JPH04162585A - Manufacture of printed wiring board - Google Patents
Manufacture of printed wiring boardInfo
- Publication number
- JPH04162585A JPH04162585A JP28936790A JP28936790A JPH04162585A JP H04162585 A JPH04162585 A JP H04162585A JP 28936790 A JP28936790 A JP 28936790A JP 28936790 A JP28936790 A JP 28936790A JP H04162585 A JPH04162585 A JP H04162585A
- Authority
- JP
- Japan
- Prior art keywords
- printed wiring
- wiring board
- plating
- copper
- resin
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 12
- 238000007747 plating Methods 0.000 claims abstract description 36
- 238000000034 method Methods 0.000 claims abstract description 18
- 238000005498 polishing Methods 0.000 claims abstract description 7
- 238000005520 cutting process Methods 0.000 claims abstract description 5
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 abstract description 15
- 229910052802 copper Inorganic materials 0.000 abstract description 14
- 239000010949 copper Substances 0.000 abstract description 14
- 239000011888 foil Substances 0.000 abstract description 7
- 239000000463 material Substances 0.000 abstract description 7
- 229910052751 metal Inorganic materials 0.000 abstract description 5
- 239000002184 metal Substances 0.000 abstract description 5
- 229920005989 resin Polymers 0.000 abstract description 4
- 239000011347 resin Substances 0.000 abstract description 4
- 239000007788 liquid Substances 0.000 abstract 1
- 230000015572 biosynthetic process Effects 0.000 description 5
- 239000011521 glass Substances 0.000 description 4
- 238000011282 treatment Methods 0.000 description 4
- 230000002159 abnormal effect Effects 0.000 description 3
- 238000001556 precipitation Methods 0.000 description 3
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- 239000004020 conductor Substances 0.000 description 2
- 238000007796 conventional method Methods 0.000 description 2
- 229910000365 copper sulfate Inorganic materials 0.000 description 2
- ARUVKPQLZAKDPS-UHFFFAOYSA-L copper(II) sulfate Chemical compound [Cu+2].[O-][S+2]([O-])([O-])[O-] ARUVKPQLZAKDPS-UHFFFAOYSA-L 0.000 description 2
- 239000003822 epoxy resin Substances 0.000 description 2
- 239000002923 metal particle Substances 0.000 description 2
- 238000000465 moulding Methods 0.000 description 2
- 239000002245 particle Substances 0.000 description 2
- 238000000059 patterning Methods 0.000 description 2
- 239000005011 phenolic resin Substances 0.000 description 2
- 229920000647 polyepoxide Polymers 0.000 description 2
- 229910001220 stainless steel Inorganic materials 0.000 description 2
- 239000010935 stainless steel Substances 0.000 description 2
- 229920006337 unsaturated polyester resin Polymers 0.000 description 2
- SMNDYUVBFMFKNZ-UHFFFAOYSA-N 2-furoic acid Chemical compound OC(=O)C1=CC=CO1 SMNDYUVBFMFKNZ-UHFFFAOYSA-N 0.000 description 1
- 239000004593 Epoxy Substances 0.000 description 1
- 229910001111 Fine metal Inorganic materials 0.000 description 1
- 238000005422 blasting Methods 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 239000011889 copper foil Substances 0.000 description 1
- 238000005553 drilling Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000007772 electroless plating Methods 0.000 description 1
- 238000009713 electroplating Methods 0.000 description 1
- -1 etc. Polymers 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 239000004744 fabric Substances 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- 238000003475 lamination Methods 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 229920006122 polyamide resin Polymers 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
Abstract
Description
【発明の詳細な説明】
（産業上の利用分野）
この発明は、プリント配線板の製造方法に関するもので
ある。さらに詳しくは、この発明は、表面メッキざらつ
きのないプリント配線板の製造を可能とする新しい製造
方法に関するものである。DETAILED DESCRIPTION OF THE INVENTION (Field of Industrial Application) The present invention relates to a method of manufacturing a printed wiring board. More specifically, the present invention relates to a new manufacturing method that makes it possible to manufacture printed wiring boards without surface plating roughness.
（従来の技術）
電気・電子機器、計算機、通信機器等には各種の構成か
らなるプリント配線板が使用されている。(Prior Art) Printed wiring boards having various configurations are used in electrical/electronic equipment, computers, communication equipment, etc.
これらのプリント配線板については、高密度実装および
高密度配線への対応が強く求められており、より高精度
、高品質な製造が必要とされてもいる。These printed wiring boards are strongly required to be compatible with high-density packaging and high-density wiring, and are also required to be manufactured with higher precision and higher quality.
これまで、このプリント配線板の製造法としては、ガラ
ス、紙等の基材にエポキシ樹脂、フェノール樹脂、不飽
和ポリエステル樹脂、ポリアミド樹脂等を含浸された樹
脂含浸基材、あるいは樹脂シート等に、銅、アルミニウ
ム、ステンレス等の金属箔を積層一体化成形し、これに
スルーホール穴あけ加工した後にメッキ処理し、さらに
エツチングしてパターニングを行うなどの方法が知られ
ている。Until now, the manufacturing method for printed wiring boards has been to use a resin-impregnated base material such as glass or paper that is impregnated with epoxy resin, phenol resin, unsaturated polyester resin, polyamide resin, etc., or a resin sheet. A known method involves laminating and integrally molding metal foils of copper, aluminum, stainless steel, etc., drilling through holes therein, plating the foil, and patterning the foil by etching.
いずれの方法を採用する場合にも、導体層形成のための
メッキ処理は必須とされ、無電解メッキと電解メッキの
組合わせ等によってこのメッキを行うのが一般的なもの
となっている。Regardless of which method is adopted, plating treatment for forming a conductor layer is essential, and it is common to perform this plating by a combination of electroless plating and electrolytic plating.
（発明が解決しようとする課題）
しかしながら、このメッキ処理は、導体層の形成手段と
しては効率的で有用なものであるが、高精度ファインパ
ターン化に対応するためには、依然として解決すべき課
題が残されているのが実情である。(Problems to be Solved by the Invention) However, although this plating process is efficient and useful as a means for forming a conductor layer, there are still issues to be solved in order to support high-precision fine patterning. The reality is that this remains the case.
このような課題の一つとして、メッキ処理中に、っぷ銅
がプリント配線基板に付着し、これが核となってメッキ
が成長し、表面にメッキざらつきを生じるという欠点が
あった。このざらつきは、後工程の回路形成において回
路幅の精度を悪くし、高品質なプリント配線板の製造を
阻害する原因となってもいた。One of these problems is that during the plating process, copper adheres to the printed wiring board, and this serves as a nucleus for the plating to grow, causing the plating to become rough on the surface. This roughness deteriorates the accuracy of circuit width in circuit formation in the subsequent process, and has also become a cause of hindering the manufacture of high-quality printed wiring boards.
このようなつぶ銅の付着は、この発明の発明者による検
討の結果からは、プリント配線基板のメッキ処理時にお
ける端面でのメッキの異状析出に帰因するものであるこ
とが確かめられた。From the results of the study conducted by the inventor of the present invention, it has been confirmed that such adhesion of copper particles is caused by abnormal precipitation of plating on the end surface during plating processing of the printed wiring board.
そこで、この発明は、上記のような従来の方法における
メッキざらつきの生成という欠点を解消し、均一なメッ
キ処理を可能とする改善されたプリント配線板の製造方
法を提供することを目的としている。SUMMARY OF THE INVENTION Therefore, an object of the present invention is to provide an improved printed wiring board manufacturing method that eliminates the drawback of generation of plating roughness in the conventional method as described above and enables uniform plating processing.
（課題を解決するための手段）
この発明は、上記の課題を解決するものとして、プリン
ト配線基板の端面を研磨またはルータ−カット処理し、
次いでメッキ処理することを特徴とするプリント配線板
の製造方法を提供する。(Means for Solving the Problems) In order to solve the above problems, the present invention polishes or router-cuts the end face of a printed wiring board,
Provided is a method for manufacturing a printed wiring board, characterized in that the method is then subjected to plating treatment.
（作 用）
この発明においては、メッキ処理に先立って、被処理プ
リント配線基板の端面を研磨またはルータ−カットする
ため、メッキ浴においてこの端面にメッキの異状析出が
生じることがないため、これが原因となるつぶ銅の生成
や、このつぶ銅のプリント配線基板表面への付着による
メ・ツキざらつきの発生も抑止される。(Function) In this invention, the end face of the printed wiring board to be processed is polished or cut with a router prior to plating treatment, so that no abnormal plating precipitation occurs on this end face in the plating bath. This also prevents the formation of crushed copper and the adhesion of this crushed copper to the surface of the printed wiring board, thereby suppressing the occurrence of roughness.
このため、後工程の回路形成においても、回路のファイ
ン形成が容易となる。Therefore, fine formation of the circuit becomes easy even in the circuit formation in the post-process.
（実施例）
以下、この発明のプリント配線板の製造方法をさらに詳
しく説明する。(Example) Hereinafter, the method for manufacturing a printed wiring board of the present invention will be explained in more detail.
第１図は、この発明の製造法を例示した工程断面図であ
る。たとえばこの第１図に示したように、（ａ） ガ
ラスシート、ガラスクロス、紙等の基材にエポキシ樹脂
、フェノール樹脂、不飽和ポリエステル樹脂等の樹脂を
含浸した樹脂含浸基材および／または樹脂シート等から
なる複数枚の基材層（１）と、銅、アルミニウム、ステ
ンレス等の金属箔（２）とを加熱加圧して積層一体化す
る。この積層成形によってプリント配線基板（３）を製
造する。FIG. 1 is a process sectional view illustrating the manufacturing method of the present invention. For example, as shown in FIG. 1, (a) a resin-impregnated base material and/or resin in which a base material such as a glass sheet, glass cloth, or paper is impregnated with a resin such as an epoxy resin, a phenol resin, or an unsaturated polyester resin; A plurality of base material layers (1) made of sheets or the like and a metal foil (2) of copper, aluminum, stainless steel, etc. are laminated and integrated by heating and pressing. A printed wiring board (3) is manufactured by this lamination molding.
得られたプリント配線基板（３）の端面はなめらかでな
（、粗端面（４）となっている。The end face of the obtained printed wiring board (3) was smooth (and had a rough end face (4)).
（ｂ） そこで、このプリント配線基板（３）の粗端
面（４）を研磨、またはルータ−カットによって処理し
て滑らかな端部表面
（５）を形成する。 この時の研磨の手段には特に限定
はなく、基材層（１）、金属箔（２）の種類や厚み等を
考慮して適宜なものを適用することができる。サンドペ
ーパーレベルサンダー、パフ、ブラスト等の物理的研磨
や化学研磨が適用される。(b) The rough end surface (4) of this printed wiring board (3) is then treated by polishing or router cutting to form a smooth end surface (5). There is no particular limitation on the means for polishing at this time, and an appropriate method can be applied in consideration of the type, thickness, etc. of the base layer (1) and the metal foil (2). Physical polishing and chemical polishing such as sandpaper level sander, puff, and blasting are applied.
ルータ−カッティング処理でもよい。Router cutting processing may also be used.
この研磨またはルータ−カットによって形成される滑ら
かな端部表面（５）を有するプリント配線基板（３）の
場合には、メッキ液に浸漬してメッキ処理する場合にそ
の端部表面（５）でのメッキの異状析出はない。このた
め、つぶ銅等の微細金属粒の生成とその付着も生じない
。In the case of a printed wiring board (3) having a smooth end surface (5) formed by this polishing or router cutting, the end surface (5) is There is no abnormal plating precipitation. Therefore, the generation and adhesion of fine metal particles such as crushed copper do not occur.
一方、従来のように、粗端面（４）のままメッキ処理す
る場合゛には、第２図にも示したように、メッキ液（６
）中に浸漬したプリント配線基板（３）の粗端面（４）
にはメッキ（７）が異常析出し、これがつぶ銅（８）等
の金属粒子として落下し、その途中で、プリント配線基
板（３）の表面（９）に付着する。すると、この付着し
たつぶ銅（８′）が核となってメッキが成長し、メッキ
ざらつきが発生する。On the other hand, when plating the rough end surface (4) as is, as in the past, as shown in Figure 2, the plating solution (6
) The rough end surface (4) of the printed wiring board (3) immersed in
The plating (7) is abnormally precipitated, and this falls as metal particles such as crushed copper (8), and along the way, it adheres to the surface (9) of the printed wiring board (3). Then, the adhered crushed copper (8') becomes a nucleus and the plating grows, causing the plating to become rough.
上記したこの発明の方法による場合には、このようなメ
ッキざらつきは発生しない。In the case of the method of the present invention described above, such plating roughness does not occur.
実際、エポキシ樹脂含浸ガラス基材と銅箔とから成形し
たプリント配線基板を用い、その端部を研磨して滑らか
な端部表面を形成し、次いで・電流密度 、
２０Ａ／ｄｔｒｌ’・時間 ４０分
・硫酸銅濃度 ７５ｇ／ｆ
・硫酸濃度 １７５ｇ／ｎ
の条件において硫酸銅メッキを施したか、つぶ銅の生成
はもちろんのこと、銅メッキのざらつきも発生しなかっ
た。In fact, using a printed wiring board molded from an epoxy resin-impregnated glass substrate and copper foil, its edges were polished to form a smooth edge surface, and then the current density was
Copper sulfate plating was performed under the conditions of 20 A/dtrl', time 40 minutes, copper sulfate concentration 75 g/f, and sulfuric acid concentration 175 g/n, and not only copper particles were formed but also no roughness of the copper plating occurred.
一方、端部表面を研磨しない場合には、この銅メッキの
ざらつき発生は避けられなかった。On the other hand, when the end surface was not polished, the occurrence of roughness in the copper plating was unavoidable.
もちろん、この発明は以上の例に限定されるものではな
い。銅メッキ以外の処理についても同様にこの発明は適
用される。それらの細部については様々な態様が可能で
ある。Of course, the invention is not limited to the above examples. The present invention is similarly applicable to treatments other than copper plating. Various aspects of these details are possible.
（発明の効果）
この発明により、以上詳しく説明した通り、プリント配
線基板表面でのメッキざらつきは発生しない。(Effects of the Invention) According to the present invention, as explained in detail above, plating roughness does not occur on the surface of the printed wiring board.
このため、後工程の回路形成においても回路ファイン化
は容易で、高品質プリント配線板が製造される。Therefore, it is easy to refine the circuit in circuit formation in the post-process, and a high-quality printed wiring board is manufactured.
第１図は、この発明の方法を例示した部分工程断面図で
ある。第２図は、従来方による場合のメッキざらつきの
発生を示した側面図である。
１・・・基材層
２・・・金属箔
３・・・プリント配線基板
４・・・粗端面
５・・・滑らかな端部表面
６・・・メッキ液
７・・・メッキ
８．８′・・・つぶ銅
９・・・表面
代理人 弁理士 西 澤 利 大
筒１図
第２図FIG. 1 is a partial process sectional view illustrating the method of the present invention. FIG. 2 is a side view showing the occurrence of plating roughness in the conventional method. 1... Base material layer 2... Metal foil 3... Printed wiring board 4... Rough end surface 5... Smooth end surface 6... Plating solution 7... Plating 8.8' ...Tsubudo 9... Surface agent Patent attorney Toshi Nishizawa Otsutsu 1 Figure 2
Claims (1)
ット処理し、次いでメッキ処理することを特徴とするプ
リント配線板の製造方法。(1) A method for manufacturing a printed wiring board, which comprises polishing or router-cutting the end face of the printed wiring board, and then plating it.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP28936790A JP2854702B2 (en) | 1990-10-25 | 1990-10-25 | Manufacturing method of printed wiring board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP28936790A JP2854702B2 (en) | 1990-10-25 | 1990-10-25 | Manufacturing method of printed wiring board |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH04162585A true JPH04162585A (en) | 1992-06-08 |
| JP2854702B2 JP2854702B2 (en) | 1999-02-03 |
Family
ID=17742293
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP28936790A Expired - Fee Related JP2854702B2 (en) | 1990-10-25 | 1990-10-25 | Manufacturing method of printed wiring board |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2854702B2 (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6783620B1 (en) | 1998-10-13 | 2004-08-31 | Matsushita Electronic Materials, Inc. | Thin-laminate panels for capacitive printed-circuit boards and methods for making the same |
| US6789298B1 (en) | 1998-10-13 | 2004-09-14 | Matsushita Electronic Materials, Inc. | Finishing method for producing thin-laminate panels |
-
1990
- 1990-10-25 JP JP28936790A patent/JP2854702B2/en not_active Expired - Fee Related
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6783620B1 (en) | 1998-10-13 | 2004-08-31 | Matsushita Electronic Materials, Inc. | Thin-laminate panels for capacitive printed-circuit boards and methods for making the same |
| US6789298B1 (en) | 1998-10-13 | 2004-09-14 | Matsushita Electronic Materials, Inc. | Finishing method for producing thin-laminate panels |
| US7018703B2 (en) | 1998-10-13 | 2006-03-28 | Matsushita Electric Works, Ltd. | Thin-laminate panels for capacitive printed-circuit boards and methods for making the same |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2854702B2 (en) | 1999-02-03 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| LAPS | Cancellation because of no payment of annual fees |