JPH04115760U - Flexible board terminal structure - Google Patents
Flexible board terminal structureInfo
- Publication number
- JPH04115760U JPH04115760U JP1991025717U JP2571791U JPH04115760U JP H04115760 U JPH04115760 U JP H04115760U JP 1991025717 U JP1991025717 U JP 1991025717U JP 2571791 U JP2571791 U JP 2571791U JP H04115760 U JPH04115760 U JP H04115760U
- Authority
- JP
- Japan
- Prior art keywords
- metal
- terminal
- metal terminal
- flexible substrate
- flexible
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000002184 metal Substances 0.000 claims abstract description 83
- 229910052751 metal Inorganic materials 0.000 claims abstract description 83
- 239000000758 substrate Substances 0.000 claims abstract description 40
- 239000004020 conductor Substances 0.000 claims abstract description 19
- 229920005989 resin Polymers 0.000 claims abstract description 3
- 239000011347 resin Substances 0.000 claims abstract description 3
- 230000000694 effects Effects 0.000 abstract description 4
- 238000005452 bending Methods 0.000 abstract description 3
- 230000003014 reinforcing effect Effects 0.000 description 8
- 239000000853 adhesive Substances 0.000 description 5
- 230000001070 adhesive effect Effects 0.000 description 5
- 238000010586 diagram Methods 0.000 description 5
- 238000000034 method Methods 0.000 description 2
- 229920000728 polyester Polymers 0.000 description 2
- 238000005476 soldering Methods 0.000 description 2
- 229920003002 synthetic resin Polymers 0.000 description 2
- 239000000057 synthetic resin Substances 0.000 description 2
- 239000004831 Hot glue Substances 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 239000012943 hotmelt Substances 0.000 description 1
- 239000000155 melt Substances 0.000 description 1
- 230000002787 reinforcement Effects 0.000 description 1
- 239000012815 thermoplastic material Substances 0.000 description 1
Landscapes
- Multi-Conductor Connections (AREA)
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
Abstract
(57)【要約】
【構成】樹脂フイルム端部の上下面の対向する位置にそ
れぞれ複数本の導電体パターン１１，１２を形成したフ
レキシブル基板１を具備し、該フレキシブル基板１の導
電体パターン１１，１２上にそれぞれ金属端子２，３の
一端を接合・固定する。金属端子３の先端は、金属端子
２の先端よりも前方に突出させ、且つ該突出させた方の
金属端子３の先端部分はその面が金属端子２の先端部分
の面と同一面上となるように折り曲げ部３２で折り曲げ
られる。
【効果】両側辺から端子を突出させた構造の電子部品の
一方の側の端子は金属端子２に接続され、他方の側の端
子は金属端子３に接続される。従ってフレキシブル基板
１は１枚だけでよくなる。
(57) [Summary] [Structure] A flexible substrate 1 is provided with a plurality of conductor patterns 11 and 12 formed at opposing positions on the upper and lower surfaces of the end portion of a resin film, and the conductor patterns 11 of the flexible substrate 1 are provided. , 12, one ends of the metal terminals 2 and 3 are respectively joined and fixed. The tip of the metal terminal 3 is made to protrude further forward than the tip of the metal terminal 2, and the surface of the tip of the protruding metal terminal 3 is flush with the surface of the tip of the metal terminal 2. It is bent at the bending portion 32 as shown in FIG. [Effect] The terminal on one side of an electronic component having a structure in which terminals protrude from both sides is connected to the metal terminal 2, and the terminal on the other side is connected to the metal terminal 3. Therefore, only one flexible substrate 1 is required.
Description
【０００１】0001
本考案は、樹脂フイルム上に形成した導電体パターンに金属端子を接続したフ レキシブル基板の端子構造に関するものである。 This invention is a film in which metal terminals are connected to a conductive pattern formed on a resin film. The present invention relates to the terminal structure of a flexible board.
【０００２】0002
近年電子機器に使用される電子部品は、小型化・薄型化が図られ、これに伴っ て、空間の有効利用が図れるフレキシブル基板が多く利用されるようになった。 In recent years, electronic components used in electronic devices have become smaller and thinner. As a result, flexible substrates have come into widespread use as they allow for efficient use of space.
【０００３】 上記フレキシブル基板は、いわゆる可撓性を有する絶縁フイルム上に導電体パ ターンを形成したものである。そしてこのフレキシブル基板を他の電子部品に接 続するには、該フレキシブル基板の端部の導電体パターン上に金属端子を取り付 け、該金属端子を他の電子部品に接続することによって行なう。このような端子 構造として出願人は例えば特開昭６３−１５８７１１号公報記載の端子構造を提 案している。0003 The above-mentioned flexible substrate has a conductive pattern on a so-called flexible insulating film. It forms a turn. Then, connect this flexible board to other electronic components. To continue, attach metal terminals on the conductive pattern at the edge of the flexible board. This is done by connecting the metal terminals to other electronic components. A terminal like this For example, the applicant has proposed a terminal structure described in Japanese Unexamined Patent Publication No. 158711/1983. I'm making plans.
【０００４】 ところで従来の電子部品の中には該電子部品の両側からそれぞれ複数本の端子 を突出させた構造のものがある。図７はこのような構造のコネクタ９０にフレキ シブル基板８０，８１を接続する方法を示す図である。同図に示すようにコネク タ９０は箱体の上面を開放した形状に構成され、その内部に多数のピン９１を立 設させるとともに、その下側辺近傍から各ピン９１の端子９３を突出させて構成 されている。そしてこのコネクタ９０は硬質の基板９５上に載置され、各端子９ ３は基板９５上に設けられた各導体パターン９６に接続されている。これら各導 体パターン９６は、スルーホール９７によって該基板９５の裏面側のパターン（ 図示せず）に接続される。そしてこの裏面側のパターンには２枚のフレキシブル 基板８０，８１のそれぞれの端部に取り付けた金属端子８３，８４がハンダ等に よって接続固定される。0004 By the way, some conventional electronic components have multiple terminals on each side of the electronic component. There is a structure with a protruding structure. Figure 7 shows a flexible connector 90 with this structure. 8 is a diagram illustrating a method for connecting flexible boards 80 and 81. FIG. Connect as shown in the figure. The terminal 90 has a box with an open top surface, and has a large number of pins 91 installed inside. The terminal 93 of each pin 91 protrudes from the vicinity of the lower side. has been done. This connector 90 is placed on a hard substrate 95, and each terminal 9 3 is connected to each conductor pattern 96 provided on the substrate 95. Each of these The body pattern 96 is connected to the pattern ( (not shown). And this pattern on the back side has two flexible sheets. The metal terminals 83 and 84 attached to the respective ends of the boards 80 and 81 are soldered etc. Therefore, the connection is fixed.
【０００５】 ここで２枚のフレキシブル基板８０，８１を用いたのは、コネクタ９０の端子 ９３がその両側辺から突出しているためであり、またコネクタ９０を基板９５に 取り付けたのは、フレキシブル基板８０，８１に取り付けるそれぞれ複数本の金 属端子８３，８４の端子間隔は狭くするのに限界があり、コネクタ９０に設けた 端子９３の間隔を金属端子８３，８４の端子間隔まで導電体パターン９６で広く するためである。[0005] The two flexible boards 80 and 81 used here are the terminals of the connector 90. This is because the connectors 93 protrude from both sides, and the connector 90 is not connected to the board 95. What was attached was a plurality of gold wires attached to each of the flexible boards 80 and 81. There is a limit to narrowing the terminal spacing between the metal terminals 83 and 84, so The distance between the terminals 93 is widened by the conductor pattern 96 to the distance between the metal terminals 83 and 84. This is to do so.
【０００６】[0006]
しかしながら上記フレキシブル基板の端子構造にあっては、以下のような問題 点があった。 However, the terminal structure of the flexible board mentioned above has the following problems. There was a point.
【０００７】 フレキシブル基板８０，８１を２枚用いなければならず、部品点数が増加す る。また、２枚のフレキシブル基板８０，８１の金属端子８３，８４を基板９５ 裏面のパターンに接続するには、まずフレキシブル基板８０の金属端子８３の方 を接続した後にフレキシブル基板８１の金属端子８４を接続しなければならず、 その接続作業が煩雑になる。[0007] Two flexible boards 80 and 81 must be used, which increases the number of parts. Ru. In addition, the metal terminals 83 and 84 of the two flexible boards 80 and 81 are connected to the board 95. To connect to the pattern on the back side, first connect the metal terminal 83 of the flexible board 80. The metal terminal 84 of the flexible board 81 must be connected after connecting the The connection work becomes complicated.
【０００８】 上記従来例に示すように、コネクタ９０の小型化が図られてその端子９３の 間隔がフレキシブル基板８０，８１の金属端子８３，８４の端子間隔よりも狭く なった場合、両者の間に基板９５を介在させなければならず、部品点数が増加す るばかりか、接続作業が煩雑になる。[0008] As shown in the above conventional example, the connector 90 has been miniaturized, and the terminals 93 of the connector 90 have been made smaller. The spacing is narrower than the terminal spacing between the metal terminals 83 and 84 on the flexible substrates 80 and 81. In this case, the board 95 must be interposed between the two, which increases the number of parts. Not only that, but the connection work becomes complicated.
【０００９】 本考案は上述の点に鑑みてなされたものであり、１枚のフレキシブル基板に取 り付けた金属端子を電子部品の両側辺から突出する全ての端子に接続でき、その 接続作業も容易なフレキシブル基板の端子構造を提供することにある。[0009] This invention was made in view of the above points, and it is mounted on a single flexible board. The attached metal terminals can be connected to all the terminals protruding from both sides of the electronic component. It is an object of the present invention to provide a terminal structure for a flexible board that allows easy connection work.
【００１０】0010
上記問題点を解決するため本考案は、樹脂フイルム端部の上下面の対向する位 置にそれぞれ複数本の導電体パターン１１，１２を形成したフレキシブル基板１ を具備し、該フレキシブル基板１の上下面の導電体パターン１１，１２上にそれ ぞれ細長形状の金属板からなる金属端子２，３の一端を接合・固定し、一方の面 側に固定した金属端子３の先端は他方の面側に固定した金属端子２の先端よりも 前方に突出させ、且つ該突出させた方の金属端子３の先端部分はその面が他方の 金属端子２の先端部分の面と同一面上となるように所定部分で折り曲げられた構 造に構成した。 In order to solve the above-mentioned problems, the present invention is designed to A flexible substrate 1 on which a plurality of conductor patterns 11 and 12 are formed on each side. The conductor patterns 11 and 12 on the upper and lower surfaces of the flexible substrate 1 are provided with One end of the metal terminals 2 and 3, each made of an elongated metal plate, is joined and fixed, and one side The tip of the metal terminal 3 fixed on one side is higher than the tip of the metal terminal 2 fixed on the other side. The tip of the protruding metal terminal 3 is made to protrude forward, and its surface is parallel to the other side. The structure is bent at a predetermined portion so that it is flush with the surface of the tip of the metal terminal 2. It was structured in a simple manner.
【００１１】 また本考案は、前記フレキシブル基板１端部の上下面に固定されたそれぞれ複 数本の金属端子２，３のそれぞれ相隣り合う金属端子間の間隔が平行に狭くなる ように金属端子２，３をそれぞれ内側に絞って構成した。[0011] Further, the present invention provides a plurality of flexible substrates each fixed to the upper and lower surfaces of the end of the flexible substrate 1. The distance between adjacent metal terminals of several metal terminals 2 and 3 becomes parallel and narrow. The metal terminals 2 and 3 are arranged inwardly as shown in FIG.
【００１２】0012
上記の如く構成したので、両側辺から端子を突出させた構造の電子部品の一方 の側の端子はフレキシブル基板１の一方の面側に固定した金属端子２に接続され 、他方の側の端子はフレキシブル基板１の他方の面側に固定した金属端子３に接 続される。従ってフレキシブル基板１は１枚だけでよく、またフレキシブル基板 １の上下面に設けた金属端子２，３と電子部品の両側辺から突出する端子との接 続は、一度のハンダ付けで行なえるので、その接続作業は容易になる。 With the above configuration, one side of the electronic component has terminals protruding from both sides. The terminal on the side is connected to the metal terminal 2 fixed on one side of the flexible board 1. , the terminal on the other side is connected to the metal terminal 3 fixed on the other side of the flexible board 1. Continued. Therefore, only one flexible board 1 is required, and Connection between metal terminals 2 and 3 provided on the upper and lower surfaces of 1 and terminals protruding from both sides of the electronic component. Connections can be made with one soldering, making the connection work easier.
【００１３】 また金属端子２，３の先端部分を内側に絞った場合は、電子部品が小型化され ても、該金属端子２，３を該電子部品の端子に直接接続できる。[0013] Also, if the tips of the metal terminals 2 and 3 are squeezed inward, the electronic components will become smaller. However, the metal terminals 2 and 3 can be directly connected to the terminals of the electronic component.
【００１４】[0014]
以下、本考案の１実施例を図面に基づいて詳細に説明する。 図１は本考案の１実施例にかかるフレキシブル基板の端子構造を示す図であり 、同図（ａ）はその斜視図、同図（ｂ）は同図（ａ）のＡ−Ａ線上断側面図であ る。 Hereinafter, one embodiment of the present invention will be described in detail based on the drawings. FIG. 1 is a diagram showing the terminal structure of a flexible board according to an embodiment of the present invention. , Figure (a) is a perspective view thereof, and Figure (b) is a cross-sectional side view taken along line A-A in Figure (a). Ru.
【００１５】 同図に示すように本考案においては、可撓性を有するフレキシブル基板１の端 部の上下面にそれぞれ５本ずつの金属端子２，３を固定して構成されている。こ こで金属端子２の一端はフレキシブル基板１上に直線状に印刷された５本の導電 体パターン１１上にそれぞれ載置され、その上に補強フイルム４を取り付けるこ とによって固定されている。また金属端子３の一端も、同様にフレキシブル基板 １の下面に直線状に印刷された５本の導電体パターン１２上にそれぞれ載置され 、その上に補強フイルム５を取り付けることによって固定されている。ここで下 側の金属端子３は、その先端部分の面が金属端子２の面と同一となるように、そ のほぼ中央部が折り曲げられている。以下各構成部品について説明する。[0015] As shown in the figure, in the present invention, the end of the flexible substrate 1 having flexibility is It is constructed by fixing five metal terminals 2 and 3 to the upper and lower surfaces of the section, respectively. child Here, one end of the metal terminal 2 is connected to five conductive wires printed in a straight line on the flexible substrate 1. are placed on the body patterns 11, and the reinforcing film 4 is attached thereon. It is fixed by Also, one end of the metal terminal 3 is also connected to a flexible board. Each of the conductor patterns 12 is placed on the five conductor patterns 12 printed in a straight line on the bottom surface of the , is fixed by attaching a reinforcing film 5 thereon. down here The metal terminal 3 on the side is aligned so that the surface of its tip portion is the same as the surface of the metal terminal 2. Almost the center is bent. Each component will be explained below.
【００１６】 図２は図１に示すフレキシブル基板の端子構造の分解斜視図である。また図３ は上記フレキシブル基板１を示す図であり、同図（ａ）は表面図、同図（ｂ）は 裏面図である。[0016] FIG. 2 is an exploded perspective view of the terminal structure of the flexible board shown in FIG. 1. Also, Figure 3 1 is a diagram showing the flexible substrate 1, in which (a) is a surface view and (b) is a surface view. It is a back view.
【００１７】 フレキシブル基板１は図３に示すように、ポリエステル等の熱可塑性を有する 合成樹脂フイルムで構成されており、その上面と下面にはそれぞれ直線状の５本 ずつの導電体パターン１１，１２が設けられている。同図に示すようにこれら導 電体パターン１１，１２は、フレキシブル基板１の上下面の対向する位置に設け られている。[0017] As shown in FIG. 3, the flexible substrate 1 is made of thermoplastic material such as polyester. It is composed of a synthetic resin film, and there are five straight lines on the top and bottom surfaces of the film. Conductor patterns 11 and 12 are provided. As shown in the figure, these The electrical patterns 11 and 12 are provided at opposing positions on the upper and lower surfaces of the flexible substrate 1. It is being
【００１８】 次に金属端子２は、図２に示すように、細長形状の金属板で構成され、フレキ シブル基板１上に固定される部分の両側面には凹凸部２１が設けられている。[0018] Next, the metal terminal 2 is made of an elongated metal plate, as shown in FIG. Concave and convex portions 21 are provided on both sides of the portion fixed onto the flexible substrate 1.
【００１９】 次に金属端子３は、図２に示すように、前記金属端子２の２倍以上の長さの金 属板で構成され、前記金属端子２と同様に、そのフレキシブル基板１に固定され る部分の両側面には凹凸部３１が設けられている。またこの金属端子３のほぼ中 央部には、折り曲げ部３２が設けられ、これによって該折り曲げ部３２の両側の 部分が平行で所定距離（前記フレキシブル基板１の厚みと金属板２の厚みを加え た分程度の距離）ずれるように構成される。[0019] Next, as shown in FIG. It is composed of a metal plate and is fixed to the flexible substrate 1 similarly to the metal terminal 2. Concave and convex portions 31 are provided on both side surfaces of the portion. Also, almost in the middle of this metal terminal 3 A bending section 32 is provided in the center, which allows the bending section 32 to be The parts are parallel and at a predetermined distance (the thickness of the flexible substrate 1 and the thickness of the metal plate 2 are added) (distance of about 100 yen).
【００２０】 次に補強フイルム４，５は、図２に示すように、いずれもポリエステル等の前 記フレキシブル基板１と同質の熱可塑性を有する合成樹脂フイルムで構成され、 いずれも前記５本の金属端子２，３の凹凸部２１，３１上に被せられる大きさに 構成されている。[0020] Next, the reinforcing films 4 and 5 are both made of polyester or the like, as shown in Figure 2. It is composed of a synthetic resin film having the same thermoplasticity as the flexible substrate 1, Both are sized to fit over the uneven parts 21 and 31 of the five metal terminals 2 and 3. It is configured.
【００２１】 そしてこの端子構造を組み立てるには、図２に示すようにまずフレキシブル基 板１上に設けた５本の導電体パターン１１のそれぞれの上に金属端子２の凹凸部 ２１を設けた部分を載置する。なおこのとき導電体パターン１１と金属端子２の 間に導電性接着剤を介在させてもよい。[0021] To assemble this terminal structure, first use a flexible base as shown in Figure 2. The uneven portion of the metal terminal 2 is placed on each of the five conductor patterns 11 provided on the plate 1. Place the part provided with 21. At this time, the conductor pattern 11 and the metal terminal 2 A conductive adhesive may be interposed therebetween.
【００２２】 そしてその上に補強フイルム４を被せ、補強フイルム４とフレキシブル基板１ が直接接する部分（図１に示す融着部４１の部分）を超音波融着すれば、図１に 示すように金属端子２はフレキシブル基板１の導電体パターン１１に強固に接続 される。なお導電体パターン１１と金属端子２の間に導電性接着剤（ホットメル トタイプのもの）を介在させた場合は、次に該接続部分に熱を加え、該導電性接 着剤を溶かして両者間を確実に導通させる。[0022] Then, a reinforcing film 4 is placed on top of it, and the reinforcing film 4 and flexible substrate 1 are If the part that directly contacts (the part of the fused part 41 shown in Fig. 1) is ultrasonically fused, the result as shown in Fig. 1 is obtained. As shown, the metal terminal 2 is firmly connected to the conductor pattern 11 of the flexible substrate 1. be done. Note that a conductive adhesive (hot melt adhesive) is used between the conductive pattern 11 and the metal terminal 2. If a conductive connection is used, then heat is applied to the connection part and the conductive connection is Dissolve the adhesive to ensure continuity between the two.
【００２３】 次に金属端子３をフレキシブル基板１上に固定する方法もこれと同様である。 即ち、フレキシブル基板１上に設けた５本の導電体パターン１２のそれぞれの上 に金属端子３の凹凸部３１を設けた部分を載置する。[0023] Next, the method for fixing the metal terminals 3 onto the flexible substrate 1 is similar to this. That is, on each of the five conductor patterns 12 provided on the flexible substrate 1. The portion of the metal terminal 3 provided with the uneven portion 31 is placed on.
【００２４】 そしてその上に補強フイルム５を被せ、補強フイルム５とフレキシブル基板１ が直接接する部分を超音波融着すれば、金属端子３はフレキシブル基板１の導電 体パターン１２に強固に接続される。なお導電体パターン１１と金属端子３の間 に導電性接着剤（ホットメルトタイプのもの）を介在させた場合は、同様に該導 電性接着剤を溶かして両者間を確実に導通させる。[0024] Then, a reinforcing film 5 is placed on top of it, and the reinforcing film 5 and the flexible substrate 1 are If the parts in direct contact with the metal terminals 3 are ultrasonically fused, the metal terminals 3 will become electrically conductive on the flexible substrate 1. It is firmly connected to the body pattern 12. Note that between the conductor pattern 11 and the metal terminal 3 If a conductive adhesive (hot melt type) is interposed in the Melt the electrically conductive adhesive to ensure continuity between the two.
【００２５】 以上のように構成すれば、図１（ｂ）に示すように、金属端子３の先端部分は 金属端子２の先端部分よりも前方に突出し、その折り曲げ部３２よりさらに先端 側の部分の面は前記金属端子２の面と同一平面上となる。[0025] With the above configuration, as shown in FIG. 1(b), the tip of the metal terminal 3 is It protrudes forward from the tip of the metal terminal 2, and the tip further extends beyond the bent portion 32. The surface of the side portion is on the same plane as the surface of the metal terminal 2.
【００２６】 ここで図４は金属端子２，３の上面に、前記図７に示す基板９５とコネクタ９ ０を取り付けた状態を示す概略側断面図である。同図に示すように、金属端子２ ，３の上面には基板９５が載置され、該基板９５の裏面にスルーホールを介して 設けた回路パターン９８にそれぞれの金属端子２，３がハンダ付け等することに よって接続される。即ち、金属端子２は前記図７に示す従来のフレキシブル基板 ８０の金属端子８３に相当し、金属端子３は従来のフレキシブル基板８１の金属 端子８４に相当するものであり、本考案の場合はコネクタ等の電子部品との接続 が１枚のフレキシブル基板で行なえるものである。[0026] Here, FIG. 4 shows a board 95 and a connector 9 shown in FIG. FIG. 2 is a schematic side cross-sectional view showing a state in which 0 is attached. As shown in the figure, metal terminal 2 A substrate 95 is placed on the top surface of , 3, and a through hole is placed on the back surface of the substrate 95. The respective metal terminals 2 and 3 are soldered to the provided circuit pattern 98. Therefore, it is connected. That is, the metal terminal 2 is the conventional flexible board shown in FIG. 80, the metal terminal 3 corresponds to the metal terminal 83 of the conventional flexible board 81. It corresponds to the terminal 84, and in the case of the present invention, it is used for connection with electronic components such as connectors. This can be done with a single flexible board.
【００２７】 なおフレキシブル基板１の厚みはかなり薄い。このため図１（ｂ）又は図４に 示す状態で金属端子２，３がたわんだとき、両金属端子２，３間が接触してしま う恐れがある。このためフレキシブル基板１を金属端子２の先端付近まで（例え ば図４の点線で示す位置まで）伸ばしておくことが望ましい。[0027] Note that the thickness of the flexible substrate 1 is quite thin. Therefore, in Figure 1(b) or Figure 4 When the metal terminals 2 and 3 are bent in the state shown, the two metal terminals 2 and 3 will come into contact. There is a risk of For this reason, move the flexible substrate 1 to the vicinity of the tip of the metal terminal 2 (for example, For example, it is desirable to extend it to the position shown by the dotted line in Figure 4).
【００２８】 次に図５は本考案の他の実施例を示す斜視図である。この実施例の場合もフレ キシブル基板１の上下面に導電体パターン１１，１２（導電体パターン１２は図 示せず）を形成し、それぞれその上に金属端子２′，３′を補強フイルム４，５ で固定する構造は上記実施例と全く同一である。本実施例において上記実施例と 相違する点は、金属端子２′，３′のフレキシブル基板１から突出した部分の途 中を内側に絞って、相隣り合う５本の金属端子２′，３′間の間隔を平行に狭く するようにした点である。このように構成すれば、図６に示すように、金属端子 ２′，３′上に直接コネクタ９０等の電子部品を接続することができる。即ち図 ４に示す基板９５は不要になる。[0028] Next, FIG. 5 is a perspective view showing another embodiment of the present invention. In this example, the flexible Conductor patterns 11 and 12 are formed on the upper and lower surfaces of the flexible substrate 1 (the conductor pattern 12 is shown in the figure). (not shown) and metal terminals 2', 3' are placed thereon with reinforcing films 4, 5, respectively. The structure for fixing is exactly the same as in the above embodiment. In this example, the above example The difference is in the length of the parts of the metal terminals 2' and 3' that protrude from the flexible substrate 1. Squeeze the inside inward and narrow the distance between the five adjacent metal terminals 2' and 3' in parallel. This is what I decided to do. With this configuration, as shown in FIG. Electronic components such as a connector 90 can be connected directly onto 2' and 3'. i.e. figure 4 becomes unnecessary.
【００２９】 なお金属端子をフレキシブル基板に固定する構造は、上記実施例の構造のもの に限定されるものではなく、他のどのような接続構造のものを用いてもよい。[0029] The structure for fixing the metal terminal to the flexible board is the same as that in the above example. However, the present invention is not limited to this, and any other connection structure may be used.
【００３０】[0030]
以上詳細に説明したように、本考案にかかるフレキシブル基板の端子構造によ れば、以下のような優れた効果を有する。 As explained in detail above, the terminal structure of the flexible board according to the present invention If so, it will have the following excellent effects.
【００３１】 両側辺から多数の端子を突出させた構造の電子部品をフレキシブル基板の金 属端子に接続する場合でも、該フレキシブル基板は１枚でよく、部品点数の削減 が図れ、またフレキシブル基板の上下面に設けた金属端子と電子部品の両側辺か ら突出する端子との接続は、一度のハンダ付けで行なえるので、その接続作業は 容易になる。[0031] An electronic component with a structure with many terminals protruding from both sides is mounted on a flexible board. Even when connecting to metal terminals, only one flexible board is required, reducing the number of parts. Also, ensure that the metal terminals on the top and bottom of the flexible board and both sides of the electronic components are close to each other. The connection to the terminal protruding from the outside can be made with one soldering, so the connection work is simple. becomes easier.
【００３２】 また金属端子の先端部分を内側に絞った場合は、該金属端子を小型化された 電子部品の端子に直接接続でき、両者間に基板を設ける必要がなく、部品点数が 削減され、しかも両者の接続作業が簡素化される。[0032] Also, if the tip of the metal terminal is squeezed inward, the metal terminal can be made smaller. Can be connected directly to the terminals of electronic components, eliminating the need for a board between the two, reducing the number of components. Moreover, the connection work between the two is simplified.
【図１】本考案の１実施例にかかるフレキシブル基板の
端子構造を示す図であり、同図（ａ）はその斜視図、同
図（ｂ）は同図（ａ）のＡ−Ａ線上断側面図である。FIG. 1 is a diagram showing the terminal structure of a flexible board according to an embodiment of the present invention; FIG. 1(a) is a perspective view thereof, and FIG. FIG.
【図２】図１に示すフレキシブル基板の端子構造の分解
斜視図である。FIG. 2 is an exploded perspective view of the terminal structure of the flexible board shown in FIG. 1;
【図３】フレキシブル基板１を示す図であり、同図
（ａ）は表面図、同図（ｂ）は裏面図である。FIG. 3 is a diagram showing the flexible substrate 1, in which FIG. 3(a) is a front view and FIG. 3(b) is a back view.
【図４】金属端子２，３の上面に、図７に示す基板９５
とコネクタ９０を取り付けた状態を示す概略側断面図で
ある。4. A substrate 95 shown in FIG. 7 is placed on the top surface of the metal terminals 2 and 3.
FIG. 3 is a schematic side sectional view showing a state in which a connector 90 is attached.
【図５】本考案の他の実施例を示す斜視図である。FIG. 5 is a perspective view showing another embodiment of the present invention.
【図６】金属端子２′，３′上に直接コネクタ９０を接
続した状態を示す斜視図である。FIG. 6 is a perspective view showing a state in which the connector 90 is directly connected to the metal terminals 2' and 3'.
【図７】コネクタ９０にフレキシブル基板８０，８１を
接続する従来の方法を示す斜視図である。FIG. 7 is a perspective view showing a conventional method of connecting flexible substrates 80, 81 to a connector 90.
１１，１２ 導電体パターン １ フレキシブル基板 ２，３ 金属端子 ４，５ 補強フイルム 11, 12 Conductor pattern 1 Flexible board 2,3 Metal terminal 4,5 Reinforcement film
Claims (2)
にそれぞれ複数本の導電体パターンを形成したフレキシ
ブル基板を具備し、該フレキシブル基板の上下面の導電
体パターン上にそれぞれ細長形状の金属板からなる金属
端子の一端を接合・固定し、一方の面側に固定した金属
端子の先端は他方の面側に固定した金属端子の先端より
も前方に突出させ、且つ該突出させた方の金属端子の先
端部分はその面が他方の金属端子の先端部分の面と同一
面上となるように所定部分で折り曲げられたことを特徴
とするフレキシブル基板の端子構造。1. A flexible substrate having a plurality of conductor patterns formed at opposing positions on the upper and lower surfaces of an end of a resin film, each of which has an elongated metal pattern formed on each of the conductor patterns on the upper and lower surfaces of the flexible substrate. One end of a metal terminal made of a plate is joined and fixed, and the tip of the metal terminal fixed to one side is made to protrude more forward than the tip of the metal terminal fixed to the other side, and 1. A terminal structure for a flexible substrate, characterized in that a tip end portion of a metal terminal is bent at a predetermined portion so that its surface is flush with the surface of the tip portion of the other metal terminal.
されたそれぞれ複数個の金属端子の相隣り合う金属端子
間の間隔が平行に狭くなるように金属端子を内側に絞っ
たことを特徴とする請求項１記載のフレキシブル基板の
端子構造。2. The plurality of metal terminals fixed to the upper and lower surfaces of the end of the flexible board are narrowed inward so that the distance between adjacent metal terminals is parallel to each other and narrow. The terminal structure of a flexible substrate according to claim 1.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1991025717U JPH083968Y2 (en) | 1991-03-25 | 1991-03-25 | Flexible board terminal structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1991025717U JPH083968Y2 (en) | 1991-03-25 | 1991-03-25 | Flexible board terminal structure |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH04115760U true JPH04115760U (en) | 1992-10-14 |
| JPH083968Y2 JPH083968Y2 (en) | 1996-01-31 |
Family
ID=31910386
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1991025717U Expired - Lifetime JPH083968Y2 (en) | 1991-03-25 | 1991-03-25 | Flexible board terminal structure |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH083968Y2 (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR102063977B1 (en) * | 2018-08-06 | 2020-01-08 | 주식회사 크레셈 | Connector junction method of flexible printed circuit board |
-
1991
- 1991-03-25 JP JP1991025717U patent/JPH083968Y2/en not_active Expired - Lifetime
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR102063977B1 (en) * | 2018-08-06 | 2020-01-08 | 주식회사 크레셈 | Connector junction method of flexible printed circuit board |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH083968Y2 (en) | 1996-01-31 |
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