデシルフォスファイト）チタ
ネ−ト、テトラ〔２，２−ジアリルオキシメチル−１−
ブチル（ジトリデシル）ホスファイト〕チタネ−ト、ビ
ス（ジオクチルパイロホスフェ−ト）オキシアセテ−ト
チタネ−ト、ビス（ジオクチルパイロホスフェ−ト）エ
チレンチタネ−ト、イソプロピルトリオクタノイルチタ
ネ−ト、イソプロピルジメタクリルイソステアロイルチ
タネ−ト、イソプロピルトリドデシルベンゼンスルホニ
ルチタネ−ト、イソプロピルイソステアロイルジアクリ
ルチタネ−ト、イソプロピルトリ（ジオクチルホスフェ
−ト）チタネ−ト、イソプロピルトリクミルフェニルチ
タネ−ト、テトライソプロピルビス（ジオクチルホスフ
ァイト）チタネ−ト、アセトアルコキシアルミニウムジ
イソプロピレ−トなどを例示することができるが、相溶
性の点で特に好ましいのはアミノ基含有アルコキシシラ
ンである。It is a compound containing a molecular structure consisting of the following in its molecule. Examples of these compounds include vinyltris(β-methoxyethoxy)silane, vinyltrisethoxysilane, vinyltrimethoxysilane, and γ-
Methacryloxypropyltrimethoxysilane, β-(3
, 4-epoxycyclohexyl)ethyltrimethoxysilane, γ-glycidoxypropyltrimethoxysilane,
γ-glycidoxypropylmethyldiethoxysilane, N
-β(aminoethyl)γ-aminopropyltrimethoxysilane, N-β(aminoethyl)γ-aminopropyldimethoxysilane, γ-aminopropyltriethoxysilane, N-phenyl-γ-aminopropyltrimethoxysilane, γ- Mercaptopropyltrimethosysilane, γ-
Chloropropyltrimethoxysilane, Isopropyl tristearoyl titanate, Isopropyl tris(dioctylpyrophosphate) titanate, Isopropyl tri(N-aminoethyl-aminoethyl) titanate, Tetraoctylbis(ditridecylphosate) phyto) titanate, tetra[2,2-diallyloxymethyl-1-
Butyl (ditridecyl) phosphite] titanate, bis(dioctyl pyrophosphate) oxyacetate titanate, bis(dioctyl pyrophosphate) ethylene titanate, isopropyltrioctanoyl titanate, isopropyl di Methacryl isostearoyl titanate, isopropyl tridodecylbenzenesulfonyl titanate, isopropyl isostearoyl diacryl titanate, isopropyl tri(dioctyl phosphate) titanate, isopropyl tricumylphenyl titanate, Examples include tetraisopropyl bis(dioctyl phosphite) titanate and acetalkoxyaluminum diisopropylate, but amino group-containing alkoxysilanes are particularly preferred in terms of compatibility.
【００１９】本発明に用いられる成分（Ｃ）のアルコキ
シ基含有化合物は、あらかじめポリフェニレンサルファ
イド樹脂、ポリフェニレンエ−テル樹脂と反応させてか
ら溶融混練してもよいし、ポリフェニレンサルファイド
樹脂、ポリフェニレンエ−テル樹脂を溶融混練する時点
で加えてもよい。本発明に用いられる成分（Ｄ）の補強
剤としては、通常の熱可塑性樹脂に配合される公知のも
のをそのまま使用することができる。例えば、ガラス繊
維、炭素繊維、チタン酸カリウム繊維、ロックウ−ル、
炭化ケイ素繊維、セラミック繊維、金属繊維、窒化ケイ
素繊維、硫酸バリウム、硫酸カルシウム、カオリン、焼
成カオリン、クレ−、パイロフライト、ベントナイト、
セリサイト、ゼオライト、マイカ、雲母、ネフェリンシ
ナイト、タルク、アタルパルジャイト、ウォラストナイ
ト、フェライト、ケイ酸カルシウム、炭酸カルシウム、
酸化チタン、二硫化モリブデン、カ−ボンブラック，ガ
ラスビ−ズなどを例示することができる。The alkoxy group-containing compound of component (C) used in the present invention may be melt-kneaded after reacting with polyphenylene sulfide resin or polyphenylene ether resin in advance, or may be melt-kneaded with polyphenylene sulfide resin or polyphenylene ether resin. It may be added at the time of melt-kneading the resin. As the reinforcing agent for component (D) used in the present invention, known reinforcing agents that are blended into ordinary thermoplastic resins can be used as they are. For example, glass fiber, carbon fiber, potassium titanate fiber, rock wool,
Silicon carbide fiber, ceramic fiber, metal fiber, silicon nitride fiber, barium sulfate, calcium sulfate, kaolin, calcined kaolin, clay, pyrolite, bentonite,
Sericite, zeolite, mica, mica, nephelinsinite, talc, atalpulgite, wollastonite, ferrite, calcium silicate, calcium carbonate,
Examples include titanium oxide, molybdenum disulfide, carbon black, and glass beads.
【００２０】また、これらの補強剤は、従来公知のカッ
プリング剤、集束剤等で処理されていてもよい。本発明
に用いられる成分（Ａ）、（Ｂ）の配合量をそれぞれａ
、ｂ重量％とすると、１≦ａ≦９９、１≦ｂ≦９９の範
囲が好ましく、５≦ａ≦９５、５≦ｂ≦９５の範囲が特
に好ましく、５０≦ａ≦９５、５≦ｂ≦５０の範囲が特
に好ましい。ａおよびｂが１未満もしくは９９以上であ
ると、本発明の効果が見られない。Further, these reinforcing agents may be treated with conventionally known coupling agents, sizing agents, etc. The amounts of components (A) and (B) used in the present invention are a
, b% by weight, the range is preferably 1≦a≦99, 1≦b≦99, particularly preferably the range 5≦a≦95, 5≦b≦95, 50≦a≦95, 5≦b≦ A range of 50 is particularly preferred. If a and b are less than 1 or greater than or equal to 99, the effects of the present invention will not be seen.
【００２１】本発明の成分（Ｃ）の配合量をｃ重量％と
すると０．００１≦ｃ≦２０の範囲が好ましく、０．０
１≦ｃ≦１０の範囲が特に好ましく、０．１≦ｃ≦５の
範囲が最も好ましい。ｃが０．００１以下であると、本
発明の効果が見られない。２０以上であると、発泡、分
解などの好ましからざる結果を招くことになる。本発明
における成分（Ｄ）の配合量をｄ重量％とすると、０≦
ｄ≦８０の範囲が好ましく、０≦ｄ≦６０の範囲が特に
好ましい。ｄが８０以上であると、溶融混練が非常に困
難になるばかりか、得られた成形品の外観が悪く、商品
価値のないものとなってしまう。[0021] The blending amount of component (C) of the present invention is preferably in the range of 0.001≦c≦20, expressed as c% by weight, and 0.0
The range of 1≦c≦10 is particularly preferred, and the range of 0.1≦c≦5 is most preferred. When c is less than 0.001, the effect of the present invention is not observed. If it is 20 or more, undesirable results such as foaming and decomposition will occur. If the blending amount of component (D) in the present invention is d% by weight, 0≦
The range of d≦80 is preferable, and the range of 0≦d≦60 is particularly preferable. If d is 80 or more, not only will it be extremely difficult to melt and knead, but the resulting molded product will have a poor appearance and will have no commercial value.
【００２２】本発明の組成物１００重量部に対し、５０
重量部以下の範囲で、他の熱可塑性樹脂、例えば、ポリ
アミド、ポリエステル、ポリケトン、ポリカ−ボネ−ト
、ポリサルホン、ポリアミドイミド、ポリエ−テルイミ
ド、ポリエ−テルサルホン、ポリエ−テルケトン、ポリ
エ−テルエ−テルケトン、ポリエ−テルケトンケトン、
スチレン系ホリマ−、オレフィン系ポリマ−などを配合
してもよい。[0022] For 100 parts by weight of the composition of the present invention, 50 parts by weight
Other thermoplastic resins such as polyamide, polyester, polyketone, polycarbonate, polysulfone, polyamideimide, polyetherimide, polyether sulfone, polyether ketone, polyether ether ketone, etc. within the range of parts by weight or less. polyetherketoneketone,
Styrene polymers, olefin polymers, etc. may also be blended.
【００２３】本発明の組成物に、通常の熱可塑性樹脂に
添加される添加剤、例えば熱安定剤、光安定剤、紫外線
吸収剤、滑剤、核剤、酸化防止剤、染料、顔料、離型剤
、可塑剤などを必要に応じて配合することも特に制限さ
れるものではない。本発明の組成物の調製は、ブラベン
ダ−、ニ−ダ−、バンバリ−ミキサ−、押出機等の従来
公知の技術によって達成される。The composition of the present invention contains additives that are added to ordinary thermoplastic resins, such as heat stabilizers, light stabilizers, ultraviolet absorbers, lubricants, nucleating agents, antioxidants, dyes, pigments, and mold release agents. There is no particular restriction on adding additives, plasticizers, etc. as necessary. Preparation of the compositions of the present invention is accomplished by conventional techniques such as Brabenders, kneaders, Banbury mixers, extruders, and the like.
【００２４】本発明の組成物の成形体は、射出成形、押
出成形、ブロ−成形などの従来公知の技術を用いること
により得ることができる。A molded article of the composition of the present invention can be obtained by using conventionally known techniques such as injection molding, extrusion molding, and blow molding.
【００２５】[0025]
【実施例】以下に本発明の実施例を示すが、本発明はそ
の要旨を超えない限り、以下の実施例に限定されるもの
ではない。本発明に用いた原料および試験方法を以下に
示す。
〔１〕原料
■ ＰＰＳ
ポリフェニレンサルファイド樹脂：リニアタイプ〔東レ
・フィリップスペトロ−リアム（株）製 Ｍ２５８８
〕■ ＰＰＥ
ポリフェニレンエ−テル樹脂：ポリ（２，６−ジメチル
−１，４−フェニレンエ−テル）〔旭化成工業（株）製
〕数平均分子量約２０，０００
■ ＭＰＰＥ
■のＰＰＥに、無水マレイン酸を０．７ｍｏｌ％付加し
たもの（製造例にて合成したもの）。
■ ＣＰ
γ−アミノプロピルトリエトキシシラン〔日本ユニカ−
（株）製Ａ１１００〕
■ ＧＦ
ガラス繊維〔旭ファイバ−グラス（株）製 ０３ＪＡ
ＦＴ−２Ａ ３ｍｍチョップドストランド〕■ Ｒ
Ｗ
ロックウ−ル（新日鉄化学（株）製 エスファイバ−
ＦＦ 繊維長１２０μｍ、繊維径４μｍ〕〔２〕試験
方法
■ 引張試験（１／８インチ）
ＡＳＴＭ Ｄ６３８ に従い試験を行なった。
■ 曲げ試験（１／８インチ）
ＡＳＴＭ Ｄ７９０ に従い試験を行なった。
■ アイゾット衝撃試験
ＡＳＴＭ Ｄ２５６ に従い試験を行なった。
■ 熱変形温度（ＨＤＴ）
ＡＳＴＭ Ｄ６４８ に従い、加重１８． ６ｋｇ
・ｆ／ｃｍ２の条件で試験を行なった。
■ ウェルド部引張特性
〔図１〕に示す、長さ１６５ｍｍ（図中ａ）、１００ｍ
ｍ（図中ｂ）、巾１９ｍｍ（図中ｃ）、１３ｍｍ（図中
ｄ）、厚み３ｍｍの形状を有し、両端から溶融樹脂が流
れ込み、中央部にウェルド部１が形成されるような金型
を用いて成形片を作った。この成形片を、ＡＳＴＭ
Ｄ６３８の引張試験法に従って、引張試験を行ない、引
張強度と引張伸度を測定した。なお、図中２はスプル−
、３はランナ−、４は試験片を示す。[Examples] Examples of the present invention are shown below, but the present invention is not limited to the following examples unless it exceeds the gist thereof. The raw materials and test methods used in the present invention are shown below. [1] Raw materials ■ PPS polyphenylene sulfide resin: Linear type [Manufactured by Toray Phillips Petroleum Co., Ltd. M2588
]■ PPE polyphenylene ether resin: poly(2,6-dimethyl-1,4-phenylene ether) [manufactured by Asahi Kasei Corporation] number average molecular weight approximately 20,000 ■ MPPE ■Maleic anhydride is added to the PPE of ■. (synthesized in the production example). ■ CP γ-Aminopropyltriethoxysilane [Nippon Unica
A1100 made by Asahi Fiberglass Co., Ltd. ■ GF glass fiber [03JA made by Asahi Fiberglass Co., Ltd.
FT-2A 3mm chopped strand〕■ R
W Rock wool (Nippon Steel Chemical Co., Ltd. S-Fiber)
FF Fiber length: 120 μm, fiber diameter: 4 μm] [2] Test method ■ Tensile test (1/8 inch) The test was conducted in accordance with ASTM D638. ■ Bending test (1/8 inch) The test was conducted according to ASTM D790. ■ Izod impact test Tests were conducted according to ASTM D256. ■ Heat distortion temperature (HDT) According to ASTM D648, load 18. 6kg
・The test was conducted under the condition of f/cm2. ■ Tensile characteristics of the weld part as shown in Figure 1, length 165 mm (a in the figure), 100 m
It has a shape of m (b in the figure), width 19 mm (c in the figure), 13 mm (d in the figure), and thickness 3 mm, and the molten resin flows from both ends and a weld part 1 is formed in the center. A molded piece was made using a mold. This molded piece was manufactured using ASTM
A tensile test was conducted according to the tensile test method of D638, and the tensile strength and tensile elongation were measured. In addition, 2 in the figure is a sprue.
, 3 indicates a runner, and 4 indicates a test piece.
【００２６】[0026]
【製造例】「酸無水基が付加したポリフェニレンエ−テ
ル樹脂（ＭＰＰＥ）の合成」ポリ（２，６−ジメチル−
１，４−フェニレンエ−テル）１００重量部、無水マレ
イン酸３重量部、２，５−ジメチル−ジ（ｔ−ブチルパ
−オキシ）ヘキサン〔日本油脂（株）製 パ−ペキサ
２５Ｂ〕１重量部を、３０ｍｍφ二軸押出機〔ＰＣＭ−
３０：池貝鉄工（株）製 Ｌ／Ｄ＝１７〕中で、３０
０〜３２０℃の温度で混合し、更にペレット化し目的物
を得た。得られたポリマ−をトルエン−メタノ−ルにて
再沈澱を繰返し、真空乾燥を行った後、ナトリウムメチ
ラ−トにて無水マレイン酸の付加量を滴定により求めた
所、０．７ｍｏｌ％の無水マレイン酸が付加していた。[Production example] “Synthesis of polyphenylene ether resin (MPPE) with acid anhydride groups added” Poly(2,6-dimethyl-
100 parts by weight of 1,4-phenylene ether), 3 parts by weight of maleic anhydride, and 1 part by weight of 2,5-dimethyl-di(t-butylperoxy)hexane [Perpexa 25B manufactured by NOF Corporation]. , 30mmφ twin screw extruder [PCM-
30: Manufactured by Ikegai Tekko Co., Ltd. L/D=17], 30
The mixture was mixed at a temperature of 0 to 320°C and further pelletized to obtain the desired product. The resulting polymer was repeatedly reprecipitated with toluene-methanol and dried under vacuum.The amount of maleic anhydride added was determined by titration with sodium methylate, and the amount was 0.7 mol%. Maleic anhydride was added.
【００２７】[0027]
【実施例１〜４、比較例１〜３】ＰＰＳ、ＰＰＥ、ＭＰ
ＰＥ、ＣＰを表１に示す組成で、池貝鉄工（株）製
ＰＣＭ４５（Ｌ／Ｄ＝３３．５）二軸押出機中で、３０
０〜３２０℃のシリンダ−設定温度で溶融混練し、更に
ペレット化して組成物を得た。この組成物を、シリンダ
−設定温度３００〜３１０℃、金型１３５℃で成形し、
物性を測定した結果を表２に示す。[Examples 1 to 4, Comparative Examples 1 to 3] PPS, PPE, MP
Made by Ikegai Tekko Co., Ltd. with PE and CP compositions shown in Table 1.
In a PCM45 (L/D=33.5) twin screw extruder, 30
The mixture was melt-kneaded at a cylinder temperature of 0 to 320°C and further pelletized to obtain a composition. This composition is molded at a cylinder set temperature of 300 to 310°C and a mold of 135°C,
Table 2 shows the results of measuring the physical properties.
【００２８】[0028]
【実施例５〜１０】実施例４の組成物と、ガラス繊維（
ＧＦ）、ロックウ−ル（ＲＷ）を表３に示す組成で、池
貝鉄工（株）製 ＰＣＭ４５（Ｌ／Ｄ＝３３．５）二
軸押出機で、３００〜３１０℃のシリンダ−設定温度で
溶融混練し、更にペレット化して組成物を得た。[Examples 5 to 10] The composition of Example 4 and glass fiber (
GF), rock wool (RW) with the composition shown in Table 3 was melted using a PCM45 (L/D = 33.5) twin-screw extruder manufactured by Ikegai Tekko Co., Ltd. at a cylinder temperature of 300 to 310°C. The mixture was kneaded and further pelletized to obtain a composition.
【００２９】此の組成物をシリンダ−設定温度３２０℃
、金型温度１４０℃で成形し、物性を測定した結果を表
４に示す。[0029] This composition was put into a cylinder at a set temperature of 320°C.
Table 4 shows the results of molding at a mold temperature of 140° C. and measuring the physical properties.
【００３０】[0030]
【表１】[Table 1]
【００３１】[0031]
【表２】[Table 2]
【００３２】[0032]
【表３】[Table 3]
【００３３】[0033]
【表４】[Table 4]
【００３４】[0034]
【発明の効果】本発明の組成物、成形体は、ウェルド強
度にすぐれ、熱時剛性、靱性（衝撃性）にすぐれるとい
う、非常に良好な物性を有し、また外観が良好であり、
バリ発生が少なく、難燃性にすぐれるという、成形材料
、成形体としてのすぐれた特性を有しているために、高
温下で使用され、かつ熱時剛性が必要とされる自動車部
品（ロッカ−カバ−、フロントカバ−、オ−メントカバ
−、デリバリ−パイプ、インヒビタ−スイッチケ−ス、
コネクタ−、エアダクト等）、電気・電子部品（ＳＭＴ
コネクタ−等）などに好適に用いることができる。[Effects of the Invention] The composition and molded article of the present invention have very good physical properties such as excellent weld strength, excellent rigidity at heat, and toughness (impact resistance), and also have a good appearance.
It has excellent properties as a molding material and molded product, such as low burr generation and excellent flame retardancy. -Cover, front cover, ornament cover, delivery pipe, inhibitor switch case,
connectors, air ducts, etc.), electrical/electronic components (SMT
It can be suitably used for connectors, etc.).
【図１】本発明の実施例に供する試験片作製用金型の平
面図である。FIG. 1 is a plan view of a mold for producing a test piece used in an example of the present invention.
Claims (1)
脂（Ｂ）ポリフェニレンエ−テル樹脂 （Ｃ）アルコキシ基含有化合物 （Ｄ）補強剤 からなる組成物であって、（Ａ）、（Ｂ）、（Ｃ）およ
び（Ｄ）の配合量をそれぞれａ、ｂ、ｃ、ｄ重量％とす
るとき、１≦ａ≦９９、１≦ｂ≦９９、０．００１≦ｃ
≦２０、０≦ｄ≦８０（ただしａ＋ｂ＋ｃ＋ｄ＝１００
）であることを特徴とする高性能化された熱可塑性樹脂
組成物。1. A composition comprising (A) a polyphenylene sulfide resin, (B) a polyphenylene ether resin, (C) an alkoxy group-containing compound, and (D) a reinforcing agent, the composition comprising (A), (B), and (C) When the blending amounts of and (D) are a, b, c, and d weight%, respectively, 1≦a≦99, 1≦b≦99, 0.001≦c
≦20, 0≦d≦80 (however, a+b+c+d=100
) A high-performance thermoplastic resin composition.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP40132290A JPH04213357A (en) | 1990-12-11 | 1990-12-11 | Thermoplastic resin composition with high performance |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP40132290A JPH04213357A (en) | 1990-12-11 | 1990-12-11 | Thermoplastic resin composition with high performance |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH04213357A true JPH04213357A (en) | 1992-08-04 |
Family
ID=18511159
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP40132290A Withdrawn JPH04213357A (en) | 1990-12-11 | 1990-12-11 | Thermoplastic resin composition with high performance |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH04213357A (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5336713A (en) * | 1992-05-22 | 1994-08-09 | Sumitomo Chemical Company, Limited | Resin composition |
| US5612401A (en) * | 1995-03-17 | 1997-03-18 | General Electric Company | Compositions of poly(phenylene ether) poly(arylene sulfide) polyester resins and compatibilizer compound |
| KR20000029411A (en) * | 1998-10-29 | 2000-05-25 | 엔다 나오토 | Polypenylene sulfide resin composite material |
| JP2002003714A (en) * | 2000-06-23 | 2002-01-09 | Mitsubishi Gas Chem Co Inc | Resin composition |
-
1990
- 1990-12-11 JP JP40132290A patent/JPH04213357A/en not_active Withdrawn
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5336713A (en) * | 1992-05-22 | 1994-08-09 | Sumitomo Chemical Company, Limited | Resin composition |
| US5612401A (en) * | 1995-03-17 | 1997-03-18 | General Electric Company | Compositions of poly(phenylene ether) poly(arylene sulfide) polyester resins and compatibilizer compound |
| KR20000029411A (en) * | 1998-10-29 | 2000-05-25 | 엔다 나오토 | Polypenylene sulfide resin composite material |
| JP2002003714A (en) * | 2000-06-23 | 2002-01-09 | Mitsubishi Gas Chem Co Inc | Resin composition |
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| Date | Code | Title | Description |
|---|---|---|---|
| A300 | Application deemed to be withdrawn because no request for examination was validly filed |
Free format text: JAPANESE INTERMEDIATE CODE: A300 Effective date: 19980312 |