JPH04206992A - Printed wiring board and fabrication thereof - Google Patents
Printed wiring board and fabrication thereofInfo
- Publication number
- JPH04206992A JPH04206992A JP33951490A JP33951490A JPH04206992A JP H04206992 A JPH04206992 A JP H04206992A JP 33951490 A JP33951490 A JP 33951490A JP 33951490 A JP33951490 A JP 33951490A JP H04206992 A JPH04206992 A JP H04206992A
- Authority
- JP
- Japan
- Prior art keywords
- resin
- conductive circuit
- printed wiring
- thermal hardening
- conductive
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000004519 manufacturing process Methods 0.000 title claims description 16
- 229920005989 resin Polymers 0.000 claims abstract description 56
- 239000011347 resin Substances 0.000 claims abstract description 56
- 238000000034 method Methods 0.000 claims abstract description 12
- 238000002347 injection Methods 0.000 claims description 29
- 239000007924 injection Substances 0.000 claims description 29
- 229920001187 thermosetting polymer Polymers 0.000 claims description 25
- 238000001746 injection moulding Methods 0.000 claims description 12
- 239000002985 plastic film Substances 0.000 claims description 7
- 229920006255 plastic film Polymers 0.000 claims description 6
- 239000004634 thermosetting polymer Substances 0.000 claims 1
- 239000000758 substrate Substances 0.000 abstract description 9
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 abstract description 7
- 238000005530 etching Methods 0.000 abstract description 5
- 239000005011 phenolic resin Substances 0.000 abstract description 5
- 229920001721 polyimide Polymers 0.000 abstract description 5
- 229920006337 unsaturated polyester resin Polymers 0.000 abstract description 5
- 229910000679 solder Inorganic materials 0.000 abstract description 3
- 239000004642 Polyimide Substances 0.000 abstract description 2
- 229920000728 polyester Polymers 0.000 abstract description 2
- 238000001125 extrusion Methods 0.000 abstract 4
- 229910052802 copper Inorganic materials 0.000 abstract 1
- 239000010949 copper Substances 0.000 abstract 1
- 238000009413 insulation Methods 0.000 abstract 1
- 229920005992 thermoplastic resin Polymers 0.000 description 7
- 239000011889 copper foil Substances 0.000 description 6
- 238000000465 moulding Methods 0.000 description 6
- 239000010410 layer Substances 0.000 description 5
- 239000003822 epoxy resin Substances 0.000 description 4
- 238000010438 heat treatment Methods 0.000 description 4
- 229920000647 polyepoxide Polymers 0.000 description 4
- 239000003795 chemical substances by application Substances 0.000 description 3
- 230000000052 comparative effect Effects 0.000 description 3
- 238000010292 electrical insulation Methods 0.000 description 3
- 238000005516 engineering process Methods 0.000 description 3
- -1 fluororesin Substances 0.000 description 3
- 239000002184 metal Substances 0.000 description 3
- 229910052751 metal Inorganic materials 0.000 description 3
- 239000004695 Polyether sulfone Substances 0.000 description 2
- 239000004697 Polyetherimide Substances 0.000 description 2
- 229920006351 engineering plastic Polymers 0.000 description 2
- 239000000203 mixture Substances 0.000 description 2
- 229920006393 polyether sulfone Polymers 0.000 description 2
- 229920001601 polyetherimide Polymers 0.000 description 2
- 239000009719 polyimide resin Substances 0.000 description 2
- 229920001296 polysiloxane Polymers 0.000 description 2
- 238000005476 soldering Methods 0.000 description 2
- 229920002554 vinyl polymer Polymers 0.000 description 2
- KXGFMDJXCMQABM-UHFFFAOYSA-N 2-methoxy-6-methylphenol Chemical compound [CH]OC1=CC=CC([CH])=C1O KXGFMDJXCMQABM-UHFFFAOYSA-N 0.000 description 1
- 229920000106 Liquid crystal polymer Polymers 0.000 description 1
- 239000004977 Liquid-crystal polymers (LCPs) Substances 0.000 description 1
- 239000004640 Melamine resin Substances 0.000 description 1
- 229920000877 Melamine resin Polymers 0.000 description 1
- 239000004696 Poly ether ether ketone Substances 0.000 description 1
- 229920012266 Poly(ether sulfone) PES Polymers 0.000 description 1
- 239000004952 Polyamide Substances 0.000 description 1
- 239000004962 Polyamide-imide Substances 0.000 description 1
- 239000004698 Polyethylene Substances 0.000 description 1
- 239000004734 Polyphenylene sulfide Substances 0.000 description 1
- 229920001807 Urea-formaldehyde Polymers 0.000 description 1
- 229920000122 acrylonitrile butadiene styrene Polymers 0.000 description 1
- 239000012790 adhesive layer Substances 0.000 description 1
- 239000012461 cellulose resin Substances 0.000 description 1
- 238000010924 continuous production Methods 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000004070 electrodeposition Methods 0.000 description 1
- 238000007772 electroless plating Methods 0.000 description 1
- 238000002474 experimental method Methods 0.000 description 1
- 239000004744 fabric Substances 0.000 description 1
- 239000000835 fiber Substances 0.000 description 1
- 239000000945 filler Substances 0.000 description 1
- 239000011888 foil Substances 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 239000003365 glass fiber Substances 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- 239000000155 melt Substances 0.000 description 1
- 239000002991 molded plastic Substances 0.000 description 1
- JYIZNFVTKLARKT-UHFFFAOYSA-N phenol;1,3,5-triazine-2,4,6-triamine Chemical compound OC1=CC=CC=C1.NC1=NC(N)=NC(N)=N1 JYIZNFVTKLARKT-UHFFFAOYSA-N 0.000 description 1
- 229920001568 phenolic resin Polymers 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 229920002647 polyamide Polymers 0.000 description 1
- 229920002312 polyamide-imide Polymers 0.000 description 1
- 229920005668 polycarbonate resin Polymers 0.000 description 1
- 239000004431 polycarbonate resin Substances 0.000 description 1
- 229920001225 polyester resin Polymers 0.000 description 1
- 239000004645 polyester resin Substances 0.000 description 1
- 229920002530 polyetherether ketone Polymers 0.000 description 1
- 229920000573 polyethylene Polymers 0.000 description 1
- 229920000069 polyphenylene sulfide Polymers 0.000 description 1
- 238000007639 printing Methods 0.000 description 1
- 229920006305 unsaturated polyester Polymers 0.000 description 1
- 238000007740 vapor deposition Methods 0.000 description 1
- 238000009736 wetting Methods 0.000 description 1
Landscapes
- Manufacturing Of Printed Wiring (AREA)
Abstract
Description
【発明の詳細な説明】
［産業上の利用分野コ
本発明は各種の工業用品や家庭用品等に利用されるプリ
ント配線体及びその製造方法に関する。DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a printed wiring body used in various industrial products, household products, etc., and a method for manufacturing the same.
［従来の技術］
従来のプリント配線体は、紙やガラスクロス等に不飽和
ポリエステル樹脂、エポキシ樹脂。[Conventional technology] Conventional printed wiring bodies are made of unsaturated polyester resin or epoxy resin on paper, glass cloth, etc.
ポリイミド樹脂等の熱硬化性樹脂な含浸、半硬化させた
ブレブリグと、銅箔とを接当し、これをプレス成形に付
して銅張積層板を得た後、さらに、該銅張積層板をエツ
チング等で配線加工処理して製造されている。このため
、得られるプリント配線体は、平板状の形状に限定され
ざるを得なかった。A semi-cured Brebrig impregnated with a thermosetting resin such as a polyimide resin is brought into contact with a copper foil, and this is press-molded to obtain a copper-clad laminate. It is manufactured by processing the wiring by etching etc. For this reason, the obtained printed wiring body had to be limited to a flat plate shape.
一方、近年、各種の電子機器の小型化が進められており
、省スペースやコストダウンの点から非平板状をなす三
次元形状のプリント配線体が要望されており、熱可塑性
樹脂の射出成形体に対して無電解メツキによる電子回路
を形成したもの、あるいは、導電ペーストによる回路が
印刷されているプラスチックフィルムからなる転写用シ
ートを用いて導電性回路を熱可塑性樹脂の射出成形体に
転写したもの等が提案されている。On the other hand, in recent years, various electronic devices have become smaller, and from the viewpoint of space saving and cost reduction, there is a demand for non-flat three-dimensional printed wiring bodies, and thermoplastic resin injection molded An electronic circuit is formed by electroless plating, or a conductive circuit is transferred to a thermoplastic resin injection molded body using a transfer sheet made of plastic film on which a conductive paste circuit is printed. etc. have been proposed.
［発明が解決しようとする課題］
ところで、前述の非平板状の三次元形状のプリント配線
体は、該配線体の基板をなしている樹脂成形体の部分が
、例えば、ＡＢＳ樹脂やポリカーボネート樹脂等の汎用
の熱可塑性樹脂で成形されている場合には、半田耐熱性
が不十分なため、ＩＣデツプ等の実装が不可能である。[Problems to be Solved by the Invention] Incidentally, in the above-mentioned non-flat three-dimensional printed wiring body, the portion of the resin molded body forming the substrate of the wiring body is made of, for example, ABS resin, polycarbonate resin, etc. If it is molded from a general-purpose thermoplastic resin, it is impossible to mount an IC depth or the like due to insufficient solder heat resistance.
他方において、近年、ポリエーテルエーテルケトン（Ｐ
ＥＥＫ） 、ポリエーテルイミド（ＰＥＩ） 、ポリエ
ーテルスルフォン（ＰＥＳ ） 。On the other hand, in recent years, polyetheretherketone (P
EEK), polyetherimide (PEI), polyether sulfone (PES).
ポリフェニレンサルファイド（ｐｐｓ ） 、あるいは
液晶ポリマー等の高耐熱性のスーパーエンジニアリング
プラスチック等が開発されているが、これらの高耐熱性
のスーパーエンジニアリングプラスチックによるプリン
ト配線体の場合ニモ、その耐熱性については未だ十分で
はなく、しかも、樹脂自体の価格が非常に高価であり、
また、樹脂の射出成形が３００〜４３０℃というような
高温度で行なわれるものであることから、例えばポリイ
ミド樹脂等の高耐熱性を有する高価な樹脂フィルムを利
用した転写用シートを使用しなければならない等の問題
を有する。Highly heat-resistant super engineering plastics such as polyphenylene sulfide (pps) or liquid crystal polymer have been developed, but the heat resistance of printed circuit boards made of these highly heat-resistant super engineering plastics is still insufficient. Moreover, the price of the resin itself is very expensive.
Furthermore, since resin injection molding is carried out at high temperatures of 300 to 430°C, it is necessary to use a transfer sheet made of an expensive resin film with high heat resistance, such as polyimide resin. There are problems such as not being possible.
これに対して本発明は、形状が平板状に限定されるよう
なことがなく、しかも、半田適性に十二分な耐熱性を具
備しており、かつ、廉価に供給されるプリント配線体、
及び、その製造方法を提供することを課題とする。In contrast, the present invention provides a printed wiring body which is not limited to a flat plate shape, has sufficient heat resistance for solderability, and is supplied at a low cost.
An object of the present invention is to provide a method for manufacturing the same.
［課題を解決するための手段］
本節１の発明のプリント配線体は、配線体の基板をなす
樹脂成形体が熱硬化性樹脂による射出成形体で形成され
ており、該成形体の表面に転写層による導電性回路が設
けられており、しかも、熱硬化性樹脂による射出成形体
と導電性回路とが一体成形されているものである。[Means for Solving the Problems] In the printed wiring body of the invention of Section 1, the resin molded body forming the substrate of the wiring body is formed of an injection molded body of thermosetting resin, and the printed wiring body is A layered conductive circuit is provided, and the injection molded body made of a thermosetting resin and the conductive circuit are integrally molded.
本節２の発明のプリント配線体の製造方法は、プラスチ
ックフィルムによるキャリヤーフィルムと該キャリヤー
フィルムの表面に形成されている導電性回路とを具備す
る転写用シートを、可動型と固定型とによる射出成形用
の金型のキャビティー内に、転写用シートにおけるキャ
リヤーフィルム面がキャビティーの表面と接当するよう
にしてセットする工程と、金型の型締めを行なう工程と
、熱硬化性樹脂を射出成形する工程とによって、プリン
ト配線体の基板をなす熱硬化性樹脂の成形を行なうと同
時に導電性回路の転写を行ない、さらに、得られた射出
成形体を金型から取り出すと共に、転写用シートにおけ
るキャリヤーフィルムを剥離することにより、目的製品
たるプリント配線体、すなわち、導電性回路が表面に（
＝１されている熱硬化性樹脂の射出成形体からなるプリ
ント配線体を得ることからなる。The method for producing a printed wiring body according to the invention of Section 2 is to mold a transfer sheet comprising a carrier film made of a plastic film and a conductive circuit formed on the surface of the carrier film by injection molding using a movable mold and a fixed mold. The process of setting the transfer sheet in the cavity of the mold so that the carrier film surface is in contact with the surface of the cavity, the process of clamping the mold, and the injection of thermosetting resin. In the molding process, the thermosetting resin that forms the substrate of the printed wiring body is molded and the conductive circuit is transferred at the same time, and the resulting injection molded body is taken out of the mold and transferred to the transfer sheet. By peeling off the carrier film, the target product, the printed wiring body, i.e., the conductive circuit, is exposed on the surface (
The method consists of obtaining a printed wiring body made of an injection molded body of a thermosetting resin having a temperature of 1.
前記構成による本番発明において、プリント配線体の基
板をなす熱硬化性樹脂には、一般の電気絶縁用途に供さ
れるモールド成形体用の熱硬化性樹脂、例えば、フェノ
ール樹脂、乾式不飽和ポリエステル樹脂、ジアリルフタ
レ−１・樹脂、エポキシ樹脂、ユリア樹脂、メラミン樹
脂、メラミン・フェノール樹脂等が利用される。なお、
射出成形用の熱硬化性樹脂には、ガラスファイバー等の
充填材を必要に応じて適宜混入しても良いことは勿論で
ある。In the actual invention with the above configuration, the thermosetting resin forming the substrate of the printed wiring body is a thermosetting resin for molded bodies used for general electrical insulation purposes, such as phenolic resin, dry unsaturated polyester resin. , diallylphthale-1 resin, epoxy resin, urea resin, melamine resin, melamine phenol resin, etc. are used. In addition,
It goes without saying that a filler such as glass fiber may be appropriately mixed into the thermosetting resin for injection molding as necessary.
転写用シートは、例えば、ポリエステル、ポリイミド、
ポリアミド、ポリアミドイミド、弗素系樹脂、セルロー
ス系樹脂等によるプラスチックフィルム、さらには、こ
れらの樹脂による繊維をシート状に加工したプラスチッ
クシート等に対して所定の導電性回路を形成することに
よって得られる。特に、前述の熱硬化性樹脂による射出
成形が、ｔ？＝４脂温度１００°Ｃ以下、金型の温度１
８０°Ｃ以下というような穏和な条件で行なえることか
ら、例えば、ポリエステル樹脂等による安価なプラスチ
ックフィルムをキャリヤーフィルムとして利用した転写
用シートを使用し得る。The transfer sheet is made of, for example, polyester, polyimide,
It can be obtained by forming a predetermined conductive circuit on a plastic film made of polyamide, polyamideimide, fluororesin, cellulose resin, etc., or a plastic sheet formed by processing fibers made of these resins into a sheet shape. In particular, injection molding using the above-mentioned thermosetting resin is t? =4 Fat temperature 100°C or less, mold temperature 1
Since the transfer can be carried out under mild conditions such as 80° C. or lower, it is possible to use, for example, a transfer sheet using an inexpensive plastic film made of polyester resin or the like as a carrier film.
本発明のプリント配線体における基材樹脂となる熱硬化
性樹脂は、熱可塑性樹脂による基材樹脂の場合と比較し
て、導電性回路との間に良好な密着性が得られるという
特質を有しているが、前述の転写用シートには、導電性
回路の形成面に対して、必要に応じてさらに接着剤層を
形成しておくことも可能である。The thermosetting resin that serves as the base resin in the printed wiring body of the present invention has the characteristic that it can provide better adhesion with the conductive circuit compared to a base resin made of thermoplastic resin. However, it is also possible to further form an adhesive layer on the surface of the transfer sheet on which the conductive circuit is formed, if necessary.
なお、キャリヤーフィルムとなるプラスデックフィルム
には、必要に応じて、導電性回路が形成される面に対し
て適当な易剥離性処理が施され得ることは勿論である。It goes without saying that the surface of the Plus Deck film serving as the carrier film on which the conductive circuit is formed may be subjected to an appropriate easy-peel treatment, if necessary.
導電性回路は、キャリヤーフィルムに対して、例えば、
金属箔をエツチング加工して回路化させる、金属蒸着に
よるパターン層を形成させる、鍍金による金属パターン
を形成させる、導電性ペーストをパターン印刷する等の
手段で形成されるが、電解銅箔をエツチング加工して回
路化させた導電性回路が、導電抵抗等の電気特性や導電
性回路の形成の容易さ等の点で好適である。The conductive circuit is attached to the carrier film, e.g.
It is formed by etching metal foil to form a circuit, forming a pattern layer by metal vapor deposition, forming a metal pattern by plating, pattern printing a conductive paste, etc., but etching electrolytic copper foil A conductive circuit formed into a circuit is preferable in terms of electrical properties such as conductive resistance and ease of forming the conductive circuit.
［イ乍 用］
木簡］の発明のプリント配線体は、熱硬化性樹脂による
射出成形体の表面に転写層による導電性回路が設けられ
ており、かつ、熱硬化性樹脂による射出成形体と導電性
回路とが一体成形されているものであるから、かかる構
造上、熱硬化性樹脂の射出成形体における三次元形状を
も含めた輪郭形状のプリント配線体となり、しかも、耐
熱性に極めて優れたプリント配線体になる。The printed wiring body of the invention [For Wooden Tablets] has a conductive circuit formed by a transfer layer on the surface of an injection molded body made of a thermosetting resin, and a conductive circuit is provided on the surface of an injection molded body made of a thermosetting resin and a conductive circuit. Because the physical circuit is integrally molded, due to this structure, the printed wiring body has a contour shape that includes the three-dimensional shape of an injection molded body of thermosetting resin, and has extremely excellent heat resistance. It becomes a printed wiring body.
また、木簡２の発明のプリント配線体の製造方法は、プ
ラスチックフィルムによるキャリヤーフィルムと該キャ
リヤーフィルムの表面に形成されている導電性回路とを
具備する転写用シートを、可動型と固定型とによる射出
成形用の金型のキャビティー内に、転写用シートにおけ
るギヤリヤーフィルム面がキャビティーの表面と接当す
るようにしてセットし、型締めした後に熱硬化性樹脂を
射出成形し、転写用シートにおける導電性回路が表面に
転写されている熱硬化性樹脂の射出成形体を得るもので
、射出成形用の金型のキャビティー内で成形される樹脂
が、加熱硬化によって三次元架橋構造になるので、耐熱
性に対して極めて良好な性質を有する木簡１の発明のプ
リント配線体が、簡単かつ確実に得られる。In addition, the method for producing a printed wiring body according to the invention of wooden tablet 2 is such that a transfer sheet comprising a carrier film made of a plastic film and a conductive circuit formed on the surface of the carrier film is transferred to a movable type and a fixed type. The transfer sheet is set in the cavity of the injection mold so that the gear film surface is in contact with the surface of the cavity, and after the mold is clamped, a thermosetting resin is injected, and the transfer sheet is placed in the cavity of the injection mold. This method obtains an injection molded article of thermosetting resin in which the conductive circuit in the sheet is transferred to the surface.The resin molded in the cavity of the injection mold is heated and cured into a three-dimensional crosslinked structure. Therefore, the printed wiring body of the invention of wooden tablet 1, which has extremely good heat resistance properties, can be easily and reliably obtained.
なお、熱可塑性樹脂の射出成形の場合には射出成形工程
での樹脂の溶融粘度が高いため、短時間内での加熱、加
圧によっては、転写用シートにおける導電性回路と射出
成形樹脂との間の濡れが完全に行なわれないだけでなく
、同一面内の圧力の差によって密着性にバラツキが発生
し易い等により、プリント配線体の基材樹脂と導電性回
路との間の密着性の良好なものが得られ難いのに対して
、本発明のプリント配線体においては、基材樹脂となる
熱硬化性樹脂の射出成形工程での樹脂の溶融粘度が低い
ため、転写用シートにおける導電性回路と射出成形樹脂
との間の濡れが完全になり、基材樹脂と導電性回路との
間の密着性の良好なプリント配線体となる。In the case of injection molding of thermoplastic resin, the melt viscosity of the resin during the injection molding process is high, so depending on the heating and pressurization within a short time, the conductive circuit in the transfer sheet and the injection molded resin may The adhesion between the base resin of the printed wiring body and the conductive circuit is not only not completely wetted, but also because the adhesion tends to vary due to pressure differences on the same plane. In contrast, in the printed wiring body of the present invention, the thermosetting resin used as the base resin has a low melt viscosity during the injection molding process, so the conductivity in the transfer sheet is low. Wetting between the circuit and the injection molded resin is complete, resulting in a printed wiring body with good adhesion between the base resin and the conductive circuit.
［実施例］
以下、本発明のプリント配線体及びその製造方法の具体
的な構成を、製造実施例に基づいて説明する。[Example] Hereinafter, the specific configuration of the printed wiring body and the manufacturing method thereof of the present invention will be described based on manufacturing examples.
実施例１
厚さ５０μのポリエチレンテレツクレートフィルムから
なるキャリヤーフィルムの片面に厚さ３５μの銅箔を、
エポキシ樹脂とポリビニルホルマールとシリコーンとの
混合組成物による離型剤層を介して積層した後、得られ
た積層体における銅箔をエツチング加工して回路化する
ことにより、転写用シートを得た。Example 1 A 35μ thick copper foil was placed on one side of a carrier film made of a 50μ thick polyethylene telescopic film.
After laminating via a release agent layer made of a mixed composition of epoxy resin, polyvinyl formal, and silicone, the copper foil in the resulting laminate was etched to form a circuit, thereby obtaining a transfer sheet.
この転写用シートを、該転写用シートにおけるキャリヤ
ーフィルム面がキャビティーの表面に接当するようにし
てキャビティー内の所定の箇所にセットした後、金型の
型締めを行ない、次いで、不飽和ポリエステル（８１脂
［ｃｃｓｔｏｏ 松下電工 （株）コを射出成形に付
し、プリント西２線体の基板をなず熱硬化性樹脂の成形
を行なうと同時に、転写用シートにおける導電性回路の
転写を行なった。After setting this transfer sheet at a predetermined location in the cavity so that the carrier film surface of the transfer sheet is in contact with the surface of the cavity, the mold is clamped, and then the unsaturated Polyester (81 resin [CCSTO Matsushita Electric Works Co., Ltd.) is injection molded to mold the thermosetting resin without using the printed 2-wire board, and at the same time transfer the conductive circuit on the transfer sheet. I did it.
次いで、成形された射出成形体を金型から取り出すと同
時に、転写用シーｌ−におけるキャリヤーフィルムと離
型剤層とを剥離し、射出成形用の金型の前方にある巻き
取りロールで巻き取ることにより、縦１５ｃｍ、横１０
ｃｍ、深さ３ｃｍの船型形状なす本発明の１実施例品た
るプリント配線体（１）、すなわち、導電性回路が前型
の框体の内壁面に伺されている熱硬化性樹脂の射出成形
体からなるプリント配線体（１）を、連続工程によって
得た。Next, the molded injection molded article is taken out from the mold, and at the same time, the carrier film and the release agent layer in the transfer seal 1- are peeled off, and the product is wound up with a take-up roll in front of the injection mold. Therefore, the length is 15cm and the width is 10cm.
Printed wiring body (1), which is an embodiment of the present invention and has a ship-shaped shape with a depth of 3 cm, that is, an injection molded thermosetting resin in which a conductive circuit is formed on the inner wall surface of the frame of the previous mold. A printed wiring body (1) consisting of a body was obtained by a continuous process.
なお、本実施例における不飽和ポリエステル樹脂の成形
条件は、
加熱筒温度 ・９０℃
射出圧力 １００１００Ｏ／ｃｍ２金型濡度
１８０°Ｃ
である。The molding conditions for the unsaturated polyester resin in this example are as follows: Heating cylinder temperature: 90°C Injection pressure: 100100O/cm2 Mold wetness
It is 180°C.
実施例２
実施例１て利用した転写用シー１−及び金型とそれぞれ
同一のものを利用し、不飽和ポリエステル樹脂の代わり
にフェノール樹脂［フドウライトＦ５７５０Ｆ 不動
化学 （株）］を利用することによって、本発明の１実
施例品たるプリント配線体 （２）を得た。Example 2 By using the same transfer sheet 1 and mold as those used in Example 1, and using phenol resin [Fudoulite F5750F Fudo Kagaku Co., Ltd.] instead of unsaturated polyester resin. A printed wiring body (2), which is an example product of the present invention, was obtained.
なお、本実施例におけるフェノール樹脂の成形条件は、
加熱筒温度 ７０°Ｃ
射出圧力 −１００１００Ｏ／ｃｍ２金型温度 ・
・１７０°Ｃ
である。In addition, the molding conditions for the phenol resin in this example are as follows: Heating cylinder temperature: 70°C Injection pressure: -100100O/cm2 Mold temperature:
・It is 170°C.
比較例
厚さ５０ ｌｒのポリイミドフィルムからなるキャリヤ
ーフィルムの片面に、厚さ３５μの銅箔を、エポキシ樹
脂とポリビニルホルマールとシリコーンとの混合組成物
による離型剤層を介して積層した後、得られた積層体に
おける銅箔をエツチング加工して回路化することにより
、転写用シートを得た。Comparative Example A 35 μm thick copper foil was laminated on one side of a carrier film made of a 50 lr thick polyimide film via a release agent layer made of a mixed composition of epoxy resin, polyvinyl formal and silicone. A transfer sheet was obtained by etching the copper foil in the laminate to form a circuit.
この転写用シートを、該転写用シートにおけるキャリヤ
ーフィルム面がキャビティーの表面と接当するようにし
て、実施例１で利用したものを同一の金型のキャビティ
ー内の所定の箇所にセットした後、金型の型締めを行な
い、射出成形用の熱可塑性樹脂であるポリエーテルサル
ホン樹脂［ピクトレックスＰＥＳ−４１２０ＧＬ２０三
井東圧 （株）１の射出成形を行なうことにより、比較
のための熱可塑性樹脂の射出成形体からなるプリント配
線体（３）を得た。This transfer sheet was set at a predetermined location in the cavity of the same mold as that used in Example 1, with the carrier film surface of the transfer sheet in contact with the surface of the cavity. After that, the mold was clamped and injection molding was performed using polyether sulfone resin (Pictrex PES-4120GL20 Mitsui Toatsu Co., Ltd.), which is a thermoplastic resin for injection molding. A printed wiring body (3) made of an injection molded plastic resin body was obtained.
なお、本比較例におけるポリエーテルサルホン樹脂の成
形条件は、
加熱筒ノズル温度・・ ３３０〜３９０℃射出圧力
＝１２００Ｋｇｆ／ｃｍ２金型温度 ・
１５０℃である。The molding conditions for the polyether sulfone resin in this comparative example are as follows: Heating tube nozzle temperature: 330-390°C Injection pressure
=1200Kgf/cm2 mold temperature ・
The temperature is 150°C.
［実 験］
実施例及び比較例で得られた各プリント配線体について
の半田耐熱性、耐熱性、電気絶縁抵抗、及び導電性回路
のビーリング強度に付いての特性を試験した。[Experiment] The printed wiring bodies obtained in Examples and Comparative Examples were tested for properties regarding solder heat resistance, heat resistance, electrical insulation resistance, and beading strength of conductive circuits.
結果を第１表に示す。The results are shown in Table 1.
なお、半田耐熱性・ ＪＩＳ−に６４８］ｉｉ４熱性
・ ＪＩＳ−に６４８］
電気絶縁抵抗 ＪＩＳ−に６９１］
ビ一リング強度 ＪＩＳ−に６４８１
によって測定した数値である。The values are measured according to soldering heat resistance, JIS-648, ii4 thermal resistance, JIS-648, electrical insulation resistance, JIS-691, and billing strength, JIS-6481.
［発明の効果］
前述の実施例の説明から明らかなように、木簡１の発明
のプリント配線体は、該配線体の基板をなす樹脂成形体
の部分が熱硬化性樹脂によるものであることから、半田
耐熱性に極めて優れた性質を有しており、ＩＣチップ等
の実装が可能であり、また、配線体の基板をなす樹脂成
形体が熱可塑性樹脂成形体による場合と比較して、導電
性回路と配線体の基板である樹脂成形体との間により高
度の電着性が形成され、しかも、形状が平板状に限定さ
れるものではなく、非平板状の三次元形状をなすプリン
ト配線体になり、実用的価値において極めて優れた特性
を有する。[Effects of the Invention] As is clear from the description of the above-mentioned embodiments, the printed wiring body of the invention of wooden tablet 1 has the advantage that the resin molded body that forms the substrate of the wiring body is made of thermosetting resin. , has extremely excellent soldering heat resistance, making it possible to mount IC chips, etc., and is also more conductive than when the resin molding that forms the substrate of the wiring body is made of thermoplastic resin molding. Printed wiring in which a high degree of electrodeposition is formed between the conductive circuit and the resin molded body that is the substrate of the wiring body, and the shape is not limited to a flat plate shape, but has a non-flat three-dimensional shape. It has excellent properties in terms of practical value.
また、木簡２の発明のプリント配線体の製造方法は、従
来の熱硬化性樹脂の射出成形の技術をそのまま利用する
ものであって、木簡１の発明の実用的価値に優れた特性
を有するプリント配線体を大量生産し得ることにより、
廉価に供給し得る。In addition, the method for manufacturing a printed wiring body according to the invention of wooden tablet 2 uses the conventional injection molding technology of thermosetting resin as it is, and the method of manufacturing a printed wiring body according to the invention of wooden tablet 2 uses the conventional injection molding technology of thermosetting resin as it is, and the method of manufacturing the printed wiring body according to the invention of wooden tablet 1 is a method for producing a printed wiring body that has characteristics superior to the practical value of the invention of wooden tablet 1. By being able to mass-produce wiring bodies,
Can be supplied at low cost.
さらに、木簡２の発明のプリント配線体の製造法におい
ては、機器框体等の形状の成形体に刻して導電性回路が
形成されている配線体を製造し得るため、従来の機器框
体の製造工程のみによって、機器框体とプリン１−配線
体とが組み合わされている成形体が製造されるので、か
かる面でも製造工程の簡略化に伴う経費の節減が計れる
。Furthermore, in the method for manufacturing a printed wiring body according to the invention of wooden tablet 2, it is possible to manufacture a wiring body in which a conductive circuit is formed by cutting into a molded body in the shape of an equipment frame, etc. Since a molded body in which the device frame and the print 1-wiring body are combined can be manufactured only through the manufacturing process, costs can be reduced due to the simplification of the manufacturing process.
Claims (2)
表面に形成されている導電性回路とからなり、熱硬化性
樹脂による射出成形体と導電性回路とが一体成形されて
いることを特徴とプリント配線体。(1) Consists of an injection molded body made of a thermosetting resin and a conductive circuit formed on the surface of the injection molded body, and the injection molded body made of the thermoset resin and the conductive circuit are integrally molded. Features a printed wiring body.
と該キャリヤーフィルムの表面に形成されている導電性
回路とを具備する転写用シートを、可動型と固定型とに
よる射出成形用の金型のキャビティー内に、転写用シー トにおけるキャリヤーフィルム面がキャビ ティーの表面と接当するようにしてセット し、型締めした後、熱硬化性樹脂を射出成形に付すこと
により、転写用シートにおける導電性回路が表面に転写
されている熱硬化性樹脂の射出成形体を得ることを特徴
とするプリント配線体の製造方法。(2) A transfer sheet comprising a carrier film made of plastic film and a conductive circuit formed on the surface of the carrier film is placed in a cavity of an injection mold consisting of a movable mold and a fixed mold, The carrier film surface of the transfer sheet is set so that it is in contact with the surface of the cavity, and after the mold is clamped, the conductive circuit on the transfer sheet is transferred to the surface by injection molding a thermosetting resin. A method for manufacturing a printed wiring body, characterized by obtaining an injection molded body of a thermosetting resin.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP33951490A JPH04206992A (en) | 1990-11-30 | 1990-11-30 | Printed wiring board and fabrication thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP33951490A JPH04206992A (en) | 1990-11-30 | 1990-11-30 | Printed wiring board and fabrication thereof |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH04206992A true JPH04206992A (en) | 1992-07-28 |
Family
ID=18328203
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP33951490A Pending JPH04206992A (en) | 1990-11-30 | 1990-11-30 | Printed wiring board and fabrication thereof |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH04206992A (en) |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6290999A (en) * | 1985-06-27 | 1987-04-25 | 大日本印刷株式会社 | Manufacture of molded product including printed circuit |
-
1990
- 1990-11-30 JP JP33951490A patent/JPH04206992A/en active Pending
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6290999A (en) * | 1985-06-27 | 1987-04-25 | 大日本印刷株式会社 | Manufacture of molded product including printed circuit |
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