JPH04161866A - Jig for measuring characteristic of integrated circuit device - Google Patents
Jig for measuring characteristic of integrated circuit deviceInfo
- Publication number
- JPH04161866A JPH04161866A JP2287819A JP28781990A JPH04161866A JP H04161866 A JPH04161866 A JP H04161866A JP 2287819 A JP2287819 A JP 2287819A JP 28781990 A JP28781990 A JP 28781990A JP H04161866 A JPH04161866 A JP H04161866A
- Authority
- JP
- Japan
- Prior art keywords
- package
- jig
- outer leads
- measurement
- measuring
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000005259 measurement Methods 0.000 claims abstract description 36
- 239000000758 substrate Substances 0.000 claims 1
- 239000004020 conductor Substances 0.000 abstract 4
- 239000011295 pitch Substances 0.000 description 6
- 238000010586 diagram Methods 0.000 description 3
- 230000001105 regulatory effect Effects 0.000 description 3
- 230000000694 effects Effects 0.000 description 2
- 230000001066 destructive effect Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000007689 inspection Methods 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
Landscapes
- Testing Of Individual Semiconductor Devices (AREA)
- Tests Of Electronic Circuits (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
Abstract
Description
【発明の詳細な説明】
〔産業上の利用分野〕
本発明は、リードフレームを有するパッケージに集積回
路が実装された集積回路装置の特性測定用治具に関する
。DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a jig for measuring the characteristics of an integrated circuit device in which an integrated circuit is mounted on a package having a lead frame.
従来、パッケージに収められた集積回路（ＩＣ）の特性
測定は、ＩＣソケットにアウターリードを挿入するか、
あるいは測定用プリント基板にパッケージのアウターリ
ードをハンダ付けすることによって行われてきた。しか
し、前者の場合は高周波特性が悪くなるため測定精度が
低く、また後者の場合は、測定後アウターリードを基板
からはずさなければならず、破壊検査になるという問題
があった。Traditionally, the characteristics of integrated circuits (ICs) housed in packages have been measured by inserting outer leads into the IC socket, or by inserting outer leads into the IC socket.
Alternatively, this has been done by soldering the outer leads of the package to the measurement printed circuit board. However, in the former case, the high frequency characteristics deteriorate, resulting in low measurement accuracy, and in the latter case, the outer lead must be removed from the board after measurement, resulting in a destructive inspection.
そこでこれらの問題を解決する測定用治具を用いた装置
が、特願昭６３−１２７３４０号で提案されている。第
３図は、その装置の断面図である。Therefore, an apparatus using a measuring jig that solves these problems has been proposed in Japanese Patent Application No. 127340/1983. FIG. 3 is a cross-sectional view of the device.
同図（ａ）に示されているように、この測定用治具は、
集積回路装置の特性を測定するためのパタ−ンが描かれ
ている測定用プリント基板１と、この測定用プリント基
板１を収納するケース４と、測定用プリント基板１上の
所定の領域に載置され厚み方向に導電性を有する異方性
導電ゴム５とを有している。さらに、このケース４に締
め付は固定されることにより異方性導電ゴム５を上方か
ら測定用プリント基板上に固定すると共に、異方性導電
ゴム５上に載置されるパッケージ２の位置を規制する固
定板６と、パッケージ２を微調整可能に押圧する抑圧手
段８と、これを有する蓋７とを備えている。As shown in Figure (a), this measurement jig is
A measurement printed circuit board 1 on which a pattern for measuring the characteristics of an integrated circuit device is drawn, a case 4 that houses the measurement printed circuit board 1, and a case 4 that is mounted on a predetermined area on the measurement printed circuit board 1. The anisotropic conductive rubber 5 has conductivity in the thickness direction. Furthermore, by being fastened to this case 4, the anisotropic conductive rubber 5 is fixed onto the measurement printed circuit board from above, and the position of the package 2 placed on the anisotropic conductive rubber 5 is controlled. It is provided with a fixing plate 6 for regulating, a suppressing means 8 for pressing the package 2 in a finely adjustable manner, and a lid 7 having the same.
上述の構造を有する治具では、第３図（ｂ）に示される
ように、パッケージ２を異方性導電ゴム５上に載せて蓋
７を閉じると、抑圧手段８がパッケージ２を押圧する。In the jig having the above-described structure, when the package 2 is placed on the anisotropic conductive rubber 5 and the lid 7 is closed, the suppressing means 8 presses the package 2, as shown in FIG. 3(b).
この押圧によってパッケージ？内の集積回路と測定用プ
リント基板１が電気的に低抵抗で接続される。このとき
、測定用プリント基板１に対するパッケージ２の位置は
固定板６により規制されるので、抑圧手段８の調整を予
め行っておけば、パッケージ２を所定の場所に載せ蓋７
を閉じるだけで外部接続端子と測定パターンは位置合わ
せされて固定され、測定の準備が完了する。Packaged by this pressing? The integrated circuit inside and the measurement printed circuit board 1 are electrically connected with low resistance. At this time, the position of the package 2 with respect to the measurement printed circuit board 1 is regulated by the fixing plate 6, so if the suppressing means 8 is adjusted in advance, the package 2 can be placed in a predetermined place and the lid 7
Just by closing the external connection terminal and measurement pattern are aligned and fixed, and preparation for measurement is completed.
［発明が解決しようとする課題〕
しかしながら上述の測定用治具では、固定板でパッケー
ジ自体の位置を規制することにより、位置合わせを行っ
ているため、測定用パターンとパッケージの外部端子と
の位置を厳密に一致させることが難しい。このような事
情は、パッケージの外部にアウターリードが突出してい
るタイプの集積回路についても同様に発生する。即ち、
パ・ンケージ自体で位置合わせをしたのでは、突出して
いるアウターリードのピッチが狭い場合には、パッケー
ジとリードフレームの間に僅かな位置ずれがあったりす
ると、アウターリードと測定用パターンとの位置合わせ
が難しくなり、隣接する他の測定用の導電パターンと短
絡する等の問題があった。[Problems to be Solved by the Invention] However, in the above-mentioned measuring jig, positioning is performed by regulating the position of the package itself with a fixing plate, so the position of the measuring pattern and the external terminal of the package is difficult to match exactly. This situation also occurs in integrated circuits of the type in which the outer leads protrude outside the package. That is,
If the pitch of the protruding outer leads is narrow and there is a slight misalignment between the package and the lead frame, alignment of the outer leads and the measurement pattern may occur if alignment is performed using the package itself. It became difficult to align the patterns, and there were problems such as short circuits with other adjacent conductive patterns for measurement.
本発明は、この問題を解決するものである。The present invention solves this problem.
本発明は、特性を測定すべき集積回路をパッケージの内
部に有し、リードフレームの複数のアウターリードをパ
ッケージの外部に有する集積回路装置の特性測定用治具
において、複数のアウターリードのピッチに対応したピ
ッチで複数の溝部が形成され、かつそれら溝部の少なく
とも底面に導電パターンが形成された測定用プリント基
板と、その複数の溝部にそれぞれ挿入可能な複数の凸部
を有し、複数の溝部にはめ込まれた複数のアウターリー
ドを前述の導電パターンに押圧する押さえ部材とを備え
ることを特徴とする。The present invention provides a jig for measuring characteristics of an integrated circuit device having an integrated circuit whose characteristics are to be measured inside a package and having a plurality of outer leads of a lead frame outside the package. A measuring printed circuit board having a plurality of grooves formed at corresponding pitches and a conductive pattern formed on at least the bottom surface of the grooves, and a plurality of protrusions that can be inserted into each of the plurality of grooves, and a plurality of grooves. It is characterized by comprising a pressing member that presses the plurality of fitted outer leads against the aforementioned conductive pattern.
本発明によれば、測定用プリント基板に形成された溝部
に７ウターリードがはめ込まれるので、パッケージはリ
ードフレームを基準として位置決めされ、かつ位置ずれ
することもない。According to the present invention, since the seven outer leads are fitted into the grooves formed in the measurement printed circuit board, the package is positioned with respect to the lead frame and does not shift.
また、溝部には導電パターンが形成され、ここにはめ込
まれたアウターリードは押さえ部材の凸部により押圧さ
れるので、良好に電気接続される。Further, a conductive pattern is formed in the groove, and the outer lead fitted therein is pressed by the convex portion of the pressing member, so that a good electrical connection is achieved.
〔実施例）
第１図は、本発明の実施例に係る集積回路装置の特性測
定用治具の斜視図である。図示されているようにこの測
定用治具は、測定すべき集積回路を内部に有するパッケ
ージ２のアウターリード２１がセットされる測定用プリ
ント基板１と、そのアウターリード２１を測定用プリン
ト基板１に押圧する押さえ部材３とを備えている。[Example] FIG. 1 is a perspective view of a jig for measuring characteristics of an integrated circuit device according to an example of the present invention. As shown in the figure, this measurement jig includes a measurement printed circuit board 1 on which an outer lead 21 of a package 2 having an integrated circuit to be measured is set, and a measurement printed circuit board 1 that connects the outer lead 21 to the measurement printed circuit board 1. It is provided with a pressing member 3 for pressing.
＃Ｊ定用プリント基板１には、測定時にパッケージ２を
保持するための２本の突出部１１が平行に設けられてお
り、この突出部１１の表面には、パッケージ２の複数の
アウターリード２１のピッチに対応したピッチで複数の
溝部１２が形成されている。その溝部１２の底部はメタ
ライズされ、測定用の導電パターン１３が形成されてい
る。なお、この溝部ユ２には、導電パターン１３が断線
することのないように緩やかな傾斜部分が設けられてお
り、配線パターン９を介して特性測定用の集積回路装置
等（図示せず）に接続されている。The #J standard printed circuit board 1 is provided with two parallel protrusions 11 for holding the package 2 during measurement. A plurality of groove portions 12 are formed at a pitch corresponding to the pitch of. The bottom of the groove 12 is metallized, and a conductive pattern 13 for measurement is formed. Note that this groove portion 2 is provided with a gentle slope portion to prevent the conductive pattern 13 from being disconnected, and is connected to an integrated circuit device, etc. (not shown) for measuring characteristics via the wiring pattern 9. It is connected.
上述の測定用プリント基板１にアウターリード２１を押
圧する押さえ部材３は断面が「コ」の字状をなし、その
両端部には、測定用プリント基板１に設けられている溝
部１２のそれぞれと噛み合ってアウターリード２１を挟
むことができるように、複数の凸部３１が設けられてい
る。The pressing member 3 that presses the outer lead 21 against the above-mentioned printed circuit board 1 for measurement has a U-shaped cross section, and has grooves 12 provided on the printed circuit board 1 for measurement at both ends thereof. A plurality of convex portions 31 are provided so that they can mesh with each other and sandwich the outer lead 21.
上記の構造により、正確な位置決めと、良好な電気接続
が実現される。The above structure provides accurate positioning and good electrical connection.
即ち、測定用プリント基板１上には複数の溝部１２が設
けられ、しかもこれらはパッケージ２の各アウターリー
ド２１と合致するようになっているので、パッケージ２
を測定位置にセットするだけで、複数のアウターリード
２１が対応する溝部にはめ込まれる。従って、アウター
リード２１のピッチが極めて狭くても測定用プリント基
板１の導電パターン１３との正確な位置合わせができる
。That is, a plurality of grooves 12 are provided on the measurement printed circuit board 1, and these are arranged to match each outer lead 21 of the package 2, so that the package 2
By simply setting the outer leads 21 to the measurement position, the plurality of outer leads 21 are fitted into the corresponding grooves. Therefore, even if the pitch of the outer leads 21 is extremely narrow, accurate alignment with the conductive pattern 13 of the printed circuit board 1 for measurement can be achieved.
さらにその上から、押さえ部材３に設けられた凸部３１
によって、アウターリード２１は溝部１２の底面に形成
された導電パターン１３に押圧されるので、パッケージ
２は測定用治具に固定され、このとき、他の測定用の導
電パターンと短絡することがない。Furthermore, from above, the convex portion 31 provided on the pressing member 3
Since the outer lead 21 is pressed against the conductive pattern 13 formed on the bottom surface of the groove 12, the package 2 is fixed to the measurement jig, and at this time, there is no short circuit with other conductive patterns for measurement. .
第２図は、本発明の実施例に係る測定用治具の使用時に
おける形態断面図である。上述したように、特性測定を
すべき集積回路を内部に有するパッケージ２のアウター
リード２１は、測定用プリント基板１の溝部１２と押さ
え部材３の凸部３１との間に挾まれて測定用治具に固定
され、測定が行われる。このとき、溝部１２と凸部３１
とは同図（ａ）に示されるように、側壁がそれぞれ斜面
となるように形成され、かつ完全に噛み合うように形成
されても良いし、また同図（ｂ）に示されているように
、溝部１２あるいは凸部３１のどちらか一方の側壁が曲
面状に形成されて、アウターリード２１の押圧部分のみ
が完全に噛み合うように形成されていても良い。FIG. 2 is a sectional view of the measurement jig according to the embodiment of the present invention when it is in use. As described above, the outer leads 21 of the package 2, which contains the integrated circuit whose characteristics are to be measured, are sandwiched between the groove 12 of the measurement printed circuit board 1 and the protrusion 31 of the holding member 3, and are held in the measurement jig. It is fixed to a fixture and measurements are taken. At this time, the groove portion 12 and the convex portion 31
As shown in the same figure (a), the side walls may be formed so as to be inclined and completely interlock with each other, or as shown in the same figure (b), The side wall of either the groove 12 or the convex portion 31 may be formed into a curved shape so that only the pressed portion of the outer lead 21 is completely engaged.
以上説明した様に、本発明に係る集積回路装置の特性測
定用治具では、ピッチの狭いアウターリードを有するパ
ッケージに対しても、各アウターリードが測定用プリン
ト基板の各溝部にはめ込まれて位置決めされるので、そ
のパッケージ内部にある集積回路の特性測定を高精度で
行うことができる。As explained above, in the jig for measuring the characteristics of an integrated circuit device according to the present invention, each outer lead is fitted into each groove of the measurement printed circuit board even for a package having outer leads with a narrow pitch. Therefore, the characteristics of the integrated circuit inside the package can be measured with high precision.
第１図は本発明の実施例に係る集積回路装置の特性測定
用治具の概略図、第２図は本発明に係る測定用治具の使
用時における形態断面図、Ｉｉ３図は従来の集積回路装
置の特性測定用治具の概略図である。
１・・・測定用プリント基板、１１・・・突出部、１２
・・・溝部、１３・・・導電パターン、２・・・パッケ
ージ、２１・・・アウターリード、３・・・押さえ部材
、３１・・・凸部。
代理人弁理士 長谷用 芳 樹実方凸イタノ１
＝係るＡり定則ｅ台ｐの府ミ略θ８１図FIG. 1 is a schematic diagram of a jig for measuring characteristics of an integrated circuit device according to an embodiment of the present invention, FIG. 2 is a sectional view of the measuring jig according to the present invention when it is used, and FIG. FIG. 2 is a schematic diagram of a jig for measuring characteristics of a circuit device. DESCRIPTION OF SYMBOLS 1... Printed circuit board for measurement, 11... Protrusion part, 12
... Groove portion, 13... Conductive pattern, 2... Package, 21... Outer lead, 3... Holding member, 31... Convex portion. Representative Patent Attorney Yoshi Hase Jumiho Convex Itano 1
= Approximate θ81 diagram of the related A law e platform p
Claims (1)
、リードフレームの複数のアウターリードをパッケージ
の外部に有する集積回路装置の特性測定用治具において
、 前記複数のアウターリードのピッチに対応したピッチで
複数の溝部が形成され、かつ前記溝部の少なくとも底面
に導電パターンが形成された測定用基板と、 前記複数の溝部にそれぞれ挿入可能な複数の凸部を有し
、前記複数の溝部にはめ込まれた前記複数のアウターリ
ードを前記導電パターンに押圧する押さえ部材と を備えることを特徴とする、集積回路装置の特性測定用
治具。[Scope of Claim] A jig for measuring characteristics of an integrated circuit device having an integrated circuit whose characteristics are to be measured inside a package and having a plurality of outer leads of a lead frame outside the package, comprising: a measurement substrate having a plurality of grooves formed at a pitch corresponding to the pitch of the grooves, and a conductive pattern formed on at least the bottom surface of the grooves; and a plurality of protrusions insertable into the plurality of grooves, respectively; A jig for measuring characteristics of an integrated circuit device, comprising: a pressing member that presses the plurality of outer leads fitted into the plurality of grooves against the conductive pattern.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2287819A JPH04161866A (en) | 1990-10-25 | 1990-10-25 | Jig for measuring characteristic of integrated circuit device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2287819A JPH04161866A (en) | 1990-10-25 | 1990-10-25 | Jig for measuring characteristic of integrated circuit device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH04161866A true JPH04161866A (en) | 1992-06-05 |
Family
ID=17722176
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2287819A Pending JPH04161866A (en) | 1990-10-25 | 1990-10-25 | Jig for measuring characteristic of integrated circuit device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH04161866A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2002103852A3 (en) * | 2001-06-18 | 2003-07-24 | Itt Mfg Enterprises Inc | Method and apparatus for non-destructive testing of leaded packages |
-
1990
- 1990-10-25 JP JP2287819A patent/JPH04161866A/en active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2002103852A3 (en) * | 2001-06-18 | 2003-07-24 | Itt Mfg Enterprises Inc | Method and apparatus for non-destructive testing of leaded packages |
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