JPH0415871U - - Google Patents
Info
- Publication number
- JPH0415871U JPH0415871U JP5676190U JP5676190U JPH0415871U JP H0415871 U JPH0415871 U JP H0415871U JP 5676190 U JP5676190 U JP 5676190U JP 5676190 U JP5676190 U JP 5676190U JP H0415871 U JPH0415871 U JP H0415871U
- Authority
- JP
- Japan
- Prior art keywords
- hybrid integrated
- conductor pattern
- reflowed
- utility
- component
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004020 conductor Substances 0.000 claims description 2
- 229910000679 solder Inorganic materials 0.000 claims description 2
- 239000003990 capacitor Substances 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 230000001681 protective effect Effects 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
Landscapes
- Manufacturing Of Printed Wiring (AREA)
Description
第１図は本考案の一実施例を示す平面図で、第
２図はＡ−Ａ線断面図である。
１……セラミツク基板、２……導体パターン、
３……保護膜、４……シリコン樹脂、５……チツ
プコンデンサ、６……ハンダ片。
FIG. 1 is a plan view showing an embodiment of the present invention, and FIG. 2 is a sectional view taken along the line A--A. 1...Ceramic substrate, 2...Conductor pattern,
3...protective film, 4...silicon resin, 5...chip capacitor, 6...solder piece.
Claims (1)
所定の導体パターンに、ハンダ片をのせてリフロ
ーさせてなることを特徴とする混成集積回路装置
。 In thick film hybrid integrated circuits, after each component is mounted,
A hybrid integrated circuit device comprising a solder piece placed on a predetermined conductor pattern and reflowed.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5676190U JPH0415871U (en) | 1990-05-30 | 1990-05-30 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5676190U JPH0415871U (en) | 1990-05-30 | 1990-05-30 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0415871U true JPH0415871U (en) | 1992-02-07 |
Family
ID=31580877
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP5676190U Pending JPH0415871U (en) | 1990-05-30 | 1990-05-30 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0415871U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7261322B2 (en) | 2002-03-05 | 2007-08-28 | Isuzu Motors Limited | Coupling structure of side member to cross member |
-
1990
- 1990-05-30 JP JP5676190U patent/JPH0415871U/ja active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7261322B2 (en) | 2002-03-05 | 2007-08-28 | Isuzu Motors Limited | Coupling structure of side member to cross member |